JP5375528B2 - Electronic component inspection equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a simple device for inspecting electronic components, which reliably detects electronic components left at arrangement positions. <P>SOLUTION: An IC handler moves and arranges an IC chip to a predetermined inspection socket, and then, pressurizes it at a predetermined pressure for electrical inspection. The IC handler includes a gripping device 28 for gripping an IC chip, and a control device for controlling an inspection head 22, that vertically moves the gripping device 28; the inspection head 22 lowers the gripping device 28 that has been moved above the inspection socket which is a predetermined arrangement position, for detecting vertical position of the gripping device 28, when the lowering is stopped. Based on the detected position, the existence or the non-existence of an electronic component in the inspection socket is determined. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to an electronic component inspection apparatus for inspecting electrical characteristics of an electronic component such as an IC.

  As one of this kind of electronic component inspection devices, together with an inspection socket for inspecting electronic components, an inspection head that arranges electronic components in the inspection socket and collects electronic components after inspection from the socket There is known an electronic component inspection apparatus comprising: That is, in this electronic component inspection apparatus, an electronic component before inspection, which is placed on a tray and supplied from the outside of the electronic component inspection apparatus, is placed in an inspection socket by an inspection head. After the inspection, the electronic components arranged in the inspection socket are collected by the inspection head and distributed to the corresponding trays according to the quality of the inspection results, together with the trays of the electronic component inspection apparatus. It will be discharged to the outside.

  Many of such electronic component inspection devices also arrange a plurality of electronic components in the inspection socket at the same time or collect them from the inspection socket for the purpose of improving the inspection efficiency. However, such transportation of a plurality of electronic components may cause inconveniences such as leaving an electronic component to be acquired in the inspection socket, and the electronic component left in this way is inspected for the next electronic component. It becomes an obstacle. Therefore, it is necessary to detect an electronic component left in the inspection socket so that the electronic component can be removed from the inspection socket. If there is a case where the next electronic component is transported and stacked in the inspection socket where the electronic component is left behind, the test of the remaining electronic component is performed again, but the next electronic component left is not inspected. Nevertheless, the quality is discriminated by the result of the re-inspection of the remaining electronic components. As a result, if an uninspected electronic component is distinguished from a non-defective product despite a defective product, the reliability of the test result itself by the electronic component inspection apparatus may be lost.

  For this reason, various techniques for detecting electronic components left in the inspection socket have been proposed, and Patent Documents 1 and 2 each describe an example of such a technique. .

  Among these, the electronic component inspection apparatus described in Patent Document 1 includes a transport unit that sucks and transports an electronic component to the inspection socket, and an inspection head that presses the electronic component against the inspection socket. The inspection apparatus also includes an attitude detection means for detecting the attitude of the electronic component placed on the inspection socket based on the amount of the sensor light of the area sensor irradiated to the space above the inspection socket. I have. That is, when the electronic component is correctly placed in the inspection socket, the light shielding amount of the sensor light is reduced, and when the electronic component is inclined and placed on the inspection socket, the light shielding amount of the sensor light is increased. The posture of the electronic component in the inspection socket is detected.

  Moreover, the electronic component inspection apparatus described in Patent Document 2 includes first and second inspection heads that perform loading and unloading of electronic components with respect to an inspection socket in which the electronic components are detachably loaded, and An imaging device provided on the first and second inspection heads for imaging the inspection socket from above; And the presence or absence of the electronic component in a test | inspection socket is detected based on the image in the predetermined area | region including the socket for a test | inspection imaged with the imaging device.

JP 2000-338179 A JP 2009-145153 A

  Incidentally, in recent years, diversification and miniaturization of electronic components to be inspected by an electronic component inspection apparatus have been advanced, and inspection sockets corresponding to various electronic components have been prepared. Then, in the technique of Patent Document 1, it is necessary to adjust the position and detection range of the area sensor according to the size and number of electronic components, and the shape of the inspection socket can be detected by the area sensor. Inconveniences such as being restricted by the shape to be generated. On the other hand, although the technology of Patent Document 2 has the ability to cope with diversification and miniaturization of electronic components, it involves the addition of precise and complicated operation adjustment devices such as an imaging device and an image recognition device. Imaging devices are required to have resistance to high temperatures in which electronic components are inspected. For example, the complexity of the device and the increase in cost are new issues.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide an electronic component inspection apparatus that can reliably detect an electronic component left in an arrangement position while having a simple configuration. There is to do.

  An electronic component inspection apparatus according to the present invention is an electronic component inspection device that moves and arranges an electronic component in a predetermined inspection socket and presses the electronic component with a predetermined pressure to perform an electrical inspection, and holds the electronic component. And a control means for controlling a vertical movement means for moving the gripping means up and down. The vertical movement means lowers the gripping means moved above a predetermined arrangement position, and the lowering is stopped. The gist of the present invention is to detect the vertical position of the gripping means and determine the presence or absence of an electronic component at the predetermined arrangement position from the detected position.

  According to such a configuration, since the vertical height when the lowering of the gripping means is stopped is detected, the presence / absence of an electronic component at the arrangement position, for example, the presence / absence of an electronic component left behind is determined. Therefore, the presence / absence of electronic components can be determined with a very simple structure. At this time, in particular, since the gripping means is lowered at a pressure lower than the pressure for inspection, for example, a descending pressure due to its own weight, for example, even if the electronic component remains at the arrangement position, the electronic component is damaged. Never give.

  Further, since the gripping means used for transporting the electronic component is used for detecting the height of the electronic component, even if the type of the electronic component is changed, the gripping means or the like can be changed to correspond to the electronic component. In addition, there is no need for adjustment of, for example, a sensor for detecting other electronic components left behind, and high convenience is maintained while being simple.

The electronic component inspection apparatus is characterized in that the gripping means grips a plurality of the electronic components.
According to such a configuration, the gripping means for gripping the plurality of electronic components can measure the vertical position of the plurality of electronic components at once with a simple structure. At the same time, there is a high possibility that such position measurement can be applied to a conventional electronic component inspection apparatus having a similar structure. As a result, the reliability and the applicability of such an electronic component inspection apparatus can be enhanced due to the extremely simple structure.

In this electronic component inspection apparatus, the vertical movement means includes a motor that moves the gripping means up and down, and when the gripping means is lowered, the motor is regeneratively braked and lowered by its own weight. To do.

  According to such a configuration, the gripping means is lowered by its own weight or the like while the motor is regeneratively braked. Therefore, even if the descending speed of the gripping means is appropriately adjusted and the electronic component is left behind at the arrangement position. An excessive load is applied to the electronic component to reduce the possibility of damaging the electronic component or the position where the electronic component is disposed, for example, a socket or a pocket. Thereby, the utility value of such an electronic component inspection apparatus is enhanced.

The electronic component inspection apparatus is characterized in that the vertical movement means is provided with an elastic means for applying an upward force to the gripping means.
According to such a configuration, since elastic means such as a spring applies an upward force to the gripping means, the weight of the gripping means is adjusted and the descending speed of the gripping means is adjusted. This also reduces the possibility of applying an excessive load to the electronic component and the arrangement position where the electronic component is arranged even if the electronic component is left behind at the arrangement position.

  In this electronic component inspection apparatus, the vertical movement means is provided with elastic means for applying an upward force exceeding the weight of the gripping means to the gripping means, and the gripping means is driven by the motor. The gist is to be lowered.

  According to such a configuration, when the gripping means is lowered at a low pressure by using the motor drive, the lowering torque can be adjusted to be reduced by the elastic means such as a spring. This increases the possibility of applying a motor to lower the gripping means with a low pressure, that is, increases the applicability of a motor that is difficult to adjust with low torque.

  In this electronic component inspection apparatus, the gripping unit grips a dummy component that replaces the electronic component, and the vertical movement unit moves in the vertical direction via the dummy component when the lowering of the gripping unit is stopped. The gist is to detect the position.

  According to such a configuration, the position in the vertical direction depending on the presence / absence of the electronic component is detected by the difference in height of the electronic component itself through the dummy component. Thereby, for example, even when the difference in the vertical position (height) due to the presence / absence of electronic components at the placement position becomes small because the gripping means is stopped by a stopper for preventing overload, etc. The presence / absence of an electronic component in the electronic component inspection apparatus (such as leftover) can be reliably detected, and the inspection reliability of the electronic component inspection apparatus can be improved.

The gist of the electronic component inspection apparatus is that the dummy component is a cleaning chip for removing dirt on the electrodes of the inspection socket.
According to such a configuration, it is possible to utilize a cleaning chip that has been conventionally installed as a dummy part. Thereby, implementation of such an electronic component inspection apparatus becomes easier.

The gist of the electronic component inspection apparatus is that the predetermined arrangement position is provided corresponding to the arrangement position of the inspection socket.
According to such a configuration, it becomes possible to detect an electronic component left in the inspection socket. As a result, in recent years, even electronic components that have become more compact and difficult to visually confirm can be confirmed by being left behind in an inspection socket. In addition, if it is possible to check whether or not an electronic component has been left in the inspection socket, it will be possible to prevent mistakes that may occur in the inspection result due to the remaining component. Can be improved.

  In addition, the inspection socket is provided with a contact pin that is movable when the terminal of the electronic component is pressed. When the holding means is lowered by a low pressure, for example, a descending pressure due to its own weight, the inspection socket Since the vertical position of the gripping means can be detected without depressing the contact pins, the detection accuracy of electronic components left behind can be maintained at a high level.

  In this electronic component inspection apparatus, the gripping means is provided with a pressing means for pressing the electronic component against the inspection socket. When the vertical movement means is lowered at a predetermined lowering pressure, the pressing means The gist is to detect the position in the vertical direction when the lowering of the gripping means is stopped in a state in which the pressing force is maintained at a pressure higher than the predetermined lowering pressure.

  According to such a configuration, the internal pressure of the pressing means is set higher than the lowering pressure in advance before the electronic component is pressed against the inspection socket with a predetermined lowering pressure to detect the presence or absence of the electronic component in the socket. As a result, the pressing means does not move even if the gripping means comes into contact with the inspection socket, that is, the buffer function for absorbing a slight height error is invalidated. As a result, even if the electronic component inspection device presses the electronic component against the inspection socket by the pressing means, the electronic component left in the inspection socket can be suitably detected by eliminating the influence of the buffer function of the pressing means. It becomes like this.

  In this electronic component inspection apparatus, the gripping means is provided with a pressing means for pressing the electronic component against the inspection socket. When the vertical movement means is lowered at a predetermined lowering pressure, the pressing means The gist is to detect the position in the vertical direction when the lowering of the gripping means is stopped in a state where the pressing force by is held at a pressure lower than the predetermined lowering pressure.

  According to such a configuration, before the electronic component is pressed against the inspection socket with a predetermined lowering pressure to detect the presence of the electronic component in the socket, the internal pressure of the pressing means is previously set lower than the lowering pressure. As a result, the pressing means can be moved up and down by an external force received by the gripping means coming into contact with the inspection socket, that is, the buffer function for absorbing a slight height error is invalidated. As a result, even if the electronic component inspection device presses the electronic component against the inspection socket by the pressing means, the electronic component left in the inspection socket can be suitably detected by eliminating the influence of the buffer function of the pressing means. It becomes like this.

The gist of the electronic component inspection apparatus is that the gripping means includes a plurality of pressing means.
According to such a structure, even if it is a holding means provided with a some press means, it becomes possible to detect the electronic component left in the inspection socket.

The gist of the electronic component inspection apparatus is that the predetermined arrangement position is provided with respect to a shuttle that horizontally moves the electronic component.
According to such a configuration, it becomes possible to detect an electronic component left on the horizontally moving shuttle. The reliability and convenience of such an electronic component inspection apparatus can be further enhanced.

  The gist of the electronic component inspection apparatus is that the predetermined arrangement position is provided with respect to a transfer tray that carries the electronic component into or out of the electronic component inspection apparatus.

  According to such a configuration, it becomes possible to detect an electronic component left on the transfer tray. The reliability and convenience of such an electronic component inspection apparatus can be further enhanced.

The top view which shows the one embodiment about the whole structure of the electronic component inspection apparatus concerning this invention. The side view which shows schematic structure of the side of the test head of the embodiment. Sectional drawing for demonstrating the schematic structure of the press apparatus provided in the head for a test | inspection of the embodiment. The block diagram which shows the electric constitution of the electronic component inspection apparatus in the embodiment. It is a figure explaining the height of the press apparatus detected in the embodiment, (a) does not hold | maintain a dummy component, (b) and (c) show the case where a dummy component is hold | maintained. Explanatory drawing explaining the aspect of the head for a test | inspection when the IC chip left behind in the embodiment is detected. The graph which shows typically the distribution range of the height detected in the embodiment. The flowchart concerning the prior preparation of the remaining device detection process of the embodiment. The flowchart concerning the prior preparation of the remaining device detection process of the embodiment. The flowchart concerning the prior preparation of the remaining device detection process of the embodiment. The flowchart concerning the prior preparation of the remaining device detection process of the embodiment. The flowchart concerning the remaining device detection process of the embodiment. The flowchart concerning the remaining device detection process of the embodiment.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a plan view showing an IC handler 10 as an electronic component inspection apparatus.
The IC handler 10 includes a base 11, a safety cover 12, a high temperature chamber 13, a supply robot 14, a collection robot 15, a first shuttle 16, a second shuttle 17, and a plurality of conveyors C1 to C6.

  The base 11 has the above elements mounted on the upper surface thereof. The safety cover 12 surrounds a large area of the base 11, and the supply robot 14, the recovery robot 15, the first shuttle 16, and the second shuttle 17 are accommodated therein.

  The plurality of conveyors C <b> 1 to C <b> 6 are provided on the base 11 such that one end thereof is located outside the safety cover 12 and the other end is located inside the safety cover 12. Each of the conveyors C1 to C6 transports the tray 18 as a transport tray containing a plurality of IC chips T such as electronic components from the outside of the safety cover 12 to the inside of the safety cover 12, or conversely, the tray 18 It is transported from the inside of the safety cover 12 to the outside of the safety cover 12. The IC chip T may be a silicon chip or a resin module, and the size thereof is not limited, but in recent years, miniaturization has progressed, for example, there is a chip having a side of 2 mm. As the number of chips thus reduced is increased per unit area, it has become difficult to visually check them individually.

The supply robot 14 includes an X-axis frame FX, a first Y-axis frame FY1, and a supply-side robot hand unit 20. The collection robot 15 includes the X-axis frame FX, the second Y-axis frame FY2, and the collection-side robot hand unit 21. The X-axis frame FX is disposed in the X direction. The first Y-axis frame FY1 and the second Y-axis frame FY2 are arranged to be parallel to each other along the Y direction, and are supported so as to be movable in the X direction with respect to the X-axis frame FX. . The first Y-axis frame FY1 and the second Y-axis frame FY2 are reciprocated in the X direction along the X-axis frame FX by respective motors (not shown) provided on the X-axis frame FX.

  On the lower side of the first Y-axis frame FY1, the supply-side robot hand unit 20 is supported so as to be movable in the Y direction. The supply-side robot hand unit 20 reciprocates in the Y direction along the first Y-axis frame FY1 by respective motors (not shown) provided on the first Y-axis frame FY1. The supply-side robot hand unit 20 can be moved in the Z direction by driving a motor (not shown), and grips a plurality of IC chips T before inspection accommodated in the tray 18 of the conveyor C1. A part (not shown) is provided. The gripping part is provided with a plurality of suction parts for sucking and holding the contacted parts by negative pressure (vacuum suction), and each suction part is supplied with negative pressure or atmospheric pressure on its suction surface (suction pad). It has become so. As a result, the suction unit sucks and holds the IC chip T by the negative pressure supplied to the suction surface, and separates the IC chip T held by the suction surface by the atmospheric pressure supplied to the suction surface. Thereby, for example, the supply-side robot hand unit 20 is moved above the tray 18 and then the gripping portion is lowered to a predetermined position by driving the motor, and a plurality of pre-inspection tests stored in the tray 18 of the conveyor C1 are performed. The IC chip T is sucked and held by each suction portion and the gripping portion is raised. Then, the plurality of IC chips T are gripped by suctioning and gripping the IC chip T by moving it above the first shuttle 16 and then lowering the gripping part to a predetermined position by driving the motor and detaching the IC chip T from each suction part. The plurality of IC chips T that have been supplied are supplied to the first shuttle 16.

  A collection-side robot hand unit 21 is supported below the second Y-axis frame FY2 so as to be movable in the Y direction. The collection-side robot hand unit 21 reciprocates in the Y direction along the second Y-axis frame FY2 by respective motors (not shown) provided on the second Y-axis frame FY2. The collection-side robot hand unit 21 can be moved in the Z direction by driving a motor (not shown), and collectively holds a plurality of inspected IC chips T accommodated in the shuttles 16 and 17. A grip portion (not shown) similar to the grip portion of the supply-side robot hand unit 20 is provided. This gripping part is also provided with a plurality of suction parts for sucking and holding the abutted parts. Each suction part suctions and holds the IC chip T by the negative pressure supplied to the suction surface (suction pad). The IC chip T sucked and held by the atmospheric pressure supplied to the suction surface is separated. As a result, for example, the collection-side robot hand unit 21 is moved above the first shuttle 16 and then lowered to a predetermined position by driving the motor, so that the plurality of inspected units accommodated in the first shuttle 16 are moved. The IC chip T is sucked and held by each suction portion and the gripping portion is raised. By moving the IC chip T above the tray 18 of the conveyor C6 while sucking and gripping the plurality of IC chips T, the gripping part is lowered to a predetermined position by driving a motor and the IC chip T is detached from each suction part. The plurality of IC chips T that have been gripped are supplied to the tray 18 of the conveyor C6.

  On the upper surface of the base 11, between the supply robot 14 and the collection robot 15, a first rail 24A and a second rail 24B are respectively disposed in parallel with the X-axis direction. The first rail 24A is provided with a first shuttle 16 that can reciprocate in the X-axis direction. The second rail 24B is provided with a second shuttle 17 that can reciprocate in the X-axis direction.

The first shuttle 16 includes a substantially plate-like base member 16A that is long in the X-axis direction, and is in sliding contact with the first rail 24A by a rail receiver (not shown) on the bottom surface thereof. Then, it is reciprocated along the first rail 24 </ b> A by a motor (not shown) provided in the first shuttle 16. Change kits 16B and 16C are fixed to both ends of the upper surface of the base member 16A in a replaceable manner with screws or the like. The second shuttle 17 includes a substantially plate-like base member 17A that is long in the X-axis direction, and is in sliding contact with the second rail 24B by a rail receiver (not shown) on the bottom surface. Then, it is reciprocated along the second rail 24 </ b> B by a motor (not shown) provided in the second shuttle 17. Change kits 17B and 17C are fixed to both ends of the upper surface of the base member 17A in a replaceable manner with screws or the like.

  Each of the change kits 16B and 17B is provided with a plurality of pockets PS in which IC chips T to be inspected that are not inspected are stored. Each of the change kits 16C and 17C has IC chips T to be inspected that have already been inspected. A plurality of pockets PS to be accommodated are provided, and the IC chip T is held in each of the pockets PS. Thereby, a plurality of IC chips T are collectively transferred from the supply-side robot hand unit 20 of the supply robot 14 to each pocket PS of each change kit 16B, 17B, and a plurality of ICs are received from the pocket PS of each change kit 16C, 17C. The chips T are collectively carried out by the collection-side robot hand unit 21 of the collection robot 15.

  An inspection unit 23 is provided between the first and second shuttles 16 and 17 on the upper surface of the base 11. The inspection unit 23 is provided with a plurality of inspection sockets 50 as arrangement positions where the IC chips T to be inspected are arranged. That is, each IC chip T accommodated in each pocket PS of each of the shuttles 16 and 17 is disposed in the inspection socket 50.

  Above the first and second shuttles 16 and 17 and the inspection sockets 50, the IC chips T are transported between the shuttles 16 and 17 and the inspection sockets 50, and reciprocate in the Y direction. A possible inspection head 22 is supported on a frame 25 (see FIG. 2) provided in the high temperature chamber 13 of the base 11 so as to be able to reciprocate in the Y direction.

  As shown in FIG. 2, the frame 25 has a top plate 25A supported by four legs 25L on the base 11, and extends to the top plate 25A in the Y direction (left-right direction in the figure). An opening 25H is provided. The inspection head 22 is supported by the top plate 25A so as to be capable of reciprocating in the Y direction with respect to the frame 25, and is disposed through the opening 25H of the top plate 25A. That is, the inspection head 22 reciprocates in the Y direction within the opening 25H of the top plate 25A.

  The inspection head 22 is connected to the top plate 25A of the frame 25 so as to be movable in the Y direction (left-right direction in FIG. 2), and to the horizontal movement unit 26 in the Z direction (in FIG. 2). A vertical movement unit 27 movably coupled in the vertical direction) and a gripping device 28 coupled to the lower end of the vertical movement unit 27.

The horizontal movement part 26 has a housing | casing long in the Z direction (up-down direction) arrange | positioned on the top plate 25A, The lower end part is on the same top plate 25A so that the top plate 25A can move to a Y direction. It is connected to a rail (not shown) and is reciprocated in the Y direction along the opening 25H of the top plate 25A by forward and reverse rotation of a Y-axis motor MY provided on the top plate 25A. In addition, a recess 26R extending in the length direction (Z direction) that accommodates the ball screw 26B extending in the length direction (Z direction) of the casing is formed on the opening 25H side in the casing of the horizontal moving portion 26. ing. An upper surface that closes the end of the concave portion 26R and supports the ball screw 26B so as to be rotatable is formed on the upper portion of the horizontal moving portion 26, and a Z-axis motor MZ that rotates the ball screw 26B is disposed on the upper surface. The ball screw 26B is connected to the Z-axis motor MZ so as to be rotationally driven. Thereby, the ball screw 26B is rotated forward and backward by forward and reverse rotation of the Z-axis motor MZ. The Z-axis motor MZ is, for example, a servo motor. The Z-axis motor MZ is fixed to the rotation axis when the Z-axis motor MZ is not driven, and the rotation axis is rotated by an external force. A Z-axis motor brake BMZ (see FIG. 5) is provided to prevent this. As a result, the Z-axis motor MZ opens the Z-axis motor brake BMZ to drive the rotating shaft during driving, and fixes the rotating shaft by fastening the Z-axis motor brake BMZ when not driven. It has become. It should be noted that the Z-axis motor brake BMZ can synchronize the opening / closing of the Z-axis motor brake BMZ with the driving of the Z-axis motor MZ, and can be arbitrarily opened / engaged when the Z-axis motor MZ is not driven. Further, when the Z-axis motor MZ is not driven, the Z-axis motor MZ can perform a regenerative operation.

  A movable connecting portion 27A of the vertical moving portion 27 is provided in the concave portion 26R of the horizontal moving portion 26 so as to be movable up and down in the concave portion 26R, and a ball screw 26B is screwed to the movable connecting portion 27A. That is, the movable connecting portion 27A is formed with a screw groove (not shown) passing through the ball screw 26B in the vertical direction, and the ball screw 26B is screwed into the screw groove, and the ball screw 26B rotates forward and backward. Accordingly, the concave portion 26R of the horizontal moving portion 26 is linearly moved in the vertical direction (Z-axis direction). A counter spring 26 </ b> S is provided between the movable connecting portion 27 </ b> A and the upper end of the horizontal moving portion 26. The counter spring 26S is a pulling spring that applies a pulling force to both ends thereof, and applies a force in the upper end direction of the horizontal moving unit 26 to the movable connecting portion 27A. As a result, the total weight of the movable connecting portion 27A and the device attached thereto, that is, the own weight applied downward is reduced. In the present embodiment, the counter spring 26S applies, for example, an upward force of 10N (Newton) to the movable connecting portion 27A. It is possible to appropriately select the presence or absence of the counter spring 26S and the force of the counter spring 26S.

  The side face of the movable connecting portion 27A facing in the X direction, the side face on the opening 25H side protrudes to the upper side of the opening 25H in the X direction, and the side face on the opening 25H side protrudes downward. Support pillars 27B extending in the (anti-Z direction) are connected. The support column 27B is arranged on the top plate 25A of the frame 25 in such a manner that the upper end of the support column 27B is connected to the movable connection portion 27A, and the lower end of the support column 27B extends through the opening 25H into the frame 25. A gripping device 28 is connected to the lower end disposed in the frame 25.

  With such a structure, the vertical moving unit 27 is reciprocated in the vertical direction along the horizontal moving unit 26 by the forward and reverse rotation of the Z-axis motor MZ provided in the horizontal moving unit 26, and along with the vertical movement, The gripping device 28 at the lower end is reciprocated in the vertical direction in the frame 25. That is, the vertical moving unit 27 moves up and down the gripping device 28 provided at the lower end, and is an arrangement that is the height when the IC chip T is supplied to and discharged from the pocket PS or arranged in the inspection socket 50. The height and the moving height which is the height when moving in the front-rear direction (Y direction) by the inspection head 22 are arranged according to each step. In the present embodiment, the gripping device 28 is lowered at a predetermined pressure, for example, a pressure of 12 MPa (megapascal) downward by rotating the Z-axis motor MZ. This force can be changed to an appropriate value depending on the type of motor, the type of IC chip T, the type of the gripping device 28 and the inspection socket 50, and the like.

  The gripping device 28 includes a plurality of (four in FIG. 2) pressing devices 30, so-called compliance units. The pressing device 30 grips (sucks and holds) the IC chip T as a semiconductor chip and presses the IC chip T to the inspection socket 50 provided in the inspection unit 23, and the mounting plate 29 is attached to the lower end of the vertical moving unit 27. Is fixed. In the present embodiment, by providing four pressing devices 30, four IC chips T are held and conveyed at a time. The gripping device 28 has a mounting plate 29 detachably connected to the lower end of the vertical moving portion 27 and can be appropriately replaced according to the number and arrangement of the IC chips T to be inspected.

Next, the pressing device 30 will be described with reference to FIG.
In FIG. 3, the pressing device 30 includes an air cylinder SL fixed to a connection base 31 attached to the lower surface of the attachment plate 29, and a device chuck DC connected to the tip of the air cylinder SL. .

  In the air cylinder SL, the base end portion of the cylinder tube 32 is fixed to the connection base 31. The cylinder tube 32 includes a bottomed cylindrical tube main body 32a and a front plate 32b that closes the opening of the tube main body 32a, and a piston 33 as an operating body in a cylinder chamber formed by the tube main body 32a and the front plate 32b. Are arranged so as to be movable in the Z direction (vertical direction). Therefore, the cylinder chamber is partitioned by the piston 33 into the first chamber a on the upper side and the second chamber b on the lower side.

  The piston 33 is lifted upward by a spring SP as an elastic member, which will be described later, and the position of the piston 33 on the first chamber a side is in contact with the bottom surface of the tube main body 32a shown in FIG. It is located at the top end position).

  An air introduction port 34 is formed at the end of the tube body 32a on the first chamber a side, and the first connection port P1 is attached to the air introduction port 34. The first connection port P1 is connected to the electropneumatic regulator circuit 61 via the air supply pipe R1. And then. When air is supplied from the electropneumatic regulator circuit 61 to the first chamber a, the piston 33 is elastically applied to the spring SP of the device chuck DC from the uppermost position in contact with the bottom surface of the tube body 32a by the pressure of the air. It moves downward against the force. Incidentally, the stroke amount of the piston 33 is the distance to the position (lowermost position) where the lower surface of the piston 33 contacts the inner surface of the front plate 32b when the piston 33 is at the uppermost position shown by the solid line in FIG. That is, it coincides with the vertical interval 33L of the second chamber b shown in FIG.

  The electropneumatic regulator circuit 61 can supply air having a pressure corresponding to a set arbitrary value. In particular, in the present embodiment, the IC chip T is connected to the first connection port P1 for inspection. Inspection air for applying pressure and high-pressure air (for example, 0.5 MPa) having a pressure higher than that of the inspection air can be supplied. That is, the piston 33 to which the inspection air is supplied moves up and down within the range of the stroke amount of the piston 33 regardless of the descending pressure from the vertical moving portion 27, and performs a predetermined inspection on the IC chip T of the inspection socket 50. The pressure for inspection is applied, and the so-called buffer function is exhibited to stably apply the pressure for inspection. On the other hand, the piston 33 to which the high-pressure air is supplied does not move from the lowermost position even if a pressure for inspection is applied to the piston 33 from below, so that the so-called buffer function is invalidated, and the vertical moving unit 27 If the descending pressure is equal to or higher than the inspection pressure, it is applied to the lower portion, for example, the inspection socket 50 as it is. The electropneumatic regulator circuit 61 is connected to a plurality of pressing devices 30 provided in the gripping device 28, and the electropneumatic regulator circuit 61 supplies air of the same pressure to each connected pressing device 30. It is like that.

  The plurality of pressing devices 30 provided in the gripping device 28 may have slight differences in the height of the suction surface of the IC chip T. However, the piston 33 has a buffer function as described above. If there is a slight difference in the stroke range, such a height difference is absorbed. Thus, when each IC chip T held by each of the plurality of pressing devices 30 is arranged in the corresponding inspection socket 50, the height control of the holding device 28 is performed without performing the individual height control of each pressing device 30. In other words, each IC chip T is arranged in each inspection socket 50 with an appropriate pressure.

  The device chuck DC includes a connection block 41, and a connection protrusion 41a formed on the upper surface thereof is connected and fixed to the piston 33 and a screw N through a through hole formed in the front plate 32b. Therefore, the connection block 41 (device chuck DC) moves in the vertical direction together with the piston 33.

  A spring SP is connected between the connection block 41 and the connection base 31. That is, the connection block 41 is elastically suspended from the connection base 31 via the spring SP. In this embodiment, the spring SP pushes up the piston 33 via the connecting block 41 so that the piston 33 is positioned at the uppermost end position. When air is supplied to the first chamber a, the pressure causes the piston 33 to move downward against the elastic force of the spring SP, eventually reaching the lowest end position and hitting the front plate 32b. The downward movement is restricted.

  The connection block 41 is recessed at the lower surface center position, and a vacuum guide path 42 is formed by forming a through hole from the recessed position toward the outer surface. A second connection port P <b> 2 is attached to the vacuum guide path 42 on the outer surface of the connection block 41. The second connection port P2 is connected to an adsorption valve 63 that is driven and controlled by the valve drive circuit 62 via an air supply pipe R2. The valve drive circuit 62 controls the suction valve 63 to switch the positive pressure and the negative pressure supplied to the air supply pipe R2 as necessary.

  An intermediate block 43 is connected and fixed below the connecting block 41, and a guide block 44 is connected and fixed below the intermediate block 43. In the central position of the intermediate block 43 and the guide block 44, accommodation holes that communicate with the vacuum guide path 42 formed in the connection block 41 are formed to penetrate, respectively, and suction tubes 45 are disposed in these accommodation holes.

  A suction pad 46 is connected and fixed to the tip of the suction tube 45. Then, by switching the pressure supplied from the valve drive circuit 62 to the air supply pipe R2 to a negative pressure so that the inside of the suction pipe 45 is in a negative pressure state, the suction pad 46 has an IC chip T as shown in FIG. Is designed to be held by suction. On the contrary, the suction pad 46 is sucked and held by switching the pressure supplied from the valve drive circuit 62 to the air supply pipe R2 to a positive pressure to release the negative pressure in the suction pipe 45 (a positive pressure). The IC chip T is disposed in, for example, an inspection socket 50 provided in the inspection unit 23.

  A detected piece 47 is fixed to the outer surface of the connecting block 41 with a bolt 48. The detected piece 47 is detected by a relative position detection sensor SE2 composed of a photocoupler as a relative position detecting means fixed to the connection base 31 at the tip. More specifically, the relative position detection sensor SE2 moves the detected piece 47 that moves up and down with the movement of the piston 33 (device chuck DC) in the vertical direction, that is, between the piston 33 (device chuck DC) and the cylinder tube 32. Detect relative position.

  In the present embodiment, the Z axis is configured by the vertical moving portion 27 that is moved in the vertical direction (Z direction) with respect to the frame 25 and the inspection socket 50 and the gripping device 28 that is connected thereto. That is, the Z axis includes four pressing devices 30 connected to the gripping device 28. Further, the weight of the Z-axis including the vertical moving unit 27 and the gripping device 28 is a self-weight that applies a downward force to the Z-axis motor MZ, for example, a self-weight of 3 kg (equivalent to 30N). Depending on the type of IC chip and the type of the pressing device 30 corresponding to them, it is selectively changed.

The inspection socket 50 of the inspection unit 23 is provided with spring pins 52 having contact portions 51 in the socket as many as the number of terminals Ta of the IC chip T. The spring pin 52 moves up and down with a predetermined stroke 50L with respect to the inspection socket 50. When the IC chip T is pushed down, each terminal Ta of the IC chip T comes into contact with the corresponding contact portion 51 from above and pushes down the spring pin 52 downward. As a result, each terminal Ta of the IC chip T and the contact portion 51 of the inspection socket 50 are in electrical contact, and electrical inspection is performed in that state. After the inspection is completed, the IC chip T that has been inspected by the device chuck DC is picked up from the inspection socket 50 and conveyed to the shuttles 16 and 17, and the shuttles 16 and 17 each correspond to a predetermined result corresponding to the inspection result. The paper is sorted and conveyed to the tray 18 by the collection robot 15.

  A stopper 55 is provided outside the inspection socket 50. The stopper 55 is made of a resin with little deformation. When the pressing device 30 is lowered from a predetermined height, the lower surface of the guide block 44 of the pressing device 30 comes into contact with the stopper 55 to stop the lowering of the pressing device 30. It is like that. This prevents the pressing device 30 from pressing the IC chip T against the inspection socket 50 with excessive pressure and damaging the IC chip T or the inspection socket 50. That is, the guide block 44 does not come into contact with the stopper 55 when the pressing device 30 normally presses the IC chip onto the inspection socket 50.

  In the present embodiment, the cleaning chip CC is disposed in the work area 19 provided on the upper surface of the base 11 and in the operating range of the supply robot 14. The cleaning chip CC is disposed in the inspection socket 50 via the shuttles 16 and 17 and the inspection head 22, thereby removing dirt adhered to the contact portion 51 of the inspection socket 50 and the like. Good electrical contact with the terminals Ta of the IC chip T is maintained. The cleaning chip CC is pressed and arranged on the inspection socket 50 for every predetermined number of inspections of the IC chip T, for example, based on a predetermined rule, so that the electrical contact is suitably maintained, and the work area 19 is used after use. Returned to

Next, an electrical configuration for the IC handler 10 to transfer the IC chip T to the inspection socket 50 or the like will be described with reference to FIG.
The IC handler 10 is provided with a control device 80. The control device 80 is mainly composed of a microcomputer having a central processing unit (CPU) and a storage device (nonvolatile memory, volatile memory, etc.), and is based on various data and programs stored in the memory. Perform various controls. In the present embodiment, the remaining device presence / absence determination process for detecting whether the IC chip T is left behind in the inspection socket 50, the tray 18, the pocket PS of each of the shuttles 16 and 17 is executed by the control device 80. The nonvolatile memory stores various parameters necessary for the remaining device presence / absence determination process in advance.

  The control device 80 is electrically connected to the input / output device 85. The input / output device 85 includes various switches and a status indicator, and outputs a command signal for starting execution of each process, initial value data for executing each process, and the like to the control device 80. In the present embodiment, information on the dimensions of various IC chips T and cleaning chips CC, movement position information of the inspection head 22, the supply robot 14, and the collection robot 15 set in accordance with the types of the IC chips T are included. It is output to the control device 80.

The control device 80 is electrically connected to the Y-axis motor drive circuit MYD and the Z-axis motor drive circuit MZD.
The Y-axis motor drive circuit MYD calculates a drive amount based on the drive signal in response to the drive signal received from the control device 80, and drives and controls the Y-axis motor MY based on the calculated drive amount. It has become. Further, the rotational speed of the Y-axis motor MY detected by the Y-axis motor encoder EMY is input to the control device 80 via the Y-axis motor drive circuit MYD. Thus, the control device 80 grasps the position of the inspection head 22 in the front-rear direction, and the grasped position and the target position such as the upper position of the inspection socket 50 and the upper position of the first or second shuttle 16 or 17. The Y-axis motor MY is driven and controlled to move the inspection head 22 to the target position.

  The Z-axis motor drive circuit MZD calculates a drive amount based on the drive signal in response to the drive signal received from the control device 80, and drives and controls the Z-axis motor MZ based on the calculated drive amount. It has become. The Z-axis motor drive circuit MZD releases the Z-axis motor brake BMZ in synchronization with the drive control of the Z-axis motor MZ or in response to a brake signal received from the control device 80 when the Z-axis motor MZ is not driven.・ Conclusion is made. Further, the Z-axis motor drive circuit MZD can make the Z-axis motor MZ in a non-drive state perform a regenerative operation in response to a regeneration signal received from the control device 80. Further, the rotational speed of the Z-axis motor MZ detected by the Z-axis motor encoder EMZ is input to the control device 80 via the Z-axis motor drive circuit MZD. As a result, the control device 80 grasps the vertical position of the gripping device 28 (pressing device 30) and obtains the deviation between the height and the target height, the arrangement height and the moving height, and the Z-axis motor MZ. Is controlled to move the pressing device 30 to a target height.

  The control device 80 is electrically connected to the valve drive circuit 62. The valve drive circuit 62 drives and controls the adsorption valve 63 in response to a control signal received from the control device 80. The suction valve 63 that is driven and controlled by the control device 80 switches the pressure of the suction pad 46 on the bottom surface of the guide block 44 between atmospheric pressure and negative pressure. When the suction pad 46 is set to a negative pressure, the IC chip T is sucked and held by the guide block 44.

  The control device 80 is electrically connected to an electropneumatic regulator circuit 61 provided corresponding to the cylinder tube 32 of the pressing device 30. The electropneumatic regulator circuit 61 selectively supplies test air or pressure-decreasing air, which is compressed air, to the cylinder tube 32 of the pressing device 30 in response to a control signal input from the control device 80. Thereby, in the pressing device 30, the piston 33 is moved down from the uppermost position to the uppermost position by the compressed air.

  Next, the principle of detecting an IC chip left in the IC handler 10 will be described with reference to FIGS. FIGS. 5A and 5B are explanatory diagrams for explaining the detected height of the pressing device, in which FIGS. 5A and 5B are diagrams in the case where dummy parts are not used, and FIG. 5C is a diagram in the case where dummy parts are used. FIG. 6 is a diagram for explaining an aspect of the inspection head when the remaining IC chip is detected, and FIG. 7 is a graph schematically showing the distribution range of the height of the inspection head to be detected. It is.

  First, a so-called remaining device presence / absence determination process for determining whether or not the IC chip T is left in the inspection socket 50 will be described with reference to FIG. As shown in FIG. 5A, in the remaining device presence / absence determination process, the pressing device 30 is lowered to the inspection socket 50. At this time, the downward pressure at which the vertical moving unit 27 lowers the pressing device 30 is the IC chip T. The pressure is lower than the inspection pressure. Specifically, by releasing the Z-axis motor brake BMZ while the Z-axis motor MZ is in the non-driven state, the vertical moving unit 27 applies its weight, for example, a weight of 3 kg (equivalent to 30 N) to the upper side of the counter spring. The pressure is lowered at a descending pressure (equivalent to 0.2 MPa) based on a weight of 2 kg (equivalent to 20 N) minus a pressure of 10 N (equivalent to 1 kg in weight). Accordingly, the pressing device 30 is lowered at a lowering pressure (for example, 0.2 MPa) that is lower than a pressure (for example, 12 MPa) when the pressing device 30 is lowered by driving the Z-axis motor MZ. If it is such a low pressure, as shown in FIG. 5 (a), the spring pin 52 that moves down by a stroke 50L if the pressure for inspection is low, for example, as shown in FIG. 5 (b). Then, even if pressed by the inspection dummy component T1, it cannot be pushed down. Thus, the vertical position of the pressing device 30 is prevented from being changed by moving the spring pin 52 within the range of the stroke 50L.

  In this process, high-pressure air is supplied to the piston 33 to invalidate the buffer function of the piston 33. Thus, the vertical position of the pressing device 30 is prevented from being changed by moving the piston 33 within the stroke interval 33L.

  In this way, the vertical position (height) where the downward movement is stopped by the pressing device 30 coming into contact with the inspection socket 50 is detected by the Z-axis motor encoder EMZ of the Z-axis motor MZ. ing.

  For example, as shown in FIG. 5A, when there is no IC chip T in the pressing device 30 and the inspection socket 50 that are lowered with a low lowering pressure, the guide block 44 of the pressing device 30 has a stopper 55. The descent is stopped and the distance L0 between the opposing surfaces of the stopper 55 and the guide block 44 is “0”. For example, the height at this time is set as the reference height. That is, the height of the pressing device 30 at this time is detected as the reference height.

  Further, as shown in FIG. 5B, when the pressing device 30 has a detection dummy component T1, and the inspection socket 50 does not have an IC chip T, the pressing device 30 has a contact portion between the dummy component T1 and the contact portion. When it comes into contact with 51, the lowering of the spring pin 52 is stopped without being pushed down. For convenience of explanation, it is assumed that the dummy component T1 is a component having the same dimensions as the IC chip T. The height of the pressing device 30 at this time is a height obtained by adding the distance L1 between the opposing surfaces of the stopper 55 and the guide block 44 to the reference height, for example, the distance L1 is 0.5 (mm). Then, it is detected as a reference height +0.5 (mm). This distance L1 stops the pressing device 30 in order to prevent the pressing device 30 from being lowered too much and applying an excessive pressure to the IC chip T when the IC chip T is pressed against the inspection socket 50. This is a predetermined distance regardless of the thickness of the IC chip T. Similarly, when the test socket 50 has the IC chip T (T1), the height of the pressing device 30 is also reduced when the pressing device 30 is lowered at a low lowering pressure without gripping the detection dummy component T1. The height obtained by adding the distance L1 to the reference height.

  Further, as shown in FIG. 5C, when the pressing device 30 has a dummy component T1 for detection and the inspection socket 50 has an IC chip T, the pressing device 30 has the dummy component T1 as an IC chip. When contacting the upper surface of T, the lowering of the spring pin 52 is stopped without causing the IC chip T to press down. The height of the pressing device 30 at this time is a height obtained by adding the distance L2 between the opposing surfaces of the stopper 55 and the guide block 44 to the reference height. This distance L2 is a height obtained by adding the thickness of the dummy component T1 to the previous distance L1, and for example, if the distance L1 is 0.5 (mm) and the thickness of the dummy component T1 is 1.5 (mm), the reference Detected as height +2.0 (mm).

Accordingly, it is determined from the detected height of the pressing device 30 whether the IC chip is left in the inspection socket 50, that is, whether there is a remaining device.
Next, determination of the presence / absence of a remaining device will be described. For convenience of explanation, the reference height is assumed to be “0 (mm)”.

For example, if the IC chip T is not present in the inspection socket 50 when the pressing device 30 is lowered to the inspection socket 50 with a low lowering pressure without holding the dummy component T1, the height of the pressing device 30 is as shown in FIG. As shown in (a), the reference height “0 (mm)” is detected. On the other hand, when the IC chip T is in the inspection socket 50, if the dummy component T1 shown in FIG. 5B is the IC chip T, the distance L1 is detected. From this, a threshold TH1 is provided between the reference height “0 (mm)” and the distance L1, and compared with the height of the pressing device 30, if the height of the pressing device 30 is lower than the threshold TH1, an inspection is performed. It is determined that there is no IC chip T in the socket 50, and if it is equal to or greater than the threshold value TH1, it is determined that the IC chip T is in the inspection socket 50. That is, a value smaller than the distance L1 can be selected as the threshold value TH1. For example, if the distance L1 is 0.5 (mm), it is possible to select a value smaller than 0.5 (mm) as the threshold TH1, but the detected variation in the height of the pressing device 30 is IC. It is preferable to select 0.2 to 0.3 (mm), which is around the intermediate value of the distance L1, if the degree is the same regardless of the presence or absence of the chip T.

  Further, for example, when the pressing device 30 grips the dummy part T1 and lowers it to the inspection socket 50 with a low lowering pressure, if the IC chip T is not present in the inspection socket 50, the height of the pressing device 30 is as shown in FIG. As shown in (b), the distance L1 is detected. On the other hand, when the IC chip T is in the inspection socket 50, the distance L2 is detected as the height of the pressing device 30 as shown in FIG. Therefore, by providing a threshold value TH2 between the distance L1 and the distance L2 and comparing it with the height of the pressing device 30, if the height of the pressing device 30 is lower than the threshold value TH2, the IC chip T is placed in the inspection socket 50. If it is higher than the threshold value TH2, it is determined that the IC chip T is present in the inspection socket 50. That is, it is possible to select a value larger than the distance L1 and smaller than the distance L2 as the threshold TH2. For example, if the distance L1 is 0.5 (mm) and the distance L2 is 2.0 (mm), a value greater than 0.5 (mm) and smaller than 2.0 (mm) is selected as the threshold TH2. Is possible. If the variation in the height of the pressing device 30 detected at this time is the same regardless of the presence or absence of the IC chip T, 1.0 to 1.5 (mm), which is around the intermediate value between the distance L1 and the distance L2, is selected. It is preferable to do.

  Incidentally, as shown in FIG. 6, when the gripping device 28 is provided with a plurality of pressing devices 30, and each of the IC chips T is placed on the corresponding inspection socket 50, these inspection sockets are provided. There is a high possibility that the IC chip T is left in only one of the 50. Even in such a case, each Z-axis pressing device 30 lowered by its own weight does not press down the spring pin 52 of each inspection socket 50, and the buffer function of each pressing device 30 is invalidated. When even one of the remaining IC chips T abuts, the lowering of the Z-axis is stopped, and the vertical position (height) as the Z-axis is detected. As a result, at least one of the gripping devices 28 including the plurality of pressing devices 30 is used for inspection based on the vertical position (distance L2 in FIG. 6) detected by being lowered with a low lowering pressure. It is determined that the IC chip T is left in the socket 50.

  In the present embodiment, since the buffer function is invalidated, errors in the height direction of the plurality of pressing devices 30 provided in the gripping device 28 are not absorbed, and the error is smaller than the thickness of the IC chip T. It is preferable to do. For example, when the thickness of the IC chip T is 0.3 (mm), the error is adjusted to 0.2 (mm) or less.

  As described above, there are some differences in the heights of the plurality of pressing devices 30 provided in the gripping device 28, and there are also some differences in the heights of the contact portions 51 of the plurality of sockets 50 for inspection. is there. Therefore, as shown in FIG. 7, when the pressing device 30 is lowered to a test socket 50 without an IC chip T with a low lowering pressure without holding the dummy component T <b> 1 by the pressing device 30, the vertical direction of each pressing device 30 ( The height of the (Z axis) is distributed in a range A0 between H01 and H02. By the way, in the present embodiment, the heights of the plurality of pressing devices 30 are collectively measured as the Z-axis height by the Z-axis motor encoder EMZ that drives the vertical moving unit 27 via the gripping device 28. Therefore, the height of the Z axis corresponds to one point in the range A0.

Further, when the pressing device 30 that does not grip the dummy component T1 is lowered to the inspection socket 50 with the IC chip T with a low lowering pressure, or the dummy component T1 is gripped to the inspection socket 50 without the IC chip T. When the pressed device 30 is lowered with a low lowering pressure, the vertical height of the Z axis is distributed in a range A1 between H11 to H12.

  Further, when the pressing device 30 that holds the dummy component T1 is lowered to the inspection socket 50 having the IC chip T with a low lowering pressure, the height in the vertical direction (Z axis) is between H21 to H22. Distributed in the range A2. In this case, the height as the Z axis corresponds to one point in the range A2.

  When the pressing device 30 does not grip the dummy component T1, whether or not the IC chip T is left is determined by comparing the height of one point in the range A0 with the height of one point in the range A1. Therefore, it is useful when the difference between the opposing surfaces of the guide block 44 and the stopper 55 when the IC chip T is normally disposed in the inspection socket 50 is large and the distance between the range A0 and the range A1 is wide. .

  On the other hand, when the difference between the opposing surfaces of the guide block 44 and the stopper 55 is small and the distance between the range A0 and the range A1 is narrow, or when the range A0 and the range A1 partially overlap, the Z-axis range From the comparison between the height of one point in A0 and the height of one point in the range A1, there is a possibility that the presence or absence of the IC chip T cannot be determined appropriately. In such a case, the pressing device 30 is caused to grip the dummy part T1 to detect the height of the pressing device 30. That is, when holding the dummy component T1 on the pressing device 30, whether or not the IC chip T is left is determined from the height of one point in the range A1 and the height of one point in the range A2 as the height of the Z axis. become. Thereby, a difference based on at least the thickness of the IC chip T can be obtained between the range A1 and the range A2, and if the difference is larger than the difference between the range A0 and the range A1, the IC chip of the socket 50 for inspection It is possible to more suitably determine whether T is left behind.

  Next, the detection operation of the remaining IC chip by the IC handler 10 will be described with reference to FIGS. FIGS. 8 to 11 are flowcharts relating to preparatory processing for the detection process of the remaining IC chip, and FIGS. 12 and 13 are flowcharts relating to the detection process of the remaining IC chip.

In order to perform the remaining device presence / absence determination processing according to the present embodiment, it is necessary to measure and initially set a reference height or the like used for the determination in advance.
First, advance preparation will be described. The advance preparation is a process performed when initial setting of various values is necessary, for example, by changing the type of the IC chip T. When the advance preparation is started, first, the control device 80 sets a reference height (step S10 in FIG. 8). The reference height is a height at which the lowering of the Z-axis that does not hold the IC chip T that has been lowered with a low lowering pressure relative to the inspection socket 50 is stopped. That is, as shown in FIG. 9, at the reference height setting, the control device 80 invalidates the buffer function for supplying high-pressure air to the piston 33 of the pressing device 30 and absorbing the difference in the vertical position (step S11). . Next, the control device 80 brings the Z-axis motor MZ into the non-driven and regenerative state and releases the Z-axis motor brake BMZ to lower the Z-axis by its own weight (step S12). Then, the control device 80 detects the height in the vertical direction (Z direction) where the lowering of the Z-axis is stopped (step S13), and uses the detected height as a reference height for a predetermined area of the nonvolatile memory. (Step S14). Thereafter, the control device 80 controls the drive of the Z-axis motor MZ so that the Z-axis is detached from the inspection socket 50 (step S15).

Further, the control device 80 sets the device arrangement height (step S20 in FIG. 8). The device arrangement height is a height at which the lowering of the Z-axis holding the IC chip T lowered with a low lowering pressure with respect to the inspection socket 50 is stopped. That is, as shown in FIG. 10, in the device arrangement height setting, the control device 80 causes each pressing device 30 to hold the IC chip T as a device for measuring the height (step S21), and the position of the pressing device 30 in the vertical direction. The buffer function for absorbing the difference is invalidated (step S22). Next, the control device 80 deactivates the Z-axis motor MZ, releases the Z-axis motor brake BMZ, and lowers the Z-axis by its own weight (step S23). Then, the control device 80 detects the height in the vertical direction (Z direction) where the lowering of the Z-axis is stopped (step S24), and the detected height is used as a device arrangement height for a predetermined amount of the nonvolatile memory. An area is set (step S25). Thereafter, the control device 80 drives and controls the Z-axis motor MZ so that the Z-axis is detached from the inspection socket 50 (step S26).

  Further, the control device 80 sets the dummy component placement height (step S30 in FIG. 8). The dummy component placement height is a height at which the lowering of the Z-axis holding the IC chip T lowered with a low lowering pressure with respect to the inspection socket 50 is stopped. That is, as shown in FIG. 11, in the dummy component arrangement height setting, the control device 80 holds, for example, the cleaning chip CC as a dummy component in each pressing device 30 in the same manner as the device arrangement height setting shown in FIG. (Step S31). Further, the buffer function of the pressing device 30 is invalidated (step S32), the Z-axis motor MZ is not driven, the Z-axis motor brake BMZ is released, and the Z-axis is lowered by its own weight (step S33). Then, the control device 80 detects the height in the vertical direction (Z direction) where the lowering of the Z-axis is stopped (step S34), and the height detected at this time is set as a dummy component arrangement height to a predetermined level of the nonvolatile memory. (Step S35), and the Z-axis is detached from the inspection socket 50 by driving the Z-axis motor MZ (step S36).

  Then, the control device 80 sets a detection threshold as shown in FIG. When the threshold TH1 used for determining the presence / absence of a remaining device without using a dummy part is set as the detection threshold based on the reference height and the device placement height, and the presence / absence of a remaining device is determined using a dummy part Is set based on the device placement height, the dummy component placement height, and the like.

Thereby, the advance preparation is completed.
Next, the remaining device presence / absence determination while the inspection of the IC chip T is automatically performed will be described. In the present embodiment, while the inspection of the IC chip T is being automatically executed, the remaining device presence / absence determination is performed when a condition that the IC chip is likely to remain in the inspection socket is satisfied. I have to. That is, when the automatic execution of the inspection of the IC chip T is started or restarted, the control device 80 determines whether there is a remaining device (step S50 in FIG. 12). The restart of the automatic execution of the inspection of the IC chip T is the restart after the automatic execution is stopped for any reason. For example, the handling error during the conveyance or the check of the inspection software program is checked. For example, after the operator manually inserts the IC, or the detection of the suction abnormality by the suction sensor (not shown) of the IC chip T is included.

As shown in FIG. 13, in the remaining device presence / absence determination, the control device 80 transports the cleaning chip CC as a dummy part held by the pressing device 30 with the inspection head 22 to the inspection socket 50 (step S51). . Further, the buffer function of the pressing device 30 is invalidated (step S52), and the Z-axis is lowered by its own weight by non-driving the Z-axis motor MZ and releasing the Z-axis motor brake BMZ (step S53). Then, the control device 80 detects the height in the vertical direction (Z direction) at which the lowering of the Z axis is stopped (step S54), and this height is used when determining the presence / absence of a remaining device using dummy parts. Compared with the threshold value TH2 (step S55), it is determined whether or not there is a remaining device, that is, whether there is an IC chip T left (step S56). For example, if the detected height is lower than the threshold value TH2, it is determined that only the dummy part exists in the inspection socket 50, that is, the IC chip T is not left. On the other hand, if the detected height is higher than the threshold value TH2, it is determined that there are parts other than the dummy parts in the inspection socket 50, that is, the IC chip T is left behind. When it is determined that the IC chip T is not left (NO in step S56), the control device 80 sets a flag indicating "no remaining device", for example, "0" in the remaining device presence / absence determination flag (step 0) (step S56). S57). On the other hand, when it is determined that the IC chip T is left behind (YES in step S56), the control device 80 sets a flag indicating “remaining device present”, for example, “1” in the remaining device presence / absence determination flag. (Step S58). When any flag is set in the remaining device presence / absence determination flag, the control device 80 causes the Z-axis to be detached from the inspection socket 50 (step S59).

  When the remaining device presence / absence determination ends, as illustrated in FIG. 12, the control device 80 refers to the remaining device presence / absence determination flag and is set to “1” indicating that there is a remaining device (YES in step S61). ), A remaining device exclusion process is performed (step S62). The remaining device exclusion process may be performed automatically, or the operator may be notified of the situation and prompted to perform an operation or the like. When the remaining device exclusion process is completed, the remaining device presence / absence determination is performed again (step S50). Completion of the remaining device removal process is automatically set if the remaining device is automatically removed, and if it is removed by the operator's work etc., the completion operation from the operator and the resumption of automatic inspection operation It is determined by the operation of.

  On the other hand, when “0” indicating that there is no remaining device is set with reference to the remaining device presence / absence determination flag (NO in step S61), the control device 80 sets an uninspected IC chip T as an uninspected device. It is determined whether or not there is (step S63). When it is determined that there is no uninspected IC chip T (NO in step S63), the control device 80 ends the automatic inspection of the IC chip T.

  On the other hand, when it is determined that there is an uninspected IC chip T (YES in step S63), the control device 80 conveys the IC chip T as an uninspected device (step S64) and transfers it to the inspection socket 50. After the placement (step S65), an electrical test of the IC chip T as a device inspection process is performed (step S66). When the electrical test of the IC chip T is completed, the control device 80 ejects the IC chip T from the inspection socket 50 and determines whether the IC chip T as a device has been correctly collected (step S68). Whether or not the IC chips T have been correctly recovered is whether or not the suction pressures and suction sensor values of all the pressing devices 30 are normal, and whether or not a predetermined number of IC chips have been recovered by the recovery robot 15. Etc. When it is determined that the IC chip T has been correctly collected (YES in step S68), the control device 80 returns to the process of determining whether there is an uninspected device (step S63), and thereafter the above-described process is executed. . On the other hand, when it is determined that the IC chip T has not been correctly collected (NO in step S68), the control device 80 notifies the operator of an alarm (step S69). The automatic operation is stopped by such an alarm notification, the operator responds to the alarm, and when the response by the operator is completed, the automatic inspection operation is restarted by the operation completion of the response by the operator, and the process of determining whether there is a remaining device Return (step S50) is performed, and thereafter the above-described processing is executed.

As described above, according to the electronic component inspection apparatus of the present embodiment, the effects listed below can be obtained.
(1) Since the height in the vertical direction when the lowering of the gripping device 28 is stopped is detected and the presence or absence of the IC chip T remaining in the inspection socket 50 is determined, the IC chip T of the IC chip T has a very simple structure. The presence or absence can be determined. At this time, in particular, since the gripping device 28 is lowered at a lowering pressure lower than the inspection pressure, for example, even if the IC chip T remains in the inspection socket 50, the IC chip T is damaged. There is no.

  (2) Since the vertical positions of a plurality of IC chips T are collectively measured, the structure is simple and the possibility of application to a conventional IC handler (electronic component inspection apparatus) is high. As a result, the reliability of the inspection of such an electronic component inspection apparatus can be enhanced while having a very simple structure.

  (3) Further, the gripping device 28 used for transporting the IC chip T was used for detecting the height of the electronic component. Accordingly, even when the type of the IC chip T is changed, if the gripping device 28 is changed to correspond to the IC chip T, for example, a sensor or the like for detecting the remaining IC chip T is used. There is no need for adjustment, and high convenience is maintained while being simple.

  (4) The gripping device 28 was lowered by its own weight while regenerating the Z-axis motor MZ. Thereby, even when the descending speed of the gripping device 28 is appropriately adjusted and an electronic component is left behind in the inspection socket 50, an excessive load is applied to the IC chip T, and the IC chip T or IC The possibility of damaging the inspection socket 50 in which the chip T is disposed is reduced. Thereby, the utility value of such an electronic component inspection apparatus is enhanced.

  (5) The weight of the gripping device 28 is adjusted by the counter spring 26S that reduces the weight of the gripping device 28. As a result, the lowering speed of the gripping device 28 is adjusted, so that even if the IC chip T is left behind in the inspection socket 50, an excessive load is applied to the IC chip T and the inspection socket 50 in which the IC chip T is disposed. Reduce the risk of giving.

  (6) When the difference in the vertical position (height) due to the presence or absence of the IC chip T is reduced by the stopper 55, the vertical position due to the presence or absence of the IC chip T can be determined by using a dummy component. Detected by height difference. As a result, the remaining detection of the IC chip T of such an electronic component inspection apparatus is ensured, and the inspection reliability of the electronic component inspection apparatus is also improved.

(7) As a dummy part, a cleaning chip CC that has been conventionally installed is utilized. Thereby, implementation of such an electronic component inspection apparatus becomes easier.
(8) Even if the IC chip T has become difficult to be visually confirmed due to further miniaturization, it can be confirmed that the IC chip T is left behind in the inspection socket 50. Since it can be confirmed that the IC chip T is left in the inspection socket 50, it is possible to prevent mistakes caused in the inspection result due to the left-over, and thus the reliability of the electronic component inspection apparatus can be improved. become.

  (9) The inspection socket 50 is provided with a spring pin 52 that is movable when the terminal of the IC chip T is pressed. Therefore, by lowering the gripping device with a low lowering pressure, the lowered vertical position of the gripping device is detected without pushing down the pin of the spring pin 52 of the inspection socket 50, so that the remaining IC chip T The detection accuracy is maintained at a high level.

(10) The IC chip T was pressed against the inspection socket 50 with a predetermined pressure, and high pressure air was supplied to the piston 33 of the pressing device 30 that absorbs some height error. As a result, the pressing device 30 does not move even when the gripping device contacts the inspection socket 50, that is, the buffer function is invalidated. As a result, even if the electronic component inspection device presses the IC chip T against the inspection socket 50 by the pressing device 30, the IC chip T left in the inspection socket 50 is preferably removed by eliminating the influence of the buffer function of the pressing device 30. Can be detected.

In addition, each said embodiment can also be implemented in the following aspects, for example.
In the above-described embodiment, the case where the remaining device presence / absence determination process is used for detection of the left IC chip T is illustrated. However, the present invention is not limited to this, and the remaining device presence / absence determination process is performed by leaving the IC chip left. Regardless of whether or not an IC chip is used, it may be used.

  In the above embodiment, the case where the Z axis is configured by the vertical moving unit 27 and the gripping device 28 is illustrated. However, the present invention is not limited thereto, and the Z-axis only needs to have a configuration for moving the sucked electronic component up and down. For example, the Z-axis may be composed of a vertical movement unit, a suction pad, and a pad protection unit. . That is, such a detection of the left IC chip may be performed by the supply-side robot hand unit or the collection-side robot hand unit. If it is provided in the supply-side robot hand unit or the collection-side robot hand unit, it is possible to detect whether the IC chip remains in the tray pocket or shuttle pocket as the IC chip placement position. As a result, the configuration capable of detecting such a left IC chip is enhanced, the problems caused by the left IC chip are reduced, and the convenience and reliability of the electronic component inspection apparatus are further enhanced.

  In the above embodiment, the case where a plurality of pressing devices 30 are connected to the electropneumatic regulator circuit 61 is illustrated. However, the present invention is not limited to this, and an electropneumatic regulator circuit corresponding to each one or a part of the pressing devices 30 may be provided as long as the air having the same pressure can be supplied to each pressing device 30.

  In the above embodiment, the case where compressed air is supplied to the pressing device 30 by the electropneumatic regulator circuit 61 is illustrated. However, the present invention is not limited to this, and if a plurality of pressure airs can be selected and adjusted and supplied to the pressing device, for example, a plurality of pre-prepared air pressures can be selected by a valve to the pressing device. You may make it supply. That is, there is no limitation on the method of supplying air having a plurality of pressures to the pressing device.

  In the above-described embodiment, the electropneumatic regulator circuit 61 is exemplified for supplying air of two types of pressure, that is, inspection air and high-pressure air. However, the present invention is not limited to this, and the electropneumatic regulator circuit may supply a plurality of air of arbitrary pressures, for example, inspection air and atmospheric pressure, or air of three or more types of pressure, to the pressing device. Good. As a result, the pressure of the air supplied depending on the type of the IC chip or the like can be set to an appropriate pressure.

  In the above embodiment, the case where high pressure air is supplied to the piston 33 is illustrated. However, the present invention is not limited to this. For example, a low pressure is supplied to the piston so that the pressure of the piston is lower than the descending pressure, or the piston is made inactive so that air can freely enter and exit the piston. May be. As a result, even if the pressing device is lowered by the lowering pressure, the piston easily moves, so that the buffer function is invalidated and the position where the lowering is stopped without being affected by the buffer function is detected. . This also increases the detection accuracy of the stopped height and improves the detection accuracy of the remaining IC chip T.

  In the above embodiment, the case where the Z axis descends by its own weight has been illustrated. However, the present invention is not limited to this, and the Z-axis may be lowered by driving a Z-axis motor. In this case, the lowering torque by driving the Z-axis motor only needs to be kept low, but if it is difficult to keep it low, the upward torque of the counter spring may be adjusted to lower the lowering torque. Good.

For example, when the gripping device is lowered at a low lowering pressure by using a motor drive, if the spring is adjusted so that the lowering torque is reduced by the counter spring, the motor is applied to the lowering of the lowering pressure holding device. The possibility is increased, that is, the applicability of a motor that is difficult to adjust with low torque is increased.

  In the above embodiment, the distance by which the Z axis is lowered by its own weight is not particularly limited. That is, the distance by which the Z-axis is lowered by its own weight may be from the height of the gripping device when it is conveyed above the inspection socket, or when the IC chip is left behind in the inspection socket, the IC chip Alternatively, it may be lowered by a motor drive until it comes into contact with (for example, 0.1 to 5 (mm)). For example, if it is lowered by a motor drive until it comes into contact with the IC chip, the time required for the descent due to its own weight can be reduced and the detection time of the remaining IC chip can be shortened. Thereby, the convenience as an electronic component inspection apparatus is improved.

  In addition, when switching from the descent by the motor drive to the descent by the own weight, the descent may be stopped and then switched, or may be switched to the own weight while leaving the descent momentum by the motor. This makes it possible to adjust the impact when the pressing device comes into contact with the IC chip.

  In the above embodiment, the case where the cleaning chip CC is used as the dummy part is illustrated. However, the present invention is not limited to this, and the dummy component may be a height detection component or an IC chip T to be inspected.

  In the above embodiment, the case where the dimensions of the IC chip T and the dummy component are the same is illustrated. However, the present invention is not limited to this, and the size of the dummy component may be different from the IC chip to be inspected. Thereby, the utility value of a dummy component comes to be raised and the convenience as such an electronic component inspection apparatus is also improved.

  In the above embodiment, the case where the stopper 55 is provided outside the inspection socket 50 is illustrated. However, the present invention is not limited to this, and a stopper may not be provided outside the inspection socket. Thereby, the freedom degree of a structure of an electronic component inspection apparatus is raised.

  In the case where the stopper 55 is not provided, a threshold value (corresponding to the threshold value TH1 in the above embodiment) for detecting an IC chip left without using a dummy component can be determined based on the thickness of the IC chip. . For example, if the thickness of the IC chip is 0.3 (mm), 0.2 (mm) can be set as the threshold value.

In the above embodiment, the case where the Z-axis motor MZ is regeneratively braked when the Z-axis is lowered is illustrated. However, the present invention is not limited to this, and the Z-axis motor may not be regeneratively braked.
In the above embodiment, the case where the Z-axis motor MZ is rotationally driven has been illustrated. However, the present invention is not limited to this, and the Z-axis motor may be a linear motor.

  In the above embodiment, the case where the weight of the Z-axis is reduced by the counter spring 26S is illustrated. However, the present invention is not limited to this, and the counter spring may not be provided as long as the adjustment of the weight of the Z-axis is unnecessary or can be adjusted by another method. Thereby, the freedom degree of the structure as an electronic component inspection apparatus comes to be raised.

  In the above embodiment, the case where the elastic force is applied to the Z-axis by the counter spring 26S is illustrated. However, the present invention is not limited to this, as long as the weight of the Z-axis is adjusted, the elastic force applied to the Z-axis is not limited to the type of spring, such as a compression spring or a leaf spring, in addition to the tension spring. Other elastic force generation devices such as air springs may also be used.

  In the above embodiment, the case where the vertical height is detected by the Z-axis motor encoder EMZ is illustrated. However, the present invention is not limited to this, and the height in the vertical direction may be detected by a linear gauge or a non-contact distance sensor as long as it is correctly detected. Thereby, the freedom degree of the structure as an electronic component inspection apparatus comes to be raised.

  In the above embodiment, it is clearly shown that there is an IC chip T having a dimension of 2 mm on a side, but the dimension of the IC chip T is shorter than 2 mm even if it has a side longer than 2 mm. It may have a side. The shape may be a polygon other than a rectangle, a circle or an ellipse. Further, the IC chip may be a silicon chip as it is or may be molded with a resin or the like.

(Other technical ideas)
(A) The electronic component carried in is moved to a predetermined arrangement position where the electronic component is arranged, and the electronic component carried in the electronic socket is inspected by a predetermined socket for inspection. An electronic component inspection apparatus having a function of pressing with pressure to perform an electrical inspection and a function of discharging the inspected electronic component, and a gripping means for collectively gripping a plurality of the electronic components, and the gripping A vertical movement means for moving the holding means upward and downward, and a control means for controlling the gripping means and the vertical movement means. The vertical movement means includes the predetermined movement position. The gripping means moved above the arrangement position is lowered at a pressure lower than the inspection pressure, and the vertical position of the gripping means when the lowering is stopped is detected. Up Electronic component inspection apparatus characterized by determining the presence or absence of an electronic component from a vertical position left behind in the predetermined positions of the detected gripping means by the moving means. According to such a configuration, it is possible to determine the presence or absence of an electronic component with an extremely simple structure.

  DESCRIPTION OF SYMBOLS 10 ... IC handler, 11 ... Base, 12 ... Safety cover, 13 ... High temperature chamber, 14 ... Supply robot, 15 ... Recovery robot, 16 ... First shuttle, 16A ... Base member, 16B ... Change kit, 16C ... Change kit, 17 ... second shuttle, 17A ... base member, 17B ... change kit, 17C ... change kit, 18 ... tray, 19 ... work area, 20 ... supply side robot hand unit, 21 ... collection side robot hand unit, 22 ... up and down movement Inspection head as means, 23 ... inspection part, 24A ... first rail, 24B ... second rail, 25 ... frame, 25A ... top plate, 25H ... opening, 25L ... leg, 26 ... horizontal movement part, 26B ... Ball screw, 26R ... Recess, 26S ... Counter spring as elastic means, 27 ... Vertical moving part, 27A ... Dynamic connection part, 27B ... support column, 28 ... gripping device as gripping means, 29 ... mounting plate, 30 ... pressing device as pressing means, 31 ... connection base, 32 ... cylinder tube, 32a ... tube body, 32b ... front Plate, 33 ... Piston, 34 ... Air introduction port, 41 ... Connection block, 41a ... Connection projection, 42 ... Vacuum guide path, 43 ... Intermediate block, 44 ... Guide block, 45 ... Suction tube, 46 ... Suction pad, 47 ... Detected piece, 48 ... Bolt, 50 ... Socket for inspection, 50L ... Stroke, 51 ... Contact part, 52 ... Spring pin, 55 ... Stopper, 61 ... Electropneumatic regulator circuit, 62 ... Valve drive circuit, 63 ... Adsorption Valve, 80 ... Control device as control means, 85 ... Input / output device, T ... IC chip, C1-C6 ... Conveyor, CC ... Cleaning DC, device chuck, FX ... X-axis frame, MY ... Y-axis motor, MZ ... Z-axis motor, PS ... pocket, R1, R2 ... air supply pipe, SL ... air cylinder, SP ... spring, T1 ... dummy Parts, Ta ... terminal, BMZ ... Z-axis motor brake, EMY ... Y-axis motor encoder, EMZ ... Z-axis motor encoder, FY1 ... first Y-axis frame, FY2 ... second Y-axis frame.

Claims (23)

An electronic component inspection apparatus that moves and arranges an electronic component in a predetermined inspection socket and performs electrical inspection by pressing it with a predetermined pressure,
Gripping means for gripping the electronic component;
A vertical movement means comprising a motor for moving the gripping means up and down;
Control means for controlling the vertical movement means,
The vertical movement means lowers the gripping means moved above a predetermined arrangement position, detects a vertical position of the gripping means when the lowering is stopped, and detects the predetermined position from the detected position. Determine the presence or absence of electronic components at the placement position,
The electronic component inspection apparatus, wherein when lowering the gripping means, the gripping means is lowered by its own weight while regeneratively braking the motor. The electronic component inspection apparatus according to claim 1, wherein the vertical movement unit is provided with an elastic unit that applies an upward force to the gripping unit.   The vertical movement means is provided with elastic means for applying an upward force exceeding the weight of the gripping means to the gripping means, and the gripping means is lowered by driving the motor. The electronic component inspection apparatus described. 2. The gripping means grips a dummy part instead of the electronic part, and the vertical movement means detects a position in the vertical direction via the dummy part when the lowering of the gripping means is stopped. Electronic component inspection apparatus as described in any one of -3. The electronic component inspection apparatus according to claim 4, wherein the dummy component is a cleaning chip that removes dirt on the electrodes of the inspection socket. The electronic component inspection apparatus according to claim 1, wherein the predetermined arrangement position is provided corresponding to an arrangement position of the inspection socket. The gripping means is provided with a pressing means for pressing the electronic component against the inspection socket,
When the vertical movement means is lowered at a predetermined lowering pressure, the vertical movement when the lowering of the gripping means is stopped while the pressing force of the pressing means is held at a pressure higher than the predetermined lowering pressure. The electronic component inspection apparatus according to claim 6, wherein the position is detected. The gripping means is provided with a pressing means for pressing the electronic component against the inspection socket,
When the vertical movement means is lowered at a predetermined lowering pressure, the vertical movement when the lowering of the gripping means is stopped in a state where the pressing force by the pressing means is held at a pressure lower than the predetermined lowering pressure. The electronic component inspection apparatus according to claim 6, wherein the position is detected. The electronic component inspection apparatus according to claim 7, wherein the gripping unit includes a plurality of the pressing units. The electronic component inspection apparatus according to any one of claims 1 to 5, wherein the predetermined arrangement position is provided for a shuttle that horizontally moves the electronic component. The said predetermined arrangement position is provided with respect to the conveyance tray which carries in the said electronic component to the said electronic component inspection apparatus, or carries it out of the said electronic component inspection apparatus. Electronic component inspection equipment. An electronic component inspection apparatus that moves and arranges an electronic component in a predetermined inspection socket and performs electrical inspection by pressing it with a predetermined pressure,
Gripping means for gripping the electronic component;
Control means for controlling the vertical movement means for moving the gripping means up and down,
The vertical movement means lowers the gripping means moved above a predetermined arrangement position, detects a vertical position of the gripping means when the lowering is stopped, and detects the predetermined position from the detected position. Determine the presence or absence of electronic components at the placement position,
The gripping means grips a dummy part in place of the electronic part, and the vertical movement means detects a vertical position via the dummy part when the lowering of the gripping means is stopped. Electronic component inspection equipment. The electronic component inspection apparatus according to claim 12, wherein the dummy component is a cleaning chip that removes dirt on an electrode of the inspection socket. The electronic component inspection apparatus according to any one of claims 12 to 13, wherein the predetermined arrangement position is provided corresponding to an arrangement position of the inspection socket. The gripping means is provided with a pressing means for pressing the electronic component against the inspection socket,
When the vertical movement means is lowered at a predetermined lowering pressure, the vertical movement when the lowering of the gripping means is stopped while the pressing force of the pressing means is held at a pressure higher than the predetermined lowering pressure. The electronic component inspection apparatus according to claim 14, wherein the position is detected. The gripping means is provided with a pressing means for pressing the electronic component against the inspection socket,
When the vertical movement means is lowered at a predetermined lowering pressure, the vertical movement when the lowering of the gripping means is stopped in a state where the pressing force by the pressing means is held at a pressure lower than the predetermined lowering pressure. The electronic component inspection apparatus according to claim 14, wherein the position is detected. The electronic component inspection apparatus according to claim 15 or 16, wherein the gripping means includes a plurality of the pressing means. The electronic component inspection apparatus according to claim 12, wherein the predetermined arrangement position is provided with respect to a shuttle that horizontally moves the electronic component. The said predetermined arrangement position is provided with respect to the tray for conveyance which carries in the said electronic component to the said electronic component inspection apparatus, or carries it out of the said electronic component inspection apparatus. Electronic component inspection equipment. An electronic component inspection apparatus that moves and arranges an electronic component in a predetermined inspection socket and performs electrical inspection by pressing it with a predetermined pressure,
Gripping means provided with pressing means for gripping the electronic component and pressing the electronic component against the inspection socket;
Control means for controlling the vertical movement means for moving the gripping means up and down,
The vertical movement means lowers the gripping means moved above a predetermined arrangement position provided corresponding to the arrangement position of the inspection socket, and the vertical movement direction of the gripping means when the lowering is stopped Detecting the position, determining the presence or absence of electronic components at the predetermined arrangement position from the detected position,
When the vertical movement means is lowered at a predetermined lowering pressure, the vertical movement when the lowering of the gripping means is stopped while the pressing force of the pressing means is held at a pressure higher than the predetermined lowering pressure. An electronic component inspection apparatus characterized by detecting a position. The electronic component inspection apparatus according to claim 20, wherein the gripping means includes a plurality of the pressing means. An electronic component inspection apparatus that moves and arranges an electronic component in a predetermined inspection socket and performs electrical inspection by pressing it with a predetermined pressure,
Gripping means provided with pressing means for gripping the electronic component and pressing the electronic component against the inspection socket;
Control means for controlling the vertical movement means for moving the gripping means up and down,
The vertical movement means lowers the gripping means moved above a predetermined arrangement position provided corresponding to the arrangement position of the inspection socket, and the vertical movement direction of the gripping means when the lowering is stopped Detecting the position, determining the presence or absence of electronic components at the predetermined arrangement position from the detected position ,
When the vertical movement means is lowered at a predetermined lowering pressure, the vertical movement when the lowering of the gripping means is stopped in a state where the pressing force by the pressing means is held at a pressure lower than the predetermined lowering pressure. An electronic component inspection apparatus characterized by detecting a position. The electronic component inspection apparatus according to claim 22, wherein the gripping means includes a plurality of the pressing means.

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