CN217007585U - Improve flying probe testing arrangement of location needle inserting precision - Google Patents
Improve flying probe testing arrangement of location needle inserting precision Download PDFInfo
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- CN217007585U CN217007585U CN202122993542.1U CN202122993542U CN217007585U CN 217007585 U CN217007585 U CN 217007585U CN 202122993542 U CN202122993542 U CN 202122993542U CN 217007585 U CN217007585 U CN 217007585U
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Abstract
The utility model provides an improve flying probe testing arrangement of location needle inserting precision, includes the frame, and sets up in the frame: the bearing module is provided with a bearing plate for bearing the PCB to be tested. The moving module is correspondingly arranged above the horizontal table top and comprises an X-axis moving mechanism, a Y-axis moving mechanism, a Z-axis moving mechanism and a base; the base is arranged at the moving end of the Z-axis moving mechanism; the Z-axis moving mechanism is connected to the moving end of the X-axis moving mechanism; the X-axis moving mechanism is connected to the moving end of the Y-axis moving mechanism. The test module comprises a probe and a test camera, and the probe and the test camera are both positioned on the base; the probe vertically extends downwards; the test camera is arranged towards the horizontal table-board. The positioning module comprises a positioning camera and a laser range finder, and the positioning camera and the laser range finder are both positioned on the base; the positioning camera is arranged towards the horizontal table-board; the laser range finder is located the probe directly over, and vertical downward setting.
Description
Technical Field
The utility model relates to the technical field of Printed Circuit Board (PCB) testing, in particular to a flying probe testing device for improving positioning probe precision.
Background
At present, the PCB is gradually thinned, the circuit structure thereof becomes more and more complex, and the requirement for reliability is also higher and higher. Generally, after the PCB is printed, a probe is used to detect the circuit of the PCB.
The flying probe test is the latest solution for some main problems of the current electrical test, mainly comprises that probes which are driven by motors and can independently and rapidly move or a jig provided with a needle dial can be arranged on an X axis and a Y axis, and the flying probe test is mainly used for realizing the contact with welding points of a PCB (printed circuit board) by utilizing the movement of the probes in the Z axis direction to carry out electrical measurement. Instead of a needle bed, it uses a plurality of motor-driven, rapidly moving electrical probes that contact the pins of the device and make electrical measurements. The advent of flying probe testing has changed the testing method of low-volume and fast-changeover assembled products, greatly shortening the product design cycle and time to market.
The flying probe tester can check for short circuits, open circuits, and component values. A camera is also used on the flying probe test to help locate the missing element. The camera is used to check the well-defined element shapes, such as polar capacitance. However, the major disadvantages of the flying probe tester include: 1. the probe positioning accuracy is not high, the lower needle position is inaccurate, the detection efficiency is low, and the probe easily punctures the product. 2. The condition of firing pin appears easily when the probe removes, and the probe removes the components and parts that the in-process hits on the PCB board easily promptly, causes the probe and the components and parts damage on the PCB board.
In view of this, the utility model provides a flying probe testing device for improving positioning and puncturing precision, avoiding firing pins, avoiding puncturing products and improving detection efficiency, which is a research subject of the utility model.
Disclosure of Invention
The utility model aims to provide a flying probe testing device for improving positioning and puncturing precision.
In order to achieve the purpose, the utility model adopts the technical scheme that:
the utility model provides an improve flying probe testing arrangement of location needle inserting precision, the device includes the frame, still including setting up in the frame:
and the bearing module is provided with a bearing plate for bearing the PCB to be tested.
The moving module is correspondingly arranged above the horizontal table top of the rack and comprises an X-axis moving mechanism, a Y-axis moving mechanism, a Z-axis moving mechanism and a base; the base is arranged at the moving end of the Z-axis moving mechanism and is driven by the Z-axis moving mechanism to move in the Z-axis direction; the Z-axis moving mechanism is connected to the moving end of the X-axis moving mechanism, and the X-axis moving mechanism drives the Z-axis moving mechanism and the base to move in the X-axis direction; the X-axis moving mechanism is connected to the moving end of the Y-axis moving mechanism to form a structure that the Y-axis moving mechanism drives the X-axis moving mechanism, the Y-axis moving mechanism and the base to move in the Y-axis direction.
