JP7174555B2 - Substrate inspection device, alignment thereof, and substrate inspection method - Google Patents

Description

TECHNICAL FIELD The present invention relates to a board inspection apparatus having an automatic alignment function for electrically inspecting mainly a wiring pattern formed on a printed wiring board by bringing probes into contact with inspection terminals of the wiring pattern.

And, the present invention is not limited to printed wiring boards, for example, various substrates and semiconductors such as flexible substrates, multilayer wiring substrates, electrode plates for liquid crystal displays and plasma displays, ceramic and resin substrates for semiconductor packages and film carriers It can be applied to inspection of electrical wiring characteristics formed on a wafer or the like. In this specification, these various wiring boards are collectively referred to as "substrates".

2. Description of the Related Art In recent years, an electrical inspection with an increased number of inspection points corresponding to the miniaturization and high density of printed wiring boards has become commonplace. In order to carry out an inspection in which probes are brought into conductive contact with a large number of fine inspection terminals at the same time, it is necessary to properly align the board and the inspection jig. Prior art related to this alignment includes the following.

In Patent Document 1, a dent sheet made of pressure-sensitive paper (a white sheet that turns black when pressure is applied) is attached to a substrate or the like, and a test head is pressed to obtain dents M of a probe P, and a straight line is obtained. By recognizing the positions of a plurality of dents in the form of a plurality of dents with the camera of the apparatus and performing statistical processing, etc., the "positional deviation amount" and "positional deviation direction" of the correction information Dr, which is the state of positional deviation of all the probes P, are specified. is doing.
This avoids the problem that the positional error of the dents M of two predetermined probes P directly translates into the positions of all the probes P of the test head. In addition, the difficulty in specifying the position of the unclear dent M of the probe P directly from the substrate is solved by attaching a dent sheet, and the plurality of dents M1 to M6 can be detected by the camera in the "dent position specifying process". It is automatically identified by image analysis.
However, if the test head has a large number of probes P and even one of the tip ends is greatly displaced from the designed position, the probe will not contact unless the corresponding inspection terminal has a large area. Further, the field of view (optical axis) of the camera is used as a reference for recognizing the position of the dent M, and if the optical axis of the camera deviates over time after acquisition of the correction information Dr, the position recognition may change. There is a problem that there is no description of the means to confirm that it is not.

In Patent Document 2, a table positioning mark 26 is provided on the substrate holding portion 22, and the positions of the inspection substrate and the inspection jig are specified in design using the table positioning mark 26 as a reference position, and the main camera 34 and the auxiliary camera 55 correspond to each other. It is possible to read each positioning mark and calculate the amount of optical positional deviation (XYΘ). Further, a control device for optical alignment is provided by defining an XY coordinate system with the reference position on the master scale 120 arranged on the substrate holding portion as the origin, and the optical position of the optically aligned optical position is determined. The periphery is searched by PASS by electrical inspection to obtain the position suitable for the electrical inspection, and the data representing the difference from the position of the electrical inspection is stored in the main memory of the device or the storage means of the inspection jig in one-to-one correspondence with the inspection jig. are written to and read from, and alignment is performed based on the data representing the difference.
It is shown as an example of performing calibration for eliminating errors unique to each of the plurality of substrate inspection apparatuses by standardizing the measurement standards of the substrate inspection apparatuses using a master scale for a plurality of substrate inspection apparatuses.

However, as a calibration that eliminates the unique errors of each of the multiple board inspection devices, simply setting the main camera and one reference position on the master scale as the origin may still leave the unique characteristics of each device. Therefore, the data representing the difference from the electrical inspection may also be a unique value for each device.

FIG. 3 of Patent Document 3 shows how the non-conduction signal is searched for in the continuity test shown in FIG. 7 of the present application. There is a section of conduction PASS with respect to the X-direction movement, and the center is the proper position in the X-direction. A proper checker head position is obtained by performing X, Y, and Θ directions. This confirms continuity of all conductive contact pins.
However, the electrical probing of the position of the checker head every time the checker head is mounted requires a long work time, and the substrate may be damaged and defective, and the burden on the site and the operator is large.
Further, in common with the above patent documents, the substrate is manufactured according to the design, but the substrate also has variations in positional errors in the positions of the target marks and the like during the manufacturing process.
As described above, various means have been devised for recognizing the positions of the inspection jig and the board before inspection and aligning the inspection jig with the board, but there is room for improvement.

JP 2014-159978 A JP 2010-169651 A JP-A-2001-235506

In Patent Document 1, even if the positions of all the probes P are estimated by optically recognizing and statistically processing a plurality of linear probe dents M, it is possible that the positions do not match the matching positions in the electrical inspection. There is
In Patent Document 2, even if data representing the difference between the optical position and the electrical position is used as the characteristics of the inspection jig, such as the manufacturing error of the inspection jig, the difference is not corrected when the substrate or the substrate inspection apparatus is changed. The amount of data represented may vary.

When using a plurality of board inspection devices and a plurality of inspection jigs, when changing the product name of the inspection board that changes the combination of them, the setup time becomes long, such as performing an electric survey each time. .
From the above situation, it can be seen that each of the plurality of substrate inspection apparatuses, inspection jigs, and substrates still has error factors due to variations in manufacturing errors. Appropriate measures are required for the factors of each part.

In view of the above, the present invention achieves alignment that can be applied to multiple devices with a single registration of data representing the difference between optical and electrical positions. It is another object of the present invention to provide a substrate inspection apparatus that is easy to operate and has good productivity, its alignment, and a substrate inspection method.

A first means of the present invention is a substrate inspection apparatus for inspecting electrical characteristics of a substrate having a plurality of inspection terminals wired with an electric circuit and a plurality of substrate position marks. A replaceable inspection jig with which the probe abuts, an inspection jig moving unit that holds and moves the inspection jig on the inspection jig holding unit, and a plurality of table position marks that hold and transport the substrate on the substrate holding unit. a carrier table; and a camera that moves relative to the carrier table and recognizes a plurality of position marks on the carrier table including a plurality of substrate position marks and a plurality of table position marks; a jig base plate held by the inspection jig holding portion; a probe holding portion for holding the probe; and a plurality of jig position marks indicating the positions of the inspection jigs. The positions of the plurality of jig position marks are determined by a guide plate. A memory that determines the position of the origin of the control coordinates, which are orthogonal coordinates, and the direction of the coordinate axes, based on a plurality of table position marks recognized by the camera, and controls the relative movement of the inspection jig and the transfer table in the physical alignment. The control device moves the board holding part relative to the inspection jig or the camera so that the inspection jig moves the jig press-contact recording plate fixed to the board holding part recognized by the camera. The position of the inspection jig is recognized on the control coordinates from a plurality of pressure contact position marks, which are pressure contact traces of the pressed jig position marks, and the position of the board is determined from the plurality of board position marks of the board placed on the board holder. A substrate inspection apparatus characterized by aligning a substrate and an inspection jig by recognizing them on control coordinates.

A second means of the present invention is the first means, wherein the plurality of jig position marks are concave and convex portions of the pressure contact surface of the inspection jig, and the tip of the probe guided through the guide hole is placed on the convex portion. The pressure contact position marks are recorded at the inspection position by fixing the jig pressure contact recording plate in a state in which the portion facing the plurality of jig position marks records the pressure contact in an optically recognizable manner. It is a position mark that records pressure contact traces of a plurality of jig position marks pressed by a tool.
A third means of the present invention is the first or second means, wherein the plurality of table position marks are three or more, two or more near one axis of the control coordinates, and one or more apart.

According to a fourth aspect of the present invention, in any one of the first to third aspects, the control device controls movement of the transport table in the X direction or the Y direction based on a plurality of table position marks recognized by the camera. are recognized, and based on the recognized deviations, the movement control of the transport table in the X direction or the Y direction is corrected.
According to a fifth means of the present invention, in the fourth means, an XY standard scale having calibration data is held by the substrate holding part, and the camera recognizes a plurality of predetermined positions on the XY standard scale, whereby the control is performed. Coordinates are calibrated.

According to a sixth aspect of the present invention, in any one of the first to fifth aspects, the control device comprises a plurality of resist position marks selected from a plurality of openings of a resist mask on the substrate surface recognized by the camera, and a plurality of substrates. From the position mark, the positional deviation of the resist mask from the inspection terminals is recognized, and the positional deviation is reflected in the recognition of the position of the substrate.
According to a seventh aspect of the present invention, in any one of the first to sixth aspects, the control device recognizes a difference between an optical position that is optically aligned and an electrical position suitable for electrical inspection with respect to the inspection jig. Then, the data representing the recognized difference is associated with each inspection jig one-to-one and stored in the storage unit, and the data representing the difference associated with the inspection jig held in the inspection jig holding unit is stored in the storage unit. and performs alignment based on the data representing the read difference.

An eighth means of the present invention is a board inspection method for a board inspection apparatus according to any one of the first to seventh means, wherein the camera moves relative to the carrier table, and the plurality of board position marks and the plurality of a step of recognizing a plurality of position marks on the conveying table including the table position marks, and a control device recognizing the position of the origin and the direction of the coordinate axis of control coordinates, which are orthogonal coordinates, based on the plurality of table position marks recognized by the camera. a step of fixing a jig pressure contact recording plate in a state in which a portion facing a plurality of jig position marks records the pressure contact in an optically recognizable manner to the substrate holding portion; A process of moving the transfer table relative to the inspection jig so that the inspection position is directly under the jig, and pressing the guide plate of the inspection jig against the jig pressure contact recording plate, thereby pressing a plurality of jig position marks. A process in which the inspection jig moving section moves the inspection jig so as to record the traces as a plurality of pressure contact position marks on the jig pressure contact recording plate and then release the press, and then board recognition in which the camera recognizes the board. a step of relatively moving the camera to a position, a step of moving the camera relative to the transfer table and recognizing a plurality of pressure contact position marks recorded on a jig pressure contact recording plate fixed to the substrate holding portion, and a step of recognizing a plurality of pressure contact position marks by the control device recognized by the camera. a step of recognizing the position of the inspection jig on control coordinates from a plurality of pressure contact position marks; a step of placing the substrate on the substrate holding portion; a step of recognizing a plurality of board position marks by the control device, recognizing the position of the board on the control coordinates from the plurality of board position marks recognized by the camera, and recognizing the position of the inspection jig from the plurality of pressure contact position marks on the control coordinates. A substrate characterized by comprising an alignment step of aligning the substrate and the inspection jig, and a step of bringing the substrate and the inspection jig into contact after the alignment step to perform an electrical inspection. Inspection methods.

A ninth means of the present invention is the substrate inspection method according to the eighth means, wherein a camera moves relative to the transfer table to recognize a plurality of table position marks; a deviation recognition process for recognizing deviations from the X-axis and the Y-axis of the control coordinates of movement of the transfer table in the X direction or the Y direction based on the plurality of table position marks recognized in the mark recognition process; and a correction step of correcting the control of the movement of the transport table in the X direction or the Y direction based on the deviation recognized in the deviation recognition step.
A tenth means of the present invention is, in the ninth means, the step of holding the XY standard scale having the calibration data on the substrate holding part; and the controller calibrating the control coordinates according to the plurality of recognized predetermined positions.

According to an eleventh means of the present invention, in any one of the eighth to tenth means, the main camera moves relative to the transfer table to detect a plurality of resist positions among a plurality of openings of the resist mask on the substrate surface. a step of recognizing the mark together with a plurality of substrate position marks; a step of recognizing a positional deviation of the resist mask from the inspection terminals from the plurality of recognized resist position marks and the plurality of substrate position marks; and the step of reflecting the recognition of the position of the .
According to a twelfth means of the present invention, in any one of the eighth to eleventh means, the controller recognizes the difference between the optical position of the inspection jig optically aligned and the electrical position suitable for electrical inspection. a step of associating the data representing the difference recognized by the control device with each inspection jig one-to-one and storing it in the storage unit; and reading data representing the attached difference from the storage unit, and the alignment step includes a step of aligning the substrate and the inspection jig based on the data representing the difference read by the controller.
A thirteenth means of the present invention is, in any one of the eighth to twelfth means, a table that recognizes a plurality of table position marks by moving relative to the conveying table for each predetermined condition during continuous automatic inspection. The position mark recognition process and the controller checks the difference from the start of continuous automatic inspection of multiple table position marks recognized in the table position mark recognition process, and resets the origin position of the control coordinates and the direction of the coordinate axis. and a substrate inspection method.

According to the first, eighth, or thirteenth means of the present invention, since there are a plurality of table position marks that are automatically and optically recognized by the camera, the position ( X, Y, Θ) are recognized, so changes over time of the mechanism body can be recognized from the difference from the previous position record. At the time of setting the origin of the control coordinates, it is possible to take appropriate measures such as displaying the state of the main body of the mechanism over time, requesting reconfirmation of the deviation of the camera optical axis, issuing a warning, and the like. The relative movement of the mechanism body can be maintained on the control coordinates over time based on the appropriate arrangement of a plurality of table position marks (body constant).
Since the control coordinates recognized by the relative movement of the camera are orthogonal coordinates, the position of the surface can be properly recognized on the control coordinates regardless of the direction of the plurality of position marks on the position recognition surface.
Since the inspection jig has a guide plate with a guide hole for guiding the tip of the probe to the inspection point of the inspection terminal so that the tip body of the probe that presses against many inspection terminals of the board can slide, the position of the tip of each probe movement over time is stabilized within the range of the clearance with the guide hole.
A plurality of jig position marks positioned on the guide plate are pressed by the inspection jig against the jig pressure contact recording plate fixed to the substrate holder, and the camera recognizes the plurality of pressure contact position marks transferred by pressure contact. Since the position of the inspection jig is recognized on the control coordinates in the same way as the substrate, the substrate and the inspection jig can be optically aligned.

According to the first or second means of the present invention, the plurality of jig position marks on the concave-convex portion of the surface of the inspection jig are optically recognizable for pressure contact, such as by attaching a pressure-sensitive sheet to the opposing portions. It is possible to form a pressure contact position mark that can be recognized by a camera by pressing against a jig pressure contact recording plate in a recording state.
A plurality of jig position marks are fixed to the guide plate at the recessed holes and the like, so that the recognition position of the inspection jig is stabilized (reproduced). If the tip of the protruding probe is guided by the guide hole and the reproducibility of the position is within the allowable range, the formation of the pressure contact position mark and recognition by the camera are easy.

According to the third, fourth, fifth, ninth or tenth means of the present invention, the control coordinates can be calibrated by the camera recognizing a plurality of predetermined positions on the XY standard scale with the calibration data recognized by the camera. I can. After this calibration, a plurality of table position marks, two or more near one axis of the control coordinates and one or more away, function as a permanent XY scale (body constant) to Appropriate control coordinates can be maintained by recognizing the deviation from the axis and the Y axis and correcting the movement control in the X direction or the Y direction with the transfer table.

According to the sixth or eleventh means of the present invention, since the amount of registration deviation is reflected in the position of the substrate, it is possible to correct and recognize the proper position of the substrate.
According to the seventh or twelfth means of the present invention, the electrical position suitable for electrical inspection is converted to the optical position of the optical alignment to be reproduced with respect to the positional error variation of the contact points of all the probes of the inspection jig. Since the data representing the difference between is added, the alignment can be adjusted to the characteristics of each inspection jig. Data representing this difference can be reused (reproduced) if the optical alignment is correct. Since it is not necessary to search the electric position from the optical position each time, the operation of the device is easy.
Although the effects of the present invention have been described for each means of the present invention, the common specific items have similar effects for other means. They may also interact with each other.

FIG. 1 is an explanatory view of the entire circuit board inspection apparatus of the present invention. FIG. 2 is an explanatory diagram showing the relative movement of the transfer table, the substrate, the camera, and the inspection jig in FIG. 1 and the origin of the control coordinates. FIG. 3(a) is a diagram of a monitor screen showing an image in which the pressure contact position mark of the tip of the probe is on the optical axis of the camera. FIG. 3(b) is a monitor screen of a camera image using jig position mark holes as jig position marks. FIG. 4 is an explanatory diagram of the surface pattern of the substrate and the resist mask. Moreover, explanatory drawing of the jig|tool position mark hole of a guide plate. FIG. 5 is an explanatory diagram of a side view, a bottom view, and a partially enlarged view of the inspection jig. FIG. 8 is an explanatory diagram showing an example of the XY standard scale. FIG. 7 is a conventional example of a graph showing the number of non-conducting objects during electrical exploration. FIG. 8 is an explanatory diagram of a configuration example of a turntable for transporting substrates.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Board inspection apparatuses, inspection jigs, boards, their alignment, and board inspection methods according to preferred embodiments of the present invention will be described below with reference to the accompanying drawings.
[Embodiment 1]

The entire board inspection apparatus 1 according to the present invention will be described with reference to FIG.
The mechanism main body 10 has moving parts for moving in the X, Y, Z, and Θ directions. Each moving part is controlled by the control device 11 . The substrate 2 is held by a substrate holding portion 211 that is exchangeably fixed to the transfer table 21 and is transferred in the XY directions by the table moving portion 20 . The inspection jig 3 is exchangeably held by the inspection jig holding portion 301 and moved in the Θ and Z directions by the inspection jig moving portion 30 . The camera 15 is fixed to the mechanism main body 10 at a position for imaging the conveying table 21 from above, and forms an XY coordinate system of the camera 15 . An image captured by the camera 15 is subjected to position recognition by the control device 11 via the image processing section 14 .

The inspection jig 3 has a large number of probes 31 that contact the inspection terminals 201 of the substrate 2 and are connected to the tester 13 . The operation of the board inspection apparatus 1 is instructed by the operator from the operation panel 12 and the operation is performed according to the display on the operation monitor 121 . The control device 11 has external connection means 115 (not shown) and can be connected to a hard disk or the like.

In FIG. 1, a lower camera 15B, a lower inspection jig 3B, and a lower inspection jig moving section 30B for moving in the XYΘZ directions are arranged for aligning both surfaces of the substrate 2 and inspecting both surfaces. ing. Position recognition of the lower camera 15B and the upper camera 15 is based on a fixed table position mark 22 penetrating the conveying table 21. As shown in FIG. In the present application, the alignment of the upper side will be explained, and since the same is true for the lower side, detailed explanation will be omitted.

FIG. 2 is an explanatory diagram showing the relative movement of the mechanism main body 10, the camera 15, the transfer table 21, the substrate 2, and the inspection jig 3 and the origin 112S of the control coordinates 112 in FIG. The conveying table 21 is fixed to the table moving section 20 and moves XY. Each moving part has a mechanical origin Xo, Yo, Zo, Θo. When the power is turned on and a set origin instruction is given, each moving part recognizes the mechanical origin and stops temporarily. Then, it moves according to instructions from the control device 11 . A conveying table 21 has a plurality of table position marks 22 . The control device 11 determines the origin 112S of the control coordinates 112 with reference to one of them, the reference mark 22S, and performs alignment.

A plurality of table position marks 22 are arranged on the conveying table 21 at equal intervals of 3 points in the X-axis direction and 3 points moved along the Y-axis, making a total of 6 points. Using the reference mark 22S as a reference point, (0, 0), (+tm, 0), (-tm, 0), (0, -tm1), (+tm, -tm1), (- tm, -tm1).
The reference mark 22S is arranged at the center of the X-axis of the transport table 21. As shown in FIG. The position (0, -tm1/2) between (0, 0) and (0, -tm1) is relatively moved to the camera optical axis 15L directly below the camera 15, and the origin 112S of the control coordinates 112 is set. The camera optical axis 15L is the center of the field of view of the camera 15. FIG. The reference mark 22S and the origin 112S are at a fixed distance Df.

A substrate holder 211 for holding the substrate 2 is exchangeably fixed to the carrier table 21 so that the position of the origin 112S is at the center of the substrate 2 . The board holding portion 211 is provided with three engaging pins 211a corresponding to the outer shape of the board 2, and the side faces of the board 2 are engaged with these. By urging the substrate 2 toward the engaging pins by the urging means, the substrate 2 is held at a proper position on the substrate holding portion 211 .

In FIG. 2, the camera optical axis 15L and the center of the substrate 2 are arranged coaxially with the origin 112S of the control coordinates 211 in design. Thus, the distance from the position of the reference mark 22S to the board position marks 2a and 2b indicating the position of the board 2 is predetermined in design. FIG. 2 shows a state in which the camera 15 has recognized the position of the reference mark 22S and has reached the origin 112S after relatively moving the fixed distance Df.

The inspection jig 3 held by the inspection jig holding portion 301 is arranged immediately above the conveying table 21 having moved a fixed distance Dt in the Y-axis direction from the origin 112S. The inspection jig 3 and the inspection jig holding portion 301 are moved in the Θ and Z directions by the inspection jig moving portion 30 . As for the structure of the moving part of the inspection jig moving part 30, the moving parts are stacked in the order of Θ and Z from the mechanism main body 10. As shown in FIG.

Regarding the position recognition of the substrate 2, the carrier table 21 moves relatively from the camera optical axis 15L coaxial with the origin 112S of the control coordinates 112, and the pair of substrate position marks 2a and 2b of the substrate 2 is imaged. By recognizing the upper XY position, the position of the substrate 2 is recognized as the plane of the center position (Xp, Yp) and the angle of rotation (Θp).

Regarding the position recognition of the inspection jig 3 , the carrier table 21 is moved directly under the inspection jig 3 relative to the inspection distance Dt to press the board 2 and the inspection jig 3 , and then returned to the origin 112 S of the control coordinates 211 . For example, each of the XY positions captured by the camera 15 while the carrier table 21 relatively moves the positions of the pressure contact position marks 3at and 3bt of the pair of jig position marks 3a and 3b of the tip 31A of the probe 31 attached to the substrate 2 , and the position of the inspection jig 3 is recognized as the plane of the center position (Xj, Yj) and the angle of rotation (Θj) in the same way as the substrate 2 . For this work, it is preferable to attach a pressure-sensitive color-developing pressure-sensitive sheet to the area to be imaged so that the camera 15 can easily optically recognize the pressure contact position marks 3at and 3bt.
FIG. 3A shows a partially enlarged monitor screen of a camera image in which the camera optical axis 15L is aligned with pressure contact position marks 3at and 3bt transferred from the tip 31A of the probe 31 to the pressure sensitive sheet 2S. It can be seen that the guide hole 361 is also press-contact-transferred 361t.

In the optical alignment, the differences (Xj-Xp, Yj-Yp) and (Θj-Θp) between the position of the surface of the substrate 2 and the position of the surface of the inspection jig 3 are calculated from the plurality of position marks recognized by the camera 15. When the moving part 20 and the inspection jig moving part 30 are added and the relative movement is directly under the inspection jig 3, the positions of (Dt+(Xj-Xp, Yj-Yp)) and (Θj-Θp) are the positions of the substrate 2 and the inspection. The jig 3 is in the aligned optical alignment position.

The outline of the operation and operation steps of the substrate inspection apparatus 1 is as follows.
S0: The state of the mechanism body 10 of the substrate inspection apparatus 1 is recognized.
S1.Set data relating to the inspection of the substrate 2 to be inspected.
S2.Mount the corresponding substrate holding portion 211 .
S3.The corresponding inspection jig 3 is mounted.
S4.The position of the inspection jig 3 is optically recognized from the pressure contact position mark.
S40.Set the origin 112S of the control coordinates.
S41.Affix a pressure-sensitive sheet to a predetermined position on the substrate.
S42.The inspection jig is pressed onto the board and returned to the origin.
S43 • Acquire the positions of the pair of pressure contact position marks.
S44 • Recognize the position (XYΘ) of the inspection jig.
S5.The substrate 2 is placed and the inspection is started.
S6.Optical position recognition of the substrate 2 and relative movement including alignment.
S7.The inspection jig 3 is pressed and inspected.
S8.The press is released and the substrate 2 is taken out by relative movement.

In the setup of model change where the type of substrate 2 to be inspected changes, S1 to S8 are performed, and if the electrical inspection is PASS, continuous automatic inspection is started. The continuous automatic inspection cycle repeats S5 to S8.

The state of the mechanism body 10 in step S0 is recognized. about,
Each mechanism body 10 has characteristics (variation) including manufacturing errors. Also, the characteristics change depending on the external environment such as the room temperature of the factory in which it is installed. In addition, a plurality of units are often installed in the same factory. Therefore, there are two steps for recognizing the state of each mechanism main body 10 and matching the product accuracy specifications.
S0A • Sets the origin of control coordinates.
The XY moving part of the camera is calibrated based on the S0B XY standard scale.
For simplicity, the S0A step may be used, but the S0B step is preferably performed as a periodic inspection.

Step S0A: Set the origin of the control coordinates. about,
When the origin setting of the control coordinates 112 is instructed, each moving part including the table moving part 20 recognizes the mechanical origin and moves to each fixed position. After the table moving unit 20 recognizes the mechanical origin, the camera 15 recognizes the positions of the plurality of table position marks 22 and sets the origin 112S of the control coordinates 112 based on the reference marks 22S.
Also, the position of the table position mark 22 from the machine origin is recorded, and it is confirmed that the difference from the previous position is less than a predetermined amount. If the difference is greater than or equal to a predetermined amount, the operation monitor 121 displays the state.

Since the positions of the plurality of table position marks 22 fixed to the carrier table 21 are recognized, the position of each point on the control coordinates 112 is normally the same as before. It can be seen that when the difference is equal to or less than a predetermined value, the XY coordinate system of the camera 15 has reproducibility, in which the relative movement between the camera 15 and the transport table 21 does not particularly change over time.
A change in the camera optical axis 15L is known from the recording of the position from the mechanical origin. Ensure that the optical axis distance Dc of the camera optical axis 15L is in the vicinity of the mechanical distance Dm at the time of mechanical design or shipping. This ensures that the transport table 21 will be in the vicinity of the center of the inspection position when moved from the origin 112S of the control coordinates 112 by the fixed inspection distance Dt.

The predetermined amount of difference in the allowable range is set according to product accuracy specifications of the mechanism body 10 . Appropriate action is preferred if this predetermined amount is exceeded.
From the configuration of the mechanism main body 10 in FIG. 2, for example, the inspection distance Dt and the mechanical distance Dm are mechanical constants, and the predetermined amount of the difference in the allowable range is ΔDmc=Dc−Dm as the main temporal change or camera optical axis deviation. The main reason for the difference in If the position recognition of the table position mark of the camera 15 and the lower camera 15B is different from before, the optical axis of either the upper or lower camera will be misaligned. If there is no problem with ΔDmc=Dc−Dm, the lower camera optical axis 15LB is moved to match the camera optical axis 15L. The optical axis distance Dc is the distance from the mechanical origin of the reference mark 22S.
Changes in straightness and orthogonality of the XY recognition coordinate system of the camera 15 can be understood from the two-dimensional arrangement of the six points of the plurality of table position marks 22 by comparing with previous records. The position of the six fixed points is used as a simple XY scale to ensure reproducibility in recognizing the position of the camera 15 on the control coordinates 112 each time the origin of the control coordinates of S0A is set.

Step S0B Calibrates the XY moving part of the camera based on the XY standard scale. , the XY standard scale 61 is held on the substrate holding part 211, and the XY coordinate system for position recognition by the camera 15 is calibrated based on a plurality of predetermined cross position marks of the XY standard scale 61.
Various XY standard scales 61 are commercially available depending on the size and accuracy specifications. For example, in the case of XY 100 mm shown in FIG. 6, the material is soda glass, the outer shape is 127(x)*127(y)*5(t), and the X axis and Y axis are orthogonal at 50 mm (center). The scale accuracy is ±0.002. In addition, it is possible to attach and obtain a calibration certificate.

First, the camera 15 is relatively moved to recognize a plurality of table position marks 22, and the origin 112S of the control coordinates 112 is set. Next, a plurality of predetermined positions on the XY standard scale 61 are recognized. Since the picked-up image of a predetermined position is a + shape of a cross line, the center of the intersection is recognized. Here, the movement of the XY axes of the camera 15 and the axis of the XY standard scale 61 do not become parallel due to the inclination at the time of mounting, and do not match. A dedicated substrate holder 211 with rotation adjustment is preferred. Perfect matching is difficult, but this can be manipulated to include rotation. Specifically, the rotation converts the XY coordinate display (X, Y) of each point into a polar coordinate display (radius and radian angle from the center) and subtracts the rotation (radian) error. Then restore the original XY coordinates. In the X and Y directions, the center error is subtracted from each point. After the arithmetic processing, (50, 50) of the XY standard scale 61 coincides with the origin 112S on the XY axes. A difference in straightness (linearity) and orthogonality is recognized and recorded in the main storage unit 111 . If this difference is within a predetermined range, the position recognition of the camera 15 and the moving part are normal.

If there is a calibration certificate for the XY standard scale 61, calibration data for a plurality of predetermined positions to be recognized by the camera 15 is created, and the amount of deviation in the position recognition of the camera 15 (XY coordinate system) is determined to be an appropriate value (0). Correction can be performed by controlling the movement of the XY axes so as to make corrections. It is preferable to perform a predetermined corrective action (calibration action) for straightness and orthogonality in accordance with the accuracy specifications of the mechanism main body 10 of the apparatus. After performing calibration, it is preferable to perform the step S0B again to check the suitability of the mechanism main body 10 after calibration. The accuracy of the XY values recognized by the camera 15 can be guaranteed on the control coordinates 112 . When the device body 10 is calibrated, the scale of the XY standard scale 61 (calibration data values) and the position recognition of the main camera 15 (XY coordinate system) will match. Since the XY standard scale 61 (glass) and the mechanism main body 10 (iron-based) have different thermal expansion coefficients, the recognition length of the camera 15 changes at room temperature.

It is preferable to carry out the state recognition in step S0B of the mechanism main body 10 as a periodic inspection. It is sufficient to maintain the body constant XY values of the plurality of table position marks recognized by the camera 15 in step S0A after this calibration. Based on a plurality of table position marks 22 that are two-dimensionally arranged in the XY directions recognized by the camera 15, the position of the origin of the control coordinates and the direction and length of the XY coordinates of the orthogonal coordinates are determined by the body constant XY value and the elapsed time. If there is a difference, appropriate measures such as automatic correction or warning can be taken depending on the state of the difference.
Due to these, the change over time of the mechanism main body 10 can be improved. In addition, the error variation among multiple devices is also improved.

In step S1, all inspection data such as the name of the board 2, the electrical inspection standard, the manufacturing number of the inspection jig 3, and the alignment data are set.
In step S2, the corresponding board holding unit 211 is mounted to place and hold the board to be inspected 2 having a different physical shape at the design position.

Mounting of the corresponding inspection jig 3 in step S3 occurs even after repairing malfunction of the probe 31 by removing the inspection jig 3 at the site. Although the inspection jig 3 is mechanically positioned on the inspection jig holding portion 301, there is an error in the reproducibility of the position, and recognition of the position of the inspection jig 3 in the next step S4 is required each time.

The position of the inspection jig 3 in step S4 is optically recognized from the pressure contact position mark. , if the position of the inspection jig 3 is known on the control coordinates 112, arithmetic processing for matching the inspection jig 3 with the position of the board 2 becomes possible. The working procedure is
Step S40: Set the origin of the control coordinates.
First, the camera 15 recognizes a plurality of table position marks 22, records the positions, and sets the origin 112S of the control coordinates 112. FIG. By recognizing a plurality of table position marks 22 arranged two-dimensionally, it is possible to confirm the conformity of the orthogonality of the XY coordinate system recognized by the camera 15 and the like. By recording the information in the main storage unit 111, the state of change over time of the mechanism main body 10 can be known.

Step S41: Affix a pressure-sensitive sheet to a predetermined position on the substrate.
A pressure-sensitive sheet 2S is attached to a portion of the substrate 2 facing the jig position marks 3a and 3b of the inspection jig 3, so that pressure contact can be optically recognized. For example, instead of the substrate 2, the jig pressure contact recording plate 2T is pasted with the pressure-sensitive sheet 2S and reused. Then, the jig pressure contact recording plate 2T is placed on the substrate holding portion 211 and fixed and held.
Step S42: Press the inspection jig on the board and return it to the origin.
The substrate holding unit 211 relatively moves the conveying table 21 to the inspection position directly below the inspection jig 3, presses the inspection jig 3 on the jig pressure contact recording plate 2T, and after releasing the pressing, moves to the origin 112S of the control coordinates 112. Relative movement. It becomes the board recognition position.

Step S43: Acquire the positions of a pair of pressure contact position marks.
The positions of a pair of pressure contact position marks 3at and 3bt to which the jig position marks 3a and 3b of the inspection jig 3 are pressure-transferred can be set by the XY coordinates of the center of the outer shape from the design data of the inspection jig 3. Therefore, the pair of pressure contact position marks 3at and 3bt are relatively moved directly below the camera 15. As shown in FIG.
FIG. 3B shows images of the pressure contact position marks 3at and 3bt captured by the camera 15 and displayed on the operation monitor 121. FIG. Since a plurality of jig position mark holes 362 of the guide plate 36 are used for the jig position marks 3a and 3b, there is no pressure contact in the holes, and there is no change in color development or the like in the pressure sensitive sheet 2S. has a thickness, pressure is applied, and a pressure contact mark 36t on the contact surface of the guide plate 36 is recorded. A plurality of jig position marks 3a and 3b are pressed and transferred to form pressure contact position marks 3at and 3bt. The positions of the jig position marks 3a and 3b are recognized from the differences Δ3at and 3bt from the camera optical axis 15L. The position of the surface of the guide plate 36 is recognized.

Step S44: Recognize the position (XYΘ) of the inspection jig.
The position (XYΘ) of the inspection jig 3 is recognized on the control coordinates 112 as a plane from the position (XY) recognition of the pair of pressure contact position marks 3at and 3bt.
However, it is assumed that the recognition positions of the pair of pressure contact position marks 3at and 3bt are at the positions of the inspection jig 3. FIG. In other words, the position of the inspection jig 3 requires that the positions of the pair of pressure contact position marks 3at and 3bt recognized by the camera 15 have reproducibility.
In the case of the press-contact position marks 3at and 3bt of the holes of the concave portion shown in FIG. If the pressure-sensitive sheet 2S is adhered only to the periphery of the pressure contact position mark to reduce the area, the pressure is concentrated and the coloring increases. Moreover, it is preferable that the camera 15 and the image processing unit 14 have a multi-gradation function.

A step S5 places the substrate 2 on the substrate holding part 211 and instructs to start the inspection.
In step S6, first, the carrier table 21 or the like is relatively moved so that the pair of substrate position marks 2a or 2b are directly under the camera 15, and the camera 15 recognizes the pair of XY positions. Since the position (X, Y, Θ) of the surface of the substrate 2 is determined on the control coordinates 112, the matching relative movement amount (X, Y, Θ) is calculated to move the substrate 2 and the inspection jig 3. Let
However, it is assumed that the pair of substrate position marks 2a and 2b are in proper positions on the substrate 2. FIG. In other words, the position of the board 2 is required to be the position of the pair of board position marks 2a and 2b.
In step 7 , since the substrate 2 is positioned at the matching position directly below the inspection jig 3 , the inspection jig 3 is pressed to abut on the substrate 2 . The probes 31 are brought into contact with the inspection terminals 201 for electrical inspection.
In step S8, the press is released upon completion of the inspection, the transfer table 21 and the like are returned to the mounting position of the substrate 2, and the substrate 2 is taken out.

This apparatus 1 can perform continuous automatic inspection by providing an automatic substrate placing device and a substrate unloading device side by side. (Not shown.) Steps 5 to 8 are repeated. Here, it is preferable to automatically perform optical position recognition for setting the origin 112S of the control coordinates in step 40 when predetermined conditions such as the number of inspections are met. Continuous automatic inspection operating conditions can last for days until there are no uninspected substrates 2 left. In order to avoid a continuity test failure due to a misalignment, the difference between the state of the mechanism main body 10 and the like from the state at the start of the continuous automatic test can be recognized, corrected, and maintained.

It is preferable to display the origin movement of the control coordinates during continuous automatic operation on the operation panel 12 and the operation monitor 121 . The automatic origin operation is displayed on the operation monitor 121, the date and time, the position recognition value, etc. are recorded in the main storage unit 111, and the difference from the previous or predetermined recorded data of the mechanism main body 10 is recognized. This makes it possible to recognize the mutual positional relationship of the mechanism body 10 over time. An abnormality in the camera XY movement system can also be determined from the difference, and appropriate apparatus operation can be performed, such as re-executing recognition of the position (XYΘ) of the inspection jig in steps S41 to S44, if necessary.
[Embodiment 2]

A dedicated inspection jig 3 mounted on the apparatus 1 to inspect the electrical characteristics of the substrate 2 will be described. In the inspection jig 3 shown in FIG. 5, the jig base 33 placed on the inspection jig holding portion 301 and held at a mechanical position is of a common standard and is exchangeable. The jig base 33 has a connector 341 and is connected to the tester 13 via the connector of the inspection jig holding portion 301 . A connector 341 of the jig base 33 is connected to an electrode 344 of an electrode plate 343 by wiring 342 or the like. This portion is used as an electrode body 34 .

The electrode 344 and the probe 31 electrically connected to the inspection terminal 201 of the substrate 2 are structured so that one end or both ends have an urging force and expand and contract. A large number of probes 31 face the electrodes 344 and the inspection terminals 201 and stand substantially vertically. Since many of them face the substrate 2, there are a probe holding plate A351 for holding the probes 31, a probe holding portion 35 of the probe holding plate B352, and a guide hole 361 for extensibly guiding the tip 31A of the probe 31 to the inspection terminal 201. A guide plate 36 constitutes one probe holder 35A.
It is the guide plate 36 that directly faces and abuts the substrate 2 in the inspection jig 3 . If the positions of the guide plate 36 and the substrate 2 are known, optical alignment can be performed.

A detailed description of the guide plate 36 will be given. The inspection jig 3 is designed by extracting the inspection terminals 201 of the conductor pattern 202 on the surface layer of the substrate shown in FIG. Add the parts mounting holes necessary for assembly. In the present application, a pair of jig position mark holes 362 are added to the guide plate 36 as a plurality of jig position marks 3a and 3b for indicating the positions of the inspection jigs 3 to form the drilling data of the guide plate 36. FIG. Holes are drilled with an NC drill or the like based on this design data, but manufacturing errors such as positional variations, although minute, occur. Therefore, for the guide plate 36, it is preferable to measure all the holes related to inspection and alignment with a digital length measuring machine after drilling to confirm that they are within a predetermined error.

The positions of all the guide holes 361 of the guide plate 36 are fixed, and the positions of the tips 31A of all the probes 31 are set such that the guide holes 361 and the probes 31 slidably guide the expansion and contraction movements (XYZ) of the tips 31A. The variation is limited to within the range of the clearance of the diameter difference of the tip trunk portion 31B. In the partially enlarged explanatory view of FIG. 5, the clearance is shown enlarged, but the position of the tip 31A is determined by reducing it to a range in which the tip body 31B can slide.

In the present application, fixed holes in the guide plate 36 are preferentially employed as the plurality of jig position marks 3a and 3b indicating the positions of the inspection jig 3. FIG. As the position marks to be transferred so that the position of the guide plate 36 can be optically recognized by the camera 15, it is preferable to arrange a pair of outer peripheral marks close to the central symmetry. 4 and 5, a pair of jig position mark holes 362 are arranged on the X-axis. A plurality of holes may be provided separately. It is preferable to match the hole diameter with the position recognition of the camera 15 .
The guide hole 361 may be used as a fixed hole in the guide plate 36, but it is not preferable because the diameter of the hole recognized by the camera 15 is small, it is difficult to identify the hole if it is dense, and the probe tip 31A is inside. Further, there is also a conventional probe tip 31A as a position mark of a convex portion to be pressure-transferred. Although there are uncertain factors in the position such as the clearance with the guide hole 361 described above, it is not preferable. can be adopted. The probe tip 31A has an urging force and is characterized by the formation of pressure contact traces.

From these, the plurality of jig position marks 3a and 3b are in a state in which the pressure-sensitive sheet 2S is attached to the facing portion of the uneven portion on the surface of the guide plate 36 so that the pressure is recorded so as to be optically recognizable. It is sufficient if the position recognized by the camera 15 after being pressure-transferred onto the jig pressure-contact recording plate 2T has reproducibility within an allowable range. It is preferable for the recognition of the camera 15 to attach data on the shape and position of the position marks to be used as a plurality of jig position marks 3a and 3b for pressing and transferring the position of the surface of the inspection jig 3 to the body of the inspection jig.
[Embodiment 3]

As shown in FIG. 4, the surface pattern 202 of the substrate 2 is covered with a resist mask 203 of a surface protective film. The resist mask 203 may be misaligned with the surface pattern 202 in the substrate manufacturing process. When the resist opening 201r shifts and overlaps the inspection terminal 201, the center position of the inspection terminal 201 moves from the point 31A of the probe 31. FIG.

In step 6 above, the camera 15 recognizes the board position marks 2a and 2b of the board 2. FIG. In general, substrate position marks 2a and 2b are often formed with a single island conductor pattern (fiducial mark) without a resist mask 203 around them. 201r is not detected. In the present application, a pair of resist mask openings 201r are registered as resist position marks 2ar and 2br, position recognition is performed for each predetermined number of substrates, and substrates are identified from the substrate position marks 2a and 2b and the resist position marks 2ar and 2br. It verifies that the position difference is within a predetermined error.

For example, when the error amount of this registration deviation exceeds a predetermined value, the resist mask opening 201r is adopted as the substrate position. If it exceeds half of the predetermined value, the average of the substrate position PM (Xm, Ym, Θm) of the substrate position marks 2a and 2b and the resist position PR (Xr, Yr, Θr) of the resist position marks 2ar and 2br is adopted. . If the value exceeds twice the predetermined value, it is determined that the registration deviation of the substrate is defective.
The registration deviation moves the target of the tip 31A of the probe 31 during electrical inspection. Alternatively, there is a problem in reducing the contact area, and the amount of registration deviation is reflected in position recognition of the substrate 2 . This improves the requirement that the pair of substrate position marks 2a, 2b of the substrate 2 before electrical testing be in the proper position for contact with the probes 31. FIG. Further, when the error of the registration deviation exceeds a predetermined value, it can be determined that the registration deviation of the substrate is defective.
[Embodiment 4]

After optical alignment between the substrate 2 and the inspection jig 3, electrical inspection is performed to confirm PASS. Then, the center of the position where the electrical inspection is passed is electrically probed.
From the optical position Ap (Xp, Yp, Θp) of optical alignment, the periphery is electroprobed to recognize the center of the PASS range. Specifically, the inspection jig 3 is rotated in the positive and negative directions about the .THETA. Next, the carrier table 21 is moved in the positive and negative directions of the X-axis for inspection, and is centered in the PASS range. Move the Y-axis in the positive and negative directions to check and center the PASS range. This results in an electrical position Ae (Xe, Ye, Θe) suitable for electrical inspection.

The data ΔApe (Xe-Xp, Ye-Yp, Θe-Θp) representing the difference between the optical position Ap and the electrical position Ae are stored in the main storage unit 111 or external storage means as characteristic values for optical position recognition of the inspection jig 3. sign up. Since the optical position Ap changes depending on each substrate 2, adding the data ΔApe representing the difference can cope with the change of the substrate 2. FIG.
The steps of the above electrical prospecting procedure are as follows.
S70 · The range of inspection PASS is recognized from the optical position.
S71 · Recognize the center of the range (Θ, X, Y) axes of the inspection PASS.
S72.Acquire data representing the difference between the optical position and the electrical position, and record it one-to-one with the inspection jig.
S73 • Add the data representing the recorded difference to the optical position recognized by the camera to obtain the matching position.

Moreover, it is preferable that the inspection jig 3 is equipped with storage means 39 as an external storage means to which data can be written and read by the control device 11 . When the inspection jig 3 is mounted on another device, the electrical position Ae can be reproduced by reading out the data ΔApe representing the difference without performing the electrical exploration.
However, it is assumed that there is reproducibility in the optical position recognition of the pair of pressure contact position marks 3at and 3bt. In other words, any variation is added as an error.

In the present application, the actual substrate inspection apparatus 1, inspection jig 3, and substrate 2 each have a minute but manufacturing error from the design value. Changes in alignment position compatible with electrical testing can be accommodated.
[Other embodiments]

Alignment of the device has been described mainly for the top surface of the substrate 2, but it can also be applied when double-sided inspection and alignment are required. In addition, the operation of only the upper surface can also be applied.
The structure of the mechanism main body 10 may be changed to a plurality of moving parts, etc., as long as the calculation of alignment is established.
In the present application, the origin 112S of the control coordinates 112 is determined based on the camera optical axis 15L and the reference mark 22S, and relative movement calculation processing is performed. However, it is not preferable because the control calculation becomes complicated.

Two transport tables 21 may be used. The position recognition of the substrate 2 by the camera 15 and the electrical inspection are performed in parallel, and the continuous automatic inspection time is reduced to about half. In this case, for example, if the transport directions are two independent XY axes, the movement trajectories (characteristics) of the two independent transport tables 21a and 21b are slightly different. There are preferably two independent control coordinates 112a, 112b depending on the accuracy of the alignment error.

The substrate 2 may be transported by one rotary table. As shown in FIG. 8, for example, there are substrate holders 211n at four stop positions every 90 degrees. This is preferable for shortening the inspection time. The camera 15 can be installed in the XY moving part 15XY independent of the position (angle) of position recognition of the substrate 2, and the origin 112S of the control coordinates 112 can be set based on the table position mark 22. FIG. The Y-axis distance of the table moving unit 20 of the first embodiment becomes the rotation angle (radian*radius=circumferential distance) of the rotary table 21R.

The reference mark 22S fixed to the rotary table 21R and the substrate holding portion 211n at a fixed angle stop at the inspection position S7, and the inspection jig 3 is independently relatively moved by the inspection jig moving portion 30XY. is the X-axis, it becomes an XYΘZ movement system.
The independent XY moving part 15XY of the camera 15 and the inspection jig moving part 30XY are at a fixed angle of 90 degrees, the control coordinates 112 are established, and the substrate 2 and the inspection jig 3 can be optically aligned.
However, it is also a requirement that the accuracy (reproducibility) of the angle and stop position of the rotary table is ensured. Also in this case, proper arrangement of the plurality of table position marks 22 is preferable for recognizing the reproducibility of the relative movement between the table stop position and the inspection jig 3 . If there is reproducibility, correction can be made on the control coordinates. Also, control coordinates 112a, 112b, 112c, and 112d can be set for each of the four substrate holding portions 211n. A correction constant may be added to each.

The moving part of the device 10 is mainly driven by rotating a ball screw with a motor, but a linear system or the like may be used. In any case, the amount of movement changes slightly depending on the temperature with respect to the indicated value of movement. Even if the moving part is equipped with a linear scale (length measuring device) or the like, the same applies to a solid scale length measuring device. Although this can be improved by equipping a laser length measuring device, this device 10 does not use it. Further, the actual measurement value (length) recognized by the camera 15 differs from the design value because the material of the mechanism body 10, the inspection jig 3, and the substrate 2 are different.
In this apparatus 10, the center position of the board 2 and the guide plate 36 of the inspection jig 3 is used as a reference, and the mutual difference due to the temperature is distributed. Further, each moving part is corrected over time based on a plurality of table position marks 22 (which are thermally expanded by the temperature at that time) arranged two-dimensionally.

By arranging a plurality of table position marks 22 according to the mechanical configuration of the table 21 of the mechanism main body 10, the camera 15, and the inspection jig moving unit 301, if the control coordinates 112 can maintain suitability over time, the optical position The inspection jig 3 can be aligned with the substrate 2 from the alignment control calculation. The data representing the difference between the reproducible correct optical alignment optical position and the correct electrical position for electrical inspection is also reproduced for each individual test fixture.

Regarding position marks recognized by the camera 15, independent circular islands or holes are common. Any shape can be used as long as it can be processed.
In image processing, the level of black and white binarization may be changed. A multi-value (multi-gradation) function may be provided. A color discrimination function may be provided. Also, dedicated position recognition software with a dedicated algorithm may be provided.
The number of position marks for recognizing the position of the surface is not limited to one pair, and may be two or more, such as two pairs.

Although the XY standard scale 61 described above has a cross shape, it may have a square shape or a lattice shape (lattice arrangement). If the accuracy of the XY positions of a plurality of predetermined position marks arranged two-dimensionally is guaranteed, the position recognition of the camera 15 can be calibrated based thereon.

The foregoing descriptions of specific embodiments of the invention have been presented for purposes of illustration. The preceding and following descriptions are not intended to be exhaustive or to limit the invention to the precise forms described. Those skilled in the art will appreciate that many variations and modifications are possible in light of the above description.

The board inspection apparatus and inspection jig of the present invention can be used in general conducting jigs and conducting devices for simultaneously conductively contacting probes with a plurality of inspection terminals provided in electronic components such as printed wiring boards, IC packages, and ICs. can.

1. Board inspection device 10. Mechanism main body, device 11. Control device 112. Control coordinates 112S. Origin 121. Operation monitor 15. Camera 15L.・Substrate 2a, 2b ・Substrate position mark 2T ・Jig pressing recording plate 2S ・Pressure sensitive sheet 3at, 3bt ・Pressure contact position mark 201 ・Inspection terminal, inspection point 201r ・Resist mask opening 2ar, 2br ・Resist position mark 30 ・Inspection jig moving unit 3 Inspection jigs 3a, 3b Jig position mark, Jig position mark hole 31 Probe, Contactor 31A Tip 36 Guide plate 361 Guide hole 362 Jig position mark hole 39 Memory Means 61 XY standard scale

Claims (7)

In a substrate inspection apparatus for inspecting electrical characteristics of a substrate having a plurality of inspection terminals wired with electric circuits and a plurality of substrate position marks,
a replaceable inspection jig for bringing the probe into contact with the inspection terminal;
an inspection jig holding unit that holds the inspection jig;
an inspection jig moving unit that moves the inspection jig holding unit;
a substrate holder that holds the substrate;
a transport table for transporting the substrate holding part , the transport table having a plurality of table position marks of three or more arranged two - dimensionally;
a camera that moves relative to the transfer table and recognizes a plurality of position marks on the transfer table including the plurality of substrate position marks and the plurality of table position marks ; A jig base plate held by the inspection jig holding portion, a probe holding portion for holding the probe, and a guide hole for slidably guiding the tip of the probe to the inspection terminal. a guide plate and a plurality of jig position marks indicating positions of the inspection jig, wherein the positions of the plurality of jig position marks are determined by the guide plate;
The board inspection device includes:
In the optical alignment for aligning the substrate and the inspection jig, the position of the origin and the direction of the coordinate axis of control coordinates, which are orthogonal coordinates, are determined based on the plurality of table position marks recognized by the camera, and the inspection is performed. further comprising a control device for controlling relative movement of the jig and the transfer table;
The control device moves the substrate holding section relative to the inspection jig or the camera so that the jig press-contact recording plate recognized by the camera and held by the substrate holding section is moved by the inspection jig . recognizing the position of the inspection jig on the control coordinates from a plurality of pressure contact position marks that are pressure contact traces of the pressed jig position mark;
The control device moves the substrate holding part relative to the inspection jig or the camera, and from the plurality of substrate position marks of the substrate held by the substrate holding part recognized by the camera , A board inspection apparatus, wherein the board and the inspection jig are aligned by recognizing the position of the board on the control coordinates. The plurality of jig position marks are concave and convex portions of the pressure contact surface of the inspection jig, and the convex portion includes the tip of the probe guided by the guide hole,
The pressure contact position marks are recorded at the inspection position when the jig pressure contact recording plate is held by the substrate holding portion in a state in which the portion facing the plurality of jig position marks records the pressure contact in an optically recognizable manner. 2. The board inspection apparatus according to claim 1, wherein said position mark is a pressure contact trace of said plurality of jig position marks pressed by said inspection jig. The control device is
based on the plurality of table position marks recognized by the camera, recognizing a deviation of the control coordinates from the X-axis and the Y-axis of the movement of the transport table in the X direction or the Y direction, and based on the recognized deviation 3. The substrate inspection apparatus according to claim 1, wherein control of movement of said transfer table in the X direction or the Y direction is corrected. 4. An XY standard scale having a calibration certificate is held by said substrate holder , and said control coordinates are calibrated by said camera recognizing a plurality of predetermined positions on said XY standard scale. The substrate inspection device according to 1. The control device controls a plurality of resist position marks selected from a plurality of openings of a resist mask on the substrate surface recognized by the camera, and positional deviation of the resist mask from the inspection terminals based on the plurality of substrate position marks. 5. The substrate inspection apparatus according to any one of claims 1 to 4 , wherein the positional deviation is reflected in the recognition of the position of the substrate. A substrate inspection method for a substrate inspection apparatus according to any one of claims 1 to 5 ,
moving the camera relative to the carrier table to recognize a plurality of position marks on the carrier table including the plurality of substrate position marks and the plurality of table position marks;
a step in which the control device determines the position of the origin and the direction of the coordinate axis of control coordinates, which are orthogonal coordinates, based on the plurality of table position marks recognized by the camera;
a step of holding the jig press-contact recording plate in a state in which a portion facing the plurality of jig position marks records the press contact in an optically recognizable manner, on the substrate holding portion;
a step of moving the transfer table relative to the inspection jig so that the jig pressure contact recording plate is located at an inspection position directly below the inspection jig;
pressing the guide plate of the inspection jig against the jig pressure recording plate, thereby recording pressure contact traces of the plurality of jig position marks as a plurality of pressure contact position marks on the jig pressure recording plate; and moving the inspection jig by the inspection jig moving unit so as to release the press after that;
then relatively moving the camera to a substrate recognition position for recognizing the substrate;
a step of the camera moving relative to the carrier table and recognizing the plurality of pressure contact position marks recorded on the jig pressure contact recording plate held by the substrate holding portion;
a step in which the control device recognizes the position of the inspection jig on the control coordinates from the plurality of pressure contact position marks recognized by the camera;
a step of removing the jig pressure contact recording plate from the substrate holding portion;
holding the substrate on the substrate holding part;
moving the camera relative to the carrier table to recognize the plurality of substrate position marks of the held substrate;
The control device recognizes the position of the substrate on the control coordinates from the plurality of substrate position marks recognized by the camera, and the position of the inspection jig and the position of the substrate recognized on the control coordinates. an aligning step of aligning the substrate and the inspection jig according to;
and a step of electrically inspecting the substrate by bringing the inspection jig into contact with the substrate after the alignment step. The substrate inspection method according to claim 6 ,
the step of causing the substrate holding part to hold the substrate;
the camera moving relative to the carrier table to recognize the plurality of substrate position marks of the held substrate;
The control device recognizes the position of the substrate on the control coordinates from the plurality of substrate position marks recognized by the camera, and the position of the inspection jig and the position of the substrate recognized on the control coordinates. the aligning step of aligning the substrate and the inspection jig according to;
After the aligning step, the step of bringing the substrate and the inspection jig into contact to perform an electrical inspection repeatedly;
For each predetermined condition in the step of repeatedly executing ,
a new table position mark recognition step in which the camera moves relative to the transport table to newly recognize the plurality of table position marks;
The control device checks the difference between the plurality of table position marks newly recognized in the new table position mark recognition step from the start of the repeatedly executed step , and determines the position of the origin of the control coordinates. and reorienting the coordinate axes.

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