KR20220128206A - Method for Chips Test using Flying Probe Tester - Google Patents

Abstract

The present invention relates to a method for testing PCB chips using a flying probe tester. The present invention automatically moves to X, Y, and Z axes to automatically measure inductance (L), capacitance (C), and resistance (R) of each chip for a PCB to which a chip is mounted and includes a pin tool for automatically exchanging a contact pin for measuring various chips such as a type, direction, and the like of chips to be measured.

Description

PCB chip measurement method using a flying probe tester {Method for Chips Test using Flying Probe Tester}

The present invention is a flying probe tester that automatically moves along the X, Y and Z axes to automatically measure the inductance (L: Inductance), capacitance (C: capacitance), and resistance (R: Resistance) of each chip with respect to the PCB on which the chip is mounted. (Flying Prove Tester) is related to the PCB chip measurement method.

In general, a printed circuit board (PCB: Printed Circuit Board) is mounted with various components such as numerous devices (chips) or modules (module).

These components are connected to each other on the PCB to form an electrical circuit. In such a PCB, if even one component is not mounted properly, or if disconnected or short-circuited, the electronic device itself may not operate or cause malfunction.

Therefore, the PCB board on which each component is mounted is tested in advance whether or not each component is properly mounted before being mounted on an electronic device.

Various prior art has been disclosed for such a PCB test, and FIG. 1 is a circuit board test system configuration diagram according to the prior art, which is disclosed in Korean Patent Publication No. 10-2009-0057518 (published on June 8, 2009). , referring to this, the circuit board test system includes a rack unit 10 , a control unit 30 , a camera unit 40 , an input/output unit 50 , a relay unit 20 , and a precision test unit 70 .

The rack unit 10 includes a digital multimeter 11 and a power supply 12 .

The digital multimeter 11 receives the measurement signal detected through the measurement probe on the measurement board mounted on the jig 21 through the relay set 22, and detects whether the measurement board is short-circuited therefrom, and as a result is transmitted to the arithmetic processing unit 33 through the relay interface unit 32 .

The jig 21 is positioned at a predetermined place by fixing the measuring board. The jig 21 moves to a predetermined position according to a jig control signal received from the operation processing unit 33 through the relay interface 32 , the relay control unit 23 , and the relay set 22 to fix the measurement board.

The relay unit 20 includes a relay control unit 23 and a relay set 22 .

The relay control unit 23 receives the relay control signal from the operation processing unit 33 through the relay interface 32 . The relay control unit 23 may include a microprocessor to generally control the operation of the relay set 22 .

The camera unit 40 takes a picture of the measuring board whose temperature rises during operation using the infrared camera 41 , and outputs the heat distribution of the measuring board as an image signal to the control unit 30 . The camera unit 40 includes an infrared camera 41 , a camera position control module 42 , and a camera position control motor 43 .

The infrared camera 41 can take a thermal image of the measurement board by moving up and down along the Z-axis direction by the camera position control motor 43 . The thermal image photographed by the infrared camera 41 is transmitted to the external equipment control unit 31 of the control unit 30 .

The camera position control motor 43 is a motor that moves the infrared camera 41 up and down in the Z-axis direction, and drives the motor according to a motor driving signal received from the camera position control module 42 .

The control unit 30 calculates and processes the thermal image signal received from the camera unit 40, measures the temperature change of each component mounted on the measurement board, determines the thermal quality and reliability of the component, and determines that there is a defect. By moving the flying probe to the position of the determined part and performing an electrical test, a precise test is made possible, and the measured result is outputted to an output means such as a printer 51 in the input/output unit 50 .

The control unit 30 may include an external equipment control unit 31 , a relay interface 32 , an operation processing unit 33 , a camera interface 34 , a printer interface 35 , and a barcode reader interface 36 .

The external equipment control unit 31 converts the image signal received from the infrared camera 41 into a digital signal and transmits it to the operation processing unit 33 .

The operation processing unit 33 transmits the position control signal of the infrared camera 41 to the camera position control module 42 through the camera interface 34 , and the digital multimeter 11 and the power supply through the relay interface 32 . (12), each control signal is transmitted to the relay control unit 23, and the flying probe assembly 75 control signal is transmitted to the flying interface 71.

The precision test unit 70 includes a flying interface 71 , a motion control unit 73 , a probe assembly 75 , and an electrical signal measurement unit 77 .

The motion controller 73 moves the flying probe assembly 75 to the position of the component in the thermal failure state. The probe assembly 75 may be connected to a robot arm or the like through a motor, and the motion control unit 73 moves the probe assembly 75 in the X-axis direction, the Y-axis direction, or the Z direction according to a control signal from the operation processing unit 33 . By moving it in the axial direction, it is moved to the position of the part to be inspected electrically.

The input/output unit 50 includes an output means such as a printer 51 and a barcode reader 52 . The printer 51 outputs the test result of the measurement board received from the arithmetic processing unit 33 through the printer interface 35 . The barcode reader 52 reads the barcodes of the measurement boards and transmits them to the microcomputer operation processing unit 33 through the barcode reader interface 36 .

The prior art configured as described above uses an infrared camera to sort out parts with a possibility of defects, and performs electrical inspection by the flying probe only on these parts, so that precise electrical inspection is possible and the flying probe needs to inspect all parts at the same time Not only is the test time significantly reduced due to the absence of The problem of additional cost incurred during testing disappears.

However, in this prior art, not only can the measurement be possible only when the actual product is mounted on the PCB and power is applied, but also the contact pin is fixed to the flying probe, so various types of chips mounted on the PCB, such as different types, sizes, and mounting directions. It takes a lot of time to replace the corresponding various contact pins in order to measure

Korean Patent Publication No. 10-2009-0057518 (published on June 8, 2009)

Therefore, in order to improve the problems of the prior art, the present invention automatically measures the inductance (L: Inductance), capacitance (C: capacitance), and resistance (R: Resistance) of each chip with respect to the PCB on which the chip is temporarily mounted. The purpose is to provide a method for measuring PCB chips using a flying probe tester that automatically moves in the X, Y and Z axes and has a pin tool for automatic contact pin replacement for measuring various chips, such as the type and direction of the chip for measurement. have.

A PCB chip measurement process using a flying probe tester for achieving the object of the present invention is a PCB chip measurement method using an X-axis, Y-axis and Z-axis flying probe tester for testing various chips on a printed circuit board (PCB). The method of claim 1 , wherein the flying probe tester includes: a first process of fixing a PCB to a set origin position on a workbench using a vision camera and a slide rail; a second process of comparing the position data of the chip mounted on the PCB by the vision camera with the position data of the previously input chip and confirming whether it is within a tolerance range; a third process of performing a first chip measurement after mounting a pin tool for testing a chip recognized by the vision camera on a tool body if it is within the allowable error in the second process; a fourth process of performing secondary chip measurement after automatically replacing the corresponding pin tool for secondary chip measurement after the first chip measurement in the third process; and a fifth process of repeating the third and fourth processes to complete measurement of all designated chips.

Here, the first process includes: 11 step of moving the vision camera to the reference origin of the workbench; 12 steps of mounting the PCB on the workbench, moving the slide rail, and fixing the PCB.

In addition, the second process is step 21 of recognizing the PCB through the vision camera; 22 step of photographing the PCB equally into a plurality of areas; 23 step of extracting the PCB chip position data taken in equal parts; 24 step of comparing the PCB chip position data with pre-stored PCB position data; and a 25 step of calculating the perseverance recognition of a preset tolerance range as a result of the comparison in step 24.

In addition, the third and fourth processes may include: step 31 of automatically recognizing and selecting a pin tool for testing a chip recognized by the vision camera; Step 32, wherein the tool body moves to the pin tool magazine, mounts the waiting pin tool, and then moves to the location of the corresponding chip; and rotating the pin tool by a predetermined angle to correspond to the position of the chip. and step 34 of testing the corresponding chip by lowering the pin tool along the Z-axis.

In the PCB chip measurement method using the flying probe tester according to the present invention, the flying probe tester automatically moves to the X, Y and Z axes, so that the inductance (L: Inductance) and capacitance (C: Capacitance) of each chip with respect to the PCB on which the chip is mounted ) and resistance (R: Resistance) are automatically measured, and by automatically replacing the pin tool in the pin tool magazine, various chips such as the type and direction of the chip can be automatically measured, and the measurement time is greatly reduced as a result. .

In addition, since components are temporarily mounted without actually mounting on the PCB, and measurements are made without power applied, the test preparation step is very simple, and correction/complementation in case of errors is also very simplified.

1 is a circuit board test system configuration diagram according to the prior art,
2 is an overall equipment configuration diagram of a flying probe tester for implementing the present invention,
3 is a detailed configuration diagram of the tool body and the pin tool magazine for replacing the tool pin in FIG. 2;
Figure 4 is a detailed configuration diagram of the tool pin in Figure 3,
5 is a flowchart of a PCB chip measurement process using a flying probe tester according to an embodiment of the present invention.

The features and effects of the present invention described above will become more apparent through the following detailed description in relation to the accompanying drawings, and accordingly, those of ordinary skill in the art to which the present invention pertains can easily implement the technical idea of the present invention. will be able

Since the present invention may have various changes and may have various forms, specific embodiments will be illustrated and described in detail in the text.

However, this is not intended to limit the present invention to a specific disclosed form, it should be understood to include all modifications, equivalents and substitutes included in the spirit and scope of the present invention.

The terms used in the present application are only used to describe specific embodiments, and are not intended to limit the present invention.

A method for measuring a PCB chip using a flying probe tester according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

2 is an overall equipment configuration diagram of a flying probe tester for implementing the present invention. A flying probe tester table 100 and a PCB 101 of various sizes on the flying probe tester table 100 are fixed in a slide manner. PCB fixing unit 110 for the purpose, Z-axis moving member 140 for moving the flying probe tester 150 up and down in the Z-axis, and X-axis moving member for slidingly moving the Z-axis moving member 140 in the X-axis 120 and a Y-axis moving member 130 fixed to both upper sides of the flying probe tester table 100 and slidingly moving in the Y-axis by supporting the X-axis moving member 120 from both sides.

The PCB fixing part 110 is composed of at least one slide-type PCB slide fixing member 111 capable of fixing PCBs of various sizes by moving the PCB 101 from side to side in a slide structure in a slide structure. (See Fig. 2)

The flying probe tester 150 includes a pin tool 152 equipped with a cobra pin 154a for measuring L, R, and C of a chip mounted on a PCB, and the pin tool 152 is detachable and rotates at a specified angle. It is composed of a tool body 151 for the purpose, and the pin tool 152 and the tool body 151 are fixed with an electromagnet so that they can be automatically replaced. (See Figs. 3 and 4)

The cobra pin 154 is configured as a POGO pin that comes into contact with the PCB 1010 to apply a driving current and receive a signal.

The detailed operation of the present invention configured as described above will be described in detail with reference to the accompanying FIGS. 2 to 5 as follows.

Referring to FIG. 5 , when the power of the entire system is applied first, it moves to the initial origin of the X, Y, and Z axes or moves to the user-specified origin set by the user.

At this time, the reference point of the inspection table is measured using a vision camera (not shown in the drawing), and if it is within the tolerance, the PCB 101 is fixed using the PCB fixing unit 110 .

Here, in the PCB 101 , each chip can be temporarily mounted on the PCB to be measured using an adhesive, etc., and the measurement is performed in a state that no actual power is applied to the PCB 101 .

The PCB 101 is fixed by sliding each of the PCB sliding fixing members 111 along the rail.

After the PCB 101 is fixed to the PCB fixing unit 110 , the vision camera recognizes the PCB 101 and takes a picture, and the picture is taken by dividing the PCB area into a plurality of parts. That is, the entire area of the PCB 101 is divided into 8/10/16 equal parts to be photographed.

After reconfirming the initially inputted PCB chip position data, comparing and analyzing the position data of the vision camera, if the comparison result is out of tolerance, reconfirming the initially input PCB chip position data, and comparing and analyzing the position data obtained with the vision camera Identify the cause and perform position adjustment.

When the initially input PCB chip position data and the position data measured by the vision camera are within the allowable error, the pin tool 152 for measuring the chip is recognized and the corresponding pin tool 152 is replaced.

Here, to replace the pin tool 152, the tool body 151 is moved to the empty pin tool magazine 160 position using the X, Y, and Z axis moving members 120, 130, and 140, and then mounted. The pin tool 152 is separated and put down, and after moving to the required pin tool 152 seated in the pin tool magazine 160 , it is mounted on the tool body 151 .

In this case, the tool body 151 and the pin tool 152 are detachable using an electromagnet. (See Fig. 3)

After replacing the pin tool 152, the X, Y, and Z-axis moving members 120 (130, 140) are driven to move to the corresponding chips of the PCB 101 to measure L, R, and C, at this time The tool body 151 is rotatable 360° using a stepping motor (not shown in the drawing), so that it is possible to respond to various directions, positions, and sizes of the mounted chips.

In addition, it is preferable that the pin tool 152 maintains a tension of about 3 to 7 g when the pin tool 152 uses a cobra pin 153 at the end of the pin tool 152 to contact the corresponding chip.

When each chip is measured using the pin tool 152 in this process, measurement result data is displayed on the monitor.

When the other pin tool 152 needs to be replaced for the next test, after replacing the pin tool in the same way as in the pin tool replacement process, L, R, and C of the secondary chip are measured, and the corresponding measurement data is displayed on the monitor. .

The PCB measurement result measured through this process is judged pass/fail, and after all PCB chip measurements are completed, the tool body 151 moves to the pin tool magazine 160, and the mounted pin tool 152 is separated and seated. After this, the X and Z-axis moving members 120 and 140 are moved to the origin, and the PCB 101 on which the measurement is completed is separated from the PCB fixing unit 110 .

After confirming the separation of the PCB 101, it moves to the origin of the Y-axis and ends all test work.

As described above, although the PCB chip measurement method using the flying probe tester according to the embodiment of the present invention has been described with reference to the limited embodiments and drawings, it is not limited by this embodiment, and common knowledge in the technical field to which the present invention belongs Of course, various modifications and variations are possible within the scope of the technical spirit of the present invention and the equivalents of the claims to be described below by those having.

100: Flying Probe Tester Table
101: PCB 110: PCB fixing part
111: PCB sliding fixing member
120,130,140: X, Y, Z axis moving member
150: Flying Probe Tester
151: tool body 152: pin tool
153: cobra pin 160: pintool magazine

Claims (6)

In a PCB chip measurement method using an X-axis, Y-axis and Z-axis flying probe tester for testing various chips on a printed circuit board (PCB),
The flying probe tester includes a first process of fixing the PCB to the set origin position on the workbench using a vision camera and a slide rail;
a second process of comparing the position data of the chip mounted on the PCB measured by the vision camera with the position data of the previously input chip and confirming whether it is within a tolerance range;
a third process of performing a first chip measurement after mounting a pin tool for testing a chip recognized by the vision camera on a tool body if it is within the allowable error in the second process;
a fourth process of performing secondary chip measurement after automatically replacing the corresponding pin tool for secondary chip measurement after the first chip measurement in the third process; and
A method for measuring PCB chips using a flying probe tester, comprising: a fifth process of repeating the third and fourth processes to complete measurement of all designated chips. According to claim 1,
The first process includes an 11 step of moving the vision camera to the reference origin of the workbench;
12 steps of mounting the PCB on the workbench, moving the slide rail, and fixing the PCB. According to claim 1,
The second process is step 21 of recognizing the PCB through the vision camera;
22 step of photographing the PCB equally into a plurality of areas;
23 step of extracting the PCB chip position data taken in equal parts;
24 step of comparing the PCB chip position data with pre-stored PCB position data; and
A method of measuring a PCB chip using a flying probe tester, comprising: a 25 step of calculating whether the comparison result in the 24 step is within a preset tolerance range. According to claim 1,
The third process and the fourth process are the 31 steps of automatically recognizing and selecting a pin tool for testing the chip recognized by the vision camera;
Step 32, wherein the tool body moves to the pin tool magazine, mounts the waiting pin tool, and then moves to the location of the corresponding chip; and
33 rotating the pin tool by a predetermined angle to correspond to the position of the chip;
Step 34 of testing the corresponding chip by lowering the pin tool along the Z-axis; PCB chip measurement method using a flying probe tester, comprising: a. According to claim 1,
The PCB chip measurement method using a flying probe tester, characterized in that the test of various chips implemented on the printed circuit board (PCB) measures inductance, capacitance, and resistance. According to claim 1,
After completing the test of each chip of the printed circuit board, after the pin tool is seated in the pin tool magazine, the tool body is moved to a set initial origin.

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