KR102289105B1 - Pushing apparatus for test handler - Google Patents

Abstract

The present invention relates to a pressing device for a test handler.
A pressing device according to the present invention includes: a pusher for pressing the semiconductor device for electrical connection between the semiconductor device and the tester; a mounting plate on which the pusher is installed; an elastic member elastically supporting the pusher with respect to the mounting plate; a cooling module for supplying cold air to the contact portion of the pusher (the contact portion is a portion in which the pusher is in contact with the semiconductor device in front); and a driving source for pushing the mounting plate forward or pulling it backward so that the pusher presses or releases the pressurization of the semiconductor device. Including, wherein the pusher has a cooling space therein to send the cold air supplied by the cooling module to the contact portion, the cooling space is opened to the rear.
According to the present invention, since the cold air of the refrigerant passes through the heat pipe or directly affects the contact portion of the pusher, heat of the semiconductor device can be quickly removed, and the efficiency of heat removal is improved because the cold air is not taken away by other components. is improved

Description

Pressing device for test handlers {PUSHING APPARATUS FOR TEST HANDLER}

The present invention relates to a test handler supported for testing of manufactured semiconductor devices. In particular, the present invention relates to a pressing device for pressing or supporting a semiconductor device toward a tester.

The test handler supports testing of manufactured semiconductor devices. And the test handler classifies the semiconductor device according to the test result.

1 is a conceptual diagram of a general test handler 100 viewed from a plane.

The test handler 100 includes a test tray 110, a first picking device 120, a first temperature control chamber 130, a test chamber 140, TEST CHAMBER, a pressure device 150, a second temperature control chamber ( 160), and a second picking device 170.

As shown in FIG. 2 , a plurality of inserts 111 on which the semiconductor device D can be seated are installed in the test tray 110 to be somewhat movable. The test tray 110 circulates along a circulation path C determined by a plurality of transfer devices (not shown).

The first picking device 120 loads the semiconductor device to be tested loaded in the customer tray into the test tray at the loading position (LP).

The first temperature control chamber 130 is provided to preheat or precool the semiconductor device loaded on the test tray 110 transferred from the loading position LP according to test environment conditions. .

The test chamber 140 is provided to test the semiconductor device in the test tray 110 that has been preheated or precooled in the soak chamber 130 and then transferred to the test position (TP).

The pressing device 150 presses the semiconductor device in the test tray 110 in the test chamber 140 toward the tester TESTER. Due to this, the semiconductor device in the test tray 110 is electrically connected to the test socket of the tester TESTER. The present invention relates to such a pressing device 150 and will be described in more detail later.

The second temperature control chamber 160 is provided to return the heated or cooled semiconductor device in the test tray 110 transferred from the test chamber 140 to room temperature.

The unloading device 170 classifies the semiconductor devices in the test tray 110 from the second temperature control chamber 160 to the unloading position (UP: UNLOADING POSITION) by test grade and unloads them into an empty customer tray. ) do.

As described above, the semiconductor device is loaded on the test tray 110 from the loading position LP to the first temperature control chamber 130 , the test chamber 140 , the second temperature control chamber 160 , and the The test tray 110 is transferred to the loading position UP, and unloading of the semiconductor devices loaded at the unloading position UP is completed is transferred to the loading position LP. If the test tray 110 is cyclically moved in the opposite direction to the circulation path C according to the change of the test mode, the roles of the first picking device 120 and the roles of the second picking device 170 are switched. , the roles of the first temperature control chamber 130 and the second temperature control chamber 160 are also switched.

Subsequently, the prior art for the pressurizing device 150 related to the present invention will be described in more detail.

As shown in the schematic side view of FIG. 3 , the conventional pressing device 150 includes a plurality of pushers 151 , a mounting plate 152 , and a driving source 153 . For reference, in FIG. 3, the spacing between the respective components is exaggerated.

The pusher 151 includes a pressing portion 151a, an extended portion 151b and a guide pin 151c.

