WO2006040797A1

WO2006040797A1 - Electronic component handling apparatus and method for correcting electronic component position shift

Info

Publication number: WO2006040797A1
Application number: PCT/JP2004/014920
Authority: WO
Inventors: Haruki Nakajima; Toshiyuki Kiyokawa
Original assignee: Advantest Corporation
Priority date: 2004-10-08
Filing date: 2004-10-08
Publication date: 2006-04-20
Also published as: JPWO2006040797A1; JP4825133B2

Abstract

An IC device (2) is held by suction by a suction pad (501e) of a suction part (501d) of a movable head part (501c) of a loader part transporting apparatus (501). In a recessed part (502c) of a buffer stage (502a), after the IC device (2) is positioned in the vicinity of an inner wall (501f) of the recessed part (502c), the movable head part (501c) is slightly moved in an X axis positive direction, and one side of the IC device (2) held by suction by the suction pad (501e) of the suction part (501d) is made to abut on the inner wall (501f) of the recessed part (502c) of the buffer stage (502a), and inclination of the IC device (2) in θ direction is corrected. Then, the IC device (2) is placed at the center of the recessed part (502c) of the buffer stage (502a).

Description

Specification

Electronic component handling apparatus and electronic component misalignment correction method

TECHNICAL FIELD [0001] The present invention relates to an electronic component handling apparatus capable of correcting an electronic component misalignment during transportation of an electronic component, and an electronic component misalignment correcting method in the electronic component handling apparatus.

Background art

In the process of manufacturing electronic components such as IC devices, an electronic component testing apparatus is used to test the performance and function of the finally manufactured electronic component.

[0003] An electronic component testing apparatus as an example of the prior art includes a test unit for testing an electronic component, a loader unit for sending an IC device before the test to the test unit, and taking out a tested IC device from the test unit. And an unloader section for classification. The loader unit includes a buffer stage that can reciprocate between the loader unit and the test unit, and an adsorption unit that can hold the IC device by suction. Customer tray card Heat plate, area from the heat plate to the buffer stage And a loader unit transporting device which can be moved at a distance. In addition, the test unit is provided with a contact arm that can hold the Ic device and hold it against the contact part of the test head, and is provided with a test unit transport device that can move in the area of the test unit.

[0004] The loader unit transport device holds the IC device accommodated in the customer tray by the suction unit and places it on the heat plate, and then heats the IC device on the heat plate heated to a predetermined temperature. The IC device is again sucked and held by the suction section and placed on the buffer stage. Then, the buffer stage on which the IC device is mounted moves from the loader unit to the test unit side. Next, the test unit transport device sucks and holds the IC device on the buffer stage by the contact arm and presses it against the contact part of the test head to bring the external terminal of the IC device into contact with the connection terminal of the contact part.

[0005] In this state, a test signal supplied to the test head through the tester main body cable is applied to the IC device, and a response signal read from the IC device camera is sent to the tester main body through the test head and the cable. Measure device electrical characteristics [0006] Here, when the contact arm of the test unit transport apparatus presses the IC device against the contact part as described above, if the holding position of the IC device in the contact arm is shifted, the external terminal of the IC device and the contact part The contact with the connection terminal is not reliably performed, and the test cannot be performed accurately.

Therefore, it is necessary to accurately define the position of the IC device when the contact arm attracts the IC device, that is, the position of the IC device on the buffer stage.

However, since there is usually a predetermined clearance between the IC device housing part and the IC device in the customer tray heat plate, the IC device is placed on the buffer stage by the loader part transport device. In some cases, misalignment or rotation in the Θ direction may occur.

By the way, conventionally, an electronic component testing apparatus is often provided with a replaceable member called a change kit so as to be compatible with IC devices having different external shapes and the like. . When testing IC devices with different external shapes, it is necessary to replace this change kit and prepare multiple types of change kits for each IC device with different external shapes.

[0010] As a method for correcting the positional deviation of the IC device as described above, a buffer stage having a tapered recess corresponding to the outer shape of the IC device under test is used as a change kit, and the tapered recess of the buffer stage is used. There are a method of positioning the IC device by dropping the IC device, and a method of correcting the positional deviation of the IC device by sandwiching the IC device with two movable bars.

