TW444126B - IC sucking device, and IC porting device and IC testing device using the sucking device - Google Patents

IC sucking device, and IC porting device and IC testing device using the sucking device Download PDF

Info

Publication number
TW444126B
TW444126B TW088109266A TW88109266A TW444126B TW 444126 B TW444126 B TW 444126B TW 088109266 A TW088109266 A TW 088109266A TW 88109266 A TW88109266 A TW 88109266A TW 444126 B TW444126 B TW 444126B
Authority
TW
Taiwan
Prior art keywords
suction
test
item
aforementioned
cylinder
Prior art date
Application number
TW088109266A
Other languages
Chinese (zh)
Inventor
Yoshiyuki Masuo
Yoshihito Kobayashi
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Application granted granted Critical
Publication of TW444126B publication Critical patent/TW444126B/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408Incorporating a pick-up tool
    • H05K13/0409Sucking devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Manipulator (AREA)

Abstract

The present invention aims to provide an IC sucking device that can combine its composition components in small size and has good motion response. The solution of the present invention is to integrally combine a sucking disk (1051), a cylinder (1052), a cylinder control valve (1053), a vacuum generator (1054), a supply valve (1055), a destructive valve (1056), and a pressure detector (1057) as one to form an IC sucking device (105d).

Description

444126 五、發明說明(i) ' ' ------- 【發明之所屬技術領域】 本發明係有關於使用在測試半導體積體電路元 各種電子零件(以下’代表性地稱為IC)用之旧貝 之較佳之1C吸著裝置,以及有關於使用該Ic吸著置 搬運裝置與IC測試裝置,特別是動作 : :吸著裝置、使用該1C吸著裝置之IC搬運裝 【先前技術】 ^稱為處理器(handler)iIC測試裝 ^托盤中多數個受測賴搬運至處理以二mi 與測試接頭作電性接觸,在1C測試袭置本體(以下又 測試器)處進行測試。然後,泰 搬運出測4·接碩’根據測試結果、 行所謂的良品與不良品種類之區h轉载托盤之方式,進 在以往之處理,目士 試後之1C用之托盤(β以下殺、示了收容测試前之IC或是測 器内作循環般運用之托t 托盤)之外更備有在處理 此類型之處理哭中,於:二下稱為測試托盤)之類型’在 托盤之間進行:測試後期間内在指定托盤與測試 1C壓:於測試接K托::::試1。之轉載或是將受測試 1C吸著裝置係由吸著受:J設:IC吸著裝x。以往之 之真空發生器、控制直」之吸盤、供給此吸盤吸著力 ⑽/_)之控制;、令2 ^器=生之吸著力之開與閉 及盤進仃昇降之致動器(例如汽缸) 444126 五 '發明說明(2) 以及驅動致動器用之控 【發明所欲解決之問題 但是,在以往之IC 動器設置於例如處理器 此致動器用之控制閥則 空發生器及其控制閥更 要有將致動器與其控制 生器連接之軟管。因此 長’在控制信號的應答 此外,由於這些零 軟管的迴繞變得困難, 進行動作之故,所以必 度。 制閥所構成。 ] 吸著裝置中,前端裝設有吸盤之致 之X γ搬運裝置之底部上,而驅動 設置於其底部以外之地方,並且真 被設置於其他部位之故,所以必^頁 閥連接之軟管以及將吸盤與真空發 ’驅動部與控制閥之距離必定會變 性上會有問題發生。 件之設置位置,連接於其間之前述 吸盤與致動器係透過X — Υ搬運裝置 須要有能夠涵蓋其動作範圍之長 本發明係有鑑於前述先前技術上之問題點所改良之物 件’將其構成零件加以小型地歸納一起,目的在提^動作 應答性良好之1C吸著裝置、使用該裝置之1(:搬運裝置以及 I C測試裝置。 【用以解決問題之手段】 (1)為了達成前述目的’本發明所述之1C吸著裝置的 特徵在於:至少將受測試1C加以吸著維持的吸盤、令前述 吸盤加以移動的致動器以及將前述吸盤之吸著力加S開閉 的吸著控制閥被一體化地加以組合而成。 在本發明之1C吸著裝置中,吸盤、致動器以及吸著控 制閥係被一體化地被加組合,若將其設置於例如處理器之444126 V. Description of the invention (i) '' ------- [Technical field to which the invention belongs] The present invention relates to various electronic components used in testing semiconductor integrated circuit elements (hereinafter referred to as "ICs") The used 1C adsorption device of the old shell, and the use of the Ic adsorption handling device and IC test device, especially the action:: adsorption device, IC handling device using the 1C adsorption device [prior art 】 The handler is called the handler (iIC). Most of the tested pallets are transported to the processing station for electrical contact with the test connector, and tested at the 1C test device (the following tester). Then, Thai Carry Out Test 4 · Receive the method based on the test results, the so-called good product and bad product category h transfer trays, into the past processing, after the eye test 1C tray (below β Killing, showing the IC before the containment test or the T-tray used in the tester for cyclical use) There are also types that deal with this type of processing cry, in: the second is called the test tray) ' Perform between pallets: press the specified pallet and test 1C within the period after the test: connect the K pallet to the test :::: test 1. Reprinted or tested 1C adsorption device is by adsorption: J set: IC adsorption device x. In the past, the vacuum generator, the suction cup that controls the straight line, the control of the suction force (//) that provided this suction cup; and the actuator that opens and closes the suction force of the device, such as 2 (Cylinder) 444126 Five 'invention description (2) and control for driving actuators [Problems to be solved by the invention] However, in the past, the IC actuator was installed in a control valve for the actuator, for example, the air generator and its control The valve must also have a hose connecting the actuator to its control unit. Therefore, it is necessary to respond to the control signal because the return of these zero hoses becomes difficult and it is necessary to perform the operation. Consisting of valve control. ] In the suction device, the front end is equipped with a suction cup to the bottom of the X γ conveying device, and the drive is installed at a place other than the bottom, and it is really installed in other parts, so the connection of the page valve must be soft Problems will occur with the distance between the tube and the distance between the suction cup and the vacuum pump's driving part and the control valve. The installation position of the piece, the aforementioned suction cup and actuator connected between them are through X — Υ The carrying device needs to have a length that can cover its action range. The present invention is an object improved in view of the aforementioned problems in the prior art. The components are summarized together in small size, and the purpose is to improve the 1C sorption device with good responsiveness and use the device (1: conveying device and IC test device. [Means to solve the problem] (1) In order to achieve the above Purpose 'The 1C suction device according to the present invention is characterized by at least a suction cup that is held and held by the test 1C, an actuator that moves the suction cup, and suction control that opens and closes the suction force of the suction cup. The valves are integrated and integrated. In the 1C adsorption device of the present invention, the suction cup, the actuator, and the adsorption control valve system are integrated and combined.

第5頁 444126 五、發明說明(3) X - Y搬運裝置之底部上的話’ IC之吸著機能零件被小塑地 歸納一起,並能夠縮短連接於吸盤與吸著控制閥之軟 管,故能提高其動作應答性。 本發明中所述之一體化組合除了含有將吸盤、致動器 以及吸著控制闕組合於一個零件上之意味之外,更含有將 前述各項零件利用螺釘或是螺絲等連結機構加以組合安裝 之意味。因此’在吸盤之移動行程不同而吸著力相同之場 合中,以交換吸盤與致動器之方式,〖c吸著裝置之一部分 能夠加以泛用。 又,本發明所述之吸著控制閥係在對吸盤供給吸著力^ 的同時亦將吸著加以解放之控制閥,除了單獨由供給閥所’ 構成之外’亦可由供給闊與破壞閱之組合加以構成。在吸 著控制閥係單獨以控制閥加以構成之場合中,會在開啟吸 著力之際令供給間動作’在關閉吸著力之際會將成為吸著 力之根源之空氣壓加以釋放於大氣中。相對於此,欲提古 受測試IC之吸著力以及解除之速度或是受測試〖c為較輕 ^場合時,以追加破壞閥之方式能夠強制性地關閉吸^ (2) 雖然在前述之發明中並無特別限定,如Page 5 444126 V. Description of the invention (3) On the bottom of the X-Y handling device, the suction function parts of the IC are summarized together, and the hose connected to the suction cup and the suction control valve can be shortened. Can improve its action response. The integrated combination described in the present invention not only means that the suction cup, the actuator, and the adsorption control cymbal are combined on one part, but also includes the aforementioned components are combined and installed by using a connection mechanism such as a screw or a screw. Means. Therefore, in the case where the suction strokes have different moving strokes and the same suction force, a part of the suction device can be widely used by exchanging the suction cups and the actuators. In addition, the suction control valve according to the present invention is a control valve that releases suction while supplying suction force ^ to the suction cup. In addition to being constituted by the supply valve alone, it can also be read by the supply and destruction. Make up in combination. In the case where the suction control valve is constituted by a control valve alone, the supply room is operated when the suction power is turned on. When the suction power is turned off, the air pressure that is the source of the suction power is released to the atmosphere. On the other hand, if you want to mention the suction force of the tested IC and the speed of release, or if it is tested, [c is a lighter ^ occasion, the suction can be closed forcibly by adding a destruction valve. ^ (2) Although the above There is no particular limitation in the invention, such as

範圍第2項所述之1C吸著裝置般,更可以將偵 === 之吸著力之偵測器一體化地加以組合。囍、迷吸盤 之偵測器一體化地加以組合之方式讀吸著 測吸著力 靠著吸盤之故,所以透過債測器之檢測準確$ = ”位緊 (3) 在前述發明中,供給前述吸會提高。 盤及者力之吸著力發Like the 1C adsorption device described in the second item of the scope, the detectors that detect the adsorption force of === can be integrated together.囍. The suction cup's detectors are combined in an integrated way to read the suction force. Because the suction force depends on the suction cup, the detection through the debt tester is accurate. $ = ”The position is tight (3) In the aforementioned invention, the aforementioned Suction will increase.

444 12 6 五、發明說明⑷ 一 生器雖然可以共用裝置外之設備’但是在裝設有各裝置 是其令幾個裝置被併用之吸著力發生器之場合時,最好 將該吸著力發生器如申請專利範圍第3項所述之1〇吸著裝 置般一體化地加以组合。 如此,IC之吸著機能零件能夠小型地被歸納之外, 夠縮短分別連接吸著力發生器、吸盤以及吸著控制.闕之t 管或是流體路徑,可提高動作應‘答性。 κ C4)在前述發明中’令前述吸盤移動之致動器可以使 用電動式、電磁式或是流體壓力式的任何一種。在使用济 體乳壓缸之%合時’如申凊專利範圍第4項所述之π吸著 裝置t ’最好疋更加將控制該流體壓力缸之驅動之红抑制 閥一體化地加以組合。 1 在作為致動器而使用流體壓力缸之場合時,雖然控制 該流體壓力缸之驅動用之缸控制閥為必要,由於將^ =控 制閥一體化地加以組合,1C之吸著機能零件能夠小型地^ 歸納之外,能夠縮短分別連接流體壓力缸與缸控制閥之軟 管或是流體路徑,可提高流體壓力缸之動作應答性。 (5)雖然並無特別之限定,在作為致動器而使用流體 壓力缸之場合時,如申請專利範圍第5項所述之“吸444 12 6 V. Description of the invention ⑷ Although a lifetime device can share equipment outside the device, but when each device is equipped with a suction force generator that enables several devices to be used in combination, it is best to use the suction force generator They are integrated in an integrated manner as in the 10 adsorption device described in item 3 of the scope of patent application. In this way, the IC's suction function parts can be summarized in a small size, which can shorten the connection of the suction force generator, the suction cup, and the suction control. The t tube or the fluid path can improve the response of the action. κ C4) In the aforementioned invention, the actuator for moving the aforementioned sucker may use any of an electric type, an electromagnetic type, and a fluid pressure type. When using the% synchronizing cylinder of the breast milk pressure cylinder, 'the π adsorption device t as described in item 4 of the patent scope of the patent, it is better to integrate the red suppression valve that controls the driving of the fluid pressure cylinder as a whole. . 1 When a fluid pressure cylinder is used as an actuator, although a cylinder control valve for controlling the driving of the fluid pressure cylinder is necessary, since the ^ = control valve is integrated as a whole, the 1C suction function parts can be In addition to the small size, the hose or fluid path connecting the fluid pressure cylinder and the cylinder control valve can be shortened, and the action response of the fluid pressure cylinder can be improved. (5) Although not particularly limited, when a fluid pressure cylinder is used as an actuator, the "suction

ίΪ採Si;力缸之控制方式以壓差控制方式為最IίΪ mining Si; the control method of the pressure cylinder is based on the differential pressure control method.

Sl|rr „ 壓差控制方式,不僅缸控制閥變得小型更能達 到1C吸著裝置之小型化。 主旯肫運 利範(圍6 ^ ί ί前述發明中並無特別加以限定,在旁請專 、斤述之1C吸著裝置令,複數條電氣信號配線 444126 五、發明說明(5) 之中至少有複數修雷 器、吸著栌制間” 13儿尤線被連接於—處。對於致動 鑽所爐士 " ^ 1《、债測器等之電氣信號配線係由複數條電 纜所構成,藉由將電缴隼申 m你由複歎條也 電源配線,其结g '、处連接之方式,能夠共用 合中’將複數條電氣信號配線之(有:.:數)減少。在此場 外,更可以將複數條雷韻传 斤有配線連接於一處之 被連接於一處。但是,將』:配線之中幾條電氣信號配線 連接於一處的話,能夠提供,^氣信號配線之所有配線 ⑺雖然在前述發明中並:二之1C吸著裝置。 利範圍第8項所述之10吸著裳j別=限定,在申請專 述吸著控制閥以及前述偵測器’ 士於則逃致動器、前 部配線。 彳°就配線’係被設定為内 透過將致動器、吸荖抑生丨 定為内部配線之方式’ IC ^ =及偵測器之信號配線設 以歸納。 者機能零件能釣更小型地加 (8) 雖然在前述發明中並盔 利範圍第9項所述之以吸著裝巧別=定2申請專 述吸著力發生器以及前述流體壓^其内部形成有對於前 流體壓力缸之流體路徑,但官f吸著力發生器以及 組合之際,透過在苴内部%f吸耆機能零件一體化地 機能零件能夠更:型:::::體路徑之方式,1C之吸著 (9) 在前述本發明之1(;:吸著 述1C吸著裝置朝至少—w ϋ’亦ϋ作為令前 秒動之驅動裝置組合後之ic 444126 五、發明說明(6) 搬運裝置加以使用’亦能夠组合於將受測試IC搬運到測 試接頭後執行測試再根據測試結果之資料將前述受測試j c 加以分類之IC測試裝置内加以使用。 在此場合中,本發明之1C吸著裝置適用於具收容室型 之IC測試裝置、加熱板型之IC測試裝置、在將受測試丨c放 置於測s式托盤之狀下執行測試型之I c測試裝置、將受測 試1C以1C吸著裝置直接維持而執_行測試型之IC測試裝置等 等之各種IC測試裝置’此外’承載部、非承載部或者是測 試接頭等’均能夠適用於IC測試裝置内之各種I c吸著裝 置。 【發明之實施形態】 以下將根據圖面說明本發明之實施形態。 圖1為適用於本發明所述1C吸著裝置之IC測試裝置之 實施形態之平面圖。圖2圖1中沿著n J線之剖面圖,圖3 為表示圖2中測試接頭之接觸部之詳細剖面圖(圖!中沿著 ΠΙ-ΙΙΙ線之剖面圓),圖4係圖3所示之插座導件之平面 本IC測試裝置係由處理器i 0 卩 測試接頭20以及測試器 查Ϊ 接頭2〇與測試器3〇之間係經由電_加以 m τ 將搭載於處理器1 〇之托盤10 2上之測試前之 又測忒ic透過χ-γ搬運裝置104、1〇5壓入測試接頭“之 Ξ部在試接頭2°以及電纜40執行受測試1c之測 ΐ盤丄中 後將受測試IC根據測試結果收容於分類Sl | rr „Differential pressure control method, not only the cylinder control valve becomes small, but also can achieve the miniaturization of the 1C adsorption device. The main operation and profit model (around 6 ^ ί ί is not particularly limited in the aforementioned invention, please beside Specially, the 1C suction device order, multiple electrical signal wiring 444126 5. Invention description (5) There are at least multiple lightning repair devices and suction control rooms "13 Eryou line is connected to-where. For Actuator of the Institute of Drilling " ^ 1 ", the electrical signal wiring of the debt tester is composed of a plurality of cables. The method of connection can be shared, and the number of electrical signal wirings (including ::: number) can be reduced. Outside this field, it is also possible to connect a plurality of thunder rhinestones with wiring to one location and be connected to one. However, if you connect several electrical signal wirings among the wirings at one place, you can provide all wirings of the gas signal wirings. Although in the aforementioned invention, the 2C 1C adsorption device is included. The eighth range of interest Item 10 of Suction Suck j Be = Limited, the application specifically describes Suction Control And the above-mentioned detectors' escape the actuator and the front wiring. 彳 ° The wiring 'is set as the internal wiring through the actuator and suction suppression, and is determined as the internal wiring method' IC ^ = and The signal wiring of the detector is set to be summarized. The functional parts of the detector can be added in a smaller size. (8) Although in the aforementioned invention, the suction range is described in item 9 above, it should be installed with suction. The generator and the aforementioned fluid pressure ^ have a fluid path for the front fluid pressure cylinder inside, but in the case of the suction force generator and combination, the functional parts integrated by the% f suction functional parts inside the unit can be more: Type ::::: Body path method, 1C adsorption (9) In the aforementioned 1 (;: adsorption 1C adsorption device is directed at least -w ϋ 'also ϋ as a driving device combination that moves the second before The later ic 444126 V. Description of the invention (6) The use of the carrying device can also be combined in the IC test device for carrying out the test after carrying the test IC to the test connector and classifying the test jc according to the information of the test result. Use. On this occasion The 1C adsorption device of the present invention is suitable for an IC test device with a storage chamber type, an IC test device with a heating plate type, and an I c test device that performs a test when the test is placed on a test tray. Various IC test devices that perform the test 1C and 1C sorption devices directly and carry out the test _ IC test devices of test type, etc. In addition, 'carrying parts, non-carrying parts, or test connectors, etc.' can be applied to IC testing Various IC adsorption devices in the device. [Embodiments of the invention] The embodiments of the present invention will be described below with reference to the drawings. Fig. 1 is a plan view of an embodiment of an IC test device suitable for the 1C adsorption device according to the present invention. Fig. 2 is a cross-sectional view taken along line nJ in Fig. 1, and Fig. 3 is a detailed cross-sectional view showing the contact portion of the test joint in Fig. 2 (fig.!) The cross-section circle along the line II-III is shown in Figure 4). Figure 4 is the plane of the socket guide shown in Figure 3. The IC test device consists of processor i 0 卩 test connector 20 and tester check Ϊ connector 20 and tester. Between 30, it is electrically charged with m τ. The test before the test on the tray 10 2 mounted on the processor 10 is pushed through the χ-γ transfer device 104 and 105 into the test head. After the test connector 2 ° and the cable 40 performs the test panel 1c of the test, the test IC is stored in the classification according to the test results

第9頁 444126 五、發明說明(7) '' ------- 處理器10設置有基板109,此基板109上亦設置有 试1C之X-Y搬運裝置104、105。此外,基板1〇9上形成有 口部110 ’如圖2所示般受測試1C會通過該開口部1丨〇而^^ 壓入接觸被設置於處理器1 〇之後端之測試接頭2〇之接觸^部 2 01° 處理器10之基板109上設置有2組X-Y搬運裝置1〇4、 1 05。其中之χ-γ搬運裝置1 〇4係以透過分別沿著X軸方向以 及Y軸方向所設置之導軌i 04a、i〇4b,被固定於固定底部 104c之1C吸著裝置i〇4d會由分類托盤103起、供給托盤 102、空牦盤ιοί、加熱板106到2個缓衝部1〇8、1〇8為止之 領域中可移動地被加以構成。並且此1C吸著裝置i〇4d之吸 盤1041能夠透過未圖示之z軸致動器(相當於圖3所示之汽 缸1 052)向Z軸方向,以就是上下方向移動。然後,透過設 置於固定基部l〇4d之2個1C吸著裝置,能夠一次進行2個受 測試IC之吸取、搬運以及解除。 對此,X-Y搬運裝置〗〇5係以透過分別沿著X軸方向以 及Y軸方向所設置之導軌105a、i〇5b,被固定於固定底部 10 5c之1C吸著裝置i〇5d會在2個緩衝部、108到測試接 頭之間之領域中可移動地被加以構成。並且此I C吸著裝置 105d之吸盤1〇51能夠透過未圖示之圖3所示之汽缸1052(Z 軸致動器)向Z軸方向(以就是上下方向)移動。然後,透過 設置於固定基部l〇5d之2個1C吸著裝置,能夠一次進行2個 受測試IC之吸取、搬運以及解除。 又,2個緩衝部1〇8、1〇8係透過導軌108a以及未圖示Page 9 444126 V. Description of the invention (7) '' ------- The processor 10 is provided with a substrate 109, and the substrate 109 is also provided with X-Y handling devices 104 and 105 for test 1C. In addition, a mouth portion 110 ′ is formed on the substrate 10. As shown in FIG. 2, the test portion 1C passes through the opening portion 1 丨 and a press-in contact is provided to the test connector 2 at the rear end of the processor 10. Contact ^ 部 2 01 ° The substrate 109 of the processor 10 is provided with two sets of XY handling devices 104 and 105. Among them, the χ-γ conveying device 1 〇4 is a 1C suction device i〇4d fixed to the fixed bottom 104c through guide rails i 04a and i〇4b provided along the X-axis direction and the Y-axis direction, respectively. The areas from the sorting tray 103, the supply tray 102, the empty tray, and the heating plate 106 to the two buffer sections 108 and 108 are movably configured. In addition, the suction plate 1041 of the 1C suction device i04d can move through the z-axis actuator (equivalent to the cylinder 1 052 shown in Fig. 3) in the Z-axis direction, so as to move up and down. Then, through the two 1C adsorption devices provided on the fixed base 104d, suction, transportation, and release of two test ICs can be performed at one time. In this regard, the XY conveying device 〇〇5 is fixed to the fixed bottom 10 5c 1C suction device i〇5d through the guide rails 105a and i〇5b provided along the X-axis direction and the Y-axis direction, respectively. The buffer section 108 is movably formed in the area between the test connector and the test connector. In addition, the suction cup 1051 of the IC suction device 105d can be moved in the Z-axis direction (that is, the vertical direction) through a cylinder 1052 (Z-axis actuator) shown in FIG. 3 (not shown). Then, through the two 1C adsorption devices installed on the fixed base 105d, suction, transportation, and release of two test ICs can be performed at one time. The two buffer portions 108 and 108 are transmitted through the guide rail 108a and not shown.

第10頁 4441 2 6 五、發明說明(8) 之致動器在2個X-Y搬運裝置1〇4、105之動作領域之間往返 移動。在圖1中’上侧之緩衝部丨0 8係進行將從加熱板丨〇 6 所搬運過來之受測試丨c移送到測試接頭2 〇之作業,下端之 缓衝區1 0 8係進行將在測試接頭2 〇處測試結束之射測試j c 送出之作業。藉由此2個緩衝部之存在,2個X-Y搬運裝 置104、105能夠不互相干涉同時進行動作。 X-Y搬運裝置104之動作領域,中設置有,搭載接下來欲 進行測試之受測試IC之供給托盤1 〇 2、將測試後之I c根據 測試結果所對應之種類分類後加以收容之4個分類托盤丨〇 3 以及空的托盤101 ’更在接近緩衝部1〇8之位置上設置有加 熱板1 0 6。 此加熱板1 06,可以是金屬製板,形成有將受測試IC 落入之複數個凹部1 〇6a ’由供給托盤運來的測試前ic藉由 X-Y搬運裝置被移送到此凹部1〇6a。加熱板1〇6乃是對受測 試IC施加所定義之熱應力用之加熱源,受測試丨c會在加熱 板1 0 6處被加熱到所定義之溫度之後,經由某一方之緩衝 部1 0 8被壓入測試接頭2 〇之接觸部。 如圖3所示般’在本發明所述之測試接頭2 0上方(接觸 部201)處’裝設有經由測試接頭2〇本體與電纜2〇3被電性 連接之組件狀環2 〇 2。此組件狀環2 〇 2呈環狀設置有多數個 向上之POGO PIN (POGO PIN :具有透過彈簧能在軸心方向 伸縮自如地受到支撐之可動接腳,此可動接腳乃是藉由前 述彈簧向突出方向被固定之接觸接腳),此p0G0 pIN2〇4處 設置有與端子接觸之功能基板2〇5。此外,在功能基板2〇5Page 10 4441 2 6 V. Description of the invention (8) The actuator moves back and forth between the operation fields of the two X-Y handling devices 104 and 105. In Fig. 1, the upper buffer section 丨 0 8 is moved from the heating plate 丨 0 6 to be tested 丨 c to the test joint 2 〇, and the lower buffer zone 108 is to be transferred. At the end of the test at the test joint 20, the test jc sends out the job. With the existence of the two buffer portions, the two X-Y transfer devices 104 and 105 can operate simultaneously without interference. The operation field of the XY conveying device 104 is provided with a supply tray 1 equipped with a test IC to be tested next. 02. The I c after the test is classified according to the type corresponding to the test result, and the four classifications are stored. The tray 丨 〇3 and the empty tray 101 'are further provided with a heating plate 106 at a position close to the buffer portion 108. The heating plate 106 may be a metal plate formed with a plurality of recessed portions 1 06a where the test IC is dropped. The pre-test ic delivered from the supply tray is transferred to the recessed portion 106a by an XY transfer device. . The heating plate 106 is a heating source for applying the defined thermal stress to the IC under test. After the test, c will be heated to the defined temperature at the heating plate 106, and then pass through one of the buffer portions 1 0 8 is pressed into the contact portion of the test joint 2 0. As shown in FIG. 3, a component-shaped ring 2 〇2 is electrically connected to the test connector 20 above the contact connector 201 (contact portion 201) through the test connector 20 and the cable 203. . This component-shaped ring 2 has a plurality of POGO PINs (POGO PIN: a movable pin that can be flexibly supported in the axial direction through a spring through a spring. The movable pin is provided by the aforementioned spring. The contact pin is fixed in the protruding direction), and a functional substrate 2 05 is provided at the p0G0 pIN204 to be in contact with the terminal. In addition, the functional substrate 20

第11頁 444 ί 2 6Page 11 444 2 2

五、發明說明(9) 上裝設有2個以電性連接之1(:插座2〇6、206。由此,〖c插 座2 06之接觸接腳(未圖示)係經由功能基板2〇5、?〇(?()V. Description of the invention (9) The upper part is provided with two electrical connections 1 (: sockets 206, 206. Therefore, the contact pins (not shown) of [c socket 2 06] pass through the functional substrate 2) 〇5,? 〇 (? ()

Pi Ν204、組件狀環2〇2以及電纜20 3與測試接頭20本體作電 性連接。 也就是說’在2個1C插座206處,裝設有具有如圖4所 示般之'2個開口部2〇7a以及導引針2 07b之插座導件207,被 維持於I C吸著裝置1 〇 5 d之受測試I C會通過插座導件2 〇 7之 開口部2 0 7 a被壓入IC插座2 0 6,此時設置於插座導件2 〇 γ之 導引針207b會分別插入ic吸著裝置i〇5d之吸盤1〇51上所形 成之導引孔1051a,藉由此方式進行受測試1(:與1(:插座2〇6 之位置調整。 如圖3所示般,本發明所述之ic吸著裝置i〇5d係由, 令將受測試1C吸著維持之吸盤1〇51作上下移動之汽缸 1 〇 5 2、控制該汽缸1 〇 5 2之驅動之缸控制閥1 〇 5 3、供給吸盤 1051吸著力之真空發生器1054、控制該真空發生器low之 開寬之供給閥1 〇 5 5與破壞閥1 〇 5 6、以及檢測真空發生器所 產生之吸著力用之壓力偵測器1057等以組件狀一體化地加 以組合之方式加以構成。 在本實施形態中所使用之真空發生器丨〇54乃是利用所 謂的喷射效果之噴射真空幫浦’將壓縮空氣由吸引室引進 狹路’透過在此形成之吸引通路帶來的伴隨流而產生吸引 力。因此,真空發生器1 054之上方連接有供給工廠等之壓 縮空氣之空氣軟管1058,由此將壓縮空氣導入真空發生器 内之方式,使被連接於吸盤1051之吸引用軟管1〇54a發生Pi Ν204, the component-shaped ring 202 and the cable 20 3 are electrically connected to the body of the test connector 20. In other words, 'the two 1C sockets 206 are provided with socket guides 207 having two openings 207a and guide pins 207b as shown in Fig. 4, and are maintained in the IC suction device. The test IC of 1 〇5 d will be pressed into the IC socket 2 0 6 through the opening 2 0 7 of the socket guide 2, and the guide pins 207 b provided at the socket guide 2 〇 γ will be inserted separately. The guide hole 1051a formed on the suction cup 1051 of the ic suction device i05d is used to adjust the position of the test 1 (: and 1 (: socket 206) in this way. As shown in FIG. 3, The ic suction device i05d described in the present invention is controlled by the cylinder 1 that moves the suction cup 1051 that is held by the test 1C to be held up and down to control the driving of the cylinder 1 〇2. Valve 1 〇5 3. Vacuum generator 1054 that supplies suction force to suction cup 1051, supply valve 1 05 that controls the widening of the vacuum generator low and break valve 1 〇6, and detection of suction generated by the vacuum generator The forceful pressure detector 1057 and the like are configured in a unitary and integrated manner. The vacuum generator used in this embodiment 丨〇54 uses the so-called spray effect of the vacuum pump "introduces compressed air from the suction chamber into the narrow path" through the suction flow formed by the accompanying flow to create attraction. Therefore, the vacuum generator 1 054 An air hose 1058 for supplying compressed air to a factory or the like is connected above, and the compressed air is introduced into the vacuum generator to generate a suction hose 1054a connected to the suction cup 1051.

第12頁 4441 2 6 五、發明說明(ίο) 吸引力而能夠將受測試IC吸著。 又’真空發生器1054係透過由空氣軟管丨058所供給之 歷縮空氣之開閉對吸引用軟管1 〇 5 4也就是吸盤1 〇 5 1供應吸 著力。因此’將由空氣軟管來的壓縮空氣導引到真空發生 器之吸引室用之供給閥1 055、將被導引至真空發生係之吸 引室内之壓縮空氣加以排出之破壞閥1 〇 5 6等設置於真空發 生器1054之側面部分。此外,為了檢測出藉由真空發生器 1054所產生之吸引力之壓力偵測器1 0 57亦與供給閥1〇55與 破壞閥1056併排地被設置真空發生器中。 另一方面’驅動控制汽缸1 〇 5 2之缸控制閥1 〇 5 3會被.供~丨 給由空氣軟管1 〇 5 8所供給之一部分壓縮空氣,藉此汽缸 一 1052之圓筒l〇52a會作進退移動(在此為上下移動)。在 此’由空氣軟管1 058所供給之壓縮空氣會被供給到前述真 空發生器1 0 54以及缸控制閥1 053之故,雖然省略其圖示^ 為了該目的之空氣通路係被形成於構成真空發生器1〇54以 及缸控制閥1053之組件内。 圖5為本實施形態之空壓電路之電路圖,在圖中所示 之二壓電路中’ Η缸1 0 5 2係以所§胃的麼差控制方式加以控 制。所謂的壓差控制方式係指’在汽缸丨052之活塞的表裡 面上’圓筒1 〇 5 2 a所设置之面與相反面比較之下,注音到 僅圓筒1 052a之截面積部分受壓面積較小之現象,以對活 塞的表裡面導入相同壓力之壓縮空氣而令圓筒1〇52a前進 之方式。 也就是’如同圖之空壓電路圖所示般,僅在活塞之圓Page 12 4441 2 6 V. Description of the Invention (ίο) Attraction can attract the test IC. Also, the 'vacuum generator 1054 supplies suction force to the suction hose 1 05, that is, the suction cup 1 051, through the opening and closing of the contracted air supplied from the air hose 058. Therefore, 'supply valve 1 055 for guiding compressed air from an air hose to the suction chamber of a vacuum generator, and destruction valve 1 056 for discharging compressed air guided to the suction chamber of a vacuum generating system, etc. It is provided on a side portion of the vacuum generator 1054. In addition, in order to detect the attractive force generated by the vacuum generator 1054, a pressure detector 1057 is also installed in the vacuum generator side by side with the supply valve 1055 and the destruction valve 1056. On the other hand, the cylinder control valve 1 〇 5 3 that drives the control cylinder 1 〇 2 will be supplied. 丨 to a part of the compressed air supplied by the air hose 1 008 5, so that the cylinder 1 105 2 cylinder 1 〇52a will move forward and backward (here it is up and down). Here, the compressed air supplied from the air hose 1 058 is supplied to the aforementioned vacuum generator 1 54 and the cylinder control valve 1 053. Although the illustration is omitted, an air passage is formed for this purpose. The vacuum generator 1054 and the cylinder control valve 1053 are included. Fig. 5 is a circuit diagram of the air-pressure circuit of this embodiment. In the two-pressure circuit shown in the figure, the Η cylinder 1 0 5 2 is controlled in the same manner as that of the stomach. The so-called differential pressure control method means that the surface of the cylinder 1 052 5 a is set on the surface of the piston of the cylinder 052 and the opposite surface is compared. The phenomenon that the pressure area is small is that the cylinder 1052a is advanced by introducing compressed air of the same pressure to the surface of the piston. That is, as shown in the air compressor circuit diagram, only in the circle of the piston

第13頁 444126 五、發明說明(11) 筒1 052a端之進氣孔經常被導入壓縮空氣,令圓筒1〇52a前 進之場合時’相反面之進氣孔亦導入相同壓力之壓縮空 亂。由此’活塞之相反面之受壓面積與圓筒l〇52a相比較 之下僅該圓筒部分增大而總受壓量變大之故,圓筒1052a 會向前進。又’若將對活塞之相反面端之壓縮空氣之導入 V止的洁’透過圓筒端之壓縮空氣的導入圓筒i〇52a會向 後退。 採用前述之壓差控制方式之汽缸丨〇52時,缸控制閥 1 0 5 3為小型之物件即可,由此本實施形態之j c吸著裝置全 體更加小型化。 但是’本發明所述之汽缸1〇52之動作控制方式並不限 定於圖5所不之方式’採用圖6所示之一般動作控制方式亦 無任何問題。圖6中,與圖5共通之零件以同一符號表示。 另一方面’朝向缸控制閥1 053、供給閥1 055以及破壞 闕1 056之信號配線與由壓力偵測器來的輸出信號配線1〇59 ,例如圖示般連接於IC吸著裝置1〇5(1之一處,由此前方則 是組件内之内部配線。在此場合中,内部配線之一部分或 是全部能夠利用印刷配線基板等物件。 接下來說明各項動作。 搭載於處理器丨〇之供給托盤丨〇 2上之受測試丨c係透過 X-Y搬運裝置而被吸著維持然後移送到加熱板〗〇6之凹部 106a 在此藉由僅依所定義之時間加以放置,受測試ic會 ,昇溫度到所定義之溫度之故,所以將溫度升高前之受測 試1C由供給托盤102向加熱板1〇6移送之χ_γ搬運裝置1〇4會Page 13 444126 V. Description of the invention (11) Compressed air is often introduced into the air inlet of the cylinder 1 052a end, so that when the cylinder 1052a advances, the air holes on the opposite side also introduce compressed air with the same pressure. . As a result, compared with the cylinder 1052a, the pressure area on the opposite side of the piston is increased only by the cylinder portion and the total pressure is increased, so that the cylinder 1052a will move forward. Also, "if the introduction of compressed air to the opposite end of the piston, V is clean", the compressed air introduction cylinder i52a passing through the cylinder end will move backward. In the case of adopting the cylinder of the differential pressure control method described above, the cylinder control valve 1053 may be a small-sized object, and thus the j c adsorption device of this embodiment is further miniaturized. However, "the operation control method of the cylinder 1052 according to the present invention is not limited to the method shown in Fig. 5" and the general operation control method shown in Fig. 6 is adopted without any problem. In FIG. 6, parts common to those in FIG. 5 are indicated by the same symbols. On the other hand, the signal wiring for the cylinder control valve 1 053, the supply valve 1 055, and the destruction valve 1 056 and the output signal wiring 1059 from the pressure sensor are connected to the IC suction device 1 as shown in the figure. 5 (1), so the front is the internal wiring inside the module. In this case, some or all of the internal wiring can use objects such as printed wiring boards. Next, each operation will be described. Mounted on the processor 丨〇The supply tray 丨 〇2 is tested 丨 c is sucked and maintained by the XY conveying device and then transferred to the heating plate〗 〇The recessed portion 106a is placed here only for the defined time. Yes, the temperature rises to the defined temperature, so the test 1C before the temperature rise is transferred from the supply tray 102 to the heating plate 106, the χ_γ transfer device 104

第14頁 44412 6 五、發明說明(12) 在放下受測試IC之後,將放置於加熱板丨 定義之溫度的受職K維持原狀地吸著維持移^所 1 二在止受 =被移送 右端為止的冋,透過χ_γ搬運裝置1〇5之1(>及 受到吸著維持,如圖3所示般,通過基板〗〇9之二 壓入接觸於測試接頭2〇iic插座2〇6。 在此,本實施形態之1C吸著,裝置i〇5d係由吸盤1〇51、 汽缸1 052、缸控制間1 0 53、真空發生器1〇54、供給閥1〇55 與破壞閥1 0 5 6、以及壓力偵測器1 〇 5 7等以組件狀一體化地 加以組合之方式加以構成,故當安裝於χ_γ搬運裝置丨〇 5之 固定底部105c時’ 1C吸著機能零件能夠小型化地"加以歸: 納。 此外,供給壓縮空氣之空氣軟管1 〇 5 8與缸控制閥丨0 5 3 之間之距離、空氣匡管1058與真空發生器之間之距離、以 及真空發生器與吸盤之間之距離分別能夠縮短,故對於由 信號配線1059所輸入之信號,能夠提高汽缸1〇52以及真空 發生器1 0 54之動作應答性。 又,本實施形態之1C吸著裝置105d中,吸盤1051 '汽 缸10 52、缸控制閥1053、真空發生器1054、供給閥1055與 破壞閥1 0 5 6、以及壓力偵測器1 0 5 7等係透過螺釘或是螺絲 加以組合,所以例如在想改變汽缸1 0 5 2之行程之場合時, 僅將該汽缸加以交換即可,其他零件能夠共用。 而且,空氣軟管或是電氣配線極力地被形成於内部, 因此IC吸著機能零件更能夠小型化地加以歸納。Page 14 44412 6 V. Description of the invention (12) After putting down the test IC, place the job K placed on the heating plate 丨 at the temperature defined by the original suction and maintain the transfer ^ 2 1 at the stop = the right end of the transfer Up to this point, it was held by the χ_γ transfer device 10.5 (>) and held by suction, as shown in FIG. 3, and pressed into contact with the test connector 20iic socket 206 as shown in FIG. 3 through the substrate. Here, 1C of this embodiment is sucked, and the device i05d is composed of a suction cup 1051, a cylinder 1 052, a cylinder control room 1 0 53, a vacuum generator 1054, a supply valve 1055 and a destruction valve 10. 5, 6, and the pressure detector 1 〇 5 7 and other components are integrated in a combination of components to form a structure, so when installed on the χ_γ transfer device 丨 05 fixed bottom 105c '1C adsorption function parts can be miniaturized Ground " Add: In addition, the distance between the air hose 1 0 5 8 and the cylinder control valve 0 5 3 for supplying compressed air, the distance between the air tube 1058 and the vacuum generator, and the vacuum generation The distance between the device and the suction cup can be shortened respectively, so for the input by the signal wiring 1059 The input signal can improve the responsiveness of the operation of the cylinder 1052 and the vacuum generator 1 54. In the 1C suction device 105d of the present embodiment, the suction cup 1051 'cylinder 10 52, the cylinder control valve 1053, and the vacuum generator 1054, supply valve 1055, destruction valve 1 0 5 6 and pressure detector 1 0 5 7 are combined by screws or screws, so for example, when you want to change the stroke of the cylinder 1 0 5 2 only This cylinder can be exchanged, and other parts can be shared. In addition, air hoses or electrical wiring are strongly formed inside, so IC suction function parts can be reduced in size.

第15頁 ϊ 444126 五、發明說明(13) 又,在前述之實施形態乃是為了容易地理解本發明所 加以記載之說明’並非限制本發明之記述。因此,前述實 施形態所說明之各項要素,均意味著包含屬於本發明之技 術範圍之所有設計變更或是同等物品。 在前述實施形態中,雖然本發明之κ吸著裝置適用於 對於測試接頭20之X-Y搬運裝置105,前述實施形態之^測 試裝置亦適用於χ~γ搬運裝置104。又,令吸盤1〇51作上下 移動之致動器並不限定於汽缸〗052,以電動馬達作 源之致動器、亦可。此外,真空發生器1〇54並非本^明之κP.15 ϊ 444126 V. Description of the invention (13) The above-mentioned embodiment is for easy understanding of the description of the present invention, and is not a description of the present invention. Therefore, each of the elements described in the foregoing embodiments is meant to include all design changes or equivalent items that belong to the technical scope of the present invention. In the foregoing embodiment, although the κ adsorption device of the present invention is applied to the X-Y transfer device 105 of the test joint 20, the ^ test device of the foregoing embodiment is also applicable to the χ ~ γ transfer device 104. The actuator that moves the suction cup 1051 up and down is not limited to the cylinder 052, and an actuator using an electric motor as a source may be used. In addition, the vacuum generator 1054 is not a κ

=箸裝置所必須之物#,在I薇等外部備有真空源之場合 ,僅將供給閥1055以及破壞閥;[〇56組入ic著裝置即可 【發明之效果】 1 1 ° 由前述之本發明來看,ic 加以歸納,並且驅動部與控制 故能夠提高驅動部之動作應答 【圖式之簡單說明】 吸著機能零件能夠小型化地 閥等之間之距離能夠縮短, 性。 圖1係適用於本發明之ic吸著裝置 施型態的平面圖。 之I C測試裝置之實 圖2係圖1之沿著丨ί _;[ I線之剖面圖。 圖3係圖2之測試接頭之接觸部之詳細剖面 圖4係圖3之插座導件之平面圖。= 箸 装置 requisite 的 物 #, where a vacuum source is provided externally, such as Ivy, only the supply valve 1055 and the destruction valve; [〇56 can be integrated into the device [effect of the invention] 1 1 ° from the foregoing In view of the present invention, ic is summarized, and the driving unit and the control unit can improve the operation response of the driving unit. [Simplified description of the drawing] The distance between the valve and the like that can reduce the size of the suction functional parts can be shortened. Fig. 1 is a plan view of an application mode of an ic adsorption device suitable for the present invention. The actual I C test device Figure 2 is a cross-sectional view taken along line I in Figure 1. Fig. 3 is a detailed sectional view of the contact portion of the test connector of Fig. 2. Fig. 4 is a plan view of the socket guide of Fig. 3.

圖5係本發明之IC吸箸裝置之空 電路圖。 電路之實施型態的 電路之其他實施型 圖6係本發明之1C吸著裝置之空壓 4441Fig. 5 is an empty circuit diagram of the IC suction device of the present invention. Circuit implementation type Other circuit implementation Figure 6 shows the air pressure of the 1C adsorption device of the present invention 4441

五、發明說明(14) 態的電路圖。 【符號之說明 1〜ϊ c測試裝置;1 〇〜 給托盤;1 〇 3〜分類托盤 處玻器;101〜空的托盤;102〜供 1〇4~Χ_Υ搬運裝置;1〇5〜X-Y搬運 震置;104a〜導執;i〇4b~導軌〜導軌〜導執; i04c〜固定底部;105c〜固定底部;l〇4d~IC吸著裝置; USd〜ic吸著裝置;1〇5卜吸盤;1 0 52〜汽缸(致動器); 1 053〜紅控制閥;1〇54~真空發生器;1〇55〜供給閥(吸著力 1 二制間);1G56〜破壞閥(吸著力控制閥);1 057〜壓力偵測 j.,- . , n 〇 ^ ’1〇58~空氣軟管;1059〜信號配線;106〜加熱.」、 取,1 ϋ 8 〜Μ 也* ,“、、 ' 頭;2〇1〜衡邻;109〜基板;110〜開口部;20〜測試接 — _部;30〜測試器;40〜電纜。5. Description of the invention (14) Circuit diagram. [Description of Symbols 1 ~ ϊc test device; 1〇 ~ feed tray; 1〇3 ~ sorting tray glassware; 101 ~ empty tray; 102 ~ for 104 ~ χ_Υ transport device; 105 ~ XY transfer Vibration set; 104a ~ Guide; i04b ~ Guide ~ Guide ~ Guide; i04c ~ Fixed bottom; 105c ~ Fixed bottom; 104d ~ IC suction device; USd ~ ic suction device; 105b suction cup 1 0 52 ~ cylinder (actuator); 1 053 ~ red control valve; 1054 ~ vacuum generator; 1055 ~ supply valve (suction force 1 2nd system); 1G56 ~ break valve (suction force control) Valve); 1 057 ~ pressure detection j.,-., N 〇 ^ '1058 ~ air hose; 1059 ~ signal wiring; 106 ~ heating. ", Take, 1 ϋ 8 ~ Μ also *,", , 'Head; 201 ~ Heng Lin; 109 ~ substrate; 110 ~ opening; 20 ~ test connection-_; 30 ~ tester; 40 ~ cable.

第17頁Page 17

Claims (1)

--——- _ 六、申請專利範圍 L ~ 種 1C 以吸著維持的 前述吸盤之吸 組合而成。 2. 如申請 前述吸盤之吸 組合而成。 3. 如申請 前述吸盤供應 合而成。 4‘如申請 前述吸盤供應 合而成。 5. 如申請 述致動器係由 驅動的缸控制 6. 如申請 述流體壓力缸 7. 如申請 述致動器係由 8. 如申請 數_條電氣信號 於一處。 吸著裝置 吸盤、令 著力加以 專利範圍 著力加以 專利範圍 吸著力的 專利範圍 吸著力的 專利範圍 此流體壓 闊更被一 專利範圍 係藉由壓 專利範圍 電磁缸所 專利範圍 配線之中 丄其特徵在於:至少將受測試IC加 則述吸盤加以移動的致動器以及將 開閉的吸著控制閥被一體化地加以 第1項所述之1C吸箸裝置,其中將 檢剛出的偵測器更被一體地化加以 第1項所述之1C吸著裝置,其中對 °及著力發生器更被一體化地加以組 第2項所述之ic吸著裝置,其中對 吸著力發生器更被一體化地加以組 第Ϊ項所述之1C吸著裝置,其中前 力虹所構成’且控制流體壓力缸之 體化加以組合而成。 第5項所述之1C吸著袭置, 差控制電路而被加以控制 第1項所述之1C吸著裝置, 構成。 第1項所述之1C吸著裳置, 其中前 其中前 其中複 至少有複數條電氣信號配線被連接 9.如申清專利範圍第2項所述之ic吸著裝置,其中對--——- _ VI. Patent application scope L ~ 1C The combination of the aforementioned suction cups that are maintained by adsorption. 2. If you apply for the combination of the suction cups mentioned above. 3. If applying for the aforementioned suction cups supply combination. 4‘If you apply for the aforementioned suction cup supply combination. 5. If applied, the actuator is controlled by a driven cylinder. 6. If applied, the fluid pressure cylinder. 7. If applied, the actuator is controlled by 8. If applied, the number of electrical signals is in one place. Suction device suction cup, make the patented range of the force, patented the range of the suction force, the patented range of the suction force, and the fluid pressure. This fluid is expanded by a patented range by pressing the patented range of the electromagnetic range of the patented electromagnetic cylinder. Its characteristics The reason is that at least the actuator for moving the IC under test and the suction cup and the suction control valve for opening and closing are integrated with the 1C suction device described in item 1, wherein the newly detected detector The 1C adsorption device described in the first item is integrated, and the ° and the force generator are integrated. The ic adsorption device described in the second item is integrated, and the suction force generator is further integrated. The 1C adsorption device described in the item Ϊ of the group is integrated, which is composed of the combination of the front pressure rainbow and the control of the fluid pressure cylinder. The 1C adsorption device described in item 5 is controlled by a difference control circuit, and the 1C adsorption device described in item 1 is configured. The 1C suction device described in item 1, among which the front of which is at least a plurality of electrical signal wirings are connected 9. As described in claim 2 of the ic absorption device of the patent scope, where 第18頁 444 12 6 六、申請專利範圍 於前述致動器、前述吸著控制閥以及前述偵測器之信號配 線係被設定為内部配線。 1 0 .如申請專利範圍第4項所述之I C吸著裝置,其中對 於前述吸著力發生器之流體路徑係形成於内部。 11. 如申請專利範圍第5項所述之I C吸著裝置,其中對 於前述流體壓力缸之流體路徑係形成於内部。 12. —種1C搬運裝置,包括: I C吸著裝置,申請專利範圍第1、2、3、4、5、6、 7、8、9、1 0或1 1項所述者;以及 驅動裝置,令前述IC吸著裝置朝至少一軸方向移動。 1 3. —種I C測試裝置,將受測試IC搬運到測試接頭而 執行測試,且根據測試結果之資料將前述受測試IC加以分 類’ 其特徵在於: 包括有如申請專利範圍第1、2、3、4、5、6、7、8、 或9項所述之1C吸著裝置。Page 18 444 12 6 VI. Scope of patent application The signal wiring of the aforementioned actuator, the aforementioned suction control valve and the aforementioned detector is set as internal wiring. 10. The IC adsorption device according to item 4 of the scope of patent application, wherein the fluid path to the aforementioned adsorption force generator is formed inside. 11. The IC suction device according to item 5 of the scope of the patent application, wherein a fluid path to the aforementioned fluid pressure cylinder is formed inside. 12. A 1C handling device, including: an IC suction device, the one described in the patent application scope 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, or 11; and a driving device , So that the IC suction device is moved in at least one axis direction. 1 3. —An IC test device that carries the test IC to the test connector and performs the test, and classifies the test IC according to the information of the test result. It is characterized by: 1C adsorption device according to item 4, 4, 5, 6, 7, 8, or 9. 第19頁Page 19
TW088109266A 1998-06-15 1999-06-04 IC sucking device, and IC porting device and IC testing device using the sucking device TW444126B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16688098A JP4090117B2 (en) 1998-06-15 1998-06-15 IC adsorption device, IC conveyance device using the same, and IC test device

Publications (1)

Publication Number Publication Date
TW444126B true TW444126B (en) 2001-07-01

Family

ID=15839338

Family Applications (1)

Application Number Title Priority Date Filing Date
TW088109266A TW444126B (en) 1998-06-15 1999-06-04 IC sucking device, and IC porting device and IC testing device using the sucking device

Country Status (4)

Country Link
US (1) US6384360B1 (en)
JP (1) JP4090117B2 (en)
KR (1) KR100711613B1 (en)
TW (1) TW444126B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103977964A (en) * 2013-02-07 2014-08-13 泰克元有限公司 Pressure applying device for testing sorting machine
TWI582442B (en) * 2014-09-30 2017-05-11 Seiko Epson Corp Electronic parts conveyor and electronic parts inspection device

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3866025B2 (en) * 2000-09-06 2007-01-10 株式会社コガネイ Adsorption transport device and flow path switching unit used therefor
JP4349743B2 (en) * 2000-12-20 2009-10-21 東北精機工業株式会社 IC handler
US6991960B2 (en) * 2001-08-30 2006-01-31 Micron Technology, Inc. Method of semiconductor device package alignment and method of testing
WO2003075025A1 (en) * 2002-03-07 2003-09-12 Advantest Corporation Electronic component testing apparatus
JP2004257980A (en) * 2003-02-27 2004-09-16 Mire Kk Handler for semiconductor element test
US20050139525A1 (en) * 2003-11-28 2005-06-30 Tung-Hung Tsai Chip sorting apparatus and method for fabricating the same
JP4262099B2 (en) * 2004-01-07 2009-05-13 ユニテクノ株式会社 Inspection jig for semiconductor integrated circuits
US20060000521A1 (en) * 2004-06-30 2006-01-05 Edward Komori Board fencing system
CN101180548A (en) * 2005-04-07 2008-05-14 株式会社爱德万测试 Pick-and-place mechanism of electronic device, electronic device handling apparatus and suction method of electronic device
CN101395981B (en) * 2006-03-07 2011-01-26 松下电器产业株式会社 Component mounting condition determination method
CN101334424B (en) * 2007-06-25 2011-05-25 鸿劲科技股份有限公司 Pressure welding device possessing multiple pressing head
KR101015553B1 (en) * 2008-10-22 2011-02-17 세크론 주식회사 Apparatus for contacting semiconductor device to test socket
JP6043993B2 (en) * 2011-10-31 2016-12-14 Jukiオートメーションシステムズ株式会社 Component mounting apparatus, information processing apparatus, information processing method, and board manufacturing method
KR101324684B1 (en) * 2012-04-23 2013-11-04 권현철 Apparatus for inspecting pcb and chip using compressed air
KR101437092B1 (en) 2013-09-30 2014-09-03 주식회사 엔티에스 Semiconductor chip testing device
CN103708713A (en) * 2013-12-26 2014-04-09 深圳市华星光电技术有限公司 Clamping mechanism, liquid crystal panel cutting machine and liquid crystal panel cutting process
CN105984723B (en) * 2014-11-27 2018-01-16 鸿劲科技股份有限公司 The vapour-pressure type inspection mechanism of electronic component apparatus for work, method and its application equipment
CN104528381B (en) * 2014-12-11 2016-09-14 杭州德创电子有限公司 The transfer integrating device of single-phase electric energy meter and reuse carton
CN105382847B (en) * 2015-12-25 2017-04-26 南京工业职业技术学院 Intelligent vacuum suction cup device
EP3254998B1 (en) * 2016-06-10 2021-11-24 Piab Ab Controlling a vacuum system comprising a vacuum generator
JP7143246B2 (en) * 2019-05-23 2022-09-28 株式会社アドバンテスト Electronic component handling equipment and electronic component testing equipment
KR20230039429A (en) * 2021-09-14 2023-03-21 (주)테크윙 Picker hand module
CN117104881B (en) * 2023-10-25 2024-01-23 江苏汉印机电科技股份有限公司 Chip module encapsulation spouts seal with material loading manipulator

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3079700B2 (en) * 1991-10-15 2000-08-21 日本電気株式会社 IC handling equipment
US5865319A (en) * 1994-12-28 1999-02-02 Advantest Corp. Automatic test handler system for IC tester
JP3138201B2 (en) * 1995-12-22 2001-02-26 株式会社しなのエレクトロニクス IC test handler
US6024392A (en) * 1996-01-23 2000-02-15 Isi Norgren, Inc. Vacuum cup actuator
JPH10118969A (en) * 1996-10-16 1998-05-12 Advantest Corp Conveying object adsorptive device
US5795001A (en) * 1996-12-18 1998-08-18 Burke; Stephen H. Vacuum device for handling articles
JPH10227834A (en) 1997-02-17 1998-08-25 Ando Electric Co Ltd Contact mechanism of ic to ic socket
KR20190000910U (en) * 2019-04-04 2019-04-16 주식회사 알씨엔이 parallel link type robot

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103977964A (en) * 2013-02-07 2014-08-13 泰克元有限公司 Pressure applying device for testing sorting machine
TWI582442B (en) * 2014-09-30 2017-05-11 Seiko Epson Corp Electronic parts conveyor and electronic parts inspection device

Also Published As

Publication number Publication date
KR20000006117A (en) 2000-01-25
KR100711613B1 (en) 2007-04-26
JP4090117B2 (en) 2008-05-28
US6384360B1 (en) 2002-05-07
JP2000002748A (en) 2000-01-07

Similar Documents

Publication Publication Date Title
TW444126B (en) IC sucking device, and IC porting device and IC testing device using the sucking device
KR100983226B1 (en) Jig device for carrying and testing integrated circuit chips
JP3007211B2 (en) Electronic component contact assembly and connection method thereof
JPWO2007077807A1 (en) Detachable device, test head, and electronic component testing device
US20120288183A1 (en) Electronic part recognition apparatus and chip mounter having the same
CN109548396B (en) Mass transfer system and method for micro light-emitting diode chip
JP2020025064A5 (en)
TW201602602A (en) Contactor arrangement, IC test handler and IC test arrangement
CN112067969A (en) Electronic component handling apparatus and electronic component testing apparatus
TWI712807B (en) Electronic component conveying device and electronic component inspection device
CN111323739A (en) Sensor testing system
CN111323067A (en) Sensor testing device
KR20180097937A (en) Semiconductor package test drawer socket
JP2002174658A (en) Handler, and testing device for electronic component
TW510006B (en) Contactor apparatus for semiconductor device and testing method of semiconductor device
CN104813172B (en) Interface for the system of testing
KR100880172B1 (en) Flying type resin dispensing method and apparatus
KR101193758B1 (en) Plunger for holding and moving electrical components
CN109633486A (en) Test device and sorter
JPH11214893A (en) Suction transferring device for electronic component
US7541824B2 (en) Forced air cooling of components on a probecard
JP2009150746A (en) Probe card, semiconductor integrated circuit testing device, and semiconductor integrated circuit test method
TW201839402A (en) Electronic component operation device and testing categorizing equipment using the same including a carrier mechanism and a test carrier
US6864678B2 (en) Nestless plunge mechanism for semiconductor testing
KR102630695B1 (en) Carrier for testing and electronic component testing equipment

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees