KR102102724B1 - Pusher assembly for semiconductor test-handler and force control type plunger used therefor - Google Patents

Abstract

The present invention provides a pusher assembly for a semiconductor test-handler, to provide a correct buffer force, and a force control type plunger for the same. According to the present invention, the pusher assembly comprises: a plunger guide; a pusher coupled to the plunger guide; a pusher guide movably installed in the pusher and disposed to face a semiconductor package supported to a socket of a socket assembly; and the force control type plunger movably installed in the plunger guide while corresponding to the center of the pusher guide and provided to equipment providing pushing force to provide a buffer force buffering a difference between a force pressing the socket through the pusher guide and the semiconductor package and an endurable force of the socket. The force control type plunger comprises: a housing including a hollow body having an inner space formed therein and first and second open holes disposed on both side surfaces of the body, respectively, wherein the first open hole faces the pusher guide and the second open hole faces the equipment providing the pressing force; a contact unit protruding from the inner space to the outside of the body while being hung in the first open hole to come in contact with the center of the pusher guide; an elastic support unit disposed in the inner space and including a coil spring elastically supporting the contact unit toward the center of the pusher guide; and a compression control unit coupled to the body to be operated through the second open hole to control the compression intensity of the elastic support unit in accordance with the degree of control.

Description

Pusher assembly of semiconductor test handler and force adjustable plunger used therein {PUSHER ASSEMBLY FOR SEMICONDUCTOR TEST-HANDLER AND FORCE CONTROL TYPE PLUNGER USED THEREFOR}

The present invention relates to a pusher assembly of a semiconductor test handler and a force adjustable plunger used therein.

In general, a semiconductor package completed by a semiconductor manufacturing process is shipped when it is classified as a good product after being checked for proper operation characteristics through a test (inspection) process.

In this inspection process, the semiconductor package is connected to the socket to check whether there is a problem in electrical operation. To do this, a pusher assembly is required to press the semiconductor package against the socket.

Such a pusher assembly has a means for cushioning the force applied to the semiconductor package or socket while applying force to connect the semiconductor package to the socket. Regarding this, it is shown in Patent Publication No. 10-2009-0123441 (Invention name: Match plate for electronic component inspection support device).

For producers of this tool, how uniform the buffering force each of them exerts is an important factor in quality control. Until now, the dispersion management for the buffering force has been achieved at a standard buffering force level of ± 10%. Although this dispersion range is rather wide, reassembly such as replacement of parts was necessary for non-conforming products in order to meet this. Due to this, the reliability of the buffer force has not reached a very high level, and there is a difficulty that requires a lot of effort and time to manage the current level of dispersion.

One object of the present invention, the semiconductor package is a pusher assembly of the semiconductor test handler, which accurately provides a buffering force that can adjust the difference between the pressing force of the socket and the force that can be received by the socket, and the force adjusting type used therein It is to provide a plunger.
Another object of the present invention is a pusher assembly of a semiconductor test handler and a force-adjustable plunger used therein, which allows simple adjustment to the buffer force without re-assembly, so that a more stringent level of dispersion can be easily achieved in the production process. Is to provide

A pusher assembly of a semiconductor test handler according to an aspect of the present invention for realizing the above-described problems includes a plunger guide; A pusher coupled to the plunger guide; A pusher guide movably installed on the pusher and facing the semiconductor package supported on the socket of the socket assembly; And it is provided in a device that is movably installed in the plunger guide while corresponding to the center of the pusher guide, and provided with a pressing force. The pusher guide, the pressing force of the socket through the semiconductor package, and the socket can be received. It includes a force-adjustable plunger that provides a cushioning force that cushions the difference in force, and the force-adjustable plunger comprises a hollow body having an interior space, and formed on both sides of the body, respectively, and the pusher guide. A housing having a first opening hole facing and a second opening hole facing the equipment providing the pressing force; A contact unit protruding outward of the body while being caught in the first opening hole in the inner space and contacting the center of the pusher guide; An elastic support unit disposed in the interior space and having a coil spring elastically supporting the contact unit toward the center of the pusher guide; And a compression control unit that is operatively coupled to the body through the second opening hole and adjusts the amount of compression of the elastic support unit according to the degree of manipulation.

