CN114441942A - Flying probe testing method, system, equipment and storage medium for PCB - Google Patents
Flying probe testing method, system, equipment and storage medium for PCB Download PDFInfo
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- CN114441942A CN114441942A CN202210106009.5A CN202210106009A CN114441942A CN 114441942 A CN114441942 A CN 114441942A CN 202210106009 A CN202210106009 A CN 202210106009A CN 114441942 A CN114441942 A CN 114441942A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
- G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance
Abstract
The invention discloses a flying probe test method, a flying probe test system, a flying probe test device and a storage medium of a PCB (printed circuit board), wherein the test method comprises the following steps: positioning the mechanical coordinates of the Mark points of the PCB in a visual detection module; establishing a mapping relation between a PCB coordinate system and a probe mechanism coordinate system; judging whether the PCB carrier needs to rotate, if so, rotating to a preset angle, and reestablishing the mapping relation between the PCB coordinate system and the probe mechanism coordinate system; indexing the next test point location, acquiring the position of the test point location in a PCB coordinate system and test point location pair information, and screening the next test point location; converting the mechanical coordinates of the test point location pair in the PCB coordinate system into mechanical coordinates in the probe mechanism coordinate system; and moving the probe mechanism to the mechanical coordinate of the test point position pair for probe test. According to the flying probe testing method of the PCB, the testing process can be flexibly configured, the flying probe testing can be automatically carried out according to the configuration, and the testing efficiency and the testing effect are improved.
Description
Technical Field
The present invention relates to the field of PCB board testing, and more particularly, to a method, system, device and storage medium for testing a flying probe of a PCB board.
Background
At present, the PCB is gradually thinned, the circuit structure thereof becomes more and more complex, and the requirement for reliability is also higher and higher. Generally, after the PCB is printed, a probe is used to detect the circuit of the PCB, for example, to test whether the circuit of the PCB has abnormal open circuit, short circuit, etc. The prior art typically uses a flying probe test method to test the open point of a PCB. When the solder joint interval of the size of the welding pad of the PCB is small, the flying probe testing method in the prior art cannot ensure the testing accuracy, so that some false open points are easy to appear during testing, and the testing is often required to be carried out again at the moment. However, the reason why the flying probe testing method in the prior art tests the false open circuit point is often because the probe deviates from the test point, so the flying probe testing method in the prior art cannot guarantee the accuracy of the secondary test. In the prior art, when the service life of the probe is prolonged or the accidental needle breakage occurs, after the probe is replaced, the manual needle correction and debugging position compensation are needed again, time and labor are consumed, the unnecessary workload of operating personnel is increased through repeated input operation, and meanwhile, the requirement on the quality of the operating personnel is high.
The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art that is already known to a person skilled in the art.
Disclosure of Invention
The invention aims to provide a flying probe testing method of a PCB, which can automatically drop a probe and improve the testing accuracy.
In order to achieve the above object, an embodiment of the present invention provides a flying probe testing method for a PCB, including: positioning the mechanical coordinates of the Mark points of the PCB in a visual detection module; establishing a mapping relation between a PCB coordinate system and a probe mechanism coordinate system; judging whether the PCB carrier needs to rotate or not, if so, rotating the PCB carrier to a preset angle, and reestablishing the mapping relation between the coordinate system of the PCB after rotation and the coordinate system of the probe mechanism; indexing point location information needing to be subjected to pin placement from a PCB database, acquiring the position of a test point location in a PCB coordinate system after rotation and test point location pair information, and screening the test point location needing to be subjected to pin placement; converting the mechanical coordinates of the test point location pair in the PCB coordinate system into mechanical coordinates in the probe mechanism coordinate system; and moving the probe mechanism to the mechanical coordinate of the corresponding test point location pair to perform automatic probe setting test.
In one or more embodiments of the present invention, rotating the PCB carrier to a predetermined angle to reestablish the mapping relationship between the PCB coordinate system and the probe mechanism coordinate system includes: acquiring a rotation center of the PCB carrier according to the mechanical coordinate of the Mark point before rotation and the mechanical coordinate of the Mark point after rotation; acquiring the position of the PCB carrier after rotation according to the rotation center, the position of the PCB carrier before rotation and a preset angle; and according to the mechanical coordinate of the Mark point before rotation in the coordinate system of the visual detection module, moving the visual detection module to shoot the rotated Mark point again to obtain an image of the Mark point, and repositioning the mechanical coordinate of the Mark point in the coordinate system of the probe mechanism to establish a new mapping relation between the coordinate system of the PCB and the coordinate system of the probe mechanism.
In one or more embodiments of the present invention, acquiring a rotation center of the PCB carrier includes: step a1, acquiring the mechanical coordinate (x) of the first MARK point of the test PCB on the carrier before rotation through the shooting of the visual detection module1,y1) And the mechanical coordinates (x) of the second MARK point2,y2) (ii) a Step a2, after the carrier is rotated, the mechanical coordinate (x) of the first MARK point of the test PCB on the carrier is obtained again through the shooting of the visual detection module1',y1') and the mechanical coordinate (x) of the second MARK point2',y2') to a host; and a step a3 of calculating and obtaining the mechanical coordinate (x) of the rotation center according to the relative position relationship between the rotation center and the first and second MARK pointsr,yr)。
In one or more embodiments of the present invention, in the steps a1 and a2, the visual inspection module is moved to above the first MARK point and the second MARK point respectively for shooting, image coordinates corresponding to the first MARK point and the second MARK point are obtained, and mechanical coordinates of the first MARK point and the second MARK point are obtained through conversion of the image coordinates into a mechanical coordinate mapping matrix.
In one or more embodiments of the invention, the mechanical coordinate (x) of the center of rotationr,yr) The calculation formula of (2) is as follows:
reversely obtaining the mechanical coordinate (x) of the rotation center according to the above formular,yr)。
In one or more embodiments of the present invention, indexing point location information of a pin to be inserted from a PCB database, obtaining a position of a test point location in a rotated PCB coordinate system and test point location pair information, and screening the test point location of the pin to be inserted includes: according to the PCB type, the test point pair index, the front side and the back side and the probe type information, point position information needing to be subjected to pin placement is indexed from a PCB database, and the position of a test point pair in a PCB coordinate system and the test point position pair information are read from a test file; and screening the PIN points needing to be selected from the test file according to the model, the carrier type, the PCB type, the probe index, the component index and/or the PIN angle index.
In one or more embodiments of the present invention, the flying probe testing method further comprises: turning the PCB to a corresponding test surface, and acquiring a mechanical coordinate of a Mark point of the PCB of the corresponding test surface in a visual inspection module coordinate system in a test file; moving the visual detection module to the position of the mechanical coordinate to identify the image coordinate of the Mark point, and establishing a PCB coordinate system of the corresponding test surface through the mechanical coordinate of the Mark point of the PCB of the corresponding test surface in the test file; and establishing a mapping relation between the PCB coordinate system of the corresponding test surface and the coordinate system of the visual detection module and establishing a mapping relation between the PCB coordinate system of the corresponding test surface and the coordinate system of the probe mechanism by combining the PCB coordinate system of the corresponding test surface with the image coordinate of the Mark point identified by the visual detection module.
In one or more embodiments of the present invention, the probe mechanism includes a first flying probe testing module and a second flying probe testing module, and the flying probe testing method further includes: judging whether interference exists between the first flying probe testing module and the second flying probe testing module; and if the interference exists, exchanging the needle descending position of the first flying needle testing module with the needle descending position of the second flying needle testing module, and recalculating the needle descending position of the first flying needle testing module and the needle descending position of the second flying needle testing module.
According to one or more embodiments of the present invention, the probe mechanism includes a first flying probe testing module and a second flying probe testing module, and the flying probe testing method further includes: judging whether the first flying probe testing module and the second flying probe testing module need to rotate or not; and if the first flying probe testing module and the second flying probe testing module need to rotate, rotating the first flying probe testing module and the second flying probe testing module by a specific angle.
In one or more embodiments of the present invention, the determining whether the first flying probe testing module and the second flying probe testing module need to rotate includes: and judging whether the distance between the test point location pairs in the set direction is smaller than a set threshold value, if so, rotating the first flying probe test module and the second flying probe test module.
In one or more embodiments of the present invention, the flying probe testing method further includes: and if the needle placement test fails, the mobile visual detection module shoots the test point location, and performs secondary positioning on the test point location through Blob analysis to obtain the needle placement position again.
The invention provides a flying probe testing system of a PCB (printed circuit board), which comprises a PCB position adjusting module, a first flying probe testing module, a second flying probe testing module, a first visual detection module, a second visual detection module and a third visual detection module.
The PCB position adjusting module is used for feeding the PCB, transporting the PCB to a testing position and rotating the PCB to a specific angle. The first flying probe testing module is used for controlling the first flying probe to be connected into the testing loop. The second flying probe testing module is used for controlling the second flying probe to be connected into the testing loop. The first visual detection module is used for shooting MARK points and pins of components on the PCB, positioning the MARK points and the positions of the pins of the components, and guiding the first flying probe test module to a specified test position for probe setting test. And the second visual detection module is used for shooting the two-dimensional code of the carrier plate, the two-dimensional code of the PCB, the MARK points on the PCB and pins of the components, positioning the positions of the Mark points and the pins of the components, and guiding the second flying probe test module to a specified test position for carrying out probe setting test. The third vision detection module is used for shooting probe images, positioning the position of the probe in a mechanical coordinate system, calibrating the position of the probe with the first vision module and the position of the probe with the position of the second vision module through the third vision module, and mapping the positions of the first flying probe and the second flying probe to the actual mechanical positions in the first flying probe testing module and the second flying probe testing module respectively for subsequent accurate probe placement.
The flying probe test system of the PCB further comprises a test point position acquisition module, a probe correction platform module, a first flying probe control module and a second flying probe control module. The test point location obtaining module is used for obtaining test information of the test point location from the PCB test file. The pin correcting platform module is used for carrying out Z-direction position calibration on the first flying pin testing module and the second flying pin testing module, so that a probe can be accurately inserted to the pin position of a PCB component in the Z direction. The first flying needle control module is used for controlling the lower needle height, the lower needle XY position and the lower needle rotation angle of the first flying needle. The second flying needle control module is used for controlling the lower needle height, the lower needle XY position and the lower needle rotation angle of the second flying needle.
The invention also discloses a flying probe test device of the PCB, which comprises: the PCB board aligning device comprises a bearing mechanism, a probe mechanism, a first visual detection mechanism, a second visual detection mechanism, a third visual detection mechanism, a pin aligning mechanism and a module control mechanism, wherein the bearing mechanism is used for conveying, horizontally rotating and overturning a PCB board. The probe mechanism is provided with a plurality of probes and is used for performing probe setting test on test point positions on the PCB. The first visual detection mechanism and the second visual detection mechanism are used for acquiring Mark points, pins of a testing device and probe images from the PCB. The third visual inspection mechanism is used for calibrating the probe in the x-y axis direction and the z axis direction. The needle correcting mechanism is used for correcting and compensating the needle-inserting position of the probe. The module control mechanism is used for controlling the bearing mechanism, the probe mechanism, the first visual detection mechanism, the second visual detection mechanism, the third visual detection mechanism and the needle correction mechanism to work.
The invention also discloses a computer readable storage medium, wherein computer instructions are stored in the computer readable storage medium and are suitable for being loaded by a processor so as to realize the flying probe testing method.
Compared with the prior art, the flying probe testing method of the PCB can accurately acquire the mechanical coordinates of the rotated test points again when the PCB needs to rotate, so that the accurate probe inserting function is realized; the test effect is improved.
According to the flying probe testing method of the PCB, the probe is controlled to move to the position above the third visual detection module through an automatic process without manual re-calibration after the probe is replaced, and then the new probe can be automatically calibrated by taking a picture and positioning the probe.
According to the flying probe testing method and the flying probe testing system of the PCB, disclosed by the embodiment of the invention, the point location information of the probe to be inserted can be indexed from the PCB database, the position of the testing point location in the rotated PCB coordinate system and the testing point location pair information can be obtained, and the testing point location of the probe to be inserted is screened. The order of putting the needle is appointed through the interactive control system software of host computer order, need not all go the test point at every turn and shoot, according to PCB board coordinate point file, automatic putting the needle, it is quick convenient. The test flow can be flexibly configured, the flying probe test can be automatically carried out according to the configuration, and the test efficiency and the test effect are improved.
Drawings
FIG. 1 is a system flow diagram of a method for flying probe testing of a PCB board according to an embodiment of the present invention;
FIG. 2 is a flow chart of a flying probe testing method of a PCB board according to an embodiment of the invention;
FIG. 3 is a system block diagram of a flying probe test system for a PCB board according to an embodiment of the present invention;
fig. 4 is a system block diagram of a flying probe testing apparatus of a PCB panel according to an embodiment of the present invention.
FIG. 5 is a block diagram of an embodiment of the present invention.
Detailed Description
The following detailed description of the present invention is provided in conjunction with the accompanying drawings, but it should be understood that the scope of the present invention is not limited to the specific embodiments.
Throughout the specification and claims, unless explicitly stated otherwise, the word "comprise", or variations such as "comprises" or "comprising", will be understood to imply the inclusion of a stated element or component but not the exclusion of any other element or component.
Example 1
As shown in fig. 1 and fig. 2, a flying probe testing method for a PCB includes the following steps.
In step S1, the mechanical coordinates of the Mark point of the PCB board in the visual inspection module are located.
The method comprises the steps of obtaining a test file corresponding to a PCB, obtaining the mechanical coordinates of Mark points of the PCB in a visual inspection module coordinate system in the test file, moving the visual inspection module to the mechanical coordinates to identify the image coordinates of the Mark points, and positioning the mechanical coordinates of the Mark points.
In the embodiment, the visual detection module is driven to move by the linear module and the x-y-z axis driving module. The vision detection module is moved to the two-dimensional code position of the carrier and the two-dimensional code position of the PCB, the two-dimensional code of the carrier and the two-dimensional code of the PCB can be shot and identified, and the type of the carrier and the type of the PCB can be obtained. In the embodiment, the type information of the carrier and the PCB is recorded in the two-dimensional code, so that the types of the carrier and the PCB can be obtained by shooting and identifying the two-dimensional code.
In an embodiment, two visual inspection modules, namely a first visual inspection module and a second visual inspection module, may be provided, and a third visual inspection module may be further provided. And the second vision module is used for identifying the two-dimensional code of the carrier and the two-dimensional code of the PCB, acquiring a test file corresponding to the PCB from a PCB test database, and acquiring the mechanical coordinate of the Mark point of the PCB in a vision detection module coordinate system from the test file. In the system of the flying probe testing machine, various types of test files of the PCB are usually stored in advance, and the corresponding test file can be retrieved in the system of the flying probe testing machine according to the type of the PCB to be tested, so that the mechanical coordinates of the Mark point on the PCB in the visual detection module coordinate system can be obtained according to the test file.
In one embodiment, the mechanical coordinates of the Mark point of the PCB are positioned in the visual detection module, and the positioning comprises coarse positioning and precise positioning. The rough positioning comprises the steps of firstly finding out the approximate position of a Mark point by adopting a template matching mode, specifically, moving a first visual detection module and a second visual detection module to a shooting position corresponding to the mechanical coordinate of the Mark point, and shooting the Mark point to obtain an image of the Mark point.
The accurate positioning comprises processing the image of the position area, accurately positioning the position of a Mark point, acquiring the image coordinate of the Mark point according to the image of the Mark point, and automatically identifying the mechanical coordinate of the Mark point in the corresponding first visual detection module and the second visual detection module according to the mapping relation between the image coordinate system of the Mark point and the visual detection module coordinate system, thereby positioning the coordinate of the Mark point. The shape of Mark points can be selected according to actual needs, and can be square, circle, cross and the like.
Before step S1, the product needs to be powered on; namely, the power is turned on, the PCB is automatically electrified, the USB is automatically plugged and unplugged, lighting is electrified, the USB is automatically communicated, and all instruments are connected. And testing preparation is performed.
Before step S1, it is further necessary to complete the establishment of the first visual inspection module coordinate system, the second visual inspection module coordinate system, the third visual inspection module coordinate system, the first flying probe testing module, and the second flying probe testing module coordinate system.
And S2, establishing a mapping relation between the PCB coordinate system and the probe mechanism coordinate system. In this embodiment, the probe mechanism includes a first flying probe testing module and a second flying probe testing module.
And establishing a PCB coordinate system through the mechanical coordinates of the Mark points in the test file, establishing a mapping relation between the PCB coordinate system and a visual detection module coordinate system through the PCB coordinate system in combination with the image coordinates of the Mark points identified by the visual detection module, and establishing a mapping relation between the PCB coordinate system and a probe mechanism coordinate system.
Before establishing a mapping relation between a PCB coordinate system and a probe mechanism coordinate system, the calibration work of the whole system needs to be completed, and the method specifically comprises the following steps: and establishing a mapping relation from a first visual detection module coordinate system to a third visual detection module coordinate system, from a second visual detection module coordinate system to a third visual detection module coordinate system, from the first visual detection module coordinate system to the second visual detection module coordinate system, from the first visual detection module coordinate system to the first flying probe testing module coordinate system, from the second visual detection module coordinate system to the second flying probe testing module coordinate system and from the third visual detection module coordinate system to the first flying probe testing module coordinate system. After the calibration work of the whole system is completed, the mapping relation between the PCB coordinate system and the first visual inspection module coordinate system and the second visual inspection module coordinate system and the mapping relation between the PCB coordinate system and the first flying probe test module coordinate system and the second flying probe test module coordinate system are established.
S3, judging whether the PCB carrier needs to rotate, if so, rotating the PCB carrier to a preset angle, and reestablishing the mapping relation between the PCB coordinate system and the probe mechanism coordinate system after rotation.
Specifically, the rotation center of the PCB carrier is obtained according to the mechanical coordinate of the Mark point before rotation and the mechanical coordinate of the Mark point after rotation. And selecting a plurality of Mark points, and calculating to obtain the rotation center of the PCB carrier according to the mechanical coordinates of the plurality of Mark points before and after rotation. In this embodiment, two Mark points are selected to calculate the rotation center of the PCB carrier.
And acquiring the position of the rotated PCB carrier according to the rotation center, the position of the PCB carrier before rotation and a preset angle.
According to the mechanical coordinate of the Mark point before rotation in the coordinate system of the vision detection module, the vision detection module is moved to a shooting position corresponding to the mechanical coordinate of the Mark point after rotation, the Mark point after rotation is shot again to obtain an image of the Mark point, the image coordinate of the Mark point is obtained again, the mechanical coordinate of the Mark point in the coordinate system of the probe mechanism is repositioned, and the mapping relation between the coordinate system of the PCB and the coordinate system of the probe mechanism is established. In this embodiment, the first visual inspection module and the second visual inspection module are moved to the corresponding Mark point positions, the Mark points are re-photographed, the image coordinates of the Mark points are re-identified, the mechanical coordinates of the Mark points in the first flying probe test module coordinate system and the second flying probe test module coordinate system are re-positioned, and the mapping relationship between the rotated PCB board coordinate system and the first flying probe test module coordinate system and the second flying probe test module coordinate system is re-established.
In one embodiment, the method of calculating the mechanical coordinates of the center of rotation of the PCB carrier is as follows.
In step a1, acquiring the mechanical coordinates (x) of the first MARK point of the test PCB on the carrier before rotation by shooting of the vision inspection module1,y1) And the mechanical coordinate (x) of the second MARK point2,y2). The visual detection module is moved to the positions above the first MARK point and the second MARK point respectively for shooting, image coordinates corresponding to the first MARK point and the second MARK point are obtained, and the mechanical coordinate (x) of the first MARK point is obtained through mapping matrix conversion from the image coordinates to the mechanical coordinate1,y1) And the mechanical coordinate (x) of the second MARK point2,y2)。
In step a2, after rotating the carrier for a fixed angle, the mechanical coordinates (x) of the first MARK point of the test PCB on the carrier are obtained again by the shooting of the vision inspection module1',y1') and the mechanical coordinates (x) of the second MARK point2',y2'). Respectively moving the visual detection module above the first MARK point and the second MARK point for shooting to obtain image coordinates corresponding to the first MARK point and the second MARK point, and obtaining the mechanical coordinates (x) of the first MARK point through the conversion of the image coordinates to the mechanical coordinate mapping matrix1',y1') and the mechanical coordinate (x) of the second MARK point2',y2')。
In step a3, the mechanical coordinate (x) of the rotation center O is calculated and obtained according to the relative position relationship between the rotation center O and the first and second MARK points A and Br,yr)。
In this embodiment, in each of the steps a 1-a 3, the first vision inspection module and the second vision inspection module are required to respectively capture the first MARK point and the second MARK point to obtain the corresponding rotation center O, i.e. the mechanical coordinate (x) of the rotation center O obtained by the first vision inspection moduler,yr) The mechanical coordinate (x) of the rotation center O acquired by the second vision inspection module corresponds to the coordinate system where the first vision inspection module is locatedr,yr) Corresponding to the coordinate system in which the second visual inspection module is located.
As shown in fig. 5, according to the rotation center O and the first MARK points a and aThe relative position relationship of the second MARK point B is unchanged, namely the distances from the rotation center O to the first MARK point A and the second MARK point B are unchanged, and the mechanical coordinate (x) of the rotation center O is obtainedr,yr) The calculation formula of (2) is as follows:
in other embodiments, the test PCB has different numbers of Mark points, and the rotation center can be calculated by selecting different numbers of Mark points, as shown in fig. 5. For example, three Mark points A, B, C are selected and rotated to become a ', B ', and C '. When three Mark points are selected, three Mark points which are not on the same straight line are selected, and the mechanical coordinate of the rotation center O can be calculated by evolving the calculation formula.
And S4, indexing point position information needing to be inserted from the PCB database, acquiring the position of the test point position in the rotated PCB coordinate system and test point position pair information, and screening the test point position needing to be inserted.
Specifically, according to the type of the PCB, the index of the test point pair, the front side and the back side and the probe type information, the test point pair information needing to be subjected to the probe is indexed from a PCB test database, and the position of the test point pair in a PCB coordinate system and the test point pair information are read from a test file. And screening the PIN points needing to be placed according to the PCB model, the PCB carrier type, the PCB type, the probe index, the component index and/or the PIN angle index in the test file.
In the embodiment, the order of the next needle is specified by the software of the upper computer order interaction control system, the test point does not need to be shot each time, and the next needle is automatically placed according to the test file of the PCB, so that the method is quick and convenient. And (4) freely setting test point positions according to a flow set at any time. And the point positions to be tested according to the requirements specify a test grounding point or two PIN angles. The first flying probe testing module comprises a common probe, the second flying probe testing module comprises a common probe and a high-frequency probe, and the total number of the probes is three. The common probes are low-frequency probes for testing common components and high-frequency probes for testing high-frequency signal components. The circuit board can be tested for open circuits, short circuits, capacitance damage, high frequency device damage, and the like.
In this embodiment, the flying probe testing method further includes: overturning the PCB to a corresponding test surface, and acquiring mechanical coordinates of Mark points of the PCB of the corresponding test surface in a first visual detection module coordinate system and a second visual detection module coordinate system in a test file; moving the first visual detection module and the second visual detection module to the position of the mechanical coordinate to identify the image coordinate of the corresponding Mark point, and establishing a PCB coordinate system of the corresponding test surface according to the mechanical coordinate of the corresponding PCB Mark point of the test surface in the test file; and establishing a mapping relation between the PCB coordinate system of the corresponding test surface and the first and second visual detection module coordinate systems and between the PCB coordinate system of the corresponding test surface and the first and second flying probe test module coordinate systems by combining the PCB coordinate system of the corresponding test surface with the image coordinates of the Mark points identified by the first and second visual detection modules.
The flying probe testing method further comprises the following steps: judging whether interference exists between the first flying probe testing module and the second flying probe testing module; if interference exists, namely the coordinate of the probe of the first flying probe testing module and the coordinate of the probe of the second flying probe testing module interfere with each other in space to cause collision of the first flying probe testing module and the second flying probe testing module, the lower probe position of the first flying probe testing module and the lower probe position of the second flying probe testing module are exchanged, and the lower probe position of the first flying probe testing module and the lower probe position of the second flying probe testing module are recalculated.
The flying probe testing method further comprises the following steps: judging whether the first flying probe testing module and the second flying probe testing module need to rotate or not; and if the first flying probe testing module and the second flying probe testing module need to rotate, rotating the first flying probe testing module and the second flying probe testing module by a specific angle. Specifically, whether the distance between the test point pair in the set direction is smaller than a set threshold is judged, and if the distance is smaller than the threshold, the first flying probe test module and the second flying probe test module need to be rotated to avoid mutual interference of the first flying probe test module and the second flying probe test module.
And S5, converting the mechanical coordinates of the test point pairs in the PCB coordinate system into the mechanical coordinates in the probe mechanism coordinate system. In the embodiment, the coordinates of the test point of the test surface corresponding to the test surface which is not overturned or overturned in the PCB coordinate system are converted into the corresponding mechanical coordinates of the first flying probe test module and the second flying probe test module.
And S6, moving the probe mechanism to the mechanical coordinate of the corresponding test point pair to perform the probe test. And driving the corresponding first flying probe testing module and the second flying probe testing module to move to the mechanical coordinate of the corresponding testing point position pair through the corresponding linear module and the x-y-z axis driving module.
Before testing, the probe rotation lower needle position calculation, grounding point teaching, Z-axis direction needle correction, Z-axis direction needle position compensation and motor rotation angle lower needle error compensation of the first flying needle testing module and the second flying needle testing module need to be completed.
The flying probe testing method further comprises the following steps: and if the needle placement test fails, the mobile visual detection module shoots the test point location, and performs secondary positioning on the test point location through Blob analysis to obtain the needle placement position again. Specifically, if the next-needle test fails, the first visual detection module and/or the second visual detection module are/is moved to a selected test point location (PIN angle) for shooting, Blob analysis is carried out, the center of the test point location (PIN angle) is identified, and the corresponding mechanical coordinates are converted through single pixel quantity. And each driving module automatically drives the corresponding first flying probe testing module and the corresponding second flying probe testing module to move to the newly determined probe descending testing position, secondary probe descending testing is carried out, the testing value of the instrument is read, and the testing is finished.
In the probe inserting test process, the probes of the first flying probe test module and the second flying probe test module are shot through the third visual detection module, image coordinates of the center of the probe in an image are located through Blob analysis, the image coordinates are converted into mechanical coordinates, the offset from the probe to the center of the camera is obtained, and the calibration of the probe in the X-Y axis direction is completed.
During multiple tests requiring probe replacement: after the probe is replaced, the probe is moved to the position above the third visual detection module for shooting, the mechanical coordinate position of the probe is identified and positioned in real time, and the automatic calibration of a new probe can be realized. In the embodiment, the probe is replaced by shooting once, and the automatic X-Y axis direction calibration of a new probe is completed without manual calibration and compensation again.
After the test is finished, the probes are bounced, all the probes of the first flying probe testing module and the second flying probe testing module return to the original point, and the PCB is bounced. And all the driving modules stop the current action, return to the original point, and the clamping cylinder of the PCB carrier loosens to take out the PCB.
As shown in fig. 3, an embodiment of the present invention further discloses a flying probe testing system for a PCB, which includes a PCB position adjusting module, a first flying probe testing module, a second flying probe testing module, a first visual inspection module, a second visual inspection module, and a third visual inspection module.
The PCB position adjusting module is used for feeding the PCB, transporting the PCB to a testing position and rotating the PCB to a specific angle. The first flying probe testing module is used for controlling the first flying probe to be connected into the testing loop. The second flying probe testing module is used for controlling the second flying probe to be connected into the testing loop.
The first visual detection module is used for shooting MARK points and pins of components on the PCB, positioning the MARK points and the positions of the pins of the components, and guiding the first flying probe test module to a specified test position for probe setting test. The second visual detection module is used for shooting the two-dimensional code of the carrier plate, the two-dimensional code of the PCB, the MARK points on the PCB and pins of the components, positioning the positions of the Mark points and the pins of the components, and guiding the second flying probe test module to a specified test position for carrying out probe placement test. The third vision detection module is used for shooting probe images, positioning the position of the probe in a mechanical coordinate system, calibrating the position of the probe with the first vision module and the position of the probe with the position of the second vision module through the third vision module, and mapping the positions of the first flying probe and the second flying probe to the actual mechanical positions in the first flying probe testing module and the second flying probe testing module respectively for subsequent accurate probe placement.
The flying probe test system of the PCB board can further comprise a test point position acquisition module, a probe correction platform module, a first flying probe control module and a second flying probe control module. The test point location obtaining module is used for obtaining test information of the test point location from the PCB test file. The pin correcting platform module is used for carrying out Z-direction position calibration on the first flying pin testing module and the second flying pin testing module, so that the probe can be accurately inserted to the pin position of a PCB (printed circuit board) component in the Z direction, and the condition that the probe does not contact the pin or pierces the component and damages the probe due to excessive force is avoided. The first flying needle control module is used for controlling the lower needle height, the lower needle XY position and the lower needle rotation angle of the first flying needle. The second flying needle control module is used for controlling the lower needle height, the lower needle XY position and the lower needle rotation angle of the second flying needle.
As shown in fig. 4, the present invention also discloses a flying probe testing device for a PCB board, comprising: the device comprises a bearing mechanism 100, a probe mechanism 200, a first visual inspection mechanism 300, a second visual inspection mechanism 400, a third visual inspection mechanism 500, a needle calibration mechanism 600 and a module control mechanism 700.
The carrying mechanism 100 is used for conveying, horizontally rotating and turning over the PCB. Specifically, the carrying mechanism 400 places the PCB board through the PCB carrier; the PCB carrier is driven by the servo sliding table to perform linear reciprocating movement, so that the PCB is conveyed to a test position; the horizontal rotation of the PCB carrier within the range of +/-180 degrees can be realized through the motor, and when the distance between the test point positions is small or the needle can not be normally inserted between the two test point positions, the probe mechanism 200 can smoothly insert the needle by rotating the PCB to a proper angle; the front side and the back side of the PCB carrier are rotated by 180 degrees through the rotating cylinder; the positioning block is driven by the cylinder to realize automatic four-corner fixing of the PCB carrier, so that the PCB carrier is more stable; the PCB is guaranteed to be pressed through the rotary pressing cylinder, and the Z-axis direction jumping is avoided.
The probe mechanism 200 has a plurality of probes for performing a probe test on a test site on the PCB. Specifically, the probe mechanism 200 includes a first flying probe control testing mechanism and a second flying probe control testing mechanism. The first flying probe control testing mechanism comprises a first flying probe testing device and a first flying probe control device. The first flying probe control device is connected with a test instrument (such as a frequency spectrograph, an oscilloscope, a current source and the like), the first probe and the first test point position, the first test point position is connected into a test loop, and the first flying probe control device is used for controlling the probe descending state of the first flying probe test device, and comprises a probe descending height, a probe descending XY position and a probe descending rotation angle. The second flying probe control testing mechanism comprises a second flying probe testing device and a second flying probe control module, the second flying probe control module is connected with a testing instrument (such as a frequency spectrograph, an oscilloscope, a current source and the like), a second probe and a second testing point position to enable a second testing point to be connected into a testing loop, and the second flying probe control module is used for controlling the needle descending state of the second flying probe testing device and comprises a needle descending height, a needle descending XY position and a needle descending rotation angle. The first flying probe testing device and the second flying probe testing device form a closed loop testing loop of a pair of testing point positions. And reading the measured value of the test instrument through software, and judging whether the test point position is abnormal or not.
The first flying probe testing device at least comprises a first high-frequency probe and a first low-frequency probe, and the second flying probe testing device at least comprises a second high-frequency probe and a second low-frequency probe. The high-frequency probe and the low-frequency probe of each flying probe testing device are driven by the independent motors to realize axial rotation, so that different lower probe angles are met, and mutual interference during operation is avoided. And a linear motor of each flying needle control device controls the corresponding high-frequency probe and low-frequency probe to realize the Z-axis direction movement, so that the needle descending precision in the Z-axis direction is ensured.
The first flying probe control testing mechanism further comprises a first CCD camera and a first servo sliding table device, the second flying probe control testing mechanism further comprises a second CCD camera and a second servo sliding table device, and the servo sliding table device drives the corresponding CCD camera to move along the Z-axis direction to meet position judgment in different Z-axis directions.
The first visual inspection mechanism 300 and the second visual inspection mechanism 400 are both used for obtaining Mark points and test point positions from the PCB. Specifically, the first visual inspection mechanism 300 is configured to shoot MARK points and pins of components on the PCB, locate the MARK points and the pin positions of the components on the PCB, and guide the first flying probe to control the testing mechanism to a designated testing position for performing a probe placement test. The second visual inspection mechanism 400 is used for shooting MARK points and pins of components on the PCB, positioning the MARK points and the pins of the components, and guiding the second flying probe to control the testing mechanism to a specified testing position for probe placement testing.
The first visual inspection mechanism 300 or the second visual inspection mechanism 400 also shoots and identifies the PCB carrier two-dimensional code and the PCB two-dimensional code at the same time, obtains the type of the PCB carrier by identifying the PCB carrier two-dimensional code, and automatically matches the corresponding test file in the database. And acquiring the type of the PCB by identifying the two-dimensional code of the PCB, and automatically matching the corresponding test file in the database.
The shape of the Mark point can be circular, cross-shaped or square, and the product positioning is realized by positioning the center and the intersection of the Mark point.
The third visual inspection mechanism 500 is used to perform calibration of the probe in the x-y direction and the z-direction. The third visual inspection mechanism 500 includes a needle alignment platform and a third CCD camera. And mounting a high-frequency probe and a low-frequency probe on the flying probe testing device, and debugging the probe tip positions of the probes at various angles and in different Z-axis directions. And moving the probe to the position above the third CCD camera for position judgment, and calculating the standard point position of the probe tip. When the needle is replaced, the Z-axis direction correction is firstly carried out in an electric contact mode with the needle correcting platform; the probe is moved to the position above the third CCD camera to shoot and calculate the actual needle point position; and compensating the position of the lower needle of the probe by comparing the actual needle point position with the standard position deviation.
The probe correcting platform is used for carrying out Z-axis direction position calibration on a probe of the first flying probe testing device and a probe of the second flying probe testing device, so that each probe can accurately descend to the pin position of the component on the PCB in the Z-axis direction, and the condition that the probe does not contact the pin or excessively impairs the component and damages the probe is avoided.
And simultaneously, by positioning the image coordinates of the probe in the probe image shot by the third CCD camera and calibrating the image coordinates of the probe with the coordinates of the first visual detection module and the second visual detection module respectively through the third CCD camera, the image coordinates of the probe are mapped to actual mechanical coordinates in a first flying probe testing device coordinate system and a second flying probe testing device coordinate system respectively, so that subsequent accurate probe placement is facilitated.
The module control mechanism 700 is used for controlling the operations of the carrying mechanism 100, the probe mechanism 200, the first visual inspection mechanism 300, the second visual inspection mechanism 400, the third visual inspection mechanism 500 and the needle calibration mechanism 600.
The flying probe test equipment further comprises an electric control cabinet 800 and a rack 900 for mounting and supporting the mechanisms and the electric control cabinet 800. The electric control cabinet 800 is used for electrical control of the equipment.
Embodiments of the present invention also provide a computer readable storage medium, in which computer instructions are stored, and the computer instructions are suitable for being loaded by a processor to implement the flying probe testing method.
The foregoing descriptions of specific exemplary embodiments of the present invention have been presented for purposes of illustration and description. It is not intended to limit the invention to the precise form disclosed, and obviously many modifications and variations are possible in light of the above teaching. The exemplary embodiments were chosen and described in order to explain certain principles of the invention and its practical application to enable one skilled in the art to make and use various exemplary embodiments of the invention and various alternatives and modifications as are suited to the particular use contemplated. It is intended that the scope of the invention be defined by the claims and their equivalents.
Claims (15)
1. A flying probe testing method of a PCB board is characterized by comprising the following steps:
positioning the mechanical coordinates of the Mark points of the PCB in a visual detection module;
establishing a mapping relation between a PCB coordinate system and a probe mechanism coordinate system;
judging whether the PCB carrier needs to rotate or not, if so, rotating the PCB carrier to a preset angle, and reestablishing the mapping relation between the coordinate system of the PCB after rotation and the coordinate system of the probe mechanism;
indexing point location information needing to be subjected to pin placement from a PCB database, acquiring the position of a test point location in a PCB coordinate system after rotation and test point location pair information, and screening the test point location needing to be subjected to pin placement;
converting the mechanical coordinates of the test point location pair in the PCB coordinate system into mechanical coordinates in the probe mechanism coordinate system; and
and moving the probe mechanism to the mechanical coordinate of the corresponding test point position pair to perform automatic probe setting test.
2. The flying probe test method of PCB board of claim 1, wherein rotating the PCB carrier to a predetermined angle and re-establishing the mapping relationship between the PCB board coordinate system and the probe mechanism coordinate system comprises:
acquiring a rotation center of the PCB carrier according to the mechanical coordinate of the Mark point before rotation and the mechanical coordinate of the Mark point after rotation;
acquiring the position of the PCB carrier after rotation according to the rotation center, the position of the PCB carrier before rotation and a preset angle; and
and according to the mechanical coordinate of the Mark point before rotation in the coordinate system of the vision detection module, the mobile vision detection module shoots the rotated Mark point again to obtain an image of the Mark point, and relocates the mechanical coordinate of the Mark point in the coordinate system of the probe mechanism so as to establish a new mapping relation between the coordinate system of the PCB and the coordinate system of the probe mechanism.
3. The flying probe testing method of PCB board of claim 2, wherein obtaining the rotation center of the PCB carrier comprises:
step a1, acquiring the mechanical coordinate (x) of the first MARK point of the test PCB on the carrier before rotation through the shooting of the visual detection module1,y1) And the mechanical coordinate (x) of the second MARK point2,y2)；
Step a2, after the carrier is rotated, the mechanical coordinate (x) of the first MARK point of the test PCB on the carrier is obtained again through the shooting of the visual detection module1',y1') and the mechanical coordinate (x) of the second MARK point2',y2') to a host; and
step a3, calculating and obtaining the mechanical coordinate (x) of the rotation center according to the relative position relationship between the rotation center and the first and second MARK pointsr,yr)。
4. The flying probe testing method of a PCB of claim 3, wherein in steps a1 and a2, the visual inspection module is moved above the first MARK point and the second MARK point respectively for shooting, image coordinates corresponding to the first MARK point and the second MARK point are obtained, and the mechanical coordinates of the first MARK point and the second MARK point are obtained by converting the image coordinates into a mechanical coordinate mapping matrix.
5. The flying probe test method of PCB board as claimed in claim 3, wherein the mechanical coordinate (x) of the rotation centerr,yr) The calculation formula of (2) is as follows:
reversely obtaining the mechanical coordinate (x) of the rotation center according to the above formular,yr)。
6. The flying probe testing method of the PCB as claimed in claim 1, wherein the step of indexing point location information of the probe to be inserted from the PCB database, obtaining the position of the test point location in the PCB coordinate system after rotation and the test point location pair information, and screening the test point location of the probe to be inserted comprises:
according to the PCB type, the test point pair index, the front side and the back side and the probe type information, point position information needing to be subjected to pin placement is indexed from a PCB database, and the position of a test point pair in a PCB coordinate system and the test point position pair information are read from a test file; and
and screening the point positions needing to be pointed according to the model, the carrier type, the PCB type, the probe index, the component index and/or the PIN angle index from the test file.
7. The flying probe testing method of a PCB board of claim 1, further comprising:
turning the PCB to a corresponding test surface, and acquiring a mechanical coordinate of a Mark point of the PCB of the corresponding test surface in a visual inspection module coordinate system in a test file;
moving the visual detection module to a mechanical coordinate position to identify the image coordinate of the Mark point, and establishing a PCB coordinate system of a corresponding test surface through the mechanical coordinate of the corresponding PCB Mark point of the test surface in the test file; and
and establishing a mapping relation between the PCB coordinate system of the corresponding test surface and the coordinate system of the visual detection module and establishing a mapping relation between the PCB coordinate system of the corresponding test surface and the coordinate system of the probe mechanism by combining the PCB coordinate system of the corresponding test surface with the image coordinate of the Mark point identified by the visual detection module.
8. The flying probe testing method of a PCB of claim 1, wherein the probe mechanism comprises a first flying probe testing module and a second flying probe testing module, the flying probe testing method further comprising:
judging whether interference exists between the first flying probe testing module and the second flying probe testing module;
and if the interference exists, exchanging the needle descending position of the first flying needle testing module with the needle descending position of the second flying needle testing module, and recalculating the needle descending position of the first flying needle testing module and the needle descending position of the second flying needle testing module.
9. The flying probe testing method of a PCB of claim 1, wherein the probe mechanism comprises a first flying probe testing module and a second flying probe testing module, the flying probe testing method further comprising:
judging whether the first flying probe testing module and the second flying probe testing module need to rotate or not;
and if the first flying probe testing module and the second flying probe testing module need to rotate, rotating the first flying probe testing module and the second flying probe testing module by a specific angle.
10. The flying probe testing method of a PCB board of claim 9, wherein the determining whether the first flying probe testing module and the second flying probe testing module need to rotate comprises: and judging whether the distance between the test point location pairs in the set direction is smaller than a set threshold value, if so, rotating the first flying probe test module and the second flying probe test module.
11. The flying probe testing method of a PCB board of claim 1, further comprising: and if the needle placement test fails, the mobile visual detection module shoots the test point location, and performs secondary positioning on the test point location through Blob analysis to obtain the needle placement position again.
12. A flying probe test system of a PCB board is characterized by comprising:
the PCB position adjusting module is used for feeding the PCB, transporting the PCB to a testing position and rotating the PCB to a specific angle;
the first flying probe testing module is used for controlling the first flying probe to be connected into the testing loop;
the second flying probe testing module is used for controlling the second flying probe to be connected into the testing loop;
the first visual detection module is used for shooting MARK points and pins of components on the PCB, positioning the MARK points and the pins of the components, and guiding the first flying probe test module to a specified test position for probe setting test;
the second visual detection module is used for shooting the two-dimensional code of the carrier plate, the two-dimensional code of the PCB, the MARK point on the PCB and the pin of the component, positioning the Mark point and the pin of the component, and guiding the second flying probe test module to a specified test position for carrying out probe placement test; and
and the third vision detection module is used for shooting the probe image, positioning the position of the probe in a mechanical coordinate system, calibrating the position of the probe with the first vision module and the position of the probe with the position of the second vision module through the third vision module, and mapping the positions of the first flying probe and the second flying probe to the actual mechanical positions in the first flying probe testing module and the second flying probe testing module respectively for subsequent accurate probe placement.
13. The flying probe test system of a PCB board of claim 12, further comprising:
the test point location obtaining module is used for obtaining test information of the test point location from the PCB test file;
the probe correcting platform module is used for carrying out Z-direction position calibration on the first flying probe testing module and the second flying probe testing module so that a probe can be accurately inserted to the pin position of the PCB component in the Z direction;
the first flying needle control module is used for controlling the lower needle height, the lower needle XY position and the lower needle rotation angle of the first flying needle; and
and the second flying needle control module is used for controlling the lower needle height, the lower needle XY position and the lower needle rotation angle of the second flying needle.
14. The flying probe test equipment of the PCB is characterized by comprising:
the bearing mechanism is used for conveying, horizontally rotating and overturning the PCB;
the probe mechanism is provided with a plurality of probes and is used for performing probe setting test on test point positions on the PCB;
the first visual detection mechanism and the second visual detection mechanism are used for acquiring Mark points, pins of a testing device and probe images from the PCB;
the third visual detection mechanism is used for calibrating the probe in the x-y axis direction and the z axis direction;
the needle correcting mechanism is used for correcting and compensating the needle-inserting position of the probe; and
and the module control mechanism is used for controlling the bearing mechanism, the probe mechanism, the first visual detection mechanism, the second visual detection mechanism, the third visual detection mechanism and the needle correction mechanism to work.
15. A computer readable storage medium having stored thereon computer instructions adapted to be loaded by a processor to carry out the flying probe testing method of any one of claims 1 to 11.
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