The pressing portion 151a is a portion for pressing the semiconductor device D seated on the insert 111 of the test tray 110 . For this, the front surface F of the pressing portion 151a is in contact with the semiconductor device D during the pressing operation. The pressing portion 151a also serves to uniformly support the semiconductor device D pushed in the opposite direction of the tester TESTER by the terminal (eg, pogo pin) of the test socket. Hereinafter, in this specification and claims, the term 'pressurization' encompasses the meanings of 'pressurization' and 'support'.

The extended portion 151b is in contact with one surface (a surface facing the pusher) of the insert 111 during the pressing operation. Accordingly, damage to the semiconductor device D due to excessive movement of the pusher 151 is prevented.

The guide pin 151c guides the front surface F of the pressing part 151a to precisely contact the semiconductor device D. That is, the guide pin 151c is first inserted into the guide hole 111a formed in the insert 111 before the front surface F of the pressing part 151a comes into contact with the semiconductor device D. Accordingly, in a state where the positions of the insert 111 and the pusher 151 are precisely set, the front surface F of the pressing part 151a may contact the semiconductor device D. As shown in FIG.

For reference, two pressing parts 151a may be provided on one pusher 151 as shown in FIG. 3 , and only one pressing part 151a may be provided on one pusher 151 depending on implementation. there is. And the pressing portion (151a) and the expanded portion (151b) may be separated or may be formed integrally.

A plurality of pushers 151 are installed on the mounting plate 152 in a matrix form.

In general, a combination of the pusher 151 and the mounting plate 152 is referred to as a match plate MP.

The driving source 153 may be provided as a cylinder or a motor. This driving source 153 moves the match plate MP toward the tester TESTER. That is, when the driving source 153 operates, the match plate MP is first in close contact with the test tray 110 . Then, the test tray moves to the tester side. Accordingly, the semiconductor device D seated on the insert 111 of the test tray 110 is electrically connected to the tester TESTER.

On the other hand, referring to Figures 2 and 4 to 6 of Publication No. 10-2009-0123441 (Name of the invention: Match plate for electronic component inspection support device), it is shown that the pusher is elastically supported with respect to the mounting plate by the spring. Able to know. The reason for this is to elastically advance and retreat the pusher with respect to the mounting plate. Therefore, even when there is a somewhat excessive movement of the pusher by the movement source, damage to the pogo pin or the spring supporting the pogo pin in contact with the terminal of the semiconductor device (ball in the case of the BGA type) is prevented.

Meanwhile, the semiconductor device may be used in various temperature environments. Therefore, most tests are performed in a state in which the temperature of the semiconductor device is artificially increased or decreased. If the semiconductor device is tested outside the required temperature range, of course, the reliability of the test is lowered.

In order to ensure the reliability of the test, the inside of the test chamber is controlled to have a required temperature environment.

Furthermore, Korean Patent Laid-Open No. 10-2005-0055685 (Title of the Invention: Test Handler), etc. proposes a technology for more precisely controlling the temperature of a semiconductor device using a duct (hereinafter referred to as 'Prior Invention 1'). The prior art 1 is a technology for supplying temperature-controlled air to each semiconductor device using a duct.

However, the semiconductor device may be out of the required temperature range due to self-heating while being tested. In order to solve this problem, the technology of Korean Patent Laid-Open Patent No. 10-2004-0015337 (title of invention: electronic component handling device and electronic component temperature control method) (hereinafter referred to as 'conventional invention 2') has been proposed.

Conventional Invention 2 is a technology for naturally dissipating the heat of a semiconductor device to the surrounding air by configuring a heat absorbing and dissipating body at the rear end of the pusher (called 'pusher' in Conventional Invention 2). However, according to the prior art 2, the cooling efficiency is lowered because it is a natural heat dissipation method.

In addition, Korean Patent Laid-Open Patent Publication No. 10-2009-0047556 (Title of the Invention: Apparatus and method for controlling the temperature of an electronic device under test) discloses a technology for lowering the temperature of an electronic device under test with a typical cooling system using a compressor and a condenser (hereinafter referred to as 'Conventional Invention 3') is presented. However, this prior art 3 is difficult to apply when hundreds of semiconductor devices are tested at once.

In particular, prior invention 2 and prior invention 3 cannot be combined with prior invention 1 in which temperature-controlled air is supplied to each semiconductor device using a duct. Therefore, if the prior inventions 2 or 3 are applied to the test handler, the benefit of precise temperature control using the duct cannot be obtained.

Therefore, the applicant of the present invention proposes a technique for configuring a cooling plate and a transmission member for transferring the cold air of the cooling plate to the pusher to the pressurizing device through Korean Patent Application Laid-Open No. 10-2014-0101458 (hereinafter referred to as 'prior art 1'). did. And according to this prior art 1, it is possible to quickly absorb the self-heating of the semiconductor device.

However, even now, the integration technology in the semiconductor field is continuously developing. Of course, as the degree of integration increases, the amount of self-heating according to the operation of the semiconductor device increases. Therefore, it can be sufficiently predicted that the self-heating amount of the semiconductor device will increase considerably in the not-too-distant future. In this case, it can also be predicted that the prior art 1 may not be able to quickly handle the self-heating of the semiconductor device. This is because, in the process of transferring the cold air of the cooling plate, the cold air absorption according to the specific heat of the pusher, the transfer member, and the metal materials in contact with the pusher and the transfer member may interfere with the rapid transfer of cold air. In addition, the temperature environment inside the test chamber to which the pusher is exposed also acts as an obstacle in removing self-heating of the semiconductor device. And it is predicted that this will lead to a decrease in the reliability of the test or damage to the semiconductor device due to self-heating.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a technology capable of minimizing the absorption of cold air or loss of cold air due to various configurations.

As described above, the pressurizing device for a test handler according to the present invention includes: a pusher for pressing the semiconductor element for electrical connection between the semiconductor element and the tester; a mounting plate on which the pusher is installed; an elastic member elastically supporting the pusher with respect to the mounting plate; a cooling module for supplying cold air to the contact portion of the pusher (the contact portion is a portion in which the pusher is in contact with the semiconductor device in front); and a driving source for pushing the mounting plate forward or pulling it backward so that the pusher presses or releases the pressurization of the semiconductor device. Including, wherein the pusher has a cooling space therein to send the cold air supplied by the cooling module to the contact portion, the cooling space is opened to the rear.

The cooling module may include: a cooling block having a refrigerant passage through which a refrigerant flows; and a heat pipe having a front end in contact with the contact portion through the cooling space, and a rear end installed so as to be in contact with the refrigerant passage side; includes

The cooling module may include: an elastic pad elastically supporting the front end of the cooling block; an elastic support for elastically supporting the rear end of the cooling block; and an installation block in which the elastic pad and the elastic support are installed to movably support the cooling block. further includes

The cooling module may include a coupling member for coupling and installing the elastic support to the installation block; further includes

The cooling module may include a heat insulating member made of a heat insulating material surrounding an outer surface of the heat pipe; further includes

The cooling module may include a conductive member made of a conductive material inserted into the cooling space; Further comprising, the conductive member has a front end in contact with the contact portion, a rear end has a gripping groove capable of gripping the front end of the heat pipe, the front end of the heat pipe is inserted into the gripping groove.

A fluid flow path is formed on the outside of the heat pipe,

The contact portion has a spray hole for spraying the temperature control fluid coming through the fluid passage from the duct for supplying the temperature control fluid to the semiconductor device.

At least a portion of the pusher may be made of a non-metallic insulating material.

The cooling module may include: a cooling block having a refrigerant passage through which a refrigerant flows; and a guide member for guiding the movement of the refrigerant so that the refrigerant flowing through the refrigerant passage passes through the contact portion through the cooling space. may include.

According to the present invention as described above, there are the following effects.

First, the self-heating of the semiconductor device can be quickly removed by transferring the cold air of the refrigerant to the contact portion at the front end of the pusher by the heat pipe or by directly affecting the contact portion at the front end of the pusher.

Second, the efficiency of removal for self-heating is improved because the amount lost by the outside air while the cold air moves to the contact part at the front end of the pusher is minimized.

Accordingly, the reliability of the test is further improved, and damage to the semiconductor device that may occur due to self-heating during the test can be prevented.

1 is a conceptual plan view of a general test handler.
2 is a schematic diagram of a test tray for a general test handler.
3 is a schematic diagram for explaining a matching relationship between a match plate, a test tray, and a tester in a general test handler.
4 is a schematic side cross-sectional view of a pressing device according to a first embodiment of the present invention.
5 is an enlarged view illustrating an enlarged portion A of FIG. 4 .
Fig. 6 is an excerpted cross-sectional view of a pusher applied to the pressing device of Fig. 4;
Fig. 7 is a schematic perspective view of the pusher of Fig. 6;
Fig. 8 is an excerpted cross-sectional view of a cooling module applied to the pressurizing device of Fig. 4;
9 is an exaggerated view for explaining the operation of the cooling module of FIG.
Fig. 10 is a schematic side cross-sectional view of a portion of a pressing device according to a second embodiment of the present invention;
Fig. 11 is an excerpt of a cooling module applied to the pressurization device of Fig. 10;

Hereinafter, preferred embodiments according to the present invention as described above will be described with reference to the accompanying drawings.

For reference, overlapping descriptions are omitted or compressed as much as possible for the sake of brevity of description. In addition, in the accompanying drawings, overlapping reference numerals for the same components have been omitted as much as possible.

<First embodiment>

4 is a schematic side cross-sectional view of the pressing device 450 according to the first embodiment of the present invention, and FIG. 5 is an enlarged view showing an enlarged portion A of FIG. 4 .

4 and 5, the pressurizing device 450 for a test handler according to the present embodiment (hereinafter abbreviated as 'pressurizing device') includes a plurality of pushers 451, a mounting plate 452, and a coil. It includes a spring 453 , a pressure plate 454 , an injection member 455 , a cooling module 456 , a duct 457 , a driving source 458 , and a temperature sensor 459 .

The pusher 451 pushes the semiconductor device D while its front surface (which is the end surface on the side facing the semiconductor device) is in contact with the semiconductor device D seated on the insert TI of the test tray during the pressing operation. Apply pressure to the test socket side of the tester. And the pusher 451 is installed so as to move forward relatively with respect to the mounting plate 452 . The pusher 451 includes a pressing portion 451a, an extension portion 451b, and a guide pin 451c as shown in the excerpted cross-sectional view of FIG. 6, and a spray hole 451d is formed toward the front.

The pressing portion 451a is a portion for pressing the semiconductor device D seated on the insert TI of the test tray. That is, during the pressing operation, the front surface PF of the pressing portion 451a is in contact with the semiconductor device D. As shown in FIG. Accordingly, the front end of the pressing portion 451a may be referred to as a contact portion CP in contact with the semiconductor device D. Referring to FIG.

The expanded portion 451b has a periphery larger than that of the pressing portion 451a. The extended portion 451b contacts one surface (a surface facing the pusher) of the insert TI when a pressing operation is performed in a state in which the semiconductor device D is not seated on the insert TI. Accordingly, the front surface PF of the pressing portion 451a is prevented from contacting the test socket of the tester.

The guide pin 451c guides the front surface PF of the pressing part 451a to precisely contact the semiconductor device D.

The injection hole 451d is formed so that the fluid for temperature control coming from the duct 457 can be injected into the semiconductor device D.

The pusher 451 as above has a cooling space CS for sending the cold air supplied by the cooling module 456 to the contact portion CP therein. In addition, in order to minimize the absorption of cold air due to the specific heat of the pusher 451 itself, a part of the pressing part 451a and the extended part 451b is a non-metallic insulating material (IM) such as epoxy, as shown in the schematic perspective view of FIG. ) is made of Of course, the front portion of the contact portion CP should be made of a metallic heat conductor HL having excellent thermal conductivity, such as copper. Here, the area of the thermal conductor HL may be determined according to the size of the semiconductor device.

An installation hole 452a for installing the pusher 451 is formed in the installation plate 452 .

The coil spring 453 is provided as an elastic member for elastically supporting the pusher 451 with respect to the mounting plate 452 .

A plurality of mounting plates 452 to which the pusher 451 is coupled are installed in the pressure plate 454 . The pressure plate 454 is a fluid flow path that allows the temperature control fluid coming from the installation groove 454a and the duct 457 for installing the mounting plate 452 and the injection member 455 to be installed to the pusher 451 side. (454b) is formed. Here, the fluid flow path 454b is connected to the installation groove 454a.

The injection member 455 is provided to inject the temperature control fluid coming from the duct 457 through the fluid flow path 454b and the installation groove 454a of the pressure plate 454 toward the pusher 451 . Accordingly, the injection member 455 has a guide hole 455a for guiding the temperature control fluid input to the installation groove 454a to the pusher 451 side. Here, a cooling fluid for cooling the semiconductor device D is supplied to the fluid passage 454b, and the fluid used may be air or a gas such as a cooling gas.

The cooling module 456 is provided to supply cold air to the contact portion CP of the pusher 451 . The cooling module 456 is a cooling block 456a, a heat pipe 456b, a heat insulating member 456c, a conductive member 456d, an elastic pad 456e, and an elastic support body 456f, as shown in the cross-sectional view of Fig. 8. , including an installation block (456g) and a coupling member (456h).

The cooling block 456a has a refrigerant passage CW through which refrigerant supplied from an external chiller (not shown) flows. The cooling block 456a is preferably made of a non-metallic insulating material such as epoxy to insulate the refrigerant on the refrigerant passage CW from external air.

The heat pipe 456b is provided to quickly transfer the cold air of the refrigerant on the refrigerant passage CW to the contact portion CP of the pusher 451 . Accordingly, the front end of the heat pipe 456b is in contact with the contact portion CP through the cooling space CS, and the rear end portion is installed so as to be in contact with the refrigerant passage CW.

The heat insulating member 456c is provided to surround the outer surface of the heat pipe 456b to prevent loss of cold air transmitted by the heat pipe 456b. Therefore, it is preferable to be provided with a resin-based insulating material having excellent thermal insulation properties. And, as shown, a gap t exists between the inner surface of the heat insulating member 456c and the outer surface of the heat pipe 456b to prevent direct contact between the heat insulating member 456c and the heat pipe 456b, thereby improving the heat insulating performance. It is desirable to be able to Of course, it is also possible to implement the heat insulating member 456c and the heat pipe 456b in contact with each other when it is difficult to space.

The conductive member 456d is inserted into the cooling space CS, the front end is in contact with the heat conductor HL of the contact portion CP, and the front end of the heat pipe 456b is inserted into the rear end of the heat pipe 456b. It has a gripping groove (GS) capable of gripping. Since the conductive member 456d is in thermal contact with the heat pipe 456b as much as the area of the inner surface constituting the gripping groove GS, the cold air of the heat pipe 456b is at a higher speed at the contact portion CP. (HL) can be conducted. Of course, the conductive member 456d is also preferably made of a metal material such as copper having excellent thermal conductivity.

For reference, the heat pipe 456b, the heat insulating member 456c, and the conductive member 456d may be integrally coupled. Of course, as in the present embodiment, the heat pipe 456b, the heat insulating member 456c, and the conductive member 456d may all be modularly integrated, but some components may be selectively modularized.

And to the outside of the heat pipe 456b and the heat insulating member 456c, the fluid for temperature control coming through the fluid flow path 454b of the pressurizing plate 454 and the guide hole 454a of the injection member 455 is injected through the injection hole 451d. ), a fluid flow path AW that can be moved to the side is formed and disposed on the cooling space CS of the pusher 451 (see FIG. 6 ). Of course, it is also possible to form a fluid flow path separated from the cooling space in the pusher depending on the implementation.

Meanwhile, as mentioned above, the area of the thermal conductor HL may be determined according to the size of the semiconductor device. In this case, the heat pipe 456b, the heat insulating member 456c, and the conductive member 456d are used as they are, and the pusher ( Although only 451 may be replaced, the heat pipe 456b, the heat insulating member 456c, and the conductive member 456d may also need to be replaced. This replacement will be described later.

The elastic pad 456e elastically supports the front end of the cooling block 456a.

The elastic support 456f elastically supports the rear end of the cooling block 456a. Since the cooling block 456a and the heat pipe 456b receive an elastic pressing force forward by the elastic support 456f, the conductive member 456d coupled to the front end of the heat pipe 456b is the contact portion CP. It is possible to maintain contact with the heat conductor (HL) at all times. Here, the front end of the elastic support 456f and the rear end of the cooling block 456a maintain only a contact state, and are not coupled or fitted to each other. Therefore, the cooling block 456a to which the heat pipe 456b is coupled can move freely without being constrained by the elastic support 456f, and thereby conduction even if the pusher 451 pressing the semiconductor device D is slightly inclined. Surface contact may be maintained between the front surface of the member 456d and the rear surface of the heat conductor HL.

The installation block 456g is provided to install the elastic pad 456e and the elastic support 456f to support the cooling block 456a in a flowable manner. This installation block (456g) is coupled to the pressing plate (454).

The coupling member 456h is provided for coupling the elastic support 456f to the installation block 456g. To this end, the coupling member 456h is provided in a 'L' shape as in this embodiment, so that one side is fixed to the installation block 456g, and the rear end of the elastic support body 456f is coupled to the other side.

The duct 457 is provided to supply the temperature control fluid to each of the semiconductor devices D through the injection holes 451d formed in the plurality of pushers 451 . A supply hole (not shown) for supplying a fluid for temperature control to the fluid passage 454b of the pressure plate 454 and insertion grooves 457a for inserting the rear end of the cooling module 456 on the front surface of the duct 457 ) are formed.

The driving source 458 advances and retreats the duct 457 in the front-rear direction. Therefore, the driving source 458 ultimately moves the pressure plate 454 coupled to the duct 457, the mounting plate 452 coupled to the pressure plate 454, and the pusher 451 coupled to the mounting plate 452 in the front-rear direction. retreat to The driving source 490 may be provided as a cylinder or a motor.

The temperature sensor 459 is provided on the front side of the pusher 451 and senses the temperature of the semiconductor device. A more specific and stable installation position of the temperature sensor 459 is preferably a position not subject to temperature interference between the conductive member 456d and the heater pipe 456b and a position shielded by the insulating material IM. Of course, the temperature sensor 459 is preferably installed at a position in direct contact with the semiconductor device, and may be covered with a protective film to prevent contamination or damage, if necessary.

Next, the operation of the pressing device 450 as described above will be described.

The test of the semiconductor device is performed while the driving source 458 operates and the pusher 451 presses the semiconductor device seated on the insert TI. During the test, the temperature of the semiconductor device D increases due to self-heating. And the temperature sensor 459 senses this temperature situation. A controller (not shown) supplies refrigerant to the cooling block 456a by operating a chiller (not shown), if necessary, after sensing information coming from the temperature sensor 459 . Accordingly, a low-temperature refrigerant flows through the refrigerant passage CW of the cooling block 456a, and the cold air of the refrigerant is rapidly transferred to the contact portion CP of the pusher 451 by the heat pipe 456b. Then, as cold air is rapidly transferred to the semiconductor device D in contact with the contact portion CP, the temperature of the semiconductor device D decreases. Of course, the temperature sensor 459 continuously senses such a temperature situation, and the controller stops the operation of the chiller when the temperature of the semiconductor device D falls below a certain level.

Of course, as described above, only cooling by the cooling module 456 may be applied, but depending on implementation, the cooling fluid is introduced into the injection hole 451d using the duct 457 together with cooling by the cooling module 456. It can also be used by mixing a fluid cooling method that sprays.

Meanwhile, as in the exaggerated view of FIG. 9 , the pusher 451 may be inclined in some cases while pressing the semiconductor device D. As shown in FIG. In this case, since the cooling block 456a of the cooling module 456 is elastically supported by the elastic support 456f to be flowable, the heat pipe 456b and the cooling block 456a are inclined of the pusher 451. can be tilted in response to Accordingly, there is no concern that twisting with respect to the inclination of the pusher 451 is applied to the heat pipe 456b.

For reference, when the standard of a semiconductor device to be newly tested is changed, it is necessary to replace the pusher 451 , the heat pipe 456b , the heat insulating member 456c , and the conductive member 456d. In this case, after removing the tester at the front, the pusher 451, the heat pipe 456b, the heat insulating member 456c, and the conductive member 456d may be replaced as shown in FIG. At this time, when the heat pipe 456b, the heat insulating member 456c, and the conductive member 456d are integrated, the time required for replacement can be reduced. Of course, when the heat pipe 456b, the heat insulating member 456c, and the conductive member 456d are not integrated, the heat pipe 456b, the heat insulating member 456c, and the conductive member 456d are individually replaced according to individual damage. resources can be saved by

In addition, if necessary, only the pusher 451 or even the mounting plate 452 may be replaced, and the heat pipe 456b, the heat insulating member 456c, and the conductive member 456d may all be replaced.

For reference, in this embodiment, one mounting plate 452 is provided for every two pushers 451, but it is also possible that all pushers 451A are installed on one mounting plate 452A as shown in FIG. . In this case, a support rail SR capable of supporting the mounting plate 452A and a mover MA capable of moving the support rail SR in the front-rear direction may be additionally configured. Therefore, if replacement of the pusher 451A or the like is required, the mounting plate 452A is moved forward by the mover MA as shown in FIG. can be done

<Second embodiment>

13 is an enlarged side cross-sectional view of a part of the pressing device 950 according to the second embodiment of the present invention.

13 , the pressing device 950 according to the present embodiment includes a pusher 951 , a mounting plate 952 , a coil spring 953 , a pressing plate 954 , a spraying member 955 , and cooling. It includes a module 956 , a duct (not shown), a driving source (not shown), and a temperature sensor 959 .

Among the above components, the pusher 951, the mounting plate 952, the coil spring 953, the pressure plate 954, the injection member 955, the duct, the driving source and the temperature sensor 959 are the same as in the first embodiment. Since they are the same, the description thereof will be omitted.

The cooling module 956 includes a cooling block 956a, a guide member 956b, a heat insulating member 956c, a conductive member 956d, an elastic pad 956e, an elastic support body 956f and Includes an installation block (956g).

The cooling block 956a, the elastic pad 956e, the elastic support 956f, and the installation block 956g are the same as those of the first embodiment, and thus descriptions thereof will be omitted.

In the guide member 956b, the refrigerant in the refrigerant passage CW of the cooling block 956a passes through the contact portion CP of the pusher 951 through the cooling space CS (refer to the arrow in FIG. 14) and passes to guide the movement of refrigerant. The guide member 956a may be provided as an insulator in order to block the effect of temperature between the refrigerant on the entry side and the exit side.

The heat insulating member 956c is provided in a cylindrical shape so as not to be taken away from the cold air of the refrigerant passing through the contact portion CP out of the cooling block 956a to form a path of the refrigerant. That is, the guide member 956b is provided in a form to be inserted into the hollow cylindrical heat insulating member 956c, so that the inner space of the heat insulating member 956c is divided into an inflow path IW and an outflow path OW of the refrigerant. will share Accordingly, the refrigerant exiting the refrigerant passage CW moves to the contact portion CP of the pusher 951 through the inflow passage IW, and then enters the refrigerant passage CW through the outlet passage OW. .

The front end of the conductive member 956d is in contact with the contact portion CP of the pusher 951 and supports the front end of the guide member 956b as the rear end. Of course, the conductive member 956d is made of a metal material having excellent thermal conductivity. Also in this embodiment, the guide member 956b, the heat insulating member 956c, and the conductive member 956d may be preferably considered to be integrally coupled.

According to the present embodiment, since the refrigerant supplies cold air to the semiconductor device while moving toward the direct contact portion CP, the temperature of the semiconductor device can be decreased very quickly.

As described above, the detailed description of the present invention has been made by the embodiments with reference to the accompanying drawings, but since the above-described embodiments have been described only with preferred examples of the present invention, the present invention is not limited to the above embodiments It should not be construed as being limited only to, and the scope of the present invention should be understood as the following claims and their equivalent concepts.

450, 490: pressure device for test handler
451, 951: pusher
451a: pressing part 451b: extended part
451c: guide pin 451d: injection hole
CP : Contact part CS : Cooling space
IM : Insulation material
452, 952: mounting plate
453, 953: coil spring
456, 956: cooling module
456a, 956a: cooling block 456b: heat pipe
456c, 956c: insulating member 456d, 956d: conducting member
456e, 956e: elastic pad 456f, 956f: elastic support
456g, 956g: installation block 956b: guide member
CW: Refrigerant flow path
457 : Duct
458: drive source
AW: fluid flow path

Claims (8)

a pusher for pressing the semiconductor device for electrical connection between the semiconductor device and the tester;
a mounting plate on which the pusher is installed;
an elastic member elastically supporting the pusher with respect to the mounting plate;
a cooling module for supplying cold air to the contact portion of the pusher (the contact portion is a portion in which the pusher is in contact with the semiconductor device in front); and
a driving source that pushes the mounting plate forward or pulls backward so that the pusher presses or releases the pressurization of the semiconductor device; including,
The pusher includes a pressing portion for pressing the semiconductor device and an extended portion whose circumference is wider than the pressing portion,
The pusher has a cooling space therein to send the cold air supplied by the cooling module to the contact portion, and is opened rearward,
The cooling module is
a cooling block having a refrigerant passage through which the refrigerant flows;
a guide member for guiding the movement of the refrigerant so that the refrigerant flowing through the refrigerant passage passes through the contact portion through the cooling space; and
Insulation member having a hollow tubular shape while being a heat insulating material; including,
The guide member is provided with a heat insulating material and is inserted into the heat insulating member to divide the internal space of the heat insulating member into an inflow path and an outflow path of the refrigerant.
Pressurizing device for test handler. a pusher for pressing the semiconductor device for electrical connection between the semiconductor device and the tester;
a mounting plate on which the pusher is installed;
an elastic member elastically supporting the pusher with respect to the mounting plate;
a cooling module for supplying cold air to the contact portion of the pusher (the contact portion is a portion in which the pusher is in contact with the semiconductor device in front); and
a driving source that pushes the mounting plate forward or pulls backward so that the pusher presses or releases the pressurization of the semiconductor device; including,
The pusher has a cooling space therein to send the cold air supplied by the cooling module to the contact portion,
The cooling space is opened to the rear,
The cooling module is
a cooling block having a refrigerant passage through which the refrigerant flows; and
a guide member for guiding the movement of the refrigerant so that the refrigerant flowing through the refrigerant passage passes through the contact portion through the cooling space; and
a conductive member made of a conductive material inserted into the cooling space; including,
The conductive member is provided with a metal material so that the front end is in contact with the contact portion, and the rear end supports the front end of the guide member
Pressurizing device for test handler. a pusher for pressing the semiconductor device for electrical connection between the semiconductor device and the tester;
a mounting plate on which the pusher is installed;
an elastic member elastically supporting the pusher with respect to the mounting plate;
a cooling module for supplying cold air to the contact portion of the pusher (the contact portion is a portion in which the pusher is in contact with the semiconductor device in front); and
a driving source that pushes the mounting plate forward or pulls backward so that the pusher presses or releases the pressurization of the semiconductor device; including,
The pusher has a cooling space therein to send the cold air supplied by the cooling module to the contact portion,
The cooling space is opened to the rear,
The cooling module is
a cooling block having a refrigerant passage through which the refrigerant flows;
an elastic pad elastically supporting the front end of the cooling block; and
an elastic support for elastically supporting the rear end of the cooling block; containing
Pressurizing device for test handler. 3. The method of claim 1 or 2,
The cooling module is
an elastic pad elastically supporting the front end of the cooling block;
an elastic support for elastically supporting the rear end of the cooling block; and
an installation block in which the elastic pad and the elastic support are installed to support the cooling block in a flowable manner; characterized in that it further comprises
Pressurizing device for test handler. 5. The method of claim 4,
The cooling module is
a coupling member for coupling and installing the elastic support to the installation block; characterized in that it further comprises
Pressurizing device for test handler. 3. The method of claim 2,
The cooling module may include a heat insulating member having a hollow tubular shape while being a heat insulating material; further comprising,
The guide member is inserted into the heat insulating member to divide the internal space of the heat insulating member into an inflow path and an outflow path of the refrigerant.
Pressurizing device for test handler. According to claim 1,
The cooling module is
a conductive member made of a conductive material inserted into the cooling space; further comprising,
The front end of the conductive member is in contact with the contact portion, and the rear end supports the front end of the guide member.
Pressurizing device for test handler. 4. The method of any one of claims 1, 2 or 3,
The pusher is characterized in that at least a part is made of a non-metallic insulating material.
Pressurizing device for test handler.

Images