KR102632319B1 - Handler for electronic component test - Google Patents

Abstract

The present invention relates to a handler for testing electronic components.
In the handler for testing electronic components according to the present invention, a measuring part that measures the temperature of the electronic component is provided to be able to move forward and backward, and in order to implement this more preferably, an exposure hole is provided in the contact cap to expose the measuring part to the electronic component side. is formed
According to the present invention, the risk of damage to the measurement part is significantly reduced by advancing and retracting the measuring part, and the reliability of the test is improved by bringing the measuring part into close contact with the electronic component.

Description

Handler for electronic component testing {HANDLER FOR ELECTRONIC COMPONENT TEST}

The present invention relates to a handler used for testing produced electronic components, and particularly to temperature control of the pressurizing part and electronic components that pressurize the electronic components.

A handler is a device that supports manufactured electronic components to be tested by a tester and classifies electronic components into grades according to test results.

The handler has been disclosed through a number of patent documents such as Korean Patent Publication No. 10-2002-0053406 (hereinafter referred to as ‘Prior Art 1’) or Japanese Patent Application Laid-Open No. 2011-247908 (hereinafter referred to as ‘Prior Art 2’). It is done.

1 is a schematic diagram of a conventional handler (TH).

A conventional handler (TH) includes a supply part (SP), a pressurizing part (PP), and a recovery part (WP).

The supply unit (SP) supplies electronic components loaded on the customer tray to the pressurizing unit (PP).

The pressurizing part (PP) pressurizes the electronic components supplied by the supply part (SP) toward the socket board (SB) connected to the main body of the tester and electrically connects the electronic components to the tester. Here, the socket board (SB) is equipped with a number of test sockets (TS) that are electrically connected to electronic components.

The recovery unit (WP) collects the tested electronic components from the pressurizing unit (PP), sorts them according to the test results, and loads them into an empty customer tray.

The above supply part (SP), pressurizing part (PP), and recovery part (WP) may have various forms and configurations depending on the purpose of use of the handler (TH).

The present invention relates to the pressurizing part (PP) and temperature control function among the above components.

As shown in the schematic diagram of FIG. 2, the pressurizing part PP includes a pressurizer 210' (named 'index head' in prior art 1 and 'pressing device' in prior art 2), a vertical mover 220', and Includes a horizontal mover (230').

The pressurizer 210' has pushers 212' for pressing individual electronic components into corresponding test sockets (TS, called 'test sockets' in prior art 2).

The pusher 212' presses the electronic component D to the lower surface of the pressing region PR, as shown in FIG. 3. In addition, the pusher 212' adsorbs and holds the electronic component D by vacuum pressure on the lower surface of the pressing area PR. For this purpose, a vacuum furnace (VW) through which vacuum pressure can be applied is formed in the pusher 212'. This pusher 212' is provided with a temperature sensor 212'c to detect the temperature of the pusher 212' itself. The temperature of the electronic component pressed by the pusher 112' can be indirectly sensed through the temperature sensor 212'c.

The pressurizer 210' lowers while holding the electronic component to electrically connect the electronic component to the test socket (TS) on the socket board (SB). To this end, the pressurizer 210' is configured to enable horizontal movement forward and backward and vertical movement up and down.

The vertical mover 220' moves the pressurizer 210' forward or backward toward the socket board SB by elevating the pressurizer 210'. The operation of this vertical mover 220' is performed when gripping or releasing the electronic component D from the electronic component movement shuttle (named 'slide table' in prior art 2) by the pressurizer 210' and when the electronic component D is released. This occurs when the component (D) is electrically connected to or disconnected from the test socket (TS).

The horizontal mover 230' moves the pressurizer 210' horizontally in the forward and backward directions. Here, the horizontal movement of the pressurizer 210' occurs when it moves between the upper point of the shuttle and the upper point of the socket board SB.

Meanwhile, electronic components generate their own heat while being tested. In particular, electronic components that require calculation, such as CPUs, generate a lot of heat themselves. And self-heating increases the temperature of electronic components, which prevents electronic components from being tested while maintaining an appropriate temperature for test conditions.

