TWI758091B - Testing mechanism, connecting mechanism and handler using the same - Google Patents
Testing mechanism, connecting mechanism and handler using the same Download PDFInfo
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本發明提供一種有關電子元件之電性測試作業及無線訊號測試作業之測試機構、接合機構及測試設備。The invention provides a test mechanism, a joint mechanism and a test equipment related to the electrical testing operation of electronic components and the wireless signal testing operation.
在現今,一內建有天線之射頻電子元件廣泛應用於行動通訊區域無線網路系統及無線通訊區域網路系統等領域;射頻電子元件於本體之底面設置複數個接點,並於本體之頂面設置天線,射頻電子元件於出廠前,除了執行電性測試作業,亦需執行無線訊號測試作業,以確保品質。At present, a radio frequency electronic component with built-in antenna is widely used in the fields of mobile communication area wireless network system and wireless communication area network system. Antennas are installed on the surface. Before the radio frequency electronic components leave the factory, in addition to performing electrical testing operations, they also need to perform wireless signal testing operations to ensure quality.
測試裝置於機台配置一具探針之電性測試器,並於電性測試器之上方配置天線測試器;射頻電子元件置入電性測試器,射頻電子元件以接點電性接觸電性測試器之探針而執行電性測試作業,並以天線朝向天線測試器發出無線訊號,天線測試器接收無線訊號而進行無線訊號測試作業。The test device is equipped with an electrical tester with a probe on the machine, and an antenna tester is arranged above the electrical tester; the radio frequency electronic components are placed in the electrical tester, and the radio frequency electronic components are electrically contacted with the contacts. The probe of the tester is used to perform the electrical test operation, and the antenna is directed toward the antenna tester to send out wireless signals, and the antenna tester receives the wireless signal to perform the wireless signal test operation.
惟,射頻電子元件之接點易與電性測試器之探針發生錯位,以致接點無法作有效性地電性接觸探針,進而影響射頻電子元件之測試良率。再者 ,部份電性測試器之探針內具有彈簧,射頻電子元件之自重壓力不足以使接點與探針作有效性地電性接觸,以致影響射頻電子元件之電性測試準確性。然若以壓接器由上向下下壓電子元件之頂面,雖可使射頻電子元件之接點確實接觸電性測試器之探針,卻會導致壓接器屏蔽電子元件之天線,以致影響射頻電子元件之無線訊號測試準確性。 However, the contacts of the radio frequency electronic components are easily misplaced with the probes of the electrical tester, so that the contacts cannot be used as effective electrical contact probes, thereby affecting the test yield of the radio frequency electronic components. Furthermore , Some electrical testers have springs in their probes. The self-weight pressure of the radio frequency electronic components is not enough to make the contacts and probes make effective electrical contact, thus affecting the electrical test accuracy of the radio frequency electronic components. However, if the crimper is used to press down the top surface of the electronic component from top to bottom, although the contacts of the RF electronic component can indeed contact the probe of the electrical tester, it will cause the crimper to shield the antenna of the electronic component, so that Affects the accuracy of wireless signal testing of RF electronic components.
本發明之目的一,提供一種測試機構,包含電性測試器、夾具組 、推抵具及驅動單元,電性測試器設有電路板,夾具組之複數個夾爪的第一端電性連接電路板,第二端圍構成夾口,以供容置電子元件之接點,推抵具設有至少一頂推部,以供頂推該夾具組夾持作動,驅動單元設有至少一驅動器,以供驅動夾具組或推抵具位移,使推抵具頂推夾具組夾持且確實電性連接電子元件之接點而執行電性測試作業,進而提升測試品質。 The first objective of the present invention is to provide a testing mechanism including an electrical tester and a fixture set , Pusher and drive unit, the electrical tester is provided with a circuit board, the first end of the plurality of jaws of the fixture group is electrically connected to the circuit board, and the second end surrounds a clamping opening for accommodating the connection of electronic components point, the pusher is provided with at least one pushing portion for pushing the clamp group to clamp, and the driving unit is provided with at least one driver for driving the clamp group or the pusher to displace, so that the pusher pushes the clamp The group clamps and electrically connects the contacts of the electronic components to perform the electrical test operation, thereby improving the test quality.
本發明之目的二,提供一種測試機構,其夾具組位於一為射頻電子元件之電子元件下方,以夾持且電性連接電子元件之接點,可防止屏蔽射頻電子元件頂面之天線,以利天線與天線測試器進行無線訊號測試作業,進而提升測試品質。The second object of the present invention is to provide a testing mechanism, wherein the fixture set is located under an electronic component that is a radio frequency electronic component, so as to clamp and electrically connect the contacts of the electronic component, which can prevent the antenna on the top surface of the radio frequency electronic component from being shielded, thereby preventing the radio frequency electronic component from being shielded. Utilize antennas and antenna testers to perform wireless signal testing operations, thereby improving test quality.
本發明之目的三,提供一種接合機構,其裝配於具探針之電性測試器上方,接合機構包含承板、夾具組、推抵具及驅動單元,承板供穿置電性測試器之探針,夾具組之複數個夾爪配置於探針之周側,並以第一端固設於承板,而第二端圍構成夾口供容置電子元件之接點,推抵具設有至少一頂推部,以供頂推該夾具組夾持作動,驅動單元設有至少一驅動器,以供驅動夾具組沿壓接軸向位移,利用推抵具頂推夾具組夾持電子元件之接點,並以夾具組帶動電子元件沿壓接軸向位移,使電子元件之接點確實壓接電性測試器之探針執行電性測試作業,進而提升測試品質。The third object of the present invention is to provide a joint mechanism, which is assembled above an electrical tester with probes. The joint mechanism includes a support plate, a clamp set, a pusher and a driving unit. The support plate is used for the insertion of the electrical tester. For the probe, a plurality of clamping claws of the clamp group are arranged on the peripheral side of the probe, and the first end is fixed on the support plate, and the second end surrounds the clamping opening for accommodating the contacts of the electronic components, and the pusher is provided with At least one pushing portion is used to push the clamp group for clamping action, and the driving unit is provided with at least one driver for driving the clamp group to move along the crimping axis, and the pusher is used to push the clamp group to clamp the electronic components. The clamp set drives the electronic components to move along the crimping axis, so that the contacts of the electronic components are crimped to the probes of the electrical tester to perform electrical testing operations, thereby improving the test quality.
本發明之目的四,提供一種接合機構,其夾具組位於一為射頻電子元件之電子元件下方,以夾持帶動電子元件電性連接電性測試器,可防止屏蔽射頻電子元件頂面之天線,以利天線與天線測試器進行無線訊號測試作業,進而提升測試品質。The fourth object of the present invention is to provide a joint mechanism, wherein the clamp set is located below an electronic component that is a radio frequency electronic component, so as to clamp and drive the electronic component to be electrically connected to an electrical tester, which can prevent shielding of the antenna on the top surface of the radio frequency electronic component, In order to facilitate the wireless signal test operation of the antenna and the antenna tester, the test quality can be improved.
本發明之目的五,提供一種測試設備,包含機台、供料裝置、收料裝置、具本發明測試機構之測試裝置、輸送裝置及中央控制裝置;供料裝置配置於機台上,並設有至少一容納待測電子元件之供料承置器;收料裝置配置於機台上,並設有至少一容納已測電子元件之收料承置器;測試裝置配置於機台上,包含至少一本發明測試機構,以供測試電子元件;輸送裝置配置於機台上,並設有至少一輸送器,以輸送電子元件;中央控制裝置以供控制及整合各裝置作動,而執行自動化作業。The fifth object of the present invention is to provide a testing equipment, including a machine, a feeding device, a receiving device, a testing device with the testing mechanism of the present invention, a conveying device, and a central control device; the feeding device is arranged on the machine, and is provided with There is at least one feeding holder for accommodating the electronic components to be tested; the receiving device is arranged on the machine table, and there is at least one receiving and holding device for accommodating the tested electronic components; the testing device is arranged on the machine table, including At least one testing mechanism of the present invention is used for testing electronic components; the conveying device is arranged on the machine table, and is provided with at least one conveyor for conveying electronic components; the central control device is used to control and integrate the actions of each device to perform automatic operations .
本發明之目的六,提供一種測試設備,包含機台、供料裝置、收料裝置、具本發明接合機構之測試裝置、輸送裝置及中央控制裝置;供料裝置配置於機台上,並設有至少一容納待測電子元件之供料承置器;收料裝置配置於機台上,並設有至少一容納已測電子元件之收料承置器;測試裝置配置於機台上,包含電性測試器及本發明接合機構,以供測試電子元件;輸送裝置配置於機台上,並設有至少一輸送器,以輸送電子元件;中央控制裝置以供控制及整合各裝置作動,而執行自動化作業。The sixth object of the present invention is to provide a testing equipment, including a machine, a feeding device, a receiving device, a testing device with the joint mechanism of the present invention, a conveying device and a central control device; the feeding device is arranged on the machine, and is provided with There is at least one feeding holder for accommodating the electronic components to be tested; the receiving device is arranged on the machine table, and there is at least one receiving and holding device for accommodating the tested electronic components; the testing device is arranged on the machine table, including The electrical tester and the joint mechanism of the present invention are used for testing electronic components; the conveying device is arranged on the machine table, and is provided with at least one conveyor for conveying the electronic components; the central control device is used to control and integrate the operation of each device, and Execute automated jobs.
為使 貴審查委員對本發明作更進一步之瞭解,茲舉一較佳實施例並配合圖式,詳述如後:In order to make your examiners further understand the present invention, hereby give a preferred embodiment and cooperate with the drawings, the details are as follows:
請參閱圖1、2,本發明測試機構之第一實施例,包含電性測試器 、至少一夾具組、至少一推抵具及驅動單元。 Please refer to FIGS. 1 and 2 , the first embodiment of the testing mechanism of the present invention includes an electrical tester , At least one clamp group, at least one pusher and drive unit.
電性測試器設有電路板11,更進一步,電路板11本身可具有測試程式,或者電路板11電性連接一具測試程式之測試機或測試電腦;於本實施例
,電路板11以線路電性連接一具測試程式之測試電腦。
The electrical tester is provided with a
至少一夾具組包含複數個夾爪12,複數個夾爪12的第一端電性連接電路板11,複數個夾爪12的第二端呈自由端且圍構成一夾口,以供容置電子元件(圖未示出)之接點;於本實施例,夾具組之複數個夾爪12以導電材質製作
,且具有彈性;更進一步,複數個夾爪12之第一端可固接於電性測試器之電路板11,或者複數個夾爪12的第一端固接於一承板,並以線路電性連接電性測試器之電路板11;於本實施例,複數個夾爪12呈Z方向直立配置,以一夾爪12為例
,其第一端121固接於電性測試器之電路板11,夾爪12取代電性測試器之探針,夾爪12之第二端122為自由端且呈內凹弧狀,以增加第二端122與接點之接觸面積而更加確保作有效性電性連接;當然,夾爪12之第二端122可依作業需求而設計呈不同形狀;複數個夾爪12之第二端122圍構成夾口123,夾爪12未作動前,夾口123之口徑尺寸大於接點之外徑尺寸,以供容置電子元件之接點。
At least one clamp group includes a plurality of
至少一推抵具13設有至少一頂推部,以供頂推夾具組夾持作動,更進一步,推抵具13配置於夾具組之周側,並設有至少一朝向夾具組之頂推部
,舉例,一推抵具13可設有一環置於夾具組周側之頂推部,舉例,一推抵具13於相對應複數個夾爪12之位置分別設有頂推部;於本實施例,推抵具13配置於電路板11上方之適當位置,推抵具13開設第一通孔131,第一通孔131之內面設有一由下向上作外擴式傾斜之頂推部132,推抵具13之第一通孔131供穿置夾具組之複數個夾爪12,令頂推部132環置於複數個夾爪12之外周側,以供導引頂推複數個夾爪12向內擺動夾持作動。
At least one
承上述,測試機構可於夾爪組之複數個夾爪12的周側配置相同數量之推抵具13,複數個推抵具13各別頂推相對應之夾爪12夾持作動,亦無不可。In view of the above, the testing mechanism can be equipped with the same number of
驅動單元設有至少一驅動器,以供驅動夾具組或推抵具13位移,利用推抵具13頂推夾具組夾持且確實電性連接電子元件之接點而執行電性測試作業。舉例,驅動單元以驅動器驅動夾具組沿第一推抵軸向A(如Z方向)向下位移,使夾具組受推抵具13之導引而夾持且電性接觸電子元件之接點;舉例,驅動單元以驅動器驅動推抵具13沿第一推抵軸向A(如Z方向)向上位移,以導引夾具組夾持且電性接觸電子元件之接點。The driving unit is provided with at least one driver for driving the fixture group or the
承上述,當複數個推抵具13對應配置於複數個夾爪12的側方時,驅動單元以複數個驅動器分別驅動複數個推抵具13沿第二推抵軸向(如X方向)作側向位移,複數個推抵具13利用頂推部132頂推複數個夾爪12夾持且電性接觸電子元件之接點。In view of the above, when the plurality of
承上述,驅動器可為線性馬達、壓缸或包含馬達及傳動組。又由於夾具組裝配於電路板11上,上述所稱驅動器帶動夾爪組位移,驅動器即同步帶動電路板11位移。驅動單元之驅動器可依作業需求配置於一承載夾具組之電路板11下方、上方或側方,僅需驅動承載夾具組之電路板11作動即可。As mentioned above, the driver can be a linear motor, a cylinder, or a motor and a transmission set. Since the clamp assembly is assembled on the
於本實施例,驅動單元之驅動器為第一驅動器,第一驅動器為第一壓缸14,第一壓缸14沿第一推抵軸向A配置於電路板11之下方,並以活塞桿連結一托板141,托板141承置電路板11,使第一壓缸14經由托板141而承載電路板11及夾具組沿第一推抵軸向A(如Z方向)位移。當然,第一壓缸14之活塞桿亦可直接連結且驅動電路板11。In this embodiment, the driver of the driving unit is the first driver, the first driver is the
請參閱圖3、4、5,以測試一為射頻電子元件20之電子元件為例,射頻電子元件20之底面具有複數個接點21,並於頂面設有天線22,測試裝置10配置有本發明測試機構及天線測試器,本發明測試機構裝配於機台30
,以供對射頻電子元件20執行電性測試作業;天線測試器15配置於測試機構之上方,以供對射頻電子元件20執行無線訊號測試作業。
Please refer to FIGS. 3 , 4 , and 5 . Taking the test of an electronic component that is an RF
測試機構以複數個夾爪12的第二端122頂撐於射頻電子元件20之底面,以供射頻電子元件20之接點21位於夾具組之複數個夾爪12之夾口123,由於第一壓缸14尚未驅動電路板11及複數個夾爪12作動,複數個夾爪12之第二端122並未接觸射頻電子元件20之接點21;當第一壓缸14以托板14承載電路板11及複數個夾爪12沿第一推抵軸向A(如Z方向)向下位移時,複數個夾爪12受推抵具13之頂推部132頂抵導引作彈性向內擺動,以縮小夾口123,並使複數個夾爪12之第二端122夾持且電性接觸射頻電子元件20之接點21,由於複數個夾爪12之第二端122夾持包覆於射頻電子元件20之接點21表面,而可增加夾爪12與接點21之接觸面積作更加有效性電性接觸,複數個夾爪12之第一端121電性連結於電路板11,電路板11即可經由複數個夾爪12對射頻電子元件20執行電性測試作業;然電路板11及複數個夾爪12配置於射頻電子元件20之下方,可防止屏蔽射頻電子元件20頂面之天線22,以利於射頻電子元件20頂面之天線22與天線測試器15進行無線訊號測試作業,進而提升測試品質。The testing mechanism supports the bottom surface of the RF
請參閱圖2、6,本發明測試機構之第二實施例,其相同第一實施例包含電性測試器、夾具組、推抵具13及驅動單元;第二實施例與第一實施例之差異在於驅動單元之驅動器以驅動推抵具13沿第一推抵軸向A位移,於本實施例,驅動單元之驅動器為第二驅動器,第二驅動器為第二壓缸16,第二壓缸16之活塞桿連結推抵具13,以驅動推抵具13沿第一推抵軸向A(如Z方向)位移,推抵具13以頂推部132頂抵導引複數個夾爪12彈性向內擺動,使複數個夾爪12之第二端122夾持電性接觸射頻電子元件之接點,電路板11即可經由複數個夾爪12對射頻電子元件執行電性測試作業。Please refer to FIGS. 2 and 6 , the second embodiment of the testing mechanism of the present invention, the same as the first embodiment includes an electrical tester, a clamp set, a pushing
請參閱圖7、8,本發明接合機構之第一實施例,其裝配於電性測試器之上方,包含承板41、至少一夾具組、至少一推抵具43及驅動單元;電性測試器設有電性連接之電路板51及測試座52,測試座52設有探針53,以對電子元件執行測試作業。Please refer to FIGS. 7 and 8 , the first embodiment of the joint mechanism of the present invention is assembled above the electrical tester, and includes a
承板41配置於電性測試器之上方,並供穿置電性測試器之探針;更進一步,承板41可作固定式配置或活動式配置,舉例承板41固設於機台30,舉例承板41由驅動單元驅動沿壓接軸向B(如Z方向)位移;於本實施例,承板41於相對應探針53之位置開設有第二通孔411,以供穿置探針53。The
至少一夾具組配置於承板41,且位於探針53之周側,夾具組包含複數個夾爪42,複數個夾爪42的第一端421固設於承板41,而第二端422圍構成夾口423,以供容置電子元件(圖未示出)之接點;於本實施例,夾具組之複數個夾爪42呈Z方向直立配置且具有彈性,複數個夾爪42的第一端421固設於承板41之第二通孔411周側,而第二端422為自由端且呈內凹弧狀,以增加第二端422與接點之接觸面積;當然,夾爪42之第二端422可依作業需求而設計呈不同形狀;複數個夾爪42之第二端422圍構成夾口423,以供穿置探針53,複數個夾爪42未作動前,夾口423之口徑尺寸大於接點之外徑尺寸,以供容置電子元件之接點。At least one clamp set is disposed on the
至少一推抵具43設有至少一頂推部,以供頂推夾具組夾持作動,更進一步,推抵具43配置於夾具組之周側,並設有至少一朝向夾具組之頂推部
,舉例,一推抵具43可設有一環置於夾具組周側之頂推部,舉例,一推抵具43於相對應複數個夾爪42之位置分別設有頂推部;於本實施例,推抵具43配置於承板41上方之適當位置,推抵具43開設第一通孔431,第一通孔431之內面設有一由下向上作外擴式傾斜之頂推部432,推抵具43之第一通孔431供穿置夾具組之複數個夾爪42,令頂推部432環置於複數個夾爪42之外周側,以供導引頂推複數個夾爪42向內擺動夾持作動。
At least one
承上述,接合機構可於夾爪組之複數個夾爪42的周側配置相同數量之推抵具43,複數個推抵具43各別頂推相對應之夾爪42夾持作動,亦無不可。In view of the above, the engagement mechanism can be provided with the same number of
驅動單元設有至少一驅動器,以供驅動夾具組沿壓接軸向B位移
,利用推抵具43頂推夾具組夾持電子元件之接點,並以夾具組帶動電子元件沿壓接軸向B(如Z方向)位移,使電子元件之接點確實壓接電性測試器之探針53執行電性測試作業。更進一步,驅動器可為線性馬達、壓缸或包含馬達及傳動組。
The driving unit is provided with at least one driver for driving the clamp group to displace along the crimping axis B
, Use the
承上述,驅動單元設有至少另一驅動器,以供驅動推抵具43位移
,利用推抵具43頂推夾具組夾持電子元件之接點。舉例驅動單元以另一驅動器驅動推抵具43沿壓接軸向B(如Z方向)向上位移,利用推抵具43頂推夾具組夾持電子元件之接點;舉例驅動單元以另一驅動器驅動推抵具43沿第二推抵軸向(如X方向)作側向位移,以頂推夾具組夾持電子元件之接點。
As mentioned above, the driving unit is provided with at least another driver for driving the
於本實施例,驅動單元之驅動器為第三驅動器,第三驅動器為第三壓缸44,第三壓缸44沿壓接軸向B配置,並位於推抵具43之下方,第三壓缸44之活塞桿連結承板41,承板41裝配夾具組,使第三壓缸44經由承板41承載夾具組沿壓接軸向B(如Z方向)位移。In this embodiment, the driver of the driving unit is a third driver, the third driver is a
請參閱圖9、10、11,以測試一為射頻電子元件20之電子元件為例,射頻電子元件20之底面具有複數個接點21,並於頂面設有天線22,測試裝置10配置有電性測試器、本發明接合機構及天線測試器,電性測試器以供承置射頻電子元件20,並對射頻電子元件20執行電性測試作業;天線測試器54配置於電性測試器及接合機構之上方,以供對射頻電子元件20執行無線訊號測試作業。Please refer to FIGS. 9 , 10 , and 11 . Taking the test of an electronic component that is an RF
電性測試器以複數支探針53承置射頻電子元件20,接合機構之複數個夾爪42位於射頻電子元件20之下方,並供射頻電子元件20之接點21置入複數個夾爪42之夾口423,由於第三壓缸44尚未驅動承板41及複數個夾爪42作動,複數個夾爪42之第二端422並未接觸射頻電子元件20之接點21;當第三壓缸44驅動承板41及複數個夾爪42由初始位置沿壓接軸向B(如Z方向)向下位移至夾持位置時,複數個夾爪42受推抵具43之頂推部432頂抵導引作彈性向內擺動,以縮小夾口423,使複數個夾爪42之第二端422夾持射頻電子元件20之接點21;當第三壓缸44繼續驅動承板41及複數個夾爪42由夾持位置沿壓接軸向B向下位移至壓接位置時,複數個夾爪42向下拉動射頻電子元件20沿壓接軸向B向下位移,使射頻電子元件20之接點21以預設下壓力下壓測試座52之探針53而執行電性測試作業;然接合機構之複數個夾爪42配置於射頻電子元件20之下方,可防止屏蔽射頻電子元件20頂面之天線22,以利於射頻電子元件20頂面之天線22與天線測試器54進行無線訊號測試作業,進而提升測試品質。The electrical tester uses a plurality of probes 53 to support the RF electronic component 20 , the plurality of jaws 42 of the joint mechanism are located below the RF electronic component 20 , and the contacts 21 of the RF electronic component 20 are placed in the plurality of jaws 42 Since the third pressure cylinder 44 has not yet driven the support plate 41 and the plurality of clamping jaws 42 to act, the second ends 422 of the plurality of clamping jaws 42 are not in contact with the contacts 21 of the radio frequency electronic component 20; When the cylinder 44 drives the support plate 41 and the plurality of clamping jaws 42 to move downward from the initial position to the clamping position along the crimping axis B (such as the Z direction), the plurality of clamping jaws 42 are pushed against the pushing portion 432 of the tool 43 The abutting guide swings elastically inward to reduce the clamping opening 423, so that the second ends 422 of the plurality of clamping jaws 42 clamp the contact point 21 of the RF electronic component 20; when the third pressing cylinder 44 continues to drive the support plate 41 and When the plurality of clamping jaws 42 are displaced downward from the clamping position along the crimping axis B to the crimping position, the plurality of clamping jaws 42 pull down the radio frequency electronic component 20 and move downward along the crimping axis B, so that the radio frequency electronic component is displaced downward along the crimping axis B. The
請參閱圖8、12,本發明接合機構之第二實施例,其相同第一實施例包含承板41、夾具組、推抵具43及驅動單元;第二實施例與第一實施例之差異在於驅動單元設有另一驅動器,另一驅動器為第四驅動器,以驅動推抵具43沿壓接軸向B或第二推抵軸向(如X方向)位移;於本實施例,驅動單元之第四驅動器為第四壓缸45,第四壓缸45之活塞桿連結推抵具43,以驅動推抵具43沿壓接軸向B(如Z方向)向上位移,推抵具43以頂推部432頂抵導引複數個夾爪42彈性向內擺動,使複數個夾爪42之第二端422夾持射頻電子元件之接點,驅動單元以第三壓缸44帶動承板41及複數個夾爪42向下拉動射頻電子元件沿壓接軸向B向下位移,使射頻電子元件之接點以預設下壓力下壓測試座52之探針53而執行電性測試作業。Please refer to FIGS. 8 and 12 , the second embodiment of the joint mechanism of the present invention, which is the same as the first embodiment includes a
請參閱圖7~11、13,本發明接合機構應用於測試設備之示意圖,於本實施例,測試設備應用測試射頻電子元件;測試設備包含機台30、供料裝置60、收料裝置70、具本發明接合機構之測試裝置10、輸送裝置80及中央控制裝置(圖未示出);供料裝置60配置於機台30上,並設有至少一容納待測電子元件(如射頻電子元件)之供料承置器61;收料裝置70配置於機台30上,並設有至少一容納已測電子元件之收料承置器71;測試裝置10配置於機台30上,包含電性測試器及本發明接合機構,電性測試器以供對電子元件執行電性測試作業
,本發明接合機構以供驅動電子元件壓接電性測試器;於本實施例,機台30之第一側及第二側分別配置測試裝置10,測試裝置10更包含天線測試器,以供對射頻電子元件執行無線訊號測試作業;輸送裝置80配置於機台30上,並設有至少一輸送器,以供輸送電子元件,於本實施例,輸送裝置80設有作X-Y-Z方向位移之第一輸送器81,第一輸送器81於供料裝置60取出待測之射頻電子元件,並移入二為載台之第二輸送器82,一第三輸送器83於第二輸送器82與測試裝置10間取放待測射頻電子元件及已測射頻電子元件,第一輸送器81再於第二輸送器82取出已測之射頻電子元件,並依測試結果,將已測之射頻電子元件移載至收料裝置70而分類收置;中央控制裝置用以控制及整合各裝置作動,以執行自動化作業,達到提升作業效能之實用效益。
Please refer to FIGS. 7-11 and 13 , which are schematic diagrams of the application of the joint mechanism of the present invention to testing equipment. In this embodiment, the testing equipment is used to test RF electronic components; the testing equipment includes a machine 30 , a feeding device 60 , a receiving device 70 , The testing device 10, the conveying device 80 and the central control device (not shown in the figure) are provided with the joint mechanism of the present invention; the feeding device 60 is arranged on the machine table 30, and is provided with at least one accommodating electronic component (such as a radio frequency electronic component) to be tested ) of the feeding holder 61; the receiving device 70 is arranged on the machine 30, and is provided with at least one receiving holder 71 for accommodating the tested electronic components; the testing device 10 is arranged on the machine 30, including electrical Electrical tester and joint mechanism of the present invention, electrical tester for performing electrical testing on electronic components
, the joint mechanism of the present invention is used for driving the electronic components to crimp the electrical tester; in this embodiment, the first side and the second side of the machine 30 are respectively equipped with a test device 10, and the test device 10 further includes an antenna tester for The wireless signal test operation is performed on the radio frequency electronic components; the conveying device 80 is arranged on the machine table 30 and is provided with at least one conveyor for conveying the electronic components. A
然,上述測試設備之測試裝置可將本發明之測試機構取代接合機構,本發明之另一測試設備(圖未示出),包含機台、供料裝置、收料裝置、具本發明測試機構之測試裝置、輸送裝置及中央控制裝置;供料裝置配置於機台上,並設有至少一容納待測電子元件之供料承置器;收料裝置配置於機台上,並設有至少一容納已測電子元件之收料承置器;測試裝置配置於機台上,包含本發明測試機構,以供測試電子元件;輸送裝置配置於機台上,並設有至少一輸送器,以輸送電子元件;中央控制裝置以供控制及整合各裝置作動,而執行自動化作業。Of course, the test device of the above-mentioned test equipment can replace the joint mechanism with the test mechanism of the present invention. Another test equipment of the present invention (not shown in the figure) includes a machine, a feeding device, a receiving device, and a test mechanism of the present invention. testing device, conveying device and central control device; the feeding device is arranged on the machine table, and is provided with at least one feeding holder for accommodating the electronic components to be tested; the receiving device is arranged on the machine table, and is provided with at least one A receiving device for accommodating the tested electronic components; the testing device is arranged on the machine table, including the testing mechanism of the present invention, for testing the electronic components; the conveying device is arranged on the machine table, and is provided with at least one conveyor to Conveying electronic components; central control device for controlling and integrating the actions of various devices to perform automated operations.
10:測試裝置 11:電路板 12:夾爪 121:第一端 122:第二端 123:夾口 13:推抵具 131:第一通孔 132:頂推部 14:第一壓缸 141:托板 15:天線測試器 16:第二壓缸 20:射頻電子元件 21:接點 22:天線 30:機台 41:承板 411:第二通孔 42:夾爪 421:第一端 422:第二端 423:夾口 43:推抵具 431:第一通孔 432:頂推部 44:第三壓缸 45:第四壓缸 51:電路板 52:測試座 53:探針 54:天線測試器 A:第一推抵軸向 B:壓接軸向 60:供料裝置 61:供料承置器 70:收料裝置 71:收料承置器 80:輸送裝置 81:第一輸送器 82:第二輸送器 83:第三輸送器 10: Test device 11: circuit board 12: Gripper 121: First End 122: Second End 123: Clip 13: Pusher 131: first through hole 132: Pushing Department 14: The first cylinder 141: pallet 15: Antenna Tester 16: The second cylinder 20: RF Electronic Components 21: Contact 22: Antenna 30: Machine 41: Bearing plate 411: second through hole 42: Gripper 421: First End 422: Second End 423: Clip 43: Pusher 431: first through hole 432: Pushing Department 44: The third cylinder 45: Fourth cylinder 51: circuit board 52: Test seat 53: Probe 54: Antenna Tester A: The first push against the axial direction B: Crimp Axial 60: Feeding device 61: Feed holder 70: Receiving device 71: Receiving holder 80: Conveying device 81: First Conveyor 82: Second conveyor 83: Third Conveyor
圖1:本發明測試機構第一實施例之示意圖。 圖2:係圖1之局部放大示意圖。 圖3:本發明測試機構第一實施例之使用示意圖。 圖4:係圖3之局部動作示意圖(一)。 圖5:係圖3之局部動作示意圖(二)。 圖6:本發明測試機構第二實施例之示意圖。 圖7:本發明接合機構第一實施例之示意圖。 圖8:係圖7之局部放大示意圖。 圖9:本發明接合機構第一實施例之使用示意圖。 圖10:係圖9之局部動作示意圖(一)。 圖11:係圖9之局部動作示意圖(二)。 圖12:本發明接合機構第二實施例之示意圖。 圖13:本發明接合機構應用於測試設備之示意圖。 FIG. 1 is a schematic diagram of the first embodiment of the testing mechanism of the present invention. FIG. 2 is a partial enlarged schematic view of FIG. 1 . FIG. 3 is a schematic diagram of the use of the first embodiment of the testing mechanism of the present invention. Figure 4: It is a schematic diagram (1) of the partial action of Figure 3 . Figure 5: It is a schematic diagram (2) of the partial action of Figure 3 . FIG. 6 is a schematic diagram of the second embodiment of the testing mechanism of the present invention. FIG. 7 is a schematic diagram of the first embodiment of the joint mechanism of the present invention. FIG. 8 is a partially enlarged schematic view of FIG. 7 . FIG. 9 is a schematic diagram of the use of the first embodiment of the joint mechanism of the present invention. Fig. 10 is a schematic diagram (1) of the partial action of Fig. 9 . Fig. 11: It is a schematic diagram (2) of the partial action of Fig. 9 . FIG. 12 is a schematic diagram of the second embodiment of the joint mechanism of the present invention. Fig. 13: A schematic diagram of the application of the joint mechanism of the present invention to a testing device.
10:測試裝置 10: Test device
20:射頻電子元件 20: RF Electronic Components
21:接點 21: Contact
22:天線 22: Antenna
44:第三壓缸 44: The third cylinder
54:天線測試器 54: Antenna Tester
Claims (7)
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US20030171021A1 (en) * | 2002-03-11 | 2003-09-11 | Enplas Corporation | Socket for electrical parts |
CN2648630Y (en) * | 2003-09-23 | 2004-10-13 | 佶鸿电子股份有限公司 | Socket type connector |
US20070243727A1 (en) * | 2006-04-13 | 2007-10-18 | Enplas Corporation | Socket for electrical parts |
TW200933989A (en) * | 2007-12-27 | 2009-08-01 | Yamaichi Electronics Co Ltd | Semiconductor device socket |
TWI703333B (en) * | 2019-08-16 | 2020-09-01 | 鴻勁精密股份有限公司 | Test device for electronic component with antenna and test equipment for its application |
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US20030171021A1 (en) * | 2002-03-11 | 2003-09-11 | Enplas Corporation | Socket for electrical parts |
CN2648630Y (en) * | 2003-09-23 | 2004-10-13 | 佶鸿电子股份有限公司 | Socket type connector |
US20070243727A1 (en) * | 2006-04-13 | 2007-10-18 | Enplas Corporation | Socket for electrical parts |
TW200933989A (en) * | 2007-12-27 | 2009-08-01 | Yamaichi Electronics Co Ltd | Semiconductor device socket |
TWI703333B (en) * | 2019-08-16 | 2020-09-01 | 鴻勁精密股份有限公司 | Test device for electronic component with antenna and test equipment for its application |
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