JPH0227676A - Socket for device - Google Patents
Socket for deviceInfo
- Publication number
- JPH0227676A JPH0227676A JP63177046A JP17704688A JPH0227676A JP H0227676 A JPH0227676 A JP H0227676A JP 63177046 A JP63177046 A JP 63177046A JP 17704688 A JP17704688 A JP 17704688A JP H0227676 A JPH0227676 A JP H0227676A
- Authority
- JP
- Japan
- Prior art keywords
- contact
- lead
- socket
- pin
- pins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 description 10
- 238000012360 testing method Methods 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 5
- 238000007689 inspection Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000004836 Glue Stick Substances 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Connecting Device With Holders (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔概要〕
高密度型のデバイス評価用ソケットに関し、必要に応じ
て任意にリードとコンタクトピンとの接触不良を検査で
きることを目的とし、集積回路のデバイスをソケットに
＠置して該デバイスのリードを該ソケットのコンタクト
ピンに当接させ、該ソケットの回動する蓋に設けた突起
部で前記リードを押圧して前記コンタクトピンに圧接す
るデバイス用ソケットにおいて、前記コンタクトピンを
２本のビンに分割し、これら２本のビンが互いに独立に
前記リードと接触するように構成する。[Detailed Description of the Invention] [Summary] With regard to a high-density device evaluation socket, the purpose of this invention is to enable inspection of poor contact between leads and contact pins as needed, by placing an integrated circuit device in the socket. A socket for a device in which a lead of the device is brought into contact with a contact pin of the socket, and a protrusion provided on a rotating lid of the socket presses the lead into pressure contact with the contact pin. It is divided into two bins, and these two bins are configured to contact the lead independently of each other.
本発明は高密度型のデバイス評価用ソケットに関するも
のである。The present invention relates to a high-density device evaluation socket.
近年、半導体製造技術の進歩に伴い高密度の集積回路が
出現してきた。このような高密度型のデバイスとしては
、スモール・アウトライン・パッケージ（ＳＯＰ）や四
方向フラットパッケージ（ＱＦＰ）等の表面実装型（Ｓ
ＭＴ）ＬＳ Ｉがある。ＳＭＴ型ＬＳＩはパッケージの
四辺から複数本のリードが突設されており、リードは細
線化し、密集している。かくして、ＳＭＴ型のＬＳＩで
は各リードをソケットのコンタクトピンに圧接して接続
を図る方式が主流になっており、圧接であるため、全て
のリードについて接触が確実であることが積極的にｈｌ
ＥｉＪできるソケットの開発が望まれている。In recent years, with advances in semiconductor manufacturing technology, high-density integrated circuits have emerged. Such high-density devices include surface-mounted devices such as small outline packages (SOPs) and four-way flat packages (QFPs).
MT) LS I is available. An SMT type LSI has multiple leads protruding from the four sides of the package, and the leads are thin and densely packed. Thus, in SMT type LSIs, the mainstream method is to connect each lead by pressure contacting the contact pin of the socket, and since pressure contact is used, it is actively required to ensure that all leads are in contact with each other.
It is desired to develop a socket that can perform EiJ.
従来、デバイスのリードとソケットのコンタクトピンと
の接触不良の検査はデバイス側に内蔵された保護用ダイ
オードのＶ−１（電圧−電流）特性を利用して行ってい
る。Conventionally, poor contact between device leads and socket contact pins has been tested using the V-1 (voltage-current) characteristic of a protective diode built into the device.
第５図において、ａは保護用ダイオードで、過電圧印加
時の回路保護のためにデバイス１内に予め設けられてい
る。デバイス１のリード２が基板３上のコンタクトピン
４に絶縁性の押圧バー５により圧接されて、デバイス１
はソケットの基板３上に支持され実装される。デバイス
ｌは５ＯＰ（スモール・アウトライン・パッケージ）や
ＳＭＴ（表面実装）型の薄型高密度ＬＳＩでありパッケ
ージの四辺から複数本のり−ド２が突設されている。こ
のような高密度ＬＳＩのリード２は細く互いに接近して
密集しており、スルーホールに挿入したり、ソケットの
挿入ビンに挿通することは困難である。従って圧接方式
が採用されている。In FIG. 5, a is a protection diode, which is provided in advance within the device 1 to protect the circuit when overvoltage is applied. The leads 2 of the device 1 are pressed against the contact pins 4 on the substrate 3 by an insulating press bar 5, and the device 1
is supported and mounted on the substrate 3 of the socket. The device 1 is a thin high-density LSI of 5OP (small outline package) or SMT (surface mount) type, and has a plurality of boards 2 protruding from the four sides of the package. The leads 2 of such a high-density LSI are thin and closely packed together, making it difficult to insert them into through holes or insert them into socket insertion bins. Therefore, a pressure welding method is adopted.
このように圧接されたり一部２とコンタクトピン４との
接触不良は以下のように検査していた。Inspection for pressure welding or poor contact between the part 2 and the contact pin 4 was performed as follows.
コンタクトピン４に数百μへ程度の負電流■を供電部６
より印加する。このとき、供電部６の他端は基板３のグ
ランドＧに接続されている。今、ダイオードａに順方向
に電流■が流れると、グランドＧとコンタクトピン４と
の間に、０．４〜０．８Ｖ程度の順方向電圧陳下による
電圧ＶＦが生じる。A negative current of several hundred μ is applied to the contact pin 4 at the power supply part 6.
Apply more. At this time, the other end of the power supply section 6 is connected to the ground G of the substrate 3. Now, when a current (2) flows in the forward direction through the diode a, a voltage VF is generated between the ground G and the contact pin 4 due to a forward voltage drop of about 0.4 to 0.8V.
この電圧■、を検出器７で検知する、電圧■ｒが発生す
ればリード２とコンタクトピン４との接触が正常、発生
しなければ接触不良と判別する。This voltage (2) is detected by the detector 7. If the voltage (2) r is generated, it is determined that the contact between the lead 2 and the contact pin 4 is normal, and if it is not generated, it is determined that the contact is poor.
しかしながら、従来の方法では、回路構成上保護用ダイ
オードを内蔵しないデバイスのリードとソケット側のコ
ンタクトピンとの接触不良の検査は不可能であるという
欠点があった。However, the conventional method has the drawback that it is impossible to inspect for poor contact between the leads of a device that does not have a built-in protection diode and the contact pins on the socket side due to the circuit configuration.
この発明は上記欠点を解消するためになされたもので、
必要に応じて任意にリードとコンタクトピンとの接触不
良を検査できるデバイス用ソケットを提供することを目
的としている。This invention was made to eliminate the above drawbacks.
It is an object of the present invention to provide a socket for a device that can arbitrarily inspect poor contact between a lead and a contact pin as necessary.
本発明を実施例に対応する第１図に基づいて説明すると
、
デバイス１をソケット１０に載置して該デバイス１のリ
ード２をコンタクトピン１１に当接させ、蓋１４に設け
た突起部１５でリード２を押圧してコンタクトピン１１
に圧接させるソケットであって、前記コンタクトピン１
１を２本のビンＩＩａ、Ｉｌｂに分割し、これら２本の
ビンｌｌａ、ｔｔｂが互いに独立に前リード２と接触す
るようにした。The present invention will be explained based on FIG. 1 corresponding to an embodiment. When a device 1 is placed in a socket 10 and the leads 2 of the device 1 are brought into contact with the contact pins 11, the projections 15 provided on the lid 14 are Press lead 2 with
A socket which is brought into pressure contact with the contact pin 1.
1 was divided into two bins IIa and Ilb, and these two bins lla and ttb were brought into contact with the front lead 2 independently of each other.
上記実施例に基づき、本発明では、突起部Ｉ５でリード
２を押圧すると、リード２は分割された各ビンｌｌａ、
ｌｌｂと別々の位置で夫々接触する。するとビンｌｌａ
、リード２、ビンｌｌｂは直列の配線路を形成するので
、一方のビン１１ａと他方のビンｌｌｂに所定の導電テ
スタを接続すれば、リード２とビンｌｌａ、ｌｌｂとが
同時に接触しているかどうか積極的に検知することがで
きる。Based on the above embodiment, in the present invention, when the lead 2 is pressed by the protrusion I5, the lead 2 is moved into each divided bottle lla,
llb at separate locations. Then the bottle lla
, lead 2, and bottle llb form a series wiring path, so if you connect a predetermined conductivity tester to one bottle 11a and the other bottle llb, you can check whether lead 2 and bottles lla and llb are in contact at the same time. Can be actively detected.
以下、本発明を図面に基いて説明する。 Hereinafter, the present invention will be explained based on the drawings.
