KR20090057518A - System for testing circuit board and method for testing circuit board using the system - Google Patents

Abstract

A system for testing a circuit board and a method for testing the circuit board using the system are provided to reduce a test time remarkably by testing only devices which are seem to be defect with a flying probe. A camera unit(40) comprises a camera position control motor(43), a camera position control module(42), and an infrared camera(41). The camera position control motor moves the infrared camera to Z-axis, and the camera position control module output a motor driving signal for driving the camera position control motor according to a camera position control signal. The infrared camera takes a picture of a target board and transmits a thermal image data to a controller(30), and the control senses a defect product based on the thermal image data.

Description

Circuit board test system and circuit board test method using the same {SYSTEM FOR TESTING CIRCUIT BOARD AND METHOD FOR TESTING CIRCUIT BOARD USING THE SYSTEM}

The present invention relates to a circuit board test system and a circuit board test method using the same, and more particularly, by using an infrared camera to screen out defective parts, and by performing an electrical inspection by a flying probe only on these parts. In addition, the present invention relates to a circuit board test system and circuit board test method using the same, which can significantly reduce test time while enabling precise electrical test.

Recently, with the development of science and technology, the type and number of components mounted on a circuit board of standard specifications are increasing exponentially. Accordingly, efforts have been actively made to more easily detect defects of components included in a circuit board.

One device that tests components on a circuit board is an IR insert tester. The IR insert tester fixes a circuit board on a jig, photographs it using an infrared camera, and then reads the obtained thermal image to detect thermal defects in the circuit board.

However, in the IR insert tester, the cost of making a fixed jig is added for each board to be measured by using a fixed jig, and there is a possibility that a test point can be determined before measuring which part is to be fixed as a test point. The problem of making a fixed jig by selecting a part and the like is raised, and its association with a result measured using an infrared camera is unclear.

In addition, since the circuit board is tested using only the infrared camera, the result depends only on the heat or temperature of the component, and thus there is a problem that precise testing is impossible. In other words, the parts in the circuit board can be accurately determined whether or not the actual failure only by electrical inspection, but since it depends only on the heat or temperature, the parts placed in different test environments in reality, the heat or It is practically impossible to detect electrical errors by specifying the relationship between thermal and electrical properties of temperature.

In addition, heat or temperature may be influenced by other components, and if such an error is detected only by the heat or temperature, it is difficult to select an actual defective part from several components.

In addition, realistic problems, such as changes caused by errors in the software, arise, making analysis difficult.

Because of this problem, a method of detecting electrical errors on components in a circuit board using a moving measuring probe called a flying probe has been proposed.

The circuit board test system using the flying probe has an advantage of precisely performing electrical component inspection, but requires a relatively large amount of test time because it requires measuring a large number of components on the board with a few flying probes. There is also an increasing problem.

Accordingly, there is a need for the development of a technology capable of conducting a highly accurate electrical inspection of the components in the circuit board while saving test time and reducing the cost of the test components.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is possible to precisely inspect electrical parts by using an infrared camera to screen out defective parts and to perform electrical inspection by only a flying probe on these components. At the same time, an object of the present invention is to provide a circuit board test system and a circuit board test method using the same, which can significantly reduce the test time.

Another object of the present invention is to eliminate the need for a fixed jig for many test points by using a freely movable measuring probe called a flying probe, and to solve the problem of additional costs by using only a small jig system for signal application. The present invention provides a circuit board test system that can be eliminated and a circuit board test method using the same.