Republic of Korea Patent No. 10-0706216 (hereinafter referred to as 'Prior Art 3') provides a heat sink to control the temperature of electronic components. However, according to prior art 3, the structure of the pusher is complicated, resulting in poor productivity and low durability.

In Korean Patent Publication No. 10-2008-0086320 (hereinafter referred to as 'Prior Art 4'), an air through hole is formed in a pusher to control the temperature of electronic components, and air for temperature control is supplied from a duct to the air through hole. However, it is difficult to apply the prior art 4 to the pusher 212', which has a structure that requires holding electronic components by vacuum pressure. This is because the pusher must be equipped with two conflicting functions: vacuum adsorption and air injection for temperature control.

In addition, the above methods reduce the reliability of the test because the response to adjusting the temperature of the electronic component by operating the temperature control function is slow.

Therefore, the applicant of the present invention, through Korean Patent Publication No. 10-2016-0064964 (hereinafter referred to as 'Prior Art 1'), has developed a technology that can immediately respond to temperature changes in electronic components by controlling the temperature of the pusher through a cooling pocket or heater. The technology has been proposed.

And in Republic of Korea Patent Publication No. 10-2017-0116875 (hereinafter referred to as 'Prior Art 2'), which further develops Prior Art 1, a technology for forming a fluid passage through which cooling fluid passes in the pusher has been additionally proposed. According to this prior art 2, a contact plate is provided between the pusher and the electronic component. And the contact plate has contact caps that correspond one-to-one with the pusher. Due to this configuration, in prior art 2, the pusher is in contact with the contact cap, and the contact cap is in contact with the electronic component. That is, in prior art 2, the pusher and the electronic components are in indirect contact.

In both Prior Art 1 and Prior Art 2, a temperature sensor is installed in the pusher to measure the temperature of the electronic component, and the temperature sensor is provided on the side where the pusher and the electronic component contact. So, according to prior art 1, the temperature sensor can directly contact the electronic component, but according to prior art 2, the temperature sensor cannot directly contact the electronic component.

That is, in the case of prior art 2, the temperature sensor has a structure that measures the temperature of the electronic component with a contact cap in between, so there is the following problem.

First, because the temperature sensor and electronic components are separated by the thickness of the contact cap, delays and deviations occur between the temperature of the semiconductor device and the temperature measured by the temperature sensor. And such delay and deviation are larger as the thickness of the contact cap is thicker.

Second, if the surface of the contact cap in contact with the pusher is not uniform or has an inclination due to poor production or mechanical installation, the accuracy of the temperature measured by the temperature sensor will be very low.

Meanwhile, during the pressurizing operation, in prior art 1, the temperature sensor is in direct contact with the electronic component, and in prior art 2, the temperature sensor is in direct contact with the contact cap, so there is a risk of damage to the temperature sensor in both cases, which can lead to failure in temperature control. This can reduce the reliability of the test and the reliability of the equipment.

The purpose of the present invention is as follows.

First, it provides technology that enables accurate temperature measurement while ensuring the stability of temperature measuring instruments that measure the temperature of electronic components.

Second, it provides technology to identify poor contact between the pusher and the contact cap.

Third, it provides a technology that can shorten the test time by appropriately maintaining the temperature of the pusher between the test of the previous electronic component and the test of the next electronic component.

The handler for testing electronic components according to the first embodiment of the present invention as described above includes a supply unit for supplying electronic components; a pressurizing unit that pressurizes the electronic components supplied by the supply unit to electrically connect them to a test socket of the tester; a temperature control unit for controlling the temperature of electronic components electrically connected to the test socket by the pressurizing unit; a recovery unit that recovers electronic components for which testing has been completed by a tester; and a control unit that controls each of the above-described components; It includes: a pressurizer for pressurizing the electronic component toward the test socket; and a contact plate interposed between the pressurizer and the electronic component and having a plurality of contact caps that are in direct contact with the electronic component and pressurize the electronic component. The pressurizer includes a plurality of pushers that correspond one-to-one with the contact cap and push the contact cap during a pressing operation to pressurize the electronic component while the contact cap contacts the electronic component; An installation plate on which the plurality of pushers are installed; a mover that causes the pusher to press or release the pressure on the contact cap by advancing or retracting the installation plate toward the test socket; and a plurality of temperature measuring devices provided on the plurality of pushers and having a measuring part capable of measuring the temperature of the electronic component. It includes, wherein the control unit controls the temperature of the electronic component to be tested by controlling the temperature controller based on temperature information of the electronic component measured by the temperature measuring device, and the contact cap is such that the measurement portion directly contacts the electronic component. An exposure hole is formed to expose the measurement portion to the electronic component side.

