TWI745197B - Positioning mechanism, handler, tester, and testing equipment - Google Patents
Positioning mechanism, handler, tester, and testing equipment Download PDFInfo
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本發明有關即時檢知單元,而應用於定位機構、作業機、測試機及測試設備。 The invention relates to a real-time detection unit, and is applied to positioning mechanisms, working machines, testing machines and testing equipment.
在現今,電子元件測試設備包含作業機及測試機,測試機依作業需求,而供裝配具不同數量測試座之測試器,於測試作業前,將測試機組裝於作業機之底面,使測試器承置及測試電子元件。 Nowadays, electronic component testing equipment includes a working machine and a testing machine. The testing machine can be equipped with testers with different numbers of test sockets according to the operation requirements. Hold and test electronic components.
請參閱圖1,作業機10於機台11之測試區設有通孔12,測試機20於台座21設置測試器,測試器包含電性連接之電路板22及測試座23,測試座23供承置及測試電子元件,一定位機構於作業機10之機台11底面設置具複數個第一定位部件32之第一基板31,並於測試機20之台座21設置具複數個第二定位部件34之第二基板33;工作人員將測試機20移動至作業機10之機台11底面,定位機構以第一定位部件32位移卡掣第二定位部件34,令第二基板33之頂面貼合於機台11之底面,以定位測試機20及複數個測試座23;測試設備之壓接器(圖未示出)作Z方向向下位移至預設作業高度,並以預設下壓力下壓電子元件,使電子元件之複數個接點電性接觸測試座23之複數個探針而執行測試作業。
Please refer to Figure 1, the
惟,測試設備於電子元件執行測試之測試製程中,工作人員並不會進行校機作業,若定位機構之第一定位部件32發生無法確實卡掣第二定位部件34之情況,將使得第二基板33之頂面與機台11之底面異常分離而具有間隙,導致測試機20及複數個測試座23向下位移而偏離預設裝配位置,但工作人員卻無法立即得知此一異常狀況,當壓接器位移至預設作業高度時,將因測試座23向下偏移,而無法以預設下壓力壓接電子元件,以致電子元件之部分探針無法確實接觸測試座23之接點,進而影響電子元件之測試良率。
However, during the testing process of the electronic component testing of the test equipment, the staff will not perform calibration operations. If the
本發明之目的一,提供一種定位機構,包含第一基板、第二基板及即時檢知單元,第一基板與第二基板設有相互卡掣之第一定位部件與第二定位部件,即時檢知單元於第二基板設有貼合面,並設有一相通貼合面之通道,通道供配置一位移感測器;藉以第一基板與第二基板可分別裝配於第一物件與第二物件,第一物件上之第二基板的貼合面與第二物件之待檢工位的貼合組裝狀態,利用位移感測器即時感測第二基板與待檢工位之貼合確實性,以供工件人員根據感測訊號即時知悉第一物件與第二物件是否分離,進而迅速排除異常,進而提高測試品質。 The first object of the present invention is to provide a positioning mechanism comprising a first substrate, a second substrate, and an instant detection unit. The known unit is provided with a bonding surface on the second substrate, and is provided with a channel communicating with the bonding surface, and the channel is used for disposing a displacement sensor; whereby the first substrate and the second substrate can be respectively assembled on the first object and the second object , The bonding and assembly state of the bonding surface of the second substrate on the first object and the station to be inspected on the second object, using a displacement sensor to sense the authenticity of bonding between the second substrate and the station to be inspected in real time, This allows the workpiece personnel to know whether the first object is separated from the second object in real time according to the sensing signal, so as to quickly eliminate the abnormality, thereby improving the test quality.
