KR20050084137A - Pressing member and electronic component handling device - Google Patents

Abstract

An electronic component handling device, wherein a first spring (54) is installed between a support member (51) and a heat block (53) driven in Z-axis direction to energize the support member (51) and the heat block (53) in a direction apart from each other, and a second spring (57) is installed between a first pusher (55) pressing the die (81) of an IC device (8) and a second pusher (56) pressing the substrate (82) of the IC device (8) to energize the first pusher (55) and the second pusher (56) in a direction apart from each other, whereby the device can cope with a change in type of electronic components, can improve a surface copying, and can uniformly press the electronic components with an accurate load.

Description

TECHNICAL FIELD [0001] The present invention relates to a pressing member and an electronic component handling device,

The present invention relates to an apparatus for testing an electronic component such as an IC device, comprising: a pressing member capable of pressing an electronic component by varying a load according to a position of the electronic component; and an electronic component handling apparatus having such a pressing member .

BACKGROUND ART [0002] In the process of manufacturing an electronic device such as an IC device, an electronic device testing device for testing the performance or function of a finally manufactured IC device or an intermediate stage device is required.

For example, testing of an IC device using an electronic component testing apparatus is performed as follows. After the IC device is transported in the direction of the upper part of the test head with the socket, the IC device is pressurized and mounted on the socket, so that the connection terminal of the socket and the external terminal of the IC device under test are brought into contact. As a result, the device under test (IC) is electrically connected to the tester body through a socket, a test head, and a cable. Then, a test signal supplied from the tester body to the test head through a cable is applied to the IC device under test, and a response signal read out from the IC device under test is sent to the tester body through the test head and the cable, Measure the electrical properties.

This test is often performed by applying thermal stress to the IC device under test. As a method of applying heat stress to the IC device to be tested, for example, a method of preheating the IC device to a predetermined set temperature before transporting the IC device to the test head is used. Further, A heater is provided in an apparatus that conveys the IC device under test so that the IC device is heated.

Here, depending on the type of the IC device to be tested, the portion of the die (IC chip) constituting the integrated circuit is prevented from being destroyed by the overload during pressing, and the substrate portion of the IC device It is necessary to prevent the contact failure (contact failure with the connection terminal of the socket) due to a certain large load. That is, the pressing load may have to be changed at the die portion of the IC device and other substrate portions. Furthermore, since the temperature is a problem in practical use because it is the die part of the IC device under test, it is preferable that thermal stress is given to the die in particular.

Therefore, conventionally, as shown in Fig. 5, the IC device is adsorbed and pressurized by the IC device adsorption device provided with the adsorption / depression portion 15P. The conventional attracting / pressing part 15P includes a support member 51P driven by the Z-axis actuator in the Z-axis direction, a joint member 52P provided on the lower side periphery of the support member 51P, A first pusher 55P for pressing the die 81 of the IC device 8 provided on the lower side of the heat block 53P and a second pusher 55P for pressing the joint member 52P And a second pusher 56P provided on the lower side of the IC device 8 for pressing the substrate 82 of the IC device 8. The IC device 8 is provided with a first pusher 55P which is in contact with the heat block 53P, The temperature of the IC device 8 is controlled and the load is controlled by applying pressure to the substrate 82 of the IC device 8 with the second pusher 56P Prevention of contact failure with respect to the substrate 82).

However, in the case of testing the IC devices 8 of different kinds in the adsorption / pressing section 15P having the above-described configuration, the respective members must be modified or changed in order to correspond to the respective IC devices 8 , The operation was costly and time consuming. The surface matching between the lower surface of the heat block 53P and the upper surface of the first pusher 55P and the surface matching between the lower surface of the first pusher 55P and the upper surface of the die 81 of the IC device 8 are secured It is not possible to press uniformly with a correct load on the die 81 of the delicate IC device 8 and the die of the IC device 8 from the heat block 53 through the first pusher 55 81, the temperature control of the die 81 could not be reliably performed.