The temperature measuring device includes an advance/retract portion that allows the measurement portion to advance/retract relative to the electronic component; It may further include.

The contact cap preferably has a guide portion that guides the measurement portion to properly pass through the exposure hole.

The handler for testing electronic components according to the second embodiment of the present invention as described above includes a supply unit for supplying electronic components; a pressurizing unit that pressurizes the electronic components supplied by the supply unit to electrically connect them to a test socket of the tester; a temperature control unit for controlling the temperature of electronic components electrically connected to the test socket by the pressurizing unit; a recovery unit that recovers electronic components for which testing has been completed by a tester; and a control unit that controls the supply unit, the pressurizing unit, the temperature control unit, and the recovery unit; It includes a pressurizer for pressurizing the electronic component toward the test socket, wherein the pressurizer includes a plurality of pushers that press the electronic component during a press operation; An installation plate on which the plurality of pushers are installed; A mover that allows pressurization or release of electronic components by advancing or retracting the installation plate toward the test socket; and a plurality of temperature measuring instruments provided on the plurality of pushers to measure the temperature of electronic components. It includes, wherein the control unit controls the temperature controller according to the temperature information of the electronic component measured by the temperature measuring device to adjust the temperature of the electronic component being tested, and the temperature measuring device is capable of measuring the temperature of the electronic component. measuring part; an advance/retract portion that allows the measurement portion to advance/retract relative to the electronic component; Includes.

It is preferable that the pusher has an installation hole through which at least a portion of the forward and backward portions can be inserted and formed to be open toward the electronic component.

The temperature control unit includes a cooling fluid supplier that supplies cooling fluid to the pressurizer; and a heater installed in the pusher to heat the pusher. Includes.

The pressurizer further includes a temperature sensor for detecting the temperature of the pusher, and the control unit compares the temperature information sensed by the temperature sensor with the temperature information sensed by the temperature sensor and sets both temperature information to a set reference value. If it deviates, it alerts you that a defect has occurred.

The pressurizer further includes a temperature sensor for detecting the temperature of the pusher, and the control unit memorizes the temperature of the pusher when testing the previous electronic component, and is configured to perform the next electronic component after the test of the previous electronic component is completed. The temperature controller is controlled to maintain the temperature of the pusher at the temperature during testing of the previous electronic component when the pressing operation is released for the test.

According to the present invention, the following effects are achieved.

First, by allowing the temperature measuring device to be advanced and retreated, the risk of the temperature measuring device being damaged during pressurization operation is significantly reduced.

Second, since the measuring part of the temperature measuring device can be directly contacted and adhered to the electronic component, accurate temperature measurement of the electronic component is possible, thereby improving the reliability of the test.

Third, through the difference between the temperature of the electronic component measured by the temperature measuring device and the temperature of the pusher detected by the temperature sensor, it is possible to determine whether there is a defective contact between the pusher and the contact cap or a failure of the temperature measuring device or temperature sensor, thereby enabling defect testing. This improves the reliability of the equipment by preventing it from happening.

Fourth, even when the pressurizing operation is released and the temperature measuring device is separated from the electronic component, the temperature information from the previous electronic component test is used to appropriately maintain the temperature of the pusher, thereby reducing test time and improving processing capacity.

1 to 3 are reference diagrams for explaining a conventional handler for testing electronic components.
Figure 4 is a plan view of a handler for testing electronic components according to an embodiment of the present invention.
Figure 5 is a conceptual perspective view of the pressing unit applied to the handler of Figure 4.
Figure 6 is a schematic cross-sectional view of a pusher that can be applied to the pressing part of Figure 5.
Figure 7 is a side view of a pressurizer according to an example to which the pusher of Figure 6 is applied.
Figure 8 is an exploded view of the main parts of the pressurizer of Figure 7.
FIG. 9 is a reference diagram for explaining the main features of the pressurizer of FIG. 8.
10 to 12 are reference diagrams for explaining the operating state of the characteristic parts of the present invention.
FIG. 13 is a reference diagram for comparing and explaining a state in which a contact cap is replaced according to a change in the size of an electronic component to be tested with FIG. 10 .
Figure 14 shows another example of a contact cap.
Figure 15 is a schematic diagram of another type of pressurizer to which the present invention can be applied.

