CN103977964A - Pressure applying device for testing sorting machine - Google Patents
Pressure applying device for testing sorting machine Download PDFInfo
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- CN103977964A CN103977964A CN201410045325.1A CN201410045325A CN103977964A CN 103977964 A CN103977964 A CN 103977964A CN 201410045325 A CN201410045325 A CN 201410045325A CN 103977964 A CN103977964 A CN 103977964A
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Abstract
The invention discloses a pressure applying device for testing a sorting machine. According to the pressure applying device of the invention, after the posture of a plug member is corrected through use of a posture correcting part, and a pushing device is mounted in a semiconductor element of the plug member in a contacting manner. Thus, through appropriate integration of the plug member and the pushing device, the semiconductor element and the plug member can be prevented from being damaged by the pushing device.
Description
Technical field
The present invention relates to support the Test handler among the test of the semiconductor element produce.Especially, the present invention relates to exert pressure or the device for exerting of support semiconductor element along test pusher side.
Background technology
Test handler is supported the test of the semiconductor element of producing.And Test handler is pressed grade separation according to test result by semiconductor element.
Fig. 1 is for observing the concept map of general Test handler 100 from plane.
Test handler 100 comprises: test pallet 110, charger 120, all hot cell (SOAK CHAMBER) 130, test cabinet (TEST CHAMBER) 140, device for exerting 150, move back equal hot cell (DESOAK CHAMBER), discharge mechanism 170.
As shown in Figure 2, on test pallet 110, how much be provided with movably a plurality of plug-in units 111 that can settle semiconductor element D.By a plurality of transfer devices (not shown), the closed path C's this test pallet 110 along regulation circulates.
Charger 120 loads (loading) to the test pallet in loading position (LP:LOADING POSITION) by the semiconductor element that is placed on the not test on client's pallet.
The object that configures equal hot cell 130 is from loading position LP, to transfer the semiconductor element in test pallet 110 that is loaded of coming according to test environment conditions preheating or precooling.
The object of configuration testing chamber 140 is to test the semiconductor element on the test pallet 110 that is shifted into test position (TP:TEST POSITION) after equal hot cell 130 preheatings or precooling.
Semiconductor element on the test pallet 110 that device for exerting 150 is exerted pressure in from test cabinet 140 to test machine (TESTER) side.Accordingly, the semiconductor element on test pallet 110 electrically contacts to test machine.The present invention relates to such device for exerting 150, describe in further detail in the back.
The object that equal hot cell 160 is moved back in configuration is to make the semiconductor element being heated or cooled of transferring the test pallet 110 of coming from test cabinet 140 to revert to normal temperature.
Discharge mechanism 170 will move to from moving back equal hot cell 160 semiconductor element the test pallet 110 of unloading position (UP:UNLOADING POSITION) by unloading (unloading) after grade separation to empty client's pallet.
As described above, semiconductor element under the state that is positioned over test pallet 110 along from loading position LP via equal hot cell 130, test cabinet 140, move back the closed path C that equal hot cell 160 and unloading position UP get back to loading position LP again and circulate.
Next, the prior art for device for exerting related to the present invention 150 gives the account in greater detail.
As shown in the side view of the summary of Fig. 3, existing device for exerting 150 comprises a plurality of pushers 151, plate 152 and moving source 153 is set.It should be noted that the spacing between each building block in Fig. 3 is exaggerated.
Pusher 151 comprises the part 151a that exerts pressure, expansion 151b and guide pin 151c.
The part of exerting pressure 151a is the part of exerting pressure for the semiconductor element D that is arranged to the plug-in unit 111 on test pallet 110.For this reason, making when action of exerting pressure, the F above of the part of exerting pressure 151a touches semiconductor element D.The part 151a that exerts pressure so also plays the effect of the semiconductor element D that the terminal (for example, spring needle) that supports equably tested test-run a machine pushes towards the rightabout of test machine.Below, within the scope of this description and claims, the term of pusher " exerting pressure " comprises the meaning of " exerting pressure " and " support ".
Making when action of exerting pressure, expansion 151b is contacted with the one side (face of facing with pusher) of plug-in unit 111.Accordingly, can prevent the damage of the semiconductor element D that the excessive movement of pusher 151 causes.
Guide pin 151c guides the F above of the part 151a that exerts pressure accurately to touch semiconductor element D.That is, guide pin 151c is within first the F above of the part 151a that exerts pressure is inserted into the bullport 111a being formed on plug-in unit 111 before touching semiconductor element.Accordingly, under the state being accurately set in the position of plug-in unit 111 and pusher 151, the F above of the part of exerting pressure 151a can touch semiconductor element.
It should be noted that, as shown in Figure 3, a pusher 151 can be equipped with two part 151a that exert pressure, and according to different embodiments, a pusher also can only be equipped with the part of exerting pressure.And the part of exerting pressure 151a and expansion 151b can be separated or be formed as one.
Form with ranks on plate 152 is set a plurality of pushers 151 are set.
Conventionally, pusher 151 and arrange plate 152 in conjunction with after become matching disc (match plate) MP.
Moving source 153 can be by outfits such as cylinder or motors.This moving source 153 is to test machine side shifting matching disc MP.That is,, after moving source 153 work, first matching disc MP is close to test pallet 110.Then, test pallet continues to test machine side shifting.Accordingly, the semiconductor element D being placed on the plug-in unit 111 of test pallet 110 electrically contacts to test machine.
And then, with reference to Korea S's publication number, be No. 10-2009-0123441 (denomination of invention: Fig. 2 and Fig. 4 to Fig. 6 electronic unit detection assisting system matching disc) are known, and pusher is supported in plate is set by spring.Its reason is, in order to make pusher, with respect to plate is set, flexibly advances and retreat.Accordingly, when there is excessive the exerting pressure of pusher, prevent from touching the damage of the spring needle of terminal (ball of BGA type) of semiconductor element or the spring of support spring pin etc.
In addition, Test handler 100 is divided into following dock (UNDER HEAD DOCKING TYPE, is also named as " horizontal ") and side dock (SIDE DOCKING TYPE, is also named as " vertical ").Following dock Test handler is placed in the test that realizes the semiconductor element loading under the state of level at test pallet 110.And side dock Test handler is placed in the test that realizes the semiconductor element loading under vertical state at test pallet 110.Therefore,, for side dock Test handler 100, need to be equipped with one or two posture that makes test pallet and be transformed to vertical state or make the posture of the test pallet of vertical state be transformed to the posture changer of level.
But above mentioned plug-in unit 111 is set to move.Therefore, as exaggerating of Fig. 4 illustrates, the state that the pusher 151 that plug-in unit 111 may be in relative device for exerting 150 tilts.Now, before plug-in unit 111 and pusher 151 integration, the front end of pusher 151 likely first touches on the building block of semiconductor element D or plug-in unit 111.Accordingly, on the building block of semiconductor element D or plug-in unit 111, likely can produce damage (cut or destruction).
Summary of the invention
The object of the present invention is to provide the technology that realizes the integration of plug-in unit and pusher under a kind of state facing with each other at plug-in unit and pusher.
According to the Test handler of First Characteristic of the present invention as above, with device for exerting, comprise: a plurality of pushers, to be in electrical contact with the semiconductor element of test machine to be placed in the state of plug-in unit, exert pressure; Plate is set, described a plurality of pusher is set; Posture correcting unit, correctly proofreaies and correct the posture with respect to the plug-in unit of described pusher; Moving source, for the mobile described plate that arranges of advancing and retreat.
Can also comprise and make described pusher resiliency supported in the described coil spring that plate is set, described pusher possesses guiding and the integration of plug-in unit and is set to inside by described coil spring to support the guide pin of described coil spring.Described posture correcting unit is that rear end is formed with and can makes described guide pin insert the logical pin-and-hole of crossing, on front end, be formed with the posture of plug-in unit is set to the cylindric of correct correction box, in described guide pin, be formed with the anti-detachment projection of the disengaging that prevents described posture correcting unit, described coil spring is set to front end and touches in described correction box, and rear end touches the described plate that arranges.
Can also comprise and make described posture correcting unit resiliency supported in the described elastomeric element that plate is set, on described posture correcting unit, be formed with the via hole above passing through that can make described pusher above, described pusher can be to arrange by the described state of via hole above above.
Can also comprise and make described posture correcting unit resiliency supported in the described elastomeric element that plate is set, described pusher be take described posture correcting unit as medium is by described elastomeric element resiliency supported indirectly.
Described pusher possesses the guide pin that guiding and described plug-in unit are integrated, and is formed with and can makes the pin-and-hole of crossing that the front end of described guide pin passes through on described posture correcting unit, and described guide pin is to arrange by the described state of crossing pin-and-hole.
Described pusher possesses the anticreep destage of the disengaging of the described posture correcting unit that prevents that the elastic force of described elastomeric element from causing.
According to the Test handler of Second Characteristic of the present invention as above, with device for exerting, comprise: a plurality of pushers, electrically contact to the semiconductor element of test machine and exert pressure being placed under the state of plug-in unit; Plate is set, described a plurality of pusher is set; Coil spring, makes described pusher resiliency supported in the described plate that arranges; Moving source, the mobile described plate that arranges of advance and retreat, described coil spring is positioned at the place ahead of pusher rear end.
According to the present invention as above, because integration is to realize under the state of mutually suitably facing at plug-in unit and pusher, therefore there is the effect of the damage that prevents semiconductor element that pusher causes or plug-in unit.
Accompanying drawing explanation
Fig. 1 is the conceptual plane for general Test handler.
Fig. 2 is the skeleton diagram with test pallet for general Test handler.
Fig. 3 is for for illustrating the skeleton diagram of matching relationship of matching disc, test pallet and the test machine of general Test handler.
Fig. 4 is for the reference diagram of the problem of prior art is described.
Fig. 5 is according to the sectional view of the summary of the device for exerting of first embodiment of the invention.
Fig. 6 is the enlarged drawing of the A part of enlarged drawing diagram 5.
Fig. 7 a and Fig. 7 b are the enlarged drawing of the characteristic structure of the present invention in further enlarged drawing 5.
Fig. 8 is the reference diagram for the action of the device for exerting of key diagram 5.
Fig. 9 is for for illustrating the reference diagram of effect of the characteristic structure of the first embodiment.
Figure 10 is according to the sectional view of the summary of the device for exerting of second embodiment of the invention.
Figure 11 is the enlarged drawing of the B part of enlarged drawing diagram 10.
Figure 12 a is the exploded perspective view of characteristic structure of the present invention, and Figure 12 b is the combination cutaway view of the I-I line of exploded chart 12a.
Figure 13 is the rear perspective view of posture correcting unit that is applied to the device for exerting of Figure 10.
Figure 14 is for for illustrating the reference diagram of action of the device for exerting of Figure 10.
Figure 15 is for for illustrating the reference diagram for the effect of the characteristic structure of the second embodiment.
Main symbol description
500,700: device for exerting
510,710: pusher
513,713: guide pin
513a: anti-detachment projection
714: anti-detachment bolt
520,720: plate is set
530,740: coil spring
540,730: posture correcting unit
542: correction box
543a, 733: cross pin-and-hole
620,820: moving source
The specific embodiment
Below, with reference to accompanying drawing to describing according to the preferred embodiments of the present invention as above.
It should be noted that, succinct for what illustrate, omit or compress as far as possible the explanation of repetition.And, in the accompanying drawings, only may omit the Reference numeral for the repetition of identical structure.
< the first embodiment >
Fig. 5 is according to the sectional view of the summary of the device for exerting 500 of first embodiment of the invention, and Fig. 6 is the enlarged drawing of the A part of enlarged drawing diagram 5, and Fig. 7 a and Fig. 7 b are the enlarged drawing of the characteristic structure of the present invention in further enlarged drawing 5.
As shown in Fig. 5 to Fig. 7 b, device for exerting 500 according to the present invention comprises a plurality of pushers 510, plate 520 is set, a plurality of coil spring 530, a plurality of posture correcting unit 540, a plurality of cylinder 550, passage 560, a plurality of transferring elements 570, a plurality of conducting parts 580, coldplate 590, seal frame 610, moving source 620, adjuster (regulator) 630, cooler 640.
Pusher 510 is being exerted pressure when action, and when before it, (terminal surface of the side of facing with semiconductor element) touches the semiconductor element D of the plug-in unit TI that is placed in test pallet, to test pusher side, double conductor element D exerts pressure.And as shown in Figure 7b, pusher 510 is set to can be mobile with respect to plate 520 advance and retreat are set.Such pusher 510 comprises the part 511 of exerting pressure, expansion 512, guide pin 513, and is formed with air vent 514 along fore-and-aft direction.
The part of exerting pressure 511 is the parts of exerting pressure for the semiconductor element D being placed on the plug-in unit TI of test pallet.That is, exert pressure in course of action, the PF above of the part of exerting pressure 511 touches semiconductor element D.
Expansion 512 is compared part 511 peripheries of exerting pressure and is expanded.Such expansion 512 is contacted with the one side (face of facing with pusher) of plug-in unit TI when not settling on plug-in unit TI and exerting pressure action under the state of semiconductor element D.Accordingly, stop the PF above of the part 511 of exerting pressure to touch the socket of test machine.
Guide pin 513 guides the PF above of the part 511 of exerting pressure accurately to touch semiconductor element D.In such guide pin 513, be formed with the anti-detachment projection 513a of the disengaging that prevents posture correcting unit 540.
Air vent 514 is for being supplied to semiconductor element D by the air from passage 560.
In the present invention, air vent 514 has adopted the structure that connects pusher 410, but the formed air vent of structure connecting along the side of pusher 410 with the sealing of PF above of pusher 410 also can be applied in the present invention.
Arrange on plate 520, be formed with a plurality of for arranging (for example, 128) pusher 510 hole 521 is set.
A plurality of coil springs 530 are as each resiliency supported in a plurality of pushers 510 is equipped with in plate 520 is set.Such coil spring 530 is set to be supported by guide pin 513.That is, guide pin 513 is positioned at by the position of the inside of coil spring 530.At this, in the past spring be set to utilize arrange plate resiliency supported pusher after, but in the present invention, coil spring 530 is arranged on the place ahead of pusher 510 rear ends by guide pin 513 and posture correcting unit 540.Accordingly, coil spring 530 is positioned at and the exerting pressure on part 511 or the roughly the same vertical curve of guide pin 513 of pusher 510.
Posture correcting unit 540 when pusher 510 and plug-in unit TI integrate first by the posture calibration accuracy of plug-in unit TI.Posture correcting unit 540 can be divided into cylindrical portions 541, correction box 542, shackle portion 543.
Cylindrical portions 541 is to make guide pin 513 by the part of its inner drum.
Correction box 542 is the parts with radial expansion at the front end of cylindrical portions 541.Such correction box 542 realizes and contacting with plug-in unit TI before integrating and by the posture calibration accuracy of plug-in unit TI at pusher 510 and plug-in unit TI.
Shackle portion 543 is positioned at the rear end of cylindrical portions 541.In such shackle portion 543, be formed with and can make guide pin 513 insert logical pin-and-hole 543a excessively.At this, the periphery that formed pin-and-hole 543a plays the effect of the shackle portion of blocking anti-detachment projection 513a.
And the front end of described coil spring 530 is set to join with correction box 542, the rear end of coil spring 530 is set to and plate 520 is set joins.
A plurality of cylinders 550 are exerted pressure a plurality of pushers 510 respectively towards semiconductor element D side.
The air that passage 560 is conditioned to each semiconductor element D supply temperature by each air vent 514 forming on a plurality of pushers 510.Before such passage 560, be formed with a plurality of groove 561 and a plurality of fumaroles 562 of arranging.And a plurality of rears that groove 561 is set are formed with for air pressure being provided to the voltage supply stream 563 to cylinder 550.At this, voltage supply stream 563 can be formed by groove itself, also can use special pipe arrangement.Certainly, voltage supply stream also can separate with passage and be equipped with.
Transferring elements 570 passes to pusher 510 by the pressure of cylinder 550.For this reason, transferring elements 570 above with the facing below of pusher 510, the joining with the piston P of cylinder 550 below of transferring elements 570.At this, between a pusher 510 and a cylinder 550, be equipped with for balanced a pair of transferring elements 570.And transferring elements 570 also has the function that the cold air of coldplate 590 is passed to pusher 510.
Conducting parts 580 is that outside joins with coldplate 590, and it is cylindric that inner side and transferring elements 570 join.Accordingly, transferring elements 570 is inserted in conducting parts 580.Such conducting parts 580, for the cold air of coldplate 590 being passed to more quickly to the front end of transferring elements 570, adopts thermal conductivity for example, higher than the material (, copper product) of transferring elements 570 and coldplate 590.
The object that coldplate 590 is set is cold air to offer semiconductor element D.For this reason, coldplate 590 has along open a plurality of hole 591, a plurality of passage 592 and a plurality of cooling flowing paths 593 of maintaining of fore-and-aft direction.Such coldplate 590, therefore can called after retaining plate because transferring elements 570 is stably maintained to relevant position.Accordingly, coldplate 590 is arranging between plate 520 and passage 560 together with a plurality of transferring elements 570.