Therefore, as shown in Fig. 6, it has been proposed to provide a spring 54P for exerting a force between the support member 51P and the heat block 53P in a direction separating the support member 51P and the heat block 53P. In the suction / depression portion 15P 'having such a configuration, the load on the die 81 of the IC device 8 can be managed with a certain width by the elastic action of the spring 54P, It may be possible to cope with the change of the kind of the IC device 8 without changing each member. However, when the load can not be managed by the same spring 54P, the spring 54P needs to be changed, and the replacement of the spring 54P is very troublesome.

In addition, the problem caused by the problem of the misalignment due to the elastic action of the spring 54P is improved to some extent, but the surface registration between the lower surface of the heat block 53P and the upper surface of the first pusher 55P, It has not been possible to ensure that all of the surface matching between the lower surface and the upper surface of the die 81 of the IC device 8 is ensured and uniform pressurization by a correct load and reliable temperature control are not achieved.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances and provides a pressing member and an electronic component handling device capable of coping with a variety of electronic components and improving surface registration and capable of uniformly pressing an electronic component with an accurate load .

In order to achieve the above object, the present invention provides a pressing member for pressing a terminal of a test electronic device to a contact portion of a test head in an electronic part handling apparatus, A first pressing member which is pressed by a member to press the first portion of the electronic component (e.g., a die of the IC device), and a second pressing member which is pressed by the body side second pressing member to press the second portion of the electronic component Wherein the first pressing member and the second pressing member are elastically connected to each other in a pressing / retreating direction (1) .

In the invention (1), since the pressing load on the first portion and the pressing load on the second portion of the electronic component can be separately managed by the first pressing member and the second pressing member, for example, It is possible to pressurize the die portion of the IC device with a load that does not damage the integrated circuit and to apply a load capable of preventing contact failure to the substrate portion of the IC device.

Particularly, in the invention (1), the first pressing member is pressed by the first pressing member on the body side applying an elastic force in the pressing direction, and the first pressing member and the second pressing member are elastically The surface matching between the first pressing member on the main body side and the first pressing member and the surface matching between the first pressing member and the electronic component are ensured and accordingly the first portion of the electronic component is accurately loaded And can be uniformly pressed in the plane direction. In the present specification, surface matching refers to uniform contact of a certain plane with another plane in the plane direction.

Further, since the first pressing member and the second pressing member are resiliently connected in the pressing / retreating direction, the load on the electronic component can be managed with a certain width, so that the first pressing member and the second pressing member It is possible to cope with the change of the kind of the electronic part without changing it. If the load can not be controlled by the elastic force between the first pressing member and the second pressing member, it is possible to cope with the change of the kind of the electronic component by changing the elastic force. In a case where the load has to be significantly changed by changing the kind of the electronic component, it is possible to cope with the change by changing the elastic force for pressing the first pressing member on the main body side.

In the invention (1), it is preferable that an elastic member is provided between the first pressing member and the second pressing member so as to exert a force in a direction separating the first pressing member and the second pressing member. According to the present invention (2), the first pressing member and the second pressing member can be elastically connected in the pressing / retracting direction by a simple member structure. However, the invention (1) is not limited to this configuration.

In the above invention (1, 2), the main body side first pressing member may have a temperature control function capable of controlling the temperature of the first pressing member (3). For example, the temperature of the first pressing member can be controlled by using the first pressing member on the body side as a heating source by a heater or the like, or by using a cooling element or a cooling fin as a cooling source.

According to the invention (3), the temperature of the portion pressed by the first pressing member in the electronic component can be controlled, and the test at the set temperature can be performed. As described above, since the surface matching between the first pressing member on the body side and the first pressing member and the surface matching between the first pressing member and the electronic component are ensured, the first pressing member The heat conduction to the electronic component through the heat conduction is excellent, so that the partial temperature control of the electronic component can be reliably performed.