本發明之目的二,提供一種作業機,包含機台、至少一裝置及即時檢知單元,機台供裝配至少一裝置,該裝置以執行預設作業,機台並設有至少一測試區,供容置測試器,測試器對電子元件執行測試作業,即時檢知單元於機台之測試區底面設有貼合面,並設有一相通貼合面之通道,通道供配置一位移感測器;藉以於機台之貼合面與一物件之待檢工位的貼合組裝狀態時,利用位移感測器即時感測機台與待檢工位之貼合確實性,以供工作人員根據感測 訊號即時知悉作業機與物件是否分離,而可迅速排除異常,進而提高測試品質。 The second objective of the present invention is to provide a working machine, which includes a machine, at least one device and a real-time detection unit. The machine is equipped with at least one device for performing preset operations. The machine is also provided with at least one test area. It is used to house the tester, and the tester performs the test operation on the electronic components. The real-time detection unit is provided with a bonding surface on the bottom surface of the test area of the machine, and a channel connecting the bonding surface is provided, and the channel is provided with a displacement sensor ; During the assembly state of the bonding surface of the machine and the station to be inspected of an object, the displacement sensor is used to sense the authenticity of the machine and the station to be inspected in real time for the staff to follow Sensing The signal knows whether the operating machine is separated from the object in real time, and the abnormality can be quickly eliminated, thereby improving the quality of the test.
本發明之目的三,提供一種測試機,包含台座及即時檢知單元,台座供裝配測試器,即時檢知單元於台座設有貼合面,並設有一相通貼合面之通道,通道供配置一位移感測器;藉以於台座之貼合面與一物件之待檢工位的貼合組裝狀態時,利用位移感測器即時感測台座與待檢工位之貼合確實性,以供工作人員根據感測訊號即時知悉測試機與物件是否分離,進而可迅速排除異常,進而提高測試品質。 The third objective of the present invention is to provide a testing machine, which includes a base and a real-time detection unit, the base is for assembling the tester, the real-time detection unit is provided with a bonding surface on the base, and is provided with a channel that communicates with the bonding surface, and the channel is for configuration A displacement sensor; when the bonding surface of the pedestal and the station to be inspected are assembled and assembled, the displacement sensor is used to sense the authenticity of the joint between the pedestal and the station to be inspected in real time. The staff knows whether the tester is separated from the object in real time based on the sensing signal, so that the abnormality can be quickly eliminated, thereby improving the quality of the test.
本發明之目的四,提供一種測試設備,包含作業機、測試機、即時檢知單元及中央控制裝置;作業機之機台供裝配至少一裝置,該裝置以執行預設作業,機台並設有至少一測試區;測試機之台座供裝配測試器,測試器對電子元件執行測試作業;即時檢知單元於作業機與測試機之其中一者設有貼合面,並設有一相通貼合面之通道,通道供配置一位移感測器,於作業機與測試機之其中另一者設有待檢工位,且相對於位移感測器,於貼合面與待檢工位之貼合組裝狀態,利用位移感測器即時感測貼合面與待檢工位之貼合確實性,以供工作人員根據感測訊號即時知悉作業機與測試機是否分離,而可迅速排除異常;中央控制裝置以供控制及整合各裝置、單元作動,而執行自動化作業。 The fourth object of the present invention is to provide a test equipment, including a working machine, a testing machine, a real-time detection unit, and a central control device; the machine of the working machine is equipped with at least one device, which performs preset operations, and the machines are arranged in parallel There is at least one test area; the pedestal of the testing machine is for assembling the tester, and the tester performs test operations on the electronic components; the real-time detection unit is provided with a bonding surface on one of the working machine and the testing machine, and a connected bonding is provided The channel of the surface, the channel is provided with a displacement sensor, the other of the working machine and the testing machine is provided with a station to be inspected, and relative to the displacement sensor, the bonding surface and the station to be inspected are bonded In the assembly state, the displacement sensor is used to sense the authenticity of the bonding surface and the station to be inspected in real time, so that the staff can know whether the working machine and the test machine are separated according to the sensing signal, and the abnormality can be quickly eliminated; The control device is used to control and integrate the actions of various devices and units to perform automated operations.