Maintain and on hole 591, be inserted with transferring elements 570 and conducting parts 580.Accordingly, transferring elements 570 and conducting parts 580 can stably be positioned.
A plurality of passages 592 make to lead to from the air of passage 560 air vent 514 sides of pusher 510.Accordingly, a plurality of passages 592 are formed on the position corresponding with air vent 514 and paired a plurality of maintaining between hole 591.
In cooling flowing path 593, be supplied with cooling water.Accordingly, coldplate 590 obtains cooling.At this, it should be noted that, tested semiconductor element D is overheated because heat release own likely exceeds desired temperature range.Under these circumstances, utilize cooling water to carry out coldplate 590 cooling, and the cold air of coldplate 590 is passed to semiconductor element D by transferring elements 570 and pusher 510.And semiconductor element D is cooled to suitable temperature accordingly.
Sealing frame 610 makes to form seal cavity SS between coldplate 590 and passage 560.Accordingly, by a plurality of fumaroles 552 of passage 560, the passage 592 of coldplate 590 and the air that is conditioned via the temperature of the nonspecific path movement air vent 514 by pusher 510 is suitably fed to each semiconductor element D.At this, the term of so-called seal cavity SS has not only represented hermetic space, represents that the air of supplying by passage 560 is prevented from the space of leaking as much as possible.
Moving source 620 makes passage 560 mobile along fore-and-aft direction advance and retreat.Moving source 620 can utilize cylinder or motor to be equipped with.
Adjuster 630 is supplied to the air supply source of cylinder 550 as generating desired pneumatics and is equipped with.At this, the pneumatics producing in adjuster 630 can be adjusted as required.That is,, when semiconductor element D change or the number of terminals that is connected to the semiconductor element D of test machine change, adjuster is controlled as and produces necessary pneumatics.Accordingly, can regulate exerting pressure by cylinder 550.Certainly, utilize air starting cylinder 550 in the present invention, but according to different embodiments, also can utilize air fluid in addition to start cylinder 550, now, adjuster can be named as fluid provider.
Cooler 640 is as the cooling water as cooling fluid is offered to the fluid provider of cooling flowing path 593 and is equipped with.
Then, the action for device for exerting 500 as above describes.
The current action state before of exerting pressure of making has been shown in Fig. 6.
In state as shown in Figure 6, moving source 620 starts and makes passage 560 to semiconductor element D side shifting.Accordingly, as shown in Figure 8, the part 511 of exerting pressure of pusher 510 contacts and exerts pressure with semiconductor element D, makes semiconductor element D be electrically connected to the socket of test machine.Now, cylinder 550 starts, and the piston P of cylinder 550 and transferring elements 570 is advanced, so that pusher 510 is exerted pressure to semiconductor element D with suitable pressure towards semiconductor element D side.
In above-mentioned action specification, when the part 511 of exerting pressure that pusher 510 has been described touches semiconductor element D, cylinder 550 starts.But, when the semiconductor element of needs test is determined, also can make cylinder 550 state in having started in advance.And in this case, moving source 620 starts and shifted matching plate is exerted pressure thereby semiconductor element D is pushed device 510.
But in No. 10-2009-0123441st, Korea S's publication of mentioning in prior art, (below) forms the structure that spring is set below pusher, being designed to thus pusher, to be oppositely arranged plate elasticity advance and retreat mobile.But, as shown in Figure 7b, in the present invention, when the part 511 of exerting pressure of pusher 510 touches semiconductor element D and while causing semiconductor element D to be pressed against rear side, compressed together with also with the coil spring 530 arranging on posture correcting unit 540 that pusher 510 together connects.And afterwards according to the elastic force of coil spring 530, pusher 510 revert to original position again.Again, can be embodied as and make pusher 510 advance and retreat movement and form the contact between pusher 510 and transferring elements 570.Now, the spacing between pusher 510 and transferring elements 570 should be got the value within the mobile scope of pusher 510 advance and retreat.
After completing test, when the action of exerting pressure is disengaged, again get back to the state of Fig. 6.
In addition, the reference diagram of Fig. 9 that with reference to exaggeration the integration of the plug-in unit TI that forms in the process of the state that the state evolution by Fig. 6 is Fig. 8 and pusher 510 is shown gives the account in greater detail.
