KR20070075757A - Apparatus for contacting devices to test sockets in semiconductor test handler - Google Patents

Abstract

A device connecting apparatus of a semiconductor device test handler is provided to connect a semiconductor device to a test socket of a test head with the exact power, by detecting that the test head is combined to a test site and exactly setting the moving distance of a contact push unit according to the combined state of the test head. A device connecting apparatus of a semiconductor device test handler is composed of a test head(100) provided with a test socket(110) connected with a semiconductor device and detachably combined to one surface of a test site; a contact push unit(200) installed at the test site with facing the test head, to contact the semiconductor device to the test socket of the test head by pushing; a push unit driving part moving the contact push unit in the desirable distance; a control unit controlling the operation of the push unit driving part; and a distance measuring unit measuring the relative distance between at least one spot of the contact push unit and the test head.

Description

Device for contacting devices to test sockets in semiconductor test handler}

1 is a cross-sectional view illustrating main parts of a conventional device connection device of a semiconductor device test handler.

FIG. 2 is a sectional view showing the principal parts of a structure in which a semiconductor device is connected to a test socket by the device connecting device of FIG. 1; FIG.

3 is a front view showing the structure of an embodiment of a device connecting device of the semiconductor device test handler according to the present invention;

FIG. 4 is a cross-sectional view illustrating main parts of the device connecting device of FIG. 3 and illustrates a state immediately before the test head is coupled to the test site. FIG.

FIG. 5 is a cross-sectional view illustrating main parts of the device connecting device of FIG. 3 and illustrates a state after the test head is coupled to the test site. FIG.

FIG. 6 is a view schematically illustrating that a coupling state and a position of a test head are sensed by a probe sensor and a push rod of the device connecting device of FIG. 3.

7 to 10 are main cross-sectional views showing in detail the structure in which the semiconductor device is connected to the test head by the device connecting device of FIG.

Explanation of symbols on the main parts of the drawings

1: Head mounting portion 1a: Through hole

100: test head 110: test socket

120: lead pin 130: socket guide

200: contact push unit 210: moving part

220: carrier push member 221: contact portion

222: guide bar 223: compression coil spring

230: element push member 232: compression coil spring

236: guide block 238: bushing

250: push unit 300: carrier module

510: push rod 515: compression coil spring

520: probe sensor S: semiconductor element

B: Ball T: Test Tray

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a handler for use in testing semiconductor devices, and more particularly, to a device connection device for a semiconductor device test handler for connecting semiconductor devices to a test socket of a test head by a predetermined pressing force.

In general, memory ICs or non-memory semiconductor devices and module ICs having their circuits properly configured on one substrate are shipped after various tests after production, and handlers are shipped with the semiconductor devices and module ICs as described above. This equipment is used to electrically connect the lamp to an external test device automatically and classify it according to the test result.

Typically, the handler returns the test target semiconductor devices loaded on the loading unit to a test site, and then electrically connects the semiconductor devices to a socket of the test head by using a contact push unit to a predetermined pressure. A test is performed by applying a predetermined electric signal, and the semiconductor devices, which have been tested at the test site, are returned to the unloading unit and sorted and stored in the customer tray according to the test result.

Recently, due to a trend of increasing integration of semiconductor devices, the time required for testing semiconductor devices is gradually increasing. Therefore, in order to improve the efficiency of testing a semiconductor device, a handler for mounting a plurality of semiconductor devices in one test tray to test a large number of semiconductor devices at a time is used.

1 and 2, a structure in which semiconductor devices are connected to a test socket at a test site of a conventional handler will be described in more detail as follows.

As shown in FIG. 1, the test tray T is a component for conveying semiconductor devices in a fixed state in a handler, and includes a plurality of carrier modules 30 for fixing and releasing the semiconductor devices to a metal frame having a rectangular frame shape. It consists of configurations installed at regular intervals.

The carrier module 30 is coupled to the test tray T via an elastic member 26 (see FIG. 2), such as a compression coil spring 32, to be installed to move elastically with respect to the test tray T. .

In addition, a test head 10 that is electrically connected to an external test equipment (called a 'tester') and applies an electrical signal for a test is detachably installed at a test site. The test heads 10 are arranged with a plurality of test sockets 11 to which semiconductor elements are connected at predetermined intervals.

In addition, the contact push unit 20 and the contact push unit for connecting the semiconductor element S of the test tray T to the test socket 11 at a predetermined pressure in a position opposite to the test head 10. A push unit driver 40 for linearly moving 20 is disposed.

The push unit driving unit 40 is a ball screw 41, a moving block 42 moving along the ball screw 41 and coupled to one side of the contact push unit 20, and the ball screw 41 It consists of a servo motor 43 and the like to rotate.

In addition, the contact push unit 20 is formed to protrude from the movable portion 20a coupled to the movable block 42 and the movable portion 20a and mounted on the carrier module 30 of the test tray T. It is composed of a plurality of connecting members 20b in contact with the semiconductor elements S.

As shown in FIG. 2, each of the connection members 20b of the contact push unit 20 functions as a buffer when the semiconductor element S is connected to the test socket 11 and at a predetermined pressing force. It is elastically supported by the compression spring 20c so that (S) can be pressed.

Hereinafter, the process by which a semiconductor element is connected to the test socket of a test head by the conventional element connection apparatus is demonstrated.

The semiconductor devices S are mounted on the carrier module 30 of the test tray T before being transferred to the test site. The test tray T on which the semiconductor element S is mounted is transferred into the test site by the conveying device and aligned in front of the test head 10 located at the test site.

Subsequently, the servomotor 43 is operated to rotate the ball screw 41 by the set amount, and the moving block 42 moves forward by the rotation of the ball screw 41, and the contact push unit 20 is fixed. Advance by the distance. When the contact push unit 20 is advanced and its connecting member 20b contacts the semiconductor elements of the carrier module 30 of the test tray T, the carrier module 30 is moved toward the test head 10 by a predetermined distance. It moves and the semiconductor element S is connected to the test socket 11.

At this time, the body portion 20ba in the middle of the connecting member 20b is in contact with the carrier module 30 and the contact portion 20bb at the end of the connecting member 20b is in contact with the surface of the semiconductor device S. The balls B of S are pressed against the lead pin 12 of the test socket 11 with a predetermined force.

By the way, the element connection apparatus of the conventional handler as mentioned above has the following problem.

As described above, when the contact push unit 20 of the element connecting device presses the carrier module 30 of the test tray to connect the semiconductor element to the test head 10, the contact push unit 20 is a push unit driver ( By the operation of 40) it is to be moved a given distance.

Therefore, when the test head 10 is coupled to the test site of the handler, the test head 10 may not be correctly aligned in the test site due to various factors such as machining or alignment error, or the test When a predetermined inclination occurs between the surface of the head 10 and the surface of the contact push unit 20, the semiconductor element when the contact push unit 20 presses the carrier module 30 and / or the semiconductor element (S) The ball B of (S) is not in contact with the lead pin 12 of the test socket 11 or is not pressed by a uniform force, which causes a problem that a test error occurs.

The present invention is to solve the above problems, an object of the present invention is to accurately detect the state that the test head is coupled to the test site, and to accurately determine the moving distance of the contact push unit for connection according to the coupling position of the test head The present invention provides a device connecting device for a semiconductor device test handler which enables the semiconductor device to be pressed to the test socket with accurate and uniform force.

The present invention for achieving the above object, the test head having a test socket to which the semiconductor device is connected, detachably coupled to one surface of the test site; A contact push unit installed at the test site so as to face the test head, for pressing and connecting a semiconductor device to a test socket of the test head; A push unit driver for moving the contact push unit by a desired distance; A control unit controlling an operation of the push unit driving unit; A device connecting device for a semiconductor device test handler including a distance measuring unit measuring a relative distance between at least one point of the contact push unit and the test head is provided.

Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the device connection device of the semiconductor device test handler according to the present invention.

As shown in FIGS. 3 to 5, the device connecting device of the present invention includes a test head 100 detachably coupled to a test site of a handler, and a test head 100 facing the test head 100 inside the test site. A contact push unit 200 which is installed to press the carrier module 300 (see FIG. 6) and the semiconductor element S (see FIG. 6) of the test tray T separately, and the contact push unit 200. It consists of a push unit driver (not shown) for linear movement to any desired position. For the sake of understanding, a part of the test site on which the test head 100 is mounted will be described as head mounting portion 1.

The test head 100 is a kind of interface that is electrically connected to a separate test equipment called a tester (TESTER) outside the handler and transmits and receives an electrical signal. The semiconductor device S is formed on a surface facing the inside of the test site. The plurality of test sockets 110 to which they are connected are arranged at regular intervals.

The contact push unit 200 may include a movable part 210 installed to be movable in the test head 100 in the test site, and a semiconductor device S mounted on the carrier module 300 of the test tray T. ) Is connected to the test socket 110 of the test head 100 is configured as a push unit (250). A detailed configuration of the contact push unit 200 will be described in more detail with reference to FIGS. 7 to 10 below.

Although not shown in the drawing, the push unit driving unit (not shown) includes a known linear motion device such as a ball screw, a servo motor, a linear motor, a drive pulley and a driven pulley, and a power transmission belt and a servo motor interconnecting them. Can be. The push unit driver connects the semiconductor device S to the test socket 110 by moving the movable part 210 of the contact push unit 200 by a desired distance, and the semiconductor device S and the test socket 110. Adjust the magnitude of the pressing force between the

On the other hand, a plurality of through holes 1a are formed at both edges of the head mounting portion 1 of the test site. The through hole 1a is provided with a push rod 510 which moves in and out of the test site according to whether the test head 100 is in contact with the edge portion of the test head 100. The push rod 510 is elastically supported by the compression coil spring 515 installed inside the through hole 1a.

In the state where the test head 100 is not in contact with the push rod 510, an outer end thereof is exposed to the outside of the head mounting part 1, and an inner end thereof is caught and supported by an inner side surface of the head mounting part 1.

Thus, when the test head 100 is coupled to the head mounting portion 1 such that the edge of the test head 100 contacts the outer end of the push rod 510, the push rod 510 is connected to the head mounting portion 1. It moves inward by a predetermined distance.

It is preferable that a plurality of push rods 510 are provided. As shown in this embodiment, one push rod 510 is installed at one edge of the head mounting unit 1 and two are installed at opposite edges to form a triangular arrangement structure. desirable.

In addition, probe sensors 520 are installed at positions corresponding to the push rods 510 at both edges of the movable part 210 of the contact push unit 200. The probe sensor 520 is formed to extend toward the test head 100, and the front end portion of the probe sensor 520 contacts the push rod 510 by the movement of the movable part 210.

The probe sensor 520 is electrically connected to a controller (not shown) that controls the operation of the push unit driver (not shown).

Therefore, when the front end portion of the probe sensor 520 contacts the push rod 510 by the movement of the movable unit 210, the control unit is applied to the probe sensor 520 and the push rod 510 while an electrical signal is applied to the control unit. Will recognize the contact.

Meanwhile, the configuration of the push unit 250 of the contact push unit 200 will be described in detail with reference to FIGS. 7 to 10.

The push part 250 of the contact push unit 200 is provided with respect to the carrier push member 220 and the movable part 210 and the carrier push member 220 which are installed to be relatively movable while sliding on the movable part 210. The element push member 230 is installed to be relatively movable while sliding, and the compression coil spring 232 elastically supports the element push member 230 with respect to the movable part 210.

The carrier push member 220 includes a plurality of guides having a contact portion 221 contacting the carrier module 300, one end of which is fixed to the contact portion 221, and the other end of which is slidably penetrated through the movable portion 210. A bar 222 and a compression coil spring 223 coupled to the outside of the guide bar 222 to elastically support the contact portion 221 with respect to the movable portion 210.

A first bushing 234 for slidably supporting the element push member 230 is mounted at the center portion of the contact portion 221.

In addition, the movable part 210 is provided with a second bushing 224 to slidably support the guide bar 222.

The element push member 230 is formed in a bar shape perpendicular to the movable portion 210, the spring support block 233, one end of the compression coil spring 232 is supported in the middle portion protrudes radially outward Is formed.

In addition, the device push member 230 is preferably installed to be inclined at an angle with respect to the movable portion (210). When the test head 100 is installed at a slight inclination when the test head is coupled to the test site, the device push member 230 is inclined automatically while pressing the semiconductor device S, thereby testing the semiconductor device S by the test socket 110. This is to pressurize with a uniform force against.

As an automatic alignment member for the automatic alignment of the device push member 230, a substantially spherical guide block 236 is rotatably installed at an arbitrary angle on the movable portion 210, and in the center of the guide block 236 A third bushing 238 is installed to slidably support the device push member 230.

Meanwhile, a plurality of lead pins 111 electrically connected to the balls B of the semiconductor device S are installed at the center of the test socket 110. In addition, a socket guide 130 surrounding the test socket 110 is disposed outside the test socket 110. The pair of guide pins 131 inserted into the guide grooves 330 of the carrier module 300 protrude from both corners of the socket guide 130. The lead pin 111 is preferably configured as a pogo pin to elastically contact the ball (B) of the semiconductor device (S) and to transmit an electrical signal.

The carrier module 300 is installed to be movable to the test tray T to a certain degree, and is elastically supported by the spring 320. The semiconductor device S is seated at a central portion of the carrier module 300 and is fixed in a releasable state by a latch (not shown).

Referring to the operation of the device for connecting the device of the present invention configured as described above in detail.

First, in order for the push unit 250 of the contact push unit 200 to press the semiconductor device S with the correct force on the test socket 110, the movable unit 210 must move by the correct distance from the initial position. For this purpose, the position of the test socket 110 with respect to the initial position of the movable part 210 should be accurately detected.

Therefore, after the test head 100 is coupled to the head mounting part 1 of the test site, the movable part 210 moves toward the test head 100 so that the engagement state of the test head 100 and the position of the test socket 110 are maintained. The process of detecting is preceded.

This will be described in detail as follows.

As shown in FIG. 4, before the test head 100 is coupled to the head mounting portion 1 of the test site, the push rod 510 has an outer end portion of the head mounting portion 1 by the action of the compression coil spring 515. ) Is exposed to the outside.

Subsequently, as shown in FIG. 5, when the test head 100 is coupled to the head mount 1, the push rod 510 is tested while the test head 100 contacts the outer end of each push rod 510. Move a predetermined distance inside the site. At this time, the movement distance of each push rod 510 depends on the state in which the test head 100 is coupled to the head mounting portion (1).

That is, when the edge surface of the test head 100 is completely attached to the surface of the head mounting portion 1, the outer end of the push rod 510 is fully inserted into the through hole 1a and the push rod 510 is Move to the maximum. On the other hand, if the test head 100 is slightly inclined with respect to the head mounting portion 1 and the edge of the test head 100 is not completely in contact with the surface of the head mounting portion 1, the outer end of the push rod 510 Without fully entering into the through hole 1a, the push rod 510 is moved by the distance pressed by the test head 100.

Therefore, the push rod 510 moves to the inside of the test site according to the state in which the test head 100 is coupled to the head mounting part 1.

Subsequently, when the control unit applies power to the servo motor of the push unit driving unit (not shown) or a motor capable of other position control, the movable unit 210 moves from the initial position toward the test head 100.

As shown in FIG. 6, any one of the probe sensors 520 attached to the test head 100 comes into contact with the push rod 510 which is moved the most among the three push rods 510. . At this time, the controller (not shown) stores the position information of the push rod 510 contacted by the probe sensor 520.

Subsequently, as the movable unit 210 continues, the remaining probe sensors 520 sequentially contact with the push rod 510 and store respective position information at every moment of contact.

When contact is made between all the probe sensors 520 and the push rods 510, the movable unit 210 returns to the initial initial position.

The controller calculates deviations of the position information values and compares the maximum and / or average values of the obtained deviations with values preset in the controller. When the deviation value obtained as described above is out of the range of the set value, the control unit determines that the test head 100 is incorrectly coupled to the head mounting unit 1, sends an error message to an external worker, and sends the test head ( 100 is required to be rejoined to the head mount 1.

On the other hand, if the obtained deviation value is determined within the set value range, the control unit calculates the relative position of the test socket 110 using the three position information values, and moves the movable unit 210 when performing the test. Set the distance.

When the position of the test socket 110 is calculated through the same process as described above, and the moving distance of the movable unit 210 is determined, the test is performed. This test process will be described with reference to FIGS. 7 to 10.

As shown in FIG. 7, when the test is started, the test tray T on which the semiconductor devices S are mounted is transferred into a test site by a separate conveying means (not shown), and thus the upper side of the test head 100. Is sorted on. At this time, each carrier module 300 of the test tray T is aligned with the test socket 110.

Subsequently, as shown in FIG. 8, by operation of a pneumatic cylinder (not shown), the test tray T is moved toward the test head 100, and a hard stoper mounted on the wall surface 400 of the test site. 410 is contacted.

Next, as shown in FIG. 9, the push unit driving unit operates to move the movable unit 210 toward the test head 100, and the contact unit 221 of the carrier push member 220 is connected to the carrier module 300. The carrier module 300 is pushed downward while in contact. Accordingly, the lower surface of the carrier module 300 is supported while touching the upper surface of the socket guide 130.

Subsequently, as shown in FIG. 10, when the movable part 210 proceeds further downward, the carrier push member 220 does not proceed any further by the socket guide 130, so that the movable part 210 moves by the carrier push member. The compression coil spring 223 of 220 is moved downward while compressing. At the same time, the element push member 230 is lowered along the movable portion 210 so that the lower end thereof contacts the upper surface of the semiconductor element S.

In this state, when the movable portion 210 is slightly lowered, the compression coil spring 232 is compressed to apply a predetermined elastic force to the semiconductor device S, whereby the ball B of the semiconductor device S is connected to the test socket ( It is connected to the lead pin 120 of 110 at a predetermined pressure.

In this case, the distance moved by the movable unit 210 from the initial position is a distance determined when measuring the relative position of the test socket 110 using the probe sensor 520.

Thereafter, a test is performed while a predetermined electrical signal is applied to the test head 100 from a tester (not shown).

Meanwhile, the push rod 510 and the probe sensor 520 are not only used to measure the coupling state of the test head 100 and the relative position between the contact push unit 200 and the test socket 110, but also the contact push unit. It can also be used as a limit sensor that prevents overrun of 200.

That is, when the movable part 210 of the contact push unit 200 moves excessively over the set distance and the probe sensor 520 contacts the push rod 510, the control unit moves the contact push unit over the set distance. It is determined that the operation of the push unit driving unit stops, sends an error message to the outside to prevent the semiconductor element from being pressed by excessive force, and to protect the equipment.

On the other hand, in the above-described embodiment of the device connection device, the relative distance from the contact push unit 200 to the push rod 510 was measured using the probe sensor 520 which detects the position by the contact method. Alternatively, the relative distance from the contact push unit 200 to the push rod 510 may be detected using a non-contact displacement sensor such as a ray sensor.

In addition, in the above-described embodiment, the three push rods 510 and the probe sensors 520 are installed in a triangular arrangement so that the test head 100 is coupled to the head mounting unit 1. Direction, and to what extent it is mounted in an inclined state, and the relative position of the test socket 110 with respect to the contact push unit 200 was detected. However, alternatively, four or more pushrods 510 and probe sensors 520 may be used to detect the engagement and relative position of the test head.

The device connection device of the semiconductor device test handler of the present invention configured as described above has the following effects.

First, since the test head recognizes the state of being coupled to the test site and can accurately set the moving distance of the contact push unit during the test according to the state of engagement of the test head, the semiconductor device can be connected to the test socket of the test head with the correct force. Can be. Thereby, test reliability can be improved and test efficiency can be improved.

Second, when the contact push unit is excessively moved beyond the set distance, the probe sensor is in contact with the push rod so that the controller can recognize it, thereby preventing the excessive movement of the contact push unit, that is, the overrun phenomenon. The element and each component can be protected.

Claims (5)

A test head having a test socket to which the semiconductor device is connected, the test head being detachably coupled to one surface of the test site; A contact push unit installed at the test site so as to face the test head, for pressing and connecting a semiconductor device to a test socket of the test head; A push unit driver for moving the contact push unit by a desired distance; A control unit controlling an operation of the push unit driving unit; And a distance measuring unit measuring a relative distance between at least one point of the contact push unit and the test head. The apparatus of claim 1, wherein the distance measuring unit comprises: a push rod mounted on one surface of a test site to which the test head is coupled to move inward and outward and protruding into the test site by contact with the test head; A probe sensor formed to protrude from the contact push unit and electrically connected to the control unit to selectively contact the push rod by the movement of the contact push unit to allow the control unit to detect contact with the push rod. A device connecting device for a semiconductor device test handler, characterized in that. The device connecting device of claim 2, wherein the distance measuring unit further comprises an elastic member elastically supporting the push rod with respect to one surface of the test site. 3. The device connecting device of claim 1 or 2, wherein the distance measuring unit is installed at at least three points on one surface of the test site. The apparatus of claim 1, wherein the distance measuring unit comprises: a push rod mounted on one surface of a test site to which the test head is coupled to move inward and outward and protruding into the test site by contact with the test head; And a displacement sensor fixedly installed at the contact push unit and measuring a distance from an inner end of the push rod in a non-contact manner.

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