本發明之目的五,提供一種測試設備,包含作業機、測試器、即時檢知單元及中央控制裝置;作業機之機台供裝配至少一裝置,該裝置以執行預設作業,機台並設有至少一測試區;測試器包含架置件、電路板及測試座,架置件裝配於機台之測試區底面,並供配置電性連接之電路板及測試座,測試座以供測試電子元件;即時檢知單元於作業機或測試器之其中一者設有貼合面 ,並設有一相通貼合面之通道,通道供配置一位移感測器,於作業機或測試器之其中另一者設有待檢工位,且相對於位移感測器,於貼合面與待檢工位之貼合組裝狀態,利用位移感測器即時感測貼合面與待檢工位之貼合確實性,以供工作人員根據感測訊號而即時知悉作業機與測試器是否分離,而可迅速排除異常;中央控制裝置以供控制及整合各裝置、單元作動,而執行自動化作業。 The fifth object of the present invention is to provide a test equipment, including a working machine, a tester, a real-time detection unit, and a central control device; the machine of the working machine is equipped with at least one device, and the device is used to perform preset operations, and the machines are arranged in parallel There is at least one test area; the tester includes a mounting part, a circuit board and a test base. The mounting part is assembled on the bottom of the test area of the machine, and is provided with electrical connection circuit boards and test bases. The test base is used for testing electronics Component; the real-time detection unit has a bonding surface on one of the working machine or the tester , And there is a channel that communicates with the bonding surface. The channel is used to configure a displacement sensor. The other of the working machine or the tester is equipped with a station to be inspected, and relative to the displacement sensor, on the bonding surface and The bonding and assembly status of the station to be inspected uses displacement sensors to sense the authenticity of the bonding surface and the station to be inspected in real time, so that the staff can instantly know whether the working machine and the tester are separated based on the sensing signal , And can quickly eliminate abnormalities; the central control device is used to control and integrate the actions of various devices and units to perform automated operations.
[習知] [Learning]
10:作業機 10: Working machine
11:機台 11: Machine
12:通孔 12: Through hole
20:測試機 20: Test machine
21:台座 21: Pedestal
22:電路板 22: circuit board
23:測試座 23: Test Block
31:第一基板 31: The first substrate
32:第一定位部件 32: The first positioning component
33:第二基板 33: second substrate
34:第二定位部件 34: The second positioning component
[本發明] [this invention]
41:第一基板 41: The first substrate
411:第一定位部件 411: The first positioning component
42:第二基板 42: second substrate
421:第二定位部件 421: second positioning component
422:貼合面 422: Fitting surface
423:通道 423: Channel
43:位移感測器 43: Displacement sensor
A:待檢工位 A: Station to be inspected
50:作業機 50: working machine
51:機台 51: Machine
511:通孔 511: Through hole
512:貼合面 512: Fitting surface
513:通道 513: Channel
514:位移感測器 514: Displacement Sensor
52:供料裝置 52: Feeding device
53:收料裝置 53: Receiving device
541:第一移料器 541: first shifter
542:第一載台 542: first stage
543:第二載台 543: second stage
544:第二移料器 544: Second Shifter
545:第三移料器 545: Third Shifter
60:測試機 60: test machine
61:台座 61: Pedestal
611:連接板 611: connecting plate
612:貼合面 612: Fitting surface
613:通道 613: Channel
62:位移感測器 62: Displacement sensor
71:電路板 71: circuit board
72:測試座 72: Test Block
73:架置件 73: mounting parts
731:貼合面 731: Fitting surface
732:通道 732: Channel
74:位移感測器 74: Displacement sensor
圖1:習知作業機及測試機之配置圖。 Figure 1: The configuration diagram of the conventional operating machine and testing machine.
圖2:本發明第一實施例之示意圖。 Figure 2: A schematic diagram of the first embodiment of the present invention.
圖3:係圖2之局部示意圖。 Figure 3: A partial schematic diagram of Figure 2.
圖4:本發明第一實施例之使用示意圖。 Figure 4: A schematic diagram of the use of the first embodiment of the present invention.
圖5:係圖4之局部示意圖。 Figure 5: is a partial schematic diagram of Figure 4.
圖6:本發明第二實施例圖。 Fig. 6: A diagram of the second embodiment of the present invention.
圖7:係圖6之俯視圖。 Figure 7: The top view of Figure 6.
圖8:本發明第三實施例圖。 Fig. 8: A diagram of the third embodiment of the present invention.
圖9:本發明第四實施例圖。 Figure 9: A diagram of the fourth embodiment of the present invention.
為使 貴審查委員對本發明作更進一步之瞭解,茲舉一較佳實施例並配合圖式,詳述如後:請參閱圖2、3,本發明第一實施例,揭示一種定位機構,包含第一基板41、第二基板42及即時檢知單元,第一基板41設有複數個第一定位部件411,第二基板42設有複數個第二定位部件421,複數個第二定位部件421以供連
結複數個第一定位部件411,即時檢知單元於第二基板42設有貼合面422,並設有一相通貼合面422之通道423,通道423供配置一位移感測器43,於貼合面422與待檢工位之貼合組裝狀態,利用位移感測器43即時感測貼合面422與待檢工位之貼合確實性,以供工件人員根據感測訊號即時知悉第二基板42與待檢工位是否分離,而可迅速排除異常。
In order to enable your reviewer to have a better understanding of the present invention, a preferred embodiment is given in conjunction with the drawings. The details are as follows: Please refer to Figures 2 and 3, the first embodiment of the present invention discloses a positioning mechanism, including The
更進一步,第二基板42之通道423可為容置槽或通孔,並以一端相通貼合面422。
Furthermore, the
更進一步,第一定位部件411與第二定位部件421作相互配合設計,以供定位第二基板42,例如第一定位部件411為移動式卡塊,第二定位部件421為擋塊,利用卡塊與擋塊之相互卡掣,使第一基板41定位連結第二基板42;例如第一定位部件411為栓具,第二定位部件421為螺孔,利用栓具螺合螺孔,使第一基板41定位連結第二基板42;不受限於本實施例。
Furthermore, the
更進一步,位移感測器43可為渦流型位移感測器、壓電元件或壓力感測器等,其一端為裝配端,另一端為感測端,感測端可作接觸或非接觸待檢工位。又位移感測器43可配置於通道423之內部或端部,例如位移感測器43配置於通道423之內部,例如通道423之一端相通貼合面422,位移感測器43配置於通道423之另一端部,該配置方式包含直接配置及間接配置,例如位移感測器43利用架體架置於通道423之另一端部,因此,位移感測器43之配置方式不受限於本實施例;位移感測器43將感測訊號傳輸至一處理器(圖未示出),處理器接收感測訊號,並作一分析判斷,處理器連接一顯示裝置(如螢幕或燈具),以供顯示異常;不受限於本實施例。
Furthermore, the
更進一步,待檢工位為一物件之其一部位,且相對於位移感測器43,例如物件為作業機之機台,並以機台底面相對應位移感測器43的一部位(如底面)作為待檢工位。
Furthermore, the station to be inspected is a part of an object, and relative to the
於本實施例,定位機構之第一基板41為獨立板體,並設有複數個為移動式卡塊之第一定位部件411,第一基板41裝配於一為作業機50之物件,作業機50之機台51設有測試區,並於測試區設有通孔511,機台51之測試區底面供裝配第一基板41,使第一基板41之第一定位部件411位於通孔511之周側;第二基板42為獨立板體,並於相對應第一基板41之第一定位部件411的位置設有第二定位部件421,第二定位部件421為擋塊,以供第一定位部件411卡掣連結組裝;第二基板42裝配於一測試機60之台座61,台座61供裝配測試器,測試器包含電性連接之電路板71與具探針之測試座72,測試座72供承置及測試電子元件;即時檢知單元於第二基板42設有複數個為容置槽之通道423,通道423之一端相通貼合面422,並於內部供配置一位移感測器43,複數個為渦流型位移感測器之位移感測器43,其裝配端置入於通道423,而感測端則靠近於貼合面422,機台51底面相對於位移感測器43之部位即為待檢工位A。
In this embodiment, the
請參閱圖4、5,工作人員將測試機60移動至作業機50之機台51下方,並令測試座72相對於機台51測試區之通孔511,再將測試機60作Z方向位移,使定位機構之第二基板42之貼合面422貼合於作業機50之機台51底面的待檢工位A,此時,即時檢知單元之位移感測器43的感測端感測於機台51底面的待檢工位A,並以位移感測器43之電阻值作為基準電阻值,定位機構以第一基板41之第一定位部件411位移卡掣於第二基板42之第二定位部件421,使第一基板41連結定位第二基板42,亦即經由第二基板42定位測試座72及測試機60;然於電
子元件測試製程中,若第二基板42因某些因素(例如第一定位部件411無法確實卡掣第二定位部件421)而向下位移與機台51作些微分離時,即會導致測試座72及測試機60同步向下位移而偏離預設裝配位置,由於即時檢知單元之位移感測器43位於第二基板42,將使得位移感測器43與機台51之待檢工位A分離,位移感測器43於位移時會發生電阻值的改變,並輸出一異常訊號至處理器,以即時感測到機台51與第二基板42分離,處理器可以顯示裝置顯示發生異常狀態,以供工作人員即時知悉而迅速排除異常,進而提高測試品質。
Please refer to Figures 4 and 5, the worker moves the
請參閱圖6、7,本發明第二實施例,揭示一種作業機50,包含機台51、至少一裝置及即時檢知單元,機台51供裝配至少一裝置,該裝置以執行預設作業,機台51並設有至少一測試區,供容置測試器,測試器對電子元件執行測試作業,即時檢知單元於機台51之測試區底面設有貼合面,並設有一相通貼合面之通道,通道供配置一位移感測器,於機台51之貼合面與待檢工位之貼合組裝狀態,利用位移感測器即時感測機台51與待檢工位之貼合確實性,以供工作人員根據感測訊號即時知悉作業機50與待檢工位是否分離,而可迅速排除異常。
6 and 7, the second embodiment of the present invention discloses a working
更進一步,機台51之通道可為容置槽或通孔,並以一端相通貼合面。
Furthermore, the channel of the
更進一步,位移感測器可為渦流型位移感測器、壓電元件或壓力感測器等,其一端為裝配端,另一端為感測端,感測端可作接觸或非接觸待檢工位。又位移感測器可配置於通道之內部或端部,位移感測器將感測訊號傳輸至一處理器(圖未示出),處理器接收感測訊號,並作一分析判斷,處理器連接一顯示裝置(如螢幕或燈具),以供顯示異常;不受限於本實施例。 Furthermore, the displacement sensor can be an eddy current type displacement sensor, a piezoelectric element or a pressure sensor. One end is the assembly end and the other end is the sensing end. The sensing end can be used for contact or non-contact to be inspected. Station. In addition, the displacement sensor can be arranged inside or at the end of the channel. The displacement sensor transmits the sensing signal to a processor (not shown). The processor receives the sensing signal and makes an analysis and judgment. The processor Connect a display device (such as a screen or a lamp) for displaying abnormalities; it is not limited to this embodiment.
於本實施例,機台51以測試區開設通孔511;作業機50於機台51配置複數個裝置,複數個裝置分別為供料裝置52、收料裝置53及輸送裝置,供料裝置52設有至少一供料承置器,以供容納至少一待測電子元件;收料裝置53設有至少一收料承置器,以供容納至少一已測電子元件;輸送裝置設有至少一移料器,以供移載電子元件,於本實施例,輸送裝置設有第一移料器541於供料裝置52取出待測之電子元件,並將待測電子元件移載至第一載台542,第一載台542以供移載待測之電子元件至測試區之側方,一第二載台543以供載送已測之電子元件,第二移料器544於測試區、第一載台542及第二載台543移載待測電子元件及已測電子元件,第三移料器545將第二載台543之已測電子元件移載至收料裝置53收置;即時檢知單元以測試區之底面作為貼合面512,並設有複數個為容置槽之通道513,通道513之一端相通貼合面512,並於內部供配置一位移感測器514,位移感測器514為一渦流型位移感測器,其裝配端嵌入於通道513之內部,而感測端則靠近於貼合面512;一測試機60設有台座61,台座61供裝配至少一測試器,測試器包含電性連接之電路板72及測試座71,測試座71以供測試電子元件;測試機60可以鎖固或卡掣方式定位於機台51下方,使機台51之貼合面512貼合測試機60之待檢工位,亦即使位移感測器514的感測端感測於待檢工位;於本實施例,定位機構於作業機50之機台51設置具第一定位部件411之第一基板41,以及於測試機60之台座61設置具第二定位部件421之第二基板42,第一基板41以第一定位部件411卡掣定位第二基板42之第二定位部件421;測試機60以第二基板42相對於機台51之位移感測器514的位置作為待檢工位A;然於電子元件測試製程中,若機台51之貼合面512與第二基板42的待檢工位A作些微分離時,第
二基板42之待檢工位A的位移將會使位移感測器514發生電阻值的改變,以即時檢知機台51與測試機60分離,以供工作人員知悉而即時排除異常。
In this embodiment, the
請參閱圖8,本發明第三實施例,揭示一種測試機60,包含台座61及即時檢知單元,台座61供裝配測試器,即時檢知單元於台座61設有貼合面,並設有一相通貼合面之通道,通道供配置一位移感測器,更進一步,台座61以頂面作為貼合面,或者於台座61裝配一連接板,並以連接板之頂面作為貼合面,該連接板具有至少一定位部,該定位部可為栓孔、卡塊或卡孔等,不受限於本實施例;於台座61之貼合面與待檢工位之貼合組裝狀態時,利用位移感測器即時感測台座61與待檢工位之貼合確實性,以供工作人員根據感測訊號而即時知悉測試機60與待檢工位是否分離,而可迅速排除異常。
Referring to FIG. 8, the third embodiment of the present invention discloses a
更進一步,台座61之通道可為容置槽或通孔,並以一端相通貼合面。
Furthermore, the passage of the
更進一步,位移感測器可為渦流型位移感測器、壓電元件或壓力感測器等,其一端為裝配端,另一端為感測端,感測端可作接觸或非接觸待檢工位。又位移感測器可配置於通道之內部或端部,位移感測器將感測訊號傳輸至一處理器(圖未示出),處理器接收感測訊號,並作一分析判斷,處理器連接一顯示裝置(如螢幕或燈具),以供顯示異常;不受限於本實施例。 Furthermore, the displacement sensor can be an eddy current type displacement sensor, a piezoelectric element or a pressure sensor. One end is the assembly end and the other end is the sensing end. The sensing end can be used for contact or non-contact to be inspected. Station. In addition, the displacement sensor can be arranged inside or at the end of the channel. The displacement sensor transmits the sensing signal to a processor (not shown). The processor receives the sensing signal and makes an analysis and judgment. The processor Connect a display device (such as a screen or a lamp) for displaying abnormalities; it is not limited to this embodiment.
於本實施例,測試機60之台座61裝配一連接板611,即時檢知單元以台座61之連接板611頂面作為貼合面612,並設有複數個為容置槽之通道613,通道613之一端相通貼合面612,並於內部供配置一位移感測器62,位移感測器62為一渦流型位移感測器,其裝配端嵌入於通道613之內部,而感測端則靠近於貼合面612;另於測試機60之台座61裝配測試器,測試器包含電性連接之電路
板72及測試座71;一作業機50之機台51位於測試機60之上方,機台51相對於測試機60之位移感測器62的位置即為待檢工位A;測試機60以鎖固方式定位於機台51底面,使測試機60之貼合面612貼合作業機50之機台51的待檢工位A,亦即使位移感測器62的感測端感測於機台51的待檢工位A;然於電子元件測試製程中,若測試機60之貼合面612與機台51的待檢工位A作些微分離時,位移感測器62的位移將會發生電阻值的改變,以即時檢知機台51與測試機60分離,以供工作人員知悉而即時排除異常。
In this embodiment, the
請再參閱圖6、7,揭示一種測試設備,包含作業機50、測試機60、即時檢知單元及中央控制裝置(圖未示出);更包含定位機構;作業機50包含機台51及至少一裝置,機台51供裝配至少一裝置,該裝置以執行預設作業,於本實施例,複數個裝置分別為供料裝置52、收料裝置53及輸送裝置,各裝置之作動如前所述,不再贅述;機台51並設有至少一測試區,供容置測試器;測試機60包含台座61及即時檢知單元,台座61供裝配測試器,測試器對電子元件執行測試作業,於本實施例,測試器包含電性連接之電路板71及測試座72,測試座72承置及測試電子元件;定位機構於作業機50之機台51設置具第一定位部件411之第一基板41,以及於測試機60之台座61設置具第二定位部件421之第二基板42,第一基板41以第一定位部件411卡掣定位第二基板42之第二定位部件421;即時檢知單元於作業機50或測試機60之其中一者設有貼合面,並設有一相通貼合面之通道,通道供配置一位移感測器,於作業機50或測試機60之其中另一者設有待檢工位,待檢工位相對於位移感測器,於貼合面與待檢工位之貼合組裝狀態,利用位移感測器即時感測作業機50或測試機60是否分離,以供工作