It is preferable that the pressing member is detachably attached to the main body side of the electronic part handling device having the main body side first pressing member and the main body side second pressing member. With this configuration, even when the load can not be managed by the elastic force between the first pressing member and the second pressing member in changing the kind of the electronic component, the pressing members (the first pressing member and the second pressing member) are exchanged It is possible to cope with the change of the kind of the electronic part very easily by changing the elasticity.

Secondly, the present invention is an electronic part handling device capable of pushing a terminal of a test electronic part to a contact part of a test head for testing an electronic part, and a first part of the electronic part (for example, a die of the IC device) A second pressing member which presses the second portion of the electronic component (for example, a substrate of the IC device), and a second pressing member which presses the first pressing member in a pressing direction Side first pressing member and a main body side second pressing member for pressing the second pressing member, characterized in that the first pressing member and the second pressing member are resiliently connected in the pressing / retreating direction (5).

In the invention (5), since the pressing load on the first portion and the pressing load on the second portion of the electronic component can be separately managed by the first pressing member and the second pressing member, for example, It is possible to pressurize the die portion of the IC device with a load that does not damage the integrated circuit and to apply a load capable of preventing contact failure to the substrate portion of the IC device.

Particularly, in the invention (5), the first pressing member is pressed by the first pressing member on the side of the main body to which an elastic force is applied in the pressing direction, and the first pressing member and the second pressing member are elastically The surface matching between the first pressing member on the body side and the first pressing member and the surface matching between the first pressing member and the electronic component are ensured and an accurate load is applied to the first portion of the electronic component It can be uniformly pressed in the plane direction.

Further, since the first pressing member and the second pressing member are elastically connected in the pressing / retreating direction, the load on the electronic component can be managed with a certain width, so that the first pressing member and the second pressing member can be changed It is possible to cope with the change of the kind of the electronic parts. When the load can not be controlled by the elastic force between the first pressing member and the second pressing member, the elastic force can be changed to cope with the change of the kind of the electronic component. When it is necessary to largely change the load due to the kind change of the electronic component, it is possible to cope with the change by changing the elastic force for pressing the main body side first pressing member.

In the invention (5), it is preferable that an elastic member is provided between the first pressing member and the second pressing member so as to exert a force in a direction separating the first pressing member and the second pressing member. According to the present invention (6), the first pressing member and the second pressing member can be elastically connected in the pressing / retreating direction by a simple member constitution. However, the invention (5) is not limited to such a configuration.

In the above invention (5, 6), it is preferable that a space between the main body side first pressing member and the main body side first pressing member and the main body side first pressing member It is preferable that an elastic member which applies a force in the direction of the arrow (7) is provided. According to the present invention (7), it is possible to exert an elastic force in the pressing direction on the main body side first pressing member with a simple structure. However, the invention (5, 6) is not limited to this configuration.

In the invention (5 to 7), the main body side first pressing member may have a temperature control function capable of controlling the temperature of the first pressing member (8). According to the present invention (8), in the electronic component, the temperature of the portion to be pressed by the first pressing member can be controlled and the test can be performed at the set temperature. As described above, since the surface matching between the first pressing member on the body side and the first pressing member and the surface matching between the first pressing member and the electronic component are ensured, the first pressing member So that the partial heat control of the electronic component can be reliably performed.

In the above-described invention (5 to 8), the pressing member having the first pressing member and the second pressing member is provided with the electronic component handling apparatus having the main body side first pressing member and the main body side second pressing member (9). ≪ RTI ID = 0.0 > (9) < / RTI > With this configuration, even when the load can not be managed by the elastic force between the first pressing member and the second pressing member in changing the kind of the electronic component, the pressing members (the first pressing member and the second pressing member) are exchanged It is possible to cope with the change of the kind of the electronic part very easily by changing the elasticity.