The test module comprises a probe and a test camera, and the probe and the test camera are both positioned on the base; the probe extends vertically downwards; the test camera is arranged towards the horizontal table top.
The positioning module comprises a positioning camera and a laser range finder, and the positioning camera and the laser range finder are both positioned on the base; the positioning camera is arranged towards the horizontal table top; the laser range finder is located directly over the probe and vertically arranged downwards.
The relevant content in the above technical solution is explained as follows:
1. in the above scheme, the working process of the technical scheme is as follows: the PCB to be tested is placed on the support plate, the PCB is photographed by a testing camera of the testing module, a Mark point on the PCB is visually positioned (a position identification point of the PCB applied to an automatic chip mounter) to position a product, and an NG Zone (bad area) coordinate is obtained. And then the probe is moved to the corresponding area to be detected through the matching of the X-axis moving mechanism and the Y-axis moving mechanism of the moving module. And then, photographing the outline of the PCB point at the bad position by a positioning camera on the positioning module, performing visual positioning analysis on the lower needle point, performing accurate positioning analysis, and judging whether the lower needle can be performed. Meanwhile, in the photographing and positioning process, the height of the plane where the PCB point at the bad position is located is measured through the laser range finder, and the height of the lower probe of the probe is determined. And then the probe is driven to move downwards by the Z-axis moving mechanism, and the probe is lowered to a PCB point at a bad position for detection.
The visual positioning Mark point, the NG Zone coordinate acquisition and the visual positioning analysis needle point can be realized by the existing software, for example, the visual positioning Mark point is realized by Halcon software, the NG Zone coordinate acquisition is realized by Halcon software, and the visual positioning analysis needle point is realized by Halcon software.
The movement of the probe can be realized by the prior art such as a servo transmission system, and can be realized by those skilled in the art, which is not an innovative point of the technical solution and therefore is not described in detail.
2. In the above scheme, the moving module includes an X-axis moving mechanism, a Y-axis moving mechanism, a Z-axis moving mechanism, and a base. And a three-axis moving mechanism is arranged to enable the probe to move randomly in three dimensions.
3. In the above technical scheme, this technical scheme sets up two cameras, sets up a test camera at test module, and it is used for detecting the product, confirms the approximate scope of bad point, when flying the needle test, also can be used for the instruction components and parts such as LED lamp on the analysis PCB board of shooing to judge the test result. The positioning camera is arranged in the positioning camera and used for accurately positioning bad PCB points in bad areas and positioning the lower needle points of the probes, so that the accuracy of the lower needle positions of the positioning probes is improved, the PCB and the components on the PCB are effectively prevented from being punctured, and the detection efficiency of flying needle testing is improved.
4. In the above scheme, a laser range finder is arranged above the probe and used for measuring the height of the plane where the corresponding PCB bad point is located, the condition of firing pin when the probe moves is avoided, the possibility of probe damage is reduced, and the production cost is reduced.
5. In the above scheme, the upper surface of the carrier plate is used as a horizontal table surface for bearing the PCB to be tested.
6. In the above scheme, the test camera and the positioning camera are both CCD cameras.
7. In the above solution, the positioning camera and the testing camera are arranged at intervals in the X-axis direction.
8. In the above scheme, the X-axis moving mechanism includes an X-axis slide rail, an X-axis slider, and an X-axis driving mechanism, the X-axis slider is driven by the X-axis driving mechanism and is slidably connected to the X-axis slide rail, and the Z-axis moving mechanism is positioned on the X-axis slider.
9. In the above scheme, the Y-axis moving mechanism includes a Y-axis slide rail, a Y-axis slider and a Y-axis driving mechanism, the Y-axis slider is driven by the Y-axis driving mechanism and is slidably connected to the Y-axis slide rail, and the X-axis moving mechanism is positioned on the Y-axis slider.
10. In the above scheme, the Z-axis moving mechanism includes a Z-axis slide rail, a Z-axis slider and a Z-axis driving mechanism, the Z-axis slider is driven by the Z-axis driving mechanism and is slidably connected to the Z-axis slide rail, and the base is positioned on the Z-axis slider.
11. In the above scheme, the Z-axis driving mechanism includes a servo motor.
The working principle of the utility model is as follows: the PCB to be tested is placed on the support plate, the PCB is photographed by a testing camera of the testing module, the Mark point on the PCB is visually positioned to position the product, and the NG Zone (bad area) coordinate is obtained. And then the probe is moved to the corresponding area to be detected through the matching of the X-axis moving mechanism and the Y-axis moving mechanism of the moving module. And then, photographing the outline of the PCB point at the bad position by a positioning camera on the positioning module, performing visual positioning analysis on the lower needle point, performing accurate positioning analysis, and judging whether the lower needle can be performed. Meanwhile, in the photographing and positioning process, the height of the plane where the PCB point at the bad position is located is measured through the laser range finder, and the height of the lower probe of the probe is determined. And then the probe is driven to move downwards by the Z-axis moving mechanism, and the probe is lowered to a PCB point at a bad position for detection.
Due to the application of the technical scheme, compared with the prior art, the utility model has the following advantages:
1. according to the utility model, the laser range finder is arranged above the probe and is used for measuring the height of the plane where the corresponding PCB bad point is located, so that the condition of firing pin when the probe moves is avoided, the possibility of probe damage is reduced, and the production cost is reduced.
2. The test module is provided with the test camera which is used for detecting products and determining the approximate range of bad points, and the test camera can also be used for photographing and analyzing indicating components such as LED lamps on a PCB (printed circuit board) to judge test results during flying probe test.
3. According to the utility model, the positioning camera is arranged in the positioning camera and used for accurately positioning the bad PCB points in the bad area and positioning the lower pin points of the probes, so that the accuracy of the lower pin positions of the positioning probes is improved, the PCB and the components on the PCB are effectively prevented from being punctured, and the detection efficiency of the flying pin test is improved.
Drawings
FIG. 1 is a front view of a flying probe testing device in accordance with an embodiment of the present invention;
FIG. 2 is a top view of a flying probe testing device in accordance with an embodiment of the present invention;
FIG. 3 is a side view of a flying probe test apparatus according to an embodiment of the present invention.
In the above drawings: 1. a frame; 2. a carrier plate; 3. an X-axis moving mechanism; 31. an X-axis slide rail; 4. a Y-axis moving mechanism; 41. a Y-axis slide rail; 5. a Z-axis moving mechanism; 51. a Z-axis slide rail; 52. a Z-axis slide block; 53. a servo motor; 6. a base; 7. a probe; 8. testing the camera; 9. positioning a camera; 10. laser range finder.
Detailed Description
The utility model is further described with reference to the following figures and examples:
example (b): improve flying probe testing arrangement of location needle inserting precision
Referring to the attached drawings 1-3, the device comprises a frame 1 and further comprises:
the bearing module is provided with a carrier plate 2 for bearing the PCB to be tested;
the moving module is correspondingly arranged above the horizontal table top of the machining device 1 and comprises an X-axis moving mechanism 3, a Y-axis moving mechanism 4, a Z-axis moving mechanism 5 and a base 6; the base 6 is mounted at the moving end of the Z-axis moving mechanism 5 and driven by the Z-axis moving mechanism 5 to move in the Z-axis direction; the Z-axis moving mechanism 5 is connected to the moving end of the X-axis moving mechanism 3, and the Z-axis moving mechanism 5 and the base 6 are driven by the X-axis moving mechanism 3 to move in the X-axis direction; the X-axis moving mechanism 3 is connected to the moving end of the Y-axis moving mechanism 4, and a structure that the Y-axis moving mechanism 4 drives the X-axis moving mechanism 3, the Y-axis moving mechanism 4 and the base 6 to move in the Y-axis direction is formed.