When under Fig. 9 (a) state, pusher 510 advances, as shown in Fig. 9 (b), the front end of upside guide pin 513T starts to be inserted in advance in the upside bullport GHT of plug-in unit TI.Accordingly, as shown in Fig. 9 (c), the correction box 542 of upside posture correcting unit 540T in advance with the joining below of plug-in unit TI.Now, upside correcting unit 540T is by coil spring 530 resiliency supported, so pusher 510 moves on and upside posture correcting unit 540T promotes the upside of plug-in unit TI, thereby as shown in Fig. 9 (d), exactly that the postural upright of plug-in unit TI is upright.Then, from the state of Fig. 9 (d), pusher 510 moves on and as shown in Fig. 9 (e), completes the integration of plug-in unit TI and pusher 510.
In the present embodiment, illustrated that posture correcting unit 540 is supported by coil spring 530.But for example the cylindrical portions of posture correcting unit forms by being converted into crooked soft elastomeric material, when avoiding hindering with respect to the advancing of the guide pin of correction box, the structure that arranges of posture correcting unit can be irrelevant with coil spring.
< the second embodiment >
Figure 10 is according to the sectional view of the summary of the device for exerting 700 of second embodiment of the invention, Figure 11 is the enlarged drawing of the B part of enlarged drawing diagram 10, Figure 12 a is the exploded perspective view of characteristic structure of the present invention, and Figure 12 b is the combination cutaway view of the I-I line of exploded chart 12a.
As shown in Figure 10 to Figure 12 a and Figure 12 b, device for exerting 700 according to the present invention comprises a plurality of pushers 710, plate 720 is set, a plurality of posture correcting unit 730, a plurality of coil spring 740, a plurality of cylinder 750, passage 760, a plurality of transferring elements 770, coldplate 790, sealing frame 790, moving source 810.
Pusher 710 is at the end of when action side that FP(faces with semiconductor element before it of exerting pressure) contact with the semiconductor element D that is arranged to the plug-in unit TI on test pallet in, towards testing double conductor element D of pusher side, exert pressure.And pusher 710 is set to relatively to advance and retreat mobile for plate 720 is set.Such pusher 710 specifically illustrates as Figure 12 a's, has the part of exerting pressure 711, shackle portion 712, guide pin 713, anti-detachment bolt 714, and is formed with air vent 715 along fore-and-aft direction.
The part of exerting pressure 711 is the parts of exerting pressure to being placed in the semiconductor element D of the plug-in unit TI on test pallet.
Shackle portion 712 is compared the part periphery of exerting pressure and is expanded.According to such shackle portion 712, even if the resilient force of coil spring 740 is also snapped fit onto plate 720 is set in the place ahead of pusher 710, so shackle portion 712 prevents that pusher 710 from departing from from the place ahead.
Guide pin 713 guides the PF above of the part 711 of exerting pressure accurately to touch semiconductor element D.
Anti-detachment bolt 714 prevents that posture correcting unit 730 from departing from from the place ahead because of the elastic force of coil spring 740 of forwards effect.That is, the head part 714a of anti-detachment bolt 714 blocks the J part of posture correcting unit 730 and plays the effect of the anticreep destage of the disengaging towards the place ahead that prevents posture correcting unit 730.
Air vent 715 is for being supplied to semiconductor element D by the air from passage 760.
Although in the present invention, air vent 715 has adopted the structure that connects pusher 710, and the air vent that the structure connecting along the side of pusher with being closed above of pusher forms also can be applied among the present invention.
Plate 720 is set and has that the pusher (710) of a plurality of for arranging (for example, 128) is a plurality of to be arranged hole 721 and can insert the support slot 722 of the rear end of support coils spring 740.Pusher 710 part 711 that is set to exert pressure is forwards outstanding by hole 721 is set.
Posture correcting unit 730 when pusher 510 and plug-in unit TI integrate first by the posture calibration accuracy of plug-in unit TI.Posture correcting unit 730 forms has four jiaos of shaped as frame shapes of via hole 731 above that the FP above of the part 711 of exerting pressure that can make pusher 710 passes through.Such posture correcting unit 730 there is above each the outstanding ledge 732a to 732d forwards from four arm of angle angles.In ledge 732a to 732d along being formed with the pin via hole 733 that can make guide pin 713 pass through on diagonal opposed facing two ledge 732a, 732c.Accordingly, with front end, the state by pin via hole 733 arranges the guide pin 713 of pusher 710.And, as shown in the rear perspective view of Figure 13, the slot 734 that is formed with the front end insertion that can make coil spring 740 below of remaining opposed facing two ledge 732b, 732d.
A plurality of coil springs 740 as utilization arrange in a plurality of posture correcting units 730 of plate 720 resiliency supported each elastomeric element and arrange.Certainly, a plurality of coil spring 740 also be take posture correcting unit 730 and is made each resiliency supported in a plurality of pushers 710 in plate 720 is set as medium.The front end of such coil spring 730 is inserted into the slot 734 of posture correcting unit 730, and rear end is inserted into the support slot 722 that plate 720 is set.At this, in the past spring be set to utilize arrange the direct resiliency supported pusher of plate after, but in the present invention, coil spring 740 be take posture correcting unit 730 as medium resiliency supported pusher 710 indirectly.
A plurality of cylinders 750 are exerted pressure to a plurality of pushers 710 to semiconductor element D side respectively.
The air that passage 760 provides separately temperature to be conditioned by the passage 715 forming on a plurality of pushers 710 to each semiconductor element D.Before such passage 760, be formed with a plurality of groove 761 and a plurality of fumaroles 762 of arranging.And, at a plurality of rears that groove 761 is set, be formed with for air pressure being offered to the voltage supply stream 763 of cylinder 750.
Transferring elements 770 passes to pusher 710 by the pressure of cylinder 750.For this reason, transferring elements 770 above with the facing below of pusher 710, the joining with the piston of cylinder 750 below of transferring elements 770.
Coldplate 780 is for offering cold air semiconductor element D.As specifically illustrating of Figure 11, such coldplate 780 has a plurality of hole 781, a plurality of passage 782, a plurality of cooling flowing paths 783 of maintaining.
It is identical that the effect that maintains hole 781, passage 782, cooling flowing path 783 and the first embodiment a plurality of maintain hole 581, a plurality of passage 582, cooling flowing path 583.
Seal frame 790 will form seal cavity SS between coldplate 780 and passage 760.
Moving source 810 is along fore-and-aft direction advance and retreat movable passageway 760.
Next, the action for device for exerting 700 as above describes.
Figure 11 illustrates the state that current formation is exerted pressure before moving.
Under the state of Figure 11, moving source 810 starts and makes passage 760 to semiconductor element D side shifting.Accordingly, as shown in figure 14, the PF(above of pusher 710 particularly, before the part of exerting pressure) touch semiconductor element D and exert pressure, make semiconductor element D be electrically connected to the test jack of test machine.
When complete test on weekly duty, exert pressure action be disengaged, again revert to the state of Figure 11.
Then the reference diagram of Figure 15 of the plug-in unit TI, forming the process with reference to the state that to illustrate from the state evolution of Figure 11 be turgidly Figure 14 and the integration of pusher 710 more specifically describes.
Under Figure 15 (a) state, if pusher 710 advances,, as shown in Figure 15 (b), the front end of upside guide pin 713T starts to be inserted in advance the upside bullport GHT of plug-in unit TI.Accordingly, as shown in Figure 15 (c), the upside ledge 732a of posture correcting unit 730 touch in advance plug-in unit TI after.Now, because posture correcting unit 730 is by 740 resiliency supported of a pair of coil spring, if therefore pusher 710 moves on, the upside ledge 732a of posture correcting unit 740 promotes the upside of plug-in unit TI, as shown in Figure 15 (d), exactly that the postural upright of plug-in unit TI is upright thus.Then, from the state of Figure 15 (d), pusher 710 moves on and as shown in Figure 15 (e), completes the integration of plug-in unit TI and pusher 510, and the PF above that semiconductor element D is pushed device 710 accordingly exerts pressure and is supported.
The existing device for exerting illustrating in such device for exerting 500,700 alternative background technologies and being applied in Test handler.
Certainly, the present embodiment also can be identical with the first embodiment, comprises a plurality of conducting parts, adjuster and cooler, but have the 26S Proteasome Structure and Function identical with the first embodiment, and therefore the description thereof will be omitted.
As mentioned above, for of the present invention illustrating, be to carry out round the embodiment with reference to accompanying drawing, but above-described embodiment is the preferred embodiments of the present invention, therefore can not be interpreted as that the present invention is only confined to above-described embodiment, should go to understand claim scope of the present invention based on claims and its equivalents.
Claims (8)
1. a Test handler device for exerting, is characterized in that, comprising:
A plurality of pushers, exert pressure to be in electrical contact with the semiconductor element of test machine to be placed in the state of plug-in unit;
Plate is set, described a plurality of pusher is set;
Posture correcting unit, correctly proofreaies and correct the posture with respect to the plug-in unit of described pusher;
Moving source, for the mobile described plate that arranges of advancing and retreat.
2. Test handler device for exerting according to claim 1, is characterized in that, also comprise and make described pusher resiliency supported in the described coil spring that plate is set,
Described pusher possesses guiding and the integration of plug-in unit and is set to inside by described coil spring to support the guide pin of described coil spring.
3. Test handler device for exerting according to claim 2, it is characterized in that, described posture correcting unit has rear end and is formed with and can makes described guide pin insert the logical pin-and-hole of crossing, and is formed with the posture of plug-in unit is set to the cylindric of correct correction box on front end
In described guide pin, be formed with the anti-detachment projection of the disengaging that prevents described posture correcting unit,
Described coil spring is set to front end and touches in described correction box, and rear end touches the described plate that arranges.
4. Test handler device for exerting according to claim 1, is characterized in that, also comprise and make described posture correcting unit resiliency supported in the described elastomeric element that plate is set,
On described posture correcting unit, be formed with the via hole above passing through that can make described pusher above,
Described pusher is to arrange by the described state of via hole above above.
5. Test handler device for exerting according to claim 1, is characterized in that, also comprise and make described posture correcting unit resiliency supported in the described elastomeric element that plate is set,
Described pusher be take described posture correcting unit as medium is by described elastomeric element resiliency supported indirectly.
6. according to the Test handler device for exerting described in claim 4 or 5, it is characterized in that, described pusher possesses the guide pin of guiding and the integration of described plug-in unit,
On described posture correcting unit, be formed with and can make the pin-and-hole of crossing that the front end of described guide pin passes through,
Described guide pin is to arrange by the described state of crossing pin-and-hole.
7. according to the Test handler device for exerting described in claim 4 or 5, it is characterized in that, described pusher possesses the anticreep destage of the disengaging of the described posture correcting unit that prevents that the elastic force of described elastomeric element from causing.
8. a Test handler device for exerting, is characterized in that, comprising:
A plurality of pushers, to electrically contacting to the semiconductor element of test machine and exert pressure being placed in the state of plug-in unit;
Plate is set, described a plurality of pusher is set;
Coil spring, makes described pusher resiliency supported in the described plate that arranges;
Moving source, the mobile described plate that arranges of advance and retreat,
Described coil spring is positioned at the place ahead of pusher rear end.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2013-0014165 | 2013-02-07 | ||
| KR1020130014165A KR101897977B1 (en) | 2013-02-07 | 2013-02-07 | Pushing apparatus for test handler |
| KR1020130044918A KR102044183B1 (en) | 2013-04-23 | 2013-04-23 | Pushing apparatus for test handler |
| KR10-2013-0044918 | 2013-04-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103977964A true CN103977964A (en) | 2014-08-13 |
| CN103977964B CN103977964B (en) | 2017-04-12 |
Family
ID=51270271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410045325.1A Active CN103977964B (en) | 2013-02-07 | 2014-02-07 | Pressure applying device for testing sorting machine |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103977964B (en) |
| TW (1) | TWI559006B (en) |
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| CN107209206A (en) * | 2015-01-12 | 2017-09-26 | 泰克元有限公司 | Testing, sorting machine pressue device |
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| CN112255472A (en) * | 2019-07-02 | 2021-01-22 | 细美事有限公司 | Semiconductor package testing device |
| CN113770039A (en) * | 2020-06-10 | 2021-12-10 | 细美事有限公司 | Airflow adjusting device and test handler provided with same |
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| CN116273994A (en) * | 2023-05-26 | 2023-06-23 | 北京京瀚禹电子工程技术有限公司 | Electrical equipment aging test equipment with intelligent feeding and sorting functions |
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Also Published As
| Publication number | Publication date |
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| TW201437655A (en) | 2014-10-01 |
| CN103977964B (en) | 2017-04-12 |
| TWI559006B (en) | 2016-11-21 |
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