KR101673375B1 - Module test socket - Google Patents
Module test socket Download PDFInfo
- Publication number
- KR101673375B1 KR101673375B1 KR1020150096324A KR20150096324A KR101673375B1 KR 101673375 B1 KR101673375 B1 KR 101673375B1 KR 1020150096324 A KR1020150096324 A KR 1020150096324A KR 20150096324 A KR20150096324 A KR 20150096324A KR 101673375 B1 KR101673375 B1 KR 101673375B1
- Authority
- KR
- South Korea
- Prior art keywords
- component
- module
- arms
- base body
- contact
- Prior art date
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2644—Adaptations of individual semiconductor devices to facilitate the testing thereof
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
A module test socket according to the present invention includes a base body, a support unit coupled to the base body and including a fixed unit for temporarily fixing the first component, and an alignment unit for aligning the first component at a specified position, A drive unit coupled to the base body, a pair of arms spaced apart by the drive unit, and a pair of arms mounted on the arms and connected to terminals of a second component disposed on the first component, A contact module including a contact pin unit having contact pins and a guide module interlocking with the gap of the arms and adapted to bring the first part into close contact with the alignment part before the contact pins are connected to the terminal of the second part, .
Description
The present invention relates to a module test socket, and more particularly, to a module test socket capable of aligning a component to a specified position or applying a test signal to a component in cooperation with a narrowed or widened arm.
In recent years, information processing devices such as smart phones, tablet PCs, and game machines are equipped with small-sized camera modules.
Recently, the camera module is equipped with a high resolution image sensor to improve the image quality. In addition, the autofocus function and the hand shake correction function are added to improve the image quality.
The camera module having the autofocus function and the hand shake correction function includes a VCM (VOICE COIL MOTOR) module for performing a focusing operation and an image sensor for converting light passing through the VCM module into an image.
Generally, to test and assemble the image sensor of the camera module, you need a test socket to test the image sensor and a test socket to test the VCM module.
To test the image sensor in the test socket, align the image sensor to the specified position of the test socket, align the VCM with respect to the image sensor, test the image sensor and VCM module after driving the VCM module, And VCM modules are coupled to each other using a separate device.
However, in order to align the image sensor to the designated position and to align the VCM to the image sensor in this way, a very complicated mechanism is required, and excessive force is applied to the image sensor during alignment of the image sensor to the designated position, It can be damaged during the process.
The present invention relates to a module for preventing the image sensor from being damaged due to excessive force applied to the image sensor during the alignment of the image sensor by allowing the image sensor, which is a component of the camera module, Provide a test socket.
The present invention also relates to a module test method for aligning an image sensor, which is a component of a camera module, at a fast alignment position and applying a test signal to a terminal of a VCM disposed at an upper portion of the image sensor, Socket.
In one embodiment, the module test socket comprises a base body; A support module coupled to the base body and including a fixed unit for temporarily fixing the first component and a guide unit fixed to the fixed unit to align the first component at a specified position; A drive module including a drive unit coupled to the base body and a pair of arms spaced apart by the drive unit; And an alignment module that cooperates with the gap of the arms to bring the first component into close contact with the guide portion.
The drive unit of the module test socket includes a pneumatic cylinder that moves a pair of arms in a direction parallel to an upper surface of the base body.
The fixed unit of the module test socket includes a fixed plate formed with at least one vacuum hole for sucking the first component by vacuum pressure and a vacuum port formed in the base body and communicating with the vacuum hole, And protrudes from the upper surface of the fixed plate in a shape that is in contact with at least one side surface of the first component.
The alignment module of the module test socket comprises a guide plate coupled to any one of the arms and having a cam protrusion and an engaging member formed on a rear surface of the cam protrusion, the push plate having a cam groove formed in the cam protrusion, A pusher formed on the push body and having a push rod that is in contact with and spaced from the first component, and an elastic member that provides the push body with an elastic force in a direction toward the first component.
An inclined portion is formed in the cam groove for moving the push rod in a direction perpendicular to the moving direction of the cam protrusion of the module test socket when viewed in plan view.
An escape portion for receiving the displacement of the arms is formed in the base body of the module test socket.
The arms of the module test socket include an extension portion extending a portion of the upper portion of the fixed unit, and the extension portion is provided with contact pins connected to terminals of the second component disposed on the upper portion of the first component.
The extension of the module test socket includes an insulation member that insulates the contact pins and is secured to the extension.
The module test socket according to the present invention allows the image sensor, which is a component of the camera module, to be aligned at a designated position by a simple operation, and an excessive force is applied to the image sensor during the alignment of the image sensor, .
In addition, the module test socket according to the present invention aligns the image sensor, which is a component of the camera module, at a quickly specified alignment position, interlocks with the operation of aligning the image sensor, and outputs a test signal to the terminal of the VCM module It has an effect that can be applied.
1 is an external perspective view of a module test socket according to an embodiment of the present invention.
2 is an exploded perspective view of FIG.
3 is an exploded perspective view illustrating a guide module according to an embodiment of the present invention.
4 is a cross-sectional view of a part of the guide module cut in the lateral direction.
5 and 6 are plan views for explaining the operation of the module test socket.
In the following description, only parts necessary for understanding the embodiments of the present invention will be described, and the description of other parts will be omitted so as not to obscure the gist of the present invention.
The terms and words used in the present specification and claims should not be construed as limited to ordinary or dictionary meanings and the inventor is not limited to the meaning of the terms in order to describe his invention in the best way. It should be interpreted as meaning and concept consistent with the technical idea of the present invention. Therefore, the embodiments described in the present specification and the configurations shown in the drawings are merely preferred embodiments of the present invention, and are not intended to represent all of the technical ideas of the present invention, so that various equivalents And variations are possible.
The terms frequently used in the present invention are summarized as follows.
The "first part " frequently used in the present invention is defined, for example, as a semiconductor product used in an image processing apparatus. The "first part" may include, for example, a substrate on which an image sensor is mounted that converts incident light into an image. The "first part" may include a substrate on which various electronic components are mounted.
The "second part" frequently used in the present invention is defined as a focusing device that adjusts the focus of an image or an image. The "second part" may be a voice coil motor (VCM) module that adjusts the focus of the image sensor.
1 is an external perspective view of a module test socket according to an embodiment of the present invention. 2 is an exploded perspective view of FIG.
1 and 2, a
The
The
The first part may be a substrate on which an image sensor is mounted as described in the definition of the term above.
In an embodiment of the present invention, the first part may be formed in the shape of a square plate. Although the first part is described as being a rectangular plate shape in the embodiment of the present invention, the first part may be formed in various shapes.
Referring to Fig. 2, the
The
The
The
The
The
Vacuum pressure is formed in the passage formed in the
When vacuum pressure is formed in the
In one embodiment of the present invention, vacuum suction of the first component on the
The
The shape of the
Specifically, the
The
The
The
The
A pair of
The
A fixing
3 is an exploded perspective view illustrating the alignment module according to an embodiment of the present invention. 4 is a cross-sectional view of a portion of the alignment module cut in the lateral direction;
2 through 4, the aligning
The
The
A portion of the
The
The
The
When viewed in plan, some of the side surfaces of the
The engaging
The engaging
The latching
The
The
The
The
The volume of the internal space of the
On the other hand, the
Since the chamfered
The
The
The
The
One end of the
When the distance between the
At this time, since the
Meanwhile, the
Hereinafter, operation of a module test socket according to an embodiment of the present invention will be described.
Figs. 5 and 6 are plan views for explaining the operation of the test socket for testing the module first part. Fig.
First, the first component is disposed on the fixed
After the first part is placed on the fixing
The
When the distance between the
The urging force of the
The
7 is a perspective view showing a module test socket according to another embodiment of the present invention. 8 is an exploded perspective view of Fig. The
7 and 8, a
The
The
The
The
A pair of
The
A first component disposed on the fixed
The ends of the pair of
The
The contact pins 135 and 136 are fixed in an insulated state by the insulating
In operation, when the distance between the pair of
When the first part is aligned with the
After the second component to which the test signal is applied is activated and the first and second components are tested, the first and second components are mutually bonded.
The module test socket according to the present invention can align the image sensor, which is a component of the camera module, with a simple operation of widening or narrowing the driving arm, and an excessive force is applied to the image sensor in the process of aligning the image sensor It is possible to prevent the image sensor from being damaged.
In addition, the module test socket according to the present invention aligns the image sensor, which is a component of the camera module, at a quickly specified alignment position, interlocks with the operation of aligning the image sensor, and outputs a test signal to the terminal of the VCM module , The image sensor can be tested through the VCM module, and the VCM and the image sensor can be assembled together.
It should be noted that the embodiments disclosed in the drawings are merely examples of specific examples for the purpose of understanding, and are not intended to limit the scope of the present invention. It will be apparent to those skilled in the art that other modifications based on the technical idea of the present invention are possible in addition to the embodiments disclosed herein.
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Claims (8)
A support module coupled to the base body and including a fixed unit for temporarily fixing the first component and a guide unit fixed to the fixed unit to align the first component at a specified position;
A drive module including a drive unit coupled to the base body and a pair of arms spaced apart by the drive unit; And
And an alignment module that cooperates with the gap of the arms to bring the first part into close contact with the guide part.
Wherein the drive unit includes a pneumatic cylinder that moves a pair of arms in a direction parallel to an upper surface of the base body.
Wherein the fixed unit includes a fixed plate formed with at least one vacuum hole for sucking the first component by vacuum pressure and a vacuum port formed in the base body and communicated with the vacuum hole, And protruding from the upper surface in a shape that is in contact with at least one side of the first component.
The alignment module includes a guide plate coupled to any one of the arms and having a cam protrusion and an engaging member formed on a rear surface of the cam protrusion, the push plate having a cam groove formed in the cam protrusion, And a pusher having a push rod that is in contact with and spaced from the first component, and an elastic member that provides an elastic force in the direction toward the first component to the push body.
Wherein the inclined portion is formed in the cam groove for moving the push rod in a direction perpendicular to the moving direction of the cam protrusion when viewed in a plan view.
And an escape portion for accommodating the displacement of the arms is formed in the base body.
Wherein the arms include an extension extending a portion of the upper portion of the fixed unit, wherein contact pins are connected to the extended portion, the contact pins being connected to terminals of the second component disposed on the upper portion of the first component.
And the extension portion includes an insulation member that insulates the contact pins and is fixed to the extension portion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020150096324A KR101673375B1 (en) | 2015-07-07 | 2015-07-07 | Module test socket |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020150096324A KR101673375B1 (en) | 2015-07-07 | 2015-07-07 | Module test socket |
Publications (1)
Publication Number | Publication Date |
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KR101673375B1 true KR101673375B1 (en) | 2016-11-09 |
Family
ID=57528785
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020150096324A KR101673375B1 (en) | 2015-07-07 | 2015-07-07 | Module test socket |
Country Status (1)
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KR (1) | KR101673375B1 (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101776797B1 (en) | 2017-05-19 | 2017-09-12 | 신승무 | Electronic parts test center with precise side contact function |
KR101804866B1 (en) | 2016-09-27 | 2017-12-06 | (주) 네스텍코리아 | The camera module assembly with a gripper device for two-way fixed-function |
KR101985205B1 (en) * | 2018-02-14 | 2019-06-03 | (주) 네스텍코리아 | An electronic component test socket having a multi-pusher function in which a contact operation is performed in the same direction as the power transmission direction |
KR101985209B1 (en) * | 2018-02-14 | 2019-06-03 | (주) 네스텍코리아 | An electronic component test socket having a multi-pusher function in which a contact operation is performed in a direction perpendicular to the power transmission direction |
KR20190106130A (en) * | 2018-03-07 | 2019-09-18 | 디플러스(주) | Product support block |
KR102095217B1 (en) * | 2018-12-17 | 2020-03-31 | 주식회사 씨케이엘 | Apparatus for correcting position of product |
KR102218871B1 (en) * | 2020-04-27 | 2021-02-23 | 디플러스(주) | Socket for testing a product |
KR102380940B1 (en) * | 2020-10-15 | 2022-03-31 | 주식회사 세인블루텍 | Camera module auto test socket |
KR102392927B1 (en) * | 2021-09-08 | 2022-05-02 | 주식회사미래기계기술 | Gripper device for testing electronic components |
KR20230041859A (en) * | 2021-09-17 | 2023-03-27 | 디플러스(주) | Circuit board aligning apparatus for product test socket |
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KR20060072948A (en) * | 2004-12-24 | 2006-06-28 | 삼성전자주식회사 | Motor for moving stage of overlay measuring equipment |
KR20090056754A (en) * | 2007-11-30 | 2009-06-03 | 미래산업 주식회사 | Structure of aligning electronic parts |
KR101246182B1 (en) * | 2013-01-22 | 2013-03-22 | 프라임텍 주식회사 | Test socket for camera module |
KR20130063347A (en) * | 2011-12-06 | 2013-06-14 | 삼성전자주식회사 | Contactor and equipment for testing semiconductor device comprising the same |
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2015
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Patent Citations (4)
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KR20060072948A (en) * | 2004-12-24 | 2006-06-28 | 삼성전자주식회사 | Motor for moving stage of overlay measuring equipment |
KR20090056754A (en) * | 2007-11-30 | 2009-06-03 | 미래산업 주식회사 | Structure of aligning electronic parts |
KR20130063347A (en) * | 2011-12-06 | 2013-06-14 | 삼성전자주식회사 | Contactor and equipment for testing semiconductor device comprising the same |
KR101246182B1 (en) * | 2013-01-22 | 2013-03-22 | 프라임텍 주식회사 | Test socket for camera module |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101804866B1 (en) | 2016-09-27 | 2017-12-06 | (주) 네스텍코리아 | The camera module assembly with a gripper device for two-way fixed-function |
KR101776797B1 (en) | 2017-05-19 | 2017-09-12 | 신승무 | Electronic parts test center with precise side contact function |
KR101985205B1 (en) * | 2018-02-14 | 2019-06-03 | (주) 네스텍코리아 | An electronic component test socket having a multi-pusher function in which a contact operation is performed in the same direction as the power transmission direction |
KR101985209B1 (en) * | 2018-02-14 | 2019-06-03 | (주) 네스텍코리아 | An electronic component test socket having a multi-pusher function in which a contact operation is performed in a direction perpendicular to the power transmission direction |
KR20190106130A (en) * | 2018-03-07 | 2019-09-18 | 디플러스(주) | Product support block |
KR102031073B1 (en) * | 2018-03-07 | 2019-10-11 | 디플러스(주) | Product support block |
KR102095217B1 (en) * | 2018-12-17 | 2020-03-31 | 주식회사 씨케이엘 | Apparatus for correcting position of product |
KR102218871B1 (en) * | 2020-04-27 | 2021-02-23 | 디플러스(주) | Socket for testing a product |
KR102380940B1 (en) * | 2020-10-15 | 2022-03-31 | 주식회사 세인블루텍 | Camera module auto test socket |
KR102392927B1 (en) * | 2021-09-08 | 2022-05-02 | 주식회사미래기계기술 | Gripper device for testing electronic components |
KR20230041859A (en) * | 2021-09-17 | 2023-03-27 | 디플러스(주) | Circuit board aligning apparatus for product test socket |
KR102608592B1 (en) | 2021-09-17 | 2023-12-04 | 디플러스(주) | Circuit board aligning apparatus for product test socket |
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