Hereinafter, preferred embodiments according to the present invention as described above will be described with reference to the accompanying drawings, but for brevity of description, overlapping descriptions will be omitted or compressed as much as possible.

As shown in Figure 4, the handler (TH, hereinafter abbreviated as 'handler') for testing electronic components according to the present invention includes a pair of loading plates 111 and 112, a first mover 120, and a pair of moving shuttles ( MS1, MS2), a pressurizing unit 200, a temperature control unit 300, a second mover 420, and a control unit 500.

Electronic components may be loaded on the loading plates 111 and 112. These loading plates 111 and 112 have heaters and can heat the loaded electronic components to a temperature required for testing. Of course, during the room temperature test, the heater stops operating.

The first mover 120 moves the electronic components of the customer tray (CT ₁ ) to the loading plates 111 and 112, or moves the electronic components of the loading plates 111 and 112 to the mobile shuttle (MS1 / MS1) currently located in the left direction. Move to MS2). For this purpose, the first mover 120 is provided to be able to move left and right and forward and backward (see arrows a and b).

Electronic components can be loaded on the mobile shuttles (MS1, MS2) and are equipped to move left and right (see arrows c ₁ and c ₂ ) past the test position (TP).

The pressurizing unit 200 electrically connects the electronic components loaded on the moving shuttles (MS1 / MS2) at the test position (TP) to the test sockets (TS) on the socket board (SB) below them. For this purpose, the pressurizing unit 200 includes a pressurizer 210, a vertical mover 220, and a horizontal mover 230, as referenced by the solid line portion shown in the conceptual diagram of FIG. 5.

The pressurizer 210 pressurizes the electronic component so that the electronic component can be electrically connected to the tester. An example of this pressurizer 210 will be described later in a different table of contents.

The vertical mover 220 elevates the pressurizer 210 (see arrow d). Accordingly, the pressurizer 220 can advance or retreat toward the test socket (TS) and advance or retreat toward the mobile shuttles (MS1 and MS2).

The horizontal mover 230 moves the pressurizer 210 in the forward and backward direction (see arrow e). Therefore, the pressurizer 210 can alternately grasp the electronic components in the moving shuttle of MS1 and the moving shuttle of MS2 and then electrically connect them to the test socket (TS).

For reference, a test chamber may be provided in the area defined as the test location (TP). And when a test chamber is provided, the pressurizing unit 200 or at least the pressurizer 210 is located inside the test chamber. Of course, the inside of the test chamber is adjusted to the temperature necessary to test electronic components.

The temperature control unit 300 is a heater installed on the cooling fluid supply 310, the flow control valve 320, and the pusher 212 (see FIG. 6) of the pressurizer 210 described above, as referenced by the dotted line in FIG. 5. (330, see FIG. 6).

The cooling fluid supplier 310 supplies cooling fluid to the pressurizer 210 to lower the temperature of the electronic components. This cooling fluid supplier 310 includes a pump 311 that pumps a certain amount of cooling fluid and a cooling module 312 that cools the cooling fluid to a certain temperature.

The flow control valve 320 controls the supply amount of cooling fluid supplied by the cooling fluid supplier 310.

The heater 330 (see FIG. 6) is installed in the pusher 212 to heat the pusher 212.

The pump 311, cooling module 312, flow control valve 320, and heater 330 of the temperature control unit 300 as described above are controlled by the control unit 500. Therefore, the temperature, supply flow rate, and supply flow rate of the supplied cooling fluid can be adjusted according to the test temperature conditions of the electronic component. Therefore, when the temperature, supply flow rate, and supply flow rate of the cooling fluid are determined according to the test temperature conditions, the cooling fluid supplier 310 continuously supplies the cooling fluid adjusted to the determined temperature, supply flow rate, and supply flow rate.

