JP5464468B2 - Substrate inspection device and inspection jig - Google Patents

Description

  The present invention relates to a board inspection apparatus and an inspection jig having an automatic alignment function for inspecting a wiring pattern by contacting a wiring pattern formed on a printed wiring board.

  Here, a mounting board on which ICs, capacitors, and resistors are already mounted is referred to as a circuit board, and a bare board on which ICs, capacitors, resistors, and the like are not yet mounted is referred to as a printed wiring board.

  And this invention is not restricted to a printed wiring board, For example, various substrates, semiconductor wafers, such as a flexible substrate, a multilayer wiring board, an electrode plate for a liquid crystal display and a plasma display, a package substrate for semiconductor packages, a film carrier, etc. It can be applied to the inspection of electrical wiring formed on the board. In this specification, these various wiring boards are collectively referred to as “substrates”.

Noto 2517277 gazette JP-A-5-302952 Japanese Patent No. 3313085 discloses that a reference mark on a substrate and a reference hole on the inspection jig are in contact with the inspection point of the wiring pattern to be inspected on the substrate in contact with the tip of the contact of the inspection jig. A configuration is disclosed in which an image is read by a camera, a displacement of those positions is detected, an abutment is canceled, the displacement is corrected, an abutment is performed again, and an inspection is performed.

  In Patent Document 2, a pair of cameras are inserted between the surface of the substrate and the surface on which the contact of the inspection unit is implanted, and the positioning mark on the surface of the substrate and that of the inspection unit are inserted by the pair of cameras. A configuration is disclosed in which the positioning marks on the surface are observed at the same time, and if they are not on the same optical axis, it is assumed that there is a displacement, and the inspection jig is moved to correct the displacement.

  Patent Document 3 is a main camera that reads a table positioning mark to determine a reference for coordinates, and further reads a substrate positioning mark to recognize the position of a substrate, and further, a jig is formed by an auxiliary camera held on a transfer table. A configuration for recognizing the position of an inspection jig by reading a positioning mark is disclosed. According to it, using the fact that the positional relationship between the main camera and the auxiliary camera is the intrinsic constant of the substrate inspection device, the positional relationship between the substrate and the inspection jig is calculated to calculate the positional deviation and to correct it. Thus, the alignment of the inspection point on the substrate and the contact of the inspection jig is achieved.

  In the alignment method according to the above patent document, the substrate positioning mark and the inspection jig positioning mark are commonly used, and the camera of the main body of the substrate inspection apparatus reads each mark, and the substrate, the inspection jig, The positional deviation is corrected by recognizing the relative positional relationship.

  In this method, the position of the inspection jig can be recognized and the optical alignment can be performed more easily and accurately than the method in which only the positioning mark on the substrate is read without positioning the inspection jig. it can.

  However, in the alignment methods disclosed in Patent Documents 1 to 3, the position where the inspection point of the substrate that easily produces PASS suitable for electrical inspection is aligned with the contact of the inspection jig at a position slightly shifted from the aligned position. May exist. Therefore, the vicinity of the position where the optical alignment has been performed is searched to check the conforming position of such an electrical inspection. If the conforming position is different from the position of the optical alignment, the conforming position is It was necessary to correct the inspection data of the substrate inspection apparatus so that the alignment target position was reached.

  The difference between the optical position of this optical alignment and the matching position suitable for electrical inspection is slight, but it differs depending on the individual inspection jig, and even for substrates with the same product name, it may be different for multiple inspection jigs. Yes, there was a case where PASS did not come out, and it was corrected by searching for an appropriate position.

  Therefore, when using multiple board inspection devices and multiple inspection jigs, it is necessary to correct the deviation from the compatible position each time the combination is changed. The time was getting longer.

  In the present invention, from the above viewpoint, a storage means is provided in each inspection jig, data relating to the alignment of the substrate inspection apparatus is recorded therein, and the data is read out, whereby the conformity position is confirmed and corrected once. An object of the present invention is to provide an inspection jig capable of reducing the setup time when changing the product name by using the stored data, and a substrate inspection apparatus including the inspection jig.

  It is another object of the present invention to provide a substrate inspection apparatus that can eliminate errors inherent to each substrate inspection apparatus by using a master scale that serves as a reference for the positions of all the substrate inspection apparatuses.

  In order to solve the above-described problems, an inspection jig according to the present invention is an inspection jig used in a substrate inspection apparatus for inspecting electrical characteristics of a wiring pattern of an inspection board. A plurality of inspection probes for inspecting the electrical characteristics of the wiring pattern of the inspection board by contacting the inspection points, a holding plate for holding the plurality of inspection probes, and data by the control device of the substrate inspection apparatus And a storage means for writing and reading.

  The inspection jig may be provided with a plurality of jig positioning marks provided on the holding plate for positioning the inspection jig when the inspection jig is attached to the substrate inspection apparatus.

  In the inspection jig, data representing the difference between the position of the substrate positioning mark in the substrate inspection apparatus and the position optically aligned from the jig positioning mark to the position suitable for the electrical inspection at the inspection point may be stored in the storage means. Good.

  In the inspection jig, inspection data for inspecting the inspection substrate using the inspection jig may be stored in the storage unit.

  In addition, a substrate inspection apparatus equipped with an inspection jig according to the present invention includes an inspection jig moving unit for moving the inspection jig, a substrate holding unit for holding the inspection substrate, and a master disposed on the substrate holding unit. A camera device that recognizes a position reference on the scale, and a control device that performs positioning using a mark indicating the position reference on the master scale recognized by the camera device as an origin of an optical alignment position of the substrate inspection device The control device writes the data representing the difference between the optical alignment position and the position suitable for the electrical inspection of the inspection point in a one-to-one correspondence with each inspection jig in the main storage unit or external storage means of the control device. And reading out and aligning and inspecting based on data representing the difference.

  In the board inspection apparatus, the storage means may be a removable or LAN-connected storage unit.

  In the substrate inspection apparatus, the scale may be a master scale made of a glass plate material.

  The substrate inspection apparatus further includes a reading and writing device including an antenna, and the storage means includes an antenna and a semiconductor memory, and data is contactlessly provided to the semiconductor memory of the storage means via the reading and writing device. Can be written and read.

  In the inspection jig, the storage means may include an antenna and a semiconductor memory, and data may be written to and read from the semiconductor memory of the storage means through a reading and writing device of the substrate inspection apparatus in a non-contact manner.

  In addition, a method of aligning the inspection jig in the substrate inspection apparatus is recognized by the camera device by the control device and the step of recognizing the reference of the position on the master scale arranged on the substrate holding unit. Positioning is performed using the mark indicating the reference of the position on the master scale as the origin of the optical alignment position of the substrate inspection apparatus, and the controller aligns the optical alignment position with the position suitable for the electrical inspection of the inspection point. The process of writing and reading the data representing the difference in a one-to-one manner with each inspection jig in the main storage unit or external storage means of the control device, and aligning the inspection jig based on the data representing the difference And a step of inspecting the inspection substrate.

According to the embodiment of the present invention, even when there are a plurality of types of substrate inspection apparatuses and a plurality of inspection substrates, data relating to inspection of the inspection substrate and the inspection jig can be directly written to and read from the storage means, and set up Is easy to operate. In some cases, the data stored in the control device in a lump may be mistaken, but such a mistake in data can be completely eliminated.

According to the embodiment of the present invention, even if there are a plurality of the same inspection jigs, individual error data can be read from the storage means of the inspection jigs, and the setup operation is simple and accurate.

According to the embodiment of the present invention, even when there are a plurality of the same inspection jigs, individual error data is handled one-to-one, and can be read from the main storage unit or storage means, and the setup operation is simple. is there.

According to the embodiment of the present invention , the storage of error data unique to each inspection jig can be operated in accordance with the mode of use, so that the setup operation is adapted to the field.

According to the embodiment of the present invention , the inherent error of the substrate inspection apparatus can be calibrated, so that the time for setting up the inspection jig can be shortened.

  As described above, according to the present invention, it is possible to shorten the substrate setup time in the substrate inspection apparatus when the inspection substrate once inspected by inspecting the position suitable for the electrical inspection is inspected again.

Further, according to the embodiment of the present invention, the data related to the inspection object and the type of the inspection jig are collated, the data such as the parameters stored in the storage means are automatically read, the inspection object is defective It is possible to check and display the location, shorten the time for switching the inspection object, and improve the efficiency of managing the maintenance time of the inspection jig.

  Further, the reliability of the inspection can be improved by handling the difference between the optical alignment position and the matching position of the electrical inspection as data depending on the individual inspection jig.

FIG. 1 is a side view showing a substrate inspection apparatus according to an embodiment of the present invention. FIG. 2 is an enlarged side view of a part of the inspection jig and the transfer table of the substrate inspection apparatus of FIG. FIG. 3 is a block diagram showing an outline of an electrical control system in the board inspection apparatus. FIG. 4 is an enlarged perspective view of a part of the inspection jig and the transfer table of the substrate inspection apparatus of FIG. FIG. 5 is a partially enlarged cross-sectional side view of the auxiliary camera holding unit and the auxiliary camera. FIG. 6 is an enlarged side view of a part of the inspection jig and the transfer table of the substrate inspection apparatus of FIG. FIG. 7A is a top view showing a state in which the inspection board is attached to the transfer table. FIG. 7B shows a see-through portion from above the holding plate of the plurality of inspection probes of the inspection jig and the inspection jig base plate. FIG. 8A is a conceptual diagram for explaining the positional deviation between the measurement position and the design position. FIG. 8B is a conceptual diagram for explaining a state in which the positional deviation between the measurement position and the design position is corrected. FIG. 8C is a conceptual diagram for explaining the positional deviation between the optical position where the positional deviation between the measurement position and the design position is corrected and the electrically compatible position. FIG. 9 is a flowchart of a process for aligning the inspection jig and the inspection substrate. FIG. 10 is a flowchart of another process for aligning the inspection jig and the inspection substrate. FIG. 11 is a diagram illustrating an example of how to use the correction data when the inspection jig is attached to the inspection apparatus (setup). FIG. 12 is a diagram for explaining an embodiment in which calibration is performed by using a master scale to share the reference for obtaining the error of the inspection apparatus and eliminate individuality between the inspection apparatuses. FIG. 13 is a simplified block diagram illustrating a customer-side board inspection apparatus system connected via a network.

  Below, based on an accompanying drawing, a substrate inspection device and an inspection jig concerning a desirable embodiment of the present invention are explained.

  In each attached drawing, the thickness, length, shape, interval between members, etc. are enlarged, reduced, deformed, simplified, etc. for easy understanding.

[Schematic configuration of substrate inspection equipment]
FIG. 1 is a side view showing a substrate inspection apparatus 1 according to an embodiment of the present invention. In the drawing, an orthogonal coordinate system based on XYZ axes is shown from the viewpoint of clarifying the moving direction of the transport table 20 and the first and second inspection jig moving units 30 and 40. In the Y-axis, the direction from the front side to the back side of the paper surface of FIG. In other drawings, directions are indicated based on an orthogonal coordinate system based on the XYZ axes.

  The substrate inspection apparatus 1 includes a substrate moving unit 60 for moving the transfer table 20 along the X axis, and inspection jigs 32 and 42 to which the substrate inspection probe 35 is attached are moved in the YZ plane. 1 and the 2nd inspection jig moving parts 30 and 40 are provided. The first and second inspection jig moving parts 30 and 40 are arranged symmetrically with respect to the XY plane.

  The transfer table 20 includes a substrate holding portion 22 for placing the inspection substrate 21 and a cylindrical bracket 63 fixed to the lower surface thereof. The cylindrical bracket 63 is formed with a screw hole penetrating in the longitudinal direction. Further, the transfer table 20 includes an auxiliary camera holding unit 22a for holding an auxiliary camera 55 (FIG. 4) for specifying the positions of the inspection jigs 32 and 42, as will be described later.

  The substrate moving unit 60 includes a ball screw 62 that is screwed into a screw hole of the bracket 63, and a drive unit 61 that rotates the ball screw 62. The threads and thread grooves on the ball screw 62 are not shown for simplicity. When the ball screw 62 is rotated by the drive unit 61, the amount and direction of movement of the bracket 63, that is, the direction along the X axis of the transport table 20 are determined according to the amount and direction of rotation.

  The first inspection jig moving unit 30 includes an inspection jig holding unit 33. The inspection jig holding unit 33 holds an inspection jig 32 to which a plurality of probes 35 for substrate inspection are attached. The inspection jig 32 is moved so that the plurality of probes 35 for substrate inspection are brought into contact with the inspection points of the wiring pattern to be inspected on the inspection substrate 21. Further, a plurality of probes 35 for substrate inspection are electrically connected to the scanner 14 for inspection and measurement of the substrate (FIG. 3) via the inspection jig holding portion 33.

  Further, the second inspection jig moving part 40 includes an inspection jig holding part 43 similar to the inspection jig holding part 33 of the first inspection jig moving part 30, and the inspection jig holding part 43. Functions in the same manner as the inspection jig holding portion 33.

  Control of movement between the first and second inspection jig moving units 30 and 40 and the substrate moving unit 60 is performed by the control device 11 (FIG. 3) of the substrate inspection apparatus 1.

  Further, main cameras 34 and 44 for specifying the positions of the inspection substrate 21 and the transfer table 20 are attached to the first and second inspection jig moving units 30 and 40, respectively.

  Although not shown, an antenna of the reading and writing device 38 shown in FIG. 3 is arranged near each of the inspection jigs 32 and 42, and is stored in the storage means 37 of the inspection jigs 32 and 42 described later. Data can be written and read.

  FIG. 2 is a schematic side view for explaining the inspection jig 32 of the first inspection jig moving unit 30 of the substrate inspection apparatus 1 in FIG.

  A plurality of inspection probes (contacts) 35 are attached to the inspection jig 32, but FIG. 2 schematically shows only two inspection probes 35. In the figure, “...” Simply indicates that other inspection probes are omitted. In addition, storage means 37 is arranged inside.

  The inspection jig 32 is held by an inspection jig holding unit 33 connected to a Y-axis drive unit, a Z-axis drive unit, and a θ drive unit that conceptually represents the function of the inspection jig moving unit 30, and will be described later. The control device 11 (FIG. 3) moves in the Y-axis direction and the Z-axis direction and rotates by a predetermined angle (∠θ). The transfer table 20 is connected to the X-axis drive unit, and is similarly moved in the X-axis direction by a control device 11 (FIG. 3) described later. The main camera 34 is fixed to the Y-axis drive unit.

  In FIG. 2, the configuration of the control drive unit is the X-axis, Z-axis, θ, and Y-axis drive units from the bottom, but the combination may be changed.

  A table positioning mark 26 is provided on the auxiliary camera holding portion 22a of the substrate holding portion 22, and the position is used as a reference position on the XYZ coordinate axes of the substrate inspection apparatus. Based on this, the positions of the inspection substrate 21 and the inspection jig 32 are specified.

  That is, by design, the distance between the table positioning mark 26 and the substrate positioning marks 2A and 2B (FIG. 6) is clear in advance. Therefore, the positions of the substrate positioning marks 2A and 2B can be calculated from the position of the table positioning mark 26.

  The inspection jig 32 is provided with jig positioning marks 36A and 36B. Since the distance between the table positioning mark 26 and the position of the optical axis (“L” shown in FIG. 5) of the auxiliary camera 55 described later is clear in advance, the position of the inspection jig 32 is determined based on the position of the table positioning mark 26. The position can be specified.

  In FIG. 2, the table positioning mark 26 and the jig positioning marks 36 </ b> A and 36 </ b> B are shown as being implanted with pin-shaped objects, but can be recognized by a main camera 34 and an auxiliary camera 55 described later. If present, the surface similar to the substrate positioning mark 2A is preferably a flat surface.

  The jig positioning marks 36A and 36B are read by the auxiliary camera 55 (FIG. 5) attached to the auxiliary camera holding portion 22a, and the table positioning mark 26 and the board positioning mark 2A of the inspection board 21 are read by the main camera 34.

  Data such as the position of the inspection jig 32 on the XYZ coordinate axes obtained from the data read by the main camera 34 and the auxiliary camera 55 is stored in a main storage unit (not shown) of the control device 11.

  FIG. 3 is a block diagram showing an outline of an electrical control system in the substrate inspection apparatus 1. As shown in the figure, the substrate inspection apparatus 1 includes a control device 11, which includes a storage means 37 of an inspection jig 32, an X, Y, Z, θ drive system, an operation panel 12, and a tester. A controller 13, a scanner 14, and an image processing unit 15 are connected. The storage means 37 is provided with an antenna and a semiconductor memory. The control device 11 is connected to a reading and writing device 38 that can write and read predetermined data to and from the semiconductor memory of the storage means 37 without contact. The control device 11 can write predetermined data to the storage means 37 and read necessary data from the storage means 37 via the reading and writing device 38. As data, the identification number of the inspection jig, the identification number of the inspection device that has been confirmed to be the combination of the inspection jig, various parameters, data for workpiece setting, alignment data, correction mark position data, defect location data, inspection There are data regarding actual replacement or scheduled time, but it is not limited thereto.

  The main camera 34 reads the table positioning mark 26 on the auxiliary camera holding part 22a fixed to the board holding part 22 and the board positioning marks 2A and 2B on the inspection board 21, and the auxiliary camera 55 reads the jig. When the positioning marks 36 </ b> A and 36 </ b> B are read, the respective center positions are processed by the image processing unit 30, converted into position data, and stored in the main storage unit of the control device 11.

  The operation panel 12 functions as an interface for an operator to operate the substrate inspection apparatus 1.

  When the tester controller 13 and the scanner 14 perform an inspection by bringing the inspection probe 35 of the inspection jig 32 into contact with the wiring pattern to be inspected on the inspection substrate 21, the tester controller 13 and the scanner 14 are connected between the inspection probe 35 and the control device 11. This is used to control transmission / reception of signals.

  As will be described later in detail, the storage means 37 relates to identification numbers of the substrate inspection apparatus 1, inspection jig 32, and inspection substrate, values for correcting the position of electrical inspection described later, and the inspection jig 32. Inspection data and the like are stored.

  4 to 6 are more detailed perspective views or side views for explaining the inspection jig 32 and a part of the substrate holding part 22 shown in FIG.

  As shown in FIG. 4, the board holding portion 22 is provided with three engagement pins 53, and the side surface of the inspection board 21 is engaged with them, and is illustrated from the direction facing the engagement pins. By urging the inspection substrate 21 toward the engagement pin 53 by the urging means, the inspection substrate 21 is held at an appropriate position on the substrate holding portion 22. Thus, the distance from the position of the table positioning mark 26 to the substrate positioning marks 2A and 2B is predetermined in design.

  A through opening 54 is formed in the substrate holding part 22, and the circuit pattern on the lower surface of the held inspection substrate 21 is inspected by the inspection jig 42 therefrom.

  An auxiliary camera 55 is attached to the auxiliary camera holding part 22a, and thereby jig positioning marks 36A and 36B (only 36A shown in FIG. 4) formed on the inspection jig 32 are imaged. The auxiliary camera 56 provided in parallel with the auxiliary camera 55 is used to image the jig positioning mark of the inspection jig 42 in the −Z direction. Since the auxiliary cameras 55 and 56 have the same configuration, the configuration of the auxiliary camera 55 will be described here, and the description of the configuration of the auxiliary camera 56 will be omitted.

  As shown in FIG. 5, the auxiliary camera 55 includes an illumination unit 551 on the upper surface 52a of the auxiliary camera holding unit 22a. The illumination unit 551 includes an external metal cylinder 551a whose inner surface reflects light and an internal light diverging portion 551b made of a transparent material such as acrylic resin or glass. The light generated from the light source 551c passes through the light guide portion 551d made of a material such as glass fiber, reaches the internal light divergence portion 551b, is diverged by the internal light divergence portion 551b, and further the internal light divergence portion. The light is diffused at the upper end of 551b to be ring-shaped light, which is irradiated toward the jig positioning marks 36A and 36B. The center of the illumination unit 551 coincides with the optical axis L of the auxiliary camera 55.

  In addition, inside the auxiliary camera holding unit 22a, light incident from the illumination unit 551 into the auxiliary camera holding unit 22a is imaged on the CCD 556 via the lens 555.

  Therefore, when the jig positioning marks 36A, 36B of the inspection jig 32 are arranged immediately above the illumination unit 551 and the centers of the jig positioning marks 36A, 36B coincide with the focal point of the auxiliary camera 55, the auxiliary camera 55 Thus, images of the jig positioning marks 36A and 36B are obtained.

  Similar to the auxiliary camera 55, the main camera 34 also includes an objective lens and a CCD for imaging.

  FIG. 6 is a schematic perspective view showing a state in which the inspection substrate 21 is placed on the substrate holding unit 22. The inspection substrate 21 is held at a predetermined position on the substrate holding part 22 by the engagement pins 53 and urging means (not shown). The main camera 34 is positioned immediately above the mark in order to detect the substrate positioning mark 2A.

  Next, optical alignment will be described based on FIGS. 7A and 7B.

  FIG. 7A shows a state in which the inspection substrate 21 is attached to the transfer table 20. The inspection board 21 is held at an appropriate position by three engagement pins 53 and urging means (not shown).

  First, the table positioning mark 26 moves directly below the main camera 34 and reading is performed by the main camera 34. The measurement position is stored in the main storage unit (not shown) of the control device 11 by X and Y in the XY coordinate system by the control device 11. Further, the measurement position is compared with the design coordinate position to calculate a difference (deviation) (Xdn, Ydn), and the value of the difference is stored in the main storage unit as the first difference (Xd1, Yd1). The The measurement position is corrected based on the first difference, and the corrected position is used as a reference position of the substrate inspection apparatus. This error exists as an eigenvalue in the main body of the substrate inspection apparatus 1.

  Next, as shown in FIG. 6, the transfer table 20 is moved to place the substrate positioning mark 2 </ b> A directly below the main camera 34, and the main camera 34 reads the substrate positioning marks 2 </ b> A and 2 </ b> B. The position where the main camera 34 has moved from the table positioning mark 26 to the substrate positioning marks 2A and 2B can be obtained as X and Y coordinate values. On the other hand, the moving distance from the position of the table positioning mark 26 to the substrate positioning mark 2A is clear in design. Therefore, the difference between the measurement position and the design position is obtained as the second difference. The second difference (Xd2, Yd2) is stored in the main storage unit. When the position of the inspection substrate 21 is specified by the polar coordinate system from the position of each mark, the second difference is represented by X, Y, and θ in the polar coordinate system. The main cause of this error is a processing error of the outer diameter processing of the inspection substrate 21. Therefore, the magnitude of the error differs depending on each inspection board 21.

  Then, the test board 21 is corrected by correcting the drive amounts of the X-axis drive unit, the Y-axis drive unit, and the θ-drive unit so as to correct the position using the second difference (Xp, Yp, ∠θp). The positional deviation from the design position can be corrected.

  FIG. 7B is a perspective view of the holding plate 32H of the plurality of inspection probes 35 of the inspection jig 32 as viewed from above the inspection jig base plate 32B. Here, only two inspection probes 35 are shown in a simplified manner. Two positioning holes 32f for attaching the inspection jig 32 to the first inspection jig holding portion 33 are formed in the inspection jig base plate 32B, and pins ( Mechanical positioning is performed by inserting (not shown).

  However, it is difficult to remove a mechanical fixing repetition error, and an error may occur when the members are connected when the inspection jig 32 is assembled. This error varies every time the inspection jig 32 is mounted on the main body of the substrate inspection apparatus 1.

  In order to detect such a mechanical error related to the inspection jig 32, first, as shown in FIG. 4, the transfer table 20 is moved directly below the main camera 34, and the main camera 34 moves the substrate holder. 22, the table positioning mark 26 is read, and the read position is set as a reference point (X0, Y0). Next, the transfer table 20 is moved to position the opening of the illumination unit 551 on the upper surface 52a of the auxiliary camera 55 as a jig. The jig positioning mark 36 </ b> A is read by the auxiliary camera 55 after moving directly below the mark 36 </ b> A.

  Since the auxiliary camera 55 and the table positioning mark 26 are in a fixed positional relationship, the position of the jig positioning mark 36A can be represented by the X and Y coordinate points from the reference point (X0, Y0).

  Further, since there are at least two jig positioning marks such as 36A and 36B, the plane positions of these marks are converted into polar coordinates X, Y, and θ, and the design positions specified at the design stage based on the converted positions. To calculate the positional deviation (Xj, Yj, ∠θj).

  The positional deviation (Xj, Yj, ∠θj) can be removed by correcting and controlling the drive amounts of the X-axis drive unit, the Y-axis drive unit, and the θ drive unit.

  However, a relative shift such as a hole processing error between the jig positioning marks 36A and 36B on the holding plate 32H of FIG. 7B and the plurality of inspection probes 35 is slight but remains.

  The jig positioning marks 36A and 36B are preferably held on the holding plate 32H, but may be fixed elsewhere in the inspection jig 32.

  FIG. 8A shows how the read images deviate from the design center at the design stage when the substrate positioning mark 2A and the jig positioning mark 36A are read by the main camera 34 and the auxiliary camera 55, respectively. It is a figure for demonstrating whether it exists.

  When the main camera 34 reads the substrate positioning mark 2A, in FIG. 8A, the intersection of the horizontal straight line Xs and the vertical straight line Ys actually indicates the center of the substrate positioning mark 2A. On the other hand, the intersection of the other horizontal line Xr and the vertical line Yr is the design center. As described above, the positional deviation Xd2 along the X linear direction and the positional deviation Yd2 along the Y linear direction represent the positional deviation between the two.

  When the jig positioning mark 36A is read by the auxiliary camera 55, in FIG. 8A, the intersection of the horizontal straight line Xs and the vertical straight line Ys actually indicates the center of the jig positioning mark 36A. On the other hand, the intersection of the other horizontal line Xr and the vertical line Yr is the design center. As described above, the positional deviation Xd3 along the X linear direction and the positional deviation Yd3 along the Y linear direction represent the positional deviation between the two.

  In FIG. 8B, the horizontal lines Xr and Xs overlap, and the vertical lines Yr and Ys also overlap. From these, it can be seen that the center of the mark actually measured coincides with the design center. This is a result of controlling the transport table 20 and the inspection jig moving unit 30 so as to correct the above-described positional deviation.

  However, when the alignment is performed as described above, when the electrical inspection is performed by mechanically scanning the periphery of the optical position where the optical alignment has been performed, a compatible position that fits electrically at a position slightly deviated from the optical position. May be found.

  FIG. 8C is a diagram for illustrating a state in which there is a shift between the optical position in which the position shift is corrected and the matching position determined as a result of the electrical inspection, as illustrated in FIG. 8B. As shown in the figure, the intersection of the horizontal straight line Xc and the vertical straight line Yc indicates the conforming position of the electrical inspection, and the conforming position and the optical position corrected for misalignment as shown in FIG. Between the correction amount Xaj in the X linear direction and the correction amount Yaj in the Y linear direction. Those values are stored in the main storage unit and the storage means 37 as a correction value as the fourth difference. At that time, the control device 11 writes correction value data into the semiconductor memory of the storage means 37 via the antenna of the reading and writing device 38 arranged near the storage means 37.

  The correction value specifies errors from the optical alignment positions of the jig positioning marks 36A and 36B, the plurality of inspection probes 35, and the inspection substrate 21.

  FIG. 9 shows various steps in obtaining the positional deviation value and the correction value of the first to fourth differences.

  The process of FIG. 9 is performed when a new inspection jig 32 and inspection substrate 21 are set in the substrate inspection apparatus 1. In the figure, first, as shown in step S10, an identification symbol, a product name and the like for specifying the inspection board 21 to be set are input from the operation panel 12.

  Next, as shown in step S <b> 20, the inspection jig 32 corresponding to the specified product name is mounted on the inspection jig holding portion 33.

  In step S30, the operation panel 12 is operated to start the alignment process of the inspection jig 32 in order to correct the positional deviation when the inspection jig 32 is mounted. That is, first, the control device 11 of the board inspection apparatus 1 automatically starts the correction function, moves the transport table 20, reads the table positioning mark 26 by the main camera 34, performs image processing, and determines the measurement position. Ask. A first difference is obtained by comparing the measured value with the design position, and a reference point of the XY axis coordinate system is obtained in consideration of the difference (Xd1, Yd1). The first difference data is stored in the main storage unit.

  Next, the conveyance table 20 is moved, and the auxiliary camera 55 reads the plurality of jig positioning marks 36A and 36B and performs image processing to specify the position of the inspection jig 32, that is, the position of the inspection probe 35.

  The amount of difference between the specified position and the design position is the positional deviation (Xd3, Yd3) as the third difference. After confirming the positions of the plurality of marks, the marks are converted into a planar polar coordinate system (X, Y, ∠θ). The positional deviation (Xd3, Yd3) is also calculated as a positional deviation (Xj, Yj, ∠θj) in the polar coordinate system. The third difference data is stored in the main storage unit.

  By controlling the movement of the transport table 20 and the inspection jig moving unit 30 so as to correct the actually measured position using the positional deviation data, the measured value of the auxiliary camera 55 is matched with the design value.

  Next, in step S40, a new inspection substrate 21 is set on the transfer table 20, and the operation panel 12 is operated to start the alignment process of the inspection substrate 21.

  Thereby, the substrate inspection apparatus 1 automatically starts the next process. That is, first, by moving the transport table 20, the main camera 34 reads the plurality of substrate positioning marks 2A and 2B, performs image processing, specifies the position of the inspection substrate 21, and compares it with the design value, thereby inspecting the inspection substrate. A positional shift (Xp, Yp, ∠θp) as a second difference in the polar coordinate system of 21 is obtained.

  Next, the positional deviation (Xj, Yj, ∠θj) of the second difference of the inspection jig 32 previously obtained and stored in the storage unit 37 is added to the positional deviation (Xp, Yp, ∠θp). Then, since the relative deviation amount can be obtained, the position correction value is obtained thereby and stored in the main storage unit of the control device 11. However, in relation to the correction position when the position of the inspection jig 32 has already been corrected, it is sufficient to consider only the second difference. The second difference data is stored in the main storage unit.

  As described above, if the movement between the transport table 20 and the inspection jig moving unit 30 is controlled based on the corrected position, the positional deviation between the inspection substrate 21 and the inspection jig 32 can be eliminated. This completes the optical alignment.

  In step S50, the tip of the inspection probe 35 of the inspection jig 32 is brought into contact with the inspection point of the wiring pattern to be inspected on the inspection substrate 21, and the electrical inspection of the inspection substrate 21 is performed to determine whether the inspection is good or not. Then, it scans the periphery of the optical position for which the above optical alignment has been completed to search for an electrically compatible position, and finds a compatible position suitable for electrical inspection at a position different from the optical position. The difference in position (Xaj, Yaj, ∠θaj) is obtained as the fourth difference and stored in the main storage unit and the storage means 37, and based on the value, the movement of the inspection jig 32 and the transport table 20 is moved. By being controlled by the control device 11, it is possible to directly align with the matching position.

  In step S60, the inspection substrate 21 is inspected with the matching position as the target position for alignment.

  The difference (Xaj, Yaj, ∠θaj) between the fitting position and the optical position is slightly different depending on each inspection jig 32. This main factor is an inherent characteristic value at the time of manufacture of the inspection jig 32 such as member hole machining. Therefore, the error of each inspection jig 32 can be obtained by converting it into data and handling the inspection jig 32 on a one-to-one basis. The characteristic correction value (fourth difference) can be used. Therefore, as will be described later with reference to FIG. 10, by using these correction values, it is possible to easily perform the subsequent work of changing the inspection board 21.

  FIG. 10 shows a flowchart of a process when the inspection substrate 21 is replaced with the inspection substrate 21 previously inspected for another inspection target. However, steps S11 and S21 in FIG. 10 are the same as S10 and S20 in FIG.

  In step S31, first, the substrate inspection apparatus 1 accesses the storage means 37 of the inspection jig 32 by the reading and writing device 38, and reads the identification data of the inspection jig 32 and the inspection substrate 21 stored therein. . If they match the inspection jig 32 incorporated in S11, the fourth difference data stored therein is read out and stored in the main storage unit.

  Thereafter, similarly to step S30, the table positioning mark 26 is read by the main camera 44 to obtain the measurement position. The measurement position is corrected based on the first difference data to obtain the reference position.

  Then, the jig positioning marks 36A and 36B are read by the auxiliary camera 55 to obtain their measurement positions, and their correction positions are obtained based on the third difference data.

  In step S41, the corresponding inspection board is attached in the same manner as in step S40, the board positioning marks 2A and 2B are read by the main camera 34, their measurement positions are obtained, and the corrections are made based on the second difference data. Find the position.

  In step S51, the electrical matching position is corrected by adding the fourth difference read in step S31 to the optical position specified based on the correction positions of the jig positioning marks 36A and 36B and the substrate positioning marks 2A and 2B. Ask.

  In step S61, an electrical inspection of the inspection substrate 21 is performed.

  As described above, in the process of FIG. 10, in step S31 to step S51, the correction value of the fourth difference already stored in the storage means 37 is read out, the correction position is obtained based on it, and the electrical adaptation of the inspection point is performed. Seeking the position.

  As described above, in the above-described embodiment, the third to fourth data, which are data related to the inspection jig 32 of the inspection substrate 21, are stored in the storage unit 37 of each inspection jig 32 by the reading and writing device 38. The correction value for the difference can be written and updated. In the subsequent steps, in the case of the inspection jig 32 and the inspection substrate 21 that have already been inspected, those data may be read out and used, so that the suitable position search step can be omitted or simplified. .

  FIG. 11 is a diagram showing an example of how to use the correction data 115, 116, 117 and the like when attaching the inspection jig 110 to the inspection apparatus (setup). The correction data 115 and the like are different between when the inspection jig 110 is attached to a certain inspection apparatus and when the inspection jig 110 is attached to another inspection apparatus. The reason why such a difference occurs is that, as described above, the inspection apparatus and the inspection jig may include errors due to deviating from the design values during processing and assembly.

  As shown in FIG. 11, when the inspection jig 110 is incorporated into a certain inspection device, the control device 11 (FIG. 3) of the inspection device uses the reading and writing device 38 to store the storage means 37 of the inspection jig 110. From the data stored in (FIG. 3), it is searched whether or not there is a combination of the inspection jigs 110 in those inspection apparatuses in the past. Read data on 3rd and 4th differences.

  Based on the third difference, the control device 11 corrects the positional error of the jig positioning marks 36A and 36B with respect to the inspection jig 110 related to the combination. Further, based on the fourth difference, the error of the electrical matching position of the inspection point is corrected. In this way, the error is individually corrected for each combination of the inspection apparatus and the inspection jig 110.

  FIG. 12 shows an example in which calibration is performed by using a master scale (MASTER SCALE) 120 to standardize the measurement of the substrate inspection apparatus and remove the inherent error of each substrate inspection apparatus.

  The master scale 120 is a scale having a plate shape made of glass, for example. When a glass plate is used, an error due to expansion or contraction is unlikely to occur without being affected by changes in temperature and humidity. Therefore, the master scale of the glass plate is desirable as a scale serving as a position reference.

  On the master scale 120, orthogonal vertical lines and horizontal lines are drawn at equal intervals, respectively, so that it is easy to specify the position of a predetermined part that serves as a reference for the position of the substrate inspection apparatus.

  In performing calibration, first, the master scale 120 is disposed at a position where the inspection substrate of the substrate inspection apparatus is fixed, for example, at the substrate holding unit 22. Next, the main camera 34 measures a predetermined position of the master scale 120, for example, one intersection of a predetermined vertical line and horizontal line, and determines the position as the origin of the inspection apparatus. With this as a reference, all positions of the inspection apparatus can be represented by XY values in the XY coordinate system.

  As described above, when the reference is made common, the position of each part of the inspection apparatus can be specified based on the predetermined position of the master scale 120 in any inspection apparatus. That is, after the calibration of the substrate inspection apparatus is performed, when the substrate is placed on the substrate holding unit 22, a predetermined position on the substrate can be specified with reference to the origin after calibration.

  In FIG. 12, calibration from # X1 to # X5 is performed using a master scale 120 for five substrate inspection apparatuses (not shown). Thereby, errors from ΔX1ΔY1 to ΔX5ΔY5 can be obtained for each substrate inspection apparatus. Since these errors are relative errors of the inspection apparatus with respect to the master scale 120, it is not necessary to obtain an error with respect to the design value in each inspection apparatus.

  In FIG. 12, when setting up an inspection jig having a predetermined ID in each inspection apparatus, as described above, the position of the position is considered in consideration of errors of ΔX1ΔY1 to ΔX5ΔY5 that are relative errors of the inspection apparatus with respect to the master scale 120. You only have to make corrections.

  Note that the error measured using the master scale 120 can also be used for the error measured using another master scale (NEXSIV). This is because the master scale itself does not cause an error, and it is sufficient to obtain the correlation between the master scales in advance. Therefore, when an error is obtained using one master scale, the error may be corrected using the correlation with the other master scale. Such correction can be used when a company that provides a substrate inspection apparatus corrects an error using a master scale and then reconfirms the error using another master scale on the customer side.

[Board inspection system]
FIG. 13 shows a customer-side board inspection apparatus system 300 connected via a network. In the substrate inspection apparatus system 300, substrate inspection apparatuses (GATS78XX # 1, GATS221X # 1, GATS222X # 1) 310, 320, and 330 are connected to the lines branched from the nodes 151, 152, 153, and 154 of the line 350, respectively. Has been. The line 350 is further connected with a failure analysis stage 340 of a jig maintenance stage. On the other hand, the supplier 200 of the board inspection apparatus and the inspection jig provides the customer with inspection conditions such as net data and map data stored in the storage device FD, type data of the inspection apparatus, and specific data of the inspection jig. Etc. are provided.

  As shown in FIG. 13, at the time of substrate inspection, for example, information such as the pattern thickness on the inspection substrate is transmitted from the substrate inspection apparatus 310 via the line 350 to the defect analysis stage 340 of the jig maintenance stage. Sent to the data server. From the defect analysis stage 340 of the jig maintenance stage, information such as the design value and calculation formula of the pattern resistance value is transmitted to the substrate inspection apparatus 310 and the like.

  After the board inspection apparatus 310 or the like is attached to the customer side, the master scale 120 may be attached to the board inspection apparatus 310 and the apparatuses may be calibrated. As a result, appropriate calibration can be performed even on the objective side.

  In FIG. 13, the storage device displaying “ID” corresponds to the storage unit 37 described above. As in the previous embodiments, data such as the model can be written in advance in the storage device. In addition, data can be written and read out in a non-contact manner using a device corresponding to the reading and writing device 38 as in the above embodiment.

[Other Embodiments]
In the above embodiment, the first to fourth difference data is stored in the main storage unit of the control device of the substrate inspection apparatus or the storage means of the inspection jig, but all the difference data is stored in the main storage unit. In addition, only necessary data may be stored in the storage means of the inspection jig.

  In addition, although the embodiment in which the first to fourth difference data is converted from the XY coordinate system to the polar coordinate system has been described, the calculation process can be performed with the data displayed in the XY coordinate system.

  Instead of the above embodiment, a transceiver may be provided in the inspection jig 32 and the substrate inspection apparatus 1.

  In the above embodiment, data is written to or read from the storage unit 37 by the reading and writing device 38 in a non-contact manner. Thereby, parts such as cables and connectors for transmitting and receiving data between the storage means and the control device 11 can be eliminated. However, depending on the amount of data transmitted and received, instead of that, a contact point between the storage means 37 and the reading and writing device 38 may be provided to read and write data by a contact method. Further, data transmission / reception may be performed by directly connecting an optical fiber cable for data communication to the storage means 37. In that case, the reliability of data communication resistant to noise can be ensured.

  The storage means 37 is attached to the inspection jig 32 and stored, and when the inspection jig 32 is mounted on the substrate inspection apparatus 1, the storage medium in the storage means 37 is directly set in the control device 11 of the substrate inspection apparatus 1. The stored data may be read out. For example, when the storage medium of the storage means 37 is a portable storage medium such as a flexible disk of a general-purpose storage medium, such use is possible.

  The control devices 11 of the plurality of board inspection apparatuses 1 are connected to a LAN, and the data stored in the storage means 37 provided in the inspection jig 32 of each board inspection apparatus 1 is collectively collected in a server connected thereto. May be saved. Further, in this case, the storage means 37 of each inspection jig 32 is eliminated, and data is directly stored in the server from the control device 11, or the control device 11 directly reads out the corresponding data from the server. Good.

  If the number of substrate inspection apparatuses 1 is not large, the main storage unit of the control apparatus 11 may be used without using a LAN server.

  Furthermore, by operating the operation panel 12, both common inspection data such as wiring data of the inspection board 21 and unique data regarding individual inspection jigs such as correction values can be written and read, and data selection and reading can be performed. The complexity of the work can be eliminated.

  Moreover, although the example which used the board | plate material made from glass as a master scale was shown, if it is a raw material which is hard to receive the change of an environment like a change of temperature, humidity, etc., you may use the board | plate material of other materials.

  As mentioned above, although several embodiment of the inspection jig for substrate inspection concerning the present invention was described, the present invention is not restrained by those embodiments, addition, deletion which those skilled in the art can easily carry out, It should be understood that modifications and the like are included in the present invention, and that the technical scope of the present invention is defined by the description of the appended claims.

DESCRIPTION OF SYMBOLS 1 ... Board | substrate inspection apparatus 2A, 2B ... Board | substrate positioning mark 11 ... Control apparatus 20 ... Transfer table 21 ... Inspection board 22 ... Board | substrate holding part 26 ... Table positioning mark 30. .... First inspection jig moving part 32 ... Inspection jig 34 ... Main camera 35 ... Inspection probes 36A, 36B ... Jig positioning mark 37 ... Storage means 38 ... Reading and writing device 40 ... second inspection jig moving unit 55 ... auxiliary camera 110 ... inspection jig 112 ... storage means 115, 116, 117 ... correction data 120 ... Master scale 300 ... Board inspection system

Claims (10)

An inspection jig used in a substrate inspection apparatus for inspecting electrical characteristics of a wiring pattern of an inspection substrate,
A plurality of inspection probes for inspecting the electrical characteristics of the wiring pattern of the inspection board in contact with inspection points on the wiring pattern of the inspection board;
A holding plate for holding the plurality of inspection probes;
A plurality of jig positioning marks provided on the holding plate for positioning the inspection jig when the inspection jig is attached to the substrate inspection apparatus;
Storage means for writing and reading data by the control device of the substrate inspection apparatus,
The storage means stores data representing a difference between a position that is optically aligned from the substrate positioning mark in the substrate inspection apparatus and a position that is optically aligned from the jig positioning mark, and a position that is suitable for electrical inspection at the inspection point. Ingredients.   The inspection jig according to claim 1, wherein inspection data for inspecting an inspection substrate using the inspection jig is stored in the storage unit.   2. The inspection jig according to claim 1, wherein the storage means includes an antenna and a semiconductor memory, and data is written to and read from the semiconductor memory of the storage means in a non-contact manner via a reading and writing device of the substrate inspection apparatus. Inspection jig is performed. An inspection jig for inspecting the electrical characteristics of the wiring pattern of the inspection board;
An inspection jig moving part for moving the inspection jig;
A substrate holding unit for holding the inspection substrate;
A camera device for recognizing a reference of a position on a master scale arranged in the substrate holding unit;
A controller that performs positioning using a mark indicating a reference of a position on the master scale recognized by the camera device as an origin of an optical alignment position of the substrate inspection device;
The inspection jig holds a plurality of inspection probes for inspecting electrical characteristics of the wiring pattern of the inspection board by contacting an inspection point on the wiring pattern of the inspection board, and the plurality of inspection probes And a storage means for writing and reading data by the control device of the substrate inspection apparatus,
The control device stores data representing a difference between an optical alignment position and a position suitable for electrical inspection of the inspection point in a one-to-one relationship with each inspection jig in the main storage unit or the storage unit of the control device. A substrate inspection apparatus that performs writing and reading on and aligns and inspects based on data representing the difference.   5. The substrate inspection apparatus according to claim 4, wherein the storage means is a removable or LAN-connected storage unit.   5. The substrate inspection apparatus according to claim 4, wherein the master scale is made of a glass plate material.   5. The substrate inspection apparatus according to claim 4, further comprising a reading and writing device including an antenna, and wherein the storage means includes an antenna and a semiconductor memory, and the semiconductor of the storage means via the reading and writing device. A substrate inspection apparatus for writing and reading data in and out of memory. A method for aligning an inspection jig in the substrate inspection apparatus according to claim 4,
Recognizing a reference of a position on a master scale arranged in the substrate holder by the camera device;
Positioning by the control device using a mark indicating the reference of the position on the master scale recognized by the camera device as the origin of the optical alignment position of the substrate inspection device;
By the control unit, a main storage unit or the storage means in a one-to-individual of the inspection jig of the control device the data representing the difference between the compatible position electrical inspection of the inspection point and the optical alignment position 1 Writing and reading to and
And a method of aligning the inspection jig based on data representing the difference and inspecting the inspection substrate.   9. The method for aligning an inspection jig according to claim 8, wherein the master scale is made of a glass plate material.   9. The method for aligning an inspection jig according to claim 8, further comprising a reading and writing device including an antenna, and the storage means including an antenna and a semiconductor memory, via the reading and writing device. A method for aligning an inspection jig, wherein data is written to and read from the semiconductor memory of the storage means without contact.

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