第１図は本発明のソケットの一部を拡大した断面図を示
し、第２図は本発明のソケットを蓋を開いたときの全体
の平面図を示している。第２図において、ソケット１０
はコンタクトピン１１が多数植設された基板１２と基板
１２にシャフト１３を介して回動可能に連結された蓋１
４とから構成されている。基板１２及びｌｊ［１４の中
央部には略同形の矩形孔１７．１６が形成され、矩形孔
１７の四辺の周囲にはコンタクトピン１１が配設されて
いる。蓋１４の矩形孔１６の四辺の周囲には突起部１５
がＭ１４の延在面から略垂直に形成され、蓋１４をシャ
フト１３の回りに回動して基板１０に重ねたとき突起部
１５がコンタクトピン１１と重なるような位置に配設さ
れている。第３図はこのソケットに実装されるフラット
パッケージ型の電子回路デバイスｌを示し、デバイス１
の４側面から多数のり一ド２が突設されている。このデ
バイスｌは高密度型のＳＯＰ、ＳＭＴタイプであり、薄
型でリード２は複数本もあり、細線で互いに密集してい
る。リード２は略クランク状の金属片からなり、水平な
基端部２ａ、垂直部２ｂ、水平な先端部２Ｃが連続して
構成される。FIG. 1 shows an enlarged cross-sectional view of a part of the socket of the present invention, and FIG. 2 shows a plan view of the entire socket of the present invention with the lid opened. In FIG. 2, socket 10
1 includes a substrate 12 on which a large number of contact pins 11 are implanted, and a lid 1 rotatably connected to the substrate 12 via a shaft 13.
It is composed of 4. Rectangular holes 17 and 16 having substantially the same shape are formed in the center of the substrate 12 and lj[14, and contact pins 11 are arranged around the four sides of the rectangular hole 17. There are protrusions 15 around the four sides of the rectangular hole 16 of the lid 14.
is formed substantially perpendicularly from the extending surface of M14, and is arranged at a position such that when the lid 14 is rotated around the shaft 13 and stacked on the substrate 10, the protrusion 15 overlaps the contact pin 11. Figure 3 shows a flat package type electronic circuit device 1 mounted in this socket.
A large number of glue sticks 2 are provided protruding from the four sides. This device 1 is a high-density SOP or SMT type, and is thin and has a plurality of leads 2, which are thin and closely packed together. The lead 2 is made of a substantially crank-shaped metal piece, and has a continuous horizontal base end 2a, a vertical part 2b, and a horizontal distal end 2C.
第１図において、ソケット１０の基板１２はプラスチッ
ク等により形成され、基板１２に植設されたコンタクト
ピン１１は独立した２本のビン１１ａ、ｌｌｂから構成
されている。各ビン１１ａ、ｌｌｂの下端部は基板１２
を貫通して下面から突出し、その上端部は上面に突出し
、中間部が互いに外方にふくらんでバネ部を形成してい
る。In FIG. 1, a substrate 12 of a socket 10 is made of plastic or the like, and contact pins 11 implanted in the substrate 12 are composed of two independent pins 11a and llb. The bottom end of each bin 11a, llb is a board 12.
It penetrates through and protrudes from the lower surface, its upper end portion protrudes from the upper surface, and the intermediate portions bulge outward from each other to form a spring portion.
各ビンｌｌａ、ｌｌｂの上端面は路間−平面上にあり、
各ビンｌｌａ、ｌｌｂは互いに対向した位置にあるが離
隔している。ソケット１０上にデバイス１が矩形孔１７
に重なるように載置され、リード２の先端部２ｃを各ビ
ンｌｌａ、ｌｌｂの先端面と夫々当接させる。次に蓋１
４を回動して閉じることにより、蓋１４が基板１２に重
なり、突起部１５の先端面がリード２の先端部２ｃを」
−方から押圧する。蓋１４を図示外の係止具で基板１２
に係止すると突起部１５は更にリード２の先端部２ｃを
圧接するので、先端部２ｃの下面は、各ビンｌｌａ、１
１ｂの先端面を押圧する。これにより各ビンｌｌａ、ｌ
ｌｂはバネ部が弾性変形し、リードと確実に接触する。The upper end surface of each bottle lla, llb is on the road plane,
The bins lla and llb are located opposite to each other but are spaced apart from each other. The device 1 is placed on the socket 10 through the rectangular hole 17.
The tips 2c of the leads 2 are brought into contact with the tips of the bottles lla and llb, respectively. Next, lid 1
4 to close it, the lid 14 overlaps the substrate 12, and the tip surface of the protrusion 15 touches the tip 2c of the lead 2.
- Press from the side. The lid 14 is attached to the base plate 12 using a locking tool not shown.
When the protrusion 15 is engaged with the lead 2, the protrusion 15 further presses against the tip 2c of the lead 2, so that the lower surface of the tip 2c is
Press the tip surface of 1b. This allows each bin lla, l
The spring portion of lb is elastically deformed to ensure reliable contact with the lead.
デバイス１の周囲の全てのり一ド２と、ソケット１０の
全てのコンタクトピン１１とが同様な構成で接触される
。All the glue 2 around the device 1 and all the contact pins 11 of the socket 10 are brought into contact with each other in a similar configuration.
かくて、デバイスｌのリード２とソケット１０のコンタ
クトピン１１との接触不良検査は、ビンｌｌａ、リード
２及びビンｌｌｂの直列配線がオーブン状態か、シーｔ
−ト状態かをマイクロアンメータ等で検査することが
できる。即ち、一方のビンｌｌｂに数百μＡ程度の電流
■を供電部６より印加し、マイクロアンメータ等の検出
器７で他方のビンｌｌａからの微弱電流を検出する。検
出器７により数百μＡ程度の電流が検知されたら、ビン
ｌｌｂ、リード２及びビンｌｌａの直列配線は正常であ
り、検知がなければ接触不良である。In this way, a contact failure test between the lead 2 of the device 1 and the contact pin 11 of the socket 10 is performed to check whether the series wiring of the bottle 11a, the lead 2, and the bottle 11b is in an oven state.
- It is possible to check whether it is in a negative state using a microammeter or the like. That is, a current (2) of about several hundred μA is applied to one bottle llb from the power supply section 6, and a weak current from the other bottle lla is detected by a detector 7 such as a microammeter. If a current of about several hundred μA is detected by the detector 7, the series wiring of the bottle llb, lead 2, and bottle lla is normal, and if no detection is detected, there is a contact failure.
このような検査を全てのり−ド２とコンタクトピン１１
について、所定の並列検査器もしくはスキャン型検査器
で行って、全体的な接触の正常、異常をを検査する。な
お一方のビンｌｌａが接触していても、他方のビンｌｌ
ｂが接触不良でも本発明の検査では不良の判断となるが
、２回路が正常なときのみ接触正常とするフェイルセー
フ型の接続方式となる。All the adhesives 2 and contact pins 11 are inspected like this.
A specified parallel tester or scan type tester is used to check whether the overall contact is normal or abnormal. Note that even if one bottle lla is in contact, the other bottle lla
Even if b is a poor contact, the inspection of the present invention will determine that the connection is defective, but this is a fail-safe connection method in which the contact is normal only when the two circuits are normal.
第４図は本発明の他の実施例を示し、コンタクトピン１
１はビンｌｌｃとビンｌｌｂとにて分割されている。ビ
ンｌｌｃはビンｌｌｂよす長＜形成され、またビンｌｌ
ｃはリード２の垂直部２ｂより離れて矩形孔１７寄りに
植設されている。FIG. 4 shows another embodiment of the present invention, in which the contact pin 1
1 is divided into bin llc and bin llb. The bottle llc is formed by the length of the bottle llb, and the length of the bottle llc is
c is planted closer to the rectangular hole 17 and away from the vertical portion 2b of the lead 2.
このためビンｌｌｃの先端面はり一ド２の基端部２ａの
下面と当接するようになっている。突起部１５により先
端部２Ｃの上面から押圧すると、先端部２Ｃの下面がビ
ンｌｌｂの上端面と圧接し、更にバネ部の弾性変形によ
りビンｌｌｂがたわむ、略同時に基端部２ａの下面がビ
ンｌｌｃの上端面に圧接する。なおこれらの接触検査は
上述と同様に行う。これによりデバイス１の内部回路構
成と無関係に接触不良の検査ができる。Therefore, the distal end surface of the bottle llc comes into contact with the lower surface of the proximal end 2a of the beam 2. When the protrusion 15 presses the top of the tip 2C, the bottom of the tip 2C comes into pressure contact with the top of the bottle Ilb, and the bottle Ilb bends due to the elastic deformation of the spring. Press it against the upper end surface of the llc. Note that these contact tests are performed in the same manner as described above. This makes it possible to test for poor contact regardless of the internal circuit configuration of the device 1.
なお、このデバイス用ソケットはデバイス１を動作評価
するための試験用ソケッｔ・とじて用いてもよい。デバ
イス１の動作評価時には蓋１４を開閉して各種デバイス
を入れ替えて評価試験をするが、複数本もあるリードと
コンタクトピンとの接触を積極的に調べることができる
ので確実な評価試験が実行される。Note that this device socket may also be used as a test socket for evaluating the operation of the device 1. When evaluating the operation of the device 1, an evaluation test is performed by opening and closing the lid 14 and replacing various devices, but since contact between multiple leads and contact pins can be actively checked, a reliable evaluation test can be performed. .
以上の説明から明らかなように、本発明のデバイス用ソ
ケットによれば、デバイスの内部回路と無関係にソケッ
トとの接続状態を確実に検査できるので、デバイスの動
作テストや、デバイスの能力評価時に接触不良等の内部
回路以外の要因を排し、デバイスそのものの評価が正確
にできる、又保守の場合にも大いに便利となる。As is clear from the above description, according to the device socket of the present invention, the connection state with the socket can be reliably inspected regardless of the internal circuit of the device. This eliminates factors other than internal circuits such as defects, allows accurate evaluation of the device itself, and is also very convenient for maintenance.
第１図は本発明の要部断面図、
第２図は本発明のソケットの全体平面図、第３図は集積
回路デバイスの斜視図、
第４図は本発明の他の実施例の断面図、第５図は従来の
方法の構成図である。
図において、
１はデバイス、
はリード、
は供電部、
は検出部、
０はソケット、
１はコンタクトピン、
１ａ、ｌｌｂ、ｌｌｃはビン、
２は基板、
４は蓋、
５は突起部を示す。FIG. 1 is a sectional view of essential parts of the present invention, FIG. 2 is an overall plan view of a socket of the present invention, FIG. 3 is a perspective view of an integrated circuit device, and FIG. 4 is a sectional view of another embodiment of the present invention. , FIG. 5 is a block diagram of a conventional method. In the figure, 1 is a device, is a lead, is a power supply part, is a detection part, 0 is a socket, 1 is a contact pin, 1a, llb, llc are bottles, 2 is a board, 4 is a lid, and 5 is a protrusion.
Claims (1)
て該デバイス（１）のリード（２）を該ソケット（１０
）のコンタクトピン（１１）に当接させ、該ソケット（
１０）の回動する蓋（１４）に設けた突起部（１５）で
前記リード（２）を押圧して前記コンタクトピン（１１
）に圧接するデバイス用ソケット（１０）において、前
記コンタクトピン（１１）を２本のピン（１１ａ、１１
ｂ）に分割し、これら２本のピン（１１ａ、１１ｂ）が
互いに独立に前記リード（２）と接触するようにしたこ
とを特徴とするデバイス用ソケット。Place the integrated circuit device (1) on the socket (10) and connect the leads (2) of the device (1) to the socket (10).
) and contact the contact pin (11) of the socket (
The contact pin (11) is pressed by the protrusion (15) provided on the rotating lid (14) of the contact pin (10).
), the contact pin (11) is connected to two pins (11a, 11
(b) A socket for a device, characterized in that it is divided into two parts, and these two pins (11a, 11b) contact the lead (2) independently of each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63177046A JPH0227676A (en) | 1988-07-18 | 1988-07-18 | Socket for device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63177046A JPH0227676A (en) | 1988-07-18 | 1988-07-18 | Socket for device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0227676A true JPH0227676A (en) | 1990-01-30 |
Family
ID=16024192
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63177046A Pending JPH0227676A (en) | 1988-07-18 | 1988-07-18 | Socket for device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0227676A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5528466A (en) * | 1991-11-12 | 1996-06-18 | Sunright Limited | Assembly for mounting and cooling a plurality of integrated circuit chips using elastomeric connectors and a lid |
| US5800209A (en) * | 1993-11-12 | 1998-09-01 | Berg Technology, Inc. | Electrical connector and affixing member |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5819882A (en) * | 1981-07-28 | 1983-02-05 | 山一電機工業株式会社 | Connector for integrated circuit board |
| JPS6255887B2 (en) * | 1981-07-23 | 1987-11-21 | Kao Corp |
-
1988
- 1988-07-18 JP JP63177046A patent/JPH0227676A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6255887B2 (en) * | 1981-07-23 | 1987-11-21 | Kao Corp | |
| JPS5819882A (en) * | 1981-07-28 | 1983-02-05 | 山一電機工業株式会社 | Connector for integrated circuit board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5528466A (en) * | 1991-11-12 | 1996-06-18 | Sunright Limited | Assembly for mounting and cooling a plurality of integrated circuit chips using elastomeric connectors and a lid |
| US5800209A (en) * | 1993-11-12 | 1998-09-01 | Berg Technology, Inc. | Electrical connector and affixing member |
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