JP2008044047A - Method for setting reference position of device carrying height, and handler device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a handler apparatus which can electrically detect the contact of the tip end portion of a suction nozzle to a device. <P>SOLUTION: The handler apparatus comprises a first potential detecting means which has a suction nozzle made of an electrically conductive material, and applies a specified first potential, and also outputs the first potential as an output signal, a second potential applying means which applies a specified second potential to a dummy device formed as a device to be mounted in a pocket using an electrically conductive material, and a reference position setting means which sets the present height of the suction nozzle as the reference height position of the suction nozzle to suck the device by electrically detecting the short circuit state, in which the tip end surface of the suction nozzle has come into contact with the upper surface of the dummy device due to the descent of the suction nozzle toward the dummy device, by mans of the first potential detecting means, and by outputting the second potential as an output signal. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a device transport height reference position setting method and a handler apparatus, and more particularly, to a device transport height reference provided with means for setting a device transport height reference position for a suction nozzle in an IC handler to suck a device. The present invention relates to a position setting method and a handler device.

  As shown in FIG. 6, the suction nozzle position in the IC handler device according to the prior art is set to the concave pocket 12 in which the IC device provided on the base substrate 11 is arranged, and the IC device placed in the pocket 12. 17 and a suction nozzle 14 attached to a device transport unit (not shown) for sucking the upper surface of the IC device 17 placed in the pocket 12 and moving it to a predetermined position.

In order to vacuum-suck the IC device 17 placed in the pocket 12 with the suction nozzle 14, it is necessary to lower the suction nozzle 14 to a position where it is in light contact with the upper surface of the IC device 17. This position is called the height reference. In order to determine the height reference position, as shown in the figure, the position at which the nozzle tip surface of the suction nozzle 14 contacts the surface of the IC device 17 can be determined by human eyes from the direction orthogonal to the suction nozzle 14. By looking, the height standard was determined with the naked eye.
JP 2002-257510 A (Page 3, Fig. 1)

However, in the IC handler described in the prior art, since the suction nozzle is lowered to a position where the suction nozzle is lightly contacted with the upper surface of the IC device and the height reference is determined with the naked eye, there are subtle differences depending on the person to be determined. There was a problem that the error was large.
Thus, as individual differences increase, skill is required to enter a certain adjustment range.
Furthermore, there is a problem that it is difficult to automatically measure the reference height when the adjustment with the naked eye is determined.
If this error is too high, an adsorption error will occur. Conversely, if the error is too low, the device will be destroyed.

  While the contact state is enlarged and observed with a camera instead of the naked eye, an expensive high-resolution camera is required, and the adjustment result may be different due to the influence of illumination.

  Therefore, the suction nozzle is highly accurate on the top surface of the IC device, is inexpensive, resolves to a method for determining the height reference of the suction nozzle without requiring skill, and a height reference setting method capable of automatic height reference calibration Has a problem that must be done.

  In order to solve the above-described problems, the device transport height reference position setting method and the handler apparatus according to the present invention are configured as follows.

(1) A device transport height reference position setting method is for placing a dummy device made of a conductive material in a concave pocket provided in a base substrate, and for adsorbing the device placed in the pocket. The suction nozzle is lowered to a position where it comes into contact with the dummy device, and a state where the nozzle tip surface of the suction nozzle is in contact with the upper surface of the dummy device is electrically detected, and the height of the suction nozzle at that time is detected. The position is set as a height reference position for the suction nozzle to suck the device.

(2) In the device transport height reference position setting method, the device is placed in a concave pocket provided on the base substrate, a conductive plate is placed on the device, and the device is placed in the pocket. The suction nozzle for sucking the device is lowered to a position in contact with the plate, and the state where the nozzle tip surface of the suction nozzle is in contact with the upper surface of the plate is electrically detected. The height position of the suction nozzle is set as a height reference position for the suction nozzle to suck the device.

(3) A device transport height reference position setting method is for placing a dummy device made of a conductive material in a concave pocket provided in a base substrate, and for sucking the device placed in the pocket. When the suction pad attached to the tip of the suction nozzle is made of a non-conductive member, the conductive pin arranged in the same direction as the suction nozzle and at least protruding from the suction pad is provided. Lowering to a position in contact with the dummy device, electrically detecting a short-circuited state by the tip of the conductive pin contacting the upper surface of the dummy device, the height position of the suction nozzle at that time, The suction nozzle is set to a height reference position for sucking the device.

(4) In the device transport height reference position setting method, a device is placed in a concave pocket provided on a base substrate, a conductive plate is placed on the device, and the device is placed in the pocket. When the suction pad attached to the tip of the suction nozzle for sucking the device is made of a non-conductive member, it is arranged in the same direction as the suction nozzle and at least protrudes from the suction pad. The disposed conductive pin is lowered to a position in contact with the plate, and the state where the tip of the conductive pin is in contact with the upper surface of the plate is electrically detected, and the suction nozzle at that time Is the height reference position for the suction nozzle to suck the device.

(5) The handler device includes a concave pocket provided in the base substrate, in which the device is disposed, and a suction nozzle for sucking and moving the upper surface of the device placed in the pocket to a predetermined position. A handler device comprising: a first potential detecting means for forming the suction nozzle from a conductive material, applying a constant first potential, and outputting the first potential as an output signal; A device placed in the pocket is formed by a dummy device made of a conductive material, a second potential applying means for applying a constant second potential to the dummy device, and the suction nozzle descends in the direction of the dummy device. Then, the first potential detecting means electrically detects a short-circuited state obtained when the nozzle tip surface of the suction nozzle contacts the upper surface of the dummy device, and Outputs of the potential as an output signal, the height position of the suction nozzle at that time, the suction nozzle is that and a reference position setting means for setting the height reference position to adsorb device.
(6) The handler apparatus according to (5), wherein the first potential is a predetermined plus or minus potential, and the second potential is a ground potential.

(7) The handler device includes a concave pocket provided on the base substrate, in which the device is disposed, and a suction nozzle for sucking and moving the upper surface of the device placed in the pocket to a predetermined position. A handler device comprising: a first potential detecting means for forming the suction nozzle from a conductive material, applying a constant first potential, and outputting the first potential as an output signal; A conductive plate is placed on the device placed in the pocket, a second potential applying means for applying a constant second potential to the plate, and the suction nozzle descends in the device direction. Then, the first potential detecting means electrically detects a short-circuited state obtained when the nozzle tip surface of the suction nozzle comes into contact with the upper surface of the plate, and the second potential is used as an output signal. Output, the height position of the suction nozzle at that time, the suction nozzle is that it comprises a reference position setting means for setting the height reference position to adsorb device, the.

(8) The handler device includes a concave pocket provided on the base substrate, in which the device is disposed, and a suction nozzle for sucking and moving the upper surface of the device placed in the pocket to a predetermined position. A handler device is provided, wherein a suction pad attached to the tip of the suction nozzle is formed of a non-conductive member, is disposed in the same direction as the suction nozzle, and is disposed at a position protruding at least from the suction pad. A first potential detecting means for applying a constant first potential to the conductive pin and outputting the first potential as an output signal; and a dummy mounted on the pocket by a device made of a conductive material. And a second potential applying means for applying a constant second potential to the dummy device, and the suction nozzle is lowered toward the dummy device before The first potential detection means electrically detects a short-circuited state obtained by contacting the tip of the conductive pin with the upper surface of the dummy device, and outputs the second potential as an output signal. And a reference position setting means for setting the height position of the suction nozzle at that time and a height reference position at which the suction nozzle sucks the device.

(9) The handler device includes a concave pocket provided on the base substrate, in which the device is disposed, and a suction nozzle for sucking and moving the upper surface of the device placed in the pocket to a predetermined position. A handler device is provided, wherein a suction pad attached to the tip of the suction nozzle is formed of a non-conductive member, is disposed in the same direction as the suction nozzle, and is disposed at a position protruding at least from the suction pad. A first potential detecting means for applying a constant first potential to the conductive pin and outputting the first potential as an output signal; and a conductive material on the device placed in the pocket. A second potential applying means for applying a constant second potential to the plate, and the suction nozzle descends in the device direction so that the tip of the conductive pin The short-circuited state obtained by contacting the upper surface of the plate is electrically detected by the first potential detection means and the second potential is output as an output signal. And a reference position setting means for setting the height position and a height reference position at which the suction nozzle sucks the device.

  The proposed device transport height reference position setting method and handler apparatus has a constant first potential for the suction nozzle, and this first potential is regarded as an output signal, and is also constant on the device side. When the suction nozzle descends and comes into contact with the device, the output signal is set to the second potential when the suction nozzle is lowered and contacts the device. Thus, it is possible to determine the height reference of the suction nozzle without requiring an expensive high-resolution camera with good reproducibility and accuracy, even if it is not an expert.

  Further, even if the suction nozzle changes with time, an automatic calibration operation can be performed without human work, and a periodic automatic calibration operation can also be performed.

  Next, various embodiments of the device transport height reference position setting method and the handler apparatus according to the present invention will be described with reference to the drawings.

  The handler apparatus that can embody the device transport height reference position setting method of the first embodiment of the present invention is configured to electrically detect contact with the suction nozzle using a dummy device and to detect the height of the suction nozzle. As shown in FIG. 1, the position is set, and as shown in FIG. 1, a concave pocket 12 in which an IC device provided on the base substrate 11 is arranged, and an IC device placed in the pocket 12 (implementation) In the example, the dummy device 13) and the IC device (dummy device 13 in the embodiment) placed in the pocket 12 are attached to a device transport unit (not shown) for sucking the upper surface and moving it to a predetermined position. The suction nozzle 14 is configured.

  The suction nozzle 14 is formed of a conductive material, and a part of the suction nozzle 14 is connected to the positive side of the power source V that generates the first potential, and the voltage of the power source V is applied. The potential is detected as an output signal. The first potential detection means 15 applies a constant first potential (power source V) to the suction nozzle 14 formed of this conductive material and outputs the first potential as an output signal.

  Here, the potential applied to the suction nozzle 14 is a positive potential from the power source V. However, the potential is not limited to this, and may be any potential different from the second potential, and if the second potential is the ground potential. Other positive potentials or negative potentials may be used.

A device to be placed in the pocket 12 is formed by a dummy device 13 made of a conductive material, and a second potential applying means 16 applies a constant second potential (ground potential E) to the dummy device 13. .
The second potential applied to the dummy device 13 is the ground potential E in the embodiment. However, the second potential is not limited to this and may be any potential different from the first potential applied to the suction nozzle 14. .

  In such a configuration, the first potential detecting means represents a short-circuited state obtained by the suction nozzle 14 descending in the direction of the dummy device 13 and the nozzle tip surface of the suction nozzle 14 contacting the upper surface of the dummy device 13. 15 detects electrically. That is, when the tip surface of the suction nozzle 14 comes into contact with the dummy device 13, the second potential (ground potential E) flows to the suction nozzle 14 side, and the second potential (ground potential E) becomes an output signal. In the figure, a circuit configuration in which resistors and the like are omitted is shown, and a minimum circuit configuration for understanding is disclosed.

The height position of the suction nozzle 14 when the first potential detection means 15 outputs the second potential as an output signal is set as the height reference position at which the suction nozzle 14 sucks the device. It is a setting means.

  As shown in FIG. 2, this reference position setting means is a control unit for analyzing an output signal (not shown). When the output signal is at a potential V, the suction nozzle 14 is not in contact with the dummy device 13. After confirming, the suction nozzle 14 is lowered, and when the tip surface of the suction nozzle 14 comes into contact with the dummy device 13, the height is detected by detecting that the output signal has changed from the potential V to the potential 0 of the ground potential E. A reference position can be set.

  Next, a device transport height reference position setting method and handler apparatus according to a second embodiment of the present invention will be described with reference to the drawings.

  The handler apparatus that can embody the device transport height reference position setting method according to the second embodiment of the present invention has a device placed in a pocket and a conductive plate placed thereon. The height reference position of the suction nozzle is set by electrically detecting that the tip surface of the suction nozzle is in contact with the plate.

  As shown in FIG. 3, the concave pocket 12 in which the IC device provided on the base substrate 11 is arranged, the IC device 17 placed in the pocket 12, and the IC device 17 are placed on the IC device 17. And a suction nozzle 14 attached to a device transport unit (not shown) for sucking the upper surface of the IC device 17 placed in the pocket 12 and moving it to a predetermined position. Yes.

  The suction nozzle 14 is formed of a conductive material, and a part of the suction nozzle 14 is connected to the positive side of the power source V that generates the first potential, and the voltage of the power source V is applied. The potential is detected as an output signal. The first potential detection means 15 applies a constant first potential (power source V) to the suction nozzle 14 formed of this conductive material and outputs the first potential as an output signal.

  Here, the potential applied to the suction nozzle 14 is a positive potential from the power source V. However, the potential is not limited to this, and may be any potential different from the second potential, and if the second potential is the ground potential. Other positive potentials or negative potentials may be used.

The second potential applying means 16 applies a constant second potential (ground potential E) to the conductive plate 18 placed on the IC device 17 placed in the pocket 12.
The second potential applied to the plate 18 is the ground potential E in the embodiment. However, the second potential is not limited to this and may be any potential different from the first potential applied to the suction nozzle 14.

  In such a configuration, the first potential detecting means 15 is in a short-circuited state obtained by the suction nozzle 14 descending in the direction of the plate 18 and the nozzle tip surface of the suction nozzle 14 contacting the upper surface of the plate 18. Detect electrically. That is, when the tip surface of the suction nozzle 14 comes into contact with the plate 18, the second potential (ground potential E) flows to the suction nozzle 14 side, and the second potential (ground potential E) becomes an output signal. In the figure, a circuit configuration in which resistors and the like are omitted is shown, and a minimum circuit configuration for understanding is disclosed.

  The height position of the suction nozzle 14 when the first potential detection means 15 outputs the second potential as an output signal is set as the height reference position at which the suction nozzle 14 sucks the IC device 17. Reference position setting means.

  As shown in FIG. 2, the reference position setting means confirms that the suction nozzle 14 is not in contact with the plate 18 when the output signal is at the potential V, as shown in FIG. Then, the suction nozzle 14 is lowered, and when the tip surface of the suction nozzle 14 comes into contact with the plate 18, the height reference position is detected by detecting that the output signal has changed from the potential V to the ground potential E. Can be set.

  Here, it is detected that the tip surface of the suction nozzle 14 contacts the plate 18, but the contact is made earlier by the thickness of the plate 18 than the position where it contacts the actual IC device 17 in advance. Therefore, since the thickness of the plate 18 is known in advance, the height reference position when electrically detected is the difference between the thickness of the plate 18 and the actual height reference position of the suction nozzle 14.

  Next, a device transport height reference position setting method and handler apparatus according to a third embodiment of the present invention will be described with reference to the drawings.

  The handler device that can embody the device transport height reference position setting method of the third embodiment of the present invention uses a dummy device when the suction pad provided at the tip of the suction nozzle is a non-conductive member. Then, the height reference position of the suction nozzle is set by electrically detecting that the conductive pin integrally formed with the suction nozzle is in contact with the dummy device.

  As shown in FIG. 4, a concave pocket 12 in which an IC device provided on the base substrate 11 is disposed, and an IC device (a dummy device 13 in the embodiment) placed in the pocket 12, A suction nozzle 14 attached to a device transport unit (not shown) for sucking the upper surface of an IC device (dummy device 13 in the embodiment) placed in the pocket 12 and moving it to a predetermined position; The conductive pin 21 is arranged substantially in the same direction and is arranged at least at a position protruding from the suction pad 19.

The suction nozzle 14 is formed of a conductive material, and has a structure including a conductive pin 21 that is urged downward by a spring 22 electrically connected to the suction nozzle 14.
A part of the suction nozzle 14 is connected to the positive side of the power source V that generates the first potential, the voltage of the power source V is applied, and the potential from the connected position is detected as an output signal. Yes. When a constant first potential (power source V) is applied to the suction nozzle 14 formed of this conductive material, the first potential is applied to the conductive pin 21 in a conductive state and the first potential is output. The first potential detection means 15 outputs as a signal.

  Here, the potential applied to the suction nozzle 14 is a positive potential from the power source V. However, the potential is not limited to this, and may be any potential different from the second potential, and if the second potential is the ground potential. Other positive potentials or negative potentials may be used.

An IC device to be placed in the pocket 12 is formed by a dummy device 13 made of a conductive material, and the second potential applying means 16 applies a constant second potential (ground potential E) to the dummy device 13. is there.
The second potential applied to the dummy device 13 is the ground potential E in the embodiment. However, the second potential is not limited to this and may be any potential different from the first potential applied to the suction nozzle 14. .

  In such a configuration, the first potential detecting means 15 represents a short-circuited state obtained by the suction nozzle 14 descending in the direction of the dummy device 13 and the tip of the conductive pin 21 contacting the upper surface of the dummy device 13. Is detected electrically. That is, when the tip surface of the conductive pin 21 in conduction with the suction nozzle 14 contacts the dummy device 13, the second potential (ground potential E) flows to the suction nozzle 14 side, and the second potential (ground potential E). ) Is the output signal. In the figure, a circuit configuration in which resistors and the like are omitted is shown, and a minimum circuit configuration for understanding is disclosed.

  The height position of the suction nozzle 14 when the first potential detection means 15 outputs the second potential as an output signal is set as the height reference position at which the suction nozzle 14 sucks the IC device. Position setting means.

  As shown in FIG. 2, the reference position setting means is a control unit that analyzes an output signal (not shown). When the output signal is at the potential V, the conductive pin 21 in a conductive state is connected to the suction nozzle 14 and the dummy device 13. After confirming that it is in a non-contact state, when the suction nozzle 14 is lowered and the tip surface of the conductive pin 21 comes into contact with the dummy device 13, the output signal changes from the potential V to the potential 0 of the ground potential E. By detecting this, the height reference position can be set.

  Here, since the difference in height between the suction pad 19 provided at the tip of the suction nozzle 14 and the tip of the conductive pin 21 is a known fixed value D, the tip of the conductive pin 21 is on the surface of the dummy device 13. A value obtained by subtracting the fixed value D from the height position at the time of contact becomes the height reference position.

  Next, a device transport height reference position setting method and handler apparatus according to a fourth embodiment of the present invention will be described with reference to the drawings.

  The handler device that can embody the device transport height reference position setting method of the fourth embodiment of the present invention is configured such that when the suction pad provided at the tip of the suction nozzle is a non-conductive member, the device is placed in the pocket. The conductive plate is placed on the mounted plate, and the height of the suction nozzle is detected by electrically detecting that the tip surface of the conductive pin formed integrally with the suction nozzle is in contact with the plate. The reference position is set.

  As shown in FIG. 5, the concave pocket 12 in which the IC device provided on the base substrate 11 is disposed, the IC device 17 placed in the pocket 12, and the IC device 17 are placed on the IC device 17. A conductive plate 18 placed thereon, a suction nozzle 14 attached to a device transport unit (not shown) for sucking and moving the upper surface of the IC device 17 placed in the pocket 12 to a predetermined position, and a suction nozzle 14 A suction pad 19 formed of a non-conductive member attached to the tip of the suction pad, and a conductive pin 21 that is disposed in the same direction as the suction nozzle 14 and that protrudes at least beyond the suction pad 19. A first potential detecting means 15 for applying a constant first potential (power source V) and outputting the first potential as an output signal; A second potential applying means 16 for placing a conductive plate 18 on the IC device 17 placed on the substrate 12 and applying a constant second potential (ground potential) to the plate 18; The first potential detecting means 15 electrically detects the short-circuited state obtained by the suction nozzle 14 descending in the device direction and the tip of the conductive pin 21 coming into contact with the upper surface of the plate 18. An electric potential (grounding potential) is output as an output signal, and is roughly constituted by reference position setting means for setting the height position of the suction nozzle 14 at that time as a height reference position at which the suction nozzle 14 sucks the IC device 17. Has been.

The suction nozzle 14 is formed of a conductive material, and has a structure including a conductive pin 21 that is urged downward by a spring 22 electrically connected to the suction nozzle 14.
A part of the suction nozzle 14 is connected to the positive side of the power source V that generates the first potential, the voltage of the power source V is applied, and the potential from the connected position is detected as an output signal. Yes. When a constant first potential (power source V) is applied to the suction nozzle 14 formed of this conductive material, the first potential is applied to the conductive pin 21 in a conductive state and the first potential is output. The first potential detection means 15 outputs as a signal.

  Here, the potential applied to the suction nozzle 14 is a positive potential from the power source V. However, the potential is not limited to this, and may be any potential different from the second potential, and if the second potential is the ground potential. Other positive potentials or negative potentials may be used.

A plate 18 having a constant thickness is placed on the IC device 17 placed in the pocket 12, and a constant second potential (ground potential E) is applied to the plate 18 to apply a second potential. Means 16.
The second potential applied to the plate 18 is the ground potential E in the embodiment. However, the second potential is not limited to this and may be any potential different from the first potential applied to the suction nozzle 14.

  In such a configuration, the first potential detection means 15 is electrically short-circuited when the suction nozzle 14 descends in the IC device direction and the tip of the conductive pin 21 contacts the upper surface of the plate 18. To detect. That is, the second potential (ground potential E) flows to the suction nozzle 14 side when the tip surface of the conductive pin 21 in conduction with the suction nozzle 14 contacts the plate 18, and the second potential (ground potential E). Becomes the output signal. In the figure, a circuit configuration in which resistors and the like are omitted is shown, and a minimum circuit configuration for understanding is disclosed.

  The height position of the suction nozzle 14 when the first potential detection means 15 outputs the second potential as an output signal is set as the height reference position at which the suction nozzle 14 sucks the IC device. Position setting means.

  As shown in FIG. 2, the reference position setting means is a non-illustrated control unit for analyzing the output signal. When the output signal is at the potential V, the conductive pin 21 in the conductive state in the suction nozzle 14 is not in the plate 18. After confirming the contact state, the suction nozzle 14 is lowered, and the output signal is changed from the potential V to the ground potential E when the tip surface of the conductive pin 21 contacts the plate 18. The height reference position can be set by detecting.

  Here, since the difference in height between the suction pad 19 provided at the tip of the suction nozzle 14 and the tip of the conductive pin 21 is a known fixed value D, the tip of the conductive pin 21 contacts the surface of the plate 18. The value obtained by subtracting the fixed value D from the height position at this time is the height reference position, but the thickness of the plate 18 is also a known value, and therefore the value obtained by subtracting the thickness of the plate 18 is also obtained. This is the height reference position.

  A constant first potential is given to the suction nozzle, and this first potential is taken as an output signal, and a constant second potential is also given to the device side, so that the suction nozzle descends and the device There is provided a handler device in which an output signal is set to a second potential by being in a short-circuited state when touching the device, and it is electrically detected that the tip of the suction nozzle has touched the device.

It is explanatory drawing which showed schematically the handler apparatus of 1st Example of this invention. It is a graph which shows an output signal similarly. It is explanatory drawing which showed schematically the handler apparatus of 2nd Example of this invention. It is explanatory drawing which showed schematically the handler apparatus of 3rd Example of this invention. It is explanatory drawing which showed schematically the handler apparatus of 4th Example of this invention. It is explanatory drawing which showed schematically the handler apparatus in a prior art.

Explanation of symbols

11 Base substrate 12 Pocket 13 Dummy device 14 Suction nozzle 15 First potential detection means 16 Second potential application means 17 IC device 18 Plate 19 Suction pad 21 Conductive pin 22 Spring.

Claims (9)

A dummy device made of a conductive material is placed in a concave pocket provided in the base substrate,
Lowering the suction nozzle for sucking the device placed in the pocket to a position in contact with the dummy device,
A state in which the nozzle tip surface of the suction nozzle is short-circuited by contacting the upper surface of the dummy device is electrically detected, and the height position of the suction nozzle at that time is used for the suction nozzle to suck the device. A device transport height reference position setting method, characterized in that a height reference position is set. Place the device in the concave pocket provided on the base substrate,
Placing a conductive plate on the device;
Lowering the suction nozzle for sucking the device placed in the pocket to a position in contact with the plate,
The state where the nozzle tip surface of the suction nozzle is short-circuited by contacting the upper surface of the plate is electrically detected, and the height position of the suction nozzle at that time is a height for the suction nozzle to suck the device. A device transport height reference position setting method, characterized in that the device transport height reference position is set. A dummy device made of a conductive material is placed in a concave pocket provided in the base substrate,
When the suction pad attached to the tip of the suction nozzle for sucking the device placed in the pocket is made of a non-conductive member, the suction pad is arranged in the same direction as the suction nozzle. The conductive pin arranged at a more protruding position is lowered to a position where it contacts the dummy device,
The state where the tip of the conductive pin is short-circuited by contacting the upper surface of the dummy device is electrically detected, and the height position of the suction nozzle at that time is a height for the suction nozzle to suck the device. A device transport height reference position setting method, characterized in that the device transport height reference position is set. Place the device in the concave pocket provided on the base substrate,
Placing a conductive plate on the device;
When the suction pad attached to the tip of the suction nozzle for sucking the device placed in the pocket is made of a non-conductive member, the suction pad is arranged in the same direction as the suction nozzle. The conductive pin arranged at a more protruding position is lowered to a position where it contacts the plate,
The state where the tip of the conductive pin is short-circuited by contacting the upper surface of the plate is electrically detected, and the height position of the suction nozzle at that time is the height at which the suction nozzle sucks the device. A device transport height reference position setting method, characterized in that a reference position is set. A concave pocket provided on the base substrate in which the device is placed;
A suction nozzle for sucking and moving the upper surface of the device placed in the pocket to a predetermined position;
A handler device comprising:
A first potential detecting means for forming the suction nozzle from a conductive material, applying a constant first potential, and outputting the first potential as an output signal;
Forming a device to be placed in the pocket with a dummy device made of a conductive material, and applying a constant second potential to the dummy device;
The first potential detecting means electrically detects a short-circuited state obtained by the suction nozzle descending toward the dummy device and the nozzle tip surface of the suction nozzle contacting the upper surface of the dummy device. Output the second potential as an output signal, and a reference position setting means for setting the height position of the suction nozzle at that time as a height reference position at which the suction nozzle sucks the device;
A handler device comprising:   6. The handler device according to claim 5, wherein the first potential is a predetermined plus or minus potential, and the second potential is a ground potential. A concave pocket provided on the base substrate in which the device is placed;
A suction nozzle for sucking and moving the upper surface of the device placed in the pocket to a predetermined position;
A handler device comprising:
A first potential detecting means for forming the suction nozzle from a conductive material, applying a constant first potential, and outputting the first potential as an output signal;
A second potential applying means for placing a conductive plate on the device placed in the pocket, and applying a constant second potential to the plate;
The first potential detecting means electrically detects a short-circuited state obtained by the suction nozzle descending in the device direction and the nozzle tip surface of the suction nozzle contacting the upper surface of the plate, A reference position setting means for outputting a second potential as an output signal and setting the height position of the suction nozzle at that time as a height reference position at which the suction nozzle sucks the device;
A handler device comprising: A concave pocket provided on the base substrate in which the device is placed;
A suction nozzle for sucking and moving the upper surface of the device placed in the pocket to a predetermined position;
A handler device comprising:
A suction pad attached to the tip of the suction nozzle is formed of a non-conductive member, is disposed in the same direction as the suction nozzle, and is disposed at least at a position protruding from the suction pad. First potential detection means for applying the first potential and outputting the first potential as an output signal;
Forming a device to be placed in the pocket with a dummy device made of a conductive material, and applying a constant second potential to the dummy device;
The first potential detecting means electrically detects a short-circuited state obtained by the suction nozzle descending toward the dummy device and the tip of the conductive pin contacting the upper surface of the dummy device. Reference position setting means for outputting the second potential as an output signal, and setting the height position of the suction nozzle at that time as a height reference position at which the suction nozzle sucks the device;
A handler device comprising: A concave pocket provided on the base substrate in which the device is placed;
A suction nozzle for sucking and moving the upper surface of the device placed in the pocket to a predetermined position;
A handler device comprising:
A suction pad attached to the tip of the suction nozzle is formed of a non-conductive member, is disposed in the same direction as the suction nozzle, and is disposed at least at a position protruding from the suction pad. First potential detection means for applying the first potential and outputting the first potential as an output signal;
A second potential applying means for placing a conductive plate on the device placed in the pocket, and applying a constant second potential to the plate;
The first potential detecting means electrically detects a short-circuited state obtained by the suction nozzle descending in the device direction and the tip of the conductive pin coming into contact with the upper surface of the plate. A reference position setting means for setting the height position of the suction nozzle at that time as a height reference position at which the suction nozzle sucks the device;
A handler device comprising:

Images