Here, the compression adjusting unit, screwed to the body while being in contact with the coil spring, includes a rotational moving member that moves toward the first opening hole as the rotational operation causes the coil spring to be compressed, and the The housing further includes a female thread formed on an inner circumferential surface of the body defining the inner space, and the rotational moving member may include a male thread formed on its outer circumferential surface to be screwed to the female thread.

Here, the rotation movement member may further include a tool groove formed on a surface exposed to the outside through the second opening hole and configured to insert a tool for rotation operation.

Here, the body, the first body through which the first opening hole is formed; And a second body in which the second opening hole is formed and coupled to the first body to form the inner space, and the compression control unit can be coupled to the second body.

Here, the second body, the width of the second opening hole is smaller than the width of the compression control unit to include a restriction jaw to limit the separation from the interior space of the compression control unit through the second opening hole You can.

A force-adjustable plunger for a pusher assembly of a semiconductor test handler according to another aspect of the present invention is provided in equipment that provides a pressing force of a semiconductor test handler, so that the semiconductor package can receive the force pressing the socket of the socket assembly and the socket. A force-adjustable plunger for pusher assembly of a semiconductor test handler that provides a cushioning force to cushion a difference in a force, a hollow body having an inner space, and formed on both sides of the body, respectively, in contact with the semiconductor package A housing having a first opening hole facing the pusher guide and a second opening hole facing the equipment providing the pressing force; A contact unit protruding outward of the body while being caught in the first opening hole in the inner space to be in contact with the center of the pusher guide; An elastic support unit disposed in the interior space and having a coil spring elastically supporting the contact unit toward the center of the pusher guide; And a compression control unit that is operatively coupled to the body through the second opening hole and adjusts the amount of compression of the elastic support unit according to the degree of manipulation.

Here, the compression adjusting unit, screwed to the body while being in contact with the coil spring, includes a rotational moving member that moves toward the first opening hole as the rotational operation causes the coil spring to be compressed, and the The housing further includes a female thread formed on an inner circumferential surface of the body defining the inner space, and the rotational moving member may include a male thread formed on its outer circumferential surface to be screwed to the female thread.

Here, the rotation movement member may include a tool groove formed on a surface exposed to the outside through the second opening hole and configured to insert a tool for rotation operation.

Here, the body, the first body through which the first opening hole is formed; And a second body in which the second opening hole is formed and coupled with the first body to form the inner space, wherein the second body has a width of the second opening hole that is greater than that of the compression control unit. It includes a limiting jaw to limit the separation from the inner space of the compression control unit through the second opening hole, the end surface exposed to the outside through the second opening hole of the compression control unit, the Since the compression adjustment unit is limited to the limiting jaw, it may be positioned to be spaced apart from the inside of the inner space than a side defining the second opening hole of the second body.

Here, a display unit having a reference mark formed on the housing and an adjustment mark formed on the compression adjusting unit to display the compression amount of the elastic support unit by the operation of the compression adjusting unit may be further provided.

According to the pusher assembly of the semiconductor test handler according to the present invention constituted as described above and the force-adjustable plunger used therein, the contact unit disposed in the inner space of the housing and caught in the first opening hole changes the contact direction by the elastic support unit. By supporting the pusher guides while being elastically supported toward the socket, the package provides exactly the cushioning force to control the difference between the force the socket can receive and the package pressing the socket.

In addition, the force that the elastic support unit supports the contact unit, which provides a force-adjustable plunger for the pusher assembly of the semiconductor test handler, can be adjusted by manipulation to the compression control unit. Thereby, the operator can easily adjust the force of the elastic support unit supporting the contact unit without replacing the elastic support unit or the like after producing the force-adjustable plunger. As a result, during mass production of the force-adjustable plunger, it is possible to adjust the scattering management for the buffer force more strictly to the standard buffer force ± 3% level.

1 is a perspective view of a force-adjustable plunger 100 for a pusher assembly of a semiconductor test handler according to an embodiment of the present invention.
FIG. 2 is a perspective view of a force-adjustable plunger 100 for a pusher assembly of the semiconductor test handler of FIG. 1 as viewed from another direction.
3 is an exploded perspective view of a force-adjustable plunger 100 for a pusher assembly of the semiconductor test handler of FIG. 1.
4 is an exploded perspective view of the force-adjustable plunger 100 for the pusher assembly of the semiconductor test handler of FIG. 3 when viewed from another direction.
FIG. 5 is a longitudinal cross-sectional view of the force-adjustable plunger 100 for a pusher assembly of a semiconductor test handler taken along line VV of FIG. 1.
FIG. 6 is a longitudinal sectional view showing another state of the force-adjustable plunger 100 for the pusher assembly of the semiconductor test handler of FIG. 5.
7 is a longitudinal cross-sectional view of a state in which a semiconductor package P is tested against a socket assembly 300 using a pusher assembly 200 employing a force-adjustable plunger 100 for a pusher assembly of the semiconductor test handler of FIG. 1. to be.

Hereinafter, a pusher assembly of a semiconductor test handler according to a preferred embodiment of the present invention and a force-adjustable plunger used therein will be described in detail with reference to the accompanying drawings. In this specification, the same or similar reference numerals are assigned to the same or similar configurations in different embodiments, and the description is replaced with the first description.

1 is a perspective view of a force-adjustable plunger 100 for a pusher assembly of a semiconductor test handler according to an embodiment of the present invention, and FIG. 2 is a force-adjustable plunger 100 for pusher assembly of a semiconductor test handler of FIG. 1. It is a perspective view looking at the other direction.

Referring to these drawings, the force-adjustable plunger 100 for the pusher assembly of the semiconductor test handler may include a housing 110, a contact unit 130, a compression adjustment unit 150, and a display unit 170. have.

The housing 110 is configured to accommodate the contact unit 130 and the like. The housing 110 may have bodies 111 and 113, a first opening hole 115, and a second opening hole 117. The bodies 111 and 113 may be specifically divided into a first body 111 and a second body 113. When the first opening hole 115 is formed on the side surface of the first body 111, the second opening hole 117 may be formed on the side surface of the second body 113. Through this, the first opening hole 115 and the second opening hole 117 may be positioned to face each other on both sides of the bodies 111 and 113. In the above, it has been described that the bodies 111 and 113 are formed by combining the first body 111 and the second body 113, but the bodies 111 and 113 may be formed as one single member. have.

The contact unit 130 is positioned in the inner spaces of the bodies 111 and 113 while protruding to the outside through the first opening hole 115. A portion of the contact unit 130 that protrudes outward may be referred to as a contact portion 131. The contact portion 131 is a portion in contact with the pusher 250 (refer to FIG. 7) of the pusher assembly 200 for a semiconductor package test handler. The contact portion 131 is elastically supported in a direction protruding to the outside, that is, in the contact direction C. In addition, the contact portion 131 may be moved while being elastically supported by a distance protruding from the side surface of the first opening hole 115. The contact portion 131 may have a hemisphere shape, as illustrated in the drawing.

Compression control unit 150 is a configuration that is operatively coupled to the housing 110, specifically the bodies 111 and 113. Compression control unit 150, more specifically, may be coupled to the second opening hole 117 side of the second body 113. The operation for the compression adjustment unit 150 may be to insert a screwdriver into its tool groove 157 and rotate it. By the operation of the compression adjusting unit 150 according to this operation, the force elastically supporting the contact unit 130 can be adjusted.

The display unit 170 is configured to display the magnitude of the force elastically supporting the contact unit 130. The display unit 170 may have a reference display 171 and an adjustment display 175. The reference mark 171 may be displayed on the side surface of the second body 113. Thereby, the reference mark 171 is fixed to the housing 110. Alternatively, the adjustment display 175 is displayed on the compression adjustment unit 150. The adjustment display 175 is rotated as the compression adjustment unit 150 is operated, thereby forming a relative relationship with the reference display 171. When the reference display 171 is one, the adjustment display 175 may be provided in a plurality arranged at regular angular intervals.

A more specific configuration will be described with reference to FIGS. 3 and 4.

3 is an exploded perspective view of the force-adjustable plunger 100 for the pusher assembly of the semiconductor test handler of FIG. 1, and FIG. 4 is a force-adjustable plunger 100 for the pusher assembly of the semiconductor test handler of FIG. 3 in another direction. It is an exploded perspective view.

Referring to these drawings, the bodies 111 and 113 of the housing 110 are hollow bodies having an inner space 112. In addition to the contact unit 130 and the compression control unit 150 described above, the elastic support unit 190 may be accommodated in the interior space 112.

In addition to the contact unit 131 described above, the contact unit 130 may further include a locking support unit 133 and a support unit 135. The locking support portion 133 has a width greater than that of the contact portion 131 and is caught by the first opening hole 115. In this embodiment, the locking support portion 133 has a substantially disc shape. The catching support 133 also serves to support the elastic support unit 190 in the inner space 112. The support part 135 is configured to protrude in the opposite direction of the contact part 131 from the engaging support part 133. The support part 135 extends into the elastic support unit 190 while having a smaller width than the engaging support part 133, so that the elastic support unit 190 can be aligned in place. Here, the contact portion 131 and the locking support portion 133 may be integrally formed with each other. Furthermore, in addition to them, even the support portion 135 can be formed as an integral body. By the configuration of the contact unit 130, distortion of the force generated in the elastic support unit 190 can be prevented.

The compression adjusting unit 150 is a configuration for adjusting the amount of compression of the elastic support unit 190. Specifically, the compression control unit 150 may be a rotational movement member. The rotational moving member may be inserted into the inner space 112 of the second body 113. To this end, the rotational moving member may have a base 151, a rhetoric hill 153, a support portion 155, and a tool groove 157. The base 151 generally has a disk shape, and thus supports the elastic support unit 190. Susasasan 153 may be formed on the outer circumferential surface of the base 151. The male thread 153 is screwed to the female thread 114 formed on the inner circumferential surface of the second body 113. Thereby, as the base 151 is rotated, the base 151 compresses the elastic support unit 190 while moving in the contact direction (C, FIG. 1) toward the first opening hole 115. The support part 155 may be inserted into the elastic support unit 190 and maintain its alignment, like the support part 135 of the contact unit 130. The tool groove 157 is exposed to the outside through the second opening hole 117 so that the operator can rotate the base 151 by inserting a driver from the outside.

The elastic support unit 190 is disposed in the inner space 112 and is configured to elastically support the contact unit 130 along the contact direction C toward the first opening hole 115. The elastic support unit 190 may be a coil spring disposed along the contact direction (C). One end 191 of the coil spring may be supported by a locking support part 133, and the other end 193 may be supported by a base 151. The coil spring may have a shape in which a metal member having a rectangular cross section 195 is spirally extended. Such a coil spring can exert a uniform force.

FIG. 5 is a longitudinal cross-sectional view of a force-adjustable plunger 100 for a pusher assembly of a semiconductor test handler taken along line VV of FIG. 1, and FIG. 6 is a force adjustment for a pusher assembly of the semiconductor test handler of FIG. 5. It is a longitudinal sectional view showing another state of the type plunger 100.

Referring to FIG. 5, a restriction jaw 116 defining a second opening hole 117 may be formed on a side surface of the second body 113. The limiting jaw 116 has a width of the second opening hole 117 smaller than the width of the compression adjusting unit 150, so that the compression adjusting unit 150 can pass through the second opening hole 117 in the inner space 112. Limit deviation. To this end, the limiting jaw 116 may have a ring shape along the outer circumference of the second opening hole 117. Further, in order to insert the compression adjusting unit 150 into the inner space 112 despite the restriction jaws 116, the bodies 111 and 113 are the first body 111 and the second body 113 as described above ), And then need to be combined. Their coupling can be achieved by screwing between the threads 111 'and 113' formed on each of them. In addition, due to the limitation of the limiting jaw 116, the end surface exposed to the outside through the second opening hole 117 of the compression control unit 150, the second opening hole 117 of the second body 113 It is spaced apart from the inside of the interior space rather than the limited side.

In this configuration, when it is necessary to adjust the amount of compression of the elastic support unit 190, the elastic support unit 190 needs to strengthen the force elastically supporting the contact unit 130 along the contact direction C, The operator can rotate the compression adjusting unit 150 by inserting a screwdriver into the tool groove 157. By rotating the base 151 of the compression control unit 150, the male thread 153 is screwed to the female thread 114 while the base 151 advances in the contact direction C. During such advancement, the base 151 compresses the elastic support unit 190. One state in which the elastic support unit 190 is compressed in this way is illustrated in FIG. 6.

In the state of FIG. 6, since the elastic support unit 190 is compressed than in the case of FIG. 5, the force that the elastic support unit 190 supports the contact unit 130 is strengthened. In addition, such a state can be immediately confirmed through the display unit 170 without other measurement tools. Through this adjustment, the force exerted by the force-adjustable plunger 100 can be adjusted closer to the reference value.

Referring now to Fig. 7, the situation in which the force-adjustable plunger 100 is used for testing of a semiconductor package will be described. 7 is a longitudinal cross-sectional view of a state in which the semiconductor package P is tested against the socket assembly 300 using the pusher assembly 200 employing the force-adjustable plunger 100 of FIG. 1.

Referring to this figure, the pusher assembly 200 may have a plunger guide 210, a pusher guide 230, and a pusher 250 in addition to the force-adjustable plunger 100. The plunger guide 210 is coupled to equipment (not shown) that provides a pressing force through a match plate (not shown). The force-adjustable plunger 100 is installed to be movable in the height direction V on the plunger guide 210. The second body 113 of the force-adjustable plunger 100 is directed upward, and the contact unit 130 is disposed downward. The pusher guide 230 is disposed below the contact unit 130 and is in contact therewith. The bottom surface of the pusher guide 230 is disposed to face the semiconductor package P. Pusher 250 is that the pusher guide 230 is installed to be movable in the height direction (V), this pusher 250 is coupled to the plunger guide 210.

Corresponding to the pusher assembly 200, the semiconductor package P may be located in the socket assembly 300. The socket assembly 300 can have an insert 310, a socket 330, and a socket guide 350. The insert 310 is configured to receive and transport the semiconductor package P. The socket 330 is disposed under the insert 310 and is connected to the semiconductor package P accommodated in the insert 310. The socket 330 is installed on the socket guide 350, and the socket guide 350 is coupled with the insert 310.

According to this configuration, in the equipment providing the pressing force, the force-adjusting plunger 100 is pressed at a set height at a set height, and specifically, the side forming the second opening hole 117 of the second body 113 is pressed. . However, when the set force is transmitted to the socket 330 through the plunger 100-pusher guide 230-semiconductor package P, the force that the socket 330 can receive and the transmitted force are immediately It is not matched and causes a certain difference. The difference in force should be controlled by the force-adjustable plunger 100. The force-adjustable plunger 100 allows the pusher guide 230 to adhere the semiconductor package P to the socket 330 through the elastic support unit 190 provided therein, but the excessive force applied to the socket 330 Force works to absorb. To this end, the force exerted by the elastic support unit 190 can be adjusted by the compression adjusting unit 150 according to the type of the socket 330 and the like.

The pusher assembly of the semiconductor test handler as described above and the force-adjustable plunger used therein are not limited to the configuration and operation of the above-described embodiments. The above embodiments may be configured such that all or part of each embodiment is selectively combined to make various modifications.

100: Force-controlled plunger for pusher assembly of semiconductor test handler
110: housing 111: first body
113: second body 115: first opening hole
117: second opening hole 130: contact unit
131: contact 133: jam support
150: compression control unit 151: base
153: male thread 170: indicator unit
190: elastic support unit 200: pusher assembly
300: socket assembly

Claims (10)

Plunger guide;
A pusher coupled to the plunger guide;
A pusher guide movably installed on the pusher and facing the semiconductor package supported on the socket of the socket assembly; And
The plunger guide is movably installed to correspond to the center of the pusher guide, and provided by equipment providing a pressing force, so that the pressing force of the socket and the socket through the pusher guide and the semiconductor package can be received. Includes a force-adjustable plunger that provides a cushioning force to dampen the difference in force,
The force-adjustable plunger,
A housing having a hollow body having an interior space, a first opening hole formed on both sides of the body and facing the pusher guide, and a second opening hole facing the equipment providing the pressing force;
A contact unit protruding outward of the body while being caught in the first opening hole in the inner space and contacting the center of the pusher guide;
An elastic support unit disposed in the interior space and having a coil spring elastically supporting the contact unit toward the center of the pusher guide; And
A pusher assembly of a semiconductor test handler, comprising a compression adjusting unit that is operatively coupled to the body through the second opening hole and adjusts the amount of compression of the elastic support unit according to the degree of manipulation.
According to claim 1,
The compression control unit,
It includes a rotating movement member that is screwed to the body while being in contact with the coil spring, moves toward the first opening hole as it is rotated to compress the coil spring,
The housing,
Further comprising a female thread formed on the inner peripheral surface of the body that defines the inner space,
The rotation movement member,
A pusher assembly of a semiconductor test handler, comprising a male thread formed on its outer circumferential surface to be screwed to the female thread.
According to claim 2,
The rotation movement member,
The pusher assembly of the semiconductor test handler further includes a tool groove formed on a surface exposed to the outside through the second opening hole and configured to insert a tool for rotation operation.
According to claim 1,
The body,
A first body in which the first opening hole is formed; And
The second opening hole is formed, and includes a second body coupled to the first body to form the inner space,
The compression control unit,
A pusher assembly of a semiconductor test handler coupled to the second body.
According to claim 4,
The second body,
A pusher assembly of a semiconductor test handler, comprising a limiting jaw limiting the width of the second opening hole to be smaller than the width of the compression adjusting unit to limit the separation from the internal space of the compression adjusting unit through the second opening hole.
Force adjustment for the pusher assembly of the semiconductor test handler provided in the equipment providing the pressing force of the semiconductor test handler to provide a cushioning force to buffer the difference between the force in which the semiconductor package presses the socket of the socket assembly and the force the socket can receive. As a type plunger,
A hollow body having an inner space, a first opening hole formed on both sides of the body and facing a pusher guide contacting the semiconductor package, and a second opening hole facing the equipment providing the pressing force Housing having a;
A contact unit protruding outward of the body while being caught in the first opening hole in the inner space to be in contact with the center of the pusher guide;
An elastic support unit disposed in the interior space and having a coil spring elastically supporting the contact unit toward the center of the pusher guide; And
Force control plunger for a pusher assembly of a semiconductor test handler, including a compression adjustment unit that is operatively coupled to the body through the second opening hole, and adjusts the amount of compression of the elastic support unit according to the degree of manipulation.
The method of claim 6,
The compression control unit,
It includes a rotating movement member that is screwed to the body while being in contact with the coil spring, moves toward the first opening hole as it is rotated to compress the coil spring,
The housing,
Further comprising a female thread formed on the inner peripheral surface of the body that defines the inner space,
The rotation movement member,
A force adjustable plunger for a pusher assembly of a semiconductor test handler, comprising a male thread formed to be screwed to the female thread on its outer circumferential surface.
The method of claim 7,
The rotation movement member,
A force adjustable plunger for a pusher assembly of a semiconductor test handler, further comprising a tool groove formed on a surface exposed to the outside through the second opening hole and configured to insert a tool for rotation operation.
The method of claim 6,
The body,
A first body in which the first opening hole is formed; And
The second opening hole is formed, and includes a second body coupled to the first body to form the inner space,
The second body,
A width of the second opening hole is smaller than the width of the compression control unit and includes a limiting jaw limiting the separation from the internal space of the compression control unit through the second opening hole,
The end surface exposed to the outside through the second opening hole of the compression regulating unit, the inner side than the side defining the second opening hole of the second body by the compression regulating unit is limited to the restriction jaw A force-adjustable plunger for pusher assembly of a semiconductor test handler positioned spaced inwards of the space.
The method of claim 6,
A display unit having a reference mark formed on the housing and an adjustment mark formed on the compression regulating unit, further comprising a display unit for displaying the compression amount of the elastic support unit by the operation of the compression regulating unit. Force adjustable plunger for pusher assembly.

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