人員根據感測訊號而迅速排除異常;中央控制裝置以供控制及整合各裝置、單元作動,而執行自動化作業。
Please refer to Figures 6 and 7, again, a test equipment is disclosed, including a working
請參閱圖7、9,本發明第四實施例,揭示一種測試設備,包含作業機50、測試器、即時檢知單元及中央控制裝置(圖未示出);作業機50包含機台51及至少一裝置,機台51供裝配至少一裝置,該裝置以執行預設作業,於本實施例,複數個裝置分別為供料裝置52、收料裝置53及輸送裝置,各裝置之作動如前所述,不再贅述;機台51並設有至少一測試區,供容置測試器;測試器裝配於作業機50,包含架置件73、電路板71及測試座72,架置件裝配於作業機50之機台51的測試區底面,並供配置電性連接之電路板71及測試座72,測試座72以供測試電子元件;即時檢知單元於作業機50或測試器之其中一者設有貼合面,並設有一相通貼合面之通道,通道供配置一位移感測器,於作業機50或測試器之其中另一者設有待檢工位,待檢工位相對於位移感測器,於貼合面與待檢工位之貼合組裝狀態,利用位移感測器即時感測作業機50或測試器是否分離,以供工作人員根據感測訊號而迅速排除異常;於本實施例,即時檢知單元於測試器之架置件73設有貼合面731,並於貼合面731設有通道732,通道732供嵌置位移感測器74,另以機台51之測試區底面相對於位移感測器74之位置作為待檢工位A,於測試器之貼合面731與機台51之待檢工位A之貼合組裝狀態,利用位移感測器74即時檢知機台51與架置件73是否分離,以供工作人員根據感測訊號而迅速排除異常;中央控制裝置以供控制及整合各裝置、單元作動,而執行自動化作業。
Please refer to Figures 7 and 9, the fourth embodiment of the present invention discloses a test equipment, including a working
更進一步,上述測試設備之位移感測器可為渦流型位移感測器、壓電元件或壓力感測器等,其一端為裝配端,另一端為感測端,感測端可作接 觸或非接觸待檢工位。又位移感測器可將感測訊號傳輸至一處理器(圖未示出),處理器接收感測訊號,並作一分析判斷,處理器連接一顯示裝置(如螢幕或燈具),以供顯示異常;不受限於本實施例。 Furthermore, the displacement sensor of the above-mentioned test equipment can be an eddy current displacement sensor, a piezoelectric element or a pressure sensor, etc., one end of which is the assembly end, the other end is the sensing end, and the sensing end can be used for connection Touch or non-contact station to be inspected. In addition, the displacement sensor can transmit the sensing signal to a processor (not shown in the figure). The processor receives the sensing signal and makes an analysis and judgment. The processor is connected to a display device (such as a screen or a lamp) for Display abnormal; not limited to this embodiment.
41:第一基板 41: The first substrate
411:第一定位部件 411: The first positioning component
42:第二基板 42: second substrate
421:第二定位部件 421: second positioning component
422:貼合面 422: Fitting surface
43:位移感測器 43: Displacement sensor
A:待檢工位 A: Station to be inspected
50:作業機 50: working machine
51:機台 51: Machine
511:通孔 511: Through hole
60:測試機 60: test machine
72:測試座 72: Test Block
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