JP2004219144A - Manufacturing method for semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a semiconductor device capable of improving the yield of inspection using a handler. <P>SOLUTION: A selection process using the handler is performed as follows: a QFP is mounted in a socket 3 of the handler and a test is performed; after the test, the QFP is taken out from inside the socket 3; then similar tests are performed relative to the QFP's to the number of several tens to a hundred; after the test, a cleaning chip 23 is arranged in the socket 3 and a contact pin 3b of the socket 3 is cleaned by the cleaning chip 23; and after cleaning, the QFP is mounted again in the socket 3 and the test is performed. Hereby, since the socket 3 can be cleaned automatically with proper frequency, the yield of the inspection can be improved, and since re-inspection can be reduced, the operation rate of the handler can be improved. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a semiconductor manufacturing technique, and more particularly to a technique that is effective when applied to improve the yield of inspection in a handler.
[0002]
[Prior art]
Conventionally, foreign matter adhering to a jig for semiconductor manufacturing can be removed by disposing a foreign matter removing sheet between the jig body and a lid member that can be opened and closed, and removes foreign matter from a connector part of the jig body. Foreign matter attached to the jig body is removed by contacting the sheet (for example, see Patent Document 1).
[0003]
In the repair of the contact failure of the socket in the semiconductor evaluation test device, a contact failure repairing polishing sheet is attached to the semiconductor evaluation test device socket, and the opening and closing operation of the socket causes the polishing layer of the contact failure repairing polishing sheet to be attached to the polishing material layer. Foreign matter adhering to the contact pins of the socket is removed by sliding the contact pins of the socket in contact (for example, see Patent Document 2).
[0004]
[Patent Document 1]
JP-A-9-178806 (page 3, FIG. 6)
[0005]
[Patent Document 2]
JP-A-11-233220 (page 3, FIG. 6)
[0006]
[Problems to be solved by the invention]
The present inventor evaluated the cleaning of the socket using the cleaning sheet, and examined the technique.
[0007]
The comparative example shown in FIG. 16 shows the result of the inventor's evaluation of the cleaning sheet. That is, the operation of mounting the semiconductor device in the socket and performing a device test, removing the tested semiconductor device from the socket, mounting the untested semiconductor device in the socket again, and performing the device test are repeated several thousand times. 4 shows a result of measuring a recovery rate of the contact terminal of the socket after being returned to the original state. The electrical resistance of the contact terminals of the socket was measured before the test and after cleaning with a cleaning sheet after performing the test several thousand times, and the recovery state of the electrical resistance was indicated as a percentage for each pin. It is a thing.
[0008]
As shown in FIG. 16, some pins have a recovery rate of 80% or more, but some pins have a recovery rate of not more than 50%. was gotten.
[0009]
That is, in the cleaning with the cleaning sheet, it is understood that the cleaning effect cannot be obtained unless the cleaning is performed at an appropriate frequency, and there is a problem that the cleaning is not performed at the appropriate frequency.
[0010]
It should be noted that Patent Documents 1 and 2 do not describe in detail the frequency of performing cleaning in cleaning using a sheet.
[0011]
Further, when cleaning the socket provided in the handler, if the cleaning is performed while the handler is stopped, a problem arises in that the operation rate of the apparatus is greatly reduced.In addition, the operator has to perform the cleaning manually. However, there is a problem that the burden on the operator is increased.
[0012]
An object of the present invention is to provide a method of manufacturing a semiconductor device which improves the yield of inspection.
[0013]
It is another object of the present invention to provide a method of manufacturing a semiconductor device for improving the operating rate of a handler.
[0014]
The above and other objects, objects, and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.
[0015]
[Means for Solving the Problems]
The following is a brief description of an outline of typical inventions disclosed in the present application.
[0016]
That is, in the present invention, in a sorting step using a handler, a socket in which a semiconductor device is mounted is cleaned by arranging a cleaning chip in the socket at predetermined timings, and thereafter, the semiconductor is placed in the socket. The semiconductor device is tested by mounting the device.
[0017]
BEST MODE FOR CARRYING OUT THE INVENTION
In the following embodiments, the description of the same or similar parts will not be repeated in principle unless necessary.
[0018]
Further, in the following embodiments, when referring to the number of elements (including the number, numerical value, amount, range, etc.), a case where it is particularly specified and a case where it is clearly limited to a specific number in principle, etc. Except, the number is not limited to the specific number, and may be more than or less than the specific number.
[0019]
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In all the drawings for describing the embodiments, members having the same functions are denoted by the same reference numerals, and repeated description thereof will be omitted.
[0020]
FIG. 1 is a plan view showing an example of the structure of a handler used in the method of manufacturing a semiconductor device according to the embodiment of the present invention, FIG. 2 is a side view showing an example of the structure of the handler shown in FIG. 1, and FIG. 4 is a partial cross-sectional view showing an example of a state when the package is transferred by the handler shown in FIG. 4, FIG. 4 is a partial cross-sectional view showing an example of a state when the package is pressed by the handler shown in FIG. 1, and FIG. 5 is sorted by the handler shown in FIG. FIG. 6 is an external perspective view showing an example of the structure of a cleaning chip for cleaning the socket of the handler shown in FIG. 1, and FIG. 7 is an external perspective view showing an example of the structure of the cleaning device shown in FIG. FIG. 8 is an enlarged partial sectional view showing the structure of the cleaning chip shown in FIG. 6, and FIG. 9 is a side view showing the structure of the cleaning chip shown in FIG. FIG. 10 is an enlarged partial cross-sectional view showing the structure of the cleaning chip, FIG. 10 is a partial cross-sectional view showing an example of a state when the cleaning chip is transferred by the handler shown in FIG. 1, and FIG. FIG. 12 is a partial sectional view showing an example of a state at the time of cleaning, FIG. 12 is a sectional view and an enlarged partial sectional view showing an example of a state at the time of socket cleaning by the cleaning chip shown in FIG. 6, and FIG. 13 is a semiconductor according to an embodiment of the present invention. FIG. 14 is a plan view showing the structure of a modification of the handler used in the method of manufacturing a device, and FIG. 14 is an external perspective view showing the structure of a semiconductor device of a modification in which sorting is performed by the method of manufacturing a semiconductor device according to the embodiment of the present invention. FIGS. 15A, 15B and 15C are perspective views showing the structure of a chip carrier and its socket used in a method of manufacturing a semiconductor device according to a modification of the embodiment of the present invention. FIG, 16 is an evaluation result showing a cleaning results when using the cleaning sheet of the comparative example with respect to the embodiment of the present invention.
[0021]
The present embodiment describes a semiconductor device sorting process using the handler 17, and describes a test of the semiconductor device by the handler 17 and a cleaning of the socket 3 to which the semiconductor device is mounted at the time of the test.
[0022]
The handler 17 shown in FIGS. 1 and 2 will be described. The loader robot 17a picks up and transports a semiconductor device from the loader tray 18 in which an untested semiconductor device is stored, and the cleaning chip 23 shown in FIG. Cleaning chip housing 17b, a device direction changing unit 17c for changing the transfer direction of the semiconductor device, a measuring unit 17d for testing the semiconductor device, a transfer unit 17e for transferring the semiconductor device to the measuring unit 17d, and an inspection. And an unloader robot section 17f for arranging the completed semiconductor device on either the first unloader tray 20 or the second unloader tray 21 according to the inspection result.
[0023]
Further, as shown in FIG. 2, a test head 17i is installed in the measuring section 17d, and a socket 3 on which a semiconductor device can be mounted is arranged on the test head 17i.
[0024]
At the time of the test, the semiconductor device is sucked and conveyed by the suction part 17k provided at the tip of the press mechanism 17g, and is pressed into the socket 3 by the pusher 17h.
[0025]
The empty tray 19 on which all the semiconductor devices have been transported in the loader tray 18 is supplied to the unloader side as an empty tray 19, and becomes either the first unloader tray 20 or the second unloader tray 21.
[0026]
Next, the cleaning chip 23 which is a cleaning sheet used in the present embodiment and shown in FIGS. 6 to 9 will be described.
[0027]
The cleaning chip 23 shown in FIGS. 6 to 8 is used for cleaning by wiping (wiping) the contact portion of the contact pin (terminal) 3b of the socket 3 with the external terminal of the semiconductor device. Foreign matter such as solder dust adhering to 3b can be scraped off.
[0028]
The configuration of the cleaning chip 23 includes a polishing sheet 23a made of polyimide or the like, a reinforcing member 23b made of aluminum or the like, and an adhesive 23c for bonding the two, and has a shape substantially similar to the outer shape of the semiconductor device to be inspected. And are formed in substantially the same size.
[0029]
It is preferable that the sheet surface of the polishing sheet 23a be formed in a corrugated shape as shown in FIG.
[0030]
The cleaning chip 23 shown in FIG. 9 is a modified example, and a foreign matter removing sheet 23d made of polyimide and an adhesive substance is used instead of the polishing sheet 23a shown in FIG. It removes foreign matter such as dust.
[0031]
Next, a method for manufacturing the semiconductor device of the present embodiment will be described.
[0032]
In the method of manufacturing a semiconductor device, in the step of selecting a semiconductor device using the handler 17, the socket 3 is cleaned at predetermined timings while the handler 17 is operating, and then the semiconductor device is again placed in the socket 3 of the handler 17. The semiconductor device is tested by being mounted. That is, in the sorting process by the handler 17, the socket 3 is cleaned without stopping the handler 17 inline, and then the semiconductor device is tested again.
[0033]
In this embodiment, a read-type QFP (Quad Flat Package) 22 shown in FIG. 5 will be described as an example of a semiconductor device to be tested by the handler 17. The QFP 22 has a sealing portion 22b in which the semiconductor chip 1 is incorporated, and a plurality of outer leads 22a that are exposed to the outside from the sealing portion 22b and are bent and formed in a gull wing shape.
[0034]
First, in the handler 17 shown in FIGS. 1 and 2, the QFP 22 is taken out of the loader tray 18, and the transport direction is changed by the device direction changing unit 17c, and then is transferred to the measuring unit 17d. In the measuring section 17d, as shown in FIGS. 3 and 4, the QFP 22 is suction-held by the suction section 17k provided at the tip of the pusher 17h, and the QFP 22 is mounted in the socket 3 of the measuring section 17d.
[0035]
Thereafter, a predetermined electrical test is performed on the QFP 22, and after the test, the QFP 22 is taken out of the socket 3, and the transport direction is changed again from the measuring unit 17d by the device direction changing unit 17c. The QFP 22 is stored in the first unloader tray 20 or the second unloader tray 21.
[0036]
Such a series of operations is performed for one QFP 22, but in the handler 17, the QFP 22 is sequentially taken out from the loader tray 18 and the QFP 22 is sequentially conveyed to the measuring unit 17d in order to improve processing efficiency.
[0037]
In the measurement unit 17d, while one QFP 22 is being tested, the next QFP 22 is already mounted in the other socket 3 and is on standby. In the handler 17 shown in FIG. 1, one set (two) of the QFPs 22 can be tested at the same time. After the test of one set of the QFPs 22, the disk-shaped measurement unit 17d rotates to rotate the next set of the QFPs 22. The QFP 22 is arranged at the test position, and the test of the next set of QFPs 22 is started, and the tested set of (two) QFPs 22 is sent to the transfer unit 17e.
[0038]
By repeating such an operation, a test is performed on a predetermined number of QFPs 22. For example, a test is performed on several tens to about 100 QFPs 22.
[0039]
After performing a test on the tens to about 100 QFPs 22, the cleaning chip 23 shown in FIG. 6 is taken out from the cleaning chip housing section 17b, and the cleaning chip 23 is transferred to the measuring section 17d via the transfer section 17e. Transport. Thereafter, in the measuring section 17d, as shown in FIGS. 10 and 11, the cleaning chip 23 is suction-held by the suction section 17k provided at the tip of the pusher 17h, and the cleaning chip 23 is placed in the socket 3 of the measuring section 17d. Attach.
[0040]
Thereafter, the contact pins 3b as terminals in the socket 3 are cleaned by the cleaning chip 23.
[0041]
At that time, as shown in FIG. 12, the cleaning chip 23 rubs and wipes (wipes) the contact portion of the contact pin 3b of the socket 3 with the outer lead 22a of the QFP 22, thereby cleaning the contact pin 3b.
[0042]
Here, when the cleaning chip 23 is seated on the socket body 3a of the socket 3 and the socket cover 3c is opened and closed, the contact pins 3b rub the abrasive sheet 23a of the cleaning chip 23 by wiping (wiping).
[0043]
As a result, foreign matters such as solder chips adhering to the contact pins 3b are scraped off by the polishing sheet 23a of the cleaning chip 23, and the contact pins 3b of the socket 3 can be cleaned.
[0044]
After the cleaning of the contact pins 3b of the socket 3 is completed, the cleaning chip 23 is taken out of the socket 3 and sent out from the measuring unit 17d, and then the cleaning chip 23 is transferred via the transfer unit 17e. Housed in
[0045]
After the cleaning of the socket 3 is completed, the QFPs 22 are sequentially mounted in the socket 3 in a similar manner, and the tests of the plurality of QFPs 22 are sequentially performed.
[0046]
As described above, in the handler 17 of the present embodiment, in the process of selecting the QFPs 22, every time a predetermined number of QFPs 22 such as several tens to 100 are tested, the QFPs 22 are automatically tested at predetermined timings. Then, the socket 3 is cleaned by the cleaning chip 23, so that the socket 3 can be periodically cleaned at an appropriate frequency.
[0047]
As a result, a sufficient cleaning effect by the cleaning chip 23 can be obtained, and the occurrence of contact failure during a test can be greatly reduced.
[0048]
Therefore, the yield of the inspection of the semiconductor device by the handler 17 can be improved, and the quality of the semiconductor device can be improved.
[0049]
Further, strict contact conditions in the screening test can be maintained.
[0050]
In addition, since a sufficient cleaning effect can be obtained, the reliability of the inspection can be improved, so that re-inspection does not need to be reduced or performed, and the operation rate of the handler 17 can be greatly improved. it can.
[0051]
Since the socket 3 is automatically cleaned by the cleaning chip 23 in-line without stopping the handler 17, the operating rate of the handler 17 can be improved.
[0052]
In addition, since the replacement of the cleaning tip 23 is automatically performed without the intervention of an operator, the burden on the operator can be reduced.
[0053]
In addition, the occurrence of contact failures can be significantly reduced, and retesting can be reduced or eliminated, so that the number of times of inserting and removing a semiconductor device from the socket 3 can be reduced. Therefore, the lead bending of the outer lead 22a of the QFP 22 can be reduced, and the quality of the semiconductor device can be improved.
[0054]
Next, modified timings for automatically cleaning the socket 3 other than for each test of a predetermined number of semiconductor devices will be described.
[0055]
As the timing, the cleaning chip 23 may be automatically arranged in the socket 3 for cleaning every time the QFP 22 is determined to be defective for a predetermined number of consecutive times.
[0056]
For example, when a contact failure (poor contact) occurs five times in a row in the test, the socket 3 may be automatically cleaned by the cleaning chip 23.
[0057]
Further, the cleaning chip 23 may be automatically arranged in the socket 3 for cleaning every time the failure rate of the QFP 22 in the test reaches a predetermined rate.
[0058]
For example, when the occurrence rate of contact failure (poor contact) in the test of the QFP 22 reaches 3%, the cleaning of the socket 3 by the cleaning chip 23 is automatically performed.
[0059]
In the two modified examples of the timing of cleaning the socket 3 described above, the same effect can be obtained as in the case where the cleaning is performed every predetermined number of tests.
[0060]
In addition, the timing of performing the cleaning is determined for each of a predetermined number of tests, each time a predetermined number of consecutive tests are performed, and when the failure rate reaches a predetermined rate. And the timing may be any one of them, or a plurality of timings may be combined.
[0061]
The timing of the cleaning need not always be in-line. For example, after stopping the handler 17 for a long time (about several days) in a factory or the like, the cleaning may be performed just before the operation, or the like. Cleaning may be performed when the flow of processing is stopped, such as between lots.
[0062]
Next, FIG. 13 shows a configuration of a handler 17 according to a modification, in which a cleaning chip 23 is attached in advance to a cleaning head 17j arranged in a measuring unit 17d.
[0063]
In this case, the cleaning chip accommodating portion 17b and the like are not required in the handler 17, and the handler 17 can be downsized and made compact.
[0064]
Note that the same effect as that of the handler 17 shown in FIG. 1 can be obtained by using the handler 17 of the modified example shown in FIG.
[0065]
FIG. 14 shows a modification of the semiconductor device to be sorted and tested by the handler 17, and shows a BGA (Ball Grid Array) 24 to which a plurality of ball electrodes 24a made of solder or the like are attached as external terminals. I have. In the BGA 24, a sealing portion 24c is formed on a front surface of a BGA substrate 24b, and a plurality of ball electrodes 24a are provided on a back surface side.
[0066]
When testing the BGA 24, according to the method of manufacturing a semiconductor device of the present embodiment, the number of times of insertion and removal to and from the socket 3 is reduced, so that deformation and dropout of the ball electrode 24a is reduced, and the quality of the BGA 24 is improved. it can.
[0067]
As described above, the invention made by the inventor has been specifically described based on the embodiment of the invention. However, the invention is not limited to the embodiment of the invention, and various modifications may be made without departing from the gist of the invention. It goes without saying that it is possible.
[0068]
In the above-described embodiment, the lead type QFP 22 and the ball electrode type BGA 24 have been described as the semiconductor devices to be inspected. However, the semiconductor device is not limited to these, and the semiconductor device is an SOP (Small Outline Package). Or an LGA (Land Grid Array) or the like, as long as it can be mounted on the socket 3 and subjected to a screening test by the handler 17.
[0069]
Further, the inspection target by the handler 17 may be a carrier 2 for chip burn-in as shown in FIG.
[0070]
The carrier 2 includes a base 4 on which the semiconductor chip 1 is mounted, and a lid 5 that can be opened and closed on the base 4. The base 4 has a through hole 6 for accommodating the semiconductor chip 1. A positioning guide 7 for positioning the semiconductor chip 1 is provided below the inner peripheral side surface of the through hole 6. A tape circuit board 8 having a multilayer wiring layer structure and a reinforcing plate 9 for reinforcing the tape circuit board 8 are provided on the back surface of the base 4. The tape circuit board 8 includes contact portions 10 that contact the electrodes of the semiconductor chip 1 and terminal portions 11 that are electrically connected to the contact portions 10 and that are compatible with the semiconductor device in arrangement and signal assignment. Have.
[0071]
Each terminal portion 11 of the tape circuit board 8 protrudes from the side surface of the base 4 and is exposed and arranged on the front and back surfaces of the tape circuit board 8. The lid 5 is provided with a pusher 12 on the inside, so that the semiconductor chip 1 can be pressed against the tape circuit board 8 when the lid 5 is closed. When the cover 5 is closed, the latch 13 provided on the cover 5 is fitted to the fitting portion 14 of the base 4.
[0072]
The socket 3 has the same structure as a socket member on a burn-in board for performing a burn-in test of a semiconductor device when the semiconductor chip 1 is sealed, and is used in an existing burn-in test performed after assembling the semiconductor chip 1 into a package structure. Test jigs and test equipment can be used as they are. The socket 3 is formed with a concave portion 15 into which the carrier 2 on which the semiconductor chip 1 is mounted is inserted, and around the inner peripheral bottom surface of the concave portion 15, each of the concave portions 15 is in contact with each terminal portion 11 of the tape circuit board 8 of the carrier 2. Pins 16 are provided, and each of the pins 16 is connected to each wiring on a burn-in board (not shown).
[0073]
The cleaning of each pin 16 of the socket 3 can also be performed by using the cleaning chip 23 described in the above embodiment.
[0074]
Further, the semiconductor device to be inspected by the handler 17 may be a module product such as an MCM (Multi-Chip-Module) or a DIMM (Dual In-Line Memory Module).
[0075]
【The invention's effect】
The effects obtained by typical aspects of the invention disclosed in the present application will be briefly described as follows.
[0076]
The occurrence of contact failure can be reduced in the sorting process using the handler, and the yield of inspection can be improved. Further, since the reliability of the inspection is improved, it is not necessary to perform the re-inspection, and the operating rate of the handler can be improved. Further, by reducing the number of times of re-inspection, damage to leads and balls of the semiconductor device can be significantly improved.
[Brief description of the drawings]
FIG. 1 is a plan view showing an example of a structure of a handler used in a method of manufacturing a semiconductor device according to an embodiment of the present invention.
FIG. 2 is a side view showing an example of the structure of the handler shown in FIG.
FIG. 3 is a partial cross-sectional view showing an example of a state when a package is transferred by the handler shown in FIG. 1;
FIG. 4 is a partial cross-sectional view showing an example of a state at the time of pressing the package by the handler shown in FIG. 1;
5 is an external perspective view illustrating an example of a structure of a semiconductor device in which sorting is performed by the handler illustrated in FIG. 1;
6 is an external perspective view showing an example of a structure of a cleaning chip for cleaning a socket of the handler shown in FIG. 1;
FIG. 7 is a side view showing the structure of the cleaning chip shown in FIG.
8 is an enlarged partial cross-sectional view showing the structure of the cleaning chip shown in FIG.
FIG. 9 is an enlarged partial cross-sectional view illustrating a structure of a cleaning chip of a modified example for cleaning the socket of the handler illustrated in FIG. 1;
10 is a partial sectional view showing an example of a state when a cleaning chip is transferred by the handler shown in FIG. 1;
FIG. 11 is a partial cross-sectional view showing an example of a state when the cleaning chip is pressed by the handler shown in FIG. 1;
12A and 12B are a sectional view and an enlarged partial sectional view illustrating an example of a state at the time of socket cleaning by the cleaning chip illustrated in FIG. 6;
FIG. 13 is a plan view showing a structure of a handler according to a modification used in the method of manufacturing a semiconductor device according to the embodiment of the present invention;
FIG. 14 is an external perspective view illustrating a structure of a semiconductor device according to a modification in which selection is performed by the method of manufacturing a semiconductor device according to the embodiment of the present invention;
FIGS. 15 (a), (b) and (c) are external perspective views showing the structure of a chip carrier and its socket used in a method of manufacturing a semiconductor device according to a modification of the embodiment of the present invention.
FIG. 16 is an evaluation result diagram showing a cleaning result when a cleaning sheet of a comparative example to the embodiment of the present invention is used.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Semiconductor chip 2 Carrier 3 Socket 3a Socket body 3b Contact pin (terminal)
3c Socket cover 4 Base 5 Lid 6 Through hole 7 Positioning guide 8 Tape circuit board 9 Reinforcement plate 10 Contact part 11 Terminal part 12 Pusher 13 Latch 14 Fitting part 15 Depression 16 Pin 17 Handler 17a Loader robot part 17b Cleaning chip housing part 17c Device direction changing unit 17d Measuring unit 17e Transfer unit 17f Unloader robot unit 17g Press mechanism 17h Pusher 17i Test head 17j Cleaning head 17k Suction unit 18 Loader tray 19 Empty tray 20 First unloader tray 21 Second unloader tray 22 QFP (semiconductor device)
22a outer lead 22b sealing portion 23 cleaning chip 23a polishing sheet 23b reinforcing member 23c adhesive 23d foreign matter removing sheet 24 BGA (semiconductor device)
24a Ball electrode 24b BGA substrate 24c Sealing part

Claims (5)

In the sorting step using a handler, the socket on which the semiconductor device is mounted is cleaned by arranging a cleaning chip in the socket at predetermined timings, and then mounting the semiconductor device in the socket and cleaning the socket. A method for manufacturing a semiconductor device, wherein a test of the semiconductor device is performed. In the sorting step using the handler, the socket in which the semiconductor device is mounted is cleaned by disposing a cleaning chip in the socket for each predetermined number of tests of the semiconductor device, and thereafter, in the socket. A method for manufacturing a semiconductor device, comprising: mounting the semiconductor device and testing the semiconductor device. In a sorting step using a handler, a socket to which a semiconductor device is mounted is cleaned by disposing a cleaning chip in the socket each time the semiconductor device is determined to be defective continuously for a predetermined number of times, Thereafter, a test of the semiconductor device is performed by mounting the semiconductor device in the socket. In the sorting step using a handler, the socket in which the semiconductor device is mounted is cleaned by disposing a cleaning chip in the socket every time the failure rate of the semiconductor device in the test reaches a predetermined ratio, and thereafter, Mounting the semiconductor device in the socket and testing the semiconductor device. After cleaning a socket in which a semiconductor device is mounted in a sorting step using a handler, a method for manufacturing a semiconductor device for testing the semiconductor device,
(A) mounting the semiconductor device in the socket of the handler, performing the test, and removing the semiconductor device from the socket after the test;
(B) performing the step (a) on several tens to 100 semiconductor devices;
(C) after the step (b), cleaning a terminal of the socket by disposing a cleaning chip in the socket;
(D) after the step (c), mounting the semiconductor device in the socket and performing the test.
The semiconductor device, wherein in the sorting step using the handler, the socket is cleaned by the cleaning chip every time when several tens to 100 semiconductor devices are tested, and thereafter, the semiconductor device is tested. Manufacturing method.

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