KR102289097B1 - Pushing apparatus and match plate for test handler - Google Patents

Abstract

The present invention relates to a pressure device for a test handler and a match plate.
A pressing device according to the present invention includes: a match plate having a pusher that is aligned with a test tray and presses semiconductor devices loaded on the test tray when aligned; an installation plate on which the match plate is installed; a driving source for moving the installation plate forward or backward so that the match plate fits evenly on the test tray or releases the alignment; and a heat exchange plate for exchanging heat with the installation plate. Including, the driving source makes contact or release of the contact between the installation plate and the heat exchange plate when heat exchange or conversion of a thermal state.
According to the present invention, there is an effect that the operation rate of the test handler can be increased by shortening the switching time, which was stretched by the metal components when switching the test mode.

Description

Pressurizing device and match plate for test handlers {PUSHING APPARATUS AND MATCH PLATE FOR TEST HANDLER}

The present invention relates to a test handler supported for testing of manufactured semiconductor devices. In particular, the present invention relates to a pressing device for pressing or supporting a semiconductor device toward a tester.

The test handler is used to test semiconductor devices manufactured through a predetermined manufacturing process.

The test handler moves semiconductor devices from the customer tray to the test tray, and supports the semiconductor devices loaded in the test tray to be simultaneously tested by the tester, According to the results, the semiconductor devices are sorted by grade and moved from the test tray to the customer tray.

The above-mentioned test tray is the position where the semiconductor device is loaded into the test tray (hereinafter referred to as the 'loading position'), and the position where the semiconductor device loaded on the test tray is electrically connected to the tester (hereinafter referred to as the 'test position'). ), the semiconductor device that has been tested passes through a position where the semiconductor device is unloaded from the test tray (hereinafter referred to as an 'unloading position'), and then circulates through a constant circulation path leading back to the loading position.

In general, a test handler applies a thermal stimulus (high or low temperature) to a semiconductor device in consideration of the usage environment of the semiconductor device, and then removes the applied thermal stimulus from the semiconductor device when the test is completed. At this time, the process of applying or removing the thermal stimulus to the semiconductor device is performed on the circulation path of the test tray.

1 is a conceptual plan view of a conventional test handler (TH).

The test handler TH includes a test tray TT, a first picking device GU1, a first chamber CB1, a test chamber TC, a pressurizing device PU, a second chamber CB2, and a second picking device. (GU2), a plurality of temperature controllers (TR1 to TR6) and a controller (CU).

A plurality of semiconductor devices may be loaded in the test tray TT, as referenced in Republic of Korea Utility Model No. 20-0389824, and the like, and circulates along a circulation path C determined by a plurality of transporters (not shown). .

The first picking device GU1 loads the semiconductor device to be tested loaded on the customer tray into the test tray TT at the loading position LP. The first picking device GU1 may be configured as a single pick-and-place device as in Korean Utility Model Publication No. 20-2010-0012620, but a plurality of pick-and-place devices as referenced in Korean Patent Application Laid-Open No. 10-2007-0077905 It may consist of a device and a movable loading table and the like.

The first chamber CB1 is provided to apply thermal stimulation in advance before testing the semiconductor device loaded on the test tray TT according to the test temperature condition. That is, the semiconductor device is assimilated to the temperature inside the first chamber CB1 before going to the test position (TP). Therefore, the flow of the whole logistics is accelerated and the processing capacity is improved. Here, the test tray TT is transferred inside the first chamber CB1.

The test chamber TC is provided to test the semiconductor device in the test tray TT that has been transferred to the test position TP after receiving the thermal stimulus from the first chamber CB1 . The interior of the test chamber TC is interconnected because the thermal state of the interior of the first chamber CB1 is always similar. For reference, the tester TESTER is coupled to the window side of the test chamber TC.

The pressing device PU presses the semiconductor device in the test tray TT in the test chamber TC toward the tester TESTER (refer to Korean Patent Application Laid-Open No. 10-2005-0055685, etc.). Due to this, the semiconductor device in the test tray TT is electrically connected to the tester TESTER.

In the second chamber CB2, a thermal stimulus is removed from the semiconductor device in the test tray TT transferred from the test chamber TC. The reason for configuring the second chamber CB2 in this way is to allow a normal unloading operation to be performed when the tested semiconductor device is unloaded from the test tray TT, and the second picking device GU2 may be damaged or the semiconductor device may be damaged. This is to prevent damage to the commercial properties of Therefore, since the internal temperature of the second chamber CB2 and the internal temperature of the test chamber TC are different from each other, the opening/closing door DR for opening and closing the second chamber CB2 and the test chamber TC must be provided. Similarly, the test tray TT is transferred inside the second chamber CB2.

The second picking device GU2 unloads the semiconductor devices in the test tray TT that are on from the second chamber CB2 to the UNLOADING POSITION UP, classifies them by test grade, and loads them into an empty customer tray. . Similarly, the second picking device GU2 may be configured as a single pick-and-place device, or may include a plurality of pick-and-place devices and a sorting table, as referred to in Korean Patent Laid-Open No. 10-2007-0079223.

The plurality of temperature controllers TR1 to TR6 control the internal temperatures of the first chamber CB1 , the test chamber TC, and the second chamber CB2 . Here, since the inside of the test chamber (TC) is directly related to the temperature condition of the semiconductor device being tested, it is necessary to quickly suppress the temperature change that occurs during the test while precise temperature control is required. is needed

The controller CU controls the components that need to be controlled among the above-mentioned respective components.

Meanwhile, since the usage environment of the semiconductor device is diverse, the test temperature condition may be a low temperature (eg -40°C) or a high temperature (eg 90°C). Therefore, there are cases in which a high-temperature test must be performed after the low-temperature test, or a low-temperature test must be performed after the high-temperature test. For example, the inside of the first chamber (CB1) is adjusted to a temperature of -40 degrees, and the inside of the second chamber (CB2) is adjusted to a temperature of 70 to 80 degrees. A high-temperature test may be required. In this case, the internal temperatures of the first chamber CB1 and the test chamber TC must be adjusted to 90 degrees, and the internal temperatures of the second chamber CB2 must be decreased. At this time, since it takes about 2 hours to raise the internal temperature of the first chamber CB1 from -40 to 90 degrees, the standby time of the test handler TH is increased, and thus the operation rate and processing capacity are reduced.

Therefore, the applicant of the present invention, through the Republic of Korea Patent Application No. 10-2014-0025058 (hereinafter referred to as 'prior art'), the roles of the first picking device (PU1) and the second picking device (PU2) and the first chamber ( By reversing the roles of CB1) and the second chamber (CB2) and reversing the circulation direction of the test tray (TT), the existing temperature environment of the first chamber (CB1) and the second chamber (CB2) can be utilized. technology has been proposed.

According to the prior art, since the test mode is changed quickly, the operation rate of the test handler TH can be greatly improved.

However, even according to the prior art, the temperature environment of the test chamber TC cannot be used as it is when the test mode is switched. Therefore, the temperature environment inside the test chamber TC must be switched.

The internal space of the test chamber TC is smaller than the internal space of the first chamber CB1 or the second chamber CB2, and since several temperature controllers TR3 to TR6 are provided, the internal space of the test chamber TC The temperature change of the air in the air can be achieved in a relatively short time.

However, among the components constituting the pressurization device, the metal components located in the inner space of the test chamber (TC) serve to increase the test mode conversion time in the following respects.

First, even if the internal air of the test chamber TC is converted to the test environment condition, metallic components may not meet the test environment condition. In this case, in particular, the temperature of the semiconductor device may be out of the range of the test temperature condition by the pusher in contact with the semiconductor device among the components. Therefore, it is necessary to have a waiting time for the temperature of the components to be converted to the test environment condition by the internal air of the test chamber (TC) converted to the test environment condition.

Second, since the components are made of metal materials with high specific heat, the waiting time for changing the temperature of the components by the internal air of the test chamber (TC) is longer.

Of course, the above-mentioned problem also occurs in the existing test handler in which the test tray circulates in only one direction.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a technology capable of rapidly changing the temperature of the metal components located in the inner space of the test chamber among the components constituting the pressurization device.

According to an aspect of the present invention, there is provided a pressurizing device for a test handler for a test handler, comprising: a match plate having a pusher that is aligned with a test tray and presses semiconductor devices loaded on the test tray when aligned; an installation plate on which the match plate is installed; a driving source for moving the installation plate forward or backward so that the match plate fits evenly on the test tray or releases the alignment; and a heat exchange plate for exchanging heat with the installation plate. Including, the driving source makes contact or release of the contact between the installation plate and the heat exchange plate when heat exchange or conversion of a thermal state.

The heat exchange plate may include a body portion in surface contact with the installation plate; a protruding portion, at least a portion of which protrudes forward from the body portion, to contact the match plate when the installation plate and the heat exchange plate come into contact; Including, the installation plate is formed with a through hole through which the protruding portion can pass.

The match plate may include: the pusher; an installation frame detachably coupled to the installation plate, the pusher being installed so as to move forward and backward in the forward and backward directions; and an elastic member for restoring the pusher pushed backward while pressing the semiconductor device when the pressure of the semiconductor device is released. Including, the protruding portion is in contact with the pusher or the contact is released.

The match plate enables the pusher to be installed to be pushed forward by the protrusion when the protrusion and the pusher come into contact, and is pushed forward when the contact between the protrusion and the pusher is released. a restorer for restoring the pusher; further includes

The restorer, a movable plate movable in the front-rear direction; and a restoring member for applying an elastic force to the moving plate toward the installation frame, wherein the elastic member elastically supports the pusher with respect to the moving plate.

A match plate for a test handler according to the present invention for achieving the above object includes: a pusher for pressing semiconductor devices loaded on a test tray; an installation frame in which the pusher is installed to move forward and backward in the forward and backward directions; an elastic member for restoring the pusher pushed backward while pressing the semiconductor device when the pressure of the semiconductor device is released; and a restorer that enables the pusher to be pushed forward by an external force applied from the rear, and restores the pusher to the rear when the external force is removed. includes

The restorer, a movable plate movable in the front-rear direction; and a restoring member for applying an elastic force to the moving plate toward the installation frame. Including, the elastic member elastically supports the pusher with respect to the moving plate.

According to the present invention as described above, there is an effect that the operation rate of the test handler can be increased because the temperature of the components located in the internal space of the test chamber is rapidly changed while forming the pressurizing device.

1 is a conceptual plan view of a general test handler.
2 is a schematic side cross-sectional view of a pressurizing device for a test handler according to the present invention.
Fig. 3 is an excerpt from part A of Fig. 2;
4 to 6 are reference views for explaining the operation of the pressing device of FIG.

Hereinafter, preferred embodiments according to the present invention as described above will be described with reference to the accompanying drawings.

For reference, overlapping descriptions are omitted or compressed as much as possible for the sake of brevity of description. In addition, in the accompanying drawings, overlapping reference numerals for the same components are omitted as much as possible, and the direction in which the semiconductor element is positioned with respect to the pressurizing device is defined as forward and the opposite direction is defined as rear.

2 is a schematic side cross-sectional view of a pressing device for a test handler (PU, hereinafter abbreviated as 'pressing device') according to an embodiment of the present invention, and FIG. 3 is an enlarged view of part A of FIG. is an enlarged view.

As shown in FIG. 2 , the pressing device PU according to the present embodiment includes a match plate 100 , an installation plate 200 , a driving source 300 , a heat exchange plate 400 , and a duct 500 .

The match plate 100 is aligned with the test tray, and when aligned, presses the semiconductor devices loaded on the test tray. To this end, the match plate 100 includes a plurality of pushers 110 , an installation frame 120 , a first restoration spring 130 , and a restoration unit 140 .

When the pusher 110 is pressed, the front surface (PF, which is the end surface of the side facing the semiconductor element) is in contact with the semiconductor element D seated on the insert TI of the test tray, and the semiconductor element D ) to the test socket side of the tester. And the pusher 110 is installed so as to move forward relatively in the front-rear direction with respect to the installation frame 120 . The pusher 110 includes a pressing portion 111 , an extended portion 112 , and a guide pin 113 .

The pressing part 111 is a part for pressing the semiconductor device D seated on the insert TI of the test tray. That is, during the pressing operation, the front surface PF of the pressing portion 111 is in contact with the semiconductor device D. As shown in FIG.

The expanded portion 112 has a perimeter larger than that of the pressing portion 111 . The extended portion 112 is in contact with one surface (a surface facing the pusher) of the insert TI when a pressing operation is performed in a state in which the semiconductor device D is not seated on the insert TI. Accordingly, the front surface PF of the pressing part 111 is prevented from directly contacting the test socket of the tester.

The guide pin 113 guides the front surface PF of the pressing part 111 to precisely contact the semiconductor device D.

In addition, the pusher 110 is formed with an air passage hole 114 in the front-rear direction. The air for temperature control coming from the duct 500 through the air passage hole 114 is injected into the semiconductor element pressurized by the front surface PF of the pusher 110 .

The installation frame 120 is detachably coupled to the installation plate 200 , and the pusher 110 is installed to move forward and backward in the forward and backward directions. To this end, an installation hole 121 into which the rear end of the pusher 110 can be inserted is formed in the installation frame 120 . In addition, the installation frame 120 has an installation protrusion 122 for installing the second restoration spring 142 of the restoration unit 140 to be described later. Here, the installation protrusion 122 may be in the form of a bolt.

The first restoration spring 130 is ultimately provided as an elastic member for elastically supporting the pusher 110 with respect to the installation frame 110 . The first restoring spring 130 applies an elastic force to the pusher 110 in the forward direction. Therefore, the pusher 110 pushed backward while pressing the semiconductor element D functions to restore the original position by moving the pusher 110 forward when the pressurization of the semiconductor element D is released. The first restoration spring 130 may be provided as a coil spring.

The restorer 140 makes it possible to be installed in the installation frame 120 so that the pusher 110 can be pushed forward when the temperature is switched according to the change of the test mode, and when the temperature switching operation is finished, it is moved forward. The pushed pusher 110 is restored to its original position. To this end, the restoration unit 140 includes a moving plate 141 and a second restoration spring 142 .

The moving plate 141 is movable in the front-rear direction, and an insertion hole 141a into which the middle portion of the pusher 110 can be inserted is formed. The first restoration spring 130 mentioned above elastically supports the pusher 110 with respect to the moving plate 141, but the semiconductor by the pusher 110 in a state in which the installation frame 120 and the moving plate 141 are in close contact. Since the pressing operation of the element (D) is made, ultimately, the pusher 110 is elastically supported with respect to the installation frame 120 .

The second restoration spring 142 is installed and maintained by the installation protrusion 122 , and applies an elastic force to the rearward of the moving plate 141 . Therefore, as will be described later, by moving the moving plate 141 and the pusher 110 moved forward during the temperature change to the rear after the temperature change is finished, it functions as a restoring member to restore the original position. The second restoration spring 142 may be a coil spring.

The installation plate 200 is provided to be movable in the front-rear direction. The installation plate 200 has support rails 210 that can support both ends of the match plate 100 . Since both ends of the match plate 100 remain inserted into the rail grooves RS of the support rail 210 , the match plate 100 can be stably supported and coupled to the installation plate 200 . Of course, when the operator pulls or pushes the match plate 100 from the side for riding or mounting the match plate 100 , the support rail RS functions as a guide rail. In addition, a through hole 220 through which the protruding portion 420 of the heat exchange plate 400 to be described later can pass is formed in the installation plate 200 at a position corresponding to the pusher 100 .

The driving source 300 moves the installation plate 200 in the original position forward or from the front to the rear in the normal position, so that the match plate 100 coupled to the installation plate 200 is aligned with the test tray. Put it on or remove what fits neatly. Accordingly, the pusher 110 of the match plate 100 presses or releases the pressurization of the semiconductor device D loaded on the insert TI of the test tray. In addition, the driving source 300 causes the installation plate 200 to come into contact with the heat exchange plate 400 or release the contact by moving the installation plate 200 in a fixed position to the rear or from the rear to the front fixed position. . To this end, the front end of the drive shaft 310 of the drive source 300 is coupled to the installation plate 200 .

The heat exchange plate 400 is provided to change the temperature of the match plate 100 according to the change of the test mode. To this end, the heat exchange plate 400 includes a body portion 410 and a protruding portion 420 .

The body portion 410 has a front surface in contact with the rear surface of the installation plate 200 when the installation plate 200 moves backward from the original position. The body portion 410 has a heater 411 for generating high-temperature heat. In addition, the body portion 410 is formed with a cooling passage 412 through which a low-temperature refrigerant supplied by a chiller (not shown) can flow. Therefore, when the heater 411 operates, the body portion 410 is in a high temperature state, and when the refrigerant flows into the cooling passage 412 , the body portion 410 is in a low temperature state.

The protruding portion 420 is installed such that the front end portion protrudes forward from the body portion 410 . The front end portion of the protruding portion 420 may be inserted into the through hole 220 of the installation plate 200 to be in contact with the rear surface of the pusher 110 . In the present embodiment, the protruding portion 420 is installed in the body portion 410 in the structure of a pin, but depending on the implementation, the protruding portion may be integrally formed to protrude from the body portion. In addition, the protrusion part 420 is formed with an air supply hole 421 through which the temperature control air coming from the duct 500 can be supplied to the rear surface of the pusher (110).

The duct 500 is provided to supply air for temperature control coming from the temperature control unit, not shown, to the semiconductor device through the air supply hole 421 and the air passage hole 114 , and corresponds to the air supply hole 421 . An air injection hole 510 is formed. Therefore, the air supplied from the temperature control unit is injected through the air injection hole 510 inside the duct, passes through the air supply hole 421 and the air passage hole 114 sequentially, and then is injected into the semiconductor device (D). do. Then, the air injected to the semiconductor device D is sucked into the temperature control unit from the inside of the test chamber and moves along the circulation path supplied to the duct 500 after the temperature is adjusted. For reference, in order to minimize exposure of air for temperature control between the installation plate 200 and the heat exchange plate 400 so that the air flow is properly made, the installation plate 200 and the heat exchange plate 400 are installed outside the installation plate ( It is preferable to include a blocking member 600 coupled to the installation plate 200 and moving together with the installation plate 200 and a sealing member 700 for sealing between the blocking member 600 and the heat exchange plate 400 .

Next, the operation of the pressing device PU according to the present embodiment as described above will be described.

<Pressure operation>

3 is a state before the current semiconductor device D is tested. In the state of FIG. 3 , the driving source 300 moves the match plate 100 forward by pushing the installation plate 200 in a fixed position forward. Accordingly, as shown in FIG. 4 , the front surface of the pusher 110 contacts the semiconductor device D to press the semiconductor device D to the test socket of the tester. Accordingly, the semiconductor device D and the test socket are electrically connected to each other so that the test can be performed. When the subsequent test is finished, the state of FIG. 3 is returned. Referring to FIGS. 3 and 4 , it can be seen that the rear surface of the moving plate 141 moves forward and backward integrally with the installation frame 120 in a state in close contact with the front surface of the installation frame 120 . Of course, as shown in FIG. 4, during the pressing operation, the pusher 110 is pushed relatively backward with respect to the moving plate 141 and the installation frame 120 by the reaction of the semiconductor element D, and when the pressing operation is released, the 1 The pusher 110 is restored to its original position with respect to the moving plate 141 and the installation frame 120 by the action of the restoration spring 130 .

<Heat exchange operation>

When the insert TI of the test tray is removed in FIG. 3, it may be in a state before heat exchange. In order to perform the heat exchange operation according to the change of the test mode, the driving source operates in the state of FIG. 3 to move the installation plate 200 rearward to the state of FIG. 5 .

5, in a state in which the installation plate 200 is in surface contact with the body portion 410 of the heat exchange plate 400, heat is supplied by conduction according to the state of the body portion 410 (high temperature state or low temperature state). or receive cold air. Therefore, the temperature of the installation plate 200 is rapidly converted to the required temperature according to the test mode conversion.

And the protruding portion 420 of the heat exchange plate 400 is in contact with the rear surface of the pusher 110 while passing through the through hole 220 of the installation plate (200). Therefore, the temperature of the pusher 110 is also rapidly converted to the required temperature according to the test mode conversion by conduction.

Meanwhile, in the present embodiment, the protrusion portion of the protrusion portion 420 is taken longer by about 2 mm in consideration of the manufacturing tolerance of each configuration.

Ideally, it is preferable that the front surface of the protruding portion 420 and the rear surface of the pusher 110 are designed to precisely contact by the rear movement of the installation plate 200 . However, even if the installation plate 200 moves backward as in the exaggerated view of FIG. 6 due to manufacturing tolerance or fine bending due to thermal deformation, the front surfaces of all the protrusions 420 may not contact the rear surfaces of the pushers 110. there is. That is, even when some of the protruding parts 420 and the pusher 110 are in contact with each other, the remaining some of the protruding parts 420 and the pusher 110 may not contact each other or may not completely contact each other ( See part B of FIG. 6). In this case, the temperature conversion of the pusher 110 that is not in contact with the protrusion 420 may be relatively slow. Therefore, by taking the protruding portion to protrude longer than the ideal length by about 2 mm, the front surfaces of the protruding portions 420 are all in contact with the rear surfaces of the pushers 110 . For this reason, some pushers 110 may be pushed forward by the protrusions 420 as shown in FIG. 5 . In this case, the pusher 110 and the moving plate 141 are pushed forward relative to the installation frame 120 while the second restoration spring 142 is compressed. At this time, the moving plate 141 is spaced apart from the installation frame 120 . Of course, when the switching operation of the test mode is finished, the moving plate 141 and the pusher 110 return to their original positions as shown in FIG. 3 .

For reference, in the above-described embodiment, the installation plate 200 has a structure in contact with the heat exchange plate 400 by moving in the front-rear direction, but in some implementations, by having a separate driving source capable of moving the heat exchange plate. It may have a structure in which the installation plate and the heat exchange plate are in contact by the movement of the heat exchange plate.

In addition, the match plate 100 having a unique structure according to the present invention can be applied in addition to heat exchange technology.

Therefore, the detailed description of the present invention has been made by the embodiments with reference to the accompanying drawings, but since the above-described embodiments have only been described with preferred examples of the present invention, it is understood that the present invention is limited only to the above embodiments. It should not be done, and the scope of the present invention should be understood as the following claims and their equivalent concepts.

TU : Pressurizing device for test handler
100: match plate
110: pusher 120: installation frame
130: first restoration spring
140: restorer
141: moving plate 142: second restoration spring
200: installation plate
220: through hole
300: drive source
400: heat exchange plate
410: body part 420: protruding part

Claims (7)

a match plate that is aligned with the test tray and has a pusher that presses the semiconductor devices loaded on the test tray when aligned;
an installation plate on which the match plate is installed;
a driving source for moving the installation plate forward or backward so that the match plate fits evenly on the test tray or releases the alignment; and
a heat exchange plate for heat exchange with the installation plate; including,
The driving source makes contact or release of the contact between the installation plate and the heat exchange plate during heat exchange or conversion of a thermal state,
The heat exchange plate,
a body portion in surface contact with the installation plate;
a protruding portion, at least a portion of which protrudes forward from the body portion, to contact the match plate when the installation plate and the heat exchange plate come into contact; includes,
The installation plate, characterized in that the through-hole through which the protrusion part can pass is formed.
Pressurizing device for test handler. According to claim 1,
The match plate is
the pusher;
an installation frame detachably coupled to the installation plate, the pusher being installed so as to move forward and backward in the forward and backward directions; and
an elastic member for restoring the pusher pushed backward while pressing the semiconductor device when the pressure of the semiconductor device is released; including,
The protruding portion is in contact with the pusher, characterized in that the contact is released
Pressurizing device for test handler. 3. The method of claim 2,
The match plate is
It enables the pusher to be installed so as to be pushed forward by the protrusion when the protrusion and the pusher come into contact, and restores the pusher pushed forward when the contact between the protrusion and the pusher is released restorer; characterized in that it further comprises
Pressurizing device for test handler. 4. The method of claim 3,
The restorer,
Moving plate movable in the forward and backward directions; and
and a restoration member for applying an elastic force to the moving plate toward the installation frame.
wherein the elastic member elastically supports the pusher with respect to the moving plate
Pressurizing device for test handler. a pusher for pressing the semiconductor devices loaded on the test tray;
an installation frame in which the pusher is installed to move forward and backward in the forward and backward directions;
an elastic member for restoring the pusher pushed backward while pressing the semiconductor device when the pressure of the semiconductor device is released; and
a restorer that enables the pusher to be pushed forward by an external force applied from the rear, and restores the pusher to the rear when the external force is removed; characterized by comprising
Matchplate for test handlers. 6. The method of claim 5,
The restorer,
Moving plate movable in the forward and backward directions; and
a restoring member for applying an elastic force to the moving plate toward the installation frame; including,
wherein the elastic member elastically supports the pusher with respect to the moving plate
Matchplate for test handlers. delete

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