The second mover 420 moves the tested electronic components currently in the moving shuttles MS1 and MS2 located on the right side to the customer tray CT ₂ while classifying them according to the test results. To this end, the second mover 420 may be moved left and right (see arrow f in FIG. 4) or forward and backward (see arrow g in FIG. 4).

The control unit 500 controls each of the above-described components, and the characteristic control by the control unit 500 will be described later.

For reference, among the above configurations, the loading plates 111 and 112 for supplying electronic components of the customer tray (CT ₁ ) to the pressing unit 200 and the first mover 120 have a supply unit (SP) for supplying electronic components. ), and the side of the second mover 420 that moves the electronic component for which testing has been completed by the tester to the customer tray (CT ₂ ) may be defined as the recovery unit (WP). Here, a pair of mobile shuttles (MS1, MS2) may function as a supply unit (SP) or a recovery unit (WP) depending on their location.

<An example of a pressurizer>

The pressurizer 200 has a number of pushers 212 for pressing electronic components.

First, the pusher 212 portion will be described with reference to FIG. 6 .

The pusher 212 in FIG. 6 includes a pushing member 212a and a temperature sensor 212c.

The pushing member 212a has a 'T'-shaped cross section and is divided into an upper coupling portion 212a-1 and a lower contact portion 212a-2.

The coupling portion 212a-1 is coupled to and installed on an installation plate to be described later.

The contact portion 212a-2 is narrower than the coupling portion 212a-1, and its lower surface, the contact end CE, is inserted into and contacts a contact cap, which will be described later. An installation groove for installing the heater 330 is formed in this contact portion 212a-2. And at the bottom of the contact portion 212a-2, an installation hole IH through which a temperature measuring device 217, which will be described later, can be installed is formed to be open toward the electronic component D (open toward the lower side in this embodiment). It is done.

In addition, the pushing member 212a is formed with a fluid passageway FT through which the cooling fluid supplied and recovered by the cooling fluid supplier 310 passes.

The temperature sensor 212c is provided to measure the temperature of the pushing member 212a.

Meanwhile, the temperature measuring instrument 217 is provided to measure the temperature of the electronic component (D) in a state of direct contact with the electronic component (D) being currently tested, and includes a measurement part (217a), a forward and backward part (217b), and a guide part. Includes (217c).

The measurement portion 217a measures the temperature of the electronic component (D) while being in direct contact with the electronic component (D) being tested. This measurement portion 217a may have a rounded bottom for precise point contact with the electronic component D, and may be protected with a thin film-type protective film made of a metal material with excellent thermal conductivity.

The advancing/retracting portion 217b is provided to allow the measuring portion 217a to advance/retracted with respect to the electronic component D, and is preferably provided inside the installation hole IH. This advance and retreat portion 217b allows the measurement portion 217a to retreat upward when the measurement portion 217a is in contact with the electronic component D, and presses the measurement portion 217a toward the electronic component D. Since it also needs to have the function of adhering closely, it can be equipped with a tool capable of elastic compression and expansion, such as a coil or leaf spring.

The upper end of the guide portion 217c is coupled to the advancing and retreating portion 214b, the lower end is coupled to the measuring portion 217a, and is provided in the form of a long rod up and down, with a portion of it inserted into the installation hole IC. The outer surfaces of this guide portion (217c) are maintained in contact with the inner surfaces of the installation hole (IH), thereby accurately positioning the measuring portion (217a) and ensuring the straightness of the movement of the measuring portion (217a) when advancing or retreating. It is guaranteed.

As above, in this embodiment, the advancing/retracting portion 217b and the guiding portion 217c are configured to allow the measuring portion 217a to advance and retreat appropriately, but the advancing/retracting configuration of the measuring portion 217a can be implemented in various forms. Therefore, any configuration and structure that allows the measuring part 217a to move forward and backward, for example, a structure that folds and unfolds like an antenna, a pneumatic structure, or a separate electrical forward and backward force, can all be considered desirable.

FIG. 7 is an example of a pressurizer 210 to which the pusher 212 described above is actually applied, and FIG. 8 is an exploded view of the main parts of the presser 210.

7 and 8, the pressurizer 210 includes an installation plate 211, a pusher 212, an installation structure 213, a support spring 214, a fluid distributor 215, a contact plate 216, and a temperature Includes a measuring device (217).

As shown in FIG. 9, a pusher 212 is installed on the installation plate 211 via the installation structure 213. This installation plate 211 is formed with installation holes (IO) that allow the contact portion 212a-2 of the pusher 212 to pass through and be installed to protrude forward.

Since the pusher 212 has been described previously, its description is omitted.

The installation structure 213 is provided to install the pusher 212 on the installation plate 211. This installation structure 213 includes a coupling plate 213a and a support bar 213b.

The coupling plate 213a is coupled to the installation plate 211 and has a through hole TH through which the contact portion 212a-2 of the pusher 212 can pass. And this coupling plate (213a) is formed with alignment holes (AH) into which the guide pin (212f-1) of the guide member (212f) provided in the pusher (212) referred to in FIG. 6 is inserted. Accordingly, in the drawing, the top of the pusher 212 can be aligned by the alignment holes AH.

The support 213b is installed on the coupling plate 213a at regular intervals, and supports the upper end of the support spring 214 so that the support spring 214 can elastically support the pusher 212.

The support spring 214 functions to elastically support the upper end of the pusher 212 so that the pusher 212 can be advanced or retreated a certain distance.

The fluid distributor 215 is provided to supply cooling fluid to the fluid passageway (FT) of the pushers 212 installed by the installation structure 213.

The contact plate 216 is interposed between the pusher 212 and the electronic component (D) and has a plurality of contact caps 216a. The contact cap 216a is opened upward and is made of a metal material such as copper with excellent thermal conductivity so that cold air or heat from the pushing member 212a can be quickly conducted to the electronic components. An exposure hole (EH) is formed on the lower surface of the contact plate 216 to expose the measurement portion 217a to the electronic component (D) so that the measurement portion (217a) can be directly contacted with the electronic component (D). Here, the inner diameter or width of the exposure hole (EH) is preferably larger than the outer diameter or width of the measurement portion (217a) so that the measurement portion (217a) does not collide with the surroundings of the exposure hole (EH) during the pressing operation. Application of the contact plate 216 like this is provided for convenience of parts exchange and efficient use of resources. In general, if the size of the electronic component to be tested changes, all pushers 212 must be replaced. At this time, replacement of the pusher 212 is very cumbersome and time consuming due to its connection with the cooling fluid, and also results in a waste of resources considering the size of the cooling medium or other parts to be replaced. However, if the contact plate 216 is applied as in the present embodiment, the contact cap 216a can be simply replaced after removing only the contact plate 216, or the contact plate 216 prepared in advance can be installed, so the replacement can be performed. The work is very easy and waste of resources can also be prevented.

Meanwhile, of course, the number of contact caps 216a installed on the contact plate 216 is the same as the number of pushers 212. That is, a handler for testing eight electronic components at once must be equipped with eight pushers 212 and eight contact caps 216a, and the pushers 212 and contact caps 216a have a one-to-one correspondence.

The temperature measuring device 217 is the same as described above.

According to this embodiment, there is no time delay in measuring the temperature of the electronic component (D) by the temperature measuring device 217, and the degree of contact between the pusher 212 and the contact cap 216a does not need to be considered. .

Determination of defective operation is made using the temperature difference between the temperature sensor 212c and the temperature measuring device 217, which will be described later in the relevant section.

Meanwhile, since the above-described temperature gauges 217 and temperature sensors 212c are installed in each pusher 212, their numbers are the same, and one temperature gauge 217 corresponds to one temperature sensor 212c on a one-to-one basis. do.

Next, the operating states of the characteristic parts of the present invention will be described with reference to the excerpts in FIGS. 10 to 12.

When the pressurizer 210 operates and the pusher 212 advances toward the electronic component D, first, the pusher 212 and the contact cap 216a are engaged as shown in FIG. 10 . In the state of FIG. 10, it can be seen that the measurement portion 217a of the temperature measuring device 217 has passed through the exposure hole EH of the contact cap 216a.

In the state shown in FIG. 10 , if the pusher 212 advances a certain amount further toward the electronic component (D), the measurement portion 217a comes into direct contact with the electronic component (D) as shown in FIG. 11 . When the pusher 217 advances a little further in the state shown in FIG. 11 and the final advance is completed, the contact cap 216a presses the electronic component D as shown in FIG. 12, and at this time, the measurement part ( 217a) is pushed upward and retreats relative to the electronic component (D). Of course, the electronic component (D) is tested in the state shown in FIG. 11, and the measurement portion (217a) is maintained in close contact with the electronic component (D) due to the elastic pressing force of the advancing and retreating portion (217b).

For reference, Figure 13 shows a state in which the electronic component to be tested is replaced with a corresponding contact cap 216a when the size becomes smaller. When the contact plate 216 is applied as in this embodiment, the compatibility of the handler (TH) for testing electronic components of various standards is improved.

In addition, Figure 14 shows an example in which the contact cap 216a is provided with a guide part GP for guiding the pusher 212 so that the measurement part 217a can properly pass through the exposure hole EH. In Figure 14, the guide part (GP) is composed of the spring (S) and the advance and retract member (E), but depending on the implementation, the inclined surface (TS) on the inner surface and inlet of the contact cap (216a) as shown in Figure 13. It may be provided as .

According to the handler (TH) according to the present invention, the temperature measuring device 217 and the temperature sensor 212c can be utilized while being controlled in various ways by the control unit 500, so this will be continued.

1. Bad alarm

When an electronic component is tested, the control unit 500 appropriately controls the temperature controller 300 using temperature information detected from the temperature measuring device 217, so that the electronic component can be tested under required test temperature conditions.

Meanwhile, the control unit 500 compares the temperature information sensed by the temperature measuring device 217 with the temperature information sensed by the temperature sensor 212c. And if the temperature difference according to the comparison exceeds the set standard value (for example, 30 degrees difference), the control unit 500 determines that the pusher 212 and the contact cap 216a are not in normal contact, or the temperature sensor 212c or the temperature It can be seen that the measuring device 217 is broken, and in this case, the manager is alerted to the occurrence of a defect. That is, according to the present invention, the temperature sensor 212c is not an essential component because the temperature of the electronic component (D) is detected through the temperature measuring device 217. However, since various defect situations can be identified by comparing the temperature information detected by the temperature sensor 217 and the temperature information sensed by the temperature sensor 212c as described above, providing the temperature sensor 212c should be considered highly desirable. do.

2. Optional ON and OFF

When the electronic component (D) is tested, accurate temperature measurement of the electronic component (D) is required, so the temperature measuring device 217 must be turned on. At this time, depending on the implementation, temperature information about the pusher 212 coming from the temperature sensor 212c may not be needed, so the temperature sensor 212c is turned off.

Meanwhile, since temperature information by the temperature measuring device 217 is not required during the gap time between the testing of the previously tested electronic component (D) and the electronic component (D) to be tested next, the temperature measuring device 217 is in an off state. It needs to be. However, for the next test, the temperature of the pusher 212 must not be overcooled or overheated, so the temperature sensor 212c is turned on, and then the pusher 212 is tested based on the temperature information from the temperature sensor 212c. Adjust the temperature.

3. Maintain proper temperature of pusher

As described above, temperature information by the temperature measuring device 217 is not required during the gap time between the testing of the previously tested electronic component D and the electronic component D to be tested next. However, maintaining an appropriate temperature of the pusher 212 is necessary to maintain an appropriate temperature of the electronic component D to be tested next. Therefore, when testing the previous electronic component (D), the test temperature of the pusher 212 is detected by the temperature sensor 212c and memorized, and after the test of the previous electronic component (D) is completed, the next electronic component (D) is tested. For the test, it is necessary to maintain the temperature of the pusher 212 at the temperature during the test of the previous electronic component (D) when the pressing operation by the pressurizer 200 is released. In this case, the control unit 500 detects and remembers the temperature of the pusher 212 by turning the temperature sensor 212c into the ON state even when testing the previous electronic component (D), and stores the stored temperature information and It is necessary to control the temperature controller 300 to appropriately maintain the temperature of the pusher 212 during the test blank time based on the temperature information received from the temperature sensor 212c.

