KR100432355B1 - Mounting and Separating Device from Test Tray in Handler for Testing Semiconductor Devices - Google Patents

Abstract

The present invention relates to a device detachment device used for mounting and removing a device on a carrier of a test tray in a handler for testing a semiconductor device. According to the present invention, a body part fixed to a test tray and a semiconductor device in the body part are provided. A plurality of carriers comprising a seating portion formed so that the seats may be seated, a pair of fixed latches rotatably installed at both ends of the seating portion to fix and release the semiconductor element, and a through hole formed in the center of the seating portion. A test tray; The main body of the handler which is installed to operate up and down on the upper side of the test tray, is in contact with and released from the fixed latch of each carrier of the test tray, and performs the coupling and release operation between the fixed latch and the semiconductor element. An installation plate installed to be moved back and forth along the guide member at an upper side of the mounting plate; A carrier operating member installed on the lower portion of the mounting plate so as to be movable up and down to press and hold the fixed latch of each carrier of the test tray; A device detecting member installed below the mounting plate so as to be movable up and down independently of the carrier operating member and detecting the presence or absence of the semiconductor device by contact with the semiconductor device seated on each carrier of the test tray; A device detachment apparatus for a test tray of a semiconductor device test handler is provided.

Description

Mounting and Separating Device from Test Tray in Handler for Testing Semiconductor Devices}

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a device detachment apparatus used for mounting and removing a device on a carrier of a test tray in a handler for testing a semiconductor device, and in particular, a carrier for device mounting of a tray for testing a semiconductor device in an exchanger of the handler The present invention relates to a device detachment device for a test tray of a semiconductor device test handler which performs a role of mounting and removing.

In general, semiconductor devices, such as memory or non-memory semiconductor devices, and modules, which are appropriately configured on a single circuit, are shipped after various tests after production. Refers to a device that is used to automatically test semiconductor devices and modules such as.

In general, many of these handlers not only perform general performance tests at room temperature but also heat and heat the liquid nitrogen injection system in an enclosed chamber to create an environment of extreme temperature at high and low temperatures so that the semiconductor device and the module can be controlled. It is also possible to conduct high temperature and low temperature tests to test whether they can function under these extreme temperature conditions.

1 of the accompanying drawings is a plan view schematically showing an example of a handler configuration that can test the temperature of the semiconductor device as described above, Figures 2a and 2b is for mounting the test tray and the device mounted on the test tray, respectively Referring to FIG. 1 to FIG. 2B, the test process performed in the conventional handler is described with reference to FIGS. 1 to 2B.

When the operator loads the customer tray containing the semiconductor devices to be tested in the loading stacker 10 to operate the handler, the first picker 31 moves the semiconductor devices to the buffer unit 40, and then the second picker. 32 picks up the semiconductor elements on the buffer unit 40 and transfers them to the exchange unit 50.

The exchange unit 50 aligns the semiconductor elements 200 transferred by the second picker 32 at regular intervals on the aligner (not shown), and then the lower and upper push units (not shown). After mounting to the element mounting carrier 100 of the test tray (T) placed in a horizontal state using the ()), the test tray (T) is rotated vertically by the rotator 550, and the test tray (T) is upright To the test site 70 at the rear.

The test site 70 is provided with a plurality of chambers capable of performing a temperature test side by side to transfer the test tray (T) to each chamber in an upright state to perform a test of the semiconductor device, the test tray (T) It is sent back to the rotator 550.

The tested test tray T is transferred to the exchange unit 50 while being converted to a horizontal posture by the turning operation of the rotator 550, and an upper push unit (not shown) that is an element detachment device installed above the exchange unit 50. The semiconductor elements are separated from the carrier 100 of the test tray T by the operation of the backplane and are aligned on the aligner (not shown).

Subsequently, the second picker 32 picks up the semiconductor elements on the aligner and transfers them to the buffer unit 40, and the first picker 31 picks up the semiconductor elements on the buffer unit 40 and unloads them according to the test result. The semiconductor device is tested by sorting and mounting each customer tray of the stacker 20.

By the way, during the testing of the semiconductor device as described above, the semiconductor device is the carrier 100 due to processing errors occurring during the manufacturing process of the carrier 100 during the attachment and detachment of the test tray T in the exchange unit 50. It often happens that it is not properly mounted or disconnected properly. Since the upper pusher unit of the conventional handler has no means of detecting it, the semiconductor device is not continuously installed and removed from the test tray. There was a problem that the expensive semiconductor device is damaged and the test is not properly progressed.

Accordingly, the present invention has been made to solve the above problems, and when the semiconductor device is not fully mounted and detached from the carrier of the test tray in the exchanger of the handler, the present invention is automatically detected, and at the time of device separation It is an object of the present invention to provide a device for attaching and detaching a device of a test tray, which facilitates a test by minimizing a phenomenon in which a semiconductor device is not separated from the test tray by helping the device to be separated.

1 is a plan view schematically showing a general handler configuration

Figures 2a and 2b is a front view showing the configuration of the test tray used in the handler of FIG.

Figure 3 is a perspective view showing the configuration of the exchange portion of the handler is installed device detachable device of the present invention

FIG. 4 is an exploded perspective view of a main part of the element detachment apparatus of FIG. 3 and is a view without a sensor installed. FIG.

FIG. 5 is a perspective view of a coupled state of a main part of the element detachment apparatus of FIG. 4;

FIG. 6 is a partial perspective view of a bottom surface of the element detachment apparatus of FIG. 4. FIG.

FIG. 7 is a cross-sectional view taken along the line I-I of FIG. 5, and is a cross-sectional view in a state where a sensor is installed.

8A and 8B are longitudinal cross-sectional views illustrating the operation of the device detachment apparatus of FIG. 4.

Explanation of Reference Symbols in Major Parts of Drawings

T: test tray 100: carrier

103: fixed latch 104: push block

105: through hole 200: semiconductor device

300: upper push unit 302: mounting plate

303a, 303b: forward and backward pneumatic cylinder 305: guide member

310: sensor pin base plate 311: sensor pin drive pneumatic cylinder

312: insertion hole 313: sensor mounting groove

316: sensor 320: sensor pin mounting plate

323: connection rod 325: sensor pin

325a: body portion 325b: sensing portion

330: push pin base plate 331: push pin drive pneumatic cylinder

335: push pin 335a: body portion

335b: contact 510: aligner

530: lower push unit 531: suction nozzle

In order to achieve the above object, the present invention provides a body portion fixed to the test tray, a seating portion formed so that the semiconductor elements are seated on the body, and pivotally installed at both ends of the seating portion to fix the semiconductor element. A test tray including a pair of fixed latches to release and a plurality of carriers including a through hole formed at a center of the seating portion; The main body of the handler which is installed to operate up and down on the upper side of the test tray, is in contact with and released from the fixed latch of each carrier of the test tray, and performs the coupling and release operation between the fixed latch and the semiconductor element. An installation plate installed to be moved back and forth along the guide member at an upper side of the mounting plate; A carrier operating member installed on the lower portion of the mounting plate so as to be movable up and down to press and hold the fixed latch of each carrier of the test tray; A device detecting member installed below the mounting plate so as to be movable up and down independently of the carrier operating member and detecting the presence or absence of the semiconductor device by contact with the semiconductor device seated on each carrier of the test tray; Provided is a device detachment device for a test tray of a semiconductor device test handler, characterized in that configured.

According to one aspect of the invention, the carrier operating member is installed to be arranged at regular intervals in pairs on the lower surface of the pushpin base plate and the pushpin base plate which is installed to be movable up and down under the mounting plate. A plurality of push pins which are in contact with a fixed latch of each carrier of a test tray, a plurality of through holes formed to penetrate the push pin base plate so as to correspond to a through hole of each carrier of the test tray, and the push pin base plate It characterized in that it comprises a drive means for driving up and down.

The device detecting member includes: a sensor pin base plate installed between the mounting plate and the push pin base plate to move up and down; It is installed to be fixedly coupled to the sensor pin base plate in the lower side of the push pin base plate, the through hole through the lower end of each push pin of the push pin base plate and the position corresponding to each through hole of the push pin base plate Sensor pin mounting plate formed in the through hole; The sensor pin mounting plate penetrates the through-hole of the push pin base plate and the through-hole of the sensor pin mounting plate to be movable up and down, and the lower end penetrates the through-hole of the carrier of the test tray to ground with the semiconductor device. Sensor pins; A sensor installed inside the sensor pin base plate to detect vertical movement of each sensor pin; It characterized in that it comprises a drive means for moving the sensor pin base plate up and down.

Hereinafter, a preferred embodiment of a device detachment device of a test tray for a handler according to the present invention will be described in detail with reference to the accompanying drawings. For the configuration of the handler, the same components will be described with reference to the related art described with reference to FIG. 1. The same reference numerals are given together and detailed description thereof is omitted.

First, in order to help understand the configuration and operation of the device detachment apparatus of the present invention, the test tray and the carrier mounting structure for device mounting will be described with reference to FIGS. 2A and 2B. Carriers 100 are arranged at regular intervals, where 64 (16 × 4) carriers 100 are installed in one test tray T.

The carrier 100 may have a substantially rectangular body portion 101, a seating portion 102 formed to mount a semiconductor element on the body portion 101, and moveable at both ends of the seating portion 102. The fixed latch 103 is formed to be fixed to hold both ends of the semiconductor device is fixed to the seating portion 102, the fixed latch 103 is a push block 104 provided behind the body portion (101) Press to open the semiconductor device and release the fixing of the semiconductor device, and when the force applied to the push block 104 is removed, it is contracted to the original state by the elastic force of the elastic member (not shown) and the semiconductor device can be held. do.

Meanwhile, FIG. 3 illustrates a configuration of an exchange part of a handler provided with an element detachment device according to the present invention. As illustrated in FIG. 3, an exchange part 50 of the handler is formed by buffers on both sides of the second picker 32. An aligner 510 on which the semiconductor elements transferred from the 40 are seated and aligned; Each element of the test tray T, which is installed in the lower part of the aligner 510 so as to be moved forward and backward, is placed in a horizontal state by raising the aligner 510 at a rear position for loading the semiconductor element into the test tray T. A lower push unit 530 for loading a semiconductor element into a mounting carrier (not shown); It is installed on the upper side of the test tray T so as to be able to move up and down and move forward and backward to press and operate the fixed latch 103 of each device mounting carrier 100 of the test tray T to the semiconductor in the test tray T. An upper push unit 300 which makes the device loadable and unloadable; It is rotatably installed at 90 ° on the rear side of the exchange unit 50 to switch the test tray T held in the horizontal state in the exchange unit 50 to an upright position, and the exchange unit 50 and the test site ( And a rotator 550 that serves to transfer the test trays between 70).

4 to 7 illustrate a configuration of an element detachment apparatus according to the present invention, and FIGS. 8A and 8B illustrate an example of the operation of the element detachment apparatus according to the present invention. As described above, the upper push unit 300 is coupled to a pair of guide members 305 (see FIG. 3), such as an LM Guide, which is installed in the front and rear directions of the handler, respectively. The vertical plate 301 and the mounting plate 302 is coupled to the upper end of the vertical plate 301 to move forward and backward along the vertical plate 301.

Forward and backward pneumatic cylinders 303a and 303b (see Fig. 3) are respectively installed in the main body of the handler in which the guide members 305 are installed, and the forward and backward pneumatic cylinders 303a and 303b are respectively installed. According to the operation of the vertical plate 301 and the mounting plate 302 coupled thereto moves forward and backward on the test tray (T) of the exchange unit 50 of the handler.

The sensor pin base plate 310 is installed on the lower side of the mounting plate 302 so as to be lifted up and down by a sensor pin driving pneumatic cylinder 311 installed on an upper surface of the mounting plate 302, and the sensor pin base plate ( The lower surface of the 310 is disposed by a plurality of connecting rods 323 and the sensor pin base plate 310 is fixedly coupled to maintain a predetermined distance with the sensor pin base plate 310, the sensor pin base plate 310 Between the sensor pin base plate 310 and the sensor pin mounting plate 320 by the push pin driving pneumatic cylinder 331 installed on the upper surface of the mounting plate 302. The plate 320 is provided to be movable up and down independently.

The push pin base plate 330 is provided with a plurality of push pins 335 for pressing the fixed latch 103 of each carrier 100 of the test tray T to be fixed at regular intervals. The through hole 332 is formed at a position between the pair of pins 335.

In addition, a plurality of guide shafts 333 are installed at the corners of the push pin base plate 330 to penetrate the mounting plate 302 and guide the lifting of the push pin base plate 330.

Similarly, a plurality of guide shafts 315 are installed at the edges of the sensor pin base plate 310 to penetrate the mounting plate 302 and guide the lifting of the sensor pin base plate 310.

The sensor pin mounting plate 320 has a plurality of through holes 321 formed at positions corresponding to the push pins 335 so that the push pins 335 of the push pin base plate 330 pass therethrough. The through holes 322 are formed between the pair of through holes 321 to correspond to the through holes 332 of the push pin base plate 330, and the sensor pins 325 are formed in the through holes 322. Is installed.

In addition, as shown in detail in Figure 7, the sensor pin base plate 310, the insertion hole 312 is formed in a straight line is inserted into the upper end of the sensor pin 325, the insertion hole 312 is Sensor installation grooves 313 (see FIG. 4) are formed respectively on both sides of the arranged portion, and the sensor 316 is installed at both sides, and each insertion hole 312 communicates with the sensor installation grooves 313 on both sides. The sensor beam penetrating holes 314 are formed to face each other, and the respective sensors 316 installed in the sensor installation grooves 313 are beamed to the sensor 316 installed on the opposite side through the sensor beam penetrating holes 314. The beam is transmitted to detect the presence or absence of the upper end of the sensor pin 325 at each insertion hole 312 position.

On the other hand, the push pin 335 is composed of a body portion 335a fixed to the push pin base plate 330 and a contact portion 335b positioned below the body portion 335a, and an outer peripheral portion of the contact portion 335b. The protrusion 335c protruding outward is formed, and between the protrusion 335c and the lower end of the body portion 335a is in elastic contact with the fixed latch 103 of each carrier 100 of the test tray (T). Compression spring 335d is combined to be able to do so.

In addition, the sensor pin 325 is composed of a hollow body portion 325a fixed to the sensor pin base plate 310 and a sensing portion 325b installed to move up and down along the hollow portion of the body portion 325a. The lower portion of the sensing unit 325b is provided with a protrusion 325c protruding outward in a radial direction, and a compression spring 325d is coupled between the protrusion 325c and the lower end of the body portion 325a to detect the sensing unit ( 325b is configured to be elastically supported with respect to body portion 325a.

On the other hand, between the push pin base plate 330 and the sensor pin mounting plate 320 a plurality of compression springs 324 elastically supporting the push pin base plate 330 relative to the sensor pin mounting plate 320 Is installed, the push pin base plate 330 is formed with a plurality of guide rods 334 are inserted and coupled to each of the compression springs (324).

Operation of the upper push unit 300 configured as described above is made as follows.

When the first picker 31 (see FIG. 1) of the handler picks up the semiconductor element to be tested from the loading stacker 10 and moves it to the buffer unit 40, the second picker 32 is placed on the buffer unit 40. The semiconductor elements are picked up and seated on each seating portion 511a of the aligner 510.

When the semiconductor elements are seated on all the mounting portions 511a on the aligner 510, the aligner 510 is moved backward by its driving means and is supported by the rotator 550 in a horizontal state. It is located directly below.

At this time, the sensor pin base plate 310 and the sensor pin mounting plate 320 coupled thereto are lowered by the operation of the sensor pin driving pneumatic cylinder 311 of the upper pusher unit 300, which is illustrated in FIG. 9A. Likewise, the lower end of the sensing unit 325b of the sensor pin 325 passes through the through hole 105 of the carrier 100 of the test tray T and is positioned directly below the carrier 100. Subsequently, the push pin base plate 330 is lowered by the operation of the push pin driving pneumatic cylinder 331 of the upper push unit 300 to press the push block 104 of the carrier 100 to open the fixed latch 103. Make it state.

Thereafter, as the lower push unit 530 is raised, the suction nozzle 531 sucks the semiconductor element on the aligner 510 and mounts it to the carrier 100 in the test tray T. As shown, while the semiconductor device 200 is mounted on the carrier 100 from below, the semiconductor device 200 comes into contact with the sensing unit 325b of the sensor pin 325 of the upper pusher unit 300 and the sensing unit 325b. Is raised.

Accordingly, the upper end of the sensing unit 325b of the sensor pin 325 is inserted into the insertion hole 312 of the sensor pin base plate 310, and the sensor 316 detects this.

Subsequently, as the push pin base plate 330 is raised by the push pin driving pneumatic cylinder 331 of the upper push unit 300, the fixed latch 103 of the carrier 100 is pinched to fix the semiconductor element. At the same time, the suction nozzle 531 of the lower push unit 530 releases the suction state of the semiconductor element and descends.

On the other hand, the suction nozzle 531 of the lower pusher unit 530 also functions to detect the presence or absence of the semiconductor element in the adsorption force, the control unit of the handler is a semiconductor element is held when the adsorption force is generated in the suction nozzle 531 If it is determined that there is no adsorption force in the adsorption nozzle 531, it is determined that the semiconductor device is not held.

Therefore, after the semiconductor device is mounted on the carrier 100 in the process of mounting the semiconductor device on the test tray T as described above, the suction nozzle 531 recognizes that the semiconductor device is being held and the upper pusher When the sensor 316 of the unit 300 does not detect the sensing unit 325b, the semiconductor device is not properly mounted on the carrier 100 of the test tray T, and thus the handler stops operating. In this case, the worker checks this and takes action.

On the other hand, when the test tray T, in which the test of the semiconductor device is completed, is placed in the exchange unit 50 through the test site of the handler, the suction nozzle 531 of the lower push unit 530 is raised to the bottom of the semiconductor device. To adsorb the semiconductor element.

Subsequently, as described above, the sensor pin base plate 310 and the sensor pin mounting plate 320 of the upper push unit 300 are lowered so that the sensing unit 325b of the sensor pin 325 is a carrier of the test tray T. The through-hole 105 of the (100) is in contact with the semiconductor device 200, accordingly, the sensing unit 325b of the sensor pin 325 is raised to the insertion hole 312 of the sensor pin base plate 310 The sensor 316 detects this and recognizes the semiconductor device 200.

Next, when the push pin base plate 330 is lowered and the push pin 335 pushes the push block 104 of the carrier 100, the fixing latch 103 is opened and the state in which the semiconductor device 200 is fixed is released. At the same time, the lower push unit 530 is lowered in the state in which the reaction element is adsorbed to separate the semi-nodal element from the test tray T. At this time, the sensor pin 325 of the upper pusher unit 300 helps the semiconductor device to be completely separated from the carrier 100 by pushing the semiconductor device.

In the process of removing the semiconductor device from the test tray T as described above, the adsorption nozzle 531 does not recognize the semiconductor device after the semiconductor device removal operation is performed, but the sensor 316 of the upper push unit 300 is the semiconductor device. In this case, the semiconductor device may not be completely separated from the carrier 100.

If neither the suction nozzle 531 nor the sensor 316 recognizes the semiconductor device, the semiconductor device is lost in the process of removing the semiconductor device.

As described above, according to the present invention, it is possible to automatically detect whether the semiconductor device is correctly attached or detached during the operation of mounting and removing the semiconductor device on the test tray by the exchanger of the handler. In this case, the handler is stopped and the operator can take appropriate measures to prevent the expensive semiconductor device from being damaged.

In addition, in the process of removing the tested semiconductor device from the test tray, the sensor pin that recognizes the presence or absence of the semiconductor device plays a role of pushing the semiconductor device, so that the semiconductor device is not separated from the carrier of the test tray. There is also an effect.

Claims (7)

A body portion fixed to the test tray, a seating portion formed so that the semiconductor elements are seated on the body, a pair of fixed latches rotatably installed at both ends of the seating portion to fix and release the semiconductor element, and the seating portion A test tray arranged with a plurality of carriers including a through hole formed at a center thereof; In the upper side of the test tray is installed to operate up and down to contact and release the fixed latch of each carrier of the test tray to perform the coupling and release operation between the fixed latch and the semiconductor device, An installation plate installed on the upper side of the handler body in which the test tray is positioned to move back and forth along the guide member; A carrier operating member installed on the lower portion of the mounting plate so as to be movable up and down to press and hold the fixed latch of each carrier of the test tray; A device detecting member installed below the mounting plate so as to be movable up and down independently of the carrier operating member and detecting the presence or absence of the semiconductor device by contact with the semiconductor device seated on each carrier of the test tray; Device detachment device of the test tray of the semiconductor device test handler, characterized in that configured. The test tray according to claim 1, wherein the carrier operation member is installed to be arranged at a predetermined interval in pairs on a lower surface of the pushpin base plate and a lower surface of the pushpin base plate. A plurality of push pins which are in contact with a fixed latch of each carrier of the carrier, a plurality of through holes formed to penetrate the push pin base plate so as to correspond to the through holes of each carrier of the test tray, and the push pin base plate up and down Device detachment device of the test tray of the semiconductor device test handler, characterized in that it comprises a drive means for driving. The device of claim 2, wherein the element sensing member comprises: a sensor pin base plate disposed between the mounting plate and the push pin base plate so as to be movable up and down; It is installed to be fixedly coupled to the sensor pin base plate in the lower side of the push pin base plate, the through hole through the lower end of each push pin of the push pin base plate and the position corresponding to each through hole of the push pin base plate Sensor pin mounting plate formed in the through hole; The sensor pin mounting plate penetrates the through-hole of the push pin base plate and the through-hole of the sensor pin mounting plate to be movable up and down, and the lower end penetrates the through-hole of the carrier of the test tray to ground with the semiconductor device. Sensor pins; A sensor installed inside the sensor pin base plate to detect vertical movement of each sensor pin; Device detachment device of the test tray of the semiconductor device test handler, characterized in that it comprises a drive means for moving the sensor pin base plate up and down. 4. The test tray of claim 3, wherein an elastic member is provided between the push pin base plate and the sensor pin mounting plate to elastically support the push pin base plate with respect to the sensor pin mounting plate. Device detachment device. 5. The device of claim 4, wherein the elastic member is a compression spring. The sensor pin groove of claim 3, wherein a plurality of insertion holes into which the upper ends of the respective sensor pins are inserted in a straight line is arranged in the sensor pin base plate, and sensors are installed at both sides around the portion where the insertion holes are arranged. It is formed side by side, each of the insertion hole is a semiconductor device characterized in that the sensor beam through-holes are communicated to the sensor installation grooves on both sides so that the beams emitted from each sensor installed in the sensor installation grooves are transmitted to the opposite sensor Device detachment device on test tray of test handler. According to claim 3 or 6, wherein the sensor pin, the hollow body portion is fixed to the sensor pin base plate, is installed to move up and down along the hollow portion of the body portion of the lower portion is exposed to the outside of the lower body portion semiconductor And a sensing unit contacting the device, a protrusion formed to protrude from the lower outer circumferential surface of the sensing unit, and an elastic member coupled between the protrusion and the bottom of the body to support the sensing unit elastically. A device detachment device for a test tray of a semiconductor device test handler.