KR20160084190A - Pushing apparatus and match plate for test handler - Google Patents

Abstract

The present invention relates to a pressurizing device and a match plate for a test handler. According to the present invention, the pressurizing device comprises: a match plate evenly matched with a test tray and including a pusher to pressurize semiconductor devices loaded on the test tray when the match plate is evenly matched with the test tray; an installation plate in which the match plate is installed; a driving source to evenly match the match plate with the test tray or to release matching between the match plate and the test tray by moving the installation plate to a front side or a rear side; and a heat exchanging board to exchange a heat with the installation plate. The driving source connects or disconnects the installation plate and the heat exchanging board when the heat is exchanged or the thermal state is changed. According to the present invention, the operation rate of the test handler is increased by reducing a change time which is increased by compositions of a metal material in changing a test mode.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a pressure handler for a test handler,

The present invention relates to a test handler that is supported for testing of produced semiconductor devices. In particular, the present invention relates to a pressing device for pressing or supporting a semiconductor device toward a tester.

The test handler is used to test semiconductor devices manufactured through a predetermined manufacturing process.

The test handler moves the semiconductor devices from the customer tray to the test tray and supports the semiconductor devices loaded in the test tray to be tested by a tester at the same time, According to the result, semiconductor devices are classified into classes and moved from the test tray to the customer tray.

The above-mentioned test tray refers to a position where a semiconductor device is loaded into a test tray (hereinafter referred to as a 'loading position'), a position where a semiconductor device loaded on a test tray is electrically connected to a tester ), The semiconductor device after the test is cycled through a certain circulation path leading to the loading position again via a position where the semiconductor device is unloaded from the test tray (hereinafter referred to as "unloading position").

Generally, the test handler has a process of applying a thermal stimulus (high temperature or low temperature) to a semiconductor device in consideration of a use environment of the semiconductor device, and then removing a thermal stimulus applied from the semiconductor device when the test is completed. At this time, the process of applying or removing the thermal stimulus to the semiconductor device is performed on the circulation path of the test tray.

Figure 1 is a conceptual top view of a conventional test handler (TH).

The test handler TH includes a test tray TT, a first picking device GU1, a first chamber CB1, a test chamber TC, a pressurizing device PU, a second chamber CB2, (GU2), a plurality of temperature regulators (TR1 to TR6) and a controller (CU).

A plurality of semiconductor elements can be loaded in the test tray TT as shown in Korean Registered Utility Model No. 20-0389824, and circulated along a circulation path C defined by a plurality of conveyors (not shown) .

The first picking device GU1 loads a semiconductor device to be tested, which is loaded in a customer tray, into a test tray TT in a loading position LP. The first picking device GU1 may be constituted by a pick-and-place device alone as disclosed in Korean Utility Model Publication No. 20-2010-0012620, but as described in Korean Patent Publication No. 10-2007-0077905, Device and an activating loading table or the like.

The first chamber CB1 is provided for applying a thermal stimulus in advance before testing the semiconductor device loaded in the test tray TT according to the test temperature condition. In other words, the semiconductor device is pre-assimilated to the temperature inside the first chamber CB1 before going to the test position (TP: TEST POSITION). Thus, the flow of the whole logistics is accelerated and the processing capacity is improved. Here, the test tray TT is conveyed inside the first chamber CB1.

The test chamber TC is provided for testing the semiconductor device in the test tray TT which has been subjected to thermal stimulation in the first chamber CB1 and then transferred to the test position TP. The interior of the test chamber TC is interconnected because the thermal state of the interior of the first chamber CB1 is always similar. For reference, the tester TESTER is coupled to the window side of the test chamber TC.

The pressurizing device PU presses the semiconductor element in the test tray TT in the test chamber TC toward the tester TESTER side (see, for example, Korean Patent Laid-Open No. 10-2005-0055685). As a result, the semiconductor element in the test tray TT is electrically connected to the tester TESTER.

The second chamber CB2 is provided to remove thermal stimuli from the semiconductor elements in the test tray TT that have been transferred from the test chamber TC. The reason for configuring the second chamber CB2 in this manner is that when the tested semiconductor device is unloaded from the test tray TT, a normal unloading operation is performed and the second picking device GU2 is damaged, In order to prevent the deterioration of the merchantability of the product. Therefore, since the internal temperature of the second chamber CB2 and the internal temperature of the test chamber TC are different from each other, the opening and closing door DR for opening and closing the second chamber CB2 and the test chamber TC must be provided. Likewise, the test tray TT is conveyed inside the second chamber CB2.

The second picking device GU2 is categorized according to the test grade while unloading the semiconductor elements in the on test tray TT in the unloading position (UP: UNLOADING POSITION) in the second chamber CB2 and loaded into the empty customer tray . Likewise, the second picking device GU2 may be constituted by a pick-and-place device alone, but may also be constituted by a plurality of pick-and-place devices, a sorting table, and the like as described in Korean Patent Laid-Open No. 10-2007-0079223.

The plurality of temperature regulators TR1 to TR6 regulate the temperatures inside the first chamber CB1, the test chamber TC and the second chamber CB2. Since the inside of the test chamber TC is directly related to the temperature condition of the semiconductor device to be tested, it is necessary to perform precise temperature control while quickly suppressing the temperature change that occurs during the test. Therefore, the temperature regulators TR3 to TR6, .

The controller (CU) controls the configurations requiring control among the above-mentioned respective configurations.

On the other hand, since the semiconductor devices are used in various environments, the test temperature condition may be a low temperature (for example, -40 degrees) or a high temperature (for example, 90 degrees). Therefore, it is necessary to conduct the high temperature test after the low temperature test, or to perform the low temperature test after the high temperature test. For example, the inside of the first chamber CB1 is controlled at a temperature of -40 degrees, the inside of the second chamber CB2 is controlled at a temperature of 70 to 80 degrees, a low temperature test is performed, High temperature testing may be required. In this case, the internal temperature of the first chamber CB1 and the test chamber TC must be adjusted to 90 degrees, and the internal temperature of the second chamber CB2 must be lowered. At this time, it takes about 2 hours to raise the internal temperature of the first chamber CB1 from -40 to 90 degrees, so that the waiting time of the test handler TH becomes longer and the operation rate and the processing capacity are lowered.

Accordingly, the applicant of the present invention has found that the role of the first picking device PU1 and the second picking device PU2 and the function of the first chamber PU2 are controlled through the Korean Patent Application No. 10-2014-0025058 The first chamber CB1 and the second chamber CB2 can be switched to each other and the circulating direction of the test tray TT can be reversed to utilize the temperature environment of the existing first chamber CB1 and the second chamber CB2 Technology.

According to the prior art, since the test mode is switched quickly, the operation rate of the test handler TH can be greatly improved.

However, even in the prior art, the temperature environment of the test chamber TC can not be used as it is when the test mode is switched. Therefore, the temperature environment inside the test chamber (TC) must be switched.

Since the internal space of the test chamber TC is smaller than the internal space of the first chamber CB1 and the second chamber CB2 and the plurality of temperature regulators TR3 to TR6 are provided, The temperature change of the air in the air can be achieved within a relatively short time.

However, among the components constituting the pressurizing device, the metallic components located in the internal space of the test chamber TC serve to increase the switching time of the test mode in the following points.

First, even if the internal air of the test chamber (TC) is converted to the test environment condition, the metallic components may not meet the test environment conditions. In this case, the temperature of the semiconductor element may be out of the range of the test temperature condition, particularly by the pusher in contact with the semiconductor element among the components. Therefore, the internal air of the test chamber (TC) converted to the test environment condition must have a waiting time for the temperature of the components to be converted to the test environment condition.

Second, since the components are made of a metal material having a large specific heat, the waiting time for changing the temperature of the components by the internal air of the test chamber (TC) becomes longer.

Of course, the above problem also occurs with existing test handlers where test trays are rotated in one direction only.

It is an object of the present invention to provide a technique in which the temperature conversion can be rapidly performed on the metallic components located in the internal space of the test chamber among the components constituting the pressurizing apparatus.

In order to accomplish the above object, a pressure device for a test handler according to the present invention includes: a match plate having a pusher that presses the semiconductor elements loaded on a test tray, the match plate being aligned with the test tray; A mounting plate on which the match plate is installed; A driving source that aligns or unequals the match plate to the test tray by moving the mounting plate forward or rearward; And a heat exchange plate for heat exchange with the installation plate; Wherein the driving source brings the mounting plate and the heat exchange plate into contact with each other or releases the contact at the time of heat exchange or switching of the thermal state.

Wherein the heat exchange plate includes: a body portion in surface contact with the mounting plate; A protruding portion at least a portion protruding forward from the body portion to contact the match plate when the mounting plate and the heat exchange plate contact each other; And a through hole through which the protruding portion can pass is formed in the mounting plate.

Wherein the match plate comprises: a pusher; A mounting frame detachably coupled to the mounting plate, the mounting frame being installed to be movable forward and backward; And an elastic member for restoring the pusher pushed rearward while pressing the semiconductor element when the pressing of the semiconductor element is released; Wherein the projecting portion contacts or is disengaged from the pusher.

Wherein the match plate allows the pusher to be pushed forward by the projecting portion when the projecting portion and the pusher come into contact, and when the contact of the projecting portion and the pusher is released, A restorer for restoring the pusher; .

The restorer includes: a moving plate movable in the front-rear direction; And a restoring member for applying an elastic force to the moving plate toward the mounting frame, wherein the elastic member elastically supports the pusher against the moving plate.

According to an aspect of the present invention, there is provided a match plate for a test handler, including: a pusher for pressing semiconductor devices loaded on a test tray; An installation frame in which the pusher is installed so as to be movable forward and backward; An elastic member for restoring the pusher pushed rearward while pressing the semiconductor element when the pressing of the semiconductor element is released; And a restorer that allows the pusher to be pushed forward by an external force applied from the rear and restores the pusher backward when an external force is removed; .

The restorer includes: a moving plate movable in the front-rear direction; And a restoring member for applying an elastic force to the moving plate toward the mounting frame side; And the elastic member elastically supports the pusher against the moving plate.

According to the present invention, the temperature of the components located in the inner space of the test chamber can be rapidly changed while forming the pressurizing device, thereby increasing the operating rate of the test handler.

Figure 1 is a conceptual top view of a generic test handler.
2 is a schematic side cross-sectional view of a pressure device for a test handler according to the present invention.
Fig. 3 is an excerpt from an A portion of Fig.
4 to 6 are reference views for explaining the operation of the pressurizing device of Fig.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

For the sake of brevity, redundant descriptions are omitted or compressed as much as possible. In the accompanying drawings, the redundant code representation for the same configuration is omitted as much as possible, and the direction in which the semiconductor device is positioned with respect to the pressure device is defined as forward and the opposite direction is defined as rearward.

FIG. 2 is a schematic side cross-sectional view of a pressurizing device (PU) for a test handler according to an embodiment of the present invention, and FIG. 3 is an enlarged view of a portion A of FIG. 2 Fig.

2, the pressing device PU according to the present embodiment includes a match plate 100, a mounting plate 200, a driving source 300, a heat exchange plate 400, and a duct 500.

The match plate 100 is aligned with the test tray and presses the semiconductor elements loaded onto the test tray when aligned. To this end, the match plate 100 includes a plurality of pushers 110, a mounting frame 120, a first restoring spring 130, and a restorer 140.

The pusher 110 is pressed against the semiconductor element D mounted on the insert TI of the test tray while the front surface PF of the pusher 110 is in contact with the semiconductor element D ) To the test socket side of the tester. The pusher 110 is installed to be relatively movable forward and backward with respect to the mounting frame 120. The pusher 110 includes a pressing portion 111, an extension portion 112, and a guide pin 113.

The pressing portion 111 is a portion for pressing the semiconductor element D that is seated on the insert TI of the test tray. That is, the front surface PF of the pressing portion 111 is brought into contact with the semiconductor element D in the pressing operation.

The extension portion 112 is extended around the pressing portion 111. This extended portion 112 is brought into contact with one surface (surface facing the pusher) of the insert TI when the pressing operation is performed in a state in which the semiconductor element D is not seated in the insert TI. Thereby preventing the front surface PF of the pressing portion 111 from directly contacting the test socket of the tester.

The guide pin 113 guides the front surface PF of the pressing portion 111 to make a precise contact with the semiconductor element D. [

Further, the pusher 110 is provided with an air passage hole 114 in the front-rear direction. The temperature control air from the duct 500 is injected through the air passage hole 114 into the semiconductor element which is pressed by the front face PF of the pusher 110. [

The mounting frame 120 is detachably coupled to the mounting plate 200, and the pusher 110 is installed to be movable forward and backward. To this end, a mounting hole 121 through which the rear end of the pusher 110 can be inserted is formed in the mounting frame 120. The mounting frame 120 also has mounting protrusions 122 for mounting the second restoring spring 142 of the restoring unit 140 which will be described later. The mounting protrusion 122 may be in the form of a bolt.

The first restoring spring 130 is ultimately provided as an elastic member for elastically supporting the pusher 110 with respect to the mounting frame 110. [ The first restoring spring 130 applies an elastic force to the pusher 110 forward. Therefore, the pusher 110, which is pushed backward while pressing the semiconductor element D, moves forward to release the pressing of the semiconductor element D, thereby restoring the pusher 110 to its original position. The first restoration spring 130 may be a coil spring.

The restorer 140 can be installed on the mounting frame 120 so that the pusher 110 can be pushed forward when the temperature is switched according to the change of the test mode. When the temperature switching operation is completed, Thereby returning the pushed pusher 110 to its original position. To this end, the restorer 140 includes a moving plate 141 and a second restoring spring 142.

The moving plate 141 is movable in forward and backward directions and has an insertion hole 141a into which a stop portion of the pusher 110 can be inserted. The first restoration spring 130 resiliently supports the pusher 110 with respect to the moving plate 141. The first restoring spring 130 elastically supports the pusher 110 in a state where the mounting frame 120 and the moving plate 141 are in close contact with each other, The pushing operation of the device D is performed so that the pusher 110 is elastically supported with respect to the mounting frame 120.

The second restoring spring 142 is installed and held by the mounting protrusion 122 and exerts an elastic force on the moving plate 141 rearward. Therefore, as described later, it functions as a restoring member that restores the original to the original position by moving the moving plate 141 and the pusher 110 moved forward after the temperature change, to the original position after the temperature change is completed. The second restoring spring 142 may be a coil spring.

The mounting plate 200 is movable in the front-rear direction. The mounting plate 200 has support rails 210 capable of supporting both ends of the match plate 100. [ The match plate 100 can be stably supported and attached to the mounting plate 200 because both ends of the match plate 100 are inserted into the rail groove RS of the support rail 210. [ Of course, the support rail RS functions as a guide rail when the operator pulls or pushes the match plate 100 at the side for riding or mounting the match plate 100. The through hole 220 through which the protrusion 420 of the heat exchange plate 400 to be described later passes is formed in the mounting plate 200 at a position corresponding to the pusher 100.

The driving source 300 moves the mounting plate 200 in the forward position to the forward position or the forward position to the rear position so that the match plate 100 coupled to the mounting plate 200 is aligned with the test tray Or release the one that matches. The pusher 110 of the match plate 100 presses or releases the semiconductor element D loaded on the insert TI of the test tray. In addition, the driving source 300 moves the mounting plate 200 in the forward position to the rear position or moves it from the rear position to the front position in the forward direction, so that the mounting plate 200 contacts or releases the heat exchange plate 400 . To this end, the front end of the driving shaft 310 of the driving source 300 is coupled to the mounting plate 200.

The heat exchange plate 400 is provided for switching the temperature of the match plate 100 according to the switching of the test mode. To this end, the heat exchange plate 400 includes a body portion 410 and a protrusion portion 420.

The body portion 410 is in surface contact with the rear surface of the mounting plate 200 when the mounting plate 200 moves from the right position to the rear position. The body portion 410 has a heater 411 for generating heat at a high temperature. In addition, the body portion 410 is formed with a cooling channel 412 through which a low-temperature refrigerant supplied by a chiller (not shown) can flow. Therefore, when the heater 411 is operated, the body portion 410 is in a high temperature state, and when the refrigerant flows into the cooling flow path 412, the body portion 410 is in a low temperature state.

The protruding portion 420 is installed so that the front end portion protrudes forward from the body portion 410. The front end portion of the protruding portion 420 may be inserted into the through hole 220 of the mounting plate 200 and be in contact with the rear surface of the pusher 110. In this embodiment, the protruding portion 420 is provided on the body portion 410 with a pin structure. However, the protruding portion may protrude integrally from the body portion. The protruding portion 420 is formed with an air supply hole 421 through which the temperature control air from the duct 500 can be supplied to the rear surface of the pusher 110.

The duct 500 is provided for supplying the temperature control air from the temperature regulating unit (not shown) to the semiconductor element via the air supply hole 421 and the air passage hole 114, An air injection hole 510 is formed. The air supplied from the temperature control unit is injected from the inside of the duct through the air injection hole 510 so as to sequentially pass through the air supply hole 421 and the air passage hole 114, do. The air injected into the semiconductor device (D) is sucked into the temperature control unit inside the test chamber and is moved along the circulation path supplied with the temperature after being adjusted to the duct (500). For the purpose of minimizing exposure of the temperature control air between the mounting plate 200 and the heat exchange plate 400 so that the air flow is appropriately performed, the mounting plate 200 and the mounting plate 400 And a sealing member 700 for sealing between the blocking member 600 and the heat exchange plate 400. The sealing member 600 may include a sealing member 600 that is coupled to the mounting plate 200 and moves together with the mounting plate 200.

Subsequently, the operation of the pressurizing device PU according to the present embodiment as described above will be described.

<Pressurizing operation>

3 shows a state before the test for the semiconductor element D is performed. In the state of FIG. 3, the driving source 300 moves the match plate 100 forward by pushing the mounting plate 200 in the forward position. Thus, as shown in FIG. 4, the front surface of the pusher 110 is brought into contact with the semiconductor element D, and the semiconductor element D is pressed against the test socket of the tester. Thus, the semiconductor device D and the test socket are electrically connected to each other so that the test can be performed. When the subsequent test is finished, the state returns to the state of FIG. 3 and 4, it can be seen that the rear surface of the moving plate 141 is in close contact with the front surface of the mounting frame 120, and moves back and forth integrally with the mounting frame 120. 4, the pusher 110 is pushed rearward relative to the moving plate 141 and the mounting frame 120 by the reaction of the semiconductor element D, and when the pressing operation is released, The pusher 110 is restored to its original position with respect to the moving plate 141 and the mounting frame 120 by the action of the one restoring spring 130. [

<Heat exchange operation>

Removal of the insert (TI) of the test tray in FIG. 3 may be the condition prior to heat exchange. In order to perform the heat exchange operation in accordance with the switching of the test mode, the driving source is operated in the state of FIG. 3 to move the mounting plate 200 backward, thereby bringing the state shown in FIG.

5, when the mounting plate 200 contacts the body 410 of the heat exchange plate 400, the heat is supplied by conduction according to the state of the body 410 (high temperature state or low temperature state) And receive cold air. Therefore, the temperature of the mounting plate 200 rapidly changes to the required temperature according to the test mode switching.

The protruding portion 420 of the heat exchange plate 400 is in contact with the rear surface of the pusher 110 while passing through the through hole 220 of the mounting plate 200. Accordingly, the temperature of the pusher 110 is rapidly switched to the required temperature according to the test mode switching by conduction.

On the other hand, in this embodiment, the protruding portion of the protruding portion 420 is taken longer by about 2 mm in view of manufacturing tolerances and the like of the respective structures.

Ideally, it is desirable that the front surface of the projecting portion 420 and the rear surface of the pusher 110 are designed to be in precise contact with each other by rearward movement of the mounting plate 200. However, even if the mounting plate 200 moves backward as shown in an exaggerated view of FIG. 6 due to manufacturing tolerances or thermal deformation, the entire surfaces of the protruding portions 420 may not contact the rear surface of the pushers 110 have. That is, even when the protrusions 420 and the pushers 110 are in contact with each other, the protrusions 420 and the pushers 110 may not be in contact with each other or may not be completely contacted with each other See part B of FIG. 6). In this case, the temperature change of the pusher 110 that is not in contact with the protruding portion 420 may be relatively slow. Therefore, the projecting portions are brought to protrude by about 2 mm longer than the ideal length so that the entire surfaces of the protruding portions 420 can be brought into contact with the rear surface of the pushers 110. For this reason, depending on the pushers 110, they can be pushed forward by the protruding portions 420 as in Fig. In this case, as the second restoring spring 142 is compressed, the pusher 110 and the moving plate 141 are pushed forward relative to the mounting frame 120. At this time, the moving plate 141 is spaced from the mounting frame 120. Of course, when the switching operation of the test mode is completed, the moving plate 141 and the pusher 110 return to their original positions as shown in FIG.

For reference, in the above-described embodiment, the mounting plate 200 has a structure in which the mounting plate 200 contacts the heat exchange plate 400 by moving in the forward and backward direction. However, according to the embodiment, there is provided a separate drive source capable of moving the heat exchange plate It may have a structure in which the installation plate and the heat exchange plate contact each other by the movement of the heat exchange plate.

Further, the match plate 100 having a unique structure according to the present invention is applicable to other than the heat exchange technique.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of illustration, And the scope of the present invention should be understood as the scope of the following claims and their equivalents.

TU: Pressure device for test handler
100: Match plate
110: pusher 120: installation frame
130: first restoration spring
140: Restore
141: moving plate 142: second restoring spring
200: mounting plate
220: through hole
300: driving source
400: Heat exchange plate
410: body part 420: protruding part

Claims (7)

A match plate having a pusher that aligns with the test tray and presses the semiconductor elements loaded in the test tray when aligned;
A mounting plate on which the match plate is installed;
A driving source that aligns or unequals the match plate to the test tray by moving the mounting plate forward or rearward; And
A heat exchange plate for heat exchange with the installation plate; / RTI &gt;
Characterized in that the drive source contacts or releases the mounting plate and the heat exchange plate at the time of heat exchange or switching of the thermal state
Pressurizing device for test handler. The method according to claim 1,
The heat exchanging plate may include:
A body portion in surface contact with the mounting plate;
A protruding portion at least a portion protruding forward from the body portion to contact the match plate when the mounting plate and the heat exchange plate contact each other; / RTI &gt;
And a through hole through which the protruding portion can pass is formed in the mounting plate
Pressurizing device for test handler. 3. The method of claim 2,
The match plate includes:
The pusher;
A mounting frame detachably coupled to the mounting plate, the mounting frame being installed to be movable forward and backward; And
An elastic member for restoring the pusher pushed rearward while pressing the semiconductor element when the pressing of the semiconductor element is released; Lt; / RTI &gt;
Characterized in that the projecting portion is in contact with or released from the pusher
Pressurizing device for test handler. The method of claim 3,
The match plate includes:
The pusher being configured to be pushed forward by the projecting portion when the projecting portion and the pusher come into contact with each other, and to restore the pusher pushed forward when the pushing portion is released from contact with the projecting portion Restorer; &Lt; RTI ID = 0.0 &gt;
Pressurizing device for test handler. 5. The method of claim 4,
The reconstructor includes:
A moving plate movable in the forward and backward directions; And
And a restoring member for applying an elastic force to the moving plate on the side of the mounting frame,
Characterized in that the elastic member elastically supports the pusher with respect to the moving plate
Pressurizing device for test handler. A pusher for pressing the semiconductor elements loaded in the test tray;
An installation frame in which the pusher is installed so as to be movable forward and backward;
An elastic member for restoring the pusher pushed rearward while pressing the semiconductor element when the pressing of the semiconductor element is released; And
A restorer that allows the pusher to be pushed forward by an external force applied from the rear and restores the pusher backward when an external force is removed; &Lt; RTI ID = 0.0 &gt;
Match plate for test handlers. The method according to claim 6,
The reconstructor includes:
A moving plate movable in the forward and backward directions; And
A restoring member for applying an elastic force to the moving plate toward the mounting frame; Lt; / RTI &gt;
Characterized in that the elastic member elastically supports the pusher with respect to the moving plate
Match plate for test handlers.

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