Brief Description of Drawings

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing an electronic component testing apparatus to which an electronic component testing and handling apparatus according to an embodiment of the present invention is applied.

Fig. 2 is a partial sectional view (A-A cross-sectional) side view of the electronic component testing apparatus in Fig. 1;

3 is a cross-sectional view (B-B cross-sectional view in Fig. 1) showing in detail the contact portion of the test head in the electronic component testing apparatus.

4 is a cross-sectional view showing in detail an adsorption / pressing section in an electronic part test handling apparatus according to the embodiment;

5 is a sectional view showing in detail a suction / depression part in a conventional electronic part test handling device.

6 is a cross-sectional view showing in detail a suction / depression part in another conventional electronic part test handling device.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

1 and 2, an electronic component testing apparatus 1 includes an electronic component handling apparatus (hereinafter referred to as a "handler") 10, a test head 20, and a tester main body 30, The test head 20 and the tester main body 30 are electrically connected to each other through a cable 40.

The handler 10 is provided with an empty tray 101, a supply tray 102, a sorting tray 103, two XY transport devices 104 and 105, a heat plate 106, And two buffer units 108 are provided. The opening portion 110 is formed in the substrate 109 and the opening portion 110 of the substrate 109 is formed on the contact portion 201 of the test head 20 disposed on the back side of the handler 10 as shown in Fig. So that the IC device 8 is mounted.

The electronic component testing apparatus 1 is a system in which an IC device (an example of an electronic component) 8 mounted on a supply tray 102 of a handler 10 before testing is sequentially driven by two XY transport apparatuses 104 and 105 The IC device 8 is brought into close contact with the contact portion 201 of the test head 20 by the XY transport device 105 on one side and the IC device 8 is tested through the test head 20 and the cable 40 The IC device 8 after the test is stored in the sorting tray 103 according to the test result. Hereinafter, each device will be described.

The XY transport apparatus 104 on one side includes two rails 104a provided along the X axis direction, a rail 104b movably attached to the two rails 104a along the Y axis direction, An attachment base 104c movably attached to the attachment base 104c, and two IC device adsorption devices 104d attached to the attachment base 104c. The IC device adsorbing device 104d is capable of moving from the sorting tray 103 to the supply tray 102 and the feed tray 104b in the X axis direction since the rail 104b can move in the X axis direction and the attachment base 104c can move in the Y axis direction. The empty tray 101, the heat plate 106, and the two buffer portions 108. In this case,

2 and 3, a suction unit 14 capable of suctioning the IC device 8 is provided at the lower end of the IC device suction device 104d, and the suction unit 14 is connected to the Z- And is movable in the Z-axis direction (that is, in the vertical direction) through the rod by an actuator (not shown).

In this embodiment, since two IC device adsorption devices 104d are provided on the attachment base 104c, it is possible to adsorb, transport, and liberate two IC devices 8 at a time.

The other XY transport apparatus 105 includes two rails 105a provided along the X-axis direction, a rail 105b movably attached to two rails 105a along the Y-axis direction, a rail 105b An attachment base 105c movably attached to the attachment base 105c, and two IC device adsorption devices 105d attached to the attachment base 105c. The IC device adsorption apparatus 105d is provided between the two buffer units 108 and the test head 20 because the rail 105b is movable in the X axis direction and the attachment base 105c is movable in the Y axis direction. Can be moved.

2 and 3, the IC device 8 is sucked to the lower end of the IC device sucking device 105d and the sucked IC device 8 is pushed to the contact portion 201 of the test head 20 The adsorption / press unit 15 is movable in the Z-axis direction (that is, in the up-down direction) through the rod 151 by a Z-axis actuator (not shown) .

Further, in the present embodiment, since two IC device adsorption devices 105d are provided on the attachment base 105c, it is possible to adsorb, transport, pressurize, and release two IC devices 8 at a time.

The two buffer units 108 are configured to be reciprocally movable between the operating regions of the two X-Y transport apparatuses 104 and 105 by a rail 108a and an actuator (not shown). 1, the buffer unit 108 on the upper side carries out the operation of transferring the IC device 8 carried from the heat plate 106 to the test head 20, and the buffer unit 108 Performs an operation of pulling out the IC device 8 which has been tested by the test head 20. Due to the presence of these two buffer units 108, the two X-Y transport apparatuses 104 and 105 can operate simultaneously without interfering with each other.

The supply tray 102 provided in the operation region of the XY transport apparatus 104 on the substrate 109 is a tray on which the IC device 8 before the test is mounted and the sort tray 103 is connected to the IC device 8 ) Are sorted into categories according to the test results and stored. In this embodiment, four sorting trays 103 are provided.

The heat plate 106 provided on the substrate 109 is a metal plate having a heater for example and a plurality of recesses 106a for dropping the IC device 8 are formed, The IC device 8 before the test is transferred from the supply tray 102 to the transfer tray 106a by the XY transfer device 104. [ The heat plate 106 is a heating source for applying a predetermined thermal stress to the IC device 8. The IC device 8 is heated to a predetermined temperature at the heat plate 106 and then heated to a predetermined temperature And is mounted on the contact portion 201 of the test head 20 through the buffer portion 108.

3, a socket 202 having a probe pin 202a, which is a connection terminal, is fixed to the contact portion 201 of the test head 20. As shown in Fig. The probe pins 202a are provided at a number and a pitch corresponding to the connection terminals of the IC device 8 and are elastically urging upward. The probe pin 202a is electrically connected to the tester main body 30 through the test head 20.

3, a socket guide 203 having an opening portion 203a and a guide pin 203b is mounted on the socket 202, and the socket guide 203 is sucked and held by the sucking / pressing portion 15 of the IC device sucking device 105d The held IC device 8 is brought into close contact with the socket 202 through the opening 203a of the socket guide 203. [ At this time, the guide pin 203b provided in the socket guide 203 is inserted into the guide hole 152a formed in the pusher base 152 to which the attracting / pressing part 15 of the IC device adsorption device 105d is fitted, The IC device 8 and the socket 202 are aligned with each other.

4, the suction / depression portion 15 of the IC device adsorption device 105d includes a support member 51 attached to the distal end portion of the rod 151 and driven in the Z-axis direction, A heat block 53 provided at a central portion of the lower side of the support member 51 and a heat block 53 provided at the lower side of the heat block 53 and provided on the die And a second pusher 56 provided on the lower side of the joint member 52 for pressing the substrate 82 of the IC device 8. The first pusher 55 presses the first pusher 81 against the first pusher 55,

A first spring 54 is provided between the support member 51 and the heat block 53. The first spring 54 urges the support member 51 and the heat block 53 in a direction I am applying force.

A convex portion 551 protruding toward the second pusher 56 is formed on the upper portion of the first pusher 55. A convex portion 561 protruding toward the first pusher 55 is formed on the lower portion of the second pusher 56, Respectively. A second spring 57 is provided between the convex portion 551 of the first pusher 55 and the convex portion 561 of the second pusher 56. The second spring 57 is disposed between the convex portion 551 of the first pusher 55 and the convex portion 561 of the second pusher 56, So that the pusher 55 and the second pusher 56 are urged in directions away from each other.

It is also preferable that the spring rate of the first spring 54 is set to be stronger than the spring rate of the second spring 57.

The heat block 53 is a heating source capable of heating the first pusher 55 and the IC device 8 is heated so that the temperature of the IC device 8 heated by the heat plate 106 is not lowered during the conveying process And is maintained at a predetermined temperature. However, in the case where the heat stress test is performed under a cooling condition other than the heating condition, or when the IC device 8 is heated to a temperature higher than the set temperature by self heat generation, the first pusher 55 is used instead of the heat block 53, Can be used as the cooling source.