According to an embodiment of the present invention for achieving the above object, a camera unit for infrared imaging the measurement board to obtain a thermal image, a precision test unit for applying an electrical signal to the components in the measurement board and measuring the electrical output signal accordingly And a controller for detecting thermal and electrical defects of components in the measurement board based on the thermal image obtained by the camera unit and the electrical output signal measured by the precision test unit. The camera unit may include a camera position control motor configured to vertically move the infrared camera in a Z-axis direction; A camera position control module for outputting a motor driving signal for driving the camera position control motor according to the camera position control signal from the controller; And an infrared camera whose position is controlled according to the camera position control motor to infrared photograph the measurement board and transfer the obtained thermal image information to the controller, wherein the controller comprises a thermally defective component based on the thermal image information. A detection probe for outputting a control signal for detecting a state and allowing the precision test unit to move to the position of the thermal defective component, and the precision test unit comprises: a flying probe detecting whether the thermal defective component is electrically defective; A motion controller for moving the flying probe in an X-axis direction, a Y-axis direction, or a Z-axis direction according to the control signal; An electrical signal measuring unit provided in the flying probe and applying an electrical signal to the thermally defective component and acquiring an electrical output signal accordingly; And a flying interface for transmitting the obtained electrical output signal to the controller.

According to another embodiment of the present invention for achieving the above object, a system for testing a circuit board using an infrared camera and a flying probe assembly, comprising: a camera unit for obtaining a thermal image of the measurement board using the infrared camera; A controller which detects a thermal defective component among the components in the measurement board based on the thermal image, and outputs a control signal for moving the flying probe assembly to a position of the thermal defective component; And the flying probe assembly, moving to the position of the thermally defective component based on the control signal, applying an electrical signal to the thermally defective component, detecting an electrical output signal accordingly, and transmitting the electrical signal to the controller. Provided is a circuit board test system, characterized in that the control unit includes a precision test unit for detecting the electrical failure of the thermal failure parts.

The circuit board test system may further include an input / output unit configured to output the list of the thermal defective parts and the list of the electrical defective parts.

The controller may include a database storing a thermal normal range or an electrical normal range which is a reference for detecting a thermal defective component or an electrical defective component based on the thermal image or the electrical output signal.

According to another embodiment of the present invention for achieving the above object, to establish a thermal normal range database and an electrical normal range database as a reference for detecting thermal and electrical failure of the components included in the measurement board, A method of establishing a reference database of a circuit board test system, comprising: initializing the circuit board test system; A measurement board information input step of inputting information of the measurement board by creating a parts information database according to the type and position of the parts included in the measurement board; A test sequence table preparing step of creating a test sequence table database for inputting test sequence information of the measurement board; Learning board applying step of applying a learning board; Photographing the learning boards in infrared to obtain a thermal image; Setting a normal range of components in the learning board based on the obtained thermal image to construct a thermal normal range database of each component; Measuring electrical characteristics of components in the learning board using a flying probe; And establishing a normal range of components in the learning board based on the measured electrical characteristics to establish an electrical normal range database of each component. do.

According to yet another embodiment of the present invention for achieving the above object, a circuit board test method using a circuit board test system including a camera unit and a precision test for detecting thermal defective components and electrical defective components in the measurement board And initializing the circuit board test system; A barcode input step of reading a barcode of the measurement board; A measuring board applying step of applying the measuring board to be tested; A short circuit inspection step of performing a short circuit inspection of the power supply unit of the measurement board; A power applying step of applying power to the measuring board if the measuring board passes the power unit short-circuit test as a result of the test of the shorting test step; A thermal image acquiring step of acquiring a thermal image by photographing the measuring board to which power is applied in the power applying step with an infrared camera included in the camera unit; A part temperature calculation step of performing a part temperature calculation for each part of the measurement board from the thermal image information obtained in the thermal image acquisition step; A temperature inspection step of inspecting the temperature of each part in the measurement board based on the calculation result of the temperature calculation step of each part; If there is a thermal error part out of the thermal normal range on the measurement board from the test result of the temperature test step, the precision test part is moved to the location where the thermal error part is located, and an electrical signal is input to the thermal error part accordingly. A current / voltage measuring step of obtaining an electrical output signal; An electrical characteristic inspection step of examining electrical characteristics of the thermal error components based on the electrical output signal obtained in the current / voltage measurement step; An electrical error output step of outputting an electrical error component if there is an electrical error component out of an electrical normal range in the measurement board from a result of the electrical characteristic inspection step; And a repair step of repairing the electrical fault component.

The circuit board test method may further include outputting a power failure error message and outputting a power failure error message according to a preset maximum time delay of a predetermined voltage when the measurement board does not pass the power failure test. It may further include.

The temperature inspection step may be performed by comparing the calculation result of the temperature calculation step for each part with the data for the thermal normal range of the part.

The electrical characteristic checking step may be performed by comparing the electrical output signal for each component with data on an electrical normal range of the component.

According to another embodiment of the present invention for achieving the above object, a thermal inspection step of obtaining a thermal image of the measuring board using an infrared camera, and obtaining a list of thermal defective parts; An electrical inspection step of obtaining a list of electrical failure parts among the thermal failure parts by using a flying probe; And a repair step of repairing the electrically defective component.

The circuit board test method may further include, after the repairing step, a re-inspection step of finally obtaining a thermal image of the measurement board by using an infrared camera to determine whether there is a defect.

According to the present invention, since an infrared camera is used to screen out parts that are likely to be defective and perform electrical inspection by only the flying probes on these parts, precise electrical inspection is possible and the flying probe needs to inspect all the components. This reduces test time significantly.

In addition, the use of freely movable measuring probes, called flying probes, eliminates the need for fixed jigs for many test points and eliminates the additional cost incurred during board testing by requiring only a small jig system for signaling. The problem goes away.

Hereinafter, various embodiments of the present invention will be described in detail with reference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS It is a block diagram which shows the structure of the circuit board test system which concerns on one Embodiment of this invention.

As shown in FIG. 1, the circuit board test system of the present invention includes a rack unit 10, a control unit 30, a camera unit 40, an input / output unit 50, a relay unit 20, and a precision unit. It includes a test unit 70.

The rack unit 10 includes a digital multimeter (DMM) 11 and a power supply 12. The power supply 12 supplies power to an electric circuit board (hereinafter, referred to as a 'measurement board') to measure a defective quantity. The power supply 12 uses an uninterruptible power supply (UPS), and prevents the parts of the measuring board from being damaged by a power failure while testing the measuring board. On the other hand, when the power is supplied by the power supply 12, the measuring board is operated and the temperature rises. The digital multimeter 11 checks the connection state of the measuring board under test to determine whether the measuring board is short-circuited. That is, the digital multimeter 11 receives the measurement signal detected through the measuring probe from the measuring board mounted on the jig 21 through the relay set 22, and detects whether the measuring board is short-circuited from the measuring board. The result is transmitted to the operation processing unit 33 through the relay interface unit 32.

The jig 21 is fixed to the measuring board and placed in a predetermined place. The jig 21 moves to a predetermined position in accordance with a jig control signal received from the arithmetic processing unit 33 through the relay interface 32, the relay control unit 23, and the relay set 22 to fix the measurement board. The jig 21 also has a power supply probe, which is connected to transmit power from the power supply 12 to the power supply probe through the relay set 22, which is also connected to the power supply section of the measurement board. It can also be connected to the power supply to the measurement board.

The relay unit 20 includes a relay control unit 23 and a relay set 22. The relay set 22 is to be placed on a separate jig 21 for each measurement board, which is operated and controlled by a drive signal from the relay control unit 23, and the wiring is controlled on the relay set 22 so that The operation can be performed. The relay control unit 23 outputs the drive signal of the relay set 22 in accordance with the relay control signal from the control unit 30.

The relay set 22 is composed of a plurality of relays, and is largely divided into a power relay and a signal relay. The relay is a device that can't conduct and turn on according to ON / OFF. The power relay is to supply power to the measurement board, and the signal relay is to measure the signal where the measuring probe is in contact. . That is, when the power is supplied to the measuring board and the measuring board is operated, the signal is measured by the measuring probe from the measuring board in operation, and the measured signal is transmitted to the digital multimeter 11 through the relay set 22. do. In addition, the relay set 22 transmits the jig control signal received from the arithmetic processing unit 33 through the relay control unit 23 to the jig 21.

The relay control unit 23 receives a relay control signal from the operation processing unit 33 through the relay interface 32. The relay controller 23 may include a microprocessor to control the overall operation of the relay set 22.

