KR101847607B1 - Inserting and ejecting apparatus for semiconductor modules - Google Patents

Abstract

An insert and eject apparatus of a semiconductor module has an advantage of improving work efficiency and relieving fatigue of a worker by simultaneously mounting a plurality of semiconductor modules on a plurality of sockets or separating the plurality of semiconductor modules from the plurality of sockets, wherein the plurality of semiconductor modules are to be individually positioned on the plurality of sockets of a test board having the plurality of sockets aligned in a plurality of rows and columns and a plurality of levers each positioned on both sides of the socket.

Description

Technical Field [0001] The present invention relates to an inserting and ejecting apparatus for semiconductor modules,

The present invention relates to an insert and an ejection apparatus for a semiconductor module, and more particularly, to an insert and an ejection apparatus for a semiconductor module which simultaneously mount or separate a plurality of semiconductor modules located in a slot of a test board through a single operation, .

Generally, a semiconductor module (a semiconductor device) that has undergone a predetermined semiconductor manufacturing process is tested through a semiconductor test equipment to see whether its performance is exhibited properly. One example of the semiconductor test equipment is a monitoring burn-in test equipment. The conventional monitoring burn-in test equipment is a kind of reliability test for finding the initial failure module before supplying the semiconductor module to the customer or before mounting the semiconductor module to the customer. The semiconductor chip separated from the wafer is assembled and packaged It is common.

The monitoring burn-in test equipment is roughly described as putting the semiconductor module in a specific environmental stress condition and removing a module that is defective or defective or is likely to become defective immediately. To this end, thermal stress is applied to the semiconductor module at a temperature as high as about 80 to 125 ° C in the monitoring burn-in test equipment. During the burn-in test, the semiconductor module operates in a state in which a high temperature and a high electric field are applied, do.

Therefore, the initial failure modules having a short life span fail to withstand the severe conditions during the burn-in test and cause defects. Semiconductor modules of this type that have passed the burn-in test can guarantee long-term service life, which can improve system reliability.

In order to inspect the semiconductor module for defects by using the semiconductor test equipment including the monitoring burn-in test equipment as described above, a semiconductor module (not shown) is inserted into a slot of a test board Are inspected for defects in the manner as described above.

Conventionally, the operation of attaching or detaching the semiconductor module to or from the slot of the test board has been performed manually by the operator. That is, in order to mount the semiconductor module in the slot of the test board, the operator presses the semiconductor module in the downward direction while the semiconductor module is positioned in the slot. Then, the semiconductor module is fully inserted into the slot, and a lever located on both sides of the slot is mounted by clamping both sides of the semiconductor module. In order to separate the semiconductor module from the slot of the test board, the operator presses the lever located on both sides of the slot from the upper side to the lower side. Then, the lever is separated from both sides of the semiconductor module, and the semiconductor module completely inserted into the slot is separated. In this state, the operator picks up the semiconductor module of the slot and draws it out of the test board.

Conventionally, in mounting or removing the semiconductor module in the slot of the test board, not only the workability is lowered by manual operation of the operator, but also the worker's fingers There was a problem of weighting.

Korean Registered Patent No. 10-1599459 (Registered on Feb. 25, 2016)

SUMMARY OF THE INVENTION Accordingly, the present invention has been made in order to solve the problems of the prior art as described above, and it is an object of the present invention to provide a semiconductor device having a plurality of semiconductor modules located in slots of a test board, And an object of the present invention is to provide an insert and an ejecting apparatus of a semiconductor module that can alleviate the fatigue of an operator while improving the efficiency.

According to an aspect of the present invention, there is provided an insert and an ejecting apparatus for a semiconductor module, the socket including a plurality of sockets aligned in a plurality of rows and rows, and a plurality of levers located on both sides of the socket, The semiconductor module is inserted into and fixed to the socket by simultaneously pressing the upper ends of the plurality of semiconductor modules so that both sides of the semiconductor module are respectively inserted into the socket, An ejection unit for simultaneously clamping the upper ends of the plurality of levers to release clamping of the semiconductor module due to the levers and to be separated from the socket; At the same time, A sliding unit for mounting or removing the semiconductor module to or from the socket by moving the insert unit and the eject unit in a vertical direction while moving on a ride, and a control unit for controlling the units.

The present invention is advantageous in that a plurality of semiconductor modules located in slots of a test board are simultaneously mounted or separated in corresponding slots through a single operation to reduce worker fatigue while improving workability.

1 and 2 are perspective views illustrating a configuration of an insert and an ejecting apparatus of a semiconductor module according to an embodiment of the present invention in a state in which a test board equipped with a plurality of semiconductor modules is installed,
FIGS. 3 and 4 are detailed views of the base frame shown in FIG. 1 with different angles,
Fig. 5 is a detailed view of the TB guide rail unit shown in Fig. 1,
FIG. 6 is a detailed view of a test board on which a semiconductor module mounted on the TB guide rail unit shown in FIG. 5 is mounted,
7 is a detailed view of the body frame unit shown in FIG. 1,
8 is an exploded perspective view showing a coupling relationship between the slide unit, the slide body unit, the insert unit, and the eject unit provided in the body frame unit shown in Fig. 7,
Fig. 9 is a detailed view of the slide unit shown in Fig. 8,
10 is a front view of the slide member shown in Fig. 9,
FIG. 11 is a detailed view of the slide body unit shown in FIG. 8,
Fig. 12 is a detailed view of the insert unit shown in Fig. 8,
13 is a detailed view of the eject unit shown in Fig. 8,
Fig. 14 is a detailed view of the LED bar unit shown in Fig. 1,
Fig. 15 is a detailed view of the erroneous insertion detecting unit shown in Fig. 1,
16 is a schematic view showing the mounting and dismounting state of the semiconductor module according to the operation of the insert unit and the eject unit according to the positions of the respective rollers according to the movement of the slide member shown in Fig.

Best Mode for Carrying Out the Invention Hereinafter, preferred embodiments of an insert and an ejecting apparatus of a semiconductor module according to the present invention will be described in detail with reference to the accompanying drawings.

FIGS. 1 and 2 are perspective views illustrating the configuration of an insert and an ejecting apparatus of a semiconductor module according to an embodiment of the present invention, with a test board having a plurality of semiconductor modules mounted thereon, at different angles. As shown in FIGS. 1 and 2, the inserts and the ejectors of the semiconductor module according to the present embodiment are constructed so that the operation of mounting or dismounting each semiconductor module in the slots of the test board can be performed simultaneously using the power of the machine And the detailed configuration will be described below with reference to the drawings.

FIGS. 3 and 4 are detailed views of the base frame shown in FIG. 1 with different angles. As shown in Figs. 1 to 4, the base frame 100 provides a space in which the respective components constituting the apparatus of this embodiment can be disposed, as well as a control unit, power supply and control signal transmission Various components are installed.

5 is a detailed view of the TB guide rail unit shown in Fig. The TB guide rail unit 200 shown in FIG. 5 is installed in the base frame 100 shown in FIG. 3 and serves to guide the test board shown in FIG. 1 to slide in the longitudinal direction of the base frame 100 do. Therefore, the TB guide rail unit 200 has guide rails or the like for smoothly sliding the test board.

6 is a detailed view of a test board on which a semiconductor module mounted on the TB guide rail unit shown in FIG. 5 is mounted. As shown in FIG. 6, the test board is configured to mount a plurality of semiconductor modules for inspecting defects before supplying them to the customer or before mounting them in the system. That is, the test board has a plurality of slots in which a plurality of semiconductor modules are mounted, and a plurality of levers that are respectively installed on both sides of the slots to clamp and fix both sides of the semiconductor module. Here, a plurality of slots are arranged in a plurality of rows and a plurality of rows.

The test board includes a bracket having rails sliding along the TB guide rail unit 200 shown in FIG. 5, and a semiconductor module mounted on the bracket and connected to the terminals of the plurality of slots, And has a substrate in which a program for memorizing whether or not defective is incorporated. A plurality of slots and levers as described above are provided on the surface of the substrate, and a handle used to slide the test board along the TB guide rail unit 200 is installed at the front of the substrate. A connection terminal to be connected to the control unit is formed.

7 is a detailed view of the body frame unit shown in Fig. The body frame unit 300 shown in FIG. 7 is installed in the base frame 100 shown in FIG. 3 and serves to support the components for mounting or removing the semiconductor module in the slots of the test board. Accordingly, the body frame unit 300 has a frame structure capable of withstanding the force applied to attach or detach the semiconductor module. In order to reduce the weight, a plurality of thin plate-shaped frames are arranged to prevent warpage. The body frame unit 300 is further configured to have a frame 310 to which an LED bar unit 800 and a false insertion detection unit 900 to be described later are coupled.

8 is an exploded perspective view showing a coupling relationship of the slide unit, the slide body unit, the insert unit, and the eject unit provided in the body frame unit shown in Fig. The slide unit 400, the slide body unit 500, the insert unit 600 and the eject unit 700 shown in FIG. 8 are sequentially or integrally connected to each other in the body frame unit 300 shown in FIG. do.

Fig. 9 is a detailed view of the slide unit shown in Fig. 8, and Fig. 10 is a front view of the slide member shown in Fig. 8 to 10, the slide unit 400 serves to provide the insert unit 600 and the eject unit 700 with power for mounting or removing the semiconductor module in the slot of the test board. The slide unit 400 includes a pair of cylinders 410 arranged in series to face each other to provide power, a block 420 connecting the rods of the pair of cylinders 410 to each other, A pair of cylinders 410 and a pair of cylinders 410. The pair of cylinders 410 are connected to each other by a pair of cylinders 410, And a slide member 440 of FIG. Accordingly, in the slide unit 400, the pair of slide members 440 slide in the left and right directions according to the operation of the pair of cylinders 410.

On the other hand, the slide member 440 is configured to have three rows of slide grooves 441, 442, and 443. That is, three slide grooves 441, 442, and 443 are provided in total for each column. Specifically, a first slide groove 441 is formed in the upper row in the horizontal direction, in which the rollers of the slide body unit 500 are respectively positioned. In the middle column, a certain horizontal section (including a stop section) is drawn in the left-to-right direction of the drawing, the upward section is tilted upward and then the horizontal section is again followed by the downward inclination. The second slide groove 442 of the cam structure is formed. On the other hand, when the insert unit 600, which will be described later, moves slightly in the downward direction during the horizontal section (neutral section) of the middle section and the horizontal section on the left side in the upward slope section of the second slide groove 442, So that the semiconductor module can be supported so as not to move. In the second slide groove 442, the rollers of the insert unit 600 are respectively positioned.

A third slide groove 443 of a cam structure having a horizontal section (including a stop section) is formed again after a certain horizontal section (stop section) is provided in the lower row from the left to the right in the drawing, do. In the third slide groove 443, rollers of the ejection unit 700 are respectively located. Here, the respective rollers are positioned to be movable in the left-right direction while rotating along the slide grooves 441, 442, and 443. Accordingly, when the pair of cylinders 410 is operated, the pair of slide members 440 slide in the left and right directions along the corresponding rollers positioned in the right position.

On the other hand, the second and third slide grooves 442 and 443 have the farthest distance from each other and the closest distance from the rightmost side from the leftmost side of the drawing. Also, the horizontal section of the third slide groove 443 is formed in the vicinity of the horizontal section (neutral section) of the central portion of the second slide groove 442. In other words, the second and third slide grooves 442 and 443 are formed such that the insert unit 600 and the ejection unit 700, which operate together with the rollers located there, are in the neutral position and the slide member 440 moves to one side The insert function is selected and the eject function is selectively made when moving to the other side. The specific working relationship will be described later.

On the other hand, the insert and the ejection apparatus of the semiconductor module of this embodiment are further configured to include three cylinder sensors and solenoid valves for controlling the stop position (including the neutral position) of the pair of cylinders 410, The stop position is configured to be controlled. That is, the operation of the pair of cylinders 410 is stopped when the respective rollers are positioned at the positions of the above-described stop section and neutral section.

11 is a detailed view of the slide body unit 500 shown in FIG. 7 to 11, the slide body unit 500 is disposed and fixed in such a manner as to closely contact the side wall of the upper frame of the body frame unit 300. [ The slide body unit 500 includes a pair of fixed frames 510 to which a pair of cylinders 410 constituting the slide unit 400 are fixed respectively and a pair of fixed frames 510 coupled to both sides of the pair of fixed frames 520. [ A first side frame 520 and a second side frame 520. The first side frame 520 is coupled to the first side frame 520 in an outwardly projecting manner and is rotatably coupled to the first side frame 520, And has a plurality of first rollers 530. At this time, the first rollers 530 are formed at the positions and positions corresponding to the first slide grooves 441, respectively.

A plurality of guide members 540 are inserted into the guide grooves of the insert unit 600 to be described later so that the insert unit 600 can be moved up and down without swaying from side to side. Respectively. The slide body unit 500 supports the slide unit 440 of the slide unit 400 to slide freely in the left and right directions while being fixed to the body frame unit 300, And is guided to move up and down.

12 is a detailed view of the insert unit shown in Fig. As shown in FIGS. 7 to 12, the insert unit 600 is for mounting a semiconductor module, which is located in a slot of a test board, from the upper side to the lower side in a slot, and has a frame structure capable of transmitting pressure. In other words, the insert unit 600 includes a pair of second side frames 610, a second side frame 610 and a second side frame 610. The insert unit 600 includes a pair of second side frames 610, A plurality of second rollers 620 located in the grooves 442, and a plurality of first pressing members 630 protruded downward to press the upper end of the semiconductor module. At this time, the second rollers 620 are formed at the positions and positions corresponding to the second slide grooves 442, respectively. Then, the first pressing member 630 is coupled to the frame with the spring 640 therebetween. Therefore, even if the insert unit 600 presses the semiconductor module beyond the predetermined pressing force, the damage of the semiconductor module can be prevented by the spring 640.

On the other hand, a plurality of first guide grooves 650, into which the guide members 540 of the slide body unit 500 are slidably inserted in the vertical direction, are formed on the upper portion of the second side frame 610, respectively. A plurality of second guide grooves (not shown) are formed in the lower portion of the second side frame 610 to allow the guide unit of the eject unit 700 to be described later to be inserted therein so that the eject unit 700 can be moved in the vertical direction 660 are formed. Accordingly, the insert unit 600 is interlocked with the slide member 440 of the slide unit 400 to press the semiconductor module from the upper direction to the lower direction, so that the semiconductor module is completely inserted into the slot, Thereby clamping both sides of the semiconductor module. The insert unit 600 is organically coupled to the slide body unit 500 and the ejection unit 700 to guide the insert unit 600 and the ejection unit 700 to move up and down.

13 is a detailed view of the eject unit shown in Fig. As shown in FIGS. 7 to 13, the eject unit 700 is for separating the semiconductor module mounted on the slot by pressing the lever located on both sides of the slot of the test board, and has a frame structure capable of transmitting pressure. The ejection unit 700 includes a pair of third side frames 710 and third side frames 710. The ejection unit 700 includes a pair of third side frames 710, A plurality of third rollers 720 located in the grooves 443 and a plurality of second pressing members 730 pressing the levers to be protruded from the bottom and clamping both sides of the semiconductor module. At this time, the third rollers 720 are formed at the positions and positions corresponding to the third slide grooves 443, respectively.

On the other hand, a plurality of second pressing members 730 are inserted into the plurality of second guide grooves 660 of the insert unit 600 so as to be slidable in the vertical direction, Guide bearings 740 are respectively formed. Accordingly, the ejecting unit 700 interlocks with the slide member 440 of the slide unit 400 to press the lever for clamping both sides of the semiconductor module, thereby releasing the clamping of the semiconductor module by the lever, Separate. The eject unit 700 is organically coupled to the slide body unit 500 and the eject unit 700 to guide the insert unit 600 and the eject unit 700 to move up and down.

Fig. 14 is a detailed view of the LED bar unit 800 shown in Fig. As shown in FIGS. 1 and 14, the LED bar unit 800 is fixed to one side of the frame 310 of the body frame unit 300, and according to the information value provided in the control unit connected to the test board, And serves to indicate whether defective or non-defective semiconductor modules are located in the slots. Thus, the LED bar unit 800 is configured to have LEDs as many as the number of semiconductor modules located in the slots of the test board. That is, the LED bar unit 800 includes a plurality of fixing blocks 810 fixed to one side of the frame 310 of the body frame unit 300, and a plurality of LEDs 810 fixed to the lower ends of the fixing blocks 810, A plurality of LED panels 830 each of which is coupled to one side of the LED support bar 820 and is equipped with LEDs indicating defective and good products of the semiconductor module at the corresponding positions, And a connecting bar 840 connecting the ends of the bars 820 to each other. Therefore, in order to check whether the semiconductor module is defective or not, the LED support bar 820 is rotated with respect to the fixing block 810 to place the LEDs on one side of the semiconductor module, (Red or green) of the semiconductor module to check whether the semiconductor module is defective or not.

Fig. 15 is a detailed view of the erroneous insertion detecting unit 900 shown in Fig. As shown in FIGS. 1 and 15, the erroneous insertion detecting unit 900 detects whether the semiconductor module located in the slot of the test board is erroneously inserted. For example, due to the operator's mistake, the semiconductor module can be positioned in the slot by varying the front and back of the semiconductor module. In this case, the height of the semiconductor module is higher than that of a normally positioned semiconductor module. The erroneous insertion detecting unit 900 of this embodiment senses whether or not the semiconductor module is erroneously inserted using the protruding height of the erroneously inserted semiconductor module. The erroneous insertion detecting unit 900 includes a rotation bar 910 rotatably coupled to one side of the frame 310 of the body frame unit 300 and a rotation bar 910 extending downward from the rotation bar 910, A sensor 930 installed on one side of the rotation bar 910 for detecting whether the rotation bar 910 is rotated and a plurality of touch bars 920 extending from the rotation bar 910 And a weight 940 for rotating and returning coupled to the lower portion of the other side. That is, in the erroneous insertion detecting unit 900 of this embodiment, in sliding the test board inward of the base frame 100 for the mounting operation of the semiconductor module, when the touch bar 920 is touched and the rotary bar 910 The sensor 930 senses the erroneous insertion of the semiconductor module.

Hereinafter, the operating relationship of the insert and the ejecting apparatus of the semiconductor module of this embodiment will be described as described above.

16 is a schematic view showing the mounting and dismounting state of the semiconductor module according to the operation of the insert unit and the eject unit according to the positions of the respective rollers according to the movement of the slide member shown in Fig. As shown in FIGS. 1 to 16, when inspecting the semiconductor module for defects using the semiconductor test equipment, the operator places the semiconductor modules in the slots of the test board. The test board in this state is pushed inward of the body frame unit 300 while being positioned on the upper part of the TB guide rail unit 200. At this time, when the semiconductor module is located in the socket in a direction opposite to the front and back of the plurality of semiconductor modules, the semiconductor module is detected by the erroneous insertion detecting unit 900 described above. If there is no abnormality, insert the test board to the position for work.

Then, a control button for mounting the semiconductor module is pressed to actuate the pair of cylinders 410 through the control unit. Then, the cylinder is operated to move the first, second, and third slide grooves 441, 442, and 443, which are located in the neutral section (neutral position) (second position in FIG. 16) 2 and the third rollers 530, 620 and 720 move to the right side of FIG. 16 and move to the rightmost position (position 1 in FIG. 16). That is, as the slide member 440 gradually moves to the left side of the drawing, the first and third rollers 530 and 720 move relatively horizontally along the first and third slide grooves 441 and 443, Therefore, no significant change in operation occurs. However, the second roller 620 moves along the second slide groove 442 at a relatively downward inclination angle. That is, the insert unit 600 gradually moves downward and presses the upper end of the semiconductor module through the first pressing member 630 from the upper direction to the lower direction. As a result, the semiconductor module is fully inserted into the slot and both sides of the semiconductor module are clamped by levers located on both sides of the slot. That is, a plurality of semiconductor modules can be conveniently and simultaneously inserted into corresponding slots through a single operation of the insert unit 600.

Meanwhile, in order to separate the semiconductor module, which has been confirmed to be defective by using the semiconductor test equipment, from the slot of the test board, the test board is placed on the TB guide rail unit 200, Push inward. Then, a control button for separating the semiconductor module is pressed to actuate the pair of cylinders 410 through the control unit. Then, the cylinder is operated to move the first, second, and third slide grooves 441, 442, and 443, which are located in the neutral section (neutral position) (second position in FIG. 16) 2 and the third rollers 530, 620 and 720 move to the left side of FIG. 16 and move to the leftmost position (position 3 in FIG. 16). That is, since the first roller 530 moves relatively horizontally along the first slide groove 441 as the slide member 440 is gradually moved to the right in the drawing, no significant change in operation occurs, The second roller 620 moves slightly along the second slide groove 442 at a relatively downward inclination angle, and then moves horizontally, so that a slight change occurs. That is, the insert unit 600 slightly moves downward, and the first pressing member 630 is brought into close contact with the upper end of the semiconductor module so that the semiconductor module is not moved.

However, the third roller 720 moves along the third slide groove 443 at a relatively downward inclination angle. That is, the ejection unit 700 gradually moves downward and presses the lever, which clamps both sides of the semiconductor module through the second pressing member 730, to release the clamping of the semiconductor module by the lever, Remove it from the slot. Even if the lever is not clamped to the semiconductor module, the first pressing member 630 of the insert unit 600 is brought into close contact with the upper end of the semiconductor module, so that the semiconductor module is positioned in the correct position of the slot. As described above, a plurality of semiconductor modules can be conveniently and simultaneously separated into corresponding slots through a single operation of the eject unit 700.

When the above-described ejection process is completed, the test board is slid to the outside of the body frame unit 300. In this state, the LED bar unit 800 confirms whether each semiconductor module is defective or not. That is, the LED support bar 820 is rotated with respect to the fixing block 810 of the LED bar unit 800 to position the LEDs on one side of the semiconductor module, and the defective (or non-defective) And whether it is good or not. Then, the operator picks up the semiconductor module of the slot, draws it out of the test board, and distinguishes defective and good products and draws out.

While the invention has been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the disclosed embodiments. It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention as defined by the appended claims. Examples or modifications will also fall within the scope of the claims of this invention.

100: Base frame 200: TB Guide rail unit
300: Body frame unit 400: Slide unit
500: slide body unit 600: insert unit
700: eject unit 800: LED bar unit
900: O insertion detection unit

Claims (10)

A test board having a plurality of sockets arranged in a plurality of rows and rows and a plurality of levers located on both sides of the socket, the plurality of semiconductor modules to be respectively placed in the plurality of sockets, An insert and an ejecting apparatus for a semiconductor module,
An insert unit for simultaneously pressing the upper ends of the plurality of semiconductor modules, inserting and fixing the semiconductor modules into the socket respectively, and clamping both sides with the levers,
An eject unit for releasing clamping of the semiconductor module due to the lever by pressing the upper ends of the plurality of levers at the same time,
A slide unit that simultaneously supplies power to the insert unit and the eject unit and moves the insert unit and the eject unit in a vertical direction while slidingly moving the insert unit and the eject unit to attach or separate the semiconductor module to or from the socket;
And a control unit for controlling the units. ≪ RTI ID = 0.0 > 11. < / RTI > The method according to claim 1,
Further comprising a body frame unit for supporting the insert unit, the eject unit, and the slide unit. The method of claim 2,
The slide unit includes a pair of cylinders disposed in series to face each other to provide power, a block that connects the rods of the pair of cylinders with each other, And a pair of slide members respectively coupled to both ends of the connecting member and arranged in parallel with the pair of cylinders. The method of claim 3,
Further comprising a slide body unit fixed to the body frame unit for fixing a pair of cylinders of the slide unit and guiding the pair of slide members to slide in the left and right direction. Device. The method of claim 4,
Wherein the slide member has a plurality of slide grooves in three rows,
The slide groove of the upper row is formed in the horizontal direction and moves along the roller constituting the slide body unit,
The slide groove of the middle row has a certain horizontal section from one side to the other side and is inclined upward, and thereafter is again formed into a cam structure having a horizontal section and then a downwardly inclined section and then a horizontal section again so as to move along the rollers constituting the insert unit ,
Wherein the slide groove of the lower row is formed as a cam structure having a horizontal section from one side to the other side and then inclined upwardly and then again a horizontal section to move along the roller constituting the ejection unit. Device. The method of claim 5,
The upward inclined section of the slide groove of the intermediate row is brought into close contact with the upper end of the semiconductor module at the time of detaching the semiconductor module through the eject unit to move the insert unit in a downward direction Wherein the distance between the first and second surfaces of the semiconductor module is greater than the distance between the first surface and the second surface. The method of claim 6,
Further comprising three cylinder sensors and a solenoid valve for controlling the stop positions of the pair of cylinders,
Wherein the stop positions of the pair of cylinders are controlled by the control unit. The method according to claim 1,
Wherein the insert unit comprises a plurality of pressing members which are respectively coupled to the lower portions so as to protrude downwardly and which are coupled with each other with the springs positioned therebetween to press the upper ends of the plurality of semiconductor modules. The method of claim 2,
An LED bar unit which is fixed to one side of a frame of the body frame unit and displays defect and non-defectiveness of semiconductor modules respectively located in slots of the test board according to information values provided by the control unit connected to the test board Further comprising: an insert and an ejecting device for the semiconductor module. The method of claim 2,
Further comprising an erroneous insertion detecting unit for detecting whether the semiconductor module located in the slot of the test board is erroneously inserted,
Wherein the erroneous insertion detecting unit includes: a rotating bar rotatably coupled to one side of the frame of the body frame unit; a plurality of touch bars extending to a lower side of the rotating bar and extending to a length in which the inserted semiconductor module is touched; A sensor installed at one side of the rotary bar for detecting whether the rotary bar is rotated; and a weight for returning rotation coupled to a lower portion of the other side of the rotary bar.

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