The pressurizer 210 described above with reference to FIG. 7 and the like is of a form suitable for application to a handler manufactured for processing electronic components that are mass-produced in small varieties, such as memory semiconductors. However, the present invention can also be properly implemented in a presser 1210 of the type shown in FIG. 15, which is suitable for application to a handler manufactured for processing electronic components produced in small quantities of various types, such as non-memory semiconductors.

For reference, the pressurizer 1210 in FIG. 15 also includes an installation plate 1211 on which a pusher is installed, a contact plate 1216 having a contact cap 1216a, and a measuring part ( It is equipped with a temperature measuring device (1217) including 1217a). Of course, even in the case of the pressurizer 1210 as shown in FIG. 15, an exposure hole EH is formed in the contact cap 1216a to expose the measurement portion 1217a to the electronic component. As such, the present invention can be preferably applied to all types of handlers for adjusting the temperature of electronic components using a pusher.

Accordingly, the detailed description of the present invention has been made by way of examples with reference to the accompanying drawings, but since the above-described embodiments are only explained by referring to preferred examples of the present invention, it is understood that the present invention is limited to the above-described embodiments. It should not be construed as such, and the scope of rights of the present invention should be understood in terms of the claims described later and their equivalent concepts.

TH: Handler for electronic component testing
SP: Supply Department
200: Pressure part
210: pressurizer
212: pusher
212a: Pushing member
212b: heater
FT: Fluid passageway
216: contact plate
216a: contact cap
EH: exposed hole
217: Temperature meter
217a: measurement part 217b: advance and retreat part
220: Vertical mover
300: Temperature control unit
WP: Recovery Department
500: Control unit

Claims (4)

a supply department that supplies electronic components;
a pressurizing unit that pressurizes the electronic components supplied by the supply unit to electrically connect them to a test socket of the tester;
a temperature control unit for controlling the temperature of electronic components electrically connected to the test socket by the pressurizing unit;
a recovery unit that recovers electronic components for which testing has been completed by a tester; and
a control unit that controls the supply unit, the pressurizing unit, the temperature control unit, and the recovery unit; Including,
The pressurizing unit includes a pressurizer for pressurizing the electronic component toward the test socket,
The pressurizer,
A plurality of pushers that enable pressing electronic components during a pressing operation;
An installation plate on which the plurality of pushers are installed;
A mover that allows pressurization or release of electronic components by advancing or retracting the installation plate toward the test socket; and
A plurality of temperature measuring instruments provided on the plurality of pushers to measure the temperature of electronic components; Including,
The control unit controls the temperature control unit based on temperature information of the electronic component measured by the temperature measuring device to adjust the temperature of the electronic component to be tested,
The temperature measuring device is,
A measuring part that can measure the temperature of electronic components;
an advance/retract portion that allows the measurement portion to advance/retract relative to the lower surface of the pusher; and
It includes a guide portion whose upper end is coupled to the advance and retreat portion, and whose lower end is coupled to the measurement portion.
In the pusher, an installation hole into which the advance and retreat portions can be inserted is formed to be open toward the electronic component,
The guide portion is provided with a portion inserted into the installation hole, and during a pressing operation, the outer surface of the guide portion retreats in a state in contact with the inner surface of the installation hole, and the entire measuring portion is inserted into the installation hole. , which holds the position of the measurement part and ensures straightness of movement when the measurement part advances or retreats.
Handler for testing electronic components. In paragraph 1
The temperature control unit,
a cooling fluid supplier that supplies cooling fluid to the pressurizer; and
a heater installed in the pusher to heat the pusher; containing
Handler for testing electronic components. In paragraph 1
The pressurizer further includes a temperature sensor for detecting the temperature of the pusher,
The control unit compares the temperature information detected by the temperature measuring device and the temperature information sensed by the temperature sensor, and warns of the occurrence of a defect when both temperature information exceeds a set standard value.
Handler for testing electronic components. According to claim 1,
The pressurizer further includes a temperature sensor for detecting the temperature of the pusher,
The control unit remembers the temperature of the pusher when testing the previous electronic component, and when the pressing operation is released for the test of the next electronic component after the test of the previous electronic component is completed, the temperature of the pusher is changed to the previous electronic component. Controlling the temperature controller to maintain the temperature during testing of parts
Handler for testing electronic components.

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