JPH10206115A - Measuring method for mounting position of recognition camera in electronic-component mounting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a measuring method, for the mounting position of a recognition camera in an electronic-component mounting apparatus, in which the mounting position of the recognition camera attached to the electronic-component mounting apparatus can be measured quickly and precisely. SOLUTION: When a recognition camera 3 is attached to an electronic- component mounting apparatus, an origin board 1 whose working accuracy is extremely good is recognized automatically, and an image processing operation is performed. When the image processing operation fails, information on a failure cause is displayed. After the cause has been removed, an image processing operation is performed automatically again. An error in the mounting position of the recognition camera 3 is found. The fond error in the mounting position is stored automatically in a control part at the electronic-component mounting apparatus. Thereby, the mounting position can be measured in an extremely short time and surely.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a recognition camera mounting position of an electronic component mounting apparatus used for measuring an error of an actual mounting position from a mounting reference position when the recognition camera is mounted on the electronic component mounting apparatus. It relates to a measuring method.

[0002]

2. Description of the Related Art In recent years, when configuring circuit units of various electronic devices, electronic components are automatically mounted on a circuit board using an electronic component mounting apparatus. In the electronic component mounting apparatus, a recognition camera is mounted on the electronic component mounting apparatus in order to increase the mounting accuracy, and the electronic component mounting position of the circuit board is detected in advance by image processing, and then the electronic component is mounted. I have.

For this reason, one or a plurality of recognition cameras are mounted on the electronic component mounting apparatus. However, there is an error in an actual mounting position with respect to a design mounting position of the recognition camera, that is, a reference mounting position. In this case, when the electronic component mounting position on the circuit board is detected by image processing, the electronic component mounting position cannot be accurately obtained due to the mounting error. Is measured in advance at the time of adjusting the mounting position of the recognition camera, and stored in the control unit as data unique to the electronic component mounting apparatus, and the error of the mounting position is detected in the image processing during the production of the circuit unit. A method of subtracting from the mounting position and eliminating the influence of an error in the mounting position of the recognition camera from the detected electronic component mounting position is adopted.

Therefore, conventionally, a substrate provided with a reference hole with very high accuracy, called an origin substrate, is mounted and held on an XY table, and the XY table is placed such that the reference hole of the origin substrate is directly below the recognition camera. An image capturing operation of the reference hole is performed by the recognition camera while being moved by a predetermined amount, and the captured image data is subjected to image processing to detect an actual mounting position of the recognition camera, and the actual mounting position and the mounting reference position. The recognition camera mounting position error obtained by taking the difference from the above is stored in the electronic component mounting apparatus.

[0005] When the origin substrate is held on the XY table, the periphery of the origin substrate is sandwiched by a guide provided on the XY table or the side end of the origin substrate is provided on the XY table, as is well known. In addition to the support by the rail, an engaging hole for positioning is provided on the origin substrate, and a pin is provided on the XY table so as to be engaged with the engaging hole and held.

[0006]

However, in the above-described conventional method for measuring the mounting position of the recognition camera of the electronic component mounting apparatus, when the image of the reference hole provided on the origin board is taken in, the XY table is used to determine the mounting reference position of the recognition camera. It is necessary to manually move the camera directly below the camera, and also manually operate the operation of starting the image capture / image processing operation and storing the resulting error in the mounting position of the recognition camera in the electronic component mounting device. was there.

As described above, the work of measuring the recognition camera mounting position requires many manual operations, which not only requires a long operation time, but also easily causes an operation error. From these facts, it can be said that the reliability of the operation is never high. Did not.

Particularly, in an electronic component mounting apparatus to which a plurality of recognition cameras are attached, when detecting the mounting position of the electronic component on the circuit board, the detection work is shared by the plurality of recognition cameras, and Since the above-mentioned detection work can be performed by moving the component mounting position to a position immediately below the nearest recognition camera, the moving time of the XY table can be shortened and the speed can be increased. On the other hand, the mounting positions of all the recognition cameras can be measured. Has to be performed manually, and a longer time is required for the mounting position measuring operation, and the reliability of the operation is reduced.

The present invention solves such a conventional problem,
Recognition camera mounting of a highly reliable electronic component mounting device that automatically measures the mounting position error of the recognition camera with simple operation and can complete the measurement work in a short time without causing a work error It is an object of the present invention to provide a position measuring method.

[0010]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention moves the XY table so that the center of the reference hole of the origin board held by the XY table of the electronic component mounting apparatus is aligned with the axis of the insertion head. After the adjustment, the XY table is moved by the data stored in the control unit in advance so that the reference hole of the origin board comes to the axis of the recognition camera, and then the reference hole of the origin board coming to the axis of the recognition camera is moved. Based on a series of programs, the amount of deviation from the reference position is obtained by reading the image by the recognition camera and performing image processing, and the operation of storing the obtained amount of deviation as a mounting position error of the recognition camera in the control unit is automatically performed. It is the way to do it.

According to the present invention, the operation time can be shortened, and the operation error due to the manual operation can be eliminated to improve the reliability of the operation of measuring the recognition camera mounting position.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention according to claim 1 of the present invention relates to an axis of a recognition camera attached to an insertion head of an electronic component mounting apparatus having a control panel so as to be parallel to the axis of the insertion head. In the method of measuring the mounting position of the electronic component mounting apparatus for measuring the distance between the axis of the insertion head and the axis, first, the origin board provided with the reference hole is held by the XY table of the electronic component mounting apparatus, After moving and adjusting the XY table so that the center of the reference hole is aligned with the axis of the insertion head, the XY table is stored in the control unit in advance so that the reference hole of the origin substrate is located at the axis of the recognition camera. After moving, the reference hole of the origin board that comes to the axis of this recognition camera is read by the recognition camera and processed for image processing, so that the position becomes the reference position. In this method, the operation of storing the determined amount of deviation as the mounting position error of the recognition camera in the control unit is automatically performed based on a series of programs. This has the effect of shortening the operation and eliminating the operational error caused by manual operation, thereby improving the reliability of the recognition camera mounting position measuring operation.

According to a second aspect of the present invention, in the first aspect of the present invention, a plurality of reference holes provided in the origin substrate are formed in the X direction or the Y direction so as to be orthogonal to each other. In this method, a plurality of holes are collectively measured for each of the X direction and the Y direction, and the average value is obtained as a shift amount. This has an effect that the recognition camera mounting position can be accurately measured.

According to a third aspect of the present invention, in the first or second aspect of the invention, when the image processing of the reference hole of the origin substrate fails, error information is displayed on the control panel. Yes, tell the worker that the recognition camera mounting position measurement work failed when image processing failed,
This has the effect that it is possible to prevent the recognition camera mounting position measurement operation from being terminated without the correct recognition camera mounting position being measured.

According to a fourth aspect of the present invention, in the third aspect of the invention, in addition to the error information, a measure against image processing failure is displayed on the control panel, so that the image is easily displayed. This has the effect of eliminating the cause of the processing failure.

According to a fifth aspect of the present invention, in the third or fourth aspect of the present invention, the image processing of the reference hole of the origin substrate is performed again after removing the cause of the image processing failure. By restarting the work of measuring the position of the recognition camera from the image processing, the operation time of measuring the position of the recognition camera when the image processing fails can be shortened.

According to a sixth aspect of the present invention, in the first aspect of the present invention, when the electronic component mounting apparatus has a plurality of recognition cameras, an axis of the plurality of recognition cameras and When sequentially measuring the dimension between the axis of the insertion head and the axis, the operation of obtaining the mounting position errors of the plurality of recognition cameras and storing the errors in the control unit is automatically performed based on a series of programs. In addition, when measuring the mounting positions of a plurality of recognition cameras, the operation of measuring the mounting positions of all the recognition cameras can be performed in a single operation, thereby reducing the time required for measuring the mounting positions of the recognition cameras. Have.

According to a seventh aspect of the present invention, in the sixth aspect of the invention, when the image processing of the reference hole of the origin board fails, the error information on the control panel and the information of the recognition camera that failed in the image processing are displayed. When the image processing fails, the worker is notified that the recognition camera mounting position measurement work has failed, thereby terminating the recognition camera mounting position measurement work without measuring the correct recognition camera mounting position. This has the effect that the cause of the image processing failure can be easily removed by indicating to the operator the recognition camera that should take action for the image processing failure.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. (Embodiment 1) A first embodiment of the present invention will be described with reference to FIGS.

FIG. 1 is a flowchart showing a procedure of a method of measuring a recognition camera mounting position of the electronic component mounting apparatus according to the embodiment. FIG. 2 is a plan view showing an origin substrate used in the above-mentioned measuring method. As shown in FIG. 2, a plurality of reference holes 2 are provided with very high accuracy, and three reference holes 2 are respectively arranged in a straight line in the X direction and the Y direction shown in the drawing. In FIG. 2, the reference holes arranged in the X direction are each 2 mm from the left.
a, 2b, and 2c.

FIG. 3A is a front view showing a main part of the electronic component mounting apparatus according to the embodiment, FIG. 3B is a plan view thereof, and FIG. 4 (b) is a plan view showing a main part of the electronic component mounting apparatus, and FIGS. 3 (a) and 3 (b) show a reference hole 2b at the center of the origin substrate 1 held on the XY table 5. FIG. 4 shows a state where is disposed on the axis of the insertion head 4, and FIG.
(B) shows a state where the reference hole 2 comes to the axis of the recognition camera 3 attached to the insertion head 4.

FIG. 5 is a front view showing a control panel 10 of the electronic component mounting apparatus according to the embodiment, in which reference holes 2a, 2b, 2c on the origin substrate 1 read by the recognition camera 3 in the state of FIG. FIG. 6 shows a state in which an image is displayed on the display unit 9.
Is a measurement execution key for starting the mounting position measurement, 7 is a continuation key used when an image processing operation described later fails, and 8 is an end key used when an image processing operation described later also fails. is there.

FIG. 6 is a front view showing the control panel 10 of the electronic component mounting apparatus according to the present embodiment, similarly to FIG. 5, and the reference holes 2a and 2a on the origin substrate 1 read by the recognition camera 3 as described above. This figure shows a state in which the positions of 2b and 2c are determined by image processing. In the drawing, 11, 12 and 13 are reference holes 2a, 2b and 2 respectively.
c indicates the original position, which is the temporary center position of each of the reference holes 2a, 2b, 2c.
Reference numerals 4, 15 and 16 denote actual center positions of the reference holes 2a, 2b and 2c, respectively.

FIG. 7 is a flow chart showing the procedure for measuring the mounting position error of the recognition camera according to the present embodiment.
FIG. 9 shows a procedure for measuring the mounting position error of the recognition camera using the image shown in FIG. 6 as described above.

FIG. 8 is a front view showing the control panel 10 according to the embodiment, and shows a state in which error information displayed when the image processing operation has failed is displayed on the display unit 9. .

The procedure for measuring the position of the mounted camera in the electronic component mounting apparatus according to the present embodiment will be described below.

First, as shown in the flow chart of FIG. 1, an origin substrate 1 having a plurality of reference holes 2 shown in FIG. 2 is attached to and held on an XY table 5 as in the prior art.

Next, as shown in the flowchart of FIG. 1, the XY table 5 is moved so that the center reference hole 2b of the origin substrate 1 is on the axis of the insertion head 4. This X
When adjusting the movement of the Y table 5, a jig (not shown) is attached to the insertion head 4, and the XY is adjusted so that the pin (not shown) attached to the jig and the reference hole 2b are aligned. Although the adjustment is performed by moving the table 5, it is not directly related to the present embodiment, and the description thereof is omitted.

FIG. 3 shows a state in which the reference hole 2b at the center of the origin substrate 1 held by the XY table 5 is arranged on the axis of the insertion head 4 by the above operation.

Next, as shown in the flowchart of FIG. 1, the electronic component mounting apparatus is operated to select the recognition camera mounting position error measuring function.

Next, as shown in the flowchart of FIG. 1, when the measurement execution key 6 of the control panel 10 is pressed, the XY table 5 is automatically moved to the X direction shown in FIG.
mm, the reference hole 2 comes to the axis of the recognition camera 3 as shown in FIG. The moving distance of the XY table 5 is 90 mm because the distance between the axis of the insertion head 4 and the axis of the recognition camera 3 is designed to be 90 mm, and the moving distance data of 90 mm is
This is stored in advance in a control unit (not shown) of the electronic component mounting apparatus.

When the reference hole 2 of the origin substrate 1 comes on the axis of the recognition camera 3 as described above, the images of the reference holes 2a, 2b and 2c are read by the recognition camera 3 as shown in FIG. The positions of the holes 2a, 2b, 2c are determined by image processing, and the mounting position error of the recognition camera 3 is determined by image processing as shown in FIGS.

As described above, when the mounting position error of the recognition camera 3 is successfully obtained by image processing, as shown in the flowchart of FIG. The data is stored in the control unit (not shown) as data unique to the mounting apparatus, and the recognition camera mounting position measuring operation ends.

A series of operations for measuring the mounting position error of the recognition camera 3 after pressing the measurement execution key 6 and storing the error in the control section are automatically performed by a program.

Here, the image processing operation will be described in detail with reference to FIGS. When the mounting position of the recognition camera 3 is shifted with respect to the insertion head 4, FIG.
As shown in the figure, the position where the reference hole 2a should be originally, that is, the temporary center position 11 and the actual center position 14 are naturally shifted. The X-direction shift is ΔXa, and the Y-direction shift is ΔXa.
Similarly, the deviations of the reference holes 2b and 2c are respectively set to ΔXb, ΔYb, ΔXc and ΔYc.

Then, as shown in the flow chart of FIG. 7, the X-direction shift amount ΔXa of the reference holes 2a, 2b, 2c is
An average value of ΔXb and ΔXc is calculated, and this average value is used as an attachment position error of the recognition camera 3 in the X direction.

Next, the same applies to the reference hole 2 in the Y direction.
The image processing operation is completed by calculating the average value of the deviation amounts ΔYa, ΔYb, ΔYc of a, 2b, 2c and setting the average value as the mounting position error of the recognition camera 3 in the Y direction.

Next, a procedure when the image processing operation has failed will be described with reference to FIGS.

When the image processing has failed, error information as shown in FIG. 8 is displayed on the display section 9 of the control panel 10. At this time, as shown in FIG.
Check items are displayed at the same time to eliminate the cause of image processing failure. The operator confirms based on this check item, and after removing the cause of the image processing failure, the operator presses the continuation key 7. Then, as shown in the flowchart of FIG.
Measure the mounting position error of.

If the cause of the image processing failure is other than the check item displayed on the display unit 9 and it is necessary to stop the work of measuring the mounting position error of the recognition camera 3 and make an adjustment, Is the control panel 1 shown in FIG.
By pressing the “0” end key 8, the recognition camera mounting position measuring operation is forcibly ended as shown in the flowchart of FIG.

As described above, in the method of measuring the position of the recognition camera of the electronic component mounting apparatus according to the present embodiment, the XY table 5 for moving the origin substrate 1 so that the reference hole 2 is located on the axis of the recognition camera 3. The operation of inputting and moving the data of the moving amount of the camera, the work of recording the recognition camera mounting position error data obtained by the image processing, and the work of storing the error data in the control unit are automatically performed by a series of programs instead of manually. Work time
It is possible to reduce to / 10 and to prevent operation errors such as data input errors due to manual operation.

Further, when the image processing fails, error information and a countermeasure are displayed to prevent erroneous termination of the recognition camera mounting position measurement operation, and to prevent the image processing after the image processing failure. The procedure can be performed quickly.

Furthermore, since the positions of the plurality of reference holes 2 provided on the origin substrate 1 are collectively determined by image processing in the X direction and the Y direction, and the recognition camera mounting position measuring operation is performed, the operation is performed with high accuracy. Measurement can be performed at high speed.

In this embodiment, among the reference holes 2 of the origin substrate 1, three reference holes 2a, 2b, 2c arranged in the X direction are obtained by image processing to determine the positions of the recognition camera 3. Although the description has been made on the assumption that the mounting position error is detected, the mounting position error of the recognition camera 3 may be detected from the positions of the three reference holes 2 arranged in the Y direction.
By doing so, the reference hole 2 used for image processing can be selected according to the shape of the field of view of the recognition camera to be used and its mounting relationship with the insertion head 4, that is, the mounting direction.

The measurement may be performed by using three or more reference holes 2, for example, all five reference holes 2 of the origin substrate 1 shown in the present embodiment. It can detect an error in the mounting position of the camera 3.

(Embodiment 2) Hereinafter, a method for measuring a recognition camera mounting position of an electronic component mounting apparatus according to a second embodiment of the present invention will be described with reference to FIGS.

FIG. 9 is a flowchart showing a procedure of a method of measuring a camera mounting position of the electronic component mounting apparatus according to the present embodiment, and FIG. 10A is a front view showing a main part of the electronic component mounting apparatus according to the embodiment. FIG. 10B is a plan view of the same, and FIG. 11 is a front view showing a control panel 10 of the electronic component mounting apparatus according to the embodiment.

This embodiment is different from the first embodiment in that
Only two recognition cameras, the procedure of the measurement method, and the image displayed on the display unit 9 of the control panel 10 are different, and the other points are the same. Therefore, only the different points will be described in detail. However, a detailed description of other points is omitted.

In FIGS. 10 (a) and 10 (b), reference numeral 19 denotes an insertion head to which a recognition camera A17 and a recognition camera B18 are attached. In the same figure, reference holes 2, 2a, 2b and 2c are provided.
Is provided, and the XY table 5 that holds the origin substrate 1 and moves in the XY directions shown in the figure is the same as in the first embodiment, and a detailed description thereof will be omitted.

FIGS. 10 (a) and 10 (b) show a state in which the reference hole 2 comes to the axis of the recognition camera A17 mounted on the insertion head 19, as in the first embodiment. It is.

FIG. 11 is a front view showing a control panel 10 of the electronic component mounting apparatus according to the embodiment.
In the same manner as in the first embodiment, the error information displayed when the image processing operation fails is displayed on the display unit 9. The image processing operation by the recognition camera A17 fails, and the error information is displayed. And the check items for removing the cause of the image processing failure are displayed.

The procedure for measuring the position of the recognition camera of the electronic component mounting apparatus according to this embodiment will be described below.

As shown in the flowchart of FIG. 9, the origin substrate 1 is held by the XY table 5, and the reference hole 2b at the center of the origin substrate 1 is adjusted so as to be on the axis of the insertion head 19. Are the same as those in the first embodiment from the step of selecting the recognition camera mounting position error measuring function by pressing the key and pressing the measurement execution key 6 of the control panel 10 shown in FIG.

When the measurement execution key 6 is depressed, the XY table 5 is automatically set to 9 in the X direction as in the first embodiment.
After moving by 0 mm, as shown in FIG.
The reference hole 2 of the origin board 1 comes to the axis of, and the mounting position error of the recognition camera A17 is automatically obtained by the image processing.
Also, it is automatically stored in the control unit (not shown) of the electronic component mounting apparatus.

As described above, when the measurement of the mounting position error of the recognition camera A17 is successful, and then the mounting position error of the recognition camera B18 is measured, that is, the measurement of the mounting position error is performed as shown in the flowchart of FIG. When the recognition camera to be performed remains, the XY table 5 automatically moves by 180 mm in the X direction opposite to the previous one, and the reference hole 2 of the origin substrate 1 comes to the axis of the recognition camera B18. A17
As in the case of (1), the mounting position error of the recognition camera B18 is automatically obtained by the image processing, and is automatically stored in the control unit (not shown) of the electronic component mounting apparatus.

When measuring the mounting position error of the recognition camera B18, the XY table 5 is set 180 mm in the X direction opposite to the previous one.
The reason for the movement is that the recognition camera A17 and the recognition camera B18 are arranged so that their axes have a distance of 90 mm in the opposite direction from the axis of the insertion head 19, respectively. The data of the mounting position of the recognition camera B18 or the moving distance data of 180 mm is stored in the control unit in advance.

As described above, the mounting position error between the recognition camera A17 and the recognition camera B18 is measured and stored in the control unit. That is, there is no recognition camera that measures the mounting position error as shown in the flowchart of FIG. If so, the recognition camera attachment position measurement operation ends.

Next, the case where the image processing by the recognition camera A17 fails in the above-described recognition camera attachment position measuring procedure will be described.

If the image processing has failed, as shown in FIG. 11, since the image processing has failed on the display unit 9 with the recognition camera A17, the mounting position error of the recognition camera A17 is reported to the control unit (not shown) of the electronic component mounting apparatus. An error message indicating that the image processing has not been described is displayed, and a check item for image processing failure is also displayed on the display unit 9. In this state, when the operator presses the continuation key 7 after confirming based on the displayed check items, the recognition camera mounting position error is measured by the image processing of the recognition camera A17 as shown in the flowchart of FIG. I do.

The cause of the failure of the image processing is other than the check item displayed on the display unit 9, and the recognition camera A1
When it is necessary to stop the measurement operation of the mounting position error of 7 and make an adjustment, the operator presses the end key 8 of the control panel 10 shown in FIG. The mounting position measurement operation is forcibly terminated.

As described above, in the method of measuring the mounting positions of the recognition cameras of the electronic component mounting apparatus according to the present embodiment, when measuring the mounting positions of a plurality of recognition cameras, the mounting positions of all the recognition cameras can be performed by one operation. Since the measurement operation can be performed, the operation time of the recognition camera mounting position measurement operation can be reduced to about 1/10.

Further, when image processing for measuring the recognition camera mounting position fails, the operator is notified of the failure of the recognition camera mounting position measurement work by displaying error information, so that the correct recognition camera mounting position cannot be measured. It is possible to prevent the recognition camera mounting position measurement operation from being terminated as it is.

Further, by displaying the information of the recognition camera which failed in the image processing to indicate the recognition camera to be treated to the operator, the work time for removing the cause when the image processing failed is shortened. Can be.

Although the present embodiment has been described on the assumption that two recognition cameras are attached to the electronic component mounting apparatus, three or more recognition cameras may be attached. Needless to say.

[0065]

As described above, the method for measuring the recognition camera mounting position of the electronic component mounting apparatus according to the present invention can reduce the number of operation procedures for adjusting the recognition camera mounting and greatly reduce the work time. It has excellent effects, eliminating the possibility of adjustment errors due to erroneous operations due to the elimination of manual operations, and has the effect of not requiring highly skilled workers for adjustment. It is a great thing.

[Brief description of the drawings]

FIG. 1 is a flowchart showing a procedure of a method of measuring a recognition camera attachment position of an electronic component mounting apparatus according to a first embodiment of the present invention.

FIG. 2 is a front view showing an origin substrate.

FIG. 3A is a front view showing a main part of the electronic component mounting apparatus according to the embodiment; FIG.

FIG. 4 (a) is a front view and FIG. 4 (b) is a plan view.

FIG. 5 is an exemplary front view showing a control panel of the electronic component mounting apparatus according to the embodiment;

FIG. 6 is a front view of the same.

FIG. 7 is a flowchart showing a procedure for measuring a mounting position error of the recognition camera according to the embodiment;

FIG. 8 is a front view showing a control panel of the electronic component mounting apparatus according to the embodiment.

FIG. 9 is a flowchart illustrating a procedure of a method of measuring a recognition camera attachment position of the electronic component mounting apparatus according to the second embodiment of the present invention.

FIG. 10A is a front view showing a main part of the electronic component mounting apparatus according to the embodiment; FIG.

FIG. 11 is an exemplary front view showing a control panel of the electronic component mounting apparatus according to the embodiment;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Origin board 2, 2a, 2b, 2c Reference hole 3 Recognition camera 4 Insertion head 5 XY table 6 Measurement execution key 7 Continue key 8 End key 9 Display unit 10 Control panel 11 Temporary center position of reference hole 2a 12 Reference hole 2b Temporary center position 13 Temporary center position of reference hole 2c 14 Center position of reference hole 2a 15 Center position of reference hole 2b 16 Center position of reference hole 2c 17 Recognition camera A 18 Recognition camera B 19 Insertion head

Claims (7)

[Claims] 1. An electronic component for measuring a dimension between an axis of a recognition camera attached to an insertion head and an axis of the insertion head so as to be parallel to an axis of the insertion head of an electronic component mounting apparatus having a control panel. In the method of measuring the mounting position of the mounting camera, the reference board provided with the reference hole is first held on the XY table of the electronic component mounting apparatus, and the XY table is set so that the center of the reference hole of the reference board matches the axis of the insertion head. After the table is moved and adjusted, the XY table is moved by the data stored in the control unit in advance so that the reference hole of the origin substrate comes to the axis of the recognition camera. The reference hole of the substrate is read by a recognition camera and image processing is performed to determine a shift amount from a reference position, and the obtained shift amount is determined by the recognition camera. A method for measuring a mounting position of a recognition camera of an electronic component mounting apparatus, wherein an operation to be stored in the control unit as the mounting position error is automatically performed based on a series of programs. 2. A plurality of reference holes provided on an origin substrate are provided in the X direction or the Y direction, respectively, so as to be orthogonal to each other, and the plurality of reference holes are collectively measured in the X direction or the Y direction. 2. The method according to claim 1, wherein the average value is obtained as a shift amount. 3. The method according to claim 1, wherein error information is displayed on a control panel when image processing of the reference hole of the origin board has failed. 4. The method according to claim 3, wherein the control panel displays, in addition to the error information, a measure against the failure of the image processing. 5. The method according to claim 3, wherein the image processing of the reference hole of the origin substrate is performed again after removing the cause of the image processing failure. 6. When the electronic component mounting apparatus has a plurality of recognition cameras, when the dimension between the axes of the plurality of recognition cameras and the axis of the insertion head is sequentially measured, the mounting of the plurality of recognition cameras is performed. 6. The method according to claim 1, wherein an operation of obtaining a position error and storing the position error in the control unit is automatically performed based on a series of programs. . 7. The electronic component mounting apparatus according to claim 6, wherein, when the image processing of the reference hole of the origin board fails, the error information and the information of the recognition camera that failed in the image processing are displayed on the control panel. Recognition camera mounting position measurement method.