KR20240026549A - Test Handler for Electronic Component - Google Patents

Abstract

The present invention includes a loading unit that performs a loading process of loading electronic components to be tested onto a test tray; An unloading unit that performs an unloading process to unload the tested electronic components from the tray; A test unit that performs a test process to connect electronic components stored in a test tray to test equipment; a first chamber unit that delivers the test tray on which the loading process has been performed to the test unit; a second chamber unit delivering the test tray on which the test process has been performed to the unloading unit; and a rotating part that rotates the test tray so that the test tray is switched between a horizontal state and a vertical state, wherein the test part includes a first moving mechanism for moving the test tray and the electronic components stored in the test tray toward the test equipment, the first moving mechanism 1. A first driving mechanism for moving the moving mechanism, and a first connection distance for the first driving mechanism to move the first moving mechanism toward the test equipment based on the first driving information of the first driving mechanism. It relates to an electronic component test handler including a first control mechanism.

Description

Test Handler for Electronic Component}

The present invention relates to an electronic component test handler for testing electronic components and classifying them by grade.

Memory semiconductor devices, non-memory semiconductor devices, CPU (Central Processing Unit), etc. (hereinafter referred to as 'electronic components') are manufactured through various processes. For example, electronic components go through various processes, such as being classified by grade through a testing process using handler equipment such as a test handler.

The test handler performs a loading process, a testing process, and an unloading process for electronic components. The loading process is a process in which a test handler loads electronic components from a user tray to a test tray. The test process is a process in which a test handler connects electronic components stored in a test tray to test equipment. The test equipment performs certain tests on electronic components. The unloading process is a process in which a test handler unloads electronic components from a test tray to a customer tray. In this case, the test handler classifies electronic components into classes according to test results.

Here, the test process is performed by connecting an electronic component stored in a test tray to the test equipment by a contact unit of the test handler. However, in the past, there was a problem in that it could not be confirmed whether the test process was performed while the electronic component stored in the test tray was normally connected to the test equipment. Because of this, there is a problem in the past that the accuracy of the testing process is reduced.

The present invention was developed to solve the problems described above, and provides an electronic component test handler that can prevent the accuracy of the test process from being deteriorated due to electronic components stored in a test tray not being properly connected to the test equipment. It is for this purpose.

In order to solve the problems described above, the present invention may include the following configuration.

An electronic component test handler according to the present invention includes a loading unit that performs a loading process of loading electronic components to be tested onto a test tray; An unloading unit that performs an unloading process to unload the tested electronic components from the tray; A test unit that performs a test process to connect electronic components stored in a test tray to test equipment; a first chamber unit that delivers the test tray on which the loading process has been performed to the test unit; a second chamber unit delivering the test tray on which the test process has been performed to the unloading unit; and a rotation unit that rotates the test tray so that the test tray switches between a horizontal state and a vertical state.

In the electronic component test handler according to the present invention, the test unit includes a test tray, a first moving mechanism for moving the electronic components stored in the test tray toward the test equipment, and a first driving mechanism for moving the first moving mechanism. , and a first control mechanism that adjusts a first connection distance through which the first driving mechanism moves the first moving mechanism toward the test equipment based on first driving information of the first driving mechanism.

According to the present invention, the following effects can be achieved.

The present invention is implemented so that even if the separation distance between the test tray and the test equipment located at the test site changes due to various reasons such as replacement of components, maintenance, aging, etc., the changed separation distance can be responded to. Accordingly, the present invention can improve the accuracy of connecting electronic components to test equipment even if the separation distance is changed, and through this, the accuracy of the testing process can be improved. Additionally, the present invention can improve the ease of response to replacement, maintenance, aging, etc. of component parts.

1 is a schematic block diagram of an electronic component test handler according to the present invention.
Figure 2 is a schematic plan view of an electronic component test handler according to the present invention.
Figure 3 is a schematic perspective view showing the circulation path of the test tray in the electronic component test handler according to the present invention.
Figure 4 is a schematic side cross-sectional view showing a portion of the test site in the electronic component test handler according to the present invention and a schematic block diagram of the first control mechanism.
Figure 5 is an enlarged view of part A of Figure 4
Figure 6 is a conceptual plan view of the test site and a schematic block diagram of the test unit in the electronic component test handler according to the present invention.

Hereinafter, an embodiment of an electronic component test handler according to the present invention will be described in detail with reference to the attached drawings. In Figure 3, reference numerals corresponding to locations or devices are indicated on the test tray according to the process performed on the test tray.

Referring to FIGS. 1 to 3, the electronic component test handler 1 according to the present invention tests electronic components such as memory semiconductor devices, non-memory semiconductor devices, and CPU (Central Processing Unit), and classifies them by grade according to the test results. It is for classification. The electronic component test handler 1 according to the present invention performs a loading process, a testing process, and an unloading process for electronic components. The loading process loads electronic components from a user tray to a test tray (100). The test process connects the electronic components stored in the test tray 100 to the test equipment 200. The unloading process unloads electronic components from the test tray 100 to the customer tray. The unloading process can be performed by classifying electronic components by grade according to test results in the test process and unloading them into a customer tray.

The electronic component test handler (1) according to the present invention includes a loading unit (2), an unloading unit (3), a test unit (4), a first chamber unit (5), a second chamber unit (6), and a rotation unit. (7) may be included.

<Loading section>

Referring to Figures 1 to 3, the loading unit 2 performs the loading process. The loading unit 2 may perform the loading process by loading the electronic component to be tested onto the test tray 100 . The loading unit 2 may load the electronic component to be tested onto the test tray 100 located at the loading position 20 . The loading unit 2 can perform the loading process on the test tray 100 arranged in a horizontal state.

The loading unit 2 may include a loading stacker 21, a loading picker 22, and a loading buffer 23.

The loading stacker 21 stores customer trays containing electronic components to be tested. The customer tray may contain a plurality of electronic components. A plurality of customer trays may be stored in the loading stacker 21.

The loading picker 22 picks up electronic components to be tested from a customer tray located in the loading stacker 21 and stores them in the test tray 100 located in the loading position 20. The loading picker 22 can pick up a plurality of electronic components at once. The loading picker 22 can be moved along the first axis direction (X-axis direction) and the second axis direction (Y-axis direction). The first axis direction (X-axis direction) and the second axis direction (Y-axis direction) are axial directions orthogonal to each other. The loading picker 22 can be raised and lowered along the vertical direction. The vertical direction (Z-axis direction) is an axis direction perpendicular to each of the first axis direction (X-axis direction) and the second axis direction (Y-axis direction). A plurality of electronic components may be stored in the test tray 100.

The loading buffer 23 temporarily stores electronic components to be tested. The loading picker 22 is a first loading picker (not shown) that transfers the electronic component to be tested from the customer tray located in the loading stacker 21 to the loading buffer 23, and the electronic component to be tested is It may include a second loading picker (not shown) that transfers the load from the loading buffer 23 to the test tray 100. The loading buffer 23 may be moved along the second axis direction (Y-axis direction).

<Unloading department>

Referring to Figures 1 to 3, the unloading unit 3 performs the unloading process. The unloading unit 3 may perform the unloading process by unloading the tested electronic component from the test tray 100. The unloading unit 3 may unload the tested electronic component from the test tray 100 located at the unloading position 30. The unloading unit 3 can perform the unloading process on the test tray 100 arranged in a horizontal state. The unloading unit 3 and the loading unit 2 may be arranged to be spaced apart from each other along the first axis direction (X-axis direction).

The unloading unit 3 may include an unloading stacker 31, an unloading picker 32, and an unloading buffer 33.

The unloading stacker 31 stores customer trays containing tested electronic components. A plurality of customer trays may be stored in the unloading stacker 31. The tested electronic components may be placed in customer trays located at different positions for each grade in the unloading stacker 31 according to the test results.

The unloading picker 32 picks up the electronic components tested on the test tray 100 located at the unloading position 30 and stores them in a customer tray located at the unloading stacker 31. The unloading picker 32 can pick up a plurality of electronic components at once. The unloading picker 32 may be moved along the first axis direction (X-axis direction) and the second axis direction (Y-axis direction). The unloading picker 32 may be raised and lowered along the vertical direction.

The unloading buffer 33 temporarily stores the tested electronic components. The unloading picker 32 includes a first unloading picker (not shown) that transfers the tested electronic component from the test tray 100 to the unloading buffer 33, and a first unloading picker (not shown) that transfers the tested electronic component to the unloading buffer ( 33) may include a second unloading picker (not shown) that transfers to the customer tray located in the unloading stacker 31. The unloading buffer 33 may be moved along the second axis direction (Y-axis direction).

<Testing Department>

Referring to Figures 1 to 3, the test unit 4 performs the test process. The test unit 4 can perform the test process by connecting the electronic components stored in the test tray 100 to the test equipment 200. A Hi-fix board included in the test equipment 200 may be coupled to the test unit 4. A test socket may be installed on the high-fix board to connect electronic components stored in the test tray 100. The test unit 4 can perform the test process on the test tray 100 arranged vertically. The test unit 4 may be implemented as a chamber.

The test unit 4 may include a test site 40. The test process can be performed at the test site 40. The test unit 4 may include an upper test site 40a and a lower test site 40b.

At the upper test site 40a, a test process may be performed to connect electronic components stored in the test tray 100 to the test equipment 200. Based on the vertical direction, the upper test site 40a may be placed above the lower test site 40b.

At the lower test site 40b, a test process of connecting electronic components stored in the test tray 100 to the test equipment 200 may be performed. In this case, a test process may be performed on electronic components stored in separate test trays 100 at the upper test site 40a and the lower test site 40b. The high-fix board may be installed in each of the upper test site 40a and the lower test site 40b. The test process at the lower test site 40b and the test process at the upper test site 40a may be performed in parallel.

<Chamber 1>

Referring to Figures 1 to 3, the first chamber unit 5 delivers the test tray 100 on which the loading process has been performed to the test unit 4. Based on the second axis direction (Y-axis direction), the first chamber part 5 may be disposed rearward (in the direction of arrow BD) with respect to the loading part 2. The first chamber unit 5 can adjust the temperature of the electronic components stored in the test tray 100 to the test temperature while transporting the test tray 100 toward the rear (in the direction of arrow BD). The test temperature can be preset by the operator. When the test temperature is higher than room temperature, the first chamber unit 5 can adjust the temperature of the electronic component stored in the test tray 100 to the test temperature through heating. When the test temperature is lower than room temperature, the first chamber unit 5 can adjust the temperature of the electronic components stored in the test tray 100 to the test temperature through cooling. The first chamber unit 5 includes a first transfer unit (not shown) for transferring the test tray 100, and a first temperature control unit for controlling the temperature of the electronic components stored in the test tray 100 ( (not shown) may be included.

The first chamber unit 5 and the test unit 4 may be arranged side by side along the first axis direction (X-axis direction). In this case, based on the first axis direction (X-axis direction), the test unit 4 may be disposed between the first chamber unit 5 and the second chamber unit 6. The first chamber unit 5 can control the temperature of electronic components stored in the test tray 100 while transporting the test tray 100 arranged in a vertical state. The first chamber portion 5 may be implemented as a chamber.

The first chamber unit 5 can supply the test tray 100 to each of the upper test site 40a and the lower test site 40b. To this end, the first chamber unit 5 may include a first raising unit (not shown) for raising the test tray 100 to a height corresponding to the upper test site 40a. The first chamber unit 5 may include a first supply unit (not shown) for pushing the test tray 100 and supplying it to the test unit 4.

<Second chamber section>

Referring to Figures 1 to 3, the second chamber unit 6 delivers the test tray 100 on which the test process has been performed to the unloading unit 3. Based on the second axis direction (Y-axis direction), the second chamber portion 6 may be disposed rearward (in the direction of arrow BD) with respect to the unloading portion 3. The second chamber unit 6 can control the temperature of the electronic components stored in the test tray 100 to room temperature while transporting the test tray 100 toward the front (FD arrow direction). When the test temperature is higher than room temperature, the second chamber unit 6 can adjust the temperature of the electronic components stored in the test tray 100 to room temperature through cooling. When the test temperature is lower than room temperature, the second chamber unit 6 can adjust the temperature of the electronic components stored in the test tray 100 to room temperature through heating. The second chamber unit 6 includes a second transfer unit (not shown) for transferring the test tray 100, and a second temperature control unit for controlling the temperature of the electronic components stored in the test tray 100 ( (not shown) may be included. The second chamber unit 6 can control the temperature of the electronic components stored in the test tray 100 while transporting the test tray 100 arranged in a vertical state. The second chamber portion 6 may be implemented as a chamber.

The second chamber unit 6 can receive the test tray 100 from each of the upper test site 40a and the lower test site 40b. To this end, the second chamber unit 6 may include a first lowering unit (not shown) for lowering the test tray 100 supplied from the upper test site 40a. The second chamber unit 6 may include a second supply unit (not shown) for pulling the test tray 100 from the test unit 4.

<Rotate section>

Referring to Figures 1 to 3, the rotate unit 7 rotates the test tray 100. The rotation unit 7 can rotate the test tray 100 to switch the test tray 100 between a horizontal state and a vertical state. By the rotating unit 7, the loading process and the unloading process can be performed with the test tray 100 placed in a horizontal state. By using the rotating unit 7, the test process can be performed with the test tray 100 arranged in a vertical state. By the rotating part 7, a process of controlling the temperature of the electronic component while transferring the test tray 100 in a vertical state is performed in each of the first chamber part 5 and the second chamber part 6. You can.

The rotating unit 7 may include a loading rotator 71 and an unloading rotator 72.

The loading rotator 71 rotates the test tray 100 from a horizontal state and converts it into a vertical state. After receiving the test tray 100 in a horizontal state from the loading unit 2, the loading rotator 71 can rotate the test tray 100 to convert it to a vertical state. Afterwards, the loading rotator 71 can supply the test tray 100 in a vertical state to the first chamber unit 5. The loading rotator 71 may be disposed between the loading unit 2 and the first chamber unit 5. The loading rotator 71 may be disposed rearward (in the direction of arrow BD) with respect to the loading unit 2 and may be disposed on the upper side of the first chamber unit 5.

The unloading rotator 72 rotates the test tray 100 from a vertical state and converts it into a horizontal state. After receiving the test tray 100 in a vertical state from the second chamber unit 6, the unloading rotator 72 can rotate the test tray 100 to convert it to a horizontal state. Afterwards, the unloading rotator 72 can supply the test tray 100 in a horizontal state to the unloading unit 3. The unloading rotator 72 may be disposed between the unloading unit 3 and the second chamber unit 6. The unloading rotator 72 may be disposed rearward (in the direction of arrow BD) with respect to the unloading unit 3 and may be disposed on the upper side of the second chamber portion 6. Based on the first axis direction (X-axis direction), the unloading rotator 72 and the loading rotator 71 may be arranged to be spaced apart from each other.

Although not shown, the rotation unit 7 may rotate the test tray 100 using a single rotator to switch between the vertical and horizontal states. In this case, the rotator can rotate the test tray 100 transferred from the loading unit 2 to change it from a horizontal state to a vertical state, and then supply it to the first chamber part 5. The rotator can rotate the test tray 100 transferred from the second chamber unit 6 to change it from a vertical state to a horizontal state, and then supply it to the unloading unit 3.

<Transfer Department>

Referring to FIGS. 1 to 3, the transfer unit 8 moves the test tray 100 on which the unloading process has been performed from the unloading position 30 of the unloading unit 3 to the loading unit 2. It is transferred to the loading position (20). The transfer unit 8 can transfer the test tray 100 by pushing or pulling it. The transfer unit 8 may transfer the test tray 100 by pushing it or pulling the test tray 100 according to the transfer direction of the test tray 100.

Here, the test unit 4 may include a contact unit 4a for connecting the electronic component stored in the test tray 100 at the test site 40 to the test equipment 200. The contact unit 4a moves the test tray 100 and the electronic components stored in the test tray 100 toward the test equipment 200, thereby transferring the electronic components stored in the test tray 100 to the test equipment 200. ) can be connected to. In this case, the contact unit 4a is a carrier that pressurizes the test tray 100 to move it toward the test equipment 200 and pressurizes the electronic components to store the electronic components in the test tray 100. The module can be moved toward the test equipment 200.

In this case, the test site ( In 40), the separation distance between the electronic component stored in the test tray 100 and the test equipment 200 may be changed. Accordingly, if the distance by which the contact unit 4a moves the test tray 100 and the electronic components stored in the test tray 100 toward the test equipment 200 does not change, the Electronic components may not be properly connected to the test equipment 200. Because of this, the accuracy of the testing process may be reduced. To prevent this, the test unit 4 of the electronic component test handler 1 according to the present invention may be implemented as follows.

The test unit 4 may include a first moving mechanism 41, a first driving mechanism 42, and a first adjusting mechanism 43.

The first moving mechanism 41 moves the test tray 100 and the electronic components stored in the test tray 100 toward the test equipment 200. The first moving mechanism 41 can be moved toward the test equipment 200 by the first driving mechanism 42 and can be moved to the opposite side of the testing equipment 200. In this case, the first moving mechanism 41 can be moved along the second axis direction (Y-axis direction). Based on the second axis direction (Y-axis direction), the test tray 100 located at the test site 40 will be placed between the test equipment 200 and the first moving mechanism 41. You can.

The first moving mechanism 41 may include a first tray pusher 411 and a first component pusher 412.

The first tray pusher 411 moves the test tray 100 toward the test equipment 200. The first tray pusher 411 can move the test tray 100 toward the test equipment 200 by directly pressing the test tray 100. The first tray pusher 411 presses the guide rail 4b that guides the movement of the test tray 100 and moves the guide rail 4b toward the test equipment 200, thereby moving the test tray 100. It can be moved toward the test equipment 200. When the pressing force is eliminated by the first tray pusher 411, the guide rail 4b can be moved to its original position using the restoring force of an elastic member (not shown). The first tray pusher 411 may be disposed outside the first part pusher 412. The first tray pusher 411 may be placed closer to the test equipment 200 than the first part pusher 412. In this case, the end of the first tray pusher 411 facing the test equipment 200 will protrude further toward the test equipment 200 than the end of the first part pusher 412 facing the test equipment 200. You can. Accordingly, when the first driving mechanism 42 moves the first moving mechanism 41 toward the test equipment 200, the first tray pusher 411 first moves the test tray 100 or the guide rail. (4b) may be contacted.

The first component pusher 412 moves the electronic component stored in the test tray 100 toward the test equipment 200. The first component pusher 412 can move the electronic component toward the test equipment 200 by directly pressing the electronic component. The first component pusher 412 may include a first contact socket 412a for pressing electronic components. When connecting a plurality of electronic components to the test equipment 200 at once, the first component pusher 412 may include a plurality of first contact sockets 412a.

Referring to Figures 1 to 4, the first driving mechanism 42 moves the first moving mechanism 41. The first driving mechanism 42 can move the first moving mechanism 41 using a driving force generated by a motor (not shown). The first driving mechanism 42 may use a ball screw method using a ball screw and a ball nut to move the first moving mechanism 41 with a driving force generated by a motor. . The first moving mechanism 41 may be coupled to the first driving mechanism 42. In this case, the first moving mechanism 41 may be disposed between the test tray 100 disposed at the test site 40 and the first driving mechanism 42.

Referring to FIGS. 1 to 4, the first control mechanism 43 provides a first connection distance through which the first drive mechanism 42 moves the first movement mechanism 41 toward the test equipment 200. It is to control. The first connection distance refers to the distance at which the first moving mechanism 41 is moved toward the test equipment 200 by the first driving mechanism 42 based on the second axis direction (Y-axis direction). can do. The first control mechanism 43 can adjust the first connection distance based on the first drive information of the first drive mechanism 42. The first driving information is related to the amount of load applied to the first driving mechanism 42 when the first driving mechanism 42 moves the first moving mechanism 41 toward the test equipment 200. You can. For example, the first driving information is the torque amount of the first driving mechanism 42, and the torque generated by the motor of the first driving mechanism 42 in the process of moving the first moving mechanism 41 ( Torque).

In this case, even after the electronic component stored in the test tray 100 is normally connected to the test equipment 200, the first driving mechanism 42 continues to operate the first moving mechanism 41 to test the test equipment 200. ), the reaction force generated as the electronic component is supported by the test equipment 200 increases. Accordingly, the torque amount of the first driving mechanism 42 can be increased. Meanwhile, if the electronic component stored in the test tray 100 is not properly connected to the test equipment 200, the reaction force generated as the electronic component is supported by the test equipment 200 is reduced. Accordingly, the torque amount of the first driving mechanism 42 can be increased.

Based on this operating principle, the first control mechanism 43 allows the first drive mechanism 42 to operate the first movement mechanism 41 based on the first drive information of the first drive mechanism 42. The first connection distance moved toward the test equipment 200 can be adjusted. For example, the first control mechanism 43 operates the test equipment 200 so that the first drive mechanism 42 operates the first movement mechanism 41 until the first drive information reaches a preset first reference value. ) By controlling the first moving mechanism 41 to move toward ), the first connection distance can be adjusted. The first reference value is a value related to the first driving information when the electronic component is normally connected to the test equipment 200 so that the test equipment 200 can perform a test process for the electronic component. This may be the torque amount of the first driving mechanism 42 when normally connected to the test equipment 200. The first reference value may be set in advance by the operator through prior testing, etc.

Therefore, even if the separation distance changes due to various causes such as replacement, maintenance, aging, etc. of the component parts, the electronic component test handler 1 according to the present invention uses the first adjustment mechanism 43 to By adjusting the first connection distance through which the first driving mechanism 42 moves the first moving mechanism 41 toward the test equipment 200, it is possible to respond to the changed separation distance. Accordingly, the electronic component test handler 1 according to the present invention can improve the accuracy of connecting the electronic component to the test equipment 200 even if the separation distance is changed, thereby improving the accuracy of the testing process. It can be improved. In addition, the electronic component test handler 1 according to the present invention can improve the ease of response to replacement, maintenance, aging, etc. of the component parts.

The first control mechanism 43 may include a first acquisition module 431.

The first acquisition module 431 acquires the first driving information. The first acquisition module 431 can receive the first drive information from the first drive mechanism 42 through wired communication, wireless communication, etc. The first acquisition module 431 may acquire the first drive information by measuring the torque amount of the first drive mechanism 42. In this case, the first driving information may be the torque amount of the first driving mechanism 42.

The first control mechanism 43 may include a first confirmation module 432, a first calculation module 433, and a first control module 434.

The first confirmation module 432 checks whether the first driving information acquired by the first acquisition module 431 reaches the first reference value. The first confirmation module 432 may receive the first driving information from the first acquisition module 431 through wired communication, wireless communication, etc. The first reference value may be stored in advance in the first confirmation module 432. The first confirmation module 432 compares the first drive information and the first reference value to check whether the first drive information has reached the first reference value. The first confirmation module 432 can provide the confirmation result to the first calculation module 433 through wired communication, wireless communication, etc.

When it is confirmed by the first confirmation module 432 that the first drive information has reached the first reference value, the first calculation module 433 determines the first connection distance using the first drive information. It can be calculated. The first calculation module 433 calculates the first calculation module 433 until the speed at which the first moving mechanism 41 moves by the first driving mechanism 42 and the first driving information reach the first reference value. The first connection distance can be calculated using the time during which the driving mechanism 42 moves the first moving mechanism 41. The first calculation module 433 may calculate the first connection distance using the operating time of the first driving mechanism 42 until the first driving information reaches the first reference value. . The first calculation module 433 may provide the first connection distance to the first control module 434 through wired communication, wireless communication, etc.

The first control module 434 controls the first driving mechanism 42. The first control module 434 allows the first driving mechanism 42 to operate the first moving mechanism 41 according to the first connection distance calculated by the first calculation module 433. The first driving mechanism 42 can be controlled to move toward ). After the separation distance is changed due to various causes such as replacement, maintenance, aging, etc. of the component parts, the first acquisition module 431, the first confirmation module 432, and the first calculation module ( When the first connection distance is calculated by 433), the first control module 434 stores the first connection distance and operates the first driving mechanism according to the first connection distance from the next test tray 100. 42) can be controlled. Accordingly, when compared with the comparative example in which the first connection distance is calculated every time the test tray 100 is located in the test site 40, the electronic component test handler 1 according to the present invention is capable of calculating the first connection distance By omitting the task of calculating the first connection distance after the distance is calculated until the separation distance is changed again, the time taken for the test process can be shortened. Therefore, the electronic component test handler 1 according to the present invention can increase productivity for electronic components classified by grade according to test results. The first control module 434 can control the first driving mechanism 42 through wired communication, wireless communication, etc.

Here, when the separation distance is changed excessively due to replacement, maintenance, aging, etc. of the component parts, the first driving mechanism 42 moves the first moving mechanism 41 toward the test equipment 200. Even if it is moved, the first driving information may not reach the first reference value. Additionally, if the first driving mechanism 42 moves the first moving mechanism 41 an excessive distance toward the test equipment 200, problems such as shortened service life may occur. To prevent this, the first control mechanism 43 may include a first detection module 435.

Referring to Figures 1 to 5, the first detection module 435 is used to detect whether the first moving mechanism 41 has reached a preset first limit position. The first limit position may be a position where the first moving mechanism 41 can move toward the test equipment 200 without excessive load being applied to the first driving mechanism 42. The first limit position may be a coordinate value based on the second axis direction (Y-axis direction). The first limit position may be set in advance by the operator through prior testing, etc.

When the first detection module 435 detects that the first moving mechanism 41 has reached the first limit position, it can provide first detection information to the first confirmation module 432. The first detection module 435 may provide the first detection information to the first confirmation module 432 through wired communication, wireless communication, etc.

When the first detection module 435 detects that the first moving mechanism 41 has reached the first limit position, the test unit 4 can operate as follows.

First, the first confirmation module 432 can check whether the first driving information is less than the first reference value and more than a preset first tolerance value. The first allowable value is an error range that allows additional movement of the first movement mechanism 41 based on the first limit position, and is a value related to the first drive information. The first allowable value and the first reference value may each be a torque amount of the first driving mechanism 42. The first allowable value may be set in advance by the operator through prior testing, etc. For example, when the first reference value is 1, the first allowable value may be set to 0.9. In this case, if the first drive information is 0.9, there is a high possibility of reaching the first reference value if the first movement mechanism 41 moves only an additional amount corresponding to 0.1, so the first drive information is 0.9. It is implemented to check whether it is above the first allowable value even if it is less than the 1 standard value. The first allowable value may be stored in advance in the first confirmation module 432. The first confirmation module 432 can provide confirmation results to the first detection module 435 and the first control module 434 through wired communication, wireless communication, etc.

Next, when it is confirmed by the first confirmation module 432 that the first drive information is less than the first reference value and more than the first allowable value, the first detection module 435 determines the first limit position. Detection can be turned off. Accordingly, the first moving mechanism 41 may be allowed to move toward the test equipment 200 past the first limit position. The first detection module 435 may provide first release information for canceling detection of the first limit position to the first control module 434 through wired communication, wireless communication, etc.

Next, when it is confirmed by the first confirmation module 432 that the first drive information is less than the first reference value and more than the first allowable value, the first control module 434 determines the first movement mechanism 41. ) can be controlled to move the first driving mechanism 42 toward the test equipment 200 past the first limit position. When the detection of the first limit position is canceled by the first detection module 435, the first control module 434 moves the first moving mechanism 41 past the first limit position to the test equipment. The first driving mechanism 42 may be controlled to move toward (200). In this case, the first release information may be provided to the first control module 434 from the first detection module 435.

Next, after the first moving mechanism 41 moves past the first limit position, the first acquisition module 431 may additionally acquire the first driving information. The first acquisition module 431 may provide the additionally acquired first driving information to the first confirmation module 432.

Next, the first confirmation module 432 may check whether the first driving information additionally acquired by the first acquisition module 431 reaches the first reference value. The first confirmation module 432 may provide the confirmation result to the first calculation module 433.

Next, when it is confirmed by the first confirmation module 432 that the first drive information has reached the first reference value while the first movement mechanism 41 has moved past the first limit position, The first calculation module 433 can calculate the first connection distance using the first driving information. The first calculation module 433 may provide the first connection distance to the first control module 434. The first control module 434 can store the first connection distance and control the first driving mechanism 42 according to the first connection distance from the next test tray 100.

Meanwhile, it is detected by the first detection module 435 that the first moving mechanism 41 has reached the first limit position, and the first drive information is sent by the first confirmation module 432. If it is confirmed that the value is less than the first reference value and the first allowable value, the first control module 434 can control the first driving mechanism 42 so that the first moving mechanism 41 is stopped. Accordingly, when the separation distance is changed excessively due to replacement, maintenance, aging, etc. of the component parts, the electronic component test handler 1 according to the present invention uses the first detection module 435 to The first driving mechanism 42 is implemented to prevent the first moving mechanism 41 from moving an excessive distance toward the test equipment 200. Therefore, the electronic component test handler 1 according to the present invention can prevent the service life of the first driving mechanism 42 from being shortened and reduce maintenance costs for the first driving mechanism 42, etc. You can contribute.

The first sensing module 435 may be coupled to the first moving mechanism 41. The first sensing module 435 may be coupled to the first contact socket 412a of the first component pusher 412. The first sensing module 435 may be implemented as a position sensor, proximity sensor, magnet sensor, optical sensor, etc.

Referring to FIGS. 1 to 5 , the first adjustment mechanism 43 may include a first limiting module 436.

The first limit module 436 is used to detect whether the first movement mechanism 41 has reached a preset second limit position. The second limit position may be a limit position at which the first moving mechanism 41 can move toward the test equipment 200. The second limit position may be located closer to the test equipment 200 than the first limit position. The second limit position may be a coordinate value based on the second axis direction (Y-axis direction). The second limit position may be set in advance by the operator through prior testing, etc.

When the first limit module 436 detects that the first moving mechanism 41 has reached the second limit position, it can provide second detection information to the first confirmation module 432. The first limiting module 436 may provide the second detection information to the first confirmation module 432 through wired communication, wireless communication, etc.

When it is detected by the first limit module 436 that the first moving mechanism 41 has reached the second limit position, the test unit 4 can operate as follows.

First, when it is detected by the first limit module 436 that the first moving mechanism 41 has reached the second limit position, the first confirmation module 432 determines that the first drive information is set to the second limit position. You can check whether it is below the standard value of 1. In this case, when the second detection information is received, the first confirmation module 432 can check whether the first driving information is less than the first reference value.

Next, when it is confirmed by the first confirmation module 432 that the first drive information is less than the first reference value while the first movement mechanism 41 is located at the second limit position, the first control The module 434 can control the first driving mechanism so that the first moving mechanism 41 is stopped. Accordingly, when the separation distance is changed excessively due to replacement, maintenance, aging, etc. of the component parts, the electronic component test handler 1 according to the present invention uses the first limiting module 436 to The first driving mechanism 42 is implemented to prevent the first moving mechanism 41 from moving an excessive distance toward the test equipment 200. Therefore, the electronic component test handler 1 according to the present invention can prevent the service life of the first driving mechanism 42 from being shortened and reduce maintenance costs for the first driving mechanism 42, etc. You can contribute.

Meanwhile, when it is confirmed by the first confirmation module 432 that the first drive information has reached the first reference value while the first moving mechanism 41 is located at the second limit position, the first 1 Calculation module 433 can calculate the first connection distance using the first driving information. The first calculation module 433 may provide the first connection distance to the first control module 434. The first control module 434 can store the first connection distance and control the first driving mechanism 42 according to the first connection distance from the next test tray 100.

The first limiting module 436 may be coupled to the first moving mechanism 41. The first limiting module 436 may be coupled to the first contact socket 412a of the first component pusher 412. The first limiting module 436 may be implemented as a position sensor, proximity sensor, magnet sensor, optical sensor, etc. The first limiting module 436 may be placed closer to the test equipment 200 than the first sensing module 435. When the first through hole 412b is formed in the first contact socket 412a, the first limiting module 436 is inserted into the first through hole 412b and is inside the first contact socket 412a. It may be placed in . The first through hole 412b is through which a fluid for controlling the temperature of the electronic component passes.

Referring to FIGS. 1 to 6 , the test unit 4 may include a second moving mechanism 44 and a second driving mechanism 45.

The second moving mechanism 44 moves the test tray 100 and the electronic components stored in the test tray 100 toward the test equipment 200. The second moving mechanism 44 can move the test tray 100 and the electronic components stored in the test tray 100 by pressing a different part from the first moving mechanism 41. For example, the second moving mechanism 44 and the first moving mechanism 41 may press different parts of the test tray 100 along the first axis direction (X-axis direction). In this case, the second moving mechanism 44 and the first moving mechanism 41 may be arranged side by side along the first axis direction (X-axis direction). Since the second moving mechanism 44 can be implemented in roughly the same way as the first moving mechanism 41, except for pressing a different part from the first moving mechanism 41, a detailed description thereof is omitted. do.

The second driving mechanism (45) moves the second moving mechanism (44). Since the second driving mechanism 45 can be implemented substantially identical to the first driving mechanism 42 except that it moves the second moving mechanism 44, detailed description thereof will be omitted. In this way, by providing the second driving mechanism 45 and the second moving mechanism 44, the electronic component test handler 1 according to the present invention can be used even for the relatively larger test tray 100. The testing process can be performed smoothly. In this case, since a greater number of electronic components can be stored in the test tray 100, the electronic component test handler 1 according to the present invention performs the test by performing the test process on a relatively larger number of electronic components. Depending on the results, productivity of electronic components classified by grade can be further increased.

Referring to FIGS. 1 to 6, the test unit 4 may include a second adjustment mechanism 46.

The second control mechanism 46 adjusts the second connection distance by which the second drive mechanism 45 moves the second movement mechanism 44 toward the test equipment 200. The second connection distance refers to the distance at which the second moving mechanism 44 is moved toward the test equipment 200 by the second driving mechanism 45 based on the second axis direction (Y-axis direction). can do. The second control mechanism 46 can adjust the second connection distance based on the second drive information of the second drive mechanism 45. The second driving information is related to the amount of load applied to the second driving mechanism 45 when the second driving mechanism 45 moves the second moving mechanism 44 toward the test equipment 200. You can. For example, the second driving information is the amount of torque of the second driving mechanism 45, which is the torque generated by the motor of the second driving mechanism 45 in the process of moving the second moving mechanism 44. It could be size.

The second control mechanism 46 may include a second acquisition module 461, a second confirmation module 462, a second calculation module 463, and a second control module 464. The second acquisition module 461 acquires the second driving information. The second confirmation module 462 checks whether the second driving information has reached a preset second reference value. The second calculation module 463 calculates the second connection distance using the second driving information. The second control module 464 controls the second driving mechanism 45. The second acquisition module 461, the second confirmation module 462, the second calculation module 463, and the second control module 464 include the first acquisition module 431 and the first confirmation. Since it can be implemented roughly identical to each of the module 432, the first calculation module 433, and the first control module 434, detailed description thereof will be omitted.

The second control mechanism 46 may include a second sensing module 465 and a second limiting module 466. The second detection module 465 is used to detect whether the second movement mechanism 44 has reached the preset third limit position. The second limit module 467 is used to detect whether the second movement mechanism 44 has reached the preset fourth limit position. Since the second sensing module 465 and the second limiting module 466 can be implemented to roughly match each of the first sensing module 435 and the first limiting module 436, a detailed description thereof is provided. Omit it.

Meanwhile, the second control mechanism 46 and the first control mechanism 43 can independently adjust the second connection distance and the first connection distance. Accordingly, the electronic component test handler 1 according to the present invention allows the second moving mechanism 44 and the first moving mechanism 41 to be moved at different distances for each part of the test tray 100. , even when eccentricity such as tilt occurs in the test tray 100, the connection rate of electronic components stored in the test tray 100 being connected to the test equipment 200 can be increased. When the second connection distance and the first connection distance are different from each other, the second driving mechanism 45 and the first driving mechanism 42 are connected to the second moving mechanism 44 and the first moving mechanism 41. ) can be moved to different distances.

Referring to Figures 1 to 6, the test unit 4 may include an eccentric mechanism 47.

The eccentric mechanism 47 obtains eccentricity information of the test tray 100. The eccentricity information of the test tray 100 is the distance spaced apart from the test equipment 200 based on the second axis direction (Y-axis direction) for each part based on the first axis direction (X-axis direction). It can mean a difference. Accordingly, the electronic component test handler 1 according to the present invention can use the eccentricity information of the test tray 100 to check when maintenance is required to resolve the eccentricity generated in the test tray 100. do. The eccentric mechanism 47 can provide the eccentricity information of the test tray 100 to the operator by displaying the eccentricity information of the test tray 100 through a display device, etc.

The eccentric mechanism 47 may obtain eccentricity information of the test tray 100 using the difference between the first connection distance and the second connection distance. The eccentric mechanism 47 may obtain eccentricity information of the test tray 100 using the difference between the first drive information and the second drive information. In this case, the first driving information may be obtained by the first acquisition module 431 measuring the torque amount of the first driving mechanism 42. The second driving information may be obtained by the second acquisition module 461 measuring the torque amount of the second driving mechanism 45. Accordingly, the eccentric mechanism 47 can obtain eccentricity information of the test tray 100 using the difference between the torque amount of the first driving mechanism 42 and the torque amount of the second driving mechanism 45. there is.

The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and various substitutions, modifications, and changes can be made without departing from the technical spirit of the present invention. It will be clear to those who have knowledge.

1: Electronic component test handler 2: Loading unit
3: unloading section 4: testing section
5: first chamber part 6: second chamber part
7: Rotate section 8: Transfer section
100: test tray 200: test equipment

Claims (14)

A loading unit that performs a loading process to load electronic components to be tested onto a test tray;
An unloading unit that performs an unloading process to unload the tested electronic components from the tray;
A test unit that performs a test process to connect electronic components stored in a test tray to test equipment;
a first chamber unit that delivers the test tray on which the loading process has been performed to the test unit;
a second chamber unit delivering the test tray on which the test process has been performed to the unloading unit; and
It includes a rotation unit that rotates the test tray so that the test tray switches between a horizontal state and a vertical state,
The test unit includes a test tray and a first moving mechanism for moving the electronic components stored in the test tray toward the test equipment, a first driving mechanism for moving the first moving mechanism, and a first driving mechanism of the first driving mechanism. An electronic component test handler comprising a first control mechanism that adjusts a first connection distance through which the first driving mechanism moves the first moving mechanism toward the test equipment based on information. According to paragraph 1,
The first control mechanism is an electronic component test handler characterized in that it includes a first acquisition module that measures the torque amount of the first drive mechanism and acquires the first drive information. The method of claim 1, wherein the first regulating mechanism is
a first acquisition module that acquires the first driving information;
a first confirmation module that checks whether the first driving information acquired by the first acquisition module reaches a preset first reference value;
a first calculation module that calculates the first connection distance using the first drive information when it is confirmed by the first confirmation module that the first drive information has reached the first reference value; and
and a first control module that controls the first driving mechanism so that the first driving mechanism moves the first moving mechanism toward the test equipment according to the first connection distance calculated by the first calculation module. Featured electronic component test handler. According to paragraph 3,
The first control mechanism includes a first detection module for detecting whether the first moving mechanism has reached a preset first limit position,
When the first confirmation module detects that the first moving mechanism has reached the first limit position by the first detection module, the first drive information is less than the first reference value and more than the preset first allowable value. Check whether it is recognized,
When it is confirmed by the first confirmation module that the first drive information is less than the first reference value and more than the first allowable value, the first detection module cancels detection of the first limit position,
The first control module is characterized in that when the detection of the first limit position is released, the first moving mechanism controls the first driving mechanism so that the first moving mechanism moves toward the test equipment past the first limit position. Component test handler. According to paragraph 3,
The first control mechanism includes a first detection module for detecting whether the first moving mechanism has reached a preset first limit position,
When the first confirmation module detects that the first moving mechanism has reached the first limit position by the first detection module, the first drive information is less than the first reference value and more than the preset first allowable value. Check whether it is recognized,
The first control module controls the first driving mechanism to stop the first moving mechanism when it is confirmed by the first confirmation module that the first driving information is less than the first reference value and less than the first tolerance value. An electronic component test handler characterized by: According to clause 4,
The first acquisition module additionally acquires the first drive information after the first moving mechanism moves past the first limit position,
The first confirmation module checks whether the first driving information additionally acquired by the first acquisition module reaches the first reference value,
When the first calculation module confirms that the first drive information has reached the first reference value by the first confirmation module while the first movement mechanism has moved past the first limit position, the first calculation module An electronic component test handler, characterized in that the first connection distance is calculated using driving information. According to clause 4,
The first control mechanism includes a first limit module for detecting whether the first movement mechanism has reached a preset second limit position,
When the first confirmation module detects that the first moving mechanism has reached the second limit position by the first limit module, the first confirmation module checks whether the first drive information is less than the first reference value,
When the first control module confirms that the first drive information is less than the first reference value by the first confirmation module while the first moving mechanism is located at the second limit position, the first moving mechanism is configured to An electronic component test handler, characterized in that controlling the first driving mechanism to stop. The method of claim 1, wherein the test unit
a second moving mechanism for moving the test tray and the electronic components stored in the test tray toward the test equipment by pressing a different part from the first moving mechanism; and
An electronic component test handler comprising a second driving mechanism for moving the second moving mechanism. According to clause 8,
The test unit includes a second control mechanism that controls the second driving mechanism, and an eccentric mechanism that obtains eccentricity information of the test tray,
The first control mechanism includes a first acquisition module that acquires the first drive information by measuring the torque amount of the first drive mechanism,
The second control mechanism includes a second acquisition module that measures a torque amount of the second drive mechanism and acquires second drive information of the second drive mechanism,
An electronic component test handler, wherein the eccentric mechanism acquires eccentricity information of the test tray using a difference between the first drive information and the second drive information. According to clause 8,
The test unit includes a second control mechanism that adjusts a second connection distance by which the second drive mechanism moves the second movement mechanism toward the test equipment based on second drive information of the second drive mechanism. Electronic component test handler. According to clause 10,
An electronic component test handler, wherein the first control mechanism and the second control mechanism independently adjust the first connection distance and the second connection distance. According to clause 10,
The first driving mechanism and the second driving mechanism move the first moving mechanism and the second moving mechanism to different distances when the first connection distance and the second connection distance are different from each other. Electronic component test handler. According to clause 10,
The test unit is an electronic component test handler characterized in that it includes an eccentricity mechanism that obtains eccentricity information of the test tray using the difference between the first connection distance and the second connection distance. The method of claim 10, wherein the second control mechanism is
a second acquisition module that acquires the second driving information;
a second confirmation module that checks whether the second driving information acquired by the second acquisition module reaches a preset second reference value;
a second calculation module that calculates the second connection distance using the second drive information when it is confirmed by the second confirmation module that the second drive information has reached the second reference value; and
and a second control module that controls the second driving mechanism so that the second driving mechanism moves the second moving mechanism toward the test equipment according to the second connection distance calculated by the second calculation module. Featured electronic component test handler.

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