KR101304276B1 - Carrier, pushing apparatus and test supporting method of handling system for supporting test of die - Google Patents

Abstract

The present invention relates to a carrier, a pushing device and an inspection support method of a die inspection support handling system.

According to the present invention, a technique for enabling inspection of a die in a state in which the die is brought into close contact with a carrier by air suction force and a technique corresponding thereto are disclosed.

Die, inspection, handler, loading, testing

Description

Carrier, pushing device and inspection support method of handling system for die inspection support {CARRIER, PUSHING APPARATUS AND TEST SUPPORTING METHOD OF HANDLING SYSTEM FOR SUPPORTING TEST OF DIE}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a die inspection support handling system used for inspecting a die in the middle of manufacturing a semiconductor device, and more particularly, to a carrier for carrying a die, a pushing device for electrically contacting the die to a tester side, and an inspection support method. It is about.

Briefly looking at the process of manufacturing a semiconductor device as follows.

First, silicon is purified to make silicon rods, which are then thinly cut laterally to polish the surface to make a wafer. The die is then fabricated by lithography and etching on the wafer and then cut to separate the areas having the same pattern. Then, the pins (balls) are connected to the die and then packaged to produce semiconductor devices.

In the above manufacturing process, prior to the packaging process, the intermediate material in the die state is inspected for the electrical conduction of the pattern on the wafer to classify the defects of the semiconductor element in the die state, thereby eliminating unnecessary waste of resources and waste of resources. I'm trying to get rid of it.

In general, the inspection of the die's electrical conduction is performed using a probe card that electrically connects the pad and the tester of the die on the wafer, and the inspection of the defect of the final semiconductor device is performed by inspecting the pin and the tester of the semiconductor device. A test handler for electrically connecting is used.

In order to accurately check whether the dynamo semiconductor device is defective in such an inspection process, it is necessary to inspect whether the semiconductor device can be properly applied in various environments.

However, in the case of inspecting the die by using a probe card, it is only a thermal chuck applied to the die by a hot chuck in consideration of the configuration and application state of the probe card. On the other hand, in the case of inspecting a semiconductor device using a tester and a test handler, the test handler can implement various temperature stress conditions, so that the inspection can be performed in consideration of various environmental conditions in which the semiconductor device is actually used.

As described above, the inspection using the probe card is all to confirm whether the pattern of the die is electrically energized, and the die determined as good in the inspection process is then completed as a semiconductor device through the manufacturing process. .

However, when the inspection is performed with various temperature stresses on the final produced semiconductor device, the defect rate is approximately 20%, which causes waste of time and additional materials in the process from die to fabrication of the final semiconductor device.

Of course, defects may occur during the process from the die to the final semiconductor device, but the time required to fail to check other defects (except for electric conduction) already generated in the die state by the limitation of inspection using a probe card and There is a waste of additional material.

In particular, such waste of time and additional materials is even more pronounced in multi-chip packages (MCPs) produced by packaging multiple dies into one.

This is because if one die of one of the dies fails, the MCP will fail even if the remaining dies are good.

Accordingly, the applicant of the present invention provides a technology related to a handling system that supports inspection to be performed by imposing various inspection conditions in a die state through Korean Patent Application No. 10-2007-0108474 (name of the invention: a die inspection support handling system) Hereinafter referred to as 'advanced technology'.

In addition, the present invention relates to a carrier, a pushing apparatus, and an inspection support method of the handling system provided in the handling system. Wherein the carrier is provided to carry the die and electrically stable contact with the tester, the pushing device is provided to electrically contact the die loaded on the carrier to the tester side by pushing the carrier to the tester side.

It is an object of the present invention to provide a technique that enables a die to be stably loaded and aligned on a carrier and allows inspection of the die to be made while the die is fixed to the carrier by air suction force.

Carrier of the die inspection support handling system according to the present invention for achieving the above object is capable of loading at least one die in order to carry the die and to electrically contact the tester. It has a loading portion, the loading portion is characterized in that it has a close contact means for allowing the die to be in close contact with the loading surface by the air suction force.

The close means may be a suction hole for allowing the air suction force from the vacuum line to be transmitted to the die loaded in the loading portion.

The close contact means is characterized in that it has a function for keeping the die in close contact with the loading surface to maintain the alignment state of the die.

In addition, the carrier of the die inspection support handling system according to the present invention for achieving the above object has a loading portion that can be loaded at least one die (die), the loading portion is aligned with the loaded die to the reference line Alignment device for making; And a reference protrusion protruding from the loading surface to provide the reference line. .

The alignment device is also characterized in that it also has a holding function to prevent the die from being separated.

The alignment device may include a pressing member provided to be able to move back and forth to push the die toward the reference protrusion; And an elastic member for applying an elastic force to the pressing member. It includes a more specific feature to include.

The pressing member is further characterized in that it is provided to protrude upward from the loading surface when moving forward to push the die toward the reference projection side, and to sink downward when retreating.

In addition, a pushing device of the die inspection support handling system according to the present invention for achieving the above object, the pushing device for pushing the carrier to the tester side and the die loaded on the carrier to electrically contact the tester side; And a driving source for providing a driving force to the pushing plate. The pushing plate may include a suction hole for allowing the air suction force from the vacuum line to be transferred to the suction hole of the carrier so that the die may be fixed to the carrier by the air suction force.

The pushing plate is further characterized in that it further has a release pin for releasing the alignment operation of the alignment device provided in the carrier to align the die loaded on the carrier.

In addition, the inspection support method of the die inspection support handling system according to the present invention for achieving the above object, 1) the step of loading the die on the carrier; 2) aligning the die loaded on the carrier by the alignment device; 3) maintaining the alignment of the die loaded on the carrier by the holding means, releasing the alignment operation of the alignment device, and electrically contacting the die with the tester; 4) when the inspection of the die is completed, releasing the holding operation of the holding means and maintaining the die in alignment by the alignment device; Step 5) of releasing the alignment operation of the alignment device; And 5) removing the die from the carrier; Characterized in that it comprises a.

Step 3) is a step 3a) of maintaining the alignment state of the die loaded on the carrier by the holding means; 3b) releasing the alignment operation of the alignment device; And 3c) electrically contacting the die with the tester; It includes, and the steps 3a), 3b) and 3c) is another feature that is made sequentially.

In addition, the inspection support method of the die inspection support handling system according to the present invention for achieving the above object, 1) the step of loading the die on the carrier; 2) contacting the die to the loading surface of the carrier by applying an air suction force to the die loaded on the carrier; 3) electrically contacting the die with the tester; 4) releasing the air suction force applied to the die; And 5) removing the die from the carrier; Characterized in that it comprises a.

According to the present invention as described above, while the die is in close contact with the loading surface of the carrier by the air suction force, it is possible to maintain the aligned state on the loading surface, there is an effect that the die is electrically stable contact with the tester.

Hereinafter, a preferred embodiment of the carrier, pushing device and inspection support method (hereinafter referred to as 'carrier', 'pushing device' and 'inspection support method') of the die inspection support handling system according to the present invention as described above. Examples and modifications will be described.

1.Examples for Carriers

As referred to in the schematic side cross-sectional view of FIG. 1, the carrier 100 according to the embodiment of the present invention has a plurality of loading parts 110 (convenes the codes of all loading parts for convenience).

Each of the plurality of mounting portions 110 is provided for loading a die, and two reference protrusions 111a formed in the main body 120, as referred to in the exploded perspective view of the schematic main part of FIG. , 111b), two alignment devices 112 installed on the main body 120 (conveniently, the same reference numerals of the two alignment devices) and a portion of the main body 120 providing the loading surface P are configured.

The reference protrusions 111a and 111b are formed to protrude from the mounting surface P to support and align adjacent sides of the die.

The alignment device 112 is provided to push the die toward the reference protrusions 111a and 111b so that the die can be correctly aligned with the loading surface P, and includes a pressing member 112a and an elastic member 112b. It is configured by.

The pressing member 112a has a pushing base 112a-1, a pushing protrusion 112a-2 protruding in a L-shape from the pushing base 112a-1, a guide protrusion 112a-3 for guiding forward and backward movement, and the like. .

The pushing base 112a-1 is accommodated in the accommodation space 121 formed in the main body 120, and a release groove 112a-1a inclined at one side thereof is formed at a lower end thereof so as to have a pointed shape upward. It is.

The pushing protrusion 112a-2 is provided to protrude upward more than the mounting surface P through the protrusion hole 122 located above the receiving space 121 at the upper end of the pushing base 112a-1. The pushing protrusion 112a-2 pushes the die toward the reference protrusions 111a and 111b to align the die, and serves as a holding to prevent the die from escaping upward.

The guide protrusion 112a-3 serves to guide the pressing member 112a when the pressing member 112a moves forward and backward. The guide protrusion 112a-3 is inserted into the guide groove 123 formed in the main body 120. The guide groove 123 is formed on the side close to the die (left side in FIG. 1) at an inclination close to the horizontal state and the die. The side farther from is formed inclined downward. Therefore, when the pressing member 112a is advanced in the state where the guide protrusion 112a-3 of the pressing member 112a is inserted into the guide groove 123, the vertical movement as well as the vertical movement are performed in parallel. The reason why the pressing member 112a is provided to be movable up and down is to prevent the upper end of the pushing protrusion 112a-2 from interfering with the die when the die is in electrical contact with the tester.

In addition, a portion of the main body 120 providing the loading surface P is provided with a plurality of suction holes 124 penetrating the main body 120 up and down. The air suction force from the vacuum line including the vacuum pump (not shown) is transmitted to the die loaded on the loading surface P through the suction hole 124, so that the die may be closely adhered to the loading surface P. .

When no external force is applied, the elastic member 112b applies an elastic force to the pressing member 112a so that the pressing member 112a pushes the die toward the reference protrusions 111a and 111b. In this embodiment, the coil spring is applied as an example of the elastic member 112b.

Reference numeral 130 is a cover for closing the lower end of the receiving space 121 in order to prevent the downward departure of the pressing member (112a) and the elastic member (112b). The cover 130 has a through hole 131 through which the release pin of the pushing device to be described later is formed.

The operation of the carrier 100 as described above will be described.

As shown in Fig. 3, when the die D is placed on the loading surface P in a state in which the pressing member 112a is retracted by an external force (a pushing device that applies an external force will be described later), the external force is removed. As a result, the pressing member 112a is pushed toward the reference protrusions 111a and 111b while moving forward by receiving the elastic force of the elastic member 112b. Therefore, when the pressing member 112a is advanced to the maximum, as shown in FIG. 4A, the die D is correctly aligned with respect to the reference protrusions 111a and 111b. Here, the advance is defined as the direction in which the pressing member 112a pushes the die D toward the reference protrusions 111a and 111b, and the retraction is defined as the opposite direction.

On the other hand, since the upper end of the pushing protrusion 112a-2 protrudes upward more than the upper surface of the die D, when the die D needs to be in electrical contact with the tester side, the pressing member 112a is retracted and pressed. The member 112a should be settled downward. That is, when the pressing member 112a is retracted by overcoming the elastic force of the elastic member 112b by external force, the pressing member 112a is lowered while the guide protrusion 112a-3 is guided to the guide groove 123. It will be in the same state as in Fig. 4B. By doing so, the alignment operation of the die D by the alignment device 112 is released. However, in consideration of various situations such as shaking of the device, in order to maintain stable electrical contact of the die D, the die D must be maintained in an aligned state. By passing through the die 124 to the die D, the die D is tightly fixed to the loading surface P by the air suction force, thereby maintaining alignment. That is, the suction hole 124 is provided as a close contact means for allowing the die (D) to be tightly fixed to the loading surface (P) even when the alignment operation of the alignment device 112 is released. Here, before releasing the alignment operation of the pressing member 112a, it is preferable to strongly fix the die D to the loading surface P by air suction force.

Of course, when the external force applied to the pressing member (112a) disappears, the pressing member (112a) is advanced to go back to the operating state of Figure 4a to maintain the alignment state of the die (D) again.

1-1. First modification of the carrier

FIG. 1 shows a carrier 100 in a quadruple pair form (four dies are stacked on one carrier). As shown in FIG. A large number is planned to be mounted to the carrier board (CB).

However, as shown in FIG. 6, the carrier 100A itself may be implemented in the form of a board.

1-2. Second modification of the carrier

Although the carrier 100 of FIG. 1 relies on the alignment device 112 to disengage upward of the die, as shown in FIG. 7, the alignment device 112 also exists on the side where the reference protrusions 111Aa and 111Ab are located. The departure prevention device 711 of the same configuration as) may be configured. In addition, as shown in the schematic side cross-sectional view of FIG. 8, it may be considered to implement the reference protrusions 111Ba and 111Bb in the "A" shape as long as they do not prevent electrical contact between the tester and the die.

1-3. Third modification of the carrier

The carrier 900 of FIG. 9 is implemented to push the die toward the reference protrusions 111a and 111b as the pressing member 112Aa of the alignment device 112A rotates. That is, when an external force is applied to the lower end of the pressing member 112Aa in the direction of the arrow, the pressing member 112Aa rotates clockwise while overcoming the elastic force of the elastic member 112Ab, thereby releasing the alignment operation of the alignment device 112A. When the external force disappears, the die is rotated counterclockwise to align the die by pushing the die toward the reference protrusions 111a and 111b.

2. Example of pushing device

10 is a schematic side cross-sectional view of a pushing device 200 according to an embodiment of the present invention.

As shown in FIG. 10, the pushing device 200 includes a pushing plate 210, a driving source 220, and the like.

The pushing plate 210 pushes the carrier 100 toward the tester side (in this embodiment, as described above, the carrier board on which the multiple carriers are mounted is pushed toward the tester side and ultimately the carrier is pushed toward the tester side). The die loaded in 100) is electrically contacted with the tester side. The pushing plate 210 is provided with a release pin 211 for releasing the alignment operation of the alignment device 112 described above. The release pin 211 has an inclined surface inclined in the same direction as the release grooves 112a-1a such that the top thereof has a pointed shape, such as the release grooves 112a-1a.

The driving source 220 provides a driving force for the pushing plate 210 to push the carrier 100 to the tester side. In this embodiment, as shown in Fig. 10, the driving source 220 is composed of two cylinders 221 and 222.

On the other hand, the pushing plate 210 allows the air suction force coming through the vacuum line to be transmitted to the suction hole 124 of the carrier 100 so that the die strongly adheres to the loading surface P of the carrier 100 by the air suction force. Suction holes 212 are formed to correspond to the suction holes 124 of the carrier 100 to be tightly fixed.

Subsequently, the operation of the pushing device 200 will be described.

When the carrier 100 is in a position facing the tester T as shown in FIG. 11, as shown in FIG. 12, the first cylinder 221 is operated to push the pushing plate 210 to push the pushing plate. 210 and carrier 100 are mated. When the matching of the pushing plate 210 and the carrier 100 is completed, the vacuum pump is operated so that the air suction force is increased through the suction hole 212 of the pushing plate 210 and the suction hole 124 of the carrier 100. The die D is tightly fixed to the loading surface P by being applied to the die D loaded on the 100). Of course, the release pin 211 of the pushing plate 210 is inserted into the release groove (112a-1a) at the time of applying an external force forcibly pushing the pressing member (112a) to the elastic member (112b) side. Therefore, the pressing member 112a overcomes the elastic force and moves to the elastic member 112b while being guided to the guide groove 123 and moves downward.

Thereafter, as shown in FIG. 13, the second cylinder 222 operates to push the pushing plate 210 to the tester T side so that the carrier 100 is mated to the tester T side and ultimately the carrier ( The die D loaded in 100 is to be in electrical contact with the tester T. Here, the air suction force by the vacuum pump is maintained at least until the completion of the test of the die (D).

2-1. Modifications to Pushing Devices

14 is a schematic side cross-sectional view of a pushing device 200A according to a modification.

As shown in FIG. 14, the pushing device 200A according to the present modification includes a pushing plate 210A, a driving source 220A, and the like.

 The pushing plate 210A includes a first pushing plate 211A and a second pushing plate 212A, and the first pushing plate 211A and the second pushing plate 212A are lifted independently of each other.

In the first pushing plate 211A, a suction hole 211Ab is formed at an extension end 211Aa extending downwardly to correspond to the suction hole 124 of the carrier 100.

The second pushing plate 212A has an insertion hole 212Aa into which the extended end 211Aa can be inserted, and a release pin 212Ab for releasing the alignment operation of the alignment device 112 of the carrier 100. ) Is formed. Of course, a pass hole 211Ac through which the release pin 212Ab can be inserted is formed in the first pushing plate 211A.

The driving source 220A includes a first cylinder 221A, a second cylinder 222A, and a base cylinder 223A, and is provided to provide driving force to the first pushing plate 211A and the second pushing plate 212A. do.

The first cylinder 221A raises and lowers the first pushing plate 211A, and the second cylinder 222A raises and lowers the second pushing plate 212A. The base cylinder 223A is implemented to raise and lower the first pushing plate 211A and the second pushing plate 212A together.

The operation of the pushing device 200A as described above will be described.

As shown in FIG. 15, when the carrier 100 is in a position facing the tester T, as shown in FIG. 16, the first cylinder 221A is operated to push the first pushing plate 211A. 1 Push plate 211A and carrier 100 are matched. When the matching of the first pushing plate 211A and the carrier 100 is completed, the vacuum pump is operated so that the air suction force is the suction hole 211Ab of the first pushing plate 211A and the suction hole 124 of the carrier 100. The die D is tightly fixed to the loading surface P by being applied to the die D loaded on the carrier 100 through the die. Therefore, it is possible to keep the die D aligned.

Then, as shown in Fig. 17, the second cylinder 222A is operated to raise the second pushing plate 212A, thereby releasing the pin 212Ab of the second pushing plate 212A of the alignment device 112. By being inserted into the release grooves 112a-1a, the pressing member 112a retreats while overcoming the elastic force of the elastic member 112b, thereby releasing the alignment operation of the alignment device 112.

After the above operation, as shown in Fig. 18, the base cylinder 223A is raised to raise the first pushing plate 211A and the second pushing plate 212A together to move the carrier 100 to the tester T side. Push to ensure that the carrier 100 is mated to the tester T side and ultimately the die D loaded on the carrier 100 is in electrical contact with the tester T.

Of course, once the test of the die D is completed, the pushing device 200A is operated in the reverse order described.

3. Inspection Support Method

A method for supporting inspection of a die in the handling system to which the carrier 100 and the pushing device 200 or 200A described above are applied will be described with reference to FIG.

3-1. Loading of dies <S191>

The die is loaded onto the carrier 100 by a loading device.

3-2. Alignment of dies <S192>

The die loaded on the carrier 100 is aligned by the alignment device 112.

3-3. Carrying the Carrier to a Position Facing the Tester <S193>

The carrier 100 on which the die is loaded is transferred to a position facing the tester T (the carrier is ultimately transported by transporting the carrier board).

3-4. Electrically contact the die to the tester side <S194>

While maintaining the alignment state of the die D loaded on the carrier 100 by the holding means (vacuum line including the vacuum pump), the alignment operation of the alignment device 112 is released, and the die D is connected to the tester ( Electrical contact with T).

Here, in the case of the pushing device 200 of FIG. 10, the alignment operation of the alignment device 112 is also released while maintaining the alignment state of the die D. FIG. However, by applying the pushing device 200A of FIG. 14 to maintain the alignment state of the die D first by air suction force, and then releasing the alignment operation of the alignment device 112, the die D can maintain a stable alignment state. More preferably.

Therefore, the inspection support method may be implemented in order to maintain the alignment state of the die (D), and then release the alignment operation of the alignment device 112 and then electrically contact the die (D) to the tester (T) side. More preferably.

3-5. Maintaining alignment of die by alignment device <S195>

When the test of the die D is completed, the holding operation of the holding means is released and the alignment device 112 maintains the alignment of the die D. FIG.

3-6. Carrying the carrier to a position to disengage the die <S196>

Carrier 100 is transported to a position for disengaging die D.

3-7. Alignment off <S197>

The alignment operation by the alignment device 112 is released.

3-8. Remove the die <S198>

The die D is removed from the carrier 100. At this time, it is preferable that the operation of classifying the dies D according to defective and good or test grades is performed together.

On the other hand, in the above inspection support method is applied when it is necessary to align the die (D) by the alignment device 112, if the separate alignment device is not required by the alignment device in each of the above processes All steps of aligning the die may be omitted.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. And the scope of the present invention should be understood as the following claims and their equivalents.

1 is a schematic side cross-sectional view of a carrier according to an embodiment of the present invention.

FIG. 2 is a schematic exploded perspective view of an essential part of the carrier of FIG.

3, 4A and 4B are operational state diagrams for the carrier of FIG.

5 and 6 are reference diagrams for explaining a carrier according to a first modification of the carrier of FIG.

7 and 8 are reference diagrams for describing a carrier according to second modifications to the carrier of FIG. 1.

FIG. 9 is a reference diagram for describing a carrier according to a third modification to the carrier of FIG. 1.

10 is a schematic side cross-sectional view of a pushing device according to an embodiment of the present invention.

11 to 13 are operating state diagrams for explaining the operation of the pushing device of FIG.

14 is a reference view for explaining a pushing device according to a modification of the pushing device of FIG.

15 to 18 are operation state diagrams for explaining the operation of the pushing device of FIG.

19 is a flowchart illustrating an inspection support method according to an embodiment of the present invention.

Description of the Related Art [0002]

100: carrier

110: loading part

111a, 111b: reference protrusion

112: alignment device

112a: pressing member

112b: elastic member

120: main body

124: suction hole

200: pushing device

210: pushing plate

211: release pin 212: suction hole

220: drive source

Claims (11)

delete delete Has a loading portion for loading at least one die, The loading portion, An alignment device that aligns the loaded die with a reference line; And A reference protrusion protruding from the loading surface to provide the reference line; Lt; / RTI &gt; The alignment device is characterized in that the role of holding the die to prevent the separation of the die while pushing the die toward the reference projection side Carrier of the handling system for die inspection support. The method of claim 3, The alignment device, A pressing member which is provided to be retractable to push the die toward the reference protrusion, and which serves to hold the die to prevent separation of the die; And An elastic member for applying an elastic force to the pressing member; &Lt; RTI ID = 0.0 &gt; Carrier of the handling system for die inspection support. 5. The method of claim 4, The pressing member is provided to protrude upward from the loading surface when moving forward to push the die toward the reference projection side, and to sink downward when retreating. Carrier of the handling system for die inspection support. A carrier having a stack capable of stacking at least one die; And A pushing device for pushing the carrier toward the tester side to electrically contact the die loaded on the carrier with the test side; Including, The loading portion, An alignment device having a holding function for aligning the loaded die with a reference line and preventing the die from being separated; A reference protrusion protruding from the loading surface to provide the reference line; Lt; / RTI & The alignment device, A pressing member which is provided to be able to move forward and backward to push the die toward the reference protrusion, and upwards from the loading surface when moving forward to push the die toward the reference protrusion, and settles downward when retreating; And An elastic member for applying an elastic force to the pressing member; Lt; / RTI & The pushing device, A pushing plate for pushing the carrier toward the tester side to electrically contact the die loaded on the carrier with the tester side; And A driving source for providing a driving force to the pushing plate; / RTI &gt; The pushing plate is provided with a suction hole for allowing the air suction force from the vacuum line to be transferred to the suction hole of the carrier so that the die can be fixed to the carrier by the air suction force. Handling system for die inspection support. The method according to claim 6, The pushing plate has a release pin for releasing the alignment operation of the alignment device, the pressing member to move downward in the direction against the elastic force of the elastic member to settle down. Handling system for die inspection support. 1) loading the die into the carrier; 2) aligning the die loaded on the carrier by the alignment device; 3) maintaining the alignment of the die loaded on the carrier by the holding means, releasing the alignment operation of the alignment device, and electrically contacting the die with the tester; 4) when the inspection of the die is completed, releasing the holding operation of the holding means and maintaining the die in alignment by the alignment device; Step 5) of releasing the alignment operation of the alignment device; And 5) removing the die from the carrier; &Lt; RTI ID = 0.0 &gt; Inspection support method of handling system for die inspection support. delete Has a loading portion for loading at least one die, The loading portion, An alignment device that aligns the loaded die with a reference line; And A reference protrusion protruding from the loading surface to provide the reference line; Lt; / RTI &gt; The alignment device, A pressing member provided to be able to move forward and backward to push the die toward the reference protrusion; And An elastic member for applying an elastic force to the pressing member; &Lt; RTI ID = 0.0 &gt; Carrier of the handling system for die inspection support. The method of claim 10, The pressing member is provided to protrude upward from the loading surface when moving forward to push the die toward the reference projection side, and to sink downward when retreating. Carrier of the handling system for die inspection support.

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