The camera unit 40 photographs the measuring board having the temperature increased during operation by using the infrared camera 41 and outputs the heat distribution of the measuring board as an image signal to the controller 30. The camera unit 40 includes an infrared camera 41, a camera position control module 42, and a camera position control motor 43.

The infrared camera 41 may move up and down along the Z-axis direction by the camera position control motor 43 to capture a thermal image of the measuring board. The thermal image captured by the infrared camera 41 is transmitted to the external device control unit 31 of the control unit 30.

The camera position control module 42 receives the camera position control signal from the controller 30, and accordingly outputs a motor driving signal of the camera position control motor 43.

The camera position control motor 43 is a motor for moving the infrared camera 41 up and down in the Z-axis direction, and drives the motor according to the motor drive signal received from the camera position control module 42. When the camera position control motor 43 is driven, the infrared camera 41 moves up and down accordingly, thereby controlling the height of the infrared camera 41 and the focus of the lens in accordance with each measurement board. On the other hand, the camera unit 40 may include a temperature sensor for thermal imaging of the measurement board.

The controller 30 calculates the temperature change of each component mounted on the measurement board by processing the thermal image signal received from the camera unit 40 to determine thermal defects and reliability of the component, and indicates that there is a defect. By moving the flying probe to the position of the determined component to perform an electrical test, a precision test is possible, and the measured result is output to an output means such as a printer 51 in the input / output unit 50.

The controller 30 may include an external device controller 31, a relay interface 32, an operation processor 33, a camera interface 34, a printer interface 35, and a barcode reader interface 36.

The external device controller 31 converts the image signal received from the infrared camera 41 into a digital signal and transmits the digital signal to the calculation processor 33. In addition, although not shown, the external device controller 31 may interact with the digital multimeter 11 to read a voltage, a current, and the like from the power supply 12 and transmit the readout to the operation processor 33.

The calculation processing unit 33 reads information on each component type and position of the measurement board from the database D / B 37 and calculates an image signal received from the camera unit 40 via the external device control unit 31. The temperature change of each component mounted on the measuring board is measured to determine thermal defects and reliability of the component. According to this determination, a list of thermally defective parts can be obtained. The result of the thermal failure status determined using the infrared camera 41 may be output through an output means such as a printer 51 or a thermal printer included in the input / output unit 50.

On the other hand, the calculation processing unit 33 outputs a flying probe assembly 75 control signal to the flying interface 71 to enable the flying probe to move to the place where the parts included in the thermal failure list are located. do. According to the control signal, the flying probe assembly 75 of the precision test unit 70 moves to the place where the defective component is located, and the electrical signal measuring unit 77 inputs an electrical signal to the component. Accordingly, the electrical output signal (suppression, current, etc.) is output to the operation control unit 33 through the flying interface 71. The operation control unit 33 determines the electrical error of the part based on the electrical output signal. The result of measuring the error or the defective state of the component may be output through various output means of the input / output unit 50.

In addition, the operation processor 33 transmits the position control signal of the infrared camera 41 to the camera position control module 42 through the camera interface 34, and the digital multimeter 11, through the relay interface 32. Each control signal is transmitted to the power supply 12 and the relay controller 23, and the control signal of the flying probe assembly 75 is transmitted to the flying interface 71.

The database 37 may include a board drawing file database, a parts information database, a test sequence table database, and a normal range database.

The board drawing file database is a database of drawing files of each measurement board. The parts information database is a database of the types of parts according to each position in the drawing of the measurement board. That is, in order to input the information of the measurement board fixed by the jig 21, graphic or image conversion information is set from the board drawing file database, and the component type and position, which are position information, are created as a CAD file in the parts information database. . The parts information database stores a time-based thermal image as an image of a region, a type, and a thermal normal range for each component.

The test sequence table database is a database in which the test sequence information of the measurement board is stored. The test sequence table database lists time, relay number, relay information, relay status, current limit, measurement items, minimum value, maximum value and operation status by time.

The normal range database stores the passion range for determining the thermal failure status of the component and the electrical normal range for determining the electrical failure status. The acquisition of the passion image range can be achieved by obtaining a thermal image using a normal board and then obtaining the normal temperature data range of the part. The acquisition of the electrical normal range can be performed using a data book provided by the manufacturer of each part or using a flying probe. This can be done by electrically measuring each part of the top board.

The precision test unit 70 is configured to electrically inspect a component determined as a thermal defect in the calculation processing unit 33 based on the thermal image of the measurement board acquired by the infrared camera 41 of the camera unit 40. Element.

The precision test unit 70 includes a flying interface 71, a motion controller 73, a probe assembly 75, and an electric signal measuring unit 77.

The flying interface 71 transmits the flying probe assembly 75 control signal from the operation processor 33 to the motion controller 73. The arithmetic processing unit 33 detects a component that is in a thermally defective state based on the thermal image obtained by the infrared camera 41 of the camera unit 40, and the flying probe assembly 75 is used for electrical inspection. The control signal is transmitted to the flying interface 71 to move to the position of the component.

The motion control unit 73 moves the flying probe assembly 75 to the position of the component in the thermal failure state. The probe assembly 75 may be connected to a robot arm or the like through a motor, and the motion controller 73 may move the probe assembly 75 in the X-axis direction, the Y-axis direction, or the Z-axis according to a control signal from the operation processor 33. Direction to the position of the component to be electrically inspected.

The probe assembly 75 is equipped with an electrical signal measuring unit 77 for electrically precision testing the component. When the probe assembly 75 moves to the position of the component to be tested, the electrical signal measuring unit 77 inputs an electrical signal to the component, acquires an electrical response thereto, that is, an output signal (voltage, current, etc.) The processor 71 transmits the data to the computation processing unit 33 through 71. The arithmetic processing unit 33 detects an electrical error of the corresponding component by comparing the electrical normal range data stored in the database 37 based on the electrical output signal.

The input / output unit 50 includes an output means such as a printer 51 and a barcode reader 52. The printer 51 outputs a test result of the measurement board received from the calculation processing unit 33 through the printer interface 35. The barcode reader 52 reads the barcodes of the measurement boards and transmits the barcodes to the microcomputer operation processor 33 through the barcode reader interface 36.

2 is a flowchart illustrating a process of constructing a database for circuit testing of the circuit board test system of the present invention.

First, the relay set 22, the infrared camera 41, the flying probe assembly 75, and the probe electrical signal measuring unit 77 are initialized (S100). That is, when the operator issues a test start command through the start and stop switches, the calculation processing unit 33 of the control unit 30 transmits and initializes the initial set value of the relay control signal to the relay control unit 23 through the relay interface 32. The initial position of the camera position control signal is initialized by the camera position control module 42 through the camera interface 34, and the probe assembly 75 and the electric signal measuring unit 77 are initialized through the flying interface 71. Let's do it. Accordingly, the components can be initialized.

Next, a part information database is created according to the part type and location from the board drawing file database of the measurement board and the board information of the measurement board is input (S120). That is, in order to input the measurement board information fixed to the jig 21, graphic or image conversion information is set from the board drawing file database, and the component type and position, which are position information, are created in the parts information database as a CAD file.

After that, a test sequence table database is created to input test sequence information of the measurement board (S140). The test sequence table database is arbitrarily set by the operator for the test sequence over time.

Next, the learning board is applied (S160). In order to detect the normal range of temperature for each part by time, about 20 learning boards which have been tested and confirmed to be normal boards are applied.

After checking the applied learning boards, the thermal image information is acquired by the operation processor 33 of the controller 30 (S180). Thereafter, the normal ranges of the parts measured by the digital multimeter 11 are set from the information obtained by the operation processor 33 to build a thermal normal range database of each part (S200). At this time, the temperature normal range setting for each part may be displayed as a teaching screen using the passion phase range databases of each part.

Thereafter, it is determined whether there is a library for electrical characteristics of components included in the learning boards (S210).

If there is an electrical characteristic library, the library data is installed (S220) to build an electrical normal range database.

On the other hand, if there is no electrical characteristic library, the calculation processing unit 33 transmits the flying probe assembly 75 control signal through the flying interface 71, the flying probe assembly 75 moves to the position of each component to measure the electrical signal After obtaining the electrical input and output characteristics of the corresponding part through the unit 77 is transmitted to the calculation processing unit 33, the calculation processing unit 33 measures the electrical characteristics of the component based on this (S230).

Thereafter, the electrical normal range of the component is set from the information on the electrical characteristics of the component acquired by the operation processor 33 to build an electrical normal range database of each component (S240). In this case, the electrical normal range database may be displayed through a setup screen.

3 is a flowchart illustrating the operation of the circuit board test system of the present invention.

First, the circuit board test system is initialized (S300). That is, when a new jig 21 is designed, various kinds of information for testing with a circuit board test system are set up. The infrared camera 41, the probe assembly 75, and the electric signal measuring unit 77 are initialized.

After that, the barcode of the measurement board is input (S320). The barcode reader 52 transmits the barcode of the measurement board to the calculation processor 33 through the barcode reader interface 36. The calculation processing unit 33 reads out the ID of the measurement board from the input bar code.

Next, the measuring board to be tested is applied on the jig 21 and the start switch is pressed (S340). At this time, the jig 21 may be locked and the measurement board may be fixed. From the information on the measurement board, the location of the guide hole and the parts information, each part location, size, type and details are checked.

Thereafter, a short circuit test of the power supply unit of the measuring board applied to the jig 21 is performed (S360). That is, when the measuring board is mounted on the jig and the start switch is pressed, the door is closed and the short circuit test of the power supply, ie, the power supply discharge, the power supply resistance measurement, and the measured value are measured within the normal range based on the test sequence table database. Here, the test sequence table database is a table listing time, relay number, relay information, relay state, current limit, measurement item, minimum value, maximum value and operation state by time.

If the measurement board does not pass the power supply short-circuit test, it outputs a power supply failure to an output means such as a printer 51 according to the maximum application time delay setting of the preset voltage (S370). The power failure message may include information about the location of the power failure on the measurement board.

On the other hand, if the measurement board passes the power supply short circuit test, power is applied to the measurement board (S380). That is, power is applied from the power supply 12 to the measuring board mounted on the jig 21 through the relay set 22. Which power supply is applied and when is stored in the test sequence table database, and power is supplied to each measurement board according to the data for each measurement board stored in the test sequence table database.

Thereafter, a thermal image of the measurement board is obtained through the infrared camera 41 (S400). That is, when power is applied to the measurement board and the measurement board is driven, the temperature of the measurement board is increased. The infrared camera 41 thermally photographs the measurement board and heats it to the operation processor 33 through the external device controller 31. Send video information.

The calculation processing unit 33 performs temperature calculation for each part using data stored in the parts information database (S420). That is, the calculation processing unit 33 calculates the temperature of each part of the measurement board using the parts information database based on the thermal image information received from the infrared camera 41 through the external device controller 31.

On the other hand, using the passion range database to perform a temperature test for each part (S440). That is, when the temperature of each component of the measurement board is calculated, the calculation processing unit 33 determines whether each component included in the measurement board is within the passion phase range by using the thermal normal range database. Accordingly, it is possible to determine whether any of the components included in the measurement board are outside the thermal normal range (S460).

If there are no parts out of the thermal normal range on the measuring board, then there is no defective part, so the circuit test is terminated.

On the other hand, if there is a part out of the thermal normal range on the measuring board, because there is a part that may be defective, using the flying probe assembly 75 and the electrical signal measuring unit 77 of the precision test unit 70 The temperature error component outside the thermal normal range starts to be electrically tested (S470).

First, the probe assembly 75 moves to the place where the temperature error components are located by the flying probe assembly control signal through the flying interface 71 from the operation processor 33, and the electrical signal measuring unit 77 moves to the corresponding component. An electrical signal (current, voltage, etc.) is input to the electrical output signal according to the measurement (S480), and is transmitted to the operation processor 33 through the flying interface 71.

The operation processor 33 checks the electrical characteristics of the corresponding component based on the measured electrical signals, that is, the current and voltage signals (S490). In this case, the electrical characteristics may be determined by comparing with the data of the electric normal range database.

The calculation processing unit 33 determines whether there are any parts out of the electric normal range among the temperature error parts through the inspection (S500).

If no parts fall outside the normal range, the test is terminated because there are no defective parts.

On the other hand, if there is a part outside the electrical normal range, using the output means such as the printer 51 outputs that the corresponding part is an electrical characteristic error (S520), it is determined whether the error component is repairable (S540).

If repair is not possible, the test is terminated, and if repair is possible, after repairing the corresponding part (S560), the application of the circuit board again (S340) may be carried out a retest.

By doing this, it is possible to detect accurate electrical defective parts by performing an electrical inspection on only those parts that are likely to be thermally defective among the components included in the measurement board.

In addition, the use of freely movable measuring probes, called flying probes, eliminates the need for fixed jigs for many test points and eliminates the additional cost incurred during board testing by requiring only a small jig system for signaling. The problem goes away.

On the other hand, the infrared camera is used to screen out parts that may be defective and perform electrical inspection by the flying probe only on these parts, thereby eliminating the need for the flying probe to inspect all parts, thereby significantly reducing test time. It works.

The present invention has been described above in connection with specific embodiments of the present invention, but this is only an example and the present invention is not limited thereto. Those skilled in the art can change or modify the described embodiments without departing from the scope of the present invention, and such changes or modifications also fall within the scope of the present invention. In addition, each component described in the present specification can be easily selected and replaced from various known components by those skilled in the art. Those skilled in the art can also omit some of the components described herein without adding performance degradation or add components to improve performance. Therefore, the scope of the present invention should be determined not by the embodiments described, but by the claims and their equivalents.

BRIEF DESCRIPTION OF THE DRAWINGS It is a block diagram which shows the structure of the circuit board test system which concerns on one Embodiment of this invention.

2 is a flowchart illustrating a process of constructing a database for circuit testing of the circuit board test system of the present invention.

3 is a flowchart illustrating the operation of the circuit board test system of the present invention.

<Description of the symbols for the main parts of the drawings>

10: rack portion 11: digital multimeter (DMM)

12: power supply device 20: relay unit

21: Jig 22: Relay Set

23: relay control unit 30: control unit

31: external device control unit 32: relay interface

33: arithmetic processing unit 34: camera interface

35: printer interface 36: barcode reader interface

37: database 40: camera unit

41: infrared camera 42: camera position control module

43: camera position control motor 50: input and output unit

51: printer 52: barcode reader

70: precision test section 71: flying interface

73: motion control unit 75: probe assembly

77: electric signal measuring unit

Claims (11)

Camera unit for acquiring a thermal image by infrared imaging of the measurement board, a precision test unit for applying an electrical signal to the components in the measurement board and measuring the electrical output signal according to, and the thermal image and the precision test unit obtained by the camera unit A circuit board test system including a control unit for detecting a thermal failure and an electrical failure for a component in the measurement board based on an electrical output signal measured by The camera unit, A camera position control motor for vertically moving the infrared camera in the Z-axis direction; A camera position control module for outputting a motor driving signal for driving the camera position control motor according to the camera position control signal from the controller; And A position is controlled according to the camera position control motor, and includes an infrared camera for taking an infrared image of the measurement board and transferring the obtained thermal image information to the controller. The controller detects a thermally defective component based on the thermal image information, and outputs a control signal to allow the precision test unit to move to the position of the thermally defective component. The precision test unit, A flying probe which detects whether the thermal defective component is electrically defective; A motion controller for moving the flying probe in an X-axis direction, a Y-axis direction, or a Z-axis direction according to the control signal; An electrical signal measuring unit provided in the flying probe and applying an electrical signal to the thermally defective component and acquiring an electrical output signal accordingly; And And a flying interface for transmitting the obtained electrical output signal to the control unit. A system for testing a circuit board using an infrared camera and a flying probe assembly. A camera unit for acquiring a thermal image of a measurement board using the infrared camera; A controller which detects a thermal defective component among the components in the measurement board based on the thermal image, and outputs a control signal for moving the flying probe assembly to a position of the thermal defective component; And The control unit includes the flying probe assembly, moves to the position of the thermally defective component based on the control signal, applies an electrical signal to the thermally defective component, detects an electrical output signal accordingly, and transmits it to the controller. And a precision test unit configured to detect an electrical defective component among the thermal defective components. The method according to claim 1 or 2, And an input / output unit configured to output the list of the thermally defective parts and the list of the electrically defective parts. The method of claim 1 or 2, wherein the control unit, And a database storing a thermal normal range or an electrical normal range as a reference for detecting a thermal defective component or an electrical defective component based on the thermal image or the electrical output signal. A method of constructing a reference database of a circuit board test system for constructing a thermal normal range and an electrical normal range database as a reference for detecting thermal and electrical defects of components included in a measurement board. Initializing the circuit board test system; A measurement board information input step of inputting information of the measurement board by creating a parts information database according to the type and position of the parts included in the measurement board; A test sequence table preparing step of creating a test sequence table database for inputting test sequence information of the measurement board; Learning board applying step of applying a learning board; Photographing the learning boards in infrared to obtain a thermal image; Setting a normal range of components in the learning board based on the obtained thermal image to construct a thermal normal range database of each component; Measuring electrical characteristics of components in the learning board using a flying probe; And setting a normal range of the components in the learning board based on the measured electrical characteristics to establish an electrical normal range database of each component. A circuit board test method using a circuit board test system including a camera unit and a precision test for detecting thermal defective parts and electrical defective parts in a measuring board, Initializing the circuit board test system; A barcode input step of reading a barcode of the measurement board; A measuring board applying step of applying the measuring board to be tested; A short circuit inspection step of performing a short circuit inspection of the power supply unit of the measurement board; A power applying step of applying power to the measuring board if the measuring board passes the power unit short-circuit test as a result of the test of the shorting test step; A thermal image acquiring step of acquiring a thermal image by photographing the measuring board to which power is applied in the power applying step with an infrared camera included in the camera unit; A part temperature calculation step of performing a part temperature calculation for each part of the measurement board from the thermal image information obtained in the thermal image acquisition step; A temperature inspection step of inspecting the temperature of each part in the measurement board based on the calculation result of the temperature calculation step of each part; If there is a thermal error part out of the thermal normal range on the measurement board from the test result of the temperature test step, the precision test part is moved to the location where the thermal error part is located, and an electrical signal is input to the thermal error part accordingly. A current / voltage measuring step of obtaining an electrical output signal; An electrical characteristic inspection step of examining electrical characteristics of the thermal error components based on the electrical output signal obtained in the current / voltage measurement step; An electrical error output step of outputting an electrical error component if there is an electrical error component out of an electrical normal range in the measurement board from a result of the electrical characteristic inspection step; And A repair step of repairing the electrical fault component. The method of claim 6, And a power failure error output step of outputting and terminating a power failure error message according to a preset maximum time delay setting of a predetermined voltage if the measurement board does not pass the power failure test. Circuit board test method. The method of claim 6, The temperature inspection step, characterized in that performed by comparing the calculation result of the temperature calculation step for each part with the data for the thermal normal range of the part, the circuit board test method. The method of claim 6, The electrical property checking step, characterized in that performed by comparing the electrical output signal for each component with the data for the electrical normal range of the component. A thermal inspection step of acquiring a thermal image of the measurement board using an infrared camera and obtaining a list of thermal defective parts; An electrical inspection step of obtaining a list of electrical failure parts among the thermal failure parts by using a flying probe; And And repairing the defective electrical part. The method of claim 10, After the repairing step, the circuit board test method, characterized in that further comprising a re-check step of finally determining whether or not to obtain a thermal image of the measuring board using an infrared camera.

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