The X-axis moving mechanism 3 comprises an X-axis slide rail 31, an X-axis slide block and an X-axis driving mechanism, the X-axis slide block is driven by the X-axis driving mechanism and is connected to the X-axis slide rail 31 in a sliding mode, and the Z-axis moving mechanism 5 is positioned on the X-axis slide block. The Y-axis moving mechanism 4 comprises a Y-axis slide rail 41, a Y-axis slide block and a Y-axis driving mechanism, the Y-axis slide block is driven by the Y-axis driving mechanism and is connected to the Y-axis slide rail 41 in a sliding mode, and the X-axis moving mechanism 3 is positioned on the Y-axis slide block. The Z-axis moving mechanism 5 includes a Z-axis slide rail 51, a Z-axis slider 52, and a Z-axis driving mechanism, the Z-axis slider 52 is driven by the Z-axis driving mechanism and is slidably connected to the Z-axis slide rail 51, and the base 6 is positioned on the Z-axis slider 52. The Z-axis drive mechanism includes a servo motor 53.
The testing module comprises a probe 7 and a testing camera 8, wherein the probe 7 and the testing camera 8 are both positioned on the base 6; the probe 7 extends vertically downwards; the test camera 8 is arranged towards the horizontal table top;
the positioning module comprises a positioning camera 9 and a laser range finder 10, and both the positioning camera 9 and the laser range finder 10 are positioned on the base 6; the positioning camera 9 is arranged towards the horizontal table top; the laser range finder 10 is located right above the probe 7 and is arranged vertically downwards.
In this embodiment, the test camera 8 and the positioning camera 9 are both CCD cameras. The positioning camera 9 and the test camera 8 are arranged at a spacing in the X-axis direction.
The working process of the embodiment is as follows: the PCB to be tested is placed on the support plate 2, the PCB is photographed by the test camera 8, the Mark point on the PCB is visually positioned to position the product, and the NG Zone (bad area) coordinate is obtained. And then the probe 7 is moved to the corresponding area to be detected through the matching of the X-axis moving mechanism 3 and the Y-axis moving mechanism 4 of the moving module. And then, the outline of the PCB point at the bad position is photographed through a positioning camera 9 on the positioning module, and the pinpoint is placed through visual positioning analysis and precise positioning analysis to judge whether the pinpoint can be placed. Meanwhile, in the photographing positioning process, the height of the plane where the PCB point at the bad position is located is measured through the laser range finder 10, and the height of the lower needle of the probe 7 is determined. And then the probe 7 is driven by the Z-axis moving mechanism 5 to move downwards, and the probe is lowered to a PCB point at a bad position for detection. In the measuring process, the testing camera 8 analyzes the LED lamp on the PCB, if the lamp is on, the electrical performance of the PCB is good, the PCB enters the next procedure, if the lamp is not on, the PCB is judged to be a defective product and is discharged out of a production line.
The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.
Claims (8)
1. The utility model provides an improve flying probe testing arrangement of location needle inserting precision which characterized in that: the device comprises a frame (1) and further comprises:
the bearing module is provided with a bearing plate (2) for bearing the PCB to be tested;
the moving module is correspondingly arranged above the horizontal table top of the rack (1), and comprises an X-axis moving mechanism (3), a Y-axis moving mechanism (4), a Z-axis moving mechanism (5) and a base (6); the base (6) is arranged at the moving end of the Z-axis moving mechanism (5) and is driven by the Z-axis moving mechanism (5) to move in the Z-axis direction; the Z-axis moving mechanism (5) is connected to the moving end of the X-axis moving mechanism (3), and the Z-axis moving mechanism (5) and the base (6) are driven by the X-axis moving mechanism (3) to move in the X-axis direction; the X-axis moving mechanism (3) is connected to the moving end of the Y-axis moving mechanism (4) to form a structure that the Y-axis moving mechanism (4) drives the X-axis moving mechanism (3), the Y-axis moving mechanism (4) and the base (6) to move in the Y-axis direction;
a test module comprising a probe (7) and a test camera (8), the probe (7) and the test camera (8) both being located on a base (6); the probe (7) extends vertically downwards; the test camera (8) is arranged towards the horizontal table top;
the positioning module comprises a positioning camera (9) and a laser range finder (10), and the positioning camera (9) and the laser range finder (10) are both positioned on the base (6); the positioning camera (9) is arranged towards the horizontal table top; the laser range finder (10) is located right above the probe (7) and is vertically arranged downwards.
2. The flying probe test device for improving the precision of positioning and puncturing according to claim 1, wherein: the upper surface of the carrier plate (2) is used as a horizontal table surface for bearing the PCB to be tested.
3. The flying probe test device for improving the precision of positioning and puncturing according to claim 1, wherein: the test camera (8) and the positioning camera (9) are both CCD cameras.
4. The flying probe test device for improving the precision of positioning and puncturing according to claim 1, wherein: the positioning camera (9) and the test camera (8) are arranged at intervals in the X-axis direction.
5. The flying probe test device for improving the precision of positioning and puncturing according to claim 1, wherein: the X-axis moving mechanism (3) comprises an X-axis sliding rail (31), an X-axis sliding block and an X-axis driving mechanism, the X-axis sliding block is driven by the X-axis driving mechanism and is connected to the X-axis sliding rail (31) in a sliding mode, and the Z-axis moving mechanism (5) is located on the X-axis sliding block.
6. The flying probe test device for improving the precision of positioning and puncturing according to claim 1, wherein: the Y-axis moving mechanism (4) comprises a Y-axis sliding rail (41), a Y-axis sliding block and a Y-axis driving mechanism, the Y-axis sliding block is driven by the Y-axis driving mechanism and is connected to the Y-axis sliding rail (41) in a sliding mode, and the X-axis moving mechanism (3) is located on the Y-axis sliding block.
7. The flying probe test device for improving the precision of positioning and puncturing according to claim 1, wherein: the Z-axis moving mechanism (5) comprises a Z-axis slide rail (51), a Z-axis slide block (52) and a Z-axis driving mechanism, the Z-axis slide block (52) is driven by the Z-axis driving mechanism and is connected to the Z-axis slide rail (51) in a sliding mode, and the base (6) is located on the Z-axis slide block (52).
8. The flying probe testing device for improving the precision of positioning and puncturing according to claim 7, wherein: the Z-axis driving mechanism comprises a servo motor (53).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202122993542.1U CN217007585U (en) | 2021-12-01 | 2021-12-01 | Improve flying probe testing arrangement of location needle inserting precision |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202122993542.1U CN217007585U (en) | 2021-12-01 | 2021-12-01 | Improve flying probe testing arrangement of location needle inserting precision |
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| CN217007585U true CN217007585U (en) | 2022-07-19 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114942381A (en) * | 2022-07-21 | 2022-08-26 | 深圳市东方宇之光科技股份有限公司 | Flying probe testing machine and testing method based on cantilever type structure test circuit board |
| CN115737127A (en) * | 2022-11-30 | 2023-03-07 | 北京铸正机器人有限公司 | Detection device and detection method for positioning accuracy of tail end of surgical robot |
| CN117406068A (en) * | 2023-12-13 | 2024-01-16 | 合肥中航天成电子科技有限公司 | Ceramic envelope detection device and method |
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2021
- 2021-12-01 CN CN202122993542.1U patent/CN217007585U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114942381A (en) * | 2022-07-21 | 2022-08-26 | 深圳市东方宇之光科技股份有限公司 | Flying probe testing machine and testing method based on cantilever type structure test circuit board |
| CN115737127A (en) * | 2022-11-30 | 2023-03-07 | 北京铸正机器人有限公司 | Detection device and detection method for positioning accuracy of tail end of surgical robot |
| CN117406068A (en) * | 2023-12-13 | 2024-01-16 | 合肥中航天成电子科技有限公司 | Ceramic envelope detection device and method |
| CN117406068B (en) * | 2023-12-13 | 2024-02-20 | 合肥中航天成电子科技有限公司 | Ceramic envelope detection device and method |
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