Disclosure of the invention

Problems to be solved by the invention

[0011] However, the former method requires a buffer stage for each IC device with a different external shape. Therefore, the cost is high, and it is necessary to replace the buffer stage every time the type of IC device is changed. There was a problem that the work was complicated. In the latter method,

There is a manufacturing cost to install a mechanism with two movable bars in an electronic component testing device. In addition to this, there was a problem that the electronic component testing apparatus was complicated.

[0012] The present invention has been made in view of such a situation, and it is possible to correct misalignment of an electronic component without requiring a positioning structure corresponding to each electronic component having a different external shape. An object of the present invention is to provide an electronic component handling apparatus and a method for correcting misalignment of an electronic component.

Means for solving the problem

[0013] In order to achieve the above object, first, the present invention includes a test unit for testing an electronic component, a loader unit for feeding an electronic component before the test to the test unit, and a tested electronic component as described above. An electronic component handling apparatus comprising an unloader unit that is taken out from the test unit and classifies the buffer unit, and provided in the loader unit, the buffer stage for delivering the electronic component between the loader unit and the test unit, A loader unit transporting device that sucks and holds an electronic component by the loader unit and places it on the buffer stage, and a side surface of the electronic component sucked and held by the loader unit transporting device is brought into contact with a predetermined reference side or reference surface. However, an electronic component handling device is provided that includes a position correction device that corrects a positional shift of the electronic component (Invention 1). Note that the “loader unit transport device” and the “position correction device” can overlap with each other (can be configured with one device).

[0014] In the above invention (Invention 1), the holding state of the electronic component in the loader unit conveying device is changed by bringing the side surface of the electronic component attracted and held into contact with a predetermined reference side or reference surface, thereby changing the electronic component. The tilt in the plane rotation direction (Θ direction) of, and in some cases, the deviation in the X-axis direction or Y-axis direction can be corrected.

[0015] In the above invention (Invention 1), there is provided a test part transport device that corrects a positional shift by the position correction device and sucks and holds the electronic component placed on the buffer stage and transports the electronic part to the test unit. It is preferable to have U ヽ (Invention 2).

[0016] In the above inventions (Inventions 1 and 2), the buffer stage is formed with a recess capable of accommodating an electronic component, and the inner wall of the recess corrects the positional deviation of the electronic component. It is preferably a side or reference plane (Invention 3). According to this invention (Invention 3), after correcting the displacement of the electronic component, the electronic component can be placed on the buffer stage with a short moving distance, and therefore the movement of the loader transport device can be efficiently performed. Short Can be done in time.

[0017] In the above invention (Invention 11-13), it is preferable that a suction part capable of sucking the electronic component is provided at a position where the electronic component is placed on the buffer stage (Invention 4). According to this invention (Invention 4), it is possible to prevent the position of the electronic component that has undergone the positional deviation correction from being shifted again when the electronic component is released from the suction holding force.

[0018] In the above invention (Invention 4), it is preferable that an adsorption member having a porous elastic force is provided in the adsorption part of the buffer stage (Invention 5). According to this invention (Invention 5), such an electronic component that the shape of the adsorbing member easily follows even an electronic component having unevenness, such as an IC device having a solder ball, is accurately adsorbed. be able to.

[0019] In the above invention (Invention 1-15), the loader transport device includes an adsorbing portion having an adsorbing pad, and the adsorbing pad is preferably made of a highly elastic material cover. (Invention 6). The degree of “high elasticity” shall be the degree of elasticity that is not deformed when the electronic component held by the suction pad is in contact with a predetermined member. By configuring the suction pad with such a highly elastic material, the suction surface of the suction pad can slide smoothly with respect to the holding position of the electronic component when the electronic component is in contact, so the electronic component is accurately corrected for displacement. be able to.

[0020] In the above invention (Invention 6), it is preferable that the highly elastic material constituting the suction pad has conductivity (Invention 7). According to the strong invention (Invention 7), it is possible to prevent the generation of static electricity in the suction pad.

[0021] In the above invention (Invention 3-7), the loader unit transport device includes a plurality of suction units for sucking and holding electronic components, and the recess of the buffer stage is formed by the suction unit of the loader unit transport device. It is preferable that a number corresponding to the number of the above is formed (Invention 8). According to this invention (Invention 8), it is possible to perform positional deviation correction of a plurality of electronic components at a time.

