TWI768909B - Air flow control apparatus and test handler including the same - Google Patents

Abstract

Embodiments of the present disclosure provides air flow control apparatus and test handler including the same. According to the present disclosure, by adjusting opening area of perforated holes formed in an air flow controlling plate through a flow control unit, air flow in a test chamber may be controlled and temperature deviation of semiconductor components may be reduced.

Description

Air conditioning device and test sorter equipped with the same

The present specification relates to an airflow adjustment device and a test sorter equipped with the same, and more particularly to an airflow adjustment device for controlling the temperature of a semiconductor element in a test chamber and a test sorter equipped with the same.

The semiconductor (or display) manufacturing process, as a process for manufacturing semiconductor elements on a substrate (eg, a wafer), includes, for example, exposure, evaporation, etching, ion implantation, cleaning, and the like. Additionally, inspection and packaging for each semiconductor element formed on the substrate can be performed. In particular, after the process for the semiconductor elements is completed, an inspection of the function and/or performance of each semiconductor element may be performed.

For inspection of semiconductor elements, a test sorter is provided for storing and transporting semiconductor elements, contacting the semiconductor elements with a test interface having a plurality of contact pins for testing, and unloading the tested semiconductor elements. The test sorter includes a test chamber for providing a test environment for semiconductor elements, and it is particularly necessary to provide each semiconductor element with a temperature suitable for the target test environment. In general, a plurality of semiconductor elements are coupled to a test interface in a state of being placed on a test tray, and a temperature variation per semiconductor element may occur here, and a method for minimizing the temperature variation per semiconductor element is being studied.

Accordingly, the embodiments of the present specification provide an airflow adjustment device for minimizing temperature deviation of semiconductor elements and a test sorter provided with the same.

In addition, the embodiments of the present specification provide an airflow adjustment device for controlling airflow in a test chamber and a test sorter provided with the same.

In addition, embodiments of the present specification provide an airflow adjustment device for controlling the positional flow rate of airflow in a test chamber, and a test sorter provided with the same.

In addition, embodiments of the present specification provide an airflow adjustment device for controlling the direction of airflow in a test chamber and a test sorter provided with the same.

Embodiments of the present specification provide an airflow adjustment device and a test sorter equipped with the same. An air flow adjusting device according to an embodiment of the present specification includes: a fan forming an air flow for controlling the temperature of the semiconductor elements placed in the test tray; an air duct guiding the air flow in the direction of the interface board; and an air flow adjusting plate, A plurality of holes through which the air flow guided by the air duct can pass is formed between a pressing unit that pushes the double-sided template in the direction of the interface board and a driving unit that moves the pressing unit ; and a first flow adjustment unit, attached to at least one hole formed in the airflow adjustment plate, and adjusts the open area of the at least one hole.

In one embodiment, the plurality of holes may include: a first hole having a first size in the airflow adjustment plate; and a second hole arranged at a certain interval in the airflow adjustment plate, and has a second dimension smaller than said first dimension.

In one embodiment, the first flow adjustment unit may include: a base part, which is detachably combined with the airflow adjustment plate and has a shape corresponding to the second hole; A blocking member is movably coupled to the base member in order to block at least a part of the second hole; and a control lever moves the blocking member relative to the base member.

In one embodiment, the pressing unit may include: a bottom frame; and a windshield, which is combined with the bottom frame and pressurizes the double-sided template through the driving unit.

In one embodiment, the windshield may include: a damping member in contact with the double-sided template; and a hole through which the airflow can pass.

In one embodiment, the airflow adjustment device may further include: a second flow adjustment unit, which is detachably coupled to the windshield and adjusts the open area of the hole of the windshield.

In an embodiment, the airflow adjustment device may further include: a first airflow direction adjustment unit, which is rotatably fastened to the left and right sides of the air duct in the pitch direction, and adjusts the airflow flow in the up and down direction.

