JP2017003411A - Processing device, processing method and production method of wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a processing device, a processing method and a production method of a wiring board capable of correcting positional deviation caused by mechanical error.SOLUTION: A processing device of the present invention comprises: a rotary body which rotates around an axis line; holding parts which are disposed with prescribed intervals, on a circumference whose center is the axis line of the rotary body, and hold a workpiece being a processing object; and processing parts which process the workpiece which is held by the holding part and positioned on a prescribed processing position. The processing device further comprises a storage part for storing at least one of a first position being the position of the workpiece on the prescribed processing position, and a second position being is the position of the holding part for holding the workpiece disposed on the prescribed processing position, and a first correction part for, based on a positional deviation amount of at least one of the first and second positions from a first standard position, correcting at least one of the position of the processing part and the position of the holding part.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a processing apparatus, a processing method, and a wiring board manufacturing method using a rotating body.

  2. Description of the Related Art Processing apparatuses that use a rotating table (rotating body) such as a turntable or an index table are known. Such a processing apparatus is provided with a plurality of holding units for holding a workpiece to be processed (for example, an electronic component or a wiring board) on a rotary table so that processes such as loading, inspection, processing, and unloading can be performed in parallel. It is configured. That is, since a plurality of processes can be performed in parallel, the throughput of the work process is improved.

  In recent years, miniaturization of workpieces such as electronic components and wiring boards has progressed, and alignment (correction) of workpiece processing positions has become important. For this reason, various correction methods have been conventionally proposed. For example, a plurality of holding means for fixing the substrate to be inspected (workpiece) are provided on the rotary table, and the rotary table is rotated and driven by a predetermined angle so that the rotary table is sequentially conveyed to the position deviation detection position, the inspection position, and the unloading position. Have been proposed (see, for example, Patent Document 1).

  In this correction method, the amount of deviation from the reference position is detected by the position deviation detection means at the position deviation detection position. When the substrate to be inspected is transferred from the position deviation detection position to the inspection position, the relative position between the inspection jig and the board to be inspected is corrected based on the amount of deviation from the reference position detected at the position deviation detection position. The wiring of the board to be inspected is inspected through this inspection jig.

JP 2002-277502 A

  However, in an actual processing apparatus, there is a mechanical error mainly caused by assembly accuracy and component accuracy. For example, the rotary table rotates eccentrically without drawing a perfect circle. For this reason, as proposed in Patent Document 1, the position deviation is detected before the inspection position, and the inspection jig and the substrate to be inspected are based on the amount of position deviation from the reference position detected at the position deviation detection position. In the method of correcting the relative position, the positional deviation due to the mechanical error cannot be corrected. As described above, in recent years, since the miniaturization of workpieces such as electronic components and wiring boards has progressed, positional deviation due to such mechanical errors becomes a problem.

  The present invention has been made in response to the above-described circumstances, and an object thereof is to provide a processing apparatus, a processing method, and a wiring board manufacturing method capable of correcting a positional shift caused by a mechanical error.

  In order to achieve the above object, a processing apparatus according to the present invention includes a rotating body that rotates about an axis, and a workpiece that is provided at a predetermined interval on a circumference around the axis of the rotating body and that is a processing target. A processing apparatus comprising: a holding unit that holds; and a processing unit that processes a workpiece that is held by the holding unit and that is positioned at a predetermined processing position, wherein the first position is a position of the workpiece at the predetermined processing position; A storage unit that stores at least one of the second positions, which is a position of a holding unit that holds a workpiece positioned at a predetermined processing position, and a first reference position that is at least one of the first position and the second position. And a first correction unit that corrects at least one of the position of the processing unit and the position of the holding unit based on the positional deviation amount.

  According to the processing apparatus of the present invention, at least one of the first position that is the position of the workpiece at the predetermined processing position and the second position that is the position of the holding unit that holds the workpiece positioned at the predetermined processing position is determined. A storage unit for storing, and correcting at least one of the position of the processing unit and the position of the holding unit based on a positional shift amount from at least one of the first position and the second position from the first reference position; Therefore, it is possible to correct the positional deviation caused by the mechanical error of the processing apparatus.

  The processing apparatus according to the present invention includes a first position detector that detects at least one of the holding unit and the position of the workpiece held by the holding unit, and a third of the holding unit measured by the first position detector. A second correction unit that corrects at least one of the position of the processing unit and the position of the holding unit based on the amount of positional deviation from the second reference position of at least one of the position and the fourth position of the workpiece held by the holding unit. And a correction unit.

  According to the processing apparatus of the present invention, at least one of the holding unit and the position of the workpiece held by the holding unit is detected, and the third position of the holding unit to be detected and the fourth of the workpiece held by the holding unit. Since at least one of the position of the processing unit and the position of the holding unit is corrected based on the amount of positional deviation from at least one of the second reference positions, the positional deviation can be corrected with higher accuracy. In addition, it is possible to correct misalignment with low reproducibility.

  A processing method according to the present invention includes a rotating body that rotates about an axis, a holding unit that holds a workpiece to be processed, provided at a predetermined interval on a circumference around the axis of the rotating body, and a holding A processing method using a processing apparatus that includes a processing unit that is held by a unit and that processes a workpiece positioned at a predetermined processing position, the first position being a position of the workpiece at the predetermined processing position, and a predetermined At least one of the position of the processing unit and the position of the holding unit is determined based on the amount of displacement from the first reference position of at least one of the second positions, which is the position of the holding unit that holds the workpiece positioned at the processing position. It is characterized by correcting.

  According to the processing method of the present invention, at least one of the first position that is the position of the workpiece at the predetermined processing position and the second position that is the position of the holding unit that holds the workpiece positioned at the predetermined processing position. Since at least one of the position of the processing unit and the position of the holding unit is corrected based on the amount of positional deviation from the first reference position, it is possible to correct the positional deviation caused by a mechanical error.

  A manufacturing method of a wiring board according to the present invention is characterized by using the above processing method.

  According to the method for manufacturing a wiring board according to the present invention, it is possible to correct the positional deviation of the processing position of the wiring board due to a mechanical error. For this reason, inconveniences caused by misalignment, for example, inconveniences such that the inspection probe does not normally come into contact with the terminals of the wiring board in electrical characteristic inspection or the like can be suppressed.

  As described above, according to the present invention, it is possible to provide a processing apparatus, a processing method, and a wiring board manufacturing method capable of correcting a positional shift caused by mechanical accuracy.

The top view of the processing apparatus which concerns on embodiment. The front view of the processing apparatus which concerns on embodiment. The functional block diagram of the control mechanism which concerns on embodiment. The flowchart figure which shows operation | movement of the processing apparatus which concerns on embodiment.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the following description, an embodiment will be described using a wiring board as an example of a processing target, but the processing target is not limited to a wiring board.

  FIG. 1 is a plan view of a processing apparatus 100 according to the embodiment. FIG. 2 is a front view of the processing apparatus 100 of FIG. The processing apparatus 100 includes a rotary table 110, a carry-in mechanism 120, a position detection mechanism 130, a plurality of processing mechanisms 140, a carry-out mechanism 150, and a control device 160.

  The rotary table 110 is a rotating body that rotates about an axis C, and rotates clockwise at a predetermined angle (45 degrees step in the present embodiment) in response to a driving force from a motor or the like (not shown). At the periphery of the turntable 110, holding portions 111 to 118 that hold the wiring board 1 every 45 degrees are provided. The holding units 111 to 118 hold the wiring board 1 (work) that is a processing target of the treatment apparatus 100. Note that the number of holding units included in the processing apparatus 100 is arbitrary and is not limited to eight.

  The carry-in mechanism 120 is provided at the processing position L1, takes out the wiring board 1 from a container (not shown) or a previous process, and takes it out on the holding units 111 to 118 that sequentially move to the processing position L1 by the rotation of the rotary table 110. The printed wiring board 1 is placed.

  The position detection mechanism 130 is provided at the processing position L2, and the position (fourth position) of the wiring board 1 held by the holding units 111 to 118 that sequentially move to the processing position L2 by the rotation of the turntable 110. Is detected. Here, the position (fourth position) of the wiring board 1 held by the holding units 111 to 118 is, for example, a position where a positioning mark of the wiring board 1 is written.

  The position detection mechanism 130 includes a solid-state imaging device such as a CCD (Charge-Coupled Device) image sensor or a CMOS (Complementary MOS) image sensor, and the wiring board 1 held by the holding units 111 to 118 located at the processing position L2. An area including the position (fourth position) is imaged. Next, the position detection mechanism 130 detects the position (fourth position) of the wiring board 1 held by the holding units 111 to 118 from the image data captured by the solid-state imaging device.

Specifically, the position detection mechanism 130 binarizes image data picked up by the solid-state image pickup device, detects an edge, and then holds the data in the holding units 111 to 118 using a technique such as pattern matching. After recognizing the position (fourth position) of the wiring board 1, the coordinates (X ₄ , Y ₄ , θ ₄ ) of the recognized fourth position are detected.

  In this embodiment, the horizontal direction (X-axis direction), the vertical direction (Y-axis direction), and the rotation direction (θ-axis direction) are used to represent the coordinates of the position, but other coordinate systems (for example, polar coordinate systems) are used. It may be used. In addition to marking the positioning mark at the fourth position, the position detection mechanism 130 may detect the coordinates of a region (for example, a corner) having a characteristic shape as the fourth position.

  Further, in the above description, the captured image data is binarized in order to detect the edge, but other known methods such as Laplacian transformation (secondary differentiation), template matching, and the like are used for edge detection. The method may be used.

  The plurality of processing mechanisms 140 are provided at the processing positions L3 to L7, respectively, and perform predetermined processing such as electrical characteristic inspection and appearance inspection. FIG. 2 shows a processing mechanism for electrical characteristic inspection as an example of the processing mechanism 140.

  A processing mechanism 140 for inspecting electrical characteristics includes an upper jig 141 having a plurality of inspection probes P <b> 1 that respectively contact a plurality of connection terminals provided on the surface of the wiring board 1, and a plurality of parts provided on the back surface of the wiring board 1. And a lower jig 142 having a plurality of inspection probes P2 that abut each of the connection terminals. Further, the processing mechanism 140 includes a first driving unit 143 that drives the upper jig 141 and a second driving unit 144 that drives the lower jig 142.

  The first drive unit 143 drives the upper jig 141 in the vertical direction (Z-axis direction), the horizontal direction (X-axis direction), the vertical direction (Y-axis direction), and the rotation direction (θ-axis direction). The second drive unit 144 drives the lower jig 142 in the vertical direction (Z-axis direction), the horizontal direction (X-axis direction), the vertical direction (Y-axis direction), and the rotation direction (θ-axis direction).

  The processing mechanism 140 drives the upper jig 141 and the lower jig 142 in the up and down direction (Z-axis direction) by the first driving unit 143 and the second driving unit 144, and makes the inspection probes P1 and P2 contact the wiring board 1 To conduct electrical property inspection. At this time, the processing mechanism 140 includes the first driving unit 143 and the second driving unit 144 that move the upper jig 141 and the lower jig 142 in the horizontal direction (X-axis direction), the vertical direction (Y-axis direction), and the rotation direction ( Drive in each direction (θ axis direction) to correct the positional deviation.

  The carry-out mechanism 150 is provided at the processing position L8 and picks up the wiring board 1 placed on the holding units 111 to 118 that are sequentially moved to the processing position L8 by the rotation of the turntable 110, and is not shown. Store in container or deliver to subsequent process.

  The control device 160 is a personal computer (PC), for example, and controls the processing device 100. FIG. 3 is a functional block diagram of the control device 160. The control device 160 includes a communication unit 161, a storage unit 162, a first correction unit 163, a second correction unit 164, and a control unit 165. Note that the functions shown in FIG. 3 are realized by reading a program stored in the memory into an arithmetic device such as a CPU.

The communication unit 161 uses the coordinates (X ₄ , Y ₄ , θ ₄ ) of the position (fourth position) of the wiring board 1 held by the holding units 111 to 118 located at the processing position L2 detected by the position detection mechanism 130. ).

The storage unit 162 includes the coordinates (X ₂ , Y ₂ , θ ₂ ) of the positions (second positions) of the holding units 111 to 118 that hold the wiring board 1 at the processing positions L3 to L7, and the processing positions L3 to L7. The coordinates (X _R1 , Y _R1 , θ _R1 ) of the reference positions (first reference positions) of the holding units 111 to 118 that hold the wiring board 1 at the wiring and the wirings held by the holding units 111 to 118 at the processing position L2 The coordinates (X _R2 , Y _R2 , θ _R2 ) of the reference position (second reference position) of the substrate 1 are stored.

Further, the storage unit 162 stores the coordinates (X ₂ , Y ₂ , θ ₂ ) of the positions (second positions) of the holding units 111 to 118 and the coordinates (X _R1 , Y _R1 , θ _R1 ) of the first reference position. ) Is stored (ΔX ₁ , ΔY ₁ , Δθ ₁ ). The positional deviation amounts (ΔX ₁ , ΔY ₁ , Δθ ₁ ) are used when the first correction unit 163 described later corrects the processing position by the processing mechanism 140.

Here, the positions of the holding units 111 to 118 (second positions) are the positions of the holding units 111 to 118 measured in advance by the position detection mechanism attached in place of the processing mechanism 140 at the processing positions L3 to L7. This is the position where the positioning mark is marked. The positions (second positions) of the holding units 111 to 118 are as many as the holding units 111 to 118 for each of the processing positions L3 to L7. That is, the storage unit 162 stores a total of 40 coordinates (X ₂ , Y ₂ , θ ₂ ) of the positions (second positions) of the holding units 111 to 118.

  In recent years, in order to improve the productivity of factories, not only high throughput but also a processing apparatus with a small footprint (installation area) has been demanded. For this reason, it is difficult to secure a space for providing a mechanism other than the processing mechanism 140 at each of the processing positions L3 to L7, and the position detection device that detects the positions (second positions) of the holding units 111 to 118 is a processing mechanism. Apart from 140, it cannot be provided at each of the processing positions L3 to L7.

  For this reason, in the present embodiment, in each of the processing positions L3 to L7, a position detection mechanism is attached instead of the processing mechanism 140, and the coordinates of the positions (second positions) of the holding units 111 to 118 are measured in advance. The mechanical error which is a problem is corrected. Note that this method can correct positional deviation with high reproducibility.

The first reference position is a position (mechanical origin) that serves as a reference for the holding units 111 to 118 at the processing positions L3 to L7. There are as many first reference positions as the holding units 111 to 118 for each of the processing positions L3 to L7. That is, the storage unit 162 stores a total of 40 coordinates (X _R1 , Y _R1 , θ _R1 ) of the first reference position.

The second reference position is a position (mechanical origin) serving as a reference for the wiring board 1 held by the holding units 111 to 118 at the processing position L2. There are as many second reference positions as the holding portions 111 to 118. That is, the storage unit 162 stores a total of eight coordinates (X _R2 , Y _R2 , θ _R2 ) of the second reference position.

The first correction unit 163 sets the processing position by the processing mechanism 140 based on the positional deviation amount between the positions (second positions) of the holding units 111 to 118 stored in the storage unit 162 and the first reference position. to correct. Specifically, the first correction unit 163 confirms the combination of the processing positions L3 to L7 and the holding units 111 to 118, and refers to the storage unit 162 to detect the positional deviation amount (ΔX ₁ , ΔY of the corresponding combination). ₁ , Δθ ₁ ).

Next, the first correction unit 163 instructs the control unit 165 to shift the position of the processing mechanism 140 by the acquired positional deviation amount (ΔX ₁ , ΔY ₁ , Δθ ₁ ). For example, when the holding unit 111 is positioned at the processing position L3, the first correction unit 163 determines the positional deviation amount (the positional deviation amount of the combination of the processing position L3 and the holding unit 111 from the combination of the positional deviation amounts stored in the storage unit 162 ( (ΔX ₁ , ΔY ₁ , Δθ ₁ ) are acquired, and the control unit 165 is instructed to shift the position of the processing mechanism 140 by the positional deviation amount (ΔX ₁ , ΔY ₁ , Δθ ₁ ).

Further, the second correction unit 164 includes a position (fourth position) of the wiring board 1 held by the holding units 111 to 118 detected by the position detection mechanism 130 provided at the processing position L2, and a storage unit 162. The position of the processing mechanism 140 is corrected based on the amount of positional deviation from the second reference position stored in. Specifically, the second correction unit 164 is the coordinates of the position (fourth position) of the wiring board 1 held by the holding units 111 to 118 detected by the position detection mechanism 130 provided at the processing position L2. A positional shift amount (ΔX ₁ , ΔY ₁ , Δθ ₁ ) between (X ₄ , Y ₄ , θ ₄ ) and the coordinates (X _R2 , Y _R2 , θ _R2 ) of the second reference position stored in the storage unit 162. ) Is calculated for each of the holding units 111 to 118, and the control unit 165 is instructed to shift the position of the processing mechanism 140 by the calculated positional deviation amounts (ΔX ₁ , ΔY ₁ , Δθ ₁ ). By this correction, it is possible to correct even a positional deviation with low reproducibility, and therefore it is possible to correct the positional deviation more accurately.

Here, the position detection mechanism 130 detects the position (fourth position) of the wiring board 1 held by the holding units 111 to 118 every time the turntable 110 rotates in 45 degree steps. Therefore, the coordinates (X ₄ , Y ₄ , θ ₄ ) of the position (fourth position) of the wiring board 1 held by the holding units 111 to 118 detected by the position detection mechanism 130 are determined by the rotary table 110. Updated every rotation (360 degrees).

  The control unit 165 controls the operation of the entire processing apparatus 100. Further, the control unit 165 corrects the positions of the processing mechanisms 140 provided at the processing positions L3 to L7 based on instructions from the first correction unit 163 and the second correction unit 164.

  Here, the correction of the position of the processing mechanism 140 means, for example, when the processing mechanism 140 is for electrical property inspection, the lateral direction (X-axis direction) of the upper jig 141 and the lower jig 142 by the driving unit 143 and the driving unit 144. This means correcting the positional deviation in the direction, the vertical direction (Y-axis direction), and the rotation direction (θ-axis direction).

(Method for manufacturing a wiring board)
FIG. 4 is a flowchart illustrating the operation of the processing apparatus 100 according to the embodiment. Hereinafter, with reference to FIGS. 1-4, the manufacturing method of the wiring board 1 by the processing apparatus 100 is demonstrated. Here, the operation of the processing apparatus 100 is controlled by an instruction from the control unit 165. Hereinafter, the operation of the processing apparatus 100 from the state where the holding unit 111 is located at the processing position L1 will be described.

  First, the carry-in mechanism 120 takes out the wiring board 1 from a container (not shown) or a previous process, and places the taken-out wiring board 1 on the holding unit 111 located at the processing position L1 (step S101). Next, the rotary table 110 receives a driving force from a motor or the like (not shown) and rotates 45 degrees (step S102).

  Next, the position detection mechanism 130 images a region including the predetermined position of the holding unit 111 located at the processing position L2, and detects the predetermined position of the holding unit 111 from the image data captured by the solid-state imaging device (step S103). ). Further, at the processing position L1, the wiring board 1 is placed on the holding unit 112 by the carry-in mechanism 120. Next, the rotary table 110 receives a driving force from a motor or the like (not shown) and rotates 45 degrees (step S104).

  Next, the first correction unit 163 performs processing based on the positional deviation amount between the position of the holding unit 111 (second position) and the first reference position at the processing position L3 stored in the storage unit 162. The position of the processing mechanism 140 at the position L3 is corrected (step S105).

  Next, the second correction unit 164 is stored in the storage unit 162 and the position (fourth position) of the wiring board 1 held by the holding unit 111 detected by the position detection mechanism 130 in step S103. Based on the amount of positional deviation from the second reference position, the position of the processing mechanism 140 at the processing position L3 is corrected (step S106).

  Based on instructions from the first correction unit 163 and the second correction unit 164, the control unit 165 corrects the position of the processing mechanism 140 provided at the processing position L3, and then the processing by the processing mechanism 140 is executed. (Step S107). At the processing position L1, the wiring board 1 is placed on the holding unit 113 by the carry-in mechanism 120. At the processing position L2, the position (fourth position) of the wiring board 1 held by the holding unit 112 located at the processing position L2 is detected by the position detection mechanism 130.

  Thereafter, each time the turntable 110 rotates, at the processing position L1, the carry-in mechanism 120 places the wiring board 1 on the holding units 114 to 117, and at the processing position L2, the position detection mechanism 130 moves the position to the processing position L2. The position (fourth position) of the wiring board 1 held by the holding parts 114 to 116 to be detected is detected. After the position of the processing mechanism 140 is corrected at the processing position L3 to the processing position L7, the processing of the wiring board 1 is performed. Is done.

  When the holding unit 111 reaches the processing position L8, the carry-out mechanism 150 picks up the wiring board 1 placed on the holding unit 111 and stores it in a container (not shown) or transfers it to a subsequent process ( Step S108).

  The control unit 165 confirms whether the processing of all the wiring boards 1 to be processed has been completed (Step S109), and if not completed (No in Step S109), continues the operations of Steps S101 to S108, If it has been completed (Yes in step S109), the operation is terminated.

  In the above description, the first correction unit 163 corrects the processing position based on the amount of positional deviation between the predetermined position (second position) of the holding units 111 to 118 and the first reference position. The processing position may be corrected based on the amount of displacement between the predetermined position (first position) of the wiring board 1 (work) held by the holding portions 111 to 118 and the first reference position. Further, a positional deviation amount between a predetermined position (second position) of the holding units 111 to 118 and the first reference position, and a predetermined position (first position) of the wiring board 1 (work) held by the holding units 111 to 118. The processing position may be corrected based on both the position) and the positional deviation amount between the first reference position.

  Further, the second correction unit 154 corrects the processing position based on the amount of positional deviation between the predetermined position (fourth position) of the wiring board 1 held by the holding units 111 to 118 and the second reference position. However, the processing position may be corrected based on the amount of positional deviation between the predetermined position (third position) of the holding units 111 to 118 and the second reference position. Further, the positional deviation amount between the predetermined position (third position) of the holding portions 111 to 118 and the second reference position and the predetermined position (fourth position) of the wiring board 1 (work) held by the holding portions 111 to 118. The processing position may be corrected based on both the positional deviation amount between the (position) and the second reference position.

In the above embodiment, the position of the processing mechanism 140 is corrected. However, the positions of the holding units 111 to 118 may be corrected. Moreover, you may comprise so that both the position of the process mechanism 140 and the position of the holding parts 111-118 may be correct | amended. Further, the storage unit 162 stores the coordinates (X ₂ , Y ₂ , θ ₂ ) of the positions (second positions) of the holding units 111 to 118 and the coordinates (X _R1 , Y _R1 , θ _R1 ) of the first reference position. The first correction unit 163 may calculate the positional deviation amounts (ΔX ₁ , ΔY ₁ , Δθ ₁ ) without storing the positional deviation amounts (ΔX ₁ , ΔY ₁ , Δθ ₁ ). .

In the storage unit 162, the coordinates (X ₂ , Y ₂ , θ ₂ ) of the positions (second positions) of the holding units 111 to 118 that hold the wiring board 1 at the processing positions L3 to L7 and the processing positions L3 to L7. Without storing the coordinates (X _R1 , Y _R1 , θ _R1 ) of the reference positions (first reference positions) of the holding units 111 to 118 that hold the wiring board 1 in L7, the positions (first number) of the holding units 111 to 118 are stored. 2 position) coordinates (X ₂ , Y ₂ , θ ₂ ) and the first reference position coordinates (X _R1 , Y _R1 , θ _R1 ) and positional deviation amounts (ΔX ₁ , ΔY ₁ , Δθ ₁ ) and Only the coordinates (X _R2 , Y _R2 , θ _R2 ) of the reference position (second reference position) of the wiring board 1 held by the holding units 111 to 118 at the processing position L2 may be stored.

  Furthermore, it is not necessary to provide the processing devices 140 at all the processing positions L3 to L7. Further, the placement of the wiring board 1 on the holding units 111 to 118 and the pickup from the holding units 111 to 118 may be performed at the same processing position (for example, the processing position L1).

  As described above, the processing apparatus 100 according to the present embodiment is provided with a rotary table 110 that rotates about the axis C and a circumference around the axis C of the rotary table 110 at predetermined intervals, and is a processing target. And a processing mechanism 140 for processing the wiring board 1 held at the predetermined processing positions L3 to L7 while being held by the holding parts 111 to 118. The first position which is the position of the wiring board 1 at the predetermined processing positions L3 to L7 and the second position which is the positions of the holding units 111 to 118 which hold the wiring board 1 located at the predetermined processing positions L3 to L7. The position of the processing mechanism 140 based on a storage unit 162 that stores at least one of the positions of the first position and the position shift amount from the first reference position of at least one of the first position and the second position. And it has a first correction unit 163 for correcting the position of at least one of the holding portions 111 to 118. For this reason, the positional deviation resulting from the mechanical error of the processing apparatus 100 can be accurately corrected.

  Further, the processing apparatus 100 according to the present embodiment includes a first position detection mechanism 130 that detects at least one of the positions of the holding units 111 to 118 and the wiring board 1 held by the holding units 111 to 118, Position shift amount from at least one second reference position of the third position of the holding units 111 to 118 and the fourth position of the wiring board 1 held by the holding units 111 to 118 measured by the position detection mechanism 130. And a second correction unit 164 that corrects at least one of the position of the processing mechanism 140 and the positions of the holding units 111 to 118. For this reason, the positional deviation can be corrected with higher accuracy. In addition, it is possible to correct misalignment with low reproducibility.

  In addition, the processing method according to the present embodiment includes a rotating table 110 that rotates about the axis C, and a wiring board that is provided at predetermined intervals on a circumference centered on the axis C of the rotating table 110 and is a processing target. 1 is a processing method using a processing apparatus 100 including a holding unit 111 to 118 that holds 1 and a processing mechanism 140 that processes the wiring substrate 1 that is held by the holding units 111 to 118 and is positioned at a predetermined processing position. The first position that is the position of the wiring board 1 at the predetermined processing positions L3 to L7 and the second position that is the positions of the holding portions 111 to 118 that hold the wiring board 1 located at the predetermined processing positions L3 to L7. At least one of the position of the processing mechanism and the positions of the holding units 111 to 118 is corrected based on the amount of positional deviation from at least one of the first reference positions.

  For this reason, it is possible to correct a positional shift caused by a mechanical error. As a result, it is possible to suppress problems caused by misalignment, for example, problems such that the inspection probes P1 and P2 do not normally come into contact with the terminals of the wiring board 1 in electrical characteristic inspection or the like.

(Other embodiments)
In addition, the said embodiment is an example of this invention and does not intend limiting the range of invention. The above embodiment can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention.

DESCRIPTION OF SYMBOLS 100 ... Processing apparatus 110 ... Rotary table 111-118 ... Holding part 120 ... Loading mechanism 130 ... Position detection mechanism 140 ... Processing mechanism 150 ... Unloading mechanism 160 ... Control apparatus 161 ... Communication part 162 ... Memory | storage part 163 ... 1st correction | amendment part 164 ... Second correction unit 165 ... Control unit

Claims (4)

A rotating body that rotates about an axis, a holding unit that holds a workpiece that is a processing target, is provided on a circumference around the axis of the rotating body, and is held by the holding unit And a processing unit that processes the workpiece located at a predetermined processing position,
A storage unit that stores at least one of a first position that is the position of the workpiece at the predetermined processing position and a second position that is a position of the holding unit that holds the workpiece positioned at the predetermined processing position; ,
A first correction that corrects at least one of the position of the processing unit and the position of the holding unit based on a positional deviation amount from a first reference position of at least one of the first position and the second position. And
A processing apparatus comprising: A first position detector for detecting at least one of the holding portion and the position of the workpiece held by the holding portion; a third position of the holding portion measured by the first position detector; A second correction unit that corrects at least one of the position of the processing unit and the position of the holding unit based on a positional shift amount from at least one second reference position of at least one of the fourth positions of the workpiece held by the holding unit; The correction part of
The processing apparatus according to claim 1, further comprising: A rotating body that rotates about an axis, a holding unit that holds a workpiece that is a processing target, is provided on a circumference around the axis of the rotating body, and is held by the holding unit And a processing method using a processing apparatus including a processing unit that processes the workpiece located at a predetermined processing position,
The first reference position of at least one of the first position that is the position of the workpiece at the predetermined processing position and the second position that is the position of the holding unit that holds the work positioned at the predetermined processing position. A processing method comprising: correcting at least one of the position of the processing unit and the position of the holding unit based on a positional deviation amount from the position.   The manufacturing method of the wiring board using the processing method of Claim 3.

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