CN113770039A - Airflow adjusting device and test handler provided with same - Google Patents
Airflow adjusting device and test handler provided with same Download PDFInfo
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- CN113770039A CN113770039A CN202110447283.4A CN202110447283A CN113770039A CN 113770039 A CN113770039 A CN 113770039A CN 202110447283 A CN202110447283 A CN 202110447283A CN 113770039 A CN113770039 A CN 113770039A
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- adjusting
- airflow
- air flow
- unit
- hole
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
- B07C5/362—Separating or distributor mechanisms
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67333—Trays for chips
Abstract
Embodiments of the present description provide an airflow adjusting device and a test handler having the same. An airflow adjustment device according to an embodiment of the present specification includes: a fan forming an air flow for controlling a temperature of the semiconductor element mounted in the test tray; the air duct guides the air flow to the direction of the interface board; an air flow adjusting plate which is positioned between a pressurizing unit for pushing the double-sided template to the direction of the interface plate and a driving unit for moving the pressurizing unit and is provided with a plurality of holes through which the air flow guided by the air duct can pass; and a first flow rate adjusting unit attached to at least one hole formed in the airflow adjusting plate and adjusting an open area of the at least one hole. The flow regulating unit regulates the opening area of the hole formed in the air flow regulating plate, so that the air flow in the testing chamber can be controlled, and the temperature deviation of the semiconductor element can be reduced.
Description
Technical Field
The present specification relates to an air flow regulator and a test handler including the same, and more particularly, to an air flow regulator for controlling the temperature of a semiconductor device in a test chamber and a test handler including the same.
Background
Semiconductor (or display) manufacturing processes include, for example, exposure, evaporation, etching, ion implantation, cleaning, and the like as processes for manufacturing semiconductor elements on a substrate (e.g., a wafer). Additionally, inspection and packaging for each semiconductor element formed on the substrate may be performed. In particular, after the process for the semiconductor elements is completed, an inspection for the function and/or performance of each semiconductor element may be performed.
In order to inspect a semiconductor device, a test handler is provided for storing and transporting the semiconductor device, bringing the semiconductor device into contact with a test interface having a plurality of contact pins for testing, and carrying out the tested semiconductor device. The test handler is provided with a test chamber for providing a test environment for semiconductor devices, and particularly, it is required to provide a temperature suitable for a target test environment for each semiconductor device. In general, a plurality of semiconductor devices are combined with a test interface in a state of being mounted on a test tray, and a temperature deviation by semiconductor device may be generated, and a method for minimizing the temperature deviation by semiconductor device is under study.
Disclosure of Invention
Accordingly, embodiments of the present specification provide an airflow adjusting device for minimizing temperature deviation of a semiconductor element and a test handler having the same.
In addition, embodiments of the present disclosure provide an air flow adjusting device for controlling an air flow in a test chamber and a test handler having the same.
Further, embodiments of the present specification provide an airflow control device for controlling a position-by-position flow rate of an airflow in a test chamber, and a test handler including the airflow control device.
In addition, embodiments of the present specification provide an airflow adjusting device for controlling the direction of airflow in a test chamber and a test handler including the same.
Embodiments of the present description provide an airflow adjusting device and a test handler having the same. An airflow adjustment device according to an embodiment of the present specification includes: a fan forming an air flow for controlling a temperature of the semiconductor element mounted in the test tray; the air duct guides the air flow to the direction of the interface board; an air flow adjusting plate which is positioned between a pressurizing unit for pushing the double-sided template to the direction of the interface plate and a driving unit for moving the pressurizing unit and is provided with a plurality of holes through which the air flow guided by the air duct can pass; and a first flow rate adjusting unit attached to at least one hole formed in the airflow adjusting plate and adjusting an open area of the at least one hole.
In one embodiment, the plurality of holes may include: a first aperture having a first size in the airflow adjustment plate; and second holes arranged at intervals in the air flow adjustment plate and having a second size smaller than the first size.
In an embodiment, the first flow rate adjusting unit may include: the base part is detachably combined with the airflow adjusting plate and has a shape corresponding to the second hole; a sealing member movably coupled to the base member to seal at least a portion of the second hole; and a control lever that moves the closing member relative to the base member.
In one embodiment, the pressurizing unit may include: a chassis; and a damper coupled to the base frame and pressurizing the match plate by the driving unit.
In one embodiment, it may be that the windshield includes: a damping member contacting the match plate; and a hole through which the airflow can pass.
In an embodiment, the airflow adjusting device may further include: and the second flow regulating unit is detachably combined with the windshield and regulates the opening area of the hole of the windshield.
In an embodiment, the airflow adjusting device may further include: and a first air flow direction adjusting unit rotatably fastened to the left and right sides of the air duct in a pitch (pitch) direction, and adjusting the flow of the air flow in the up-down direction.
In an embodiment, the airflow adjusting device may further include: and a second air flow direction adjusting unit rotatably fastened to upper and lower portions of the air duct in a horizontal (yaw) direction, and adjusting a flow of the air flow in a left and right direction.
A test handler according to an embodiment of the present specification includes: a match plate including a pusher for contacting the plurality of semiconductor elements mounted in the test tray to the interface board for testing; the pressurizing unit pushes and presses the double-sided template towards the direction of the interface board; a driving unit which makes the pressurizing unit move towards the direction of the interface board; and an air flow adjusting device that adjusts an air flow for controlling the temperature of the semiconductor element. Here, the air flow adjusting device may include: a fan that forms the airflow; an air duct that guides the air flow in a direction of the interface board; an air flow adjusting plate positioned between the driving unit and the pressurizing unit and formed with a plurality of holes through which the air flow guided by the air duct can pass; and a first flow rate adjusting unit attached to at least one hole formed in the airflow adjusting plate and adjusting an open area of the at least one hole.
A test handler according to another embodiment of the present specification includes: a match plate including a pusher for contacting the plurality of semiconductor elements mounted in the test tray to the interface board for testing; the pressurizing unit pushes and presses the double-sided template towards the direction of the interface board; a driving unit which makes the pressurizing unit move towards the direction of the interface board; and an air flow adjusting device that adjusts an air flow for controlling the temperature of the semiconductor element. Here, the pressurizing unit may include: a chassis; and a damper coupled to the base frame and including a damping member contacting the driving unit and the match plate and a hole through which the air flow can pass. The air flow adjusting device may include: a fan that forms the airflow; an air duct that guides the air flow in a direction of the interface board; an air flow adjusting plate positioned between the driving unit and the pressurizing unit and formed with a plurality of holes through which the air flow guided by the air duct can pass; a first flow rate adjusting unit attached to at least one hole formed in the airflow adjusting plate and adjusting an open area of the at least one hole; and a second flow rate adjusting unit adjusting an open area of the hole of the damper.
According to the embodiments of the present specification, the air flow in the test chamber is adjusted by the air flow adjusting means according to the temperature distribution of the semiconductor elements mounted in the test tray, so that the temperature deviation of the semiconductor elements can be minimized.
In addition, embodiments of the present description are capable of controlling airflow within a test chamber via an airflow adjustment device.
In addition, according to the embodiments of the present disclosure, the position-based flow rate of the air flow in the test chamber can be controlled by adjusting the opening area of the hole of the air flow adjusting plate.
In addition, according to the embodiments of the present specification, the direction of the air flow in the test chamber may be controlled by an air flow direction adjusting unit provided to the air duct.
Drawings
Fig. 1 shows an example of an outline structure of a test handler according to an embodiment of the present specification.
Fig. 2a and 2b show a pressurizing device and an air flow regulating device of a test handler according to an embodiment of the present specification.
Fig. 3 illustrates an example of a flow rate adjustment plate and a first flow rate adjustment unit according to an embodiment of the present description.
Fig. 4 illustrates an example of a pressurizing unit and a second flow rate adjusting unit according to an embodiment of the present description.
Fig. 5 illustrates an example of an airflow direction adjusting unit according to an embodiment of the present specification.
(description of reference numerals)
20: test tray, 30: custom tray, 100: test handler, 110: loading unit, 120: first chamber, 130: test chamber, 140: second chamber, 150: unloading unit, 150: unloading unit, 210: drive unit, 220: air duct, 230: fan, 240: pressurizing unit, 250: match plate, 260: DUT board, 300: airflow adjusting plate, 310: first flow rate adjusting unit, 400: windshield, 410: second flow rate adjustment unit, 500: first airflow direction adjusting unit, 550: a second airflow direction adjusting unit.
Detailed Description
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those having ordinary knowledge in the art to which the present invention pertains can easily carry out the embodiments. The invention may be implemented in various different ways and is not limited to the embodiments described herein.
In order to clearly explain the present invention, portions that are not related to the description are omitted, and the same reference numerals are given to the same or similar constituent elements throughout the specification.
In addition, in the embodiments, only the representative embodiment will be described using the same reference numerals for the constituent elements having the same structure, and in the other embodiments, only the structure different from the representative embodiment will be described.
In the entire specification, when a part is referred to as being "connected (or coupled)" to another part, it includes not only a case of being "directly connected (or coupled)" but also a case of being "indirectly connected (or coupled)" by interposing another member therebetween. In addition, when a certain portion is referred to as including a certain constituent element, it does not exclude other constituent elements and means that other constituent elements may be included unless specifically stated to the contrary.
All terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs unless defined otherwise. Terms that are defined in commonly used dictionaries should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
Fig. 1 shows an example of an outline structure of a test handler 100 according to an embodiment of the present specification. Fig. 1 is a schematic configuration diagram of a test handler 100 viewed from the ceiling side. In this specification, the test handler 100 refers to a device that electrically connects a semiconductor device and a test interface in order to inspect the function and/or performance of the semiconductor device that has been subjected to a semiconductor process and packaged. In order to inspect the semiconductor devices, the test handler 100 may convey the conveyed semiconductor devices on a tray, create an environment (e.g., temperature) for inspection, sort the inspected semiconductor devices into classes, and carry out the semiconductor devices. In this specification, a case where the test handler 100 is connected to the test apparatus through the test interface is described, but the embodiment of the specification is not limited thereto, and the test handler 100 and the test apparatus may be integrated. That is, the test handler 100 may also be referred to as a test apparatus.
Referring to fig. 1, the test handler 100 may include a loading unit 110, a first chamber 120, a test chamber 130, a second chamber 140, and an unloading unit 150. First, a custom tray (or a C-tray) 30 containing semiconductor devices SD to be inspected is loaded into the test handler 100. The loading unit 110 unloads the semiconductor devices SD stored in the custom tray 30 to the test tray (or T-tray) 20. Here, one of the size, the number of sockets that can accommodate the semiconductor devices SD, and the distance between the sockets may be different between the test tray 20 and the custom tray 30. Although not shown, the loading unit 110 may include a pickup device for sucking the semiconductor element SD, a driving portion for movement of the pickup device, and a movement rail. The test tray 20 on which the semiconductor devices SD are mounted may be transferred to the first chamber 120 by a transfer device (not shown).
The first chamber 120 may be a space for storing the test tray 20 and may be maintained in a temperature environment (first temperature) for testing. That is, the first chamber 120 may hold the test tray 20 transferred from the loading unit 110 at a first temperature. The first temperature is a temperature preset as a test temperature for testing the semiconductor device SD in the test chamber 130. That is, the first temperature may be the same temperature as the test temperature or a temperature close to the test temperature. The first chamber 120 may be referred to as a soak chamber. The test tray 20 stored in the first chamber 120 may be transferred to the test chamber 130 by a transfer device (not shown).
The test chamber 130 provides an environment for testing the semiconductor device SD as a space for performing inspection for the semiconductor device SD in conjunction with the test interface 170. The test interface 170 may be in contact with the semiconductor device SD to apply an electrical signal thereto, and may transmit a signal output from the semiconductor device SD to a test apparatus (not shown). In the test chamber 130, a semiconductor device pressing device for pressing the semiconductor device SD may be provided in order to bring the semiconductor device SD into contact with the interface board of the test interface 170. The structure for inspecting the semiconductor device SD in the test chamber 130 is described in more detail with reference to fig. 2a to 4 below. The semiconductor device SD whose inspection is completed in the test chamber 130 may be transferred to the second chamber 140.
The second chamber 140 is a space for storing the test tray 20 in which the semiconductor devices SD subjected to inspection are stored, and can be maintained at a normal temperature (second temperature). That is, the second chamber 140 may hold the test tray 20 transferred from the test chamber 130 at the second temperature. The test tray 20 stored in the second chamber 140 may be transferred to the unloading unit 150 by a transfer device (not shown). The unloading unit 150 may unload the semiconductor devices SD of the test tray 20 transferred from the second chamber 140 by sorting according to grades.
Fig. 2a and 2b show a pressurizing device and an air flow regulating device of a test handler according to an embodiment of the present specification. Fig. 2a and 2b show a pressurizing device that is provided in the test chamber 130 of fig. 1 to pressurize the semiconductor device SD and a gas flow adjusting device that adjusts the gas flow in the test chamber 130, fig. 2a shows a perspective view, and fig. 2b shows a side view.
Referring to fig. 2a and 2b, the pressing device for pressing the semiconductor device SD includes a DUT (device under test) board 260 combined with the test tray 20 on which the semiconductor device SD to be inspected is mounted, a match plate 250 including a pusher for contacting the semiconductor device SD mounted on the test tray 20 with the interface board, a pressing unit 240 for pressing the match plate 250 in a direction of the interface board, and a driving unit 210 for moving the pressing unit 240 in the direction of the interface board. The airflow regulating device that regulates the airflow within the test chamber 130 may include a fan (fan)230 that creates the airflow and a duct 220 that directs the airflow in the direction of the interface board.
More specifically, the driving unit 210 may include one or more cylinder assemblies. The cylinder assembly may advance the cylinder rod using the gas pressure of gas supplied from a gas supply unit (not shown) including a gas pump, a flow passage, a valve, and the like. The urging force generated from the driving unit 210 may be applied to the semiconductor element SD through the pressurizing unit 240 and the match plate 250.
The pressurizing unit 240 may push the match plate 250 out of the pusher of the match plate 250 by pressing the match plate 250 against the test tray 20 using the force applied by the driving unit 210. The pressurizing unit 240 may include a base frame and a windshield 400 coupled to the base frame. The chassis may be combined with the wind tunnel 220 and/or the driving unit 210, and the windshield 400 may be combined with the chassis. The damper 400 may pressurize the match plate 250 using the urging force transmitted from the driving unit 210.
The match plate 250 can be attached to the test tray 20 by the pressing unit 240, and the semiconductor device SD mounted in the test tray 20 is pressed toward the interface board by the inserter (pusher).
The fan 230 may create an airflow within the test chamber 130. For example, the fan 230 may include an upper fan unit and a lower fan unit, and each fan unit may be connected to an external air inflow device or an air exhaust device to allow air to flow into the test chamber 130 or exhaust air from the test chamber 130 to the outside. For example, the upper fan unit may flow air into the test chamber 130, and the lower fan unit may discharge air from the test chamber 130 to the outside. The air flowed into the test chamber 130 may be discharged to the outside through the internal circulation.
The air duct 220 may direct the flow of air within the test chamber 130 in a particular direction. For example, the air duct 220 may cause the air flow directed to the upper side (or the lower side) of the test chamber 130 to descend (or ascend) toward the driving unit 210 side, and direct the air flow from the driving unit 210 toward the test tray 20 via the pressurizing unit 240 and the match plate 250.
As described above, it is necessary to perform the test under the same environment for the semiconductor devices SD mounted in the test tray 20. The operating temperature of the semiconductor device SD is included in the test environment, and therefore a uniform temperature distribution of the semiconductor device SD to be tested is required. However, an uneven temperature distribution may occur in an actual test environment, and it is often the case that the temperature of the semiconductor element SD located at the center portion of the test tray 20 does not reach the target temperature. For example, the following occurs: the semiconductor device SD located at the center of the test tray 20 has a lower temperature than the semiconductor device SD located at the periphery of the test tray 20 when the test is performed in a high temperature environment, and the semiconductor device SD located at the center of the test tray 20 has a higher temperature than the semiconductor device SD located at the periphery of the test tray 20 when the test is performed in a low temperature environment.
Therefore, the embodiments described below provide an airflow control device and a test handler including the same for controlling the flow rate and direction of the gas flowing from the driving unit 210 to the test tray 20 for each area, thereby reducing the temperature variation of the semiconductor device SD.
Fig. 3 illustrates an example of an airflow adjustment plate 300 and a first flow rate adjustment unit according to an embodiment of the present description. Referring to fig. 3, an air flow adjustment plate 300 disposed between the driving unit 210 and the pressurizing unit 240 is provided. The air flow adjustment plate 300 may be fastened to the pressurizing unit 240 or inserted or fastened to the air duct 220.
A plurality of holes may be formed in the air flow-adjusting plate 300, and the air flow may pass through the holes. For example, as shown in fig. 3, the holes of the air flow adjustment plate 300 may include a first hole 301 relatively located at the center portion and having a first size and a second hole 302 arranged at an interval and having a second size smaller than the first size. As shown in fig. 3, the second hole may be constituted by a set of a plurality of holes. Fig. 3 shows only one example of the airflow adjustment plate 300 having holes formed therein, and holes having various sizes and shapes may be used.
According to an embodiment of the present specification, a flow rate adjusting device (first flow rate adjusting unit 310) for adjusting an opening area (opening ratio) of a hole formed in the air flow adjusting plate 300 may be provided. For example, as shown in fig. 3, a first flow rate adjusting unit 310 may be applied, which is detachably coupled to a portion where the holes are formed and can adjust an open area of the corresponding hole. For example, the first flow amount adjustment unit 310 may include a base member 314 detachably coupled to the air flow adjustment plate 300 and having a shape corresponding to at least one hole, a blocking member 316 movably coupled to the base member 314 in order to block at least a portion of the hole, and a lever 312 to move the blocking member 316 with respect to the base member 314.
More specifically, the base member 314 may be attached to the airflow adjustment plate 300 using bolt fastening or an adhesive. The base member 314 may have a shape corresponding to the hole (e.g., the first hole 301 or the second hole 302) formed in the airflow adjustment plate 350, but may have a shape independent of the hole formed in the airflow adjustment plate 350. For example, the base member 314 may have a hole corresponding to the second hole 302 as in fig. 3, but may have any shape of hole. The blocking member 316 can adjust the opening area of the hole of the airflow adjustment plate 350 by moving relative to the base member 314. For example, the blocking member 316 may have a blade shape formed centering on the central axis. The blocking member 316 may be formed to be rotatable about the center axis like a fan, and may rotate together with the rotation of the lever 312. For example, it is possible that when a specific hole of the air flow adjusting plate 350 is to be completely opened, the blocking member 316 is located at a blocking portion where no hole is formed in the base member 314, and when half (50%) of the specific hole of the air flow adjusting plate 350 is to be opened, a part of the blocking member 316 is located at a hole portion in the base member 314 and the remaining part is located at a blocking portion where no hole is formed. The lever 312 for adjusting the position of the blocking member may be rotatably provided at the center portion of the base member 314, but may be implemented in various ways.
According to the embodiments of the present disclosure, it is required that the holes in the airflow adjusting plate 300 located at the portion where a large amount of airflow is required are completely opened, and the holes located at the portion where no airflow or a relatively small amount of airflow is required are completely closed or partially closed. In this case, the flow rate adjusting unit 310 coupled to a position where a large amount of flow rate is required may completely open the hole, and the flow rate adjusting unit 310 coupled to a position where a small amount of flow rate is required may open or close only a part of the hole. Thus, the flow rate adjusting unit 310 is used to adjust the opening area (opening ratio) according to the holes of the respective air flow adjusting plates 300 in conformity with the environment of the test chamber 130, so that the air flow in the chamber of the test chamber 130 can be controlled, and the temperature deviation of the semiconductor devices SD mounted in the test tray 20 can be reduced by the air flow control.
Fig. 4 illustrates an example of a pressurizing unit and a second flow rate adjusting unit according to an embodiment of the present description. Referring to fig. 4, the pressurizing unit 240 includes a base frame and a windshield 400 coupled to the base frame. The windshield 400 may be located between the drive unit 210 and the match plate 250, and pressurize the match plate 250 using the force of application transmitted from the drive unit 210.
The damper 400 may include a damping member 405 contacting the driving unit 210 or the match plate 250 while attenuating an impact with the driving unit 210 or the match plate 250, and a hole through which an air flow formed by the fan 230 and the air duct 220 can pass. Additionally, holes for coupling with the match plate 250 or the bottom chassis may be formed.
According to an embodiment of the present specification, a second flow amount adjusting unit 410 that is detachably coupled to the windshield 400 and adjusts an open area of a hole of the windshield 400 may be used. For example, the second flow regulating unit 410 may completely close or block a portion of one hole. As shown in fig. 4, in order to block a part of the holes formed in the windshield 400, a second flow rate adjusting unit 410 may be used. The second flow amount adjustment unit 410 may be attached to the windshield 400 in order to completely block the hole formed in the windshield 400.
In addition, in an embodiment, like the first flow rate adjusting unit 310, the second flow rate adjusting unit 410 may be detachably coupled to the windshield 400 to adjust the opening area of the hole. That is, the second flow rate adjustment unit 410 may include a base member attached to the windshield 400 and having a shape corresponding to the hole of the windshield 400, a blocking member movably coupled to the base member in order to block at least a portion of the hole of the windshield 400, and a lever to move the blocking member relative to the base member.
Similar to the first flow rate adjustment unit 310, the holes in the damper 400 at the portions where a large amount of airflow is required are required to be completely opened, and the holes at the portions where no airflow is required or a relatively small amount of airflow is required to be completely closed or partially closed. In this case, the second flow rate adjustment unit 410 coupled to a position where a large amount of flow rate is required may completely open the hole, and the second flow rate adjustment unit 410 coupled to a position where a small amount of flow rate is required may open or close only a part of the hole.
As such, the flow rate of the air flow may be adjusted according to the positions of the air flow adjusting plate 300 and the damper 400 using the first and second flow rate adjusting units 310 and 410 in correspondence with the environment of the test chamber 130. In particular, the air flow in the chamber of the test chamber 130 can be controlled in multiple stages (2 stages) by adjusting the opening area of the holes according to the positions of the airflow adjusting plate 300 and the damper 400. This can reduce temperature variations of the semiconductor devices SD mounted on the test tray 20.
Fig. 5 illustrates an example of an airflow direction adjusting unit according to an embodiment of the present specification. An example of an air flow direction adjusting unit provided to the air duct 220 for adjusting the direction of the air flow in the test chamber 130 is shown in fig. 5.
In an embodiment, a first air flow direction adjusting unit 500 rotatably fastened to the left and right side walls of the air duct 220 in a pitch (pitch) direction to adjust the flow of the air flow in the up-down direction may be provided as the air flow adjusting means. As shown in the upper right side of fig. 5, a first air flow direction adjusting unit 500 may be provided, the first air flow direction adjusting unit 500 being formed in the width direction of the air duct 220 and rotatably fastened to the left and right sidewalls of the air duct 220 and being capable of rotating in the pitch direction according to a user's operation. As shown in fig. 5, the first air flow direction adjustment units 500 may be disposed at intervals in the height of the air duct 220.
In an embodiment, a second air flow direction adjusting unit 550 rotatably fastened to the upper and lower portions of the air duct 220 to the horizontal (yaw) direction to adjust the left and right directional flow of the air flow may be provided as the air flow adjusting means. As shown in the lower right side of fig. 5, a second air flow direction adjusting unit 550 may be provided, the second air flow direction adjusting unit 550 being formed in the height direction of the air duct 220 and rotatably fastened to the upper and lower sidewalls of the air duct 220 and being capable of rotating in the horizontal direction according to a user's operation. As shown in fig. 5, the second air flow direction adjustment units 550 may be disposed at regular intervals across the width of the air duct 220.
The upper right side of fig. 5 shows an example of a case where the first air flow direction adjustment unit 500 is coupled to the air duct 220, and the lower right side of fig. 5 shows an example of a case where the first air flow direction adjustment unit 500 and the second air flow direction adjustment unit 550 are coupled together to the air duct 220, but it is of course possible that the second air flow direction adjustment unit 550 is separately coupled to the air duct 220.
As shown in fig. 5, the direction of the air flow in the test chamber 130 can be easily adjusted by using the first air flow direction adjusting unit 500 or the second air flow direction adjusting unit 550 coupled to the air duct 220, and thus, the temperature deviation between the semiconductor devices SD mounted in the test tray 20 can be reduced.
In addition, according to the embodiments of the present specification, the airflow adjusting plate 300 or the damper 400 formed with holes in such a manner that the airflow meeting the specific test condition can be guided is provided, and the desired airflow can be composed by replacing the airflow adjusting plate 300 or the damper 400 according to the test condition.
While the embodiments of the present invention have been described above, the drawings referred to above and the detailed description of the invention described above are merely illustrative of the present invention and are used for the purpose of describing the present invention, and are not intended to be used for the purpose of limiting the scope of the present invention described in the claims. Accordingly, those having ordinary skill in the art will appreciate that various modifications can be made and other embodiments can be made based on the equivalents. Therefore, the true technical scope of the present invention should be determined by the technical idea of the appended claims.
Claims (20)
1. An air flow adjusting apparatus of a test handler, comprising:
a fan forming an air flow for controlling a temperature of the semiconductor element mounted in the test tray;
the air duct guides the air flow to the direction of the interface board;
an air flow adjusting plate which is positioned between a pressurizing unit for pushing the double-sided template to the direction of the interface plate and a driving unit for moving the pressurizing unit and is provided with a plurality of holes through which the air flow guided by the air duct can pass; and
and a first flow rate adjusting unit attached to at least one hole formed in the airflow adjusting plate and adjusting an open area of the at least one hole.
2. A gas flow regulating device according to claim 1,
the plurality of holes includes:
a first aperture having a first size in the airflow adjustment plate; and
second holes arranged at intervals in the air flow regulating plate and having a second size smaller than the first size.
3. A gas flow regulating device according to claim 2,
the first flow rate adjustment unit includes:
the base part is detachably combined with the airflow adjusting plate and has a shape corresponding to the second hole;
a sealing member movably coupled to the base member to seal at least a portion of the second hole; and
a lever for moving the closing member relative to the base member.
4. A gas flow regulating device according to claim 1,
the pressurizing unit includes:
a chassis; and
and a damper coupled to the base frame and pressurizing the match plate by the driving unit.
5. A gas flow regulating device according to claim 4,
the windshield includes:
a damping member contacting the match plate; and
a hole through which the airflow can pass.
6. A gas flow regulating device according to claim 5,
the air flow regulating device further includes:
and the second flow regulating unit is detachably combined with the windshield and regulates the opening area of the hole of the windshield.
7. A gas flow regulating device according to claim 1,
the air flow regulating device further includes:
and a first airflow direction adjusting unit rotatably fastened to the left and right sides of the air duct in a pitch direction, and adjusting the flow of the airflow in the up-down direction.
8. A gas flow regulating device according to claim 7,
the air flow regulating device further includes:
and a second airflow direction adjusting unit rotatably fastened to an upper portion and a lower portion of the air duct in a horizontal direction, and adjusting a flow of the airflow in a left-right direction.
9. A test handler, comprising:
a match plate including a pusher for contacting the plurality of semiconductor elements mounted in the test tray to the interface board for testing;
the pressurizing unit pushes and presses the double-sided template towards the direction of the interface board;
a driving unit which makes the pressurizing unit move towards the direction of the interface board; and
a gas flow adjusting device that adjusts a gas flow for controlling a temperature of the semiconductor element,
the air flow regulating device includes:
a fan that forms the airflow;
an air duct that guides the air flow in a direction of the interface board;
an air flow adjusting plate positioned between the driving unit and the pressurizing unit and formed with a plurality of holes through which the air flow guided by the air duct can pass; and
and a first flow rate adjusting unit attached to at least one hole formed in the airflow adjusting plate and adjusting an open area of the at least one hole.
10. The test handler of claim 9,
the plurality of holes includes:
a first aperture having a first size in the airflow adjustment plate; and
second holes arranged at intervals in the air flow regulating plate and having a second size smaller than the first size.
11. The test handler of claim 10,
the first flow rate adjustment unit includes:
the base part is detachably combined with the airflow adjusting plate and has a shape corresponding to the second hole;
a blocking member movably coupled to the base member to block at least a portion of the second hole; and
a lever for moving the closing member relative to the base member.
12. The test handler of claim 9,
the pressurizing unit includes:
a chassis; and
a damper coupled to the base frame and pressurizing the match plate by the driving unit,
the windshield includes:
a damping member contacting the match plate; and
a hole through which the airflow can pass.
13. The test handler of claim 12,
the air flow regulating device further includes:
and the second flow regulating unit is detachably combined with the windshield and regulates the opening area of the hole of the windshield.
14. The test handler of claim 9,
the air flow regulating device further includes:
and a first airflow direction adjusting unit rotatably fastened to the left and right sides of the air duct in a pitch direction, and adjusting the flow of the airflow in the up-down direction.
15. The test handler of claim 14,
the air flow regulating device further includes:
and a second airflow direction adjusting unit rotatably fastened to an upper portion and a lower portion of the air duct in a horizontal direction, and adjusting a flow of the airflow in a left-right direction.
16. A test handler, comprising:
a match plate including a pusher for contacting the plurality of semiconductor elements mounted in the test tray to the interface board for testing;
the pressurizing unit pushes and presses the double-sided template towards the direction of the interface board;
a driving unit which makes the pressurizing unit move towards the direction of the interface board; and
a gas flow adjusting device that adjusts a gas flow for controlling a temperature of the semiconductor element,
the pressurizing unit includes:
a chassis; and
a damper coupled to the base frame and including a damping member contacting the driving unit and the match plate and a hole through which the air flow can pass,
the air flow regulating device includes:
a fan that forms the airflow;
an air duct that guides the air flow in a direction of the interface board;
an air flow adjusting plate positioned between the driving unit and the pressurizing unit and formed with a plurality of holes through which the air flow guided by the air duct can pass;
a first flow rate adjusting unit attached to at least one hole formed in the airflow adjusting plate and adjusting an open area of the at least one hole; and
and a second flow rate adjusting unit adjusting an opening area of the hole of the damper.
17. The test handler of claim 16,
the plurality of holes includes:
a first aperture having a first size in the airflow adjustment plate; and
second holes arranged at intervals in the air flow regulating plate and having a second size smaller than the first size.
18. The test handler of claim 17,
the first flow rate adjustment unit includes:
a base member attached to the airflow adjustment plate and having a shape corresponding to the second hole;
a sealing member movably coupled to the base member to seal at least a portion of the second hole; and
a lever for moving the closing member relative to the base member.
19. The test handler of claim 16,
the air flow regulating device further includes:
and a first airflow direction adjusting unit rotatably fastened to the left and right sides of the air duct in a pitch direction, and adjusting the flow of the airflow in the up-down direction.
20. The test handler of claim 19,
the air flow regulating device further includes:
and a second airflow direction adjusting unit rotatably fastened to an upper portion and a lower portion of the air duct in a horizontal direction, and adjusting a flow of the airflow in a left-right direction.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020200070164A KR20210153787A (en) | 2020-06-10 | 2020-06-10 | Air flow control apparatus and test handler including the same |
| KR10-2020-0070164 | 2020-06-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113770039A true CN113770039A (en) | 2021-12-10 |
| CN113770039B CN113770039B (en) | 2023-09-22 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110447283.4A Active CN113770039B (en) | 2020-06-10 | 2021-04-25 | Air flow adjusting device and test handler provided with same |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR20210153787A (en) |
| CN (1) | CN113770039B (en) |
| TW (1) | TWI768909B (en) |
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| WO2016114491A1 (en) * | 2015-01-12 | 2016-07-21 | (주)테크윙 | Pushing device for test handler |
| US20170115339A1 (en) * | 2015-10-26 | 2017-04-27 | TEST21 TAIWAN CO.,Ltd | Device and method for controlling ic temperature |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101968984B1 (en) * | 2012-03-16 | 2019-08-26 | (주)테크윙 | Side docking type test handler |
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2020
- 2020-06-10 KR KR1020200070164A patent/KR20210153787A/en not_active Application Discontinuation
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- 2021-04-25 CN CN202110447283.4A patent/CN113770039B/en active Active
- 2021-05-19 TW TW110118115A patent/TWI768909B/en active
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|---|---|---|---|---|
| US20040050545A1 (en) * | 2002-09-13 | 2004-03-18 | Tilton Charles L. | Dynamic spray system |
| CN101107723A (en) * | 2004-12-21 | 2008-01-16 | 株式会社爱德万测试 | Peltier element drive method and circuit, peltier module attaching structure, and electronic component handling device |
| US20080252324A1 (en) * | 2007-03-30 | 2008-10-16 | Nasser Barabi | Active thermal control unit for maintaining the set point temperature of a DUT |
| US20120112777A1 (en) * | 2009-07-14 | 2012-05-10 | Advantest Corporation | Electronic device pushing apparatus, electronic device test apparatus, and interface device |
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| US20170115339A1 (en) * | 2015-10-26 | 2017-04-27 | TEST21 TAIWAN CO.,Ltd | Device and method for controlling ic temperature |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI768909B (en) | 2022-06-21 |
| KR20210153787A (en) | 2021-12-20 |
| CN113770039B (en) | 2023-09-22 |
| TW202147490A (en) | 2021-12-16 |
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