In one embodiment, the airflow adjustment device may further include: a second airflow direction adjustment unit, which is rotatably fastened to the upper part and the lower part of the air duct in the yaw direction, and adjusts the air flow direction. The flow of air in the left and right directions.

A test sorter according to an embodiment of the present specification includes: a double-sided template including a pusher for contacting a plurality of semiconductor elements placed in a test tray with an interface board for testing; a pressing unit, The double-sided template is pressed in the direction of the interface board; a driving unit is used to move the pressing unit in the direction of the interface board; controlled airflow. Here, the airflow adjustment device may include: a fan to form the airflow; an air duct to guide the airflow to the direction of the interface board; an airflow adjustment plate located on the driving unit and the pressurizing unit between, and formed with the air guided by the air duct a plurality of holes through which flow can pass; and a first flow adjustment unit attached to at least one hole formed in the airflow adjustment plate and adjusting an open area of the at least one hole.

A test sorter according to another embodiment of the present specification includes: a double-sided template including a pusher for contacting a plurality of semiconductor elements placed in a test tray with an interface board for testing; pressurizing a unit for pressing the double-sided template in the direction of the interface board; a driving unit for moving the pressing unit in the direction of the interface board; Airflow for temperature control. Here, the pressurizing unit may include: a bottom frame; and a windshield, which is combined with the bottom frame and includes a damping member in contact with the driving unit and the double-sided template, and the airflow can pass through of holes. It can be that the air flow adjustment device comprises: a fan, forming the air flow; an air duct, guiding the air flow in the direction of the interface board; an air flow adjustment plate, located between the driving unit and the pressurizing unit, and formed with a plurality of holes through which the airflow guided by the air duct can pass; the first flow adjustment unit is attached to at least one hole formed in the airflow adjustment plate, and adjusts the open area of the at least one hole ; and a second flow adjustment unit for adjusting the opening area of the holes of the windshield.

According to the embodiments of the present specification, according to the temperature distribution of the semiconductor elements placed in the test tray, the air flow in the test chamber is adjusted by the air flow adjusting device, so that the temperature deviation of the semiconductor elements can be minimized.

Additionally, embodiments of the present specification enable control of airflow within the test chamber through an airflow adjustment device.

In addition, according to the embodiments of the present specification, by adjusting the open area of the holes of the airflow adjustment plate, the positional flow rate of the airflow in the test chamber can be controlled.

In addition, according to the embodiments of the present specification, the direction of the airflow in the test chamber can be controlled through the airflow direction adjustment unit disposed in the air duct.

20: Test tray

30: Custom Tray

100: Test Sorter

110: Loading unit

120: first chamber

130: Test Chamber

140: Second chamber

150: Unload unit

170: Test interface

210: Drive unit

220: Air duct

230: Fan

240: Pressurized unit

250: Double Sided Template

260: DUT board

300: Airflow adjustment plate

301: The first hole

302: The second hole

310: The first flow regulating unit

312: Joystick

314: Base Parts

316: Blocking parts

400: Windshield

405: Damping parts

410: Second flow adjustment unit

500: The first airflow direction adjustment unit

550: The second airflow direction adjustment unit

FIG. 1 shows an example of an outline structure of a test sorter according to an embodiment of the present specification.

Figures 2a and 2b illustrate a pressurizing device and an air flow adjusting device of a test sorter according to an embodiment of the present specification.

FIG. 3 shows an example of a flow regulating plate and a first flow regulating unit according to an embodiment of the present specification.

FIG. 4 shows an example of a pressurizing unit and a second flow regulating unit according to an embodiment of the present specification.

FIG. 5 shows an example of an airflow direction adjustment unit according to an embodiment of the present specification.

Hereinafter, the embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those having ordinary knowledge in the technical field to which the present invention pertains can be easily implemented. The present invention may be implemented in various different ways and is not limited to the embodiments described herein.

In order to explain the present invention clearly, parts irrelevant to the description are omitted, and the same or similar constituent elements are denoted by the same reference numerals throughout the entire specification.

In addition, in the plurality of embodiments, the same reference numerals are used for the constituent elements having the same structure, and only the representative embodiment will be described, and in the other embodiments, only the structure different from the representative embodiment will be described. Be explained.

Throughout the specification, when a part is referred to as being "connected (or combined)" with another part, it includes not only the case of "direct connection (or combination)", but also "indirect connection (indirect connection ( or in combination)". In addition, when it is said that a certain part includes a certain constituent element, it does not exclude other constituent elements but means that other constituent elements may also be included, unless specifically stated to the contrary.

All terms including technical or scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, unless defined differently. Terms such as those defined in commonly used dictionaries should be interpreted as having meanings consistent with the meanings in the context of the associated technology, and should not be interpreted as ideal or excessively formal meanings unless explicitly defined in this application .

FIG. 1 shows an example of a schematic structure of a test sorter 100 according to an embodiment of the present specification. FIG. 1 is a schematic configuration diagram of the test sorter 100 viewed from the ceiling side direction. In this specification, the test sorter 100 refers to a device that electrically connects the semiconductor element to a test interface by inspecting the function and/or performance of the semiconductor element subjected to the semiconductor process and packaging. In addition, for the inspection of semiconductor elements, the test sorter 100 can transport the transferred semiconductor elements on a tray, form an environment (eg, temperature) for inspection, classify the inspected semiconductor elements into grades, and carry out the semiconductor elements. In this specification, the case where the test sorter 100 is connected to the test device through the test interface is described, but the embodiments of this specification are not limited to this, and the test sorter 100 and the test device may be integrated. That is, the test sorter 100 may also be referred to as a test device.

1 , the test sorter 100 may include a loading unit 110 , a first chamber 120 , a testing chamber 130 , a second chamber 140 and an unloading unit 150 . First, the custom tray (or C-type tray) 30 containing the semiconductor elements SD to be inspected is put into the test sorter 100 . loading unit 110 unloads the semiconductor elements SD stored in the custom tray 30 to the test tray (or T-tray) 20 . Here, one of the size between the test tray 20 and the custom tray 30, the number of slots that can accommodate the semiconductor elements SD, and the distance between the slots may be different from each other. Although not shown, the loading unit 110 may include a pickup device for sucking the semiconductor element SD, a drive unit for moving the pickup device, and a moving rail. The test tray 20 on which the semiconductor element SD is placed may be conveyed to the first chamber 120 through a conveying device (not shown).

The first chamber 120 can be maintained in a temperature environment (first temperature) for testing as a space for storing the test tray 20 . That is, the first chamber 120 may hold the test tray 20 conveyed from the loading unit 110 at the first temperature. The first temperature is a temperature for preset as a test temperature for testing the semiconductor element SD in the test chamber 130 . That is, the first temperature may be the same as or similar to the test temperature. The first chamber 120 may be referred to as a soak chamber. The test tray 20 stored in the first chamber 120 may be transferred to the test chamber 130 by a conveying device (not shown).

The test chamber 130 provides an environment for testing the semiconductor element SD as a space for performing inspection for the semiconductor element SD in conjunction with the test interface 170 . The test interface 170 can be in contact with the semiconductor element SD to apply an electrical signal, and transmit the signal output through the semiconductor element SD to a testing device (not shown). In the test chamber 130, in order to bring the semiconductor element SD into contact with the interface board of the test interface 170, a semiconductor element pressurizing device for pressurizing the semiconductor element SD may be provided. The structure for inspecting the semiconductor element SD in the test chamber 130 will be described in more detail with reference to FIGS. 2a to 4 below. The semiconductor elements SD that have been inspected in the test chamber 130 may be transferred to the second chamber 140 .

The second chamber 140 can be kept at normal temperature (second temperature) as a space for storing the test tray 20 in which the semiconductor elements SD that have been inspected are accommodated. That is, the second chamber 140 may be heated at the second temperature The test tray 20 conveyed from the test chamber 130 is preserved. The test trays 20 stored in the second chamber 140 may be transferred to the unloading unit 150 through a conveying device (not shown). The unloading unit 150 may unload the semiconductor elements SD of the test tray 20 conveyed from the second chamber 140 by grade classification.

Figures 2a and 2b illustrate a pressurizing device and an air flow adjusting device of a test sorter according to an embodiment of the present specification. FIGS. 2a and 2b show a pressurizing device installed in the test chamber 130 of FIG. 1 to pressurize the semiconductor element SD and an air flow adjusting device for adjusting the air flow in the test chamber 130. FIG. 2a shows a perspective view and FIG. 2b shows a side view.

2a and 2b, the pressing device for pressurizing the semiconductor element SD includes a DUT (device under test, device under test) board 260 combined with the test tray 20 on which the semiconductor element SD to be inspected is placed, and includes a The semiconductor element SD in the test tray 20 is in contact with the double-sided template 250 of the pusher of the interface board, the pressing unit 240 which pushes the double-sided template 250 in the direction of the interface board, and the pressing unit 240 in the direction of the interface board Mobile drive unit 210 . The air flow regulating device for regulating the air flow in the test chamber 130 may include a fan 230 for forming the air flow and an air duct 220 for guiding the air flow in the direction of the interface board.

More specifically, the drive unit 210 may include one or more cylinder assemblies. The cylinder assembly may advance the cylinder rod using air pressure of gas supplied from a gas supply unit (not shown) including an air pump, flow passages, valves, and the like. The applying force generated from the driving unit 210 may be applied to the semiconductor element SD through the pressing unit 240 and the double-sided template 250 .

The pressing unit 240 can use the force provided by the driving unit 210 to make the double-sided template 250 close to the test tray 20 and push out the pusher of the double-sided template 250 . The pressurizing unit 240 may include a base frame and a windshield 400 coupled to the base frame. The bottom frame can be combined with the air duct 220 and/or the drive unit 210, and the air The stopper 400 may be combined with the chassis. The windshield 400 may pressurize the double-sided template 250 using the applied force transmitted from the driving unit 210 .

The double-sided template 250 can be closely attached to the test tray 20 through the pressing unit 240, and press the semiconductor element SD placed in the test tray 20 to the interface board through the insert (puller).

The fan 230 may create an airflow within the test chamber 130 . For example, the fan 230 may include an upper fan unit and a lower fan unit, and each fan unit may be connected to an external air inflow device or an air discharge device to allow air to flow into the test chamber 130, or to send the air of the test chamber 130 to the outside. discharge. For example, the upper fan unit may flow air into the test chamber 130, and the lower fan unit may discharge the air in the test chamber 130 to the outside. The air flowing into the test chamber 130 may be discharged to the outside through the internal circulation.

The air duct 220 can guide the airflow in the test chamber 130 to a specific direction. For example, the air duct 220 can make the airflow guided above (or below) the test chamber 130 to descend (or ascend) toward the driving unit 210, and from the driving unit 210 to the test tray via the pressing unit 240 and the double-sided template 250 The direction of 20 guides the airflow.

As described above, the semiconductor elements SD placed in the test tray 20 need to be tested under the same environment. Since the operating temperature of the semiconductor element SD is included in the test environment, a uniform temperature distribution of the semiconductor element SD to be tested is required. However, in an actual test environment, uneven temperature distribution may occur, and it usually occurs that the temperature of the semiconductor element SD located in the center portion of the test tray 20 cannot reach the target temperature. For example, it happens that the semiconductor element SD located in the center portion of the test tray 20 has a lower temperature than the semiconductor elements SD located in the outer periphery of the test tray 20 when the test is performed under the high temperature environment, and when the test is performed under the low temperature environment , the semiconductor element SD located in the center portion of the test tray 20 has a higher temperature than the semiconductor element SD located in the outer periphery of the test tray 20 .

Therefore, in the following, the embodiments of the present specification provide an air flow control device and a test sorter equipped with the same, for controlling the flow rate and direction of the gas flowing from the driving unit 210 in the direction of the test tray 20 by region, thereby The temperature deviation of the semiconductor element SD is reduced.

FIG. 3 shows an example of the airflow adjustment plate 300 and the first flow adjustment unit according to the embodiment of the present specification. Referring to FIG. 3 , an airflow adjustment plate 300 disposed between the driving unit 210 and the pressurizing unit 240 is provided. The airflow adjustment plate 300 may be fastened to the pressurizing unit 240 , or inserted into or fastened to the air duct 220 .

A plurality of holes may be formed in the airflow adjustment plate 300 through which the airflow may pass. For example, as shown in FIG. 3 , the holes of the airflow adjustment plate 300 may include a first hole 301 located at a relatively central portion and having a first size and a second hole 302 arranged at a certain interval and having a second size smaller than the first size. . As shown in FIG. 3 , the second hole may be composed of a set of a plurality of holes. FIG. 3 shows only an example of the airflow adjustment plate 300 in which the holes are formed, and holes having various sizes and shapes can be used.

According to the embodiment of the present specification, a flow adjustment device (first flow adjustment unit 310 ) for adjusting the open area (opening ratio) of the holes formed in the airflow adjustment plate 300 can be provided. For example, as shown in FIG. 3 , a first flow adjustment unit 310 that can be detachably coupled to the part where the holes are formed and can adjust the opening area of the corresponding holes can be applied. For example, the first flow adjustment unit 310 may include a base member 314 detachably coupled to the airflow adjustment plate 300 and having a shape corresponding to at least one hole, movably coupled to the base member 314 for blocking at least a portion of the hole The blocking member 316 and the lever 312 for moving the blocking member 316 relative to the base member 314 .

More specifically, the base member 314 may be attached to the airflow adjustment plate 300 using bolts or adhesives. The base member 314 may have holes formed in the airflow adjustment plate 300 (eg: The shape corresponding to the first hole 301 or the second hole 302 ) may have a shape unrelated to the hole formed in the airflow adjustment plate 300 . For example, the base member 314 may have holes corresponding to the second holes 302 as shown in FIG. 3, but may have holes of any shape. The blocking member 316 can adjust the open area of the hole of the airflow adjustment plate 300 by moving relative to the base member 314 . For example, the blocking member 316 may have a vane shape formed around the central axis. The blocking member 316 may be formed to be rotatable with respect to the central axis like a fan, and may rotate together with the rotation of the control lever 312 . For example, when the specific hole of the airflow adjustment plate 300 is to be completely opened, the blocking member 316 is located in the blocking part where no hole is formed in the base member 314, and when half (50% of the specific hole of the airflow adjustment plate 300 is to be opened) %), a part of the blocking member 316 is located at the hole portion in the base member 314 and the remaining portion is located at the blocking portion where no hole is formed. The lever 312 for adjusting the position of the blocking member may be rotatably provided at the center portion of the base member 314, but may be implemented in various ways.

According to the embodiment of the present specification, holes in the airflow adjustment plate 300 at locations requiring a large amount of airflow are required to be completely open, and holes located at locations requiring no airflow or relatively little airflow are required to be completely closed or partially closed. At this time, the flow adjustment unit 310 connected to a position requiring a large flow rate may completely open the hole, and the flow adjustment unit 310 connected to a position requiring a small flow rate may open or partially close the hole. In this way, by using the flow adjustment unit 310 to adjust the open area (opening ratio) according to the holes of each airflow adjustment plate 300 in accordance with the environment of the testing chamber 130, the airflow in the testing chamber 130 can be controlled, and the permeable airflow can be controlled. The temperature deviation of the semiconductor elements SD mounted in the test tray 20 is reduced.

FIG. 4 shows an example of a pressurizing unit and a second flow regulating unit according to an embodiment of the present specification. Referring to FIG. 4 , the pressurizing unit 240 includes a base frame and a windshield 400 coupled to the base frame. windshield The 400 may be located between the driving unit 210 and the double-sided template 250 and press the double-sided template 250 using an application force transmitted from the driving unit 210 .

The windshield 400 may include a damping member 405 contacting the driving unit 210 or the double-sided template 250 while attenuating the impact with the driving unit 210 or the double-sided template 250 and a hole through which the airflow formed by the fan 230 and the air duct 220 can pass. Additionally, holes for combining with the double-sided template 250 or the chassis may be formed.

According to the embodiment of the present specification, the second flow adjustment unit 410 that is detachably coupled to the windshield 400 and adjusts the opening area of the hole of the windshield 400 may be used. For example, the second flow regulating unit 410 may completely close a hole or block a part of the hole. As shown in FIG. 4 , in order to block some of the holes formed in the windshield 400 , a second flow regulating unit 410 may be used. The second flow adjustment unit 410 may be attached to the windshield 400 in order to completely block the hole formed in the windshield 400 .

In addition, in an embodiment, like the first flow adjustment unit 310 , the second flow adjustment unit 410 can be detachably combined with the windshield 400 to adjust the opening area of the hole. That is, the second flow adjustment unit 410 may include a base member attached to the windshield 400 and having a shape corresponding to the hole of the windshield 400 , and a base member movably coupled to the base member in order to block at least a part of the hole of the windshield 400 . A blocking member and a lever for moving the blocking member relative to the base member.

Similar to the first flow regulating unit 310 , the holes in the windshield 400 where a large amount of airflow is required are required to be completely open, and the holes located at the locations where no airflow or relatively little airflow is required are completely closed or partially closed. At this time, the second flow regulating unit 410 coupled to a position requiring a large flow may completely open the hole, and the second flow regulating unit 410 coupled to a position requiring a small flow may only partially open or close the hole.

In this way, the first flow regulating unit 310 and the second flow regulating unit 410 can be used to adjust the flow rate of the airflow according to the positions of the airflow regulating plate 300 and the damper 400 in accordance with the environment of the test chamber 130 . In particular, by adjusting the opening area of the holes according to the positions of the airflow adjustment plate 300 and the windshield 400 , it is possible to perform multi-level (two-level) control of the airflow in the test chamber 130 . Thereby, the temperature deviation of the semiconductor element SD mounted in the test tray 20 can be reduced.

FIG. 5 shows an example of an airflow direction adjustment unit according to an embodiment of the present specification. FIG. 5 shows an example of an air flow direction adjusting unit provided in the air duct 220 for adjusting the direction of the air flow in the test chamber 130 .

In one embodiment, the first airflow direction adjusting unit 500 , which is rotatably fastened to the left and right side walls of the air duct 220 in the pitch direction to adjust the vertical flow of the airflow, may be provided as an airflow adjusting device. As shown in the upper right side of FIG. 5 , a first airflow direction adjusting unit 500 may be provided, the first airflow direction adjusting unit 500 is formed along the width direction of the air duct 220 and rotatably fastened to the left and right side walls of the air duct 220 wall, and can be rotated in the distance direction according to the user's operation. As shown in FIG. 5 , the first airflow direction adjustment unit 500 may be arranged at a certain interval on the height of the air duct 220 .

In one embodiment, the second airflow direction adjusting unit 550 that is rotatably fastened to the upper and lower portions of the air duct 220 in the yaw direction to adjust the flow of the airflow in the left-right direction may be provided as an airflow adjusting device. As shown in the lower right side of FIG. 5 , a second airflow direction adjusting unit 550 may be provided, which is formed along the height direction of the air duct 220 and is rotatably fastened to the upper and lower side walls of the air duct 220 side wall, and can be rotated in the pan direction according to the user's operation. As shown in FIG. 5 , the second airflow direction adjustment unit 550 may be arranged at a certain interval in the width of the air duct 220 .

The upper right side of FIG. 5 shows an example of the case where the first airflow direction adjustment unit 500 is combined with the air duct 220 , and the lower right side of FIG. 5 shows that the first airflow direction adjustment unit 500 and the second airflow direction adjustment unit 550 are combined with the wind An example of the case of the duct 220, but of course, the second airflow direction adjustment unit 550 may be separately integrated with the air duct 220.

As shown in FIG. 5 , by using the first airflow direction adjusting unit 500 or the second airflow direction adjusting unit 550 combined with the air duct 220 , the direction of the airflow in the test chamber 130 can be easily adjusted, thereby reducing the number of places placed on the test tray. Variation in temperature among semiconductor elements SD in 20 .

In addition, according to the embodiment of the present specification, the airflow adjustment plate 300 or the windshield 400 having the holes formed so as to guide the airflow corresponding to the specific test conditions is provided, and a desired configuration can be made by replacing the airflow adjustment plate 300 or the windshield 400 according to the test conditions. airflow.

A plurality of embodiments of the present invention have been described above, but the drawings referred to and the detailed description of the invention described so far are merely illustrative of the present invention, and are used for the purpose of explaining the present invention, not It is used for the purpose of meaning definition or limitation of the scope of the present invention described in the claims. Therefore, it can be understood by those having ordinary knowledge in the technical field that various modifications and equivalent other embodiments can be implemented therefrom. Therefore, the true technical protection scope of the present invention should be determined through the attached technical concept of the scope of the patent application.

130: Test Chamber

210: Drive unit

220: Air duct

230: Fan

240: Pressurized unit

250: Double Sided Template

300: Airflow adjustment plate

301: The first hole

302: The second hole

310: The first flow regulating unit

312: Joystick

314: Base Parts

316: Blocking parts

Claims (20)

An air flow adjustment device is an air flow adjustment device of a test sorting machine, the air flow adjustment device comprises: a fan, forming an air flow for controlling the temperature of a semiconductor element placed in a test tray; an air duct, in the direction of an interface board Guide the air flow; the air flow regulating plate is located between the pressurizing unit that pushes the double-sided template toward the interface board and the driving unit that moves the pressurizing unit, and is formed with the air flow guided by the air duct to pass through a plurality of holes passed through; and a first flow adjustment unit attached to at least one hole formed in the airflow adjustment plate and adjusting the open area of the at least one hole. The airflow adjustment device according to claim 1, wherein the plurality of holes include: first holes having a first size in the airflow adjustment plate; and second holes arranged at certain intervals in the airflow adjustment plate , and has a second dimension smaller than the first dimension. The airflow adjustment device according to claim 2, wherein the first flow adjustment unit comprises: a base part, which is detachably combined with the airflow adjustment plate and has a shape corresponding to the second hole; a blocking part, Removably coupled to the base member for closing at least a portion of the second hole; and A lever is used to move the blocking member relative to the base member. The airflow adjustment device according to claim 1, wherein the pressing unit comprises: a base frame; and a windshield, which is combined with the base frame and pressurizes the double-sided template through the driving unit. The airflow adjustment device according to claim 4, wherein the windshield comprises: a damping member in contact with the double-sided template; and a hole through which the airflow can pass. The airflow adjustment device according to claim 5, wherein the airflow adjustment device further comprises: a second flow adjustment unit, which is detachably coupled to the windshield and adjusts the open area of the hole of the windshield. The airflow adjustment device according to claim 1, wherein the airflow adjustment device further comprises: a first airflow direction adjustment unit, which is rotatably fastened to the left and right sides of the air duct in the spacing direction, and adjusts the up and down of the airflow direction of flow. The airflow adjustment device according to claim 7, wherein the airflow adjustment device further comprises: a second airflow direction adjustment unit, which is rotatably fastened to the upper part and the lower part of the air duct in the roll direction, and adjusts the airflow direction. flow in the left and right directions. A test sorter, comprising: a double-sided template, comprising a pusher for contacting a plurality of semiconductor components placed in the test tray with an interface board for testing; a pressing unit for pushing the double-sided template toward the interface board; a driving unit to move the pressurizing unit in the direction of the interface board; and an airflow adjustment device to adjust the airflow for controlling the temperature of the semiconductor element, the airflow adjustment device comprising: a fan to form the airflow; an air duct, guiding the air flow in the direction of the interface plate; an air flow adjustment plate, located between the driving unit and the pressurizing unit, and formed with a plurality of holes through which the air flow guided by the air duct can pass; and a first flow adjustment unit , which is attached to at least one hole formed in the airflow adjustment plate, and adjusts the open area of the at least one hole. The test sorter of claim 9, wherein the plurality of holes include: first holes having a first size in the airflow adjustment plate; and second holes at certain intervals in the airflow adjustment plate are arranged and have a second dimension smaller than the first dimension. The test sorting machine according to claim 10, wherein the first flow adjustment unit comprises: a base part, which is detachably combined with the airflow adjustment plate and has a shape corresponding to the second hole; a blocking part , movably combined with the base member to be able to seal at least a portion of the second hole; and A lever is used to move the blocking member relative to the base member. The test sorting machine according to claim 9, wherein the pressing unit includes: a chassis; and a windshield, which is combined with the chassis and pressurizes the double-sided template through the driving unit, the windshield including: damping a component in contact with the double-sided template; and a hole through which the airflow can pass. The test sorting machine according to claim 12, wherein the airflow adjustment device further comprises: a second flow adjustment unit, which is detachably coupled to the windshield and adjusts the open area of the hole of the windshield. The test sorting machine according to claim 9, wherein the airflow adjustment device further comprises: a first airflow direction adjustment unit, which is rotatably fastened to the left and right sides of the air duct in the spacing direction, and adjusts the airflow direction. flow in the up and down direction. The test sorting machine according to claim 14, wherein the airflow adjustment device further comprises: a second airflow direction adjustment unit, which is rotatably fastened to the upper part and the lower part of the air duct in the roll direction, and adjusts the airflow flow in the left and right directions. A test sorting machine, comprising: a double-sided template, including a pusher for contacting a plurality of semiconductor components placed in a test tray with an interface board for testing; a pressing unit for pressing the double-sided template in the direction of the interface board; a driving unit for moving the pressing unit in the direction of the interface board; and an airflow adjustment device for controlling the temperature of the semiconductor element the air flow, the pressurizing unit includes: a bottom frame; and a windshield, combined with the bottom frame, and comprising a damping member contacting the driving unit and the double-sided template and a hole through which the air flow can pass, the air flow adjustment device includes : a fan to form the airflow; an air duct to guide the airflow in the direction of the interface board; an airflow adjustment plate, located between the drive unit and the pressurizing unit, and formed with an air duct through which the airflow guided by the air duct can pass through. a plurality of holes; a first flow adjustment unit attached to at least one hole formed in the airflow adjustment plate and adjusting the open area of the at least one hole; and a second flow adjustment unit adjusting the open area of the hole of the windshield. The test sorter of claim 16, wherein the plurality of holes include: first holes having a first size in the airflow adjustment plate; and second holes at regular intervals in the airflow adjustment plate are arranged and have a second dimension smaller than the first dimension. The test sorter according to claim 17, wherein the first flow regulating unit comprises: a base member attached to the airflow adjustment plate and having a shape corresponding to the second hole; a blocking member movably coupled to the base member for blocking at least a portion of the second hole; and a lever, The blocking member is moved relative to the base member. The test sorting machine according to claim 16, wherein the airflow adjustment device further comprises: a first airflow direction adjustment unit, which is rotatably fastened to the left and right sides of the air duct in the spacing direction, and adjusts the airflow direction. flow in the up and down direction. The test sorting machine according to claim 19, wherein the airflow adjustment device further comprises: a second airflow direction adjustment unit, which is rotatably fastened to the upper part and the lower part of the air duct in the roll direction, and adjusts the airflow flow in the left and right directions.

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