The first pusher 55 and the second pusher 56 are detachably attached to the main body side having the support member 51, the joint member 52 and the heat block 53 as the change kit 58 . The method of detachably attaching the change kit 58 is not particularly limited, and for example, a method using a buckle may be adopted.

The pressing load applied to the die 81 of the IC device 8 by the first pusher 55 and the pressing force applied to the IC device 8 by the second pusher 56 is reduced, The pressure load on the substrate 82 can be separately managed. That is, the die 81 of the IC device 8 is pressed with a load that does not damage the integrated circuit, and the substrate 82 of the IC device 8 can be pressed with a load capable of preventing contact failure have.

The first spring 54 provided between the support member 51 and the heat block 53 applies a force to the heat block 53 to the lower side, Since the second spring 57 provided between the first pusher 55 and the second pusher 56 exerts the first pusher 55 to the upper side and the second pusher 56 to the lower side, The surface matching between the lower surface and the upper surface of the first pusher 55 and the surface matching between the lower surface of the first pusher 55 and the upper surface of the die 81 of the IC device 8 are secured. It is possible to uniformly press the die 81 of the delicate IC device 8 with the correct load in the planar direction while simultaneously pressing the die of the IC device 8 through the first pusher 55 from the heat block 53, The heat conduction to the die 81 becomes excellent and the temperature control of the die 81 can be reliably performed.

The load on the die 81 of the IC device 8 is controlled to some extent by the elastic action of the second spring 57 provided between the first pusher 55 and the second pusher 56 It is possible to cope with the change of the type of the IC device 8 without changing the first pusher 55 and the second pusher 56 (change kit 58). When the load can not be managed by the same second spring 57, the second spring 57 is changed, specifically, the second spring 57 having a spring rate capable of managing the load By changing to the change kit 58, it is possible to cope with the change of the kind of the IC device 8. The change of the change kit 58 can be performed much more easily than the change of the first spring 54 provided on the main body side. However, in the case where the load has to be significantly changed by changing the kind of the IC device 8, it is possible to cope with the change by changing the first spring 54.

Hereinafter, the operation of the electronic component testing apparatus 1 will be described taking the case where the IC device 8 is tested under high temperature conditions.

The IC device adsorbing device 104d of the XY transport device 104 is provided with the concave portion 106a of the heat plate 106 for holding and holding the IC device 8 before the test mounted on the supply tray 102 of the handler 10, And releases the IC device 8 on the concave portion 106a. The IC device 8 is heated to a predetermined temperature by being left in the heat plate 106 for a predetermined time. The IC device adsorption device 104d of the XY transport device 104 adsorbs and holds the IC device 8 heated to a predetermined temperature by the heat plate 106 to be adsorbed on the left end of the rail 108a To the buffer unit 108, and releases the IC device 8 on the buffer unit 108.

The buffer unit 108 in which the IC device 8 is loaded moves to the right end of the rail 108a in Fig. The IC device adsorption apparatus 105d of the X-Y transport apparatus 105 adsorbs and holds the IC device 8 on the buffer unit 108 that has been moved and transfers the IC device 8 to the contact section 201 of the test head 20. The IC device adsorption device 105d of the X-Y transport device 105 pushes the IC device 8 to the socket 202 of the contact portion 201 through the opening 110 of the substrate 109. Then,

At this time, the sucking / pressing part 15 of the IC device adsorption device 105d presses the die 81 of the IC device 8 by the first pusher 55 and presses the die 81 of the IC device 8 by the second pusher 56 The substrate 81 of the IC device 8 and the substrate 82 of the IC device 8 can be pressed by the respective loads. Since the first spring 54 and the second spring 57 are provided in the attraction / depression portion 15, the die 81 of the IC device 8 can be uniformly It is possible to pressurize.

