KR20130047204A - Pushing apparatus for test handler and test handler - Google Patents

Abstract

PURPOSE: A pushing device for a test handler is provided to control the pressure of the pusher by the air pressure so that the device has no need to replace an elastic member supporting the pusher even when a testing semiconductor device changes or the number of terminal which is electrically contacting with a tester side changes, thereby improving the availability ratio of the test handler. CONSTITUTION: A pushing device(700) is comprised of a pusher(710), an installation plate(720), first elastic members(731,732), a pressure adjustment(740), and a driving source. The pusher is prepared to contact with a semiconductor device(D) mounted on an insert(TI) of a test tray(TT) when operating, pressurizes the semiconductor device to a tester side, and is installed to be able to enter/exit the installation plate. The installation plate forms the installation holes(H) for installing the pusher. The first elastic members elastically support a base unit(711) of the pusher toward the installation plate. The pressure adjustment(740) controls the pressure applied to the semiconductor device through the pusher, and is comprised of a cylinder unit(741), an air pressure provider(742), a control device(743), an input unit(744).

Description

Pushing device for test handlers {PUSHING APPARATUS FOR TEST HANDLER AND TEST HANDLER}

The present invention relates to a pushing device of a test handler which is supported for testing a semiconductor device prior to shipping the produced semiconductor device.

The test handler supports a semiconductor device manufactured through a predetermined manufacturing process so that the semiconductor device can be tested by a tester. The test handler classifies semiconductor devices according to the test results and loads the semiconductor devices on a customer tray.

1 is a conceptual view of a general test handler 100 including a test handler according to the present invention as viewed in plan, the test handler 100 includes a test tray 110, a loading device 120, and a soak chamber 130. , SOAK CHAMBER), a test chamber 140, a test chamber 140, a pushing device 150, a desoak chamber 160, an unloading device 170, and the like.

As illustrated in FIG. 2, the test tray 110 has a plurality of inserts 111 on which the semiconductor element D can be seated, which is installed in a somewhat movable manner, and is closed by a plurality of transfer devices (not shown). Cycle along path (C).

The loading device 120 loads an untested semiconductor device loaded in a customer tray into a test tray at a loading position LP.

The soak chamber 130 is provided for preheating or precooling the semiconductor device loaded in the test tray 110 transferred from the loading position LP according to the test environment conditions before being tested. do.

The test chamber 140 is provided for testing a semiconductor device loaded in the test tray 110 that is preheated / precooled in the soak chamber 130 and then transferred to the test position (TP: TEST POSITION).

The pushing device 150 pushes the semiconductor device loaded in the test tray 110 in the test chamber 140 toward the tester TECK docked (coupled) to the test chamber 140. Is provided for electrically connecting. The present invention relates to such a pushing device 150, which will be described in more detail later.

The desock chamber 160 is provided to return the heated or cooled semiconductor device loaded in the test tray 110 transferred from the test chamber 140 to room temperature.

The unloading device 170 classifies the semiconductor devices loaded in the test tray 110 from the desock chamber 160 into the unloading position (UP) by class of test and unloads them into empty customer trays. )

As described above, the semiconductor device is loaded from the test position 110 to the soak chamber 120, the test chamber 130, the desock chamber 140, and the unloading position UP from the loading position LP. After circulating along the closed path (C) leading back to the loading position (LP).

The test handler 100 having the circulation path of the basic test tray as described above is an underhead docking type test handler and a test tray in which a test of the semiconductor device loaded while the test tray 110 is horizontal is performed. It is divided into a side docking type test handler in which the test of the semiconductor device loaded while the 110 is in a vertical state is performed. Therefore, in the case of the side docking test handler 100, the test tray in the horizontal state in which the loading of the semiconductor device is completed is converted to a vertical position, or the test tray in the vertical state is horizontally used for unloading the completed semiconductor device. One or two posture converting apparatus for converting a posture into a state should be provided.

Subsequently, the pushing device 150 related to the present invention will be described in more detail.

As shown in the schematic side view of FIG. 3, the general pushing device 150 configured in the conventional test handler 100 includes a match plate 50, a driving source 60, and the like.

The match plate 50 includes a plurality of pushers 51, a mounting plate 52, and the like.

The pusher 51 is a pressing part 51a that contacts the semiconductor element D seated on the insert 111 of the test tray 110, and a base part that contacts one surface (face facing the pusher) of the insert 111. The tip of the pressing portion 51a is guided so as to precisely contact the semiconductor element D seated in the loading groove 111b of the insert 111 by being inserted into the 51b and the guide hole 111a formed in the insert 111. In order to include a guide pin (51c) installed in the base portion (51b). For reference, one pusher 51 may be provided with one or more pressing parts according to the implementation, such as two pressing parts 51a or only one pressing part may be provided as shown in FIG. The pressing portion 51a and the base portion 51b may be integrally formed.

The mounting plate 52 is provided with a plurality of pushers 51 in a matrix form.

The drive source 60 may be provided with a cylinder or a motor. The driving source 60 is moved to a stationary test tray 110 after being moved on a non-rail (not shown, a rail to which the test tray moves) by moving the match plate 50 fixedly mounted on the guide rail (not shown). After the close contact, the test tray is continuously pushed to the tester side, thereby pushing the semiconductor device D seated on the insert 111 of the test tray to the tester side or the contact thereof is released. Here, the pressing unit 51a uniformly pushes the semiconductor device D when the semiconductor device is pushed in the opposite direction of the tester by the repulsive force of the terminal of the tester when the tester and the semiconductor device D contact each other. To support or pressurize. In general, the match plate 50 has a structure in which the pusher 51 is pushed by a force that the semiconductor device D repels a terminal (eg, pogo pin) of a test socket provided on a test board of a tester. For reference, in FIG. 3, the distance between the pusher 51, the test tray 110, and the tester TESTER is exaggerated.

Meanwhile, referring to FIGS. 2 and 4 to 6 of Publication No. 10-2009-0123441 (Invention: Matchplate for Electronic Component Inspection Supporting Device) registered and filed by the applicant, the pusher is installed with respect to the installation plate. It can be seen that the elastic member is elastically supported. The reason for this is that when the terminal of the semiconductor device (BGA type ball) and the pogo pin are in contact with each other, the pusher is elastically retractable with respect to the mounting plate, and thus the spring supporting the pogo pin or the pogo pin due to the excessive pressure of the pusher. This is to prevent damage to the back.

In general, the spring supporting the pogo pin is appropriate to maintain the repulsion by compressing 0.3mm when a constant pressing force is applied to the pogo pin.

In addition, the pusher of the pushing device must also support or press the semiconductor element on the opposite side of the pogo pin, the force that the repulsion against the semiconductor element in the pogo pin and the force that the pusher supports or press the semiconductor element should be appropriate. For example, the spring force supporting the pogo pin is 0.3 mm compressed and the repulsive force to rebound and the pusher are properly retracted (the pusher retracted to about 0.5 to 1.5 mm or 0.5 to 2.0 mm) (or It is preferable that the bearing force, hereinafter referred to collectively as the pressing force, is configured to balance and test can be performed in this state. Therefore, the elastic member of the pushing device must have an elastic modulus capable of maintaining such a state. If the elastic modulus of the elastic member is large, the pressing force by the pusher is excessive to cause the above problem (damage of the pogo pin or the spring supporting the pogo pin or the terminal of the semiconductor element), and if the elastic modulus of the elastic member is weak, Since the pressing force is weak, the contact between the terminals of the semiconductor device and the pogo pin may not be smoothly performed, and thus a normal test may not be performed.

However, the number of terminals is often changed due to the change of the semiconductor device to be tested, or the number of terminals electrically contacting the tester may be reduced or increased even when the semiconductor device is not changed. This prevents proper pressurization. For example, if a semiconductor device having 200 terminals is to be tested and a semiconductor device having 20 terminals is to be tested, an elastic member that has a pressing force of 200F is applied to one semiconductor device having 200 terminals and has 20 terminals. If applied to the semiconductor device as it is, excessive pressurization will be made. Therefore, when the type of semiconductor device to be tested or the number of terminals electrically contacting the tester is changed, the elastic member must be replaced with one having a modulus of elasticity corresponding thereto.

However, as described above, since a plurality of pushers are installed in the pushing device, the pushing device is very troublesome to replace the elastic member after the separation from the test handler. In addition, productivity is reduced due to a lot of work time due to replacement, and the elastic member must be prepared separately according to the semiconductor device. Alternate use may adversely affect the test results.

For reference, the above description only describes replacing the elastic member of the pushing device without considering replacement of the spring supporting the pogo pin. The reason is that in general, the springs of the pogo pins are relatively much larger than the elastic members of the pushing device (for example, regardless of the number of pogo pins (200 or 20), and the elastic members of the pushing device are at least one to one). 4), and it is relatively easy to replace.

Accordingly, it is an object of the present invention to provide a technique that does not require replacement of an elastic member of a pushing device even in a situation in which a semiconductor device to be tested is changed.

A pushing device for a test handler according to the present invention as described above comprises: a pusher for pressing or supporting a semiconductor element electrically connected to a tester; An installation plate on which a plurality of the pushers are installed; An elastic member elastically supporting the pusher with respect to the mounting plate; A pressure regulator provided to adjust a pressing force (including a supporting force) applied to the semiconductor device through the pusher; And a driving source providing a driving force for advancing and installing the mounting plate toward the semiconductor element. .

The pressing force regulator may vary the pressing force provided according to the number of terminals of the test socket contacting the terminals of the semiconductor device under test.

The pressing force regulator may include a cylinder unit provided to apply a pressing force applied to the semiconductor device through the pusher.

The pressing force regulator may include a pneumatic provider for providing pneumatic pressure to the cylinder unit side; And a control device provided to adjust the pneumatic pressure provided from the pneumatic provider to the cylinder unit side. As shown in FIG.

The pressure regulator includes an input device for inputting a user's command to the control device; As shown in FIG.

The cylinder unit, the piston member for transmitting the pneumatic pressure provided from the pneumatic provider to the pusher; And a cylinder plate having a plurality of piston members installed therein. . ≪ / RTI >

The pusher may include a base part supported by the elastic member; And a pressing part installed at the base and having one end contacting the semiconductor device. It includes, The cylinder unit, Piston member for transmitting the pneumatic pressure provided from the pneumatic provider to the pressing unit; And a cylinder plate having a plurality of piston members installed therein. . ≪ / RTI >

The pusher may further include a second elastic member elastically supporting the pressing part to be able to move forward and backward with respect to the base element relative to the base.

The pressing unit, one end of the tip in contact with the semiconductor element; And a transmission member for transmitting the pressing force coming from the piston member to the tip. ≪ / RTI >

According to the present invention as described above, instead of replacing the elastic member only by adjusting the pneumatic pressure applied to the piston of the cylinder unit, there is no need to replace the elastic member, there is no occurrence of time and cost for replacement of the elastic member, ultimate As a result, the operation rate of the test handler can be improved.

1 is a conceptual plan view of a general test handler.
2 is a schematic diagram of a test tray for a general test handler.
3 is a schematic diagram for explaining a matching relationship between a match plate, a test tray, and a tester in a general test handler.
4 is a schematic side view of a pushing apparatus according to a first embodiment of the present invention.
5 and 6 are operational state diagrams of the pushing device of FIG.
7 is a schematic side view of a pushing apparatus according to a second embodiment of the present invention.
8 and 9 are operational state diagrams for the pushing device of FIG.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. For simplicity of description, redundant description is omitted or compressed as much as possible.

≪ Embodiment 1 >

4 is a schematic side view of a pushing device 400 according to a first embodiment of the present invention.

As shown in FIG. 4, the pushing device 400 according to the present embodiment includes a pusher 410, a mounting plate 420, elastic members 431 and 432, a pressure regulator 440, and a driving source (not shown). And the like.

The pusher 410 is in contact with the semiconductor device D whose tip (which is the end of the side facing the semiconductor device) is seated on the insert TI of the test tray TT when the pushing device 400 operates. At the same time, the semiconductor device D is provided to pressurize (or support, hereinafter referred to as pressing) toward the tester TESTER, and is installed to be able to move forward and backward with respect to the mounting plate 420. The pusher 410 in the present embodiment is provided integrally with the base portion and the pressing portion are integrally provided and has a guide pin (G).

The mounting plate 420 is supported by the mounting rail MR, and mounting holes H for mounting a plurality of pushers 410 (for example, 256) are formed. For reference, only one installation hole H is shown in the drawings and the rest is omitted.

The elastic members 431 and 432 are provided in pairs and are provided to elastically support the pusher 410 with respect to the mounting plate 420. The elastic members 431 and 432 may be provided with springs as shown in the drawing (however, one or two elastic members may be provided depending on the structure of the mounting plate and the pusher).

The pressing force regulator 440 is provided to adjust the pressing force applied to the semiconductor device D through the pusher 410, and includes a cylinder unit 441, a pneumatic provider 442, a controller 443, and an input device. 444 and the like.

The cylinder unit 441 includes a piston member 441a and a cylinder plate 441b.

The piston member 441a is provided to transfer the pneumatic pressure provided from the pneumatic provider 442 to the pusher 410 by moving forward and backward by pneumatic pressure. The piston member 441a is elastically supported in the direction opposite to the pusher 410 by the spring S. As shown in FIG.

The cylinder plate 441b is provided with a plurality of piston members 441a, and a plurality of pneumatic spaces A are formed for this purpose. As shown in FIG. 4, the piston member 441a is installed in the pneumatic space A. The pneumatic pressure from the pneumatic provider 442 is input to the pneumatic space A while pneumatic pressure is applied to the piston member 441a. You lose. Similarly, due to the limitations of the drawing, only one piston member 441a and the pneumatic space A are shown and the rest are omitted in the drawings.

Pneumatic provider 442 is provided to provide the required air pressure through the tube (T) to the cylinder unit 441 (more specifically, the pneumatic space of the cylinder plate).

The controller 443 is provided to adjust the pneumatic pressure provided from the pneumatic provider 442 to the cylinder unit 441 side. This control device 443 can be implemented simply by adding a function for controlling the pneumatic provider 442 to the control device provided in the existing test handler. In the separate storage space provided in the control device 443, data necessary for pneumatic control (for example, a calculation table for calculating a pneumatic value for each number of terminals or a number of terminals required for electrical contact with the tester side) Etc.) are stored.

The input device 444 is provided to the control device 443 for the user's operation command or data necessary for the control of the pneumatic provider 442 (eg, the number of pogo pins corresponding to one semiconductor element and one pogo pin). It is provided to input the elastic modulus of the corresponding spring).

The driving source applies a force to the cylinder plate 441b and ultimately provides a driving force for advancing and mounting the mounting plate 420 coupled with the cylinder plate 441b in the direction of the semiconductor element D, and may be provided as a motor or a cylinder. Can be. This drive source is omitted due to the limitations of the drawing because the function and the role of the drive source 60 described in the background art is the same.

 4 to 6, the operation of the pushing device 400 according to the first embodiment will be described.

First, the user inputs the number of terminals of the semiconductor device D to be contacted with the pogo pin P (the terminal of the test socket) in the test socket TS of the tester TESTER through the input device 444. The spring force corresponding to one pogo pin is not changed because it does not change when it is initially set, but it can be input if necessary.Also, even if the number of terminals of the semiconductor device is 200, the number of pogo pins used in the test is not 200. Since 200 or less are used depending on the test type and method, the value to be input here is not the number of terminals of one semiconductor element D, but the number of pogo pins P used when testing one semiconductor element D. Is preferred)

The controller 443 then determines the pneumatic value according to the number of input terminals (which may have an example of determining the pneumatic value in the table or calculating it by calculation). In determining the pneumatic value, although the elastic modulus of the elastic members 431 and 432 is small, it should be considered that the elastic force by the elastic members 431 and 432 also affects the pressing force of the pusher 410 to some extent. . That is, when the pneumatic value table is implemented to determine the pneumatic value, the experiment is to find the pneumatic value to create a table, or when implemented to determine the pneumatic value by calculation, the elastic modulus of the elastic members (431, 432) It should be adopted as a constant for calculating the pneumatic value.

Subsequently, as shown in FIG. 4 according to a full operation of the test handler, the semiconductor device D seated on the insert TI of the test tray TT is moved along the tray rail TR of the test tray TT. It is positioned between the pusher and the test socket TS by the movement.

In this state as shown in Fig. 4, the driving source is operated at this time, and as shown in Fig. 5, the mounting plate 420 is moved by the semiconductor element D side direction (the pusher and cylinder plate coupled to the mounting plate are also moved together). The tip of 410 is first in contact with the semiconductor device (D).

When the pusher 410 is further advanced to the TESTER side by the continuous operation of the driving source, as described in the background art, the pogo pin P retreats by about 0.3 mm and exerts a repulsive force on the semiconductor device D. Accordingly, as shown in FIG. 6, the elastic members 431 and 432 are compressed to a certain degree, so that the pusher 410 is retracted relative to the mounting plate 420 (actually, the forward movement interval of the pusher according to the continuous operation of the driving source). Because the forward movement interval of the mounting plate is greater). At this time, the piston member 441a is in the direction of the pusher 410 because the pneumatic provider 442 inputs the required pneumatic pressure to the pneumatic space A of the cylinder unit 441 under the control of the controller 443. By slightly advancing to support the rear end of the pusher 410 to prevent the excessive retraction of the pusher 410 consequently and to allow the pusher 410 to retreat only the appropriate degree required.

For convenience of description, the pneumatic providing by the pneumatic provider 442 is described as being made after the tip of the pusher 410 is in contact with the semiconductor element (D) in accordance with the operation of the drive source, it may be implemented as described It is also possible to implement pneumatics whenever the test handler is running. In other words, the pneumatic pressure is sufficient if the pogo pin (P) and the pusher 410 is input on the time when the balance of the force can be made in a state that the proper retreat in the opposite direction.

In addition, in the present description, the tip of the pusher 410 is first contacted with the semiconductor device D, but the mounting rail MR moves toward the test socket TS while pushing the tray rail TR, and the pusher 410 is moved. When the front end of the pusher 410 is supported by the piston member 441a and the semiconductor device is in contact with the pogo pin, the front end of the pusher 410 may support the semiconductor device not to be pushed beyond a predetermined depth.

In this embodiment, although the piston member 441a and the pneumatic controller 442 are applied to the pressure regulator 440, a motor and a motor controller may be applied in some cases.

Second Embodiment

7 is a schematic side view of a pushing device 700 according to a second embodiment of the present invention.

In the pushing device 700 according to the present embodiment, as shown in FIG. 7, the pusher 710, the mounting plate 720, the first elastic members 731 and 732, the pressure regulator 740, and the driving source (not shown). C) and the like.

The pusher 710 is in contact with the semiconductor device D whose tip (which is the end of the side facing the semiconductor device) is seated on the insert TI of the test tray TT when the pushing device 700 operates. While being provided to press the semiconductor device (D) to the tester (TESTER) side, it is installed to be retractable with respect to the mounting plate (720). The pusher 410 in this embodiment is comprised including the base part 711 which has the guide pin G, the press part 712, and the 2nd elastic members 713a and 713b.

The base portion 711 is elastically supported with respect to the mounting plate 720 by the first elastic members 731 and 732, and an installation space 711a and an installation space for installing the pressing portion 712 in the center thereof. The communication path 711b which communicates 711a to the back side pressure regulator 740 side is formed. And the rear end of the communication path 711b is extended.

The pressing unit 712 is composed of a tip 712a and a transmission member 712b.

The tip 712a is elastically supported by the second elastic members 713a and 713b and its tip is in contact with the semiconductor device D.

The front end of the transmission member 712b is coupled to the rear end of the tip 712a. And the extended rear end of the transmission member 712b is located at the extended rear end of the communication path 711b through the communication path 711b, so that the pressing part 712 is located on the semiconductor element D side as shown in FIG. It may be installed in the base portion 711 to prevent the deviation in the direction.

The second elastic members 713a and 713b are provided in pairs in the installation space 711a and are positioned on both sides of the communication path 711b to elastically support the tip 712a. The elastic modulus of the second elastic members 713a and 713b may be sufficient so that the pressing part 712 does not allow a relatively random flow (more specifically, random retreat) with respect to the base part 711.

The mounting plate 720 is provided with mounting holes H for installing the pusher 710.

The first elastic members 731 and 732 are provided to elastically support the base portion 711 of the pusher 710 with respect to the mounting plate 720.

The pressing force regulator 740 is provided to adjust the pressing force applied to the semiconductor device D through the pusher 710, and as in the first embodiment, the cylinder unit 741, the pneumatic provider 742, control Device 743, input device 744, and the like.

The cylinder unit 741 is comprised including the piston member 741a and the cylinder plate 741b.

The piston member 741a is provided to transfer the pneumatic pressure provided from the pneumatic provider 742 to the pressurizing portion 712 of the pusher 710 (more specifically, to the transmitting member of the pressurizing portion) by moving forward and backward by pneumatic pressure. do.

A plurality of piston members 741a are installed in the cylinder plate 741b, and a plurality of pneumatic spaces A are formed for this purpose. Here, the pneumatic space (A) may maintain an independent space for each piston member (741a) as in this embodiment, but depending on the implementation may be configured to communicate with each other pneumatic space. This may be determined by the number of pneumatic spaces, the flow rate to be supplied, and the reaction speed of the piston member 741a.

The pneumatic provider 742 is provided to provide the pneumatic pressure required to the cylinder unit 741 side.

The control device 743 is provided for adjusting the pneumatic pressure provided from the pneumatic provider 742 to the cylinder unit 741 side.

The input device 744 is provided for inputting a user's operation command or data necessary for controlling the pneumatic provider 742 to the control device 742.

The driving source is similarly omitted, and may be provided by a motor, a cylinder, or the like.

 Subsequently, an operation of the pushing device 700 according to the second embodiment will be described with reference to FIGS. 7 to 9.

The pneumatic value is determined by the user's input of information. For reference, in obtaining the pneumatic value, the elastic force by the first elastic members 731 and 732 and the second elastic members 713a and 713b should also be considered. The pneumatic value can also be determined by experiment. That is, as described in the background art, the pressure value when the pusher push amount is within a predetermined range is determined as the pressure value of the tested semiconductor device.

Subsequently, the semiconductor device D is positioned between the pusher 710 and the test socket TS as referred to in FIG. 7 according to the full operation of the test handler.

In the state as shown in FIG. 7, the driving source is operated to move the mounting plate 720 in the direction of the semiconductor element D, as shown in FIG. 8, so that the tip (more specifically, the tip of the tip) of the pusher 710 is semiconductor. It comes into contact with the element D first.

When the pusher 710 is further advanced to the tester side by the continuous operation of the driving source, the repulsive force is applied to the semiconductor device D while the pogo pin P retreats about 0.3 mm as described in the background art. Accordingly, the second elastic members 713a and 713b are compressed as shown in FIG. 6, so that the pressing part 712 is relatively retracted with respect to the installation plate 720. At this time, since the required pneumatic pressure is input into the pneumatic space A of the cylinder unit 741 as in the first embodiment, the pressurizing portion 712 is moved forward with the piston member 741a slightly toward the pusher 710 side. By supporting the rear end (more specifically, the rear end of the transmission member) in order to prevent the excessive retraction of the pressing portion 712 and to allow the pressing portion 712 to retreat only as much as required. For reference, the base portion 711 is also retreated relatively with respect to the installation plate 720, but because the degree is fine it was not represented on the drawing.

Here, the second elastic members 713a and 713b are designed to be relatively elastic with respect to the thickness of the semiconductor device D (the thickness of the packaged silicon). Initially, the height of the tip 712a is set based on the thinnest semiconductor device D among the given semiconductor devices D, and when testing a semiconductor device thicker than the thickness of the first designed semiconductor device D, 2 The tip 712b is pushed backward by the operation of the elastic members 713a and 713b so that the second embodiment can actively respond to changes in the thickness of the semiconductor element in addition to the effects obtained in the first embodiment. It can bring the effect.

In addition, the technology described in Embodiment 1 may be used in Embodiment 2, and the technology described in Embodiment 2 may be combined with Embodiment 1.

Meanwhile, in the above embodiments, it may be considered that the pneumatic providers 442 and 742, the control devices 743 and 743, and the input devices 444 and 744 are omitted.

For example, even if there is only a cylinder unit, a separate pneumatic provider (air pump, etc.) may be used to preset the required air pressure according to the number of terminals of the semiconductor device to be tested in the pneumatic space of the cylinder unit. There is no need for a pneumatic provider, control device and input device to be provided in the test handler.

In addition, if the control device is equipped with a program for automatically adjusting the pneumatic pressure without additional information input, it may be considered to omit the input device for inputting information for the pneumatic setting as described above.

Although the present invention has been fully described by way of example only with reference to the accompanying drawings, it is to be understood that the present invention is not limited thereto. It is to be understood that the scope of the invention is to be construed as being limited only by the following claims and their equivalents.

400, 700: Pushing device
410, 710: pusher
711: base portion
712: pressure part
712a: tip 712b: transfer member
713a, 713b: second elastic member
420, 720: Installation version
431, 432: elastic member
731 and 732: first elastic member
440, 740: pressure regulator
441, 741: Cylinder Unit
441a, 741a: Piston member 441b, 741b: Cylinder plate
442, 742: Pneumatic Provider
443, 743: Control
444, 744: Input device
60: drive source

Claims (9)

A pusher for pressing or supporting a semiconductor element electrically connected to the tester;
An installation plate on which a plurality of the pushers are installed;
An elastic member elastically supporting the pusher with respect to the mounting plate;
A pressure regulator provided to adjust a pressing force (including a supporting force) applied to the semiconductor device through the pusher; And
A driving source providing a driving force for advancing and installing the mounting plate toward the semiconductor element; ≪ RTI ID = 0.0 >
Pushing device for test handler. The method of claim 1,
The pressing force regulator may vary the pressing force provided according to the number of terminals of the test socket contacting the terminals of the semiconductor device under test.
Pushing device for test handler. According to claim 1, wherein the pressure regulator is characterized in that it comprises a cylinder unit which is provided for applying a pressing force applied to the semiconductor element through the pusher.
Pushing device for test handler. The method of claim 3,
The pressure regulator,
A pneumatic provider providing pneumatic to the cylinder unit side; And
A control device provided to adjust the pneumatic pressure provided from the pneumatic provider to the cylinder unit side; ≪ RTI ID = 0.0 >
Pushing device for test handler. 5. The method of claim 4,
The pressure regulator includes an input device for inputting a user's command to the control device; ≪ RTI ID = 0.0 >
Pushing device for test handler. The method of claim 3, wherein the cylinder unit,
A piston member for transferring the pneumatic pressure provided from the pneumatic provider to the pusher; And
A cylinder plate having a plurality of piston members installed therein; Characterized in that it comprises
Pushing device for test handler. The method of claim 3,
The pusher
A base portion supported by the elastic member; And
A pressing part installed at the base and having one end contacting the semiconductor element; Including,
The cylinder unit includes:
A piston member configured to transfer the pneumatic pressure provided from the pneumatic provider to the pressurizing unit; And
A cylinder plate having a plurality of piston members installed therein; Characterized in that it comprises
Pushing device for test handler. The method of claim 7, wherein
The pusher may further include a second elastic member elastically supporting the pressing part to be able to move forward and backward relative to the base with respect to the base.
Pushing device for test handler. The method of claim 7, wherein
The pressing portion
A tip whose one end contacts the semiconductor element; And
A transmission member for transmitting a pressing force coming from the piston member to the tip; ≪ RTI ID = 0.0 >
Pushing device for test handler.

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