KR101919088B1 - Pushing apparatus for test handler - Google Patents

Abstract

The present invention relates to a pressure device for a test handler.
According to the present invention, cold air is conducted to a pusher that presses a semiconductor element by using a cooling plate and a transmitting member.
According to the present invention, since cooling air is stably supplied to the pusher, the cooling efficiency of the semiconductor element is improved. Therefore, there is an effect of ultimately improving the reliability of the test.

Description

[0001] PUSHING APPARATUS FOR TEST HANDLER [0002]

The present invention relates to a test handler that is supported for testing of produced semiconductor devices. In particular, the present invention relates to a pressing device for pressing or supporting a semiconductor device toward a tester.

The test handler supports testing of the produced semiconductor device. The test handler classifies semiconductor devices according to the test results.

FIG. 1 is a conceptual diagram of a general test handler 100 viewed from a plane.

The test handler 100 includes a test tray 110, a loading device 120, a SOAK CHAMBER 130, a test chamber 140, a pressurizing device 150, a desock chamber 160, ), And an unloading device 170.

2, the test tray 110 is provided with a plurality of inserts 111 to which the semiconductor device D can be adhered, so as to be somewhat flowable. The test tray 110 circulates along a closed path C defined by a plurality of transfer devices (not shown).

The loading device 120 loads the untested semiconductor device loaded in the customer tray into a test tray at a loading position (LP).

The soak chamber 130 is provided to preheat or precool the semiconductor devices loaded in the test tray 110 transferred from the loading position LP according to test environment conditions.

The test chamber 140 is provided for testing semiconductor devices in the test tray 110 that have been preheated or pre-cooled in the soak chamber 130 and then transferred to a test position (TP).

The pressurizing device 150 presses the semiconductor element in the test tray 110 in the test chamber 140 toward the tester TESTER. As a result, the semiconductor element in the test tray 110 is electrically connected to the tester (TESTER). 3, the pressing device 150 includes a plurality of pushers 151, a mounting plate 152, and a moving source 153. [ 3, the spacing between the respective structures is exaggerated.

The pusher 151 presses the semiconductor element D seated in the insert 111 of the test tray 110. The pusher 151 also serves to uniformly support the semiconductor element D pushed in the opposite direction of the tester TESTER by a terminal of the tester (e.g., pogo pin). In the following specification and claims, the term 'pressurization' of pushers encompasses the meaning of 'pressurization' and 'support.'

The mounting plate 152 is provided with a plurality of pushers 151 in a matrix form.

Generally, the combination of the pusher 151 and the mounting plate 152 is referred to as a match plate MP.

The moving source 153 may be provided by a cylinder, a motor, or the like. This movement source 153 moves the match plate MP to the tester TESTER side. That is, when the moving source 153 operates, the match plate MP is first brought into close contact with the test tray 110. Then, the test tray is moved to the tester (TESTER) side. Therefore, the semiconductor element D mounted on the insert 111 of the test tray 110 is electrically connected to the tester TESTER.

The desolator chamber 160 is provided to return the heated or cooled semiconductor elements in the test tray 110 transferred from the test chamber 140 to room temperature.

The unloading apparatus 170 classifies the semiconductor elements in the on-test tray 110 into unloading positions (UP (unloading position)) from the desock chambers 160 according to the test grades and unloads them into the empty customer tray .

As described above, the semiconductor device is transferred from the loading position LP to the soak chamber 130, the test chamber 140, the desorption chamber 160, and the unloading position UP from the loading position LP while being loaded on the test tray 110. [ And back to the loading position LP.

On the other hand, semiconductor devices can be used in various temperature environments. Therefore, most tests are performed with the temperature of the semiconductor device raised or lowered artificially. If the semiconductor device is tested outside the required temperature range, the reliability of the test is of course lowered.

To ensure the reliability of the test, the interior of the test chamber is controlled to have the required temperature environment.

Further, Korean Patent Laid-Open No. 10-2005-0055685 (entitled "Test Invention") proposes a technology for finely adjusting the temperature of a semiconductor device using a duct (hereinafter referred to as "Convention 1"). Conventional Invention 1 is a technology for supplying temperature-controlled air to individual semiconductor elements by using a duct.

However, when the semiconductor device is being tested, the temperature may deviate from the required temperature range due to self heat generation. To solve this problem, Korean Patent Laid-Open No. 10-2004-0015337 (entitled "Electronic component handling device and electronic component temperature control method") (hereinafter referred to as "Conventional Invention 2") has been proposed.

Conventional Invention 2 is a technique of arranging a sucking and discharging heat exchanger at the rear end of a pusher (referred to as "Fuze" in Conventional Invention 2) to naturally dissipate the heat of the semiconductor device into the surrounding air. However, according to the conventional second invention, the cooling efficiency is lowered because of the natural heat dissipation method.

Korean Patent Laid-Open Publication No. 10-2009-0047556 (entitled " Apparatus and Method for Controlling the Temperature of an Electronic Device under Test) " describes a technique of dropping the temperature of an electronic device under test by a typical cooling system using a compressor and a condenser (Hereinafter referred to as " Conventional Invention 3 "). However, such a prior art 3 is difficult to apply when several hundred semiconductor devices are tested at a time.

In particular, the conventional Invention 2 and the conventional Invention 3 can not be combined with the conventional Invention 1 in which temperature-adjusted air is separately supplied to the individual semiconductor elements by using a duct. Therefore, if the conventional invention 2 or 3 is applied to the test handler, the advantage of the sophisticated temperature control using the duct can not be obtained.

It is an object of the present invention to provide a technique capable of cooling the temperature of a semiconductor device under test to a required level quickly by conduction.

As described above, the pressure device for a test handler according to the present invention includes: a plurality of pushers for pressing a semiconductor device electrically connected to a tester in a state of being mounted on an insert; A mounting plate on which the plurality of pushers are installed; A cooling plate provided for cooling the pusher and having a cooling flow path through which the cooling fluid moves; Transferring members for transferring cold air of the cooling plate to the plurality of pushers; A fluid supply source for supplying a cooling fluid to the cooling channel; And a moving source provided to move the mounting plate toward and away from the semiconductor device; .

A duct for supplying temperature controlled air to the semiconductor element; Wherein the plurality of pushers are each provided with an air supply hole for supplying air from the duct to semiconductor elements, and the cooling plate is provided with an air passage hole for passing air from the duct to the pusher side, Respectively.

A plurality of cylinders for pressing the plurality of pushers toward the semiconductor element, respectively; And each of the transmitting members transmits the pressing force of the plurality of cylinders to the plurality of pushers.

The cooling plate is provided with a holding hole for holding the transmitting member, and the transmitting member is inserted in the holding hole.

A conductive member having a higher thermal conductivity than the transmitting member; Wherein the conductive member is in contact with the cooling plate on one side and contacts the transmission member on the other side.

The pusher and the transmitting member are brought into contact with each other after the mounting plate moves toward the semiconductor element side by the moving source.

According to the present invention, it is possible to cool the temperature of a self-generated semiconductor element by conduction to a required level, thereby improving the reliability of the test.

Figure 1 is a conceptual top view of a generic test handler.
2 is a schematic view of a test tray for a general test handler.
3 is a schematic diagram for explaining a matching relationship between a match plate, a test tray, and a tester in a general test handler.
4 is a schematic side cross-sectional view of a pressurizing device according to an embodiment of the present invention.
5 is an enlarged view showing an enlarged view of a portion A in Fig.
Fig. 6 is a reference diagram for explaining an extended portion of the pusher applied to the pressing device of Fig. 4; Fig.
FIG. 7 is a reference diagram for explaining the operation of the pressurizing device of FIG. 4;

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

For the sake of brevity, redundant descriptions are omitted or compressed as much as possible. In the drawings, redundant codes for the same configuration are omitted as much as possible.

4 is a schematic side cross-sectional view of a pressurizing apparatus 400 according to an embodiment of the present invention, and Fig. 5 is an enlarged view showing an enlarged view of a portion A of Fig.

4 and 5, the pressing device 400 according to the present invention includes a plurality of pushers 410, a mounting plate 420, coil springs 430, a plurality of air cylinders 440, And includes a duct 450, a transmitting member 460, a conducting member 470, a cooling plate 480, a sealing frame 490, a moving source 510, and a chiller 520.

The pusher 410 is pressed against the semiconductor element D placed on the insert TI of the test tray while the front surface of the pusher 410 is pressed against the semiconductor element D Press to the tester side. The pusher 410 is installed so as to be relatively movable relative to the mounting plate 420. The pusher 410 includes a pressurizing portion 411, an extension portion 412, and a guide pin 413, and an air supply hole 414 is formed in the front and rear direction.

The pressing portion 411 is a portion for pressing the semiconductor element D which is seated on the insert TI of the test tray. That is, the front face PF of the pressing portion 411 is brought into contact with the semiconductor element D in the pressing operation.

The expanded portion 412 is extended around the pressing portion 411. The front surface EF of the extension portion 412 is in contact with one surface of the insert TI (the surface facing the pusher) when the pressing operation is performed in a state in which the semiconductor element D is not seated in the insert TI . Thereby preventing the front surface PF of the pressing portion 411 from contacting the socket of the tester.

The guide pin 413 guides the front face PF of the pressing portion 411 to make a precise contact with the semiconductor element D. [

An air supply hole 414 is formed to supply air from the duct 450 to the semiconductor element D. [

Although the air supply hole 414 penetrates through the pusher 410 in the present invention, the front portion PF of the air supply hole 414 is closed and penetrates to the side of the pusher 410, Can be applied.

The mounting plate 420 is formed with mounting holes 421 through which a plurality of (for example, 128) pushers 410 are installed.

The coil springs 430 are provided as elastic members that elastically support the plurality of pushers 410 with respect to the mounting plate 420. The coil spring 430 is installed to be supported by the guide pin 413. [

The plurality of air cylinders 440 press the plurality of pushers 410 toward the semiconductor elements D, respectively.

The duct 450 supplies temperature-regulated air to the individual semiconductor elements D through the air supply holes 414 formed in the plurality of pushers 410. Mounting grooves 451 and air injection holes 452 are formed in the front surface of the duct 450. An air passage 453 for supplying air to the air cylinder 440 is formed in the rear of the installation recesses 451.

The transfer members 460 transfer the cold air of the cooling plate 480 to the plurality of pushers 410. Further, the transmitting member 460 transmits the pressing force of the air cylinder 440 to the pusher 410. [ The front surface of the transmitting member 460 faces the rear surface of the pusher 410 and the rear surface of the transmitting member 460 abuts against the piston P of the air cylinder 440. [ Here, a pair of transmitting members 460 are provided between one pusher 410 and one air cylinder 440 for balance.

The conductive member 470 has a cylindrical shape in which the outside is in contact with the cooling plate 480 and the inside is in contact with the transmitting member 460. Therefore, the transmitting member 460 is inserted into the conductive member 470. The conductive member 470 is made of a material having a thermal conductivity higher than that of the transfer member 460 and the cooling plate 480 in order to rapidly transfer the cool air of the cooling plate 480 to the front end of the transfer member 460 ).

The cooling plate 480 stably maintains the transmitting members 460 in the corresponding positions. Thus, the cooling plate 480 is also located between the mounting plate 420 and the duct 450 together with the transmitting members 460. 6, the cooling plate 480 has retaining holes 481 and air passage holes 482 opened in the front-rear direction and a cooling passage 483.

In the holding holes 481, the transmitting members 460 and the conducting members 470 are inserted.

The air passage holes 482 allow the air coming from the duct 450 to pass to the air supply hole 414 side of the pusher 410.

The cooling water (cooling fluid) circulated by the chiller 520 moves to the cooling channel 483. As a result, the cooling plate 480 is cooled.

The sealing frame 490 forms a space SS between the cooling plate 480 and the duct 450. The air coming through the air injection holes 452 of the duct 450 and the air passage holes 482 of the cooling plate 480 through the air supply holes 414 of the pusher 410 D). Here, the term " enclosed space (SS) " does not mean only a space completely enclosed with the outside, but means a space in which air supplied from the duct 450 is leaked to the outside as much as possible.

The moving source 510 advances and retreats the mounting plate 420 provided with the pushers 410 back and forth by moving the duct 450 back and forth in the forward and backward directions. The moving source 510 may be a cylinder or a motor.

The chiller 520 is provided as a fluid supply source for supplying cooling water, which is a cooling fluid, to the cooling channel 483.

Subsequently, the operation of the pressure device 400 as described above will be described.

Fig. 5 shows a state before the current pressing operation is performed.

The moving source 510 operates in the state shown in FIG. 5 to move the duct 450 to the semiconductor device D side. 7, the pressing portion 411 of the pusher 410 contacts the semiconductor element D and presses the semiconductor element D to electrically connect the semiconductor element D to the socket of the tester. The piston P of the air cylinder 440 and the transmitting member 460 are advanced to the side of the semiconductor element D so that the pusher 410 presses the semiconductor element D Pressure.

In the above description of operation, it has been described that when the pressing portion 411 of the pusher 410 contacts the semiconductor element D, the air cylinder 440 operates. However, if the semiconductor device to be tested is determined, it is also possible that the air cylinder 440 is in the operating state in advance. In this case, the moving source 510 operates and the match plate is moved so that the semiconductor device D is pressed by the pusher 410.

The contact between the transmitting member 460 and the pusher 410 may also be such that the pusher 410 pushes the semiconductor element D and the pusher 410 is retracted by the repulsive force Do. In this case, the distance between the pusher 410 and the transmitting member 460 should be within a range in which the pusher 410 is retracted.

On the other hand, when the temperature of the semiconductor element D exceeds the required level due to self heat generation, the chiller 520 operates and the cooling water flows into the cooling channel 483 of the cooling plate 480. The cooling plate 480 is cooled and the cold air of the cooling plate 480 is conducted to the semiconductor element D through the conductive member 470, the transmitting member 460 and the pusher 410. [ The temperature of the semiconductor element D is lowered to a required level.

Of course, depending on the type of the semiconductor device D, the degree of self-heating during the test can be confirmed through experimentation, and the temperature and flow rate of the cooling water can be controlled according to the result of the experiment.

Further, even when the cooling water flows through the cooling passage 483, the temperature-controlled air can be continuously supplied to the individual semiconductor elements D through the duct 450 continuously. At this time, it can be considered that the temperature-regulated air in contact with the cooling plate 480 is slightly changed by the cooling plate 480. However, this is not a concern because the pressure of the temperature-controlled air is high and the thermal conductivity by air is small. It is also possible to add another insulating plate to the rear surface of the cooling plate 480 in order to prevent a small temperature change.

Of course, when the semiconductor element D is cooled by the cooling plate 480, the supply of air by the duct 450 may be temporarily stopped.

When the test is completed, the pressurizing operation is released and the operation returns to the state of FIG. 5 again.

In the present invention, the inlet and the outlet of the cooling channel 483 are shown as one, respectively. However, in some cases, it is also possible to use a single chiller to install several inlet and outlet of the cooling channel, It is also possible to use an individual chiller according to.

The pressure device 400 as described above can be applied to the test handler in place of the conventional pressure device described in the background art.

Although the present invention has been fully described by way of example only with reference to the accompanying drawings, it is to be understood that the present invention is not limited thereto. It is to be understood that the scope of the invention is to be construed as being limited only by the following claims and their equivalents.

400: Pressure device
410: pusher
414: air supply hole
420: mounting plate
440: Air cylinder
450: duct
460:
470: conductive member
480: Cooling plate
471: Retaining hole 472: Air passage hole
473:
490: Sealing frame
SS: Enclosed space
510:
520: Chiller

Claims (6)

A plurality of pushers for pressing the semiconductor elements seated in the insert toward the tester;
A mounting plate on which the plurality of pushers are installed;
A cooling plate provided for cooling the pusher and having a cooling flow path through which the cooling fluid moves;
Transferring members for transferring cold air of the cooling plate to the plurality of pushers;
A fluid supply source for supplying a cooling fluid to the cooling channel;
A moving source provided to move the mounting plate toward and away from the semiconductor device; And
A duct having air injection holes for supplying temperature-controlled air to individual semiconductor elements; / RTI >
The plurality of pushers are each provided with an air supply hole for supplying air from the duct to semiconductor devices,
Wherein the cooling plate is formed with air holes for passing air from the duct to the air supply hole side of the pusher
Pressurizing device for test handler. delete The method according to claim 1,
A plurality of cylinders for pressing the plurality of pushers toward the semiconductor element, respectively; Further comprising:
Wherein each of the transmitting members transmits the pressing force of the plurality of cylinders to the plurality of pushers
Pressurizing device for test handler. The method according to claim 1,
Wherein the cooling plate is provided with a holding hole for holding the transmitting member,
And the transmitting member is inserted into the holding hole.
Pressurizing device for test handler. 5. The method of claim 4,
A conductive member having a higher thermal conductivity than the transmitting member; Further comprising:
And the conductive member is in contact with the cooling plate on one side and the transmission member on the other side.
Pressurizing device for test handler. The method of claim 1, wherein
Wherein the pusher and the transmitting member are brought into contact with each other after the mounting plate moves toward the semiconductor element by the moving source.

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