KR20190106616A - Handler for electronic component test - Google Patents

Abstract

The present invention relates to a handler for testing an electronic component. According to the present invention, the handler for testing an electronic component includes a presser for pressurizing the electronic component and a contact plate disposed between the electronic component and the pusher constituting the presser. A temperature cap is provided on a contact cap of the contact plate, and the temperature of the electronic component is controlled by controlling a temperature adjustment unit in accordance with the temperature information obtained by a temperature measurement device. According to the present invention, the temperature of the electronic components can be accurately measured while ensuring the stability of the temperature measurement device, and the reliability of the test and equipment can be improved by detecting bad contact or the like between the pusher and the contact cap to prevent a bad test.

Description

Handler for testing electronic components {HANDLER FOR ELECTRONIC COMPONENT TEST}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a handler used for testing an electronic component produced, and more particularly, to a pressurizing unit for pressurizing the electronic component and a temperature control of the electronic component.

The handler supports the manufactured electronic components to be tested by the tester and classifies the electronic components according to the test results.

The handler is disclosed through a number of patent documents, such as Korean Patent Publication No. 10-2002-0053406 (hereinafter referred to as 'Prior Art 1') or Japanese Patent Application Publication No. 2011-247908 (hereinafter referred to as 'Prior Art 2'). It is.

1 is a schematic diagram of a conventional handler TH.

The conventional handler TH includes a supply part SP, a press part PP and a recovery part WP.

The supply unit SP supplies the electronic component loaded in the customer tray to the pressurizing unit PP.

The pressing unit PP presses the electronic component supplied by the supply unit SP toward the socket board SB connected to the main body of the tester to electrically connect the electronic components to the tester. Here, the socket board SB is provided with a plurality of test sockets TS electrically connected to the electronic components.

The recovery unit WP collects the tested electronic components from the press unit PP and sorts them according to the test results and loads them in the empty customer tray.

The supply part SP, the pressurizing part PP, and the recovery part WP as described above may have various forms and configurations according to the purpose of use of the handler TH.

The present invention relates to the pressure portion PP and the temperature control function of the above configurations.

The pressurizing part PP is a pressurizer 210 ', as shown in the schematic diagram of FIG. 2, referred to as an' index head 'in the prior art 1, and referred to as a' compression device 'in the prior art 2, a vertical mover 220', and A horizontal mover 230 '.

The pressurizer 210 'has pushers 212' for pressurizing the individual electronic components into corresponding test sockets (TS, referred to as "inspection sockets" in prior art 2).

The pusher 212 ′ presses the electronic component D on the lower surface of the pressing portion PR, as shown in FIG. 3. In addition, the pusher 212 ′ sucks and grasps the electronic component D by the vacuum pressure to the lower surface of the pressing portion PR. To this end, the pusher 212 ′ is formed with a vacuum furnace VW through which a vacuum pressure can be applied. The pusher 212 ′ has a temperature sensor 212 ′ c for sensing the temperature of the pusher 212 ′ itself. The temperature of the electronic component pressurized by the pusher 112 'may be indirectly sensed through the temperature sensor 212'c.

The pressurizer 210 ′ lowers while holding the electronic component to electrically connect the electronic component to the test socket TS in the socket board SB. To this end, the pressurizer 210 ′ is configured to be able to move horizontally and vertically forward and backward.

The vertical mover 220 'advances or retracts the pressurizer 210' toward the socket board SB by elevating the pressurizer 210 '. The operation of the vertical mover 220 'is performed when the electronic component D is held or released by the pressurizer 210' from the electronic component moving shuttle (referred to as a slide table in the related art 2). This is done when the component D is electrically connected to or disconnected from the test socket TS.

The horizontal mover 230 ′ horizontally moves the pressurizer 210 ′ in the front-rear direction. Here, the horizontal movement of the pressurizer 210 'is made when the upper point of the shuttle and the upper point of the socket board (SB).

On the other hand, the electronic component generates self heating during the test. In particular, electronic components that require computation such as CPUs generate a lot of heat. And self-heating increases the temperature of the electronics, which prevents them from being tested at the right temperature for the test conditions.

Republic of Korea Patent No. 10-0706216 (hereinafter referred to as "prior art 3") is provided with a heat sink to control the temperature of the electronic component. However, according to the related art 3, the structure of the pusher is complicated, so the productivity is not good, and the durability is poor.

Republic of Korea Patent Publication No. 10-2008-0086320 (hereinafter referred to as "prior art 4") forms an air through hole in the pusher to control the temperature of the electronic component, and supplies the air for adjusting the temperature from the duct to the air through hole. However, the related art 4 is difficult to apply in the case of the pusher 212 'to which the structure in which the electronic component is held by the vacuum pressure is applied. This is because the pusher must have both opposing vacuum adsorption functions and opposing functions such as the injection of temperature control air.

In addition, the above methods reduce the reliability of the test because the temperature control of the electronic components is controlled by the operation of the temperature control function.

Thus, the applicant of the present invention can immediately respond to the temperature change of the electronic component by adjusting the temperature of the pusher through the cooling pocket or heater through the Republic of Korea Patent Publication No. 10-2016-0064964 (hereinafter referred to as 'prior art 1') I have proposed a technique.

In addition, Korean Patent Laid-Open Publication No. 10-2017-0116875 (hereinafter referred to as "prior art 2"), which has further developed the prior art 1, has further proposed a technique for forming a fluid passage through which a cooling fluid passes through the pusher. According to this prior art 2, a contact plate is provided between the pusher and the electronic component. The contact plate has contact caps corresponding to the pusher one-to-one. Due to this configuration, in the prior art 2, the pusher is in contact with the contact cap, and the contact cap is in contact with the electronic component. That is, in the prior art 2, the pusher and the electronic component are indirectly contacted.

The prior art 1 and the prior art 2 are both provided with a temperature sensor for measuring the temperature of the electronic component in the pusher, the temperature sensor is provided to the side that the pusher and the electronic component contact. Thus, according to the prior art 1, the temperature sensor may be in direct contact with the electronic component, but according to the prior art 2, the temperature sensor may not be in direct contact with the electronic component.

That is, in the case of the prior art 2 has a structure that the temperature sensor to measure the temperature of the electronic component with the contact cap between the following problems.

First, since the temperature sensor and the electronic component are separated by the thickness of the contact cap, a delay and a deviation occur between the temperature of the semiconductor device and the temperature measured by the temperature sensor. And such delays and deviations are greater with thicker contact caps.

Second, if the surface of the contact cap in contact with the pusher is uneven or inclined due to poor production or mechanical installation, the accuracy of the temperature measured by the temperature sensor is very low.

On the other hand, since the temperature sensor is in direct contact with the electronic component in the prior art during the pressurization operation, and the temperature sensor is in direct contact with the contact cap in the prior art 2, both of them have a risk of damage to the temperature sensor, which leads to failure of temperature control. This can reduce the reliability of the test and the equipment.

The object of the present invention is as follows.

First, it provides a technology that can measure the temperature more accurately while ensuring the stability of the temperature measuring device for measuring the temperature of the electronic component.

Second, it provides a technology that can identify the bad contact between the pusher and the contact cap.

Third, the present invention provides a technique for shortening the test time by appropriately maintaining the temperature of the pusher between the test of the previous electronic component and the test of the next electronic component.

An electronic component test handler according to the present invention as described above includes a supply unit for supplying an electronic component; A pressing unit for pressing the electronic component to electrically connect the electronic component supplied by the supply unit to the test socket of the tester; A temperature control unit for controlling a temperature of an electronic component electrically connected to the test socket by the pressing unit; A recovery unit for recovering the electronic component that has been tested by the tester; And a controller for controlling each of the above components. It includes, The pressing unit, Pressurizer for pressing the electronic component to the test socket side; And a contact plate interposed between the pressurizer and the electronic component and having a plurality of contact caps for directly contacting the electronic component to press the electronic component. The pressurizer includes a one-to-one correspondence with the contact cap, and a plurality of pushers to push the contact cap during the pressing operation to press the electronic component while the contact cap contacts the electronic component. An installation plate on which the plurality of pushers are installed; And a mover for allowing the pusher to press or release the contact cap by advancing or retracting the mounting plate toward the test socket. The contact plate further comprises a plurality of temperature measuring devices are provided for each of the plurality of contact caps to measure the temperature of the electronic component, and the control unit by the temperature information of the electronic component measured by the temperature measuring device The temperature controller controls the temperature of the electronic component under test.

When the electronic component is pressed by the pressurizer, the temperature measuring device is provided to be spaced apart from both the pusher and the electronic component.

The temperature measuring instrument is provided to be buried in the contact cap.

The pressurizer further includes a temperature sensor for sensing a temperature of the pusher, and the control unit compares the temperature information detected by the temperature measuring instrument with the temperature information detected by the temperature sensor and sets a reference value for which both temperature information is set. In case of deviation, it alerts the occurrence of a defect.

The temperature control unit, a cooling fluid supply for supplying a cooling fluid to the pressurizer; And a heater installed at the pusher to heat the pusher. It includes.

The pressurizer further includes a temperature sensor for sensing the temperature of the pusher, and the control unit stores the temperature of the pusher when the test of the previous electronic component, and after the test of the previous electronic component is finished, the next electronic component The temperature control unit controls the temperature of the pusher to maintain the temperature at the time of the test of the electronic component when the pressing operation is released for the test.

According to the present invention has the following effects.

First, since the temperature measuring device is installed in the contact cap, since the temperature sensing element is spaced apart from both the pusher and the electronic component, it is possible to measure the temperature of the electronic component relatively accurately while reducing the risk of breakage due to the contact shock, thereby making the test reliable. Is improved.

Second, the deviation between the temperature sensed by the temperature measuring instrument and the temperature measured by the temperature sensor can determine whether there is a faulty contact between the pusher and the contact cap or a failure of the temperature measuring instrument or the temperature sensor. Can improve the reliability of the equipment.

Third, even when the pressurization operation is released and the temperature measuring device is separated from the electronic component, the processing time is improved by reducing the test time because the temperature of the pusher is properly maintained by utilizing the temperature information at the time of the test of the electronic component.

1 to 3 are reference diagrams for explaining a conventional electronic component test handler.
4 is a plan view of an electronic component test handler according to an embodiment of the present invention.
5 is a conceptual perspective view of a pressing unit applied to the handler of FIG. 4.
6 is a schematic cross-sectional view of a pusher that can be applied to the pressing portion of FIG.
FIG. 7 is a side view of the pressurizer according to an example to which the pusher of FIG. 6 is applied.
8 is an exploded view of the main parts of the pressurizer of FIG.
9 and 10 are reference diagrams for explaining main features of the pressurizer of FIG. 8.
FIG. 11 is a reference view for explaining a state in which a contact cap is replaced with a change in size of an electronic component to be tested with FIG. 10.
12 is a schematic diagram of another type of pressurizer to which the present invention can be applied.

Hereinafter, a preferred embodiment according to the present invention as described above with reference to the accompanying drawings, for the sake of brevity of description overlapping description is omitted or compressed as possible.

As shown in FIG. 4, the handler for testing electronic components according to the present invention (TH, hereinafter abbreviated as “handler”) includes a pair of stacking plates 111 and 112, a first mover 120, and a pair of moving shuttles ( MS1 and MS2, the pressurizing part 200, the temperature control part 300, the 2nd mobile device 420, and the control part 500 are included.

Electronic components may be mounted on the mounting plates 111 and 112. The mounting plates 111 and 112 have a heater to heat the loaded electronic components to a temperature required for a test. Of course, the heater is stopped during the room temperature test.

The first mobile unit 120 moves the electronic parts of the customer tray CT ₁ to the stacking plates 111 and 112, or moves the electronic parts of the stacking plates 111 and 112 to the current leftward direction. MS2). To this end, the first mover 120 is provided to be movable in the left and right directions and the front and rear directions (see arrows a and b).

Electronic components may be loaded in the movement shuttles MS1 and MS2 and provided to be movable in the left and right directions (see arrows c ₁ and c ₂ ) past the test position TP.

The pressurizing unit 200 electrically connects the electronic components loaded in the mobile shuttle MS1 / MS2 at the test position TP to the test sockets TS in the socket board SB below. To this end, the pressurizing unit 200 includes a pressurizer 210, a vertical mover 220, and a horizontal mover 230 as referred to in the solid line portion shown in FIG. 5.

The pressurizer 210 pressurizes the electronic component so that the electronic component can be electrically connected to the tester. An example of such a pressurizer 210 will be described later with different contents.

Vertical mover 220 lifts the pressurizer 210 (see arrow d). Accordingly, the pressurizer 220 may move forward or backward toward the test socket TS and move forward or backward toward the mobile shuttles MS1 and MS2.

The horizontal mover 230 moves the pressurizer 210 in the front-rear direction (see arrow e). Therefore, the pressurizer 210 may be electrically connected to the test socket TS after holding the electronic component alternately in the moving shuttle of the MS1 and the MS2 of the MS2.

For reference, a test chamber may be provided in an area defined as the test position TP. When the test chamber is provided, the pressurizing unit 200 or at least the pressurizer 210 is positioned inside the test chamber. Of course, the interior of the test chamber is adjusted to the temperature required to test the electronic components.

The temperature controller 300 is a heater installed in the cooling fluid supply 310, the flow control valve 320 and the pusher 212 (see Fig. 6) of the pressurizer 210 as described in the dotted line of FIG. (330, see FIG. 6).

The cooling fluid supplier 310 supplies the cooling fluid to the pressurizer 210 to lower the temperature of the electronic component. The cooling fluid supplier 310 includes a pump 311 for pumping the cooling fluid by a predetermined amount and a cooling module 312 for cooling the cooling fluid to a predetermined temperature.

The flow control valve 320 controls the supply amount of the cooling fluid supplied by the cooling fluid supplier 310.

The heaters 330 (see FIG. 6) are installed in the pushers 212 to heat the pushers 212. Of course, the heater 330 is ultimately provided for heating the electronic component through the pusher 212.

The pump 311, the cooling module 312 and the flow control valve 320 and the heater 330 of the temperature control unit 300 as described above are controlled by the control unit 500. Therefore, the temperature, supply flow rate and supply flow rate of the cooling fluid supplied can be adjusted according to the test temperature conditions of the electronic component. Thus, when the cooling fluid supplier 310 determines the temperature, the supply flow rate, and the flow rate of the cooling fluid according to the test temperature conditions, the cooling fluid supplier 310 continuously supplies the cooling fluid adjusted to the determined temperature, the supply flow rate, and the supply flow rate.

The second mobile unit 420 moves the tested electronic components in the mobile shuttles MS1 and MS2 located on the right side to the customer tray CT ₂ while classifying the tested electronic components according to the test results. To this end, the second mover 420 may be moved in the left and right directions (see arrow f in FIG. 4) or in the front and rear directions (see arrow g in FIG. 4).

The control unit 500 controls each of the above configurations, and the characteristic control by the control unit 500 will be described later.

For reference, among the above components, the stacking plates 111 and 112 for supplying the electronic components of the customer tray CT ₁ to the pressing unit 200, and the supply unit SP for supplying the electronic components to the first mover 120 side. The second mobile unit 420 side for moving the electronic component tested by the tester to the customer tray CT ₂ may be defined as a recovery unit WP. Here, the pair of mobile shuttles MS1 and MS2 may function as the supply part SP or as the recovery part WP depending on the position.

<Example of presser>

The pressurizer 200 has a plurality of pushers 212 for pressing the electronic component.

First, the pusher 212 portion will be described with reference to FIG. 6.

The pusher 212 of FIG. 6 includes a pushing member 212a, a first temperature sensor 212c, and a second temperature sensor 212d.

The pushing member 212a has a 'T' shape in cross section and is divided into an upper coupling part 212a-1 and a lower contact part 212a-2.

Coupling portion 212a-1 is coupled to the mounting plate to be described later.

The contact portion 212a-2 is a narrower portion than the engaging portion 212a-1, and the lower end of the contact end CE is inserted into and contacted with a contact cap to be described later. The contact portion 212a-2 is provided with an installation groove for installing the heater 330.

In addition, the pushing member 212a is formed with a fluid passage FT through which the cooling fluid supplied and recovered by the cooling fluid supplier 310 passes.

The first temperature sensor 212c and the second temperature sensor 212d are provided to measure the temperature of the upper side and the lower side of the pushing member 212a, respectively. Here, the second temperature sensor 212d is preferably provided at the contact end CE side of the contact portion 212a-2 so as to be located close to the electronic component.

7 is an example of the pressurizer 210 to which the pusher 212 described above is actually applied, and FIG. 8 is an exploded view of main components of the pressurizer 210.

As shown in FIGS. 7 and 8, the pressurizer 210 includes a mounting plate 211, a pusher 212, an installation structure 213, a support spring 214, a fluid distributor 215, and a contact plate 216. do.

As shown in FIG. 9, the mounting plate 211 is provided with the pusher 212 through the mounting structure 213. The mounting plate 211 is provided with mounting holes IO for allowing the contact portion 212a-2 of the pusher 212 to pass therethrough and be installed to protrude forward.

Since the pusher 212 has been described above, the description thereof is omitted.

The mounting structure 213 is provided to install the pusher 212 to the mounting plate 211. The installation structure 213 includes a coupling plate 213a and a support 213b.

The coupling plate 213a is coupled to the mounting plate 211 and has a through hole TH through which the contact portion 212a-2 of the pusher 212 can pass. The coupling plate 213a is formed with alignment holes AH into which the guide pins 212f-1 of the guide member 212f provided in the pusher 212 are inserted in FIG. 6. Accordingly, the top of the pusher 212 in the drawing can be aligned by the alignment holes (AH).

The support 213b is installed on the coupling plate 213a at a predetermined interval and supports the upper end of the support spring 214 so that the support spring 214 elastically supports the pusher 212.

The support spring 214 elastically supports the upper end of the pusher 212 so that the pusher 212 can be retracted by a predetermined distance.

The fluid distributor 215 is provided to supply the cooling fluid to the fluid passage FT of the pushers 212 installed by the installation structure 213.

The contact plate 216 is interposed between the pusher 212 and the electronic component D, and has a plurality of contact caps 216a and a temperature measuring instrument 216b.

The contact cap 216a is opened upward and is made of a metal material such as copper having excellent thermal conductivity so that cold air or heat of the pushing member 212a can be quickly conducted to the electronic component.

The temperature measuring instrument 216b is provided to detect the temperature of the electronic component. That is, in the present embodiment, the second temperature sensor 212d and the temperature measuring instrument 216b are provided to sense the temperature of the electronic component. In this embodiment, a temperature measuring instrument 216b is installed in the contact cap 216a to detect the temperature of the electronic component separately from the presence of the second temperature sensor 212d, which is necessary to detect the temperature of the electronic component more accurately. This is to determine whether or not bad operation.

 Application of the contact plate 216 as described above is provided for the convenience of parts replacement and the efficient use of resources. In general, when the size of the electronic component to be tested is different, all the pushers 212 must be replaced. At this time, the pusher 212 is very cumbersome and time-consuming due to the connection relationship with the cooling fluid, and also takes waste of resources when considering the size of the cooling medium or other parts to be replaced. However, when the contact plate 216 is applied as in the present embodiment, the contact cap 216a may be simply replaced after removing the contact plate 216 only, or the contact plate 216 prepared in advance may be replaced. The work is very easy and the waste of resources can be prevented.

Of course, the number of contact caps 216a installed on the contact plate 216 is the same as the number of the pushers 212. That is, if the handler for testing eight electronic components at a time, eight pushers 212 and eight contact caps 216a should be provided, and the pushers 212 and contact caps 216a correspond one-to-one.

On the other hand, when the temperature of the electronic component is detected only by the second temperature sensor 212d as in the prior art 2, even if the thermal conductivity of the contact cap 216a is excellent, a time delay for temperature sensing occurs. Due to the non-uniformity of heat conduction according to the degree of contact between the pusher 212 and the contact cap 216a, a failure may ultimately occur in temperature control. However, when the temperature of the electronic component is measured by the temperature measuring instrument 216b installed in the contact cap 216a as in this embodiment, the time delay for measuring the temperature of the electronic component is minimized and the pusher 212 and the contact cap 216a are ) The degree of contact does not need to be considered.

The determination of whether the malfunction is performed is performed by using the temperature difference between the second temperature sensor 212c or the second temperature sensor 212d and the temperature measuring instrument 217, which will be described later in the related section.

FIG. 10 shows the relationship between the pusher 212 and the contact cap 216a in a state where the electronic component is electrically connected to the tester by the pressurizer 210.

As shown in FIG. 10, the pusher 212 pushes the contact cap 216a with the lower end portion of the contact portion 212a-2 covered with the contact cap 216a so that the contact cap 216a presses the electronic component D. Do it. At this time, the contact end CE of the contact portion 212a-2 is in surface contact with the contact end 216a-1 of the contact cap 216a, thereby facilitating rapid conduction of hot or cold air and proper transfer of pressing force. The contact end 216a-1 of the contact cap 216a is a lower end of the contact cap 216a in surface contact with the electronic component. On the other hand, the temperature measuring instrument 216b is provided to be buried in the contact end 216a-1 of the contact cap 216a as shown. Therefore, the temperature measuring instrument 216b is also spaced apart from the pusher 212 and is also spaced apart from the electronic component D. However, since the temperature measuring instrument 216b is disposed closer to the electronic component than the second temperature sensor 212d, the temperature of the electronic component can be detected more quickly and accurately, and the temperature measuring instrument 216b during the pressurization operation of the electronic component. The risk of breakage is reduced because is out of direct impact. Preferably, it may be considered that the distance between the temperature measuring instrument 216b and the electronic component D is within 2 mm when the pusher 212 presses the electronic component D for accurate and rapid temperature sensing. .

In addition, since the contact cap 216a or at least the contact end 216a-1 is made of a metal material such as copper having high thermal conductivity, accuracy of almost directly detecting the temperature of the electronic component can be ensured.

For reference, FIG. 11 illustrates a state in which the contact cap 216a is replaced when the size of the electronic component to be tested is reduced. Thus, when applying the contact plate 216 as in this embodiment, the compatibility of the handler TH for testing electronic components of various standards is improved.

According to the handler TH according to the present invention, the temperature measuring device 216b and the first temperature sensor 212c or the second temperature sensor 212d may be utilized while being controlled by the controller 500 in various ways. Examine.

1. Bad alarm

When the electronic component is tested, the controller 500 appropriately controls the temperature control unit 300 through the temperature information sensed by the temperature measuring instrument 216b so that the electronic component can be tested under the required test temperature conditions.

The controller 500 compares the temperature information detected by the temperature measuring instrument 216b with the temperature information detected by the first temperature sensor 212c or the second temperature sensor 212d. And when the temperature difference according to the comparison is out of the set reference value (for example, 30 degrees difference), the control unit 500, the pusher 212 and the contact cap 216a is not in normal contact, or the first temperature sensor 212c It can be seen that the second temperature sensor 212d or the temperature measuring instrument 217 is broken, and in this case, a failure is alerted to the manager. That is, according to the present invention, since the temperature of the electronic component D is sensed through the temperature measuring instrument 216b, the first temperature sensor 212c or the second temperature sensor 212d is not an essential configuration, and all of them may be omitted. . However, the first temperature sensor can be identified by comparing the temperature information detected by the temperature measuring device 216b with the temperature information detected by the first temperature sensor 212c or the second temperature sensor 212d. The provision of 212c or the second temperature sensor 212d should be considered very advantageously. Similarly, only one of the first temperature sensor 212c or the second temperature sensor 212d may be provided. In addition, the second temperature sensor 212d may also be provided on the side of the pushing member 212a to prevent direct contact with the contact cap 216a.

2. Optional ON and OFF

When the electronic component D is tested, accurate temperature measurement of the electronic component D is required, so the temperature measuring instrument 216b should be turned on. At this time, since the temperature information for the pusher 212 coming from the first temperature sensor 212c or the second temperature sensor 212d may not be necessary, the first temperature sensor 212c and the second temperature sensor may not be necessary. 212d causes the state to be OFF.

On the other hand, since the temperature information by the temperature measuring instrument 216b is not required during the empty time between the electronic component D previously tested and the test of the electronic component D to be tested next, the temperature measuring instrument 216b is turned off. Need to be. However, since the temperature of the pusher 212 should not be overcooled or overheated for the next test, the first temperature sensor 212c or the second temperature sensor 212d is turned on, and then the first temperature sensor ( 212c) or the temperature of the pusher 212 is adjusted based on the temperature information by the second temperature sensor 212d.

3. Maintain proper temperature of pusher

As described above, the temperature information by the temperature measuring instrument 216b is not required during the blanking time between the previously tested electronic component D and the test of the electronic component D to be tested next. However, maintaining the proper temperature of the pusher 212 is necessary for maintaining the proper temperature of the electronic component D to be tested next. Therefore, the test temperature of the pusher 212 is detected and stored by the first temperature sensor 212c and the second temperature sensor 212d when the electronic component D is tested, and the test of the electronic component D is performed. When the pressurization operation by the pressurizer 210 is released for the test of the next electronic component D after completion, the temperature of the pusher 212 is to maintain the temperature at the test of the electronic component D before. There is a need. In this case, the controller 500 detects the temperature of the pusher 212 by turning on the first temperature sensor 212c and the second temperature sensor 212d even when the electronic component D is tested. And store the temperature control unit 300 to properly maintain the temperature of the pusher 212 during the test blanking time based on the stored temperature information and the temperature information from the first temperature sensor 212c and the second temperature sensor 212d. ) Needs to be controlled.

The assembly of the mounting plate 211 and the pusher 212 of the pressurizer 210 described above with reference to FIG. 7 is applied to a handler manufactured for the processing of electronic parts mass-produced small parts such as, for example, a memory semiconductor. Suitable form. However, the present invention may also be appropriately implemented in an assembly of the type shown in FIG. 12 suitable for being applied to a handler manufactured for processing an electronic component that is produced in a small quantity of multi-products such as a non-memory semiconductor.

For reference, the assembly in FIG. 12 also has a mounting plate 1211 and a pusher 1212 that are nearly similar to the previous embodiment. Even when such an assembly is applied, a contact plate having a contact cap is provided, and of course, a temperature meter is installed in the contact cap. As such, the present invention can be preferably applied to all kinds of handlers for controlling the temperature of electronic components using pushers.

Therefore, although the detailed description of the present invention has been made by the embodiments with reference to the accompanying drawings, it is understood that the present invention is limited only to the above embodiments, since the above embodiments have only been described with reference to preferred examples of the present invention. It should not be understood that the scope of the invention should be understood by the claims and equivalent concepts described below.

TH: Handler for Testing Electronic Components
SP: Supply part
200: pressurization part
210: pressurizer
212 pusher
212a: pushing member 212c: first temperature sensor
212d: second temperature sensor FT: fluid passage
216: contact plate
216a: Contact cap 216b: Temperature measuring instrument
220: vertical mover
300: temperature control unit
WP: Recovery Department
500: control unit

Claims (6)

A supply unit for supplying electronic components;
A pressing unit for pressing the electronic component to electrically connect the electronic component supplied by the supply unit to the test socket of the tester;
A temperature control unit for controlling a temperature of an electronic component electrically connected to the test socket by the pressing unit;
A recovery unit for recovering the electronic component that has been tested by the tester; And
A control unit controlling each of the above components; Including,
The pressing unit,
A pressurizer for pressurizing the electronic component to the test socket side; And
A contact plate interposed between the pressurizer and the electronic component and having a plurality of contact caps for directly contacting the electronic component to pressurize the electronic component; Including;
The pressurizer,
A plurality of pushers which correspond one-to-one with the contact cap and push the contact cap during the pressing operation to press the electronic component while the contact cap contacts the electronic component;
An installation plate on which the plurality of pushers are installed; And
A mover for causing the pusher to press or release the contact cap by advancing or retracting the mounting plate toward the test socket; Including,
The contact plate further includes a plurality of temperature measuring instruments provided for each of the plurality of contact caps to measure the temperature of the electronic component.
The control unit adjusts the temperature of the electronic component to be tested by controlling the temperature control unit by the temperature information of the electronic component measured by the temperature measuring instrument.
Handler for testing electronic components. According to claim 1,
When the electronic component is pressed by the pressurizer, the temperature measuring device is provided to be spaced apart from both the pusher and the electronic component.
Handler for testing electronic components. The method of claim 2,
The temperature measuring device is provided buried in the contact cap
Handler for testing electronic components. According to claim 1,
The pressurizer further comprises a temperature sensor for sensing the temperature of the pusher,
The controller compares the temperature information detected by the temperature measuring instrument with the temperature information detected by the temperature sensor to alert the occurrence of a failure when both temperature information deviates from the set reference value. According to claim 1,
The temperature control unit,
A cooling fluid supplier for supplying a cooling fluid to the pressurizer; And
A heater installed at the pusher to heat the pusher; Containing
Handler for testing electronic components. According to claim 1,
The pressurizer further comprises a temperature sensor for sensing the temperature of the pusher,
The control unit stores the temperature of the pusher when the previous electronic component is tested, and when the pressing operation is released for the test of the next electronic component after the test of the previous electronic component is finished, the temperature of the pusher is earlier. To control the temperature control unit to maintain a temperature at the time of testing the component.
Handler for testing electronic components.

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