JP4899933B2 - Mounting method of camera for substrate recognition in electronic component mounting apparatus - Google Patents

Description

  The present invention relates to a substrate recognition camera mounting method for mounting a substrate recognition camera in an electronic component mounting apparatus for mounting electronic components on a substrate.

An electronic component mounting apparatus that transports and mounts electronic components on a substrate includes a substrate recognition camera for recognizing the position of the substrate, and the substrate recognition camera includes a mounting head that transports and mounts the electronic components. Often configured to move together. Since the position detection of the board requires high-precision position detection with the advancement of the component mounting position accuracy, adjustment work for alignment of the optical system is required when mounting the camera to the mounting head. (See, for example, Patent Document 1). In this patent document example, a camera mounting error is obtained by recognizing an origin substrate with good processing accuracy when the camera is mounted, and this mounting error is corrected in actual substrate recognition.
JP-A-9-283993

  Since the above-described adjustment work when the camera is mounted is a complicated and precise work for a high-precision optical system, it has been performed only by skilled workers who have abundant experience. In addition, the substrate recognition camera is not necessarily used in a fixed manner. When the type of the target substrate is switched, it is necessary to replace it with another camera having a different field of view size or resolution depending on the imaging target. There is a case. When the camera is replaced, the above-described adjustment operation is performed again each time, so that the work load on the skilled worker is high, and there is a demand for a method that enables the camera to be attached in a simple manner.

  Accordingly, an object of the present invention is to provide a method for mounting a camera for board recognition in an electronic component mounting apparatus that can mount a camera for board recognition by a simple method.

The mounting method of the camera for board recognition in the electronic component mounting apparatus according to the present invention is such that the electronic component mounting apparatus in which the electronic component is taken out from the component supply unit by the mounting head and transferred to the substrate is moved integrally with the mounting head. A board recognition camera mounting method in an electronic component mounting apparatus for mounting a board recognition camera for recognizing the board on the electronic component mounting apparatus, wherein the camera still remains after the adjustment operation. position and the positional deviation amount of the rotational position of the optical coordinate system comprises a storage unit for storing as the camera-specific deviation, provided on the camera mounting portion provided in association with said mounting head for mounting said camera It said positioning pins to be aligned reference when mounting the camera to the adjusting jig which is the same arrangement as the camera mounting portion A camera temporary mounting step for temporarily mounting a camera, an adjustment step for performing camera adjustment work including adjustment of a focal position of the temporarily mounted camera and a rotation direction position of an optical coordinate system, and the above-mentioned removed from the adjustment jig look including a camera mounting step of mounting the camera adjustment work after the camera at said alignment reference on the camera mounting portion of the electronic component mounting apparatus, and stores the deviation in the adjustment process in the storage unit.

  According to the present invention, the camera is temporarily attached to an adjustment jig provided with an alignment means capable of reproducing the alignment reference when the camera is attached to the camera attachment portion provided in association with the mounting head, and the camera is preliminarily attached. By performing camera adjustment work including adjustment of the focal position and rotation direction position of the optical coordinate system, and mounting the adjusted camera to the camera mounting portion of the electronic component mounting device with the same mounting alignment reference, A camera for recognition can be attached by a simple method.

  Next, embodiments of the present invention will be described with reference to the drawings. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a plan view of the electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 3 is an electronic circuit according to an embodiment of the present invention. FIG. 4 is a side view of a mounting head in the component mounting apparatus, FIG. 4 is an explanatory view of the structure of a camera unit for substrate recognition in the electronic component mounting apparatus of one embodiment of the present invention, and FIGS. FIG. 7 is an explanatory view of the alignment reference to the mounting head of the camera unit for board recognition in the electronic component mounting apparatus of FIG. 7, and FIG. 7 is a camera adjustment operation of the camera unit for board recognition in the electronic component mounting apparatus of one embodiment of the present invention. FIG. 8 is an explanatory view of the alignment reference to the adjustment jig of the camera unit for substrate recognition in the electronic component mounting apparatus according to the embodiment of the present invention. FIGS. 9, 10 and 11 are the present invention. Electronic part of one embodiment FIG. 12 is an explanatory diagram of the alignment reference to the mounting head of the camera unit for board recognition in the electronic component mounting apparatus according to the embodiment of the present invention. FIG. 13 is a process explanatory diagram of a method for attaching a camera unit for board recognition in the electronic component mounting apparatus according to the embodiment of the present invention.

  First, the structure of an electronic component mounting apparatus as an electronic component mounting apparatus used in an electronic component mounting line for mounting electronic components on a substrate will be described with reference to FIGS. In FIG. 1, a transport path 2 is disposed on a base 1 in the X direction. The transport path 2 transports the substrate 3 on which electronic components are mounted, and positions the substrate 3 at a mounting position set on the transport path 2. Component supply units 4 are provided on both sides of the conveyance path 2, and a plurality of tape feeders 5 are mounted on the component supply unit 4.

  A Y-axis moving table 7 provided with a linear drive mechanism is disposed horizontally in the Y direction at one end of the base 1 in the X direction. The Y-axis moving table 7 is mainly composed of a beam member 7a provided in an elongated shape in the horizontal direction, and linear rails 8 are arranged in the horizontal direction on the beam member 7a. A linear block 9 is fitted to the linear rail 8 so as to be slidable in the Y direction. The linear block 9 is connected to a linear drive mechanism (fixed as shown in FIG. 3) via a rectangular coupling bracket 10 arranged in a vertical posture. It is combined with an X-axis moving table 13 having a child 11 and a movable element 12).

  The X-axis moving table 13 is mainly composed of a beam member 13a provided in an elongated shape in the X direction, and linear rails 14 are arranged in the horizontal direction on the beam member 13a. As shown in FIG. 3, a linear block 15 is fitted to the linear rail 14 so as to be slidable in the X direction, and the linear rail 14 is mounted on the mounting head via a rectangular coupling bracket 16 arranged in a vertical posture. 17. A movable element 12 constituting a linear drive mechanism is coupled to the coupling bracket 16, and the movable element 12 slides relative to the opposed stator 11.

  The mounting head 17 is a multiple head including a plurality of unit mounting heads 18, and a suction nozzle 18 a that sucks and holds an electronic component on a nozzle mounting portion 18 b provided at the lower end of each unit mounting head 18. Is installed. The suction nozzle 18 a is moved up and down by a nozzle lifting mechanism built in the unit mounting head 18. By driving the Y-axis moving table 7 and the X-axis moving table 13, the mounting head 17 moves in the X direction and the Y direction, whereby each unit mounting head 18 takes out the electronic component from the tape feeder 5 of the component supply unit 4. Then, it is transported and mounted on the substrate 3 positioned in the transport path 2.

A component recognition device 6 is disposed between the component supply unit 4 and the conveyance path 2, and when the mounting head 17 that has taken out an electronic component from the component supply unit 4 moves above the component recognition device coupling bracket 16. In addition, the component recognition device 6 captures and recognizes the electronic component held by the mounting head 17. When the electronic component is mounted on the board 3, position correction at the time of component mounting is performed based on the recognition result. As shown in FIG. 2, a substrate recognition camera unit 20 that moves integrally with the mounting head 17 is mounted below the X-axis table 13 via a coupling bracket 16.

  As shown in FIG. 3, the camera unit 20 is attached to a camera attachment portion 19 provided on the coupling bracket 16 in a posture in which the imaging optical axis “a” is directed downward, and moves to above the substrate 3 together with the mounting head 17. The recognition mark 3 a provided on the substrate 3 is imaged. The “camera” in claims 1 and 2 of the present application means the camera unit 20.

  The configuration of the camera unit 20 will be described with reference to FIG. As shown in FIG. 4, the camera unit 20 combines a light receiving unit 23 including a light receiving element 23 a with an optical unit 24 including lenses 24 a and 24 b and a prism 24 c to form a camera 25. The coaxial illumination unit 26 is coupled, and the planar illumination unit 30 is mounted on the lower surface of the coaxial illumination unit 26. The light receiving unit 23 is coupled to the optical unit 24 in a posture in which the imaging optical axis a is horizontal, and the imaging light incident vertically upward from below through the lens 24b on the imaging object side is refracted in the horizontal direction by the prism 24c. After that, the light is incident on the light receiving element 23a through the lens 24a, and an image of the imaging target at a predetermined focal position is formed on the light receiving element 23a. Thereby, the light receiving element 23a outputs an image signal.

  The coaxial illumination unit 26 includes a coaxial illumination light source unit 27 including a plurality of LEDs 28 and a half mirror 26 a that reflects illumination light from the coaxial illumination light source unit 27 downward. The reflected illumination light is applied to the substrate 3. In this case, the object to be imaged is illuminated from the coaxial direction of the imaging optical axis a. The flat illumination unit 30 includes a flat illumination substrate 31 having a light source unit 32 disposed on the lower surface side, and irradiates illumination light at a specific irradiation angle to the substrate 3 to be imaged by the camera 25.

  The light receiving unit 23a is connected to an imaging processing unit 33 that is an imaging controller, and the imaging processing unit 33 receives an image signal output from the light receiving element 23a and generates an image of the imaging target. The imaging processing unit 33 includes a memory 33a, and can store deviations unique to the camera unit 20, such as a positional deviation amount of the optical coordinate system in the light receiving element 23a, as offset data.

  Next, with reference to FIG. 5, the configuration of the camera mounting portion 19 provided along with the mounting head 17 for mounting the camera unit 20 will be described. As shown in FIG. 5, the camera mounting portion 19 is provided at a lower portion of the coupling bracket 16 to which the mounting head 17 is coupled, and positioning pins 16 b that are provided to project downward from the lower end surface 16 a of the coupling bracket 16. It comprises positioning pins 16d and bolt holes 16e provided on the back surface 16c of the coupling bracket 16 (the surface opposite to the mounting surface of the mounting head 17). Note that the portion where the camera mounting portion 19 is provided may be other than the coupling bracket 16 as long as the portion moves integrally with the mounting head 17. For example, a camera mounting portion for directly attaching the camera unit 20 to the mounting head 17 body is provided. It may be a configuration.

When the camera unit 20 is attached to the camera attachment portion 19, the Y side surface 24d and the X side surface 24e of the optical system unit 24 are brought into contact with the back surface 16c and the positioning pin 16d, respectively, and the upper surface 26b of the coaxial illumination unit 26 is positioned with the positioning pin. It is made to contact 16b. Next, the fixing bolt 21 is inserted through the through hole 24 f provided in the optical system unit 24 and screwed and fastened to the bolt hole 16 e, so that the camera unit 20 is positioned in advance in the camera mounting portion 19. Attached according to. That is, the Y side surface 24d, the X side surface 24e of the optical system unit 24, and the upper surface 26b of the coaxial illumination unit 2 coupling bracket 16 serve as position reference surfaces in the X, Y, and Z directions when the camera unit 20 is attached to the camera attachment portion 19. ing.

  Next, with reference to FIG. 6, the alignment reference | standard at the time of attaching the camera unit 20 to the camera attaching part 19 is demonstrated. As shown in FIG. 6, when the Y side surface 24d, the X side surface 24e, and the upper surface 26b are in contact with the back surface 16c and the positioning pins 16b and 16d, respectively, the position of the imaging optical axis a is the positioning pin 16d in the X direction. The X reference dimension L1 from the end surface of the connecting bracket 16 is located at the position of the Y reference dimension W1 from the back surface 16c of the coupling bracket 16 in the Y direction. Further, the upper surface 26b (that is, the lower surface 24g of the optical system unit 24) is located at a height reference dimension T1 from the recognition mark 3a of the substrate 3 that is the imaging target. The height reference dimension T <b> 1 is a specified dimension for achieving a focal position in capturing an object to be imaged by the camera 25.

  In the manufacturing process of the electronic component mounting apparatus, the dimensional accuracy of each part is managed so that the X reference dimension L1, the Y reference dimension W1, and the height reference dimension T1 are accurately ensured. That is, in the manufacturing process of the camera unit 20, the dimensional accuracy from each reference position of the Y side surface 24d, the X side surface 24e, and the lower surface 24g is managed, and the positional accuracy of each element of the camera mounting portion 19 in the coupling bracket 16 is managed. .

  Next, with reference to FIG. 7, a camera adjustment operation required when the camera unit 20 is attached to the electronic component mounting apparatus will be described. In FIG. 7A, 34 indicates an optical coordinate system of the light receiving element 23a in a state where the camera unit 20 is attached, and 35 indicates a mechanical coordinate system (XY orthogonal coordinate system) of the electronic component mounting apparatus. . In order for the camera unit 20 to function correctly as imaging means for substrate recognition, first, imaging light obtained by imaging the imaging target plane (the upper surface of the recognition mark 3a) is correctly imaged on the light receiving surface of the light receiving element 23a, and recognition accuracy is obtained. Therefore, it is necessary to correctly adjust the focal position of the optical system unit 24 so that a high-resolution image necessary for the optical system unit 24 can be acquired. At the same time, the positional information in the image of the optical coordinate system 34 needs to be correctly aligned with the actual positional relationship in the machine coordinate system 35.

  In this camera adjustment operation, adjustment of the focal position for correctly aligning the focal position of the camera unit 20 with the imaging target plane, and coordinate position adjustment for setting the relative relationship between the machine coordinate system 35 and the optical coordinate system 34 to a prescribed positional relationship. Is needed. The focal position is adjusted by visually confirming the degree of focus of the image formed by the optical system unit 24 while finely moving the lens 24a along the imaging optical axis a by the focusing mechanism provided in the camera unit 20. Done.

  Adjustment of the coordinate position is performed by matching the position of the imaging optical axis a with a predetermined alignment reference when the camera unit 20 is attached. That is, as shown in FIG. 7B, the imaging optical axis a that is the origin of the optical coordinate system 34 is a position that should correspond in the machine coordinate system 35 (here, this position is shown as the origin O of the XY orthogonal coordinate system). In addition, the rotation position of the optical coordinate system 34 is adjusted, that is, the orthogonal coordinate direction of the optical coordinate system is matched with the XY orthogonal coordinate direction of the machine coordinate system 35.

  As a method of this adjustment, first, as described above, the alignment of the imaging optical axis a is performed by using the Y reference dimension W1 and X reference dimension L1 in the camera unit 20 as the Y reference dimension W1 in the camera mounting portion 19 of the coupling bracket 16, This is performed by managing the dimensional accuracy so as to correctly match the X reference dimension L1. The rotation direction position is adjusted by finely adjusting the rotation position of the light receiving unit 23 around the imaging optical axis a relative to the optical system unit 24 in the configuration of the camera unit 20 shown in FIG. . That is, in the present embodiment, the camera adjustment operation includes adjustment of the focal position of the camera unit 20 and the rotational direction position of the optical coordinate system 34.

  This camera adjustment operation has been conventionally performed when or after the camera unit 20 is attached to the electronic component mounting apparatus. That is, a substrate, jig, or the like created for camera adjustment is actually imaged at the time of or after the camera unit 20 is attached, and operations such as focus position adjustment and coordinate position adjustment are performed. This camera adjustment work is a complicated work that requires skill, and it is necessary to repeat the camera adjustment work each time when it is necessary to replace the camera due to a malfunction of the camera or switching of the target product. The workload was high.

  On the other hand, in the camera mounting method shown in the present embodiment, as shown below, an adjustment jig 40 (see FIG. 8) dedicated to camera adjustment work is prepared and prior to mounting on the electronic component mounting apparatus. Necessary camera adjustment work is executed to eliminate as much as possible the complicated adjustment work required after installation. That is, mounting reproducibility is ensured by using the adjustment jig 40 provided with the alignment means that can reproduce the alignment reference when the camera unit 20 is mounted on the camera mounting portion 19 provided in the electronic component mounting apparatus. After that, the above-mentioned camera adjustment work is performed in an offline state with good workability.

  FIG. 8 shows the structure of the adjustment jig 40 and the alignment reference of the camera unit 20 in the adjustment jig 40. As shown in FIG. 8, the adjustment jig 40 is a frame-shaped jig having a substantially U-shaped cross section, and has a structure including a base portion 41, a side portion 42, an upper portion 43, and an X positioning portion 44. The unit 20 is temporarily attached to the upper portion 43. A side portion 42 is erected at one end portion of the base portion 41 placed on a work table or the like, and an upper portion of the side portion 42 is coupled to the upper portion 43. From one end of the upper portion 43, an X positioning portion 44 is provided extending in the Y direction.

  A scale member 45 (see FIG. 10) for detecting displacement is provided on the upper surface 41a of the base 41. The scale member 45 (see FIG. 10) is provided with position measurement graduations in the X and Y directions. The scale member 45 is provided with a reference point P as a position reference for matching the imaging optical axis a. In the camera adjustment operation, an image of the scale member 45 is formed on the light receiving element 23a, so that the optical member in the optical coordinate system 34 is obtained. The positional deviation amount of the imaging optical axis a in the X direction and the Y direction can be visually measured.

  The Z positioning surface 43b on the lower surface of the upper portion 43 is a reference surface for positioning the camera unit 20 in the Z direction. When the camera unit 20 is temporarily attached to the adjustment jig 40, the upper surface 26b of the coaxial illumination unit 26 is removed. By abutting against the Z positioning surface 43b, the dimension between the upper surface of the scale member 45 and the lower surface 24g of the optical system unit 24 is set to coincide with the prescribed height reference dimension T1 shown in FIG. Yes.

  The front surface of the upper portion 43 is a Y positioning surface 43a for positioning the camera unit 20 in the Y direction. When the camera unit 20 is temporarily attached to the adjustment jig 40, the Y side surface 24d is brought into contact with the Y positioning surface 43a. By making contact, the camera unit 20 is positioned in the Y direction. The side surface of the X positioning portion 44 is an X positioning surface 44a for determining the position of the camera unit 20 in the X direction, and the X side surface 24e is X positioned when temporarily mounting the camera unit 20 on the adjustment jig 40. The camera unit 20 is positioned in the X direction by contacting the surface 44a.

The position of the scale member 45 on the upper surface 41a in the X and Y directions is such that the horizontal dimension in the X direction from the X positioning surface 44a is the X reference dimension L1 shown in FIG. 6, and Y from the Y positioning surface 43a. The direction position is set to be the Y reference dimension W1 shown in FIG. Therefore, when the camera unit 20 is mounted on the adjustment jig 40, the camera unit 20 reproduces the alignment reference shown in FIG. That is, Y provided in the adjustment jig 40
The positioning surface 43a, the Z positioning surface 43b, and the X positioning surface 44a serve as alignment means for temporarily attaching the camera unit 20 to the adjustment jig 40. This alignment means is the camera attachment portion 19 shown in FIG. The alignment standard in can be reproduced.

  When the camera unit 20 is temporarily attached to the adjustment jig 40, the upper surface 26b of the coaxial illumination unit 26 is brought into contact with the Z positioning surface 43a, and the Y side surface 24e of the optical system unit 24 is brought into contact with the Y positioning surface 43a. Further, with the X side surface 24e in contact with the X positioning surface 44a, the mounting bolt 21 is screwed into a bolt hole 43b (see FIG. 9B) provided in the upper portion 43 and fixedly fastened. Thereby, the camera unit 20 is temporarily attached to the adjustment jig 40 in a form in which the alignment reference is reproduced by replacing the recognition mark 3a to be imaged in the case shown in FIG. 6 with the scale member 45.

  Next, a method for attaching the camera for board recognition will be described with reference to FIGS. This board recognition camera mounting method is to mount a board recognition camera unit 20 that moves integrally with the mounting head 17 and recognizes the board 3 in the electronic component mounting apparatus.

  First, the camera unit 20 is temporarily attached to the adjustment jig 40 having an alignment means capable of reproducing the alignment reference of the camera attachment portion 19 (camera temporary attachment step). Here, the temporary attachment of the camera unit 20 is performed in two stages. First, as shown in FIG. 9A, among the constituent parts of the camera unit 20, the light receiving unit 23 is the other part, that is, an assembly in which the optical system unit 24, the coaxial illumination unit 26, and the flat illumination unit 30 are assembled in advance. Prepare separately.

  Next, as shown in FIG. 9B, an assembly in which the optical system unit 24, the coaxial illumination unit 26, and the flat illumination unit 30 are assembled in advance is temporarily attached to the adjustment jig 40. At this time, mount the coaxial illumination unit 26 with the upper surface 26b in contact with the Z positioning surface 43b, the Y side surface 24d of the optical system unit 24 in contact with the Y positioning surface 43a, and the X side surface 24e in contact with the X positioning surface 44a. The optical system unit 24 is fastened and fixed to the upper portion 43 by the bolt 21.

  Next, as shown in FIG. 9C, the light receiving unit 23 is coupled to the optical system unit 24. Thereby, the camera unit 20 is temporarily attached to the adjustment jig 40 in a state where the relative positional relationship between the scale member 45 and the imaging optical axis a is matched with the alignment reference shown in FIG. In other words, the position of the camera unit 20 in the Z direction is defined by the height reference dimension T1 from the upper surface of the scale member 45 provided with the adjustment point P for adjustment. Further, the position of the imaging optical axis a in the Y direction from the Y positioning surface 43a is defined by the reference dimension W1. Further, the position in the X direction from the imaging optical axis aX positioning surface 44a is defined by the reference dimension L1. That is, the alignment reference of the camera unit 20 in the camera mounting portion 19 is reproduced in the adjustment jig 40.

  In this state, camera adjustment work including adjustment of the focal position of the temporarily attached camera unit 20 and the rotation direction position of the optical coordinate system is performed (adjustment process). Here, the focus position is first adjusted. In other words, the focus position of the optical system unit 24 is adjusted by the focusing mechanism provided in the camera unit 20 so that the focus position of the optical system unit 24 is correctly aligned with the reference point of the scale member 45, and then the focus position is fixed. Perform the process.

  Next, the coordinate position is adjusted. By imaging the scale member 45 with the camera 25, as shown in FIG. 10A, an image showing the positional deviation state between the optical coordinate system 34 and the scale member 45 is acquired, and the imaging optical axis a and the scale member 45 are acquired. The amount of positional deviation (Δx, Δy) with respect to the reference point P provided on and the rotational positional deviation amount (tilt) Δθ of the optical coordinate system 34 are measured by visual observation.

  Here, the Y reference dimension (dimension from the imaging optical axis a to the Y side surface 24d) and the X reference dimension (dimension from the imaging optical axis a to the X side surface 24e) in the camera unit 20 are the camera mounting portion 19 of the coupling bracket 16. If the dimensional accuracy is managed accurately so that it matches the Y reference dimension W1 and X reference dimension L1 correctly, the measured positional deviation amounts (Δx, Δy) are small, and adjustment work is particularly necessary And not. That is, only by attaching the camera unit 20 to the camera attachment portion 19, the origin of the optical coordinate system 34 is aligned with a point that should correspond in the machine coordinate system 35 within an allowable error range. In this case, the adjustment work is performed so that Δθ is as close to zero as possible with respect to only the rotational position deviation amount (tilt).

  In addition, when a misalignment exceeding the allowable error range is detected due to a processing error or assembly error of parts of the camera unit 20 and the misalignment error is not so large, an adjustment shim plate is attached. Perform mechanical error adjustment measures such as. In addition, if the position error is large and error adjustment is impossible, it is rejected as a defective product. In this adjustment step, the relative positional relationship between the optical coordinate system 34 and the machine coordinate system 35 shown in FIG. 10A is corrected to the state shown in FIG. That is, the positional deviation amount (Δx, Δy) of the imaging optical axis a and the rotational positional deviation amount (tilt) Δθ of the optical coordinate system 34 shown in FIG. 10A are as small as possible as shown in FIG. 10B. The shift amount (Δxr, Δyr) and the rotational position shift amount Δθr are decreased. These misregistration amounts are misregistration amounts that inevitably remain due to the limit of the adjustment capability of error adjustment.

  Then, the positional deviation amounts Δxr, Δyr, and θr remaining after the adjustment work are written and stored in the memory 33a of the imaging processing unit 33 as deviations inherent to the camera. Of course, when the measured positional deviation amount is within the allowable error range, the positional deviation amount shown in FIG. 10A is stored as it is as a deviation unique to the camera. That is, the memory 33a is a storage unit that stores the optical axis position still remaining after the adjustment work and the positional deviation amount of the rotational position of the optical coordinate system as a deviation inherent to the camera, and is shown in this embodiment. In the camera mounting method, the deviation acquired in the adjustment step is stored in the storage unit.

  When the adjustment process is completed, the camera unit 20 is removed from the adjustment jig 40. Then, the camera unit 20 after the adjustment work removed from the adjustment jig 40 is carried to the electronic component mounting apparatus as shown in FIG. 11A, and is attached to the camera mounting portion 19 as shown in FIG. Attachment is performed according to the alignment reference shown in FIG. 6 (camera attachment process). That is, the Y side surface 24d and the X side surface 24e of the optical system unit 24 are brought into contact with the back surface 16c and the positioning pin 16d of the coupling bracket 16, respectively, and the upper surface 26b of the coaxial illumination unit 26 is brought into contact with the positioning pin 16b. Next, the fixing bolt 21 is inserted through the through hole 24 f provided in the optical system unit 24 and screwed and fastened to the bolt hole 16 e, so that the camera unit 20 is positioned in advance in the camera mounting portion 19. Attached according to.

  After the camera unit 20 is mounted, if more accurate imaging is required due to the required recognition accuracy, imaging is actually performed on a dedicated board or the like. Calibration to be obtained as offset data indicating the amount of positional deviation is executed. At the time of this calibration, more accurate calibration can be performed by reading data indicating the camera-specific deviation from the memory 33a of the camera unit 20.

That is, the offset data set as a result of the calibration is converted into an error component due to the camera-specific deviation and an attachment error component generated in relation to the camera attachment portion 19 to which the camera unit 20 is attached in the target apparatus. It becomes possible to register separately. Therefore, if calibration is performed for one camera unit 20 to obtain an attachment error component specific to the device, the other camera unit 20 is not attached to the device without newly performing calibration. By combining the error component and the error component due to the deviation inherent in the camera unit 20, correct offset data can be acquired.

  As described above, according to the present invention, the camera is temporarily attached to an adjustment jig having an alignment means capable of reproducing the alignment reference when the camera is attached to the camera attachment portion provided with the mounting head. Execute camera adjustment work including adjustment of the focal position of the camera and the rotation direction position of the optical coordinate system in advance, and attach the adjusted camera to the camera mounting portion of the electronic component mounting apparatus with the same mounting alignment reference. It is a thing.

  Thereby, the camera adjustment work which requires skill can be continuously performed by using the adjustment jig for plural units of the same model. Since the work using the adjusting jig can be performed off-line, workability is good, and high-precision complicated work can be executed with high efficiency. And the work of attaching the camera after the adjustment work to the electronic component mounting apparatus is simply a simple work of positioning and fixing according to a preset positioning standard, so that it does not bother the skilled worker. A substrate recognition camera can be attached to the mounting head by a simple method.

  In the above embodiment, the camera mounting portion 19 having a configuration in which the camera unit 20 is directly fixed to the coupling bracket 16 is employed. However, as shown in FIG. 12, the camera unit 20 and the coupling bracket 16 A camera mounting plate 46 having a rectangular plate shape, and the camera mounting plate 46 is first fixed to the coupling bracket 16, and then the camera unit 20 is fixed and fastened to the camera mounting plate 46. May be adopted.

  In FIG. 12, the back surface 16 c of the coupling bracket 16 is a mounting surface that abuts and fixes the camera mounting plate 46. The back surface 16 c has a position corresponding to a through hole 46 d provided in the camera mounting plate 46. A bolt hole 16g into which the mounting bolt 21A is screwed is provided. Further, a positioning pin 16f serving as a reference in the X direction of the camera unit 20 is implanted on the back surface 16c, and a pin through hole 46b is provided on the camera mounting plate 46.

  In a state in which the camera mounting plate 46 is attached to the coupling bracket 16 by the bolt 21A, the positioning pin 16f penetrates the pin through hole 46b and protrudes to the back surface 46c, which serves as a reference for positioning the camera unit 20 in the X direction. The rear surface 46c and the lower end surface 46a of the camera mounting plate 46 serve as the reference for positioning in the Y direction and Z direction when positioning the camera unit 20, respectively.

  The camera unit 20 has the same configuration as the camera unit 20 shown in FIG. 5, and includes a through hole 24f for fastening bolts and a position reference plane in the X, Y, and Z directions (X side 24e, Y side 24d of the optical system unit 24, coaxial An upper surface 26b) of the lighting unit 26 is set. The camera mounting plate 46 is provided with bolt holes 46e corresponding to the positions of the through holes 24f. When the camera unit 20 is coupled to the camera mounting plate 46, the Y side surface 24d, X of the optical system unit 24 is provided. The side surface 24e is brought into contact with the back surface 46c of the camera mounting plate 46 and the positioning pin 16f, and the upper surface 26b of the coaxial illumination unit 26 is brought into contact with the lower end surface 46a of the camera mounting plate 46. Next, by inserting the fixing bolt 21 through the through hole 24f and screwing and fastening it to the bolt hole 46e, the camera unit 20 is attached to the camera attachment portion 19A according to a preset alignment standard.

  When the camera mounting plate 46 is attached to the coupling bracket 16, an alignment operation for adjusting the parallelism between the height position of the lower end surface 46 a and the apparatus reference surface is performed. That is, as shown in FIG. 13A, an alignment jig (not shown) is set between the lower end face 46a and the apparatus reference plane 47, and the height dimension H of the lower end face 46a from the apparatus reference plane 47 is set. Then, the bolt 21A is fastened in a state where the parallelism with respect to the apparatus reference surface 47 is properly matched within the specified accuracy. As described above, by adopting a configuration in which the camera attachment plate 46 is interposed in the camera attachment portion 19A for attaching the camera unit 20 to the coupling bracket 16, the operation for aligning the camera unit 20 at an accurate position is performed. It becomes possible to carry out with high precision and good workability using the tool.

  Then, the camera unit 20 is attached to the camera attachment portion 19A in a state where the camera attachment plate 46 is correctly aligned with the coupling bracket 16 in this way. That is, as shown in FIG. 13B, the Y side surface 24d and the X side surface 24e of the optical system unit 24 are brought into contact with the back surface 46c of the camera mounting plate 46 and the positioning pin 16f, respectively, and further, the upper surface 26b of the coaxial illumination unit 26. Is brought into contact with the lower end surface 46 a of the camera mounting plate 46. Next, by inserting the fixing bolt 21 through the through hole 24f and screwing and fastening it to the bolt hole 46e, the camera unit 20 is attached to the camera attachment portion 19A according to a preset alignment standard.

  The mounting method of the substrate recognition camera in the electronic component mounting apparatus of the present invention has the effect that the substrate recognition camera can be mounted on the mounting head by a simple method, and the electronic component is mounted on the substrate by the mounting head. It is useful in the field.

The perspective view of the electronic component mounting apparatus of one embodiment of this invention The top view of the electronic component mounting apparatus of one embodiment of this invention The side view of the mounting head in the electronic component mounting apparatus of one embodiment of this invention Structure explanatory drawing of the camera unit for board recognition in the electronic component mounting device of one embodiment of the present invention Explanatory drawing of the alignment reference | standard to the mounting head of the camera unit for board | substrate recognition in the electronic component mounting apparatus of one embodiment of this invention Explanatory drawing of the alignment reference | standard to the mounting head of the camera unit for board | substrate recognition in the electronic component mounting apparatus of one embodiment of this invention Explanatory drawing of the camera adjustment work of the camera unit for board | substrate recognition in the electronic component mounting apparatus of one embodiment of this invention Explanatory drawing of the alignment reference | standard to the adjustment jig of the camera unit for board | substrate recognition in the electronic component mounting apparatus of one embodiment of this invention Process explanatory drawing of the attachment method of the camera unit for board | substrate recognition in the electronic component mounting apparatus of one embodiment of this invention Process explanatory drawing of the attachment method of the camera unit for board | substrate recognition in the electronic component mounting apparatus of one embodiment of this invention Process explanatory drawing of the attachment method of the camera unit for board | substrate recognition in the electronic component mounting apparatus of one embodiment of this invention Explanatory drawing of the alignment reference | standard to the mounting head of the camera unit for board | substrate recognition in the electronic component mounting apparatus of one embodiment of this invention Process explanatory drawing of the attachment method of the camera unit for board | substrate recognition in the electronic component mounting apparatus of one embodiment of this invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 3 Board | substrate 4 Component supply part 7 Y-axis movement table 13 X-axis movement table 16 Connection bracket 17 Mounting head 19 Camera mounting part 20 Camera unit 23 Light-receiving part 23a Light-receiving element 24 Optical system unit 25 Camera 34 Optical coordinate system 35 Mechanical coordinate system 40 Adjustment jig

Claims (1)

In an electronic component mounting apparatus that takes out an electronic component from a component supply unit by a mounting head and transfers and mounts the electronic component on a substrate, the electronic component mounting apparatus includes a substrate recognition camera that moves integrally with the mounting head and recognizes the substrate. A method of mounting a camera for board recognition in an electronic component mounting apparatus to be attached to
The camera includes a storage unit that stores the positional deviation amount of the optical axis position and the rotational direction position of the optical coordinate system still remaining after the adjustment work as a deviation inherent to the camera,
Adjustment jig positioning pins as the alignment reference when mounting the camera provided on the camera mounting portion provided in association with the mounting head to mount the camera to the same arrangement as the camera mounting portion A temporary camera mounting step for temporarily mounting the camera on
An adjustment step for performing camera adjustment work including adjustment of the focal position of the temporarily mounted camera and the rotational direction position of the optical coordinate system;
Look including a camera mounting step of mounting the adjusting jig from the removed after the camera adjustment camera the alignment reference on the camera mounting portion of the electronic component mounting apparatus,
The method of mounting a camera for board recognition in an electronic component mounting apparatus , wherein the deviation is stored in the storage unit in the adjustment step .

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