TWI598603B - Pusher assembly and match plate for test handler - Google Patents

Description

Test sorter with pusher assembly and matching board

The present invention relates to a pusher assembly for a test sorter for supporting a tester to test a semiconductor component and a matching board to which the pusher assembly is applied.

The test sorter is a device that supports a tester capable of testing a semiconductor component manufactured through a predetermined manufacturing process, and classifying the semiconductor component according to the test result and then placing it on the customer tray.

The test sorter has a test tray to enable multiple semiconductor components to be tested at one time by the test machine. As disclosed in Korean Laid-Open Utility Model Publication No. 20-2009-0001188, the test tray is provided with a plurality of inserts capable of mounting semiconductor elements. Moreover, the semiconductor element is electrically connected to the test in a state of being placed on the interposer, thereby being tested. Of course, the semiconductor element needs to be supported in a state of being placed on the interposer. Conventionally, as disclosed in Korean Laid-Open Patent Publication No. 10-2013-0023781, a support table supporting a semiconductor element is integrally formed on a main body of an interposer, thereby supporting a semiconductor element placed on the interposer. However, in recent years, the degree of integration of semiconductor circuits has been greatly increased, and the height of terminals of semiconductor elements and the interval between terminals have become extremely small. According to this, in the case of supporting the semiconductor element by the support stage, the design of the electrical connection structure between the semiconductor element and the tester socket becomes quite difficult. For example, a structure in which a support member in a film form is used to support a semiconductor element is disclosed in Japanese Laid-Open Patent Publication No. 10-2014-0070863.

1 is a conceptual plan view of a test sorter 100 to which a test tray TT is applied as described above.

As shown in FIG. 1, the test handler 100 includes a first hand, a first chamber 120, a test chamber 130, a connection device 140, a second chamber 150, and a second hand 160.

The first robot 110 loads the semiconductor component to be tested placed on the customer tray CTn to the test tray TT at the first position P1. In this case, the first robot 110 can function as a loading device for loading the semiconductor element to the test tray TT, and the first position P1 will become a loading position.

The purpose of the first chamber 120 is to preheat or pre-cool the semiconductor components carried in the test tray TT transferred from the first position P1 in accordance with the test environment conditions.

The purpose of the test chamber 130 is to test the semiconductor components of the test tray TT that are transferred to the test position (TP: Test Position) after being preheated or pre-cooled in the first chamber 120.

The connecting device 140 pushes the test tray TT of the test position TP located in the test chamber 130 to the interface panel IB of the test machine coupled to the side of the test chamber 130, thereby electrically connecting the semiconductor element of the insert located in the test tray TT to Test panel socket for IB panel. The invention relates to a connection device 140 for electrically connecting a semiconductor component and a tester socket. Therefore, the connection device 140 will be more specifically described later.

The purpose of the second chamber 150 is to return the heated or cooled semiconductor component carried in the test tray TT transferred from the test chamber 130 to normal temperature or close to normal temperature.

The second robot 160 classifies the semiconductor components placed in the test tray TT transferred to the second position P2 by the test level and unloads them to the empty customer tray CTe. In this case, the second robot 160 functions as an unloading device that unloads the semiconductor element from the test tray TT, and the second position P2 becomes an unloading position.

In the test sorter 100 having the above configuration, the test tray TT is cyclically moved along the circulation path C that is connected again to the first position P1 via the first position P1, the test position TP, and the second position P2.

However, the test tray can be cyclically moved in the opposite direction of the circulation path C according to the test mode. In this case, the roles of the first robot 110 and the second robot 160, the first chamber 120, and the second chamber 150 will be switched, and the second position P2 becomes the loading position, and the first position P1 becomes unloaded. position.

Next, the connection device 140 will be described more specifically.

As disclosed in Korean Laid-Open Patent Publication No. 10-2014-0101456, the connecting device 140 includes a mating plate composed of a pusher and a setting plate, and a moving source that moves the matching plate toward the side of the test tray and the intermediate panel IB.

The pusher presses the semiconductor component to the side of the tester socket while integrating the mating plate with the test tray. At this time, if the pressing force of the pusher first contacting the semiconductor element or being applied to the semiconductor element by the pusher is not properly controlled before the semiconductor element contacts the tester socket, there is It is possible to damage the semiconductor component, the tester socket contacting the semiconductor component, and the support table or support member of the insert. In particular, as mentioned above, in the case where the insert is applied with a thinner support member in the form of a film, the support member is easily torn or elongated due to the uncontrolled pressing force of the pusher, so that it is easily damaged. Therefore, as shown in FIG. 2, a structure is adopted in which the front end of the pusher is brought into contact with the semiconductor element D, and the base of the pusher is brought into contact with the insert, thereby preventing the pusher from excessively entering. To the internal space S of the insert (Insert). According to this, it is possible to prevent the pusher from being excessively accessed by means of the insert, so that the pressurizing force of the pusher can structurally obtain comparable control.

However, there are often cases where the thickness of the semiconductor element to be tested becomes different depending on the kind of semiconductor element to be tested. For example, after testing a semiconductor component having a thickness of 1 mm, it is necessary to test a semiconductor component having a thickness of 2 mm. In this case, as shown in (a) of FIG. 3, the length of the pressurizing portion PP of the pusher is set corresponding to the case where the semiconductor element D having a thickness of 1 mm is placed on the insert, and thus, as shown in FIG. (b), if the semiconductor element D having a thickness of 2 mm is placed on the interposer, the pusher is in a state where the substrate of the pusher does not contact the insert and the semiconductor element does not contact the tester socket TS. The front end first contacts the semiconductor element D. Accordingly, in the state of (b) of FIG. 3, as mentioned above, damage to the semiconductor element D, the tester socket TS, and the insert may occur. On the contrary, in the case where a thick semiconductor element is first tested and a thinner semiconductor element is required to be tested, as shown in (c) of FIG. 3, the substrate of the pusher is before the front end of the pusher contacts the semiconductor element D. The insert is contacted, so the pusher cannot properly pressurize the semiconductor element D. Therefore, with the conventional matching board, it is necessary to replace it with a matching board provided with a pusher having a pressurizing portion whose length matches the varying thickness of the semiconductor element to be tested.

Therefore, if the matching board needs to be replaced, there are the following problems.

First, it is necessary to provide a variety of types of matching plates that can correspond to various types of semiconductor elements that need to be tested, which results in wasted resources and increased production costs.

Second, it takes time to replace, and wastes manpower, and replacement costs also occur.

Third, the operating rate of the test sorter is reduced by an amount equivalent to the time of replacement (including the time waiting for replacement, the time for replacement and the new temperature adjustment for operation, etc.), thus reducing production efficiency. [Prior Art Document] [Patent Document]

Patent Document 1: Korean Public Patent No. 10-2015-0014357

An object of the present invention is to provide a pusher assembly and a matching plate that can prevent a pusher from excessively entering the inside of the insert while appropriately pressurizing the semiconductor elements of various thicknesses. The technology involved.

In order to achieve the above object, a pusher assembly for a test sorter according to the present invention includes: a pressurizing portion provided to a setting plate for pressurizing a semiconductor element; and a head portion for advancing and retracting relative to the pressurizing portion Movably disposed in the pressurizing portion, and contacting the pressurizing portion to advance the semiconductor element in order to pressurize the semiconductor element placed on the interposer, before the pressurizing portion contacts the semiconductor element An insert; an elastic body elastically supporting the leading portion in a direction of the pressurized insert.

The elastic body elastically supports the pressurizing portion and the leading portion to each other such that when the leading portion contacts the insert, the pressing is performed in a direction opposite to a direction in which the pressing portion advances Partial compression is applied while applying elastic force.

The pressing portion includes: a setting member disposed on the setting plate; a pressing member movably coupled to the setting member to pressurize the semiconductor element; and a bonding member to cause the pressing member to be opposite to the The setting member is movably coupled to the setting member in advance and backward.

The elastic body elastically supports the leading portion and the setting member from each other.

The pusher assembly further includes a guiding portion for guiding the advance and retreat movement of the leading portion.

The coupling member is provided with a guiding member for guiding the forward and backward movement of the leading portion.

The pusher assembly further includes a fixing portion that allows the leading portion to be movably fixed to the pressing portion with respect to the pressing portion, and the fixing portion has an advancement and retreat movement for guiding the leading portion The function.

Also, in order to achieve the above object, a matching plate for a test sorter according to the present invention includes: the above-described pusher assembly; and a setting plate for setting the pusher assembly.

The mating plate further includes: a spring that elastically supports the pusher assembly and the setting plate, and the setting plate has a setting hole for arranging the pusher assembly, the pusher A portion of the assembly is provided to the setting plate in a state of being inserted into the setting hole, so that the pusher assembly elastically supported by the spring can be relatively advanced and retracted relative to the setting plate.

With the use of a matching board according to the present invention as described above, it is possible to pressurize semiconductor elements of various thicknesses, and thus the following effects are obtained.

First, there is no need to produce multiple matching boards, so production costs can be saved.

Second, the contact shock between the semiconductor element and the tester socket is alleviated, and accordingly, damage to the semiconductor element, the tester socket, and the insert can be prevented, and the reliability of the product can be improved.

Third, there is no need to replace the matching board, which saves manpower, time and cost, and the operating rate of the test sorter is improved, thereby improving production efficiency.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings, and the repeated description is omitted or reduced as much as possible for the sake of simplicity of the description.

<First Embodiment Regarding Pusher Assembly>

4 is a schematic exploded perspective view of a pusher assembly for a test sorter (hereinafter, simply referred to as "pusher assembly") 40 according to the first embodiment of the present invention, and FIG. 5 is a pusher assembly of FIG. A conceptual cross-sectional view of 40.

The pusher assembly 40 according to the present embodiment includes a pressurizing portion 41, a head portion 42, an elastic body 43, and a fixing portion 44.

The pressurizing portion 41 is provided on a setting plate of the matching plate to pressurize the semiconductor element. To this end, the pressurizing portion 41 includes a setting member 41a, a pressing member 41b, a coupling member 41c, and an elastic member 41d.

As shown in the reference drawing of Fig. 5, the setting member 41a is provided in the setting plate 541 with its rear end inserted into the setting hole IH, which is a hole formed to set the pusher assembly 40 to the setting plate 541. . To this end, the setting member 41a includes the setting member IE, the engaging member OE, and the coupling member JE.

The installation member IE is provided with a pressing member 41b, a coupling member 41c, and an elastic member 41d. To this end, the setting member IE is formed with an elastic groove ES capable of inserting the rear end of the elastic member 41d and a coupling hole JH for coupling with the coupling member 41c. Further, the installation member IE is provided with support grooves SS on both sides of the elastic groove ES to allow the rear end of the elastic body 43 to be inserted and supported. Such a setting member IE has a substantially T-shape in which the width of the rear end is narrower than the width of the front end when viewed from the side, and as shown in FIG. 5, the bolt groove BS is opened toward the rear end direction. Moreover, the setting member IE elastically supports the setting plate 541 by means of the spring 542. Therefore, the pusher assembly 40 can be disposed to be elastically supported by the spring 542 while being configured to be movable forward and backward relative to the setting plate 541.

The snap member OE functions as a snap-in to prevent the setting member IE from being detached forward by the elastic force of the spring 542. Such a snap member OE is formed with a bolt hole BH corresponding to the bolt groove BS.

The coupling member JE is composed of a bolt, and its front end is coupled to the bolt groove BS through the bolt hole BH, thereby combining the setting member IE and the engaging member OE.

The pressing member 41b is coupled to the installation member 41a so as to be movable forward and backward by the coupling member 41c. The front end of the pressing member 41b pressurizes the semiconductor element, and the rear end is elastically supported by the elastic member 41d. An insertion groove IS into which the front end of the elastic member 41d can be inserted is formed at the rear end of such a pressing member 41b. Further, a chucking station OJ is formed on the side edge of the pressing member 41b.

The coupling member 41c is for coupling the pressing member 41b to the setting member 41a so as to be movable forward and backward with respect to the setting member 41a. To this end, the coupling member 41b is formed with a first through hole TH1 through which the front end of the pressing member 41b can pass. Here, the first through hole TH1 is formed in such a size that the inner edge constituting the first through hole TH1 can be engaged with the carding stage OJ. Therefore, the pressing member 41b cannot be detached forward by the elastic force of the elastic member 41d, and the bonded state can be maintained. Further, in the coupling member 41c, a through hole PH through which the front end of the elastic body 43 can pass is formed at a position corresponding to the support groove SS, and a coupling groove JS for coupling with the installation member 41a is formed in the coupling hole JH. position. Further, the two corners of the mutually symmetrical sides of the coupling member 41c are cut while the side faces thereof are formed with the fixing grooves FS, and the side faces of the two corners of the other side are formed with the guide protrusions GP as the guide for guiding the advance and retreat of the leading portion 42. member. Such a coupling member 41c is coupled to the installation member 41a by a bolt B that is coupled to the coupling groove JS side via the coupling hole JH.

The elastic member 41d composed of a coil spring is inserted into the insertion groove IS and the elastic groove ES at the front end and the rear end, respectively, and the pressing member 41b is elastically supported by the installation member 41a.

The leading portion 42 is equipped to be capable of relative advance and retreat movement with respect to the pressing portion 41, and the leading portion 42 is in the pressing portion when the pressing portion 41 advances toward the semiconductor member in order to pressurize the semiconductor member placed on the interposer 41 contacts the insert prior to contacting the semiconductor component. The leading portion 42 is formed with a second through hole TH2 at a position corresponding to the first through hole TH1 for the insertion of the front end of the pressing member 41b. Further, the two corners on one side which are symmetrical to each other are bent and extended rearward, and a fixing hole FH in the form of a long hole extending in the front-rear direction is formed on the side thereof at a position corresponding to the fixing groove FS. Here, the long diameter of the fixing hole FH in the front-rear direction should have a length sufficient to ensure the advance and retreat distance of the leading portion 42. Further, the two corners on the other side of the head portion 42 are bent to extend rearward, and a guide groove GS opening along the rear side is formed on the side thereof. Therefore, the guide protrusion GP can guide the advance and retreat movement of the head portion 42 by being inserted into the guide groove GS.

The elastic body 43 composed of a coil spring elastically supports the head portion 42 in a direction (i.e., front) for pressurizing the insert. To this end, the rear end of the elastic body 43 is inserted into the support groove SS, and the front end passes through the through hole PH to contact the rear of the leading portion 42. Such an elastic body 43 functions to elastically support the leading portion 42, and also serves in a direction (front) toward the pressing portion 41 while the leading portion 42 contacts the insert and is compressed while the panel and the test tray are integrated. The opposite direction (rear) acts to apply an elastic force to the pressurizing portion 41. Of course, one or more elastic bodies 43 may be provided as needed, and the support groove SS and the puncturing PH may be formed one or more.

The fixing portion 44 composed of a bolt is coupled to the fixing groove FS through the fixing hole FH in the form of a long hole, whereby the leading portion 42 is movably coupled to the coupling member 41c of the pressing portion 41. Further, the thickness of the portion of the fixing hole FH inserted into the fixing portion 44 is formed to be the same as the short diameter of the fixing hole FH, whereby the fixing portion 44 has a function of guiding the forward and backward movement of the leading portion 42. From this point of view, the fixed portion 44 functions as a guide portion that guides the advance and retreat movement of the head portion 42.

Next, the operation of the pusher assembly 40 having the above-described configuration will be described with reference to FIGS. 6 to 9 which are somewhat exaggerated.

The current FIG. 6 illustrates a state before the pusher assembly 40 pressurizes the semiconductor element.

In the state of Fig. 6, if the matching plate is advanced toward the test tray, the pusher assembly 40 is also advanced together, and as shown in Fig. 7, the front surface of the leading portion 42 will come into contact with the rear surface of the insert IT. At this time, the front surface of the pressing member 41b is in a state of being separated from the semiconductor element placed on the interposer IT. In the state of FIG. 7, if the pusher assembly 40 continues to advance, while the front surface of the pressing member 41b maintains a state of being separated from the semiconductor element D, the insert IT contacting the leading portion 42 is simultaneously directed toward the tester socket. The TS advances so that as shown in Figure 8, the insert IT will be integrated into the tester socket TS. Next, in the state of FIG. 8, the pressing member 41b is further advanced toward the semiconductor element D, so that the front surface of the pressing member 41b will contact the semiconductor element D as shown in FIG. According to this, the pressing member 41b presses the semiconductor element D toward the tester socket TS side, so that the semiconductor element D and the tester socket TS are appropriately electrically connected. That is, in the connection structure of the semiconductor element D and the tester socket TS as described above, the pressing member 41b contacts the semiconductor element D in a state where the tester socket TS and the insert IT are first integrated, and thus the semiconductor element D is capable of The pressing member 41b is in contact with the semiconductor element D in a state where the countermeasure force is obtained from the tester socket TS. Therefore, for example, when a support member in the form of a film is applied, there is no fear that the support member is stretched forward due to the pressing force of the pressurizing member 41b.

Further, in the state of FIG. 8, when the pressing member 41b advances toward the semiconductor element D, the elastic body 43 is compressed while applying a rearward elastic force to the setting member 41a. At this time, the greater the degree of compression of the elastic body 43, the stronger the elastic force applied to the rear side of the installation member 41a, and therefore the advancement speed of the installation member 41a and the pressing member 41b will be considerably slower. Here, when the elastic body 43 is compressed and the elastic force is applied to the installation member 41a toward the rear, the mechanical relationship between the elastic body 43 and the spring 542 is slightly complicated. That is, the elastic body 43 and the spring 542 are compressed to each other by the elastic force applied to each other in a short time, and the member 41a and the pressing member are disposed at a level at which the elastic force between the two forms a balance. 41b will move forward. Therefore, the speed of the pressing member 41b becomes slow (the degree of slowing down is equivalent to the time of action of each other) while the front surface of the pressing member 41b applies a gentle contact shock to the semiconductor element D to gently contact the semiconductor. Element D. Of course, in the case where the front surface of the pressing member 41b is in contact with the semiconductor element D, the elastic member 41d also contributes a certain degree of complexity to the mechanical relationship between the elastic body 43 and the spring 542.

<Second Embodiment Regarding Pusher Assembly>

Fig. 10 is a schematic exploded perspective view showing a pusher assembly for a test sorter (hereinafter simply referred to as "pusher assembly") 50 according to a second embodiment of the present invention.

The pusher assembly 50 according to the present embodiment includes a pressurizing portion 51, a head portion 52, an elastic body 53, and a fixing portion 54.

The pressurizing portion 51 is provided on the setting plate of the matching plate and pressurizes the semiconductor element. To this end, the pressurizing portion 51 includes a setting member 51a, a pressing member 51b, a coupling member 51c, and an elastic member 51d. Here, the configuration and function of the installation member 51a, the pressing member 51b, and the elastic member 51d are almost the same as those of the installation member 41a, the pressing member 41b, and the elastic member 41d in the first embodiment, and thus the description thereof will be omitted.

The coupling member 51c allows the pressing member 51b to be coupled to the setting member 51a so as to be movable forward and backward with respect to the setting member 51a. To this end, the pressing member 51c is formed with a first through hole TH1 through which the front end of the pressing member 51b can pass. Further, the coupling member 51c is formed with a through hole PH through which the front end of the elastic body 53 can pass, and a coupling groove JS for coupling with the installation member 51a is formed. Further, a guide groove GS that is recessed toward the rear is formed in a portion where the first through hole TH1 is formed. The guide groove GS of such a coupling member 51c functions as a guiding member that guides the leading portion 52. Further, the coupling member 51c is formed with a fixing groove FS that is open to the side on the side surface of the portion where the guide groove GS is formed.

The leading portion 52 is supported by the elastic body 53 and has the same function as the leading portion 42 in the first embodiment, however, its form and bonding structure are different. The tip portion 52 has the same "ᄀ" shape as the inner surface constituting the guide groove GS when viewed from the side, and is provided such that its forward and backward movement can be guided by the inner surface constituting the guide space GG. Further, the side surface of the leading portion 52 is formed with a fixing hole FS in the form of a long hole in the front-rear direction at a position corresponding to the fixing groove FS of the coupling member 51c.

The elastic body 53 and the fixing portion 54 are the same as those of the elastic body 43 and the fixing portion 44 of the first embodiment, and thus the description thereof will be omitted.

The form or the joint structure of the joint member 51c and the head portion 52 of the pusher assembly 50 according to the present embodiment is somewhat different from that of the pusher assembly 40 of the first embodiment, and the advance and retreat movement guide structure of the head portion 52 and the first portion An embodiment differs somewhat, except that it operates in the same manner as the pusher assembly 40 of the first embodiment. Therefore, the explanation about the operation of the pusher assembly 50 according to the present embodiment is omitted.

<The third embodiment regarding the pusher assembly>

Fig. 11 is a schematic exploded perspective view of a pusher assembly for a test sorter (hereinafter simply referred to as "pusher assembly") 60 according to a third embodiment of the present invention.

The pusher assembly 60 according to the present embodiment includes a pressurizing portion 61, a head portion 62, an elastic body 63, and a fixing portion 64.

The pressurizing portion 61 is provided on the setting plate of the matching plate and pressurizes the semiconductor element. To this end, the pressurizing portion 61 includes a setting member 61a, a pressing member 61b, a coupling member 61c, and an elastic member 61d. Here, the configuration and function of the installation member 61a, the pressing member 61b, and the elastic member 61d are almost the same as those of the installation member 51a, the pressing member 51b, and the elastic member 51d in the second embodiment, and thus detailed description thereof will be omitted. .

However, the setting member IE of the setting member 61a is formed with a fixing groove FS that opens upward, and the fixing groove FS serves to allow the leading end portion 62 to be coupled in advance and backward.

The coupling member 61c in the present embodiment does not have a through hole capable of passing the front end of the elastic body 63 or a fixing groove for fixing the head portion 62. Alternatively, the coupling member 61c is formed with a guide space GG that opens in the front-rear direction and one side. The guiding space GG of such a coupling member 61c functions as a guiding member that guides the leading portion 62.

The leading portion 62 is supported by the elastic body 63, and its function is the same as that of the leading portion 52 in the second embodiment, however, its form and bonding structure are different. The leading portion 62 has the same substantially hexahedral shape as the guiding space GG formed in the coupling member 61c, and is provided so that the forward and backward movement in the front-rear direction can be guided by the guiding space GG of the coupling member 61c. Further, the leading portion 62 is formed with a fixing hole FH that opens in the vertical direction at a position corresponding to the fixing groove FS of the setting member IE formed in the setting member 61a.

The elastic body 63 is the same as the elastic body 53 of the second embodiment, and thus the description thereof will be omitted.

The fixing portion 64 composed of a bolt is coupled to the fixing groove FS side of the setting member IE formed on the setting member 61a from the front to the rear through the fixing hole FH, thereby fixing the leading portion 62 to the setting member IE in the front-rear direction. .

With regard to the pusher assembly 60 according to the present embodiment, the pusher assembly 50 of the second embodiment differs somewhat only in terms of the form or the joint structure of the joint member 61c and the head portion 62, and The operation is the same as that of the pusher assembly 50 of the second embodiment. Therefore, the explanation about the operation of the pusher assembly 60 according to the present embodiment is omitted.

As described above, the present invention has been specifically described by referring to the embodiments of the drawings. However, the above-described embodiments are merely described as a preferred embodiment of the present invention, and thus the invention is not limited to the above embodiments. The scope of the invention should be understood by the scope of the claims and the equivalents thereof.

541‧‧‧Setting board
542‧‧ ‧ spring
IH‧‧‧Setting holes
40, 50, 60‧‧‧ pusher assemblies
41, 51, 61‧‧‧ Pressurized parts
41a, 51a, 61a‧‧‧Set parts
41b, 51b, 61b‧‧‧ Pressurized parts
41c, 51c, 61c‧‧‧ combined parts
GP‧‧‧Guided protrusion
GG‧‧‧Guide space
42, 52, 62‧‧‧ first part
43, 53, 63‧‧‧ Elastomers
44, 54, 64‧‧‧ fixed parts

Figure 1 is a conceptual plan view of a general test sorter. 2 and 3 are reference views for examining the problem of the conventional pusher. Figure 4 is a schematic exploded perspective view of a pusher assembly in accordance with a first embodiment of the present invention. Figure 5 is a conceptual cross-sectional view of the pusher assembly of Figure 4. 6 to 9 are reference views for explaining the operation of the pusher assembly of Fig. 4. Figure 10 is a schematic exploded perspective view of a pusher assembly in accordance with a second embodiment of the present invention. Figure 11 is a schematic exploded perspective view of a pusher assembly in accordance with a third embodiment of the present invention.

Domestic deposit information (please note according to the order of the depository, date, number)

Foreign deposit information (please note in the order of country, organization, date, number)

(Please change the page separately) No

40‧‧‧Pusher assembly

41‧‧‧ Pressurized part

41a‧‧‧Setting parts

41b‧‧‧Pressure parts

41c‧‧‧Combined parts

GP‧‧‧Guided protrusion

42‧‧‧ first part

43‧‧‧ Elastomers

44‧‧‧Fixed part

Claims (8)

A pusher assembly for testing a sorting machine, comprising: a pressurizing portion disposed on a setting plate for pressurizing a semiconductor element; and a head portion that is movable forwardly and movably with respect to the pressurizing portion Pressing a portion, and contacting the insert member before the pressurizing portion contacts the semiconductor element before the pressurizing portion advances toward the semiconductor element in order to pressurize the semiconductor element placed on the interposer; and the elastomer Elastically supporting the head portion in a direction of the pressure insert; wherein the elastic body elastically supports the pressurizing portion and the head portion from each other such that when the head portion contacts the insert, The opposite direction of the direction in which the pressurizing portion advances is compressed while applying an elastic force to the pressurizing portion. A pusher assembly for testing a sorting machine, comprising: a pressurizing portion disposed on a setting plate for pressurizing a semiconductor element; and a head portion that is movable forwardly and movably with respect to the pressurizing portion a pressing portion, and when the pressing portion advances toward the semiconductor element in order to pressurize the semiconductor element placed on the interposer, contact the insertion before the pressing portion contacts the semiconductor element And an elastic body elastically supporting the leading portion in a direction of the pressure insert; the pressing portion comprising: a setting member disposed on the setting plate; and a pressing member coupled to the setting member in a forward and backward movement And pressing the semiconductor element; bonding the member so that the pressing member is movably coupled to the setting member with respect to the setting member; and the elastic member is disposed at the center; wherein the elastic body is elastically supported at the center Between the setting member and the leading portion, and the elastic member is elastically supported between the setting member and the pressing member. A tester assembly according to claim 1 or claim 2, wherein the elastic body elastically supports the leading portion and the setting member with each other. The pusher assembly for the test sorter of claim 1 or claim 2, further comprising: a guiding portion for guiding the advance and retreat movement of the leading portion. A pusher assembly for a test sorter such as claim 1 or claim 2, wherein The coupling member is provided with a guiding member for guiding the forward and backward movement of the leading portion. The pusher assembly for a test sorter according to claim 1 or claim 2, further comprising: a fixing portion, wherein the head portion is movably fixed to the pressurizing portion with respect to the pressurizing portion, wherein The fixed portion has a function of guiding the advance and retreat movement of the leading portion. A matching plate for a test sorter, comprising: the pusher assembly of any one of claims 1 to 6; and a setting plate for setting the pusher assembly. A matching plate for a test sorter according to claim 7, further comprising: a spring for elastically supporting the pusher assembly and the setting plate with each other, wherein the setting plate has a function for setting the push a mounting hole of the device assembly, the portion of the pusher assembly being disposed in the setting plate in a state of being inserted into the setting hole, so that the pusher assembly elastically supported by the spring can be opposite to the Set the board for relative advance and retreat movement.