Since the adsorption / depression portion 15 of the IC device adsorption device 105d is provided with the heat block 53, the first pusher 55 is heated by setting the heat block 53 at a high temperature, The temperature of the IC device 8 heated by the heater 106 can be prevented from lowering. Since the first spring 54 and the second spring 57 are provided on the suction / depression portion 15, the temperature control of the die 81 of the IC device 8 is reliably performed as described above can do.

The suction and depression 15 of the IC device adsorption device 105d pushes the IC device 8 to the socket 202 of the contact portion 201 and the external terminal 83 of the IC device 8 contacts the socket 202 The test signal is applied to the IC device 8 from the tester main body 30 through the test head 20. The response signal read out from the IC device 8 is sent to the tester main body 30 through the test head 20 so that the performance or function of the IC device 8 is tested.

When the test of the IC device 8 is completed, the IC device adsorption device 105d of the XY transport device 105 places the tested IC device 8 on the buffer 108 located at the right end of the rail 108a And the buffer unit 108 moves to the left end in Fig. The IC device adsorption device 104d of the X-Y transport device 104 adsorbs and holds the tested IC device 8 from the buffer part 108 and stores the IC device 8 in the sorting tray 103 according to the test result.

The embodiments described above are described for the purpose of facilitating understanding of the present invention and are not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design modifications and equivalents falling within the technical scope of the present invention.

For example, instead of the first spring 54 and / or the second spring 57, an elastic body such as rubber or thermoplastic elastomer may be used.

INDUSTRIAL APPLICABILITY As described above, according to the pressing member and the electronic part handling apparatus of the present invention, it is possible to cope with the change of the kind of the electronic part, and the electronic part can be uniformly pressed with the correct load by improving the surface matching. That is, the pushing member and the electronic component handling apparatus of the present invention are useful for performing testing of various kinds of electronic components that require accurate load management.

Claims (9)

A pressing member for pushing a terminal of a test electronic component to a contact portion of a test head in an electronic component handling apparatus, A first pressing member which is pressed by a first pressing member on the body side applying an elastic force in a pressing direction and presses the first portion of the electronic component and a second pressing member which is pressed by the body side second pressing member to press the second portion of the electronic component And a second pressing member, And the first pressing member and the second pressing member are resiliently connected in the pressing / retracting direction. The method according to claim 1, Wherein an elastic member is provided between the first pressing member and the second pressing member for applying a force in a direction separating the first pressing member and the second pressing member. 3. The method according to claim 1 or 2, Wherein the main body side first pressing member has a temperature control function capable of controlling the temperature of the first pressing member. 4. The method according to any one of claims 1 to 3, Wherein the pressing member is detachably attached to a main body side of the electronic part handling device having the main body side first pressing member and the main body side second pressing member. An electronic part handling device capable of pushing a terminal of a test electronic component to a contact portion of a test head for testing the electronic component, A first pressing member for pressing the first portion of the electronic component, A second pressing member for pressing the second portion of the electronic component, Side first pressing member to which an elastic force is applied in a pressing direction for pressing the first pressing member, Side second pressing member for pressing the second pressing member, And the first pressing member and the second pressing member are resiliently connected in the pressing / retracting direction. 6. The method of claim 5, Wherein an elastic member is provided between the first pressing member and the second pressing member so as to apply a force in a direction separating the first pressing member and the second pressing member. The method according to claim 5 or 6, A third pressing member for pressing the main body side first pressing member and the main body side second pressing member and an elastic member for applying a force in a direction for separating the first pressing member and the second pressing member from the main body side first pressing member Wherein said electronic component handling device comprises: 8. The method according to any one of claims 5 to 7, Wherein the main body side first pressing member has a temperature control function capable of controlling the temperature of the first pressing member. 9. The method according to any one of claims 5 to 8, Wherein the pressing member having the first pressing member and the second pressing member is detachably attached to the main body side of the electronic component handling apparatus having the main body side first pressing member and the main body side second pressing member Wherein the electronic component handling device comprises: