CN114441942B - Flying probe testing method, system and equipment for PCB and storage medium - Google Patents

Flying probe testing method, system and equipment for PCB and storage medium Download PDF

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Publication number
CN114441942B
CN114441942B CN202210106009.5A CN202210106009A CN114441942B CN 114441942 B CN114441942 B CN 114441942B CN 202210106009 A CN202210106009 A CN 202210106009A CN 114441942 B CN114441942 B CN 114441942B
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pcb
test
coordinate system
probe
flying
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CN114441942A (en
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朱春雷
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Suzhou Grani Vision Technology Co ltd
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Suzhou Grani Vision Technology Co ltd
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

The invention discloses a flying probe testing method, a system, equipment and a storage medium of a PCB, wherein the testing method comprises the following steps: positioning the mechanical coordinates of Mark points of the PCB in the visual detection module; establishing a mapping relation between a PCB coordinate system and a probe mechanism coordinate system; judging whether the PCB carrier needs to rotate, if so, rotating to a preset angle, and reestablishing a mapping relation between a PCB coordinate system and a probe mechanism coordinate system; indexing the test point positions of the needle down, acquiring the positions of the test points in a PCB coordinate system and the pair information of the test points, and screening the test point positions of the needle down; converting the mechanical coordinates of the test point pairs in the PCB coordinate system into mechanical coordinates in the probe mechanism coordinate system; and moving the probe mechanism to the mechanical coordinates of the test point pair for needle-down test. According to the flying probe testing method of the PCB, the testing flow can be flexibly configured, the flying probe test can be automatically performed according to the configuration, and the testing efficiency and the testing effect are improved.

Description

Flying probe testing method, system and equipment for PCB and storage medium
Technical Field
The present invention relates to the field of PCB testing, and in particular, to a method, system, device and storage medium for testing a flying probe of a PCB.
Background
At present, the PCB is gradually developed towards light and thin, the circuit structure thereof becomes more and more complex, and the requirement on reliability is also higher and higher. In general, after the PCB is printed, a circuit of the PCB needs to be tested using a probe, for example, whether an abnormal open circuit, a short circuit, etc. exists in the circuit of the PCB. The prior art typically uses a flying probe test method to test the open circuit point of a PCB. When the pad size and the solder joint distance of the PCB are smaller, the flying probe testing method in the prior art cannot guarantee the testing accuracy, so that a plurality of false open-circuit points easily appear during testing, and the test is often needed to be carried out again. However, the reason why the flying probe test method in the prior art tests a false open point is often because the probe is offset from the test point, so the flying probe test method in the prior art cannot guarantee the accuracy of the secondary test. In the prior art, when the service life of the probe reaches the service life or accidental needle breakage occurs, after the probe is replaced, manual re-needle correction and position compensation adjustment are needed, time and labor are consumed, unnecessary workload of operators is increased due to repeated input operation, and meanwhile, the quality requirements on the operators are high.
The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person of ordinary skill in the art.
Disclosure of Invention
The invention aims to provide a flying probe testing method for a PCB, which can automatically lower a probe and improve the testing accuracy.
In order to achieve the above object, an embodiment of the present invention provides a flying probe testing method for a PCB board, the method including: positioning the mechanical coordinates of Mark points of the PCB in the visual detection module; establishing a mapping relation between a PCB coordinate system and a probe mechanism coordinate system; judging whether the PCB carrier needs to be rotated, if so, rotating the PCB carrier to a preset angle, and reestablishing the mapping relation between the rotated PCB coordinate system and the probe mechanism coordinate system; indexing the point position information needing to be needled in a PCB database, acquiring the position and the point position pair information of the test point in a rotated PCB coordinate system, and screening the test point position needing to be needled; converting the mechanical coordinates of the test point pairs in the PCB coordinate system into mechanical coordinates in the probe mechanism coordinate system; and moving the probe mechanism to the mechanical coordinates of the corresponding test point position pair for automatic needle-down test.
In one or more embodiments of the present invention, rotating the PCB carrier to a predetermined angle, reestablishing a mapping relationship between the PCB coordinate system and the probe mechanism coordinate system, includes: acquiring the rotation center of the PCB carrier according to the mechanical coordinates of the Mark point before rotation and the mechanical coordinates of the Mark point after rotation; acquiring the position of the rotated PCB carrier according to the rotation center, the position of the PCB carrier before rotation and a preset angle; and according to the mechanical coordinates of the Mark point before rotation in the coordinate system of the visual detection module, the visual detection module is moved to re-shoot the Mark point after rotation to obtain an image of the Mark point, and the mechanical coordinates of the Mark point in the coordinate system of the probe mechanism are repositioned to establish a new mapping relation between the coordinate system of the PCB and the coordinate system of the probe mechanism.
In one or more embodiments of the present invention, acquiring the center of rotation of the PCB carrier includes: step a1, acquiring mechanical coordinates (x) of a first MARK point of the test PCB on the carrier before rotation by shooting of the visual detection module 1 ,y 1 ) And the mechanical coordinates (x 2 ,y 2 ) The method comprises the steps of carrying out a first treatment on the surface of the Step a2, after the carrier is rotated, the mechanical coordinates (x) of the first MARK point of the test PCB on the carrier are obtained again by shooting with the visual detection module 1 ',y 1 ') and the mechanical coordinates (x) of the second MARK point 2 ',y 2 ' s); and step a3, calculating and obtaining the mechanical coordinate (x) of the rotation center according to the relative position relation between the rotation center and the first and second MARK points r ,y r )。
In one or more embodiments of the present invention, in the steps a1 and a2, the visual detection module is moved to above the first MARK point and the second MARK point to capture, so as to obtain the image coordinates corresponding to the first MARK point and the second MARK point, and the mechanical coordinates of the first MARK point and the second MARK point are obtained through the conversion of the image coordinates to the mechanical coordinate mapping matrix.
In one or more embodiments of the invention, the mechanical coordinates (x r ,y r ) The calculation formula of (2) is as follows:
the mechanical coordinates (x) of the rotation center are reversely calculated according to the above formula r ,y r )。
In one or more embodiments of the present invention, indexing the point location information requiring needle insertion from a PCB database, acquiring the position of a test point in a rotated PCB coordinate system and the point location pair information, and screening the test point location requiring needle insertion, including: according to the PCB type, the index of the test point pair, the front and back sides and the probe type information, indexing the point information needing to be needled down from a PCB database, and reading the position of the test point pair in a PCB coordinate system and the test point pair information from a test file; and screening the point positions needing needle dropping according to the model, the carrier type, the PCB type, the probe index, the component index and/or the PIN angle index from the test file.
In one or more embodiments of the present invention, the flying probe testing method further comprises: turning over the PCB to the corresponding test surface, and acquiring the mechanical coordinates of Mark points of the PCB of the corresponding test surface in a visual detection module coordinate system in a test file; moving the visual detection module to the mechanical coordinates to identify the image coordinates of Mark points, and establishing a corresponding PCB coordinate system of the test surface through the mechanical coordinates of the Mark points of the PCB of the corresponding test surface in the test file; and establishing a mapping relation between the PCB coordinate system of the corresponding test surface and the coordinate system of the visual detection module by combining the PCB coordinate system of the corresponding test surface with the image coordinates of the Mark points identified by the visual detection module, and establishing a mapping relation between the PCB coordinate system of the corresponding test surface and the coordinate system of the probe mechanism.
In one or more embodiments of the present invention, the probe mechanism includes a first flying probe testing module and a second flying probe testing module, and the flying probe testing method further includes: judging whether interference exists between the first flying probe testing module and the second flying probe testing module; if interference exists, the needle-down position of the first flying needle testing module is exchanged with the needle-down position of the second flying needle testing module, and the needle-down position of the first flying needle testing module and the needle-down position of the second flying needle testing module are recalculated.
According to one or more embodiments of the present invention, the probe mechanism includes a first and a second flying probe testing module, and the flying probe testing method further includes: judging whether the first flying probe testing module and the second flying probe testing module need to rotate or not; and if the first flying probe testing module and the second flying probe testing module need to rotate, rotating the first flying probe testing module and the second flying probe testing module by a specific angle.
In one or more embodiments of the present invention, the determining whether the first and second flying probe test modules need to be rotated includes: judging whether the distance between the test point pairs in the set direction is smaller than a set threshold value, and if so, rotating the first flying probe test module and the second flying probe test module.
In one or more embodiments of the present invention, the flying probe testing method further includes: if the needle-down test fails, the mobile vision detection module shoots the test point positions, and secondary positioning is carried out on the test point positions through Blob analysis, so that the needle-down positions are obtained again.
The invention provides a flying probe testing system of a PCB, which comprises a PCB position adjusting module, a first flying probe testing module, a second flying probe testing module, a first visual detection module, a second visual detection module and a third visual detection module.
The PCB board position adjustment module is used for PCB board material loading and transportation PCB board to test position to can rotatory PCB board to specific angle. The first flying probe testing module is used for controlling the first flying probe to be connected into the testing loop. The second flying probe testing module is used for controlling the second flying probe to be connected into the testing loop. The first vision detection module is used for shooting MARK points and pins of components on the PCB, positioning the MARK points and the pins of the components, and guiding the first flying probe test module to a specified test position for needle-down test. The second visual detection module is used for shooting a carrier plate two-dimensional code, a PCB two-dimensional code, MARK points and pins of components on the PCB, positioning the MARK points and the pins of the components, and guiding the second flying probe test module to a specified test position for needle-setting test. The third vision detection module is used for shooting a probe image, positioning the position of the probe in a mechanical coordinate system, calibrating the positions of the first vision module and the second vision module through the third vision module, and mapping the positions of the first flying needle and the second flying needle to the actual mechanical positions in the first flying needle testing module and the second flying needle testing module respectively for follow-up accurate needle setting.
The flying probe testing system of the PCB further comprises a testing point position acquisition module, a probe calibrating platform module, a first flying probe control module and a second flying probe control module. The test point position acquisition module is used for acquiring test information of the test point positions from the PCB test file. The needle calibrating platform module is used for calibrating the Z-direction positions of the first flying needle testing module and the second flying needle testing module, so that the probe can accurately descend the needle to the pin position of the PCB component in the Z direction. The first flying needle control module is used for controlling the needle falling height, the needle falling XY position and the needle falling rotation angle of the first flying needle. The second flying needle control module is used for controlling the needle falling height, the needle falling XY position and the needle falling rotation angle of the second flying needle.
The invention also discloses flying probe testing equipment of the PCB, which comprises: bear mechanism, probe mechanism, first visual inspection mechanism, second visual inspection mechanism, third visual inspection mechanism, school needle mechanism and module control mechanism, bear the weight of the transportation of mechanism for the PCB board, horizontal rotation and upset. The probe mechanism is provided with a plurality of probes and is used for carrying out needle-down test on the test points on the PCB. The first visual detection mechanism and the second visual detection mechanism are used for acquiring Mark points and pin and probe images of the testing device from the PCB. The third visual inspection mechanism is used for calibrating the probe in the x-y axis direction and the z axis direction. The needle calibrating mechanism is used for calibrating and compensating the needle-falling position of the probe. The module control mechanism is used for controlling the bearing mechanism, the probe mechanism, the first visual detection mechanism, the second visual detection mechanism, the third visual detection mechanism and the needle correction mechanism to work.
The invention also discloses a computer readable storage medium, wherein the computer readable storage medium stores computer instructions, and the computer instructions are suitable for being loaded by a processor so as to realize the flying probe testing method.
Compared with the prior art, the flying probe testing method of the PCB can accurately acquire the mechanical coordinates of the rotated test point again when the PCB needs to be rotated, and achieves an accurate probe setting function; the test effect is improved.
According to the flying probe testing method of the PCB, after the probe is replaced, the probe is controlled to move to the position above the third visual detection module directly through an automatic flow without manually re-calibrating the probe, photographing is carried out, and the position of the probe is positioned, so that the automatic calibration of a new probe can be realized.
According to the flying probe testing method and the testing system of the PCB, point position information needing to be needled can be indexed from the PCB database, the position of the testing point position in the rotated PCB coordinate system and the point position pair information can be obtained, and the testing point position needing to be needled can be screened. The needle-down command is appointed through the upper computer command interaction control system software, photographing of test points is not needed each time, and the needle-down is automatically and conveniently performed according to the PCB coordinate point file. The test flow can be flexibly configured, the flying probe test can be automatically performed according to the configuration, and the test efficiency and the test effect are improved.
Drawings
Fig. 1 is a system flow diagram of a flying probe testing method of a PCB board according to an embodiment of the present invention;
fig. 2 is a flowchart of a flying probe testing method of a PCB board according to an embodiment of the present invention;
FIG. 3 is a system block diagram of a flying probe testing system for a PCB board according to one embodiment of the invention;
fig. 4 is a system block diagram of a flying probe testing device for a PCB board according to an embodiment of the present invention.
Fig. 5 is a model diagram for determining a rotation center according to an embodiment of the present invention.
Detailed Description
The following detailed description of embodiments of the invention is, therefore, to be taken in conjunction with the accompanying drawings, and it is to be understood that the scope of the invention is not limited to the specific embodiments.
Throughout the specification and claims, unless explicitly stated otherwise, the term "comprise" or variations thereof such as "comprises" or "comprising", etc. will be understood to include the stated element or component without excluding other elements or components.
Example 1
As shown in fig. 1 and fig. 2, a flying probe testing method of a PCB board includes the following steps.
In step S1, the mechanical coordinates of Mark points of the PCB board in the visual inspection module are located.
And acquiring a test file corresponding to the PCB, acquiring the mechanical coordinates of Mark points of the PCB in a coordinate system of the visual detection module in the test file, moving the visual detection module to the mechanical coordinates to identify the image coordinates of the Mark points, and positioning the mechanical coordinates of the Mark points.
In this embodiment, the visual inspection module is driven to move by the linear module and the x-y-z axis driving module. The visual detection module moves to the two-dimensional code of the carrier and the two-dimensional code of the PCB to shoot and identify the two-dimensional code of the carrier and the two-dimensional code of the PCB, so that the carrier type and the PCB type are obtained. In this embodiment, the type information of the carrier and the PCB is recorded in the two-dimensional code, so that the type of the carrier and the PCB can be obtained by photographing and identifying the two-dimensional code.
In an embodiment, two visual detection modules, namely a first visual detection module and a second visual detection module, may be provided, and a third visual detection module is further provided. The method comprises the steps of identifying a two-dimensional code of a carrier and a two-dimensional code of a PCB by adopting a second vision module, acquiring a test file corresponding to the PCB from a PCB test database, and acquiring mechanical coordinates of Mark points of the PCB in a vision detection module coordinate system in the test file. In the system of the flying probe tester, test files of various types of PCBs are usually stored in advance, corresponding test files can be searched in the system of the flying probe tester according to the type of the PCB to be tested, and the mechanical coordinates of Mark points on the PCB in a visual detection module coordinate system can be obtained according to the test files.
In one embodiment, the mechanical coordinates of Mark points of the PCB in the visual detection module include coarse positioning and precise positioning. The rough positioning comprises the steps of firstly adopting a template matching mode to find the approximate position of the Mark point, specifically, moving the first visual detection module and the second visual detection module to the shooting position corresponding to the mechanical coordinates of the Mark point, and shooting the Mark point to obtain the image of the Mark point.
The accurate positioning comprises the steps of processing the position area image, accurately positioning the Mark point position, acquiring the image coordinates of the Mark point according to the image of the Mark point, and automatically identifying the mechanical coordinates of the Mark point in the corresponding first visual detection module and second visual detection module according to the mapping relation between the image coordinate system of the Mark point and the visual detection module coordinate system, so as to position the Mark point coordinates. The Mark point shape can be selected according to actual needs, for example, square, round, cross and the like.
Before step S1, the product needs to be powered on; the power is turned on, the PCB is automatically electrified, the USB is automatically plugged in and plugged out, lighting is electrified, the USB is automatically communicated, and all the instruments are connected. And (5) preparing test.
Before step S1, the first visual inspection module coordinate system, the second visual inspection module coordinate system, the third visual inspection module coordinate system, the first flying probe testing module and the second flying probe testing module coordinate system are also required to be established.
S2, establishing a mapping relation between the PCB coordinate system and the probe mechanism coordinate system. In this embodiment, the probe mechanism includes a first flying probe testing module and a second flying probe testing module.
And establishing a PCB coordinate system through the mechanical coordinates of the Mark points in the test file, establishing a mapping relation between the PCB coordinate system and the visual detection module coordinate system through the combination of the PCB coordinate system and the image coordinates of the Mark points identified by the visual detection module, and establishing a mapping relation between the PCB coordinate system and the probe mechanism coordinate system.
Before the mapping relation between the PCB coordinate system and the probe mechanism coordinate system is established, the calibration work of the whole system is required to be completed, and the method specifically comprises the following steps: and establishing mapping relations among the first visual detection module coordinate system, the third visual detection module coordinate system, the second visual detection module coordinate system, the third visual detection module coordinate system, the first visual detection module coordinate system, the second visual detection module coordinate system, the first flying probe test module coordinate system, the second visual detection module coordinate system, the second flying probe test module coordinate system and the third visual detection module coordinate system. After the calibration of the whole system is completed, the mapping relation between the PCB coordinate system and the first visual detection module coordinate system and the second visual detection module coordinate system and the mapping relation between the PCB coordinate system and the first flying probe test module coordinate system and the second flying probe test module coordinate system are established.
S3, judging whether the PCB carrier needs to rotate, if so, rotating the PCB carrier to a preset angle, and reestablishing the mapping relation between the rotated PCB coordinate system and the probe mechanism coordinate system.
Specifically, the rotation center of the PCB carrier is obtained according to the mechanical coordinates of the Mark point before rotation and the mechanical coordinates of the Mark point after rotation. And selecting a plurality of Mark points, and calculating to obtain the rotation center of the PCB carrier according to the mechanical coordinates of the Mark points before and after rotation. In this embodiment, two Mark points are selected to calculate the rotation center of the PCB carrier.
And acquiring the position of the PCB carrier after rotation according to the rotation center, the position of the PCB carrier before rotation and the preset angle.
And moving the shooting position corresponding to the mechanical coordinates of the Mark point after rotation by the visual detection module according to the mechanical coordinates of the Mark point before rotation in the visual detection module coordinate system, re-shooting the Mark point after rotation to obtain an image of the Mark point, re-obtaining the image coordinates of the Mark point, re-positioning the mechanical coordinates of the Mark point in the probe mechanism coordinate system, and establishing a new mapping relation between the PCB coordinate system and the probe mechanism coordinate system. In this embodiment, the first visual detection module and the second visual detection module are moved to the positions of the corresponding Mark points, the Mark points are shot again, the image coordinates of the Mark points are identified again, the mechanical coordinates of the Mark points in the first flying probe test module coordinate system and the second flying probe test module coordinate system are repositioned, and the mapping relation between the rotated PCB board coordinate system and the first flying probe test module coordinate system and the second flying probe test module coordinate system is reestablished.
In one embodiment, the method of calculating the mechanical coordinates of the center of rotation of the PCB carrier is as follows.
In step a1, the mechanical coordinates (x) of the first MARK point of the test PCB on the carrier before rotation are obtained by photographing with the vision detection module 1 ,y 1 ) And the mechanical coordinates (x 2 ,y 2 ). The visual detection module is moved to the positions above the first MARK point and the second MARK point to shoot, image coordinates corresponding to the first MARK point and the second MARK point are obtained, and the mechanical coordinates (x) of the first MARK point are obtained through mapping matrix conversion from the image coordinates to the mechanical coordinates 1 ,y 1 ) And the mechanical coordinates (x 2 ,y 2 )。
In step a2, the rotationAfter the carrier is at a fixed angle, the mechanical coordinates (x) of the first MARK point of the test PCB on the carrier are obtained again by shooting with the visual detection module 1 ',y 1 ') and the mechanical coordinates (x) of the second MARK point 2 ',y 2 '). The visual detection module is moved to the positions above the first MARK point and the second MARK point to shoot, image coordinates corresponding to the first MARK point and the second MARK point are obtained, and the mechanical coordinates (x) of the first MARK point are obtained through conversion of an image coordinate to a mechanical coordinate mapping matrix 1 ',y 1 ') and the mechanical coordinates (x) of the second MARK point 2 ',y 2 ')。
In step a3, the mechanical coordinates (x) of the rotation center O are calculated based on the relative positional relationship between the rotation center O and the first and second MARK points A and B r ,y r )。
In this embodiment, in steps a1 to a3, the first visual detection module and the second visual detection module are required to capture the first MARK point and the second MARK point respectively to obtain the corresponding rotation center O, that is, the mechanical coordinates (x r ,y r ) Corresponding to the coordinate system in which the first visual inspection module is located, the mechanical coordinates (x r ,y r ) Corresponding to the coordinate system in which the second visual inspection module is located.
As shown in FIG. 5, the mechanical coordinates (x) of the rotation center O are obtained according to the relative positional relationship between the rotation center O and the first and second MARK points A and B, i.e. the distances between the rotation center O and the first and second MARK points A and B, respectively, are unchanged r ,y r ) The calculation formula of (2) is as follows:
in other embodiments, the test PCB has different numbers of Mark points, and the calculation of the rotation center may be performed by selecting different numbers of Mark points, as shown in fig. 5. For example, three Mark points A, B, C are selected, and the rotation is changed into a ', B ' and C '. When three Mark points are selected, three Mark points which are not on the same straight line are selected, and the mechanical coordinates of the rotation center O can be calculated through evolving the calculation formula.
S4, indexing the point position information needing to be needled from the PCB database, acquiring the position and the point position pair information of the test point in the rotated PCB coordinate system, and screening the test point position needing to be needled.
Specifically, according to the type of the PCB, the index of the test point pair, the front and back sides and the probe type information, the test point information needing to be put down is indexed from a PCB test database, and the position of the test point pair in the PCB coordinate system and the test point pair information are read from a test file. And screening the point positions needing needle dropping according to the type of the PCB, the type of the PCB carrier, the type of the PCB, the index of the probe, the index of the component and/or the index of the PIN angle from the test file.
In the embodiment, the needle-setting command is appointed through the upper computer command interaction control system software, shooting of test points is not needed every time, and the needle-setting is automatically and conveniently performed according to the PCB test file. And freely setting the test points according to the set flow at any time. The point to be tested is designated the test ground point or two PIN angles as required. The first flying probe testing module comprises a common probe, and the second flying probe testing module comprises a common probe and a high-frequency probe, wherein the total number of the probes is three. The common probe is a low-frequency probe for testing common components and devices, and the high-frequency probe is used for testing high-frequency signal components and devices. The circuit board can be tested for open circuit, short circuit, capacitor damage, high frequency device damage, etc.
In this embodiment, the flying probe test method further includes: turning over the PCB to the corresponding test surface, and acquiring the mechanical coordinates of Mark points of the PCB of the corresponding test surface in a first visual detection module coordinate system and a second visual detection module coordinate system in a test file; moving the first visual detection module and the second visual detection module to the mechanical coordinates to identify the image coordinates of the corresponding Mark points, and establishing a corresponding PCB coordinate system of the test surface through the mechanical coordinates of the corresponding PCB Mark points of the test surface in the test file; and establishing a mapping relation between the PCB coordinate system of the corresponding test surface and the coordinate system of the first flying probe test module and the coordinate system of the second flying probe test module by combining the PCB coordinate system of the corresponding test surface with the image coordinates of Mark points identified by the first visual test module and the second visual test module.
The flying probe testing method further comprises the following steps: judging whether interference exists between the first flying probe testing module and the second flying probe testing module; if interference exists, that is, the coordinates of the probe of the first flying probe testing module and the coordinates of the probe of the second flying probe testing module interfere with each other in space to cause collision of the first flying probe testing module and the second flying probe testing module, the needle-down position of the first flying probe testing module is exchanged with the needle-down position of the second flying probe testing module, and the needle-down position of the first flying probe testing module and the needle-down position of the second flying probe testing module are recalculated.
The flying probe testing method further comprises the following steps: judging whether the first flying probe testing module and the second flying probe testing module need to rotate or not; if the first flying probe testing module and the second flying probe testing module need to rotate, the first flying probe testing module and the second flying probe testing module rotate by a specific angle. Specifically, by judging whether the distance between the test point pairs in the set direction is smaller than a set threshold value, if so, the first and second flying probe test modules need to be rotated to avoid mutual interference.
S5, converting the mechanical coordinates of the test point pairs in the PCB coordinate system into mechanical coordinates in the probe mechanism coordinate system. In this embodiment, the coordinates of the test points of the test surface that are not flipped or flipped in the PCB coordinate system are converted into the mechanical coordinates corresponding to the first and second flying probe test modules.
And S6, moving the probe mechanism to the mechanical coordinates of the corresponding test point position pair for needle-down test. And driving the corresponding first flying probe testing module and second flying probe testing module to move to the mechanical coordinates of the corresponding testing point position pair through the corresponding linear module and the x-y-z axis driving module.
Before the test, the probe rotation needle-setting position calculation, grounding point teaching, Z-axis direction needle correction, Z-axis direction needle-setting position compensation and motor rotation angle needle-setting error compensation of the first flying needle test module and the second flying needle test module are required to be completed.
The flying probe testing method further comprises the following steps: if the needle-down test fails, the mobile vision detection module shoots the test point positions, and secondary positioning is carried out on the test point positions through Blob analysis, so that the needle-down positions are obtained again. Specifically, if the needle-down test fails, the first visual detection module and/or the second visual detection module are moved to the selected test point position (PIN angle) for shooting, blob analysis is performed, the center of the test point position (PIN angle) is identified, and the center is converted into corresponding mechanical coordinates through single pixel quantity. And each driving module automatically drives the corresponding first flying probe testing module and second flying probe testing module to move to the newly determined needle-setting testing position, secondary needle-setting testing is carried out, instrument testing values are read, and testing is completed.
In the needle setting test process, probes of the first flying needle test module and the second flying needle test module are shot through the third visual detection module, the image coordinates of the center of the probe in the image are positioned through Blob analysis, the image coordinates are converted into mechanical coordinates, the offset of the probe to the center of the camera is obtained, and the X-Y axis direction calibration of the probe is completed.
During multiple tests requiring replacement of probes: after the probe is replaced, the probe is moved to the position above the third visual detection module to shoot, and the mechanical coordinate position of the probe is recognized and positioned in real time, so that the automatic calibration of a new probe can be realized. In the embodiment, the needle is replaced for shooting once, and the automatic X-Y axis direction calibration of a new probe is completed without the need of manual calibration and compensation again.
After the test is finished, the probes are sprung, and all the probes of the first flying probe test module and the second flying probe test module return to the original point and pop up the PCB. All the driving modules stop the current action, return to the original point, the clamping cylinders of the PCB carrier are loosened, and the PCB is taken out.
As shown in fig. 3, the embodiment of the invention also discloses a flying probe testing system of the PCB board, which includes a PCB board position adjusting module, a first flying probe testing module, a second flying probe testing module, a first visual detection module, a second visual detection module and a third visual detection module.
The PCB board position adjustment module is used for PCB board material loading and transportation PCB board to test position to can rotatory PCB board to specific angle. The first flying probe testing module is used for controlling the first flying probe to be connected into the testing loop. The second flying probe testing module is used for controlling the second flying probe to be connected into the testing loop.
The first vision detection module is used for shooting MARK points and pins of components on the PCB, positioning the MARK points and the pins of the components, and guiding the first flying probe test module to a specified test position for needle-down test. The second visual detection module is used for shooting a carrier plate two-dimensional code, a PCB two-dimensional code, MARK points and pins of components on the PCB, positioning the MARK points and the pins of the components, and guiding the second flying probe test module to a specified test position for probe-down test. The third vision detection module is used for shooting a probe image, positioning the position of the probe in a mechanical coordinate system, calibrating the positions of the first vision module and the second vision module through the third vision module, and mapping the positions of the first flying needle and the second flying needle to the actual mechanical positions in the first flying needle testing module and the second flying needle testing module respectively for follow-up accurate needle setting.
The flying probe testing system of the PCB board can further comprise a testing point position acquisition module, a needle calibrating platform module, a first flying probe control module and a second flying probe control module. The test point position acquisition module is used for acquiring test information of the test point positions from the PCB test file. The needle calibrating platform module is used for calibrating the Z-direction positions of the first flying needle testing module and the second flying needle testing module, so that the probe can accurately drop the needle to the pin position of the PCB component in the Z direction, and the probe is prevented from not contacting with the pin or piercing the component and damaging the probe due to overlarge force. The first flying needle control module is used for controlling the needle falling height, the needle falling XY position and the needle falling rotation angle of the first flying needle. The second flying needle control module is used for controlling the needle falling height, the needle falling XY position and the needle falling rotation angle of the second flying needle.
As shown in fig. 4, the present invention also discloses a flying probe testing device for a PCB board, including: the device comprises a bearing mechanism 100, a probe mechanism 200, a first visual detection mechanism 300, a second visual detection mechanism 400, a third visual detection mechanism 500, a needle calibration mechanism 600 and a module control mechanism 700.
The carrying mechanism 100 is used for conveying, horizontally rotating and overturning the PCB. Specifically, the carrying mechanism 400 places a PCB board through a PCB carrier; the servo sliding table drives the PCB carrier to linearly reciprocate so as to realize conveying the PCB to the test position; the motor can realize the horizontal rotation within the range of +/-180 degrees of the PCB carrier, and when the interval between the test points is small or the needle cannot be normally placed between the two test points, the probe mechanism 200 can be placed smoothly by rotating the PCB to a proper angle; the front and back 180-degree rotation of the PCB carrier is realized through the rotary cylinder; the positioning block is driven by the air cylinder to realize automatic four-corner fixation of the PCB carrier, so that the PCB carrier is more stable; the compressing cylinder is rotated to ensure compressing the PCB, so that the Z-axis direction is prevented from jumping.
The probe mechanism 200 has a plurality of probes for performing a needle down test on test sites on the PCB. Specifically, the probe mechanism 200 includes a first flying probe control test mechanism and a second flying probe control test mechanism. The first flying probe control testing mechanism comprises a first flying probe testing device and a first flying probe control device. The first flying probe control device is connected with a testing instrument (such as a frequency spectrograph, an oscilloscope, a current source and the like) and the first probe and the first testing point position, so that the first testing point position is connected into the testing loop, and the first flying probe control device is used for controlling the needle setting state of the first flying probe testing device and comprises a needle setting height, a needle setting XY position and a needle setting rotation angle. The second flying probe control testing mechanism comprises a second flying probe testing device and a second flying probe control module, wherein the second flying probe control module is connected with a testing instrument (such as a spectrometer, an oscilloscope, a current source and the like) and a second probe and a second testing point position, so that the second testing point is connected into a testing loop, and the second flying probe control module is used for controlling the needle setting state of the second flying probe testing device, including needle setting height, needle setting XY position and needle setting rotation angle. The first flying probe testing device and the second flying probe testing device form a closed loop testing circuit of a pair of testing points. And reading the measured value of the test instrument through software, and judging whether the test point is abnormal.
The first flying probe testing device at least comprises a first high-frequency probe and a first low-frequency probe, and the second flying probe testing device at least comprises a second high-frequency probe and a second low-frequency probe. The high-frequency probe and the low-frequency probe of each flying probe testing device are driven by separate motors to realize axial rotation, so that different needle setting angles are met, and mutual interference is avoided during operation. The linear motor of each flying probe control device controls the corresponding high-frequency probe and low-frequency probe to realize the Z-axis direction movement, thereby ensuring the needle precision in the Z-axis direction.
The first flying probe control testing mechanism further comprises a first CCD camera and a first servo sliding table device, the second flying probe control testing mechanism further comprises a second CCD camera and a second servo sliding table device, and the servo sliding table device drives the corresponding CCD camera to move along the Z-axis direction, so that position judgment of different Z-axis directions is met.
The first visual inspection mechanism 300 and the second visual inspection mechanism 400 are both used for acquiring Mark points and test points from the PCB. Specifically, the first vision detecting mechanism 300 is configured to capture MARK points and pins of components on the PCB, locate MARK points and pin positions of components on the PCB, and guide the first flying probe control testing mechanism to a specified testing position for performing a probe-down test. The second vision detection mechanism 400 is used for shooting MARK points and pins of components on the PCB board, locating MARK points and pin positions of the components, and guiding the second flying probe control testing mechanism to a specified testing position for needle-down testing.
The first visual inspection mechanism 300 or the second visual inspection mechanism 400 also shoots and identifies the two-dimensional code of the PCB carrier and the two-dimensional code of the PCB board at the same time, obtains the type of the PCB carrier by identifying the two-dimensional code of the PCB carrier, and automatically matches the corresponding test file in the database. And the type of the PCB is acquired by identifying the two-dimension code of the PCB, and the corresponding test file is automatically matched in the database.
The Mark point can be circular, cross or square, and the product positioning is realized by positioning the center and the crossing point of the Mark point.
The third visual inspection mechanism 500 is used to perform calibration of the probe in the x-y and z directions. The third visual inspection mechanism 500 includes a needle calibration platform and a third CCD camera. And installing a high-frequency probe and a low-frequency probe on the flying probe testing device, and debugging the positions of probe tips at various angles and in different Z-axis directions. And (3) moving the probe to the upper part of the third CCD camera to perform position judgment, and calculating the standard point position of the probe tip. When the needle is replaced, correcting the Z-axis direction in a mode of being in electrical contact with the needle correcting platform; shooting and calculating the actual needle point position when the probe is moved to the upper part of the third CCD camera; and compensating the needle-falling position of the probe by comparing the actual needle point position with the standard position deviation.
The needle calibrating platform is used for calibrating the positions of the probes of the first flying needle testing device and the probes of the second flying needle testing device in the Z-axis direction, so that each probe can be accurately needled to the pin position of a component on the PCB in the Z-axis direction, and the situation that the probe is not contacted with the pin or excessively forcefully pierces the component and damages the probe is avoided.
Meanwhile, the image coordinates of the probe in the probe image shot by the third CCD camera are positioned, and the coordinates of the probe are respectively calibrated with the coordinates of the first visual detection module and the second visual detection module by the third CCD camera, so that the image coordinates of the probe are respectively mapped to the actual mechanical coordinates in the first flying probe testing device coordinate system and the second flying probe testing device coordinate system, and the follow-up accurate needle setting is facilitated.
The module control mechanism 700 is used for controlling the operation of the carrying mechanism 100, the probe mechanism 200, the first visual inspection mechanism 300, the second visual inspection mechanism 400, the third visual inspection mechanism 500 and the needle calibration mechanism 600.
The flying probe testing apparatus further includes an electronic control cabinet 800 and a frame 900 for mounting and supporting the respective mechanisms and the electronic control cabinet 800. The electronic control cabinet 800 is used for electrical control of the apparatus.
The embodiment of the invention also provides a computer readable storage medium, wherein the computer readable storage medium stores computer instructions, and the computer instructions are suitable for being loaded by a processor so as to realize the flying probe testing method.
The foregoing descriptions of specific exemplary embodiments of the present invention are presented for purposes of illustration and description. It is not intended to limit the invention to the precise form disclosed, and obviously many modifications and variations are possible in light of the above teaching. The exemplary embodiments were chosen and described in order to explain the specific principles of the invention and its practical application to thereby enable one skilled in the art to make and utilize the invention in various exemplary embodiments and with various modifications as are suited to the particular use contemplated. It is intended that the scope of the invention be defined by the claims and their equivalents.

Claims (11)

1. The flying probe testing method for the PCB is characterized by comprising the following steps of:
positioning the mechanical coordinates of Mark points of the PCB in the visual detection module;
establishing a mapping relation between a PCB coordinate system and a probe mechanism coordinate system;
judging whether the PCB carrier needs to be rotated, if so, rotating the PCB carrier to a preset angle, and reestablishing the mapping relation between the rotated PCB coordinate system and the probe mechanism coordinate system;
rotating the PCB carrier to a preset angle, reestablishing the mapping relation between the PCB coordinate system and the probe mechanism coordinate system, including: acquiring the rotation center of the PCB carrier according to the mechanical coordinates of the Mark point before rotation and the mechanical coordinates of the Mark point after rotation; acquiring the position of the rotated PCB carrier according to the rotation center, the position of the PCB carrier before rotation and a preset angle; according to the mechanical coordinates of the Mark point before rotation in the coordinate system of the visual detection module, the visual detection module is moved to shoot the Mark point after rotation again to obtain an image of the Mark point, and the mechanical coordinates of the Mark point in the coordinate system of the probe mechanism are repositioned to establish a new mapping relation between the coordinate system of the PCB and the coordinate system of the probe mechanism;
indexing the point position information needing to be needled in a PCB database, acquiring the position and the point position pair information of the test point in a rotated PCB coordinate system, and screening the test point position needing to be needled;
converting the mechanical coordinates of the test point pairs in the PCB coordinate system into mechanical coordinates in the probe mechanism coordinate system; and
and moving the probe mechanism to the mechanical coordinates of the corresponding test point position pair for automatic needle-setting test.
2. The flying probe testing method of a PCB board of claim 1, wherein obtaining a center of rotation of the PCB carrier comprises:
step a1, acquiring mechanical coordinates (x) of a first MARK point of the test PCB on the carrier before rotation by shooting of the visual detection module 1 ,y 1 ) And the mechanical coordinates (x 2 ,y 2 )；
Step a2, after the carrier is rotated, the mechanical coordinates (x) of the first MARK point of the test PCB on the carrier are obtained again by shooting with the visual detection module 1 ',y 1 ') and the mechanical coordinates (x) of the second MARK point 2 ',y 2 ' s); and
step a3, calculating to obtain the mechanical coordinate (x) of the rotation center according to the relative position relation between the rotation center and the first and second MARK points r ,y r )。
3. The flying probe testing method of the PCB according to claim 2, wherein in the steps a1 and a2, the visual detection module is moved to the upper parts of the first MARK point and the second MARK point to shoot, the image coordinates corresponding to the first MARK point and the second MARK point are obtained, and the mechanical coordinates of the first MARK point and the second MARK point are obtained through the conversion of the image coordinates to the mechanical coordinate mapping matrix.
4. The flying probe testing method of a PCB board according to claim 2, wherein the mechanical coordinates (x r ,y r ) The calculation formula of (2) is as follows:
the mechanical coordinates (x) of the rotation center are reversely calculated according to the above formula r ,y r )。
5. The flying probe testing method of the PCB of claim 1, wherein indexing the point location information requiring needle dropping from the PCB database, obtaining the position and the point location pair information of the tested point location in the rotated PCB coordinate system, and screening the tested point location requiring needle dropping, comprising:
according to the PCB type, the index of the test point pair, the front and back sides and the probe type information, indexing the point information needing to be needled down from a PCB database, and reading the position of the test point pair in a PCB coordinate system and the test point pair information from a test file; and
screening the point positions needing needle dropping according to the model, the carrier type, the PCB type, the probe index, the component index and/or the PIN angle index from the test file.
6. The flying probe testing method of a PCB of claim 1, further comprising:
turning over the PCB to the corresponding test surface, and acquiring the mechanical coordinates of Mark points of the PCB of the corresponding test surface in a visual detection module coordinate system in a test file;
moving the visual detection module to the mechanical coordinates to identify the image coordinates of Mark points, and establishing a corresponding PCB coordinate system of the test surface through the mechanical coordinates of the Mark points of the PCB of the corresponding test surface in the test file; and
and establishing a mapping relation between the PCB coordinate system of the corresponding test surface and the coordinate system of the visual detection module by combining the PCB coordinate system of the corresponding test surface with the image coordinates of the Mark points identified by the visual detection module, and establishing a mapping relation between the PCB coordinate system of the corresponding test surface and the coordinate system of the probe mechanism.
7. The method of claim 1, wherein the probe mechanism comprises a first and a second probe test module, the method further comprising:
judging whether interference exists between the first flying probe testing module and the second flying probe testing module;
if interference exists, the needle-down position of the first flying needle testing module is exchanged with the needle-down position of the second flying needle testing module, and the needle-down position of the first flying needle testing module and the needle-down position of the second flying needle testing module are recalculated.
8. The method of claim 1, wherein the probe mechanism comprises a first and a second probe test module, the method further comprising:
judging whether the first flying probe testing module and the second flying probe testing module need to rotate or not;
and if the first flying probe testing module and the second flying probe testing module need to rotate, rotating the first flying probe testing module and the second flying probe testing module by a specific angle.
9. The method of claim 8, wherein determining whether the first and second pin test modules need to be rotated comprises: judging whether the distance between the test point pairs in the set direction is smaller than a set threshold value, and if so, rotating the first flying probe test module and the second flying probe test module.
10. The flying probe testing method of a PCB of claim 1, further comprising: if the needle-down test fails, the mobile vision detection module shoots the test point positions, and secondary positioning is carried out on the test point positions through Blob analysis, so that the needle-down positions are obtained again.
11. A computer readable storage medium having stored therein computer instructions adapted to be loaded by a processor to implement the flying probe test method of any one of claims 1 to 10.
CN202210106009.5A 2022-01-28 2022-01-28 Flying probe testing method, system and equipment for PCB and storage medium Active CN114441942B (en)

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