[0022] In the above invention (Invention 11-8), the position correction device may be configured such that the two adjacent side surfaces of the electronic component sucked and held by the loader unit transport device are the predetermined reference side or reference surface and the predetermined It may be a device that corrects the positional deviation of the electronic component while being brought into contact with two or two sides of the reference side or the reference surface adjacent to the reference side (Invention 9). Heels According to the invention (Invention 9), it is possible to accurately define the positions of two adjacent sides of the electronic component, and thus to correct the deviation of the electronic component in the Θ direction, the X axis direction, and the Y axis direction. It is out.

[0023] Secondly, according to the present invention, the first positional force on the electronic component handling apparatus also holds the electronic component by suction, and makes the side surface of the electronic component sucked and held contact a predetermined reference side or reference surface. Correcting the positional deviation of the electronic component in the electronic component handling apparatus, correcting the positional deviation of the electronic component, and placing the electronic component after the positional deviation correction on the second position on the electronic component handling apparatus A method is provided (Invention 10).

[0024] In the above invention (Invention 10), the holding state of the electronic component is changed by bringing the side surface of the sucked and held electronic component into contact with a predetermined reference side or reference surface, and the electronic component is in the Θ direction. Tilt, and in some cases, offset in the X-axis or Y-axis direction can be corrected.

[0025] In the above invention (Invention 10), preferably, the second position is a recess formed in a buffer stage of an electronic component handling apparatus, and an inner wall of the recess is the predetermined reference side or reference surface. (Invention 11). According to the powerful invention (Invention 11), after correcting the displacement of the electronic component, the electronic component can be placed on the buffer stage with a short movement distance, so that the electronic component can be moved efficiently. It can be done in a short time.

The invention's effect

[0026] According to the electronic component handling apparatus and the electronic component misalignment correcting method of the present invention, it is possible to correct the misalignment of an electronic component without requiring a positioning structure corresponding to each electronic component having a different outer shape. Can do.

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a plan view of a handler according to an embodiment of the present invention, FIG. 2 is a partial cross-sectional side view (cross-sectional view taken along II in FIG. 1) of the nozzle according to the embodiment, and FIG. 3 is a buffer stage used in the handler 4 is a cross-sectional view of a buffer stage used in the same handler, FIG. 5 (a) one (c) is a side view showing a method for correcting misalignment of an IC device in the handler, and FIG. 6 (a) one. (c) is a plan view showing a method of correcting the misalignment of an IC device in the handler. As shown in FIGS. 1 and 2, the electronic component test apparatus 1 in the present embodiment includes a handler 10, a test head 300, and a tester 20, and the test head 300 and the tester 20 include a cape Connected through. Then, the IC device before the test on the supply tray stored in the supply tray stock force 401 of the handler 10 is transported and pressed against the contact portion 301 of the test head 300, and the test head 300 and the cable 21 are passed through this test head 300. After the IC device test is executed, the IC device for which the test has been completed is mounted on the classification tray stored in the classification tray stock force 402 according to the test result.

The noder 10 mainly includes a test unit 30, an IC device storage unit 40, a loader unit 50, and an unloader unit 60. Hereinafter, each part will be described.

[0030] IC device storage 40

The IC device storage unit 40 is a means for storing the IC device before and after the test. The IC device storage unit 40 mainly includes the supply tray force 401, the classification tray stock force 402, the empty tray stock force 403, and the tray transport. Device 404.

[0031] In the supply tray stock force 401, a plurality of supply trays loaded with a plurality of IC devices before the test are loaded and stored. In this embodiment, as shown in FIG. Two supply tray stock forces 401 are provided.

[0032] The stock tray force 402 for the classification tray is loaded with a plurality of classification trays loaded with a plurality of IC devices after the test. In this embodiment, as shown in FIG. A tray stocking force 402 is provided. By providing these four classification tray stock forces 402, IC devices can be sorted and stored in up to four classifications according to the test results.

The empty tray stock force 403 is mounted on the supply tray stock force 401 and stores the empty tray after all the pre-test IC devices 20 are supplied to the test unit 30. It should be noted that the number of stock forces 401-403 can be set as necessary.

[0034] The tray transport device 404 is a transport means that can move in the X-axis and Z-axis directions in FIG. 1, and is mainly composed of an X-axis direction lenore 404a, a movable head b 404b, and four suction nodes 404c. The range including the supply tray force 401, the partial tray force 402, and the empty tray force 403 is defined as the operation range. In the tray transfer device 404, the X-axis direction rail 404a fixed on the base 12 of the handler 10 supports the movable head 404b in a cantilevered manner so as to be movable in the X-axis direction. The portion 404b is provided with a Z-axis direction actuator (not shown) and four suction pads 404c at the tip.

[0036] The tray transport device 404 sucks and holds the empty tray emptied by the supply tray stock force 401 by the suction pad 404c, moves up by the Z-axis direction actuator, and moves on the X-axis direction rail 404a. The head portion 404b is slid to be transferred to the empty tray stock force 401. Similarly, when the post-test IC devices are fully loaded on the classification tray in the classification tray force 402, the empty tray is attracted and held from the empty tray force 403 and lifted by the Z-axis direction actuator. Then, the movable head portion 404b is slid on the X-axis direction rail 404a to be transferred to the sorting tray stock force 402.

[0037] As shown in FIG. 2, the operation range of the tray transfer device 404 is provided so as not to overlap with the operation ranges of a loader unit transfer device 501 and an unloader unit transfer device 601 described later in the Z-axis direction. Therefore, the operations of the tray transport device 404, the loader unit transport device 501, and the unloader unit transport device 601 do not interfere with each other.

[0038] Loader section 50

The loader unit 50 is a means for supplying the IC device before the test to the test unit 30 from the supply tray stock force 401 of the IC device storage unit 40. The loader unit 50 mainly includes a loader unit transfer device 501 and two loader buffers. It comprises a part 502 (two in the negative direction of the X axis in FIG. 1) and a heat plate 503.

[0039] The IC device before the test is moved from the supply tray stock force 401 to the heat plate 503 by the loader unit conveying device 501 and heated to a predetermined temperature by the heat plate 503, and then again the loader unit conveying device 501. The loader buffer unit 502 moves to the loader buffer unit 502, and the loader buffer unit 502 introduces it to the test unit 30.

[0040] The loader unit transport device 501 moves the IC device on the supply tray 401 of the supply tray of the IC device storage unit 40 onto the heat plate 503 and also transfers the IC device on the heat plate 503 to the loader buffer. This is a means for moving onto the portion 502, mainly from the Y-axis direction rail 501a, the X-axis direction rail 501b, the movable head portion 501c, and the suction portion 501d. It is configured. This loader unit conveying device 501 has an operating range that includes a supply tray stock force 401, a heat plate 503, and two loader buffer units 502!

[0041] As shown in FIG. 1, the two Y-axis rails 501a of the loader unit transport device 501 are fixed on the base 12 of the handler 10, and the X-axis rail 502b is Y between them. It is slidably supported in the axial direction. The X-axis direction rail 502b supports a movable head portion 501c having a Z-axis direction actuator (not shown) so as to be slidable in the X-axis direction.

[0042] The movable head portion 501c includes four suction portions 501d each having a suction pad 501e at the lower end, and each of the four suction portions 501d is independently driven by driving the Z-axis direction actuator. Can be moved up and down in the Z-axis direction.

[0043] The suction pad 501e in the present embodiment also has a high elastic material force that has an elasticity that does not deform when it comes into contact with the inner wall surface 501f of the recess 502c of the buffer stage 502a described later. It is preferable. As a result, when the suction pad 501e is moved and the IC device held by the suction pad 501e is held in contact with the inner wall surface 501f, the suction surface of the suction pad 501e is in contact with the holding position of the IC device. Therefore, it is possible to accurately correct the misalignment of the IC device. As a highly elastic material that can constitute the suction pad 501e, for example, a resin material can be used.

[0044] In addition, the suction pad 501e is preferably configured with a conductive material force in order to prevent generation of static electricity. Such a suction pad 501e can be obtained, for example, by blending a resin with conductive powder and molding, or by subjecting the molded pad to a conductive treatment.

[0045] Each suction unit 501d is connected to a negative pressure source (not shown). By sucking air from the suction pad 501e and generating a negative pressure, the IC device can be sucked and held. Also, the IC device can be released by stopping the suction of air from the suction pad 501e.

[0046] The heat plate 503 is a heating source for applying a predetermined thermal stress to the IC device. For example, the heat plate 503 is a metal heat transfer plate having a heat source (not shown) in the lower part. Heatp On the upper surface side of the rate 503, a plurality of recesses 503a for dropping an IC device are formed. Note that a cooling source may be provided instead of a powerful heating source.

[0047] The loader buffer unit 502 is a means for reciprocally moving the IC device between the operation range of the loader unit transport device 501 and the operation range of the test unit transport device 310, and mainly includes a buffer stage 502a, Consists of X-axis direction actuator 502b!

[0048] A buffer stage 502a is supported at one end of an X-axis direction actuator 502b fixed on the base 12 of the handler 10, and as shown in FIGS. 3 and 4, the upper surface of the buffer stage 502a On the side, four concave portions 502c having a rectangular shape in plan view for forming an IC device are formed.

[0049] The size of the recess 502c of the buffer stage 502a in the planar direction can be set to a size that can accommodate the largest IC device among the various IC devices to be tested. As a result, even when the IC device under test 2 is changed to various IC devices 2 having different external shapes, it is not necessary to replace the kaffer stage 502a. For example, if you want to correspond to many types of IC devices 2 with each side of 3. Omm—20 mm, the recess 502c of the buffer stage 502a will be offset or rotated in the XY-axis direction of the IC device 2 (the Θ direction) For example, recesses with a size of about 22 mm on each side can be formed.

[0050] One inner wall surface 501f in the recess 502c of the buffer stage 502a (in this embodiment, the surface along the Y-axis direction and the surface on the X-axis positive direction side) is used to correct the positional deviation of the IC device. The reference surface of the IC device is the wall on which the side surface of the IC device comes into contact, and is formed vertically. Note that the inner wall surface 501j adjacent to the inner wall surface 501f (in this embodiment, a surface along the X-axis direction and on the Y-axis positive direction side) can also be a reference surface along with the inner wall surface 501f.

[0051] The four suction pads 501e holding the IC device 2 are lowered onto the buffer stage 502a to position the IC device 2 in the recess 502c, and then move toward the reference surface to move the IC device 2 While contacting the reference surface, the IC device 2 moves until the side surface of the IC device 2 is in parallel with the reference surface and the entire side surface contacts the reference surface. As a result, the four IC devices are simultaneously corrected for misalignment. In the present embodiment, a suction member 501g capable of sucking and sucking the IC device is provided at the center of the bottom surface of the recess 502c of the buffer stage 502a. The adsorbing member 5 Olg has a substantially cylindrical shape with a suction hole formed in the center. The adsorbing member 501g preferably has a porous elastic force, and therefore the shape of the adsorbing member 50lg easily follows the uneven surface of an IC device having a large number of solder balls as external terminals. IC devices can be adsorbed accurately. Examples of the powerful porous elastic body include materials such as urethane foam.

[0053] In the present embodiment, the adsorbing member 501g is provided so that its upper end protrudes from the bottom surface of the recess 502c to the extent that it contacts the bottom surface of the IC device 2, and is attached to the fixing plate 501h at the bottom surface. It is fixed to the buffer stage 502a so as to be supported. The lower part of the fixed plate 501h is connected to the negative pressure tube 501k. Note that, when suction is performed from the suction member 501g, a structure may be adopted in which the entire lower surface of the buffer stage 502a is covered with a negative pressure.

Here, as shown in FIG. 7 (e), a position where the IC device 2 can be sucked and held in a state where the contact with the reference surface (inner wall surfaces 501f, 501j) of the IC device 2 is completed ( In FIG. 7 (e), at least one adsorption member 501g may be additionally provided in the upper right part of the recess 50lc. In such a configuration, while the IC device 2 is sucked and held by the suction member 501g while the contact of the IC device 2 with the reference surface is completed, the suction state by the suction pad 501e is once released, and then again by the suction pad 501e. By adsorbing the IC device 2, the elastic deformation state of the adsorption pad 50 le is eliminated. In this case, it is not necessary to use a highly elastic material as the material constituting the suction pad 501e.

By installing the loader buffer unit 502 as described above, the loader unit transport device 501 and the test unit transport device 310 can operate simultaneously without interfering with each other. Further, by providing the two loader buffer units 502 as in the present embodiment, it is possible to efficiently supply an IC device to the test head 300 and increase the operating rate of the test head 300. Note that the number of loader buffer units 502 is not limited to two, and it is possible to set the time power required for the IC device test as appropriate.

[0056] Test unit 30 The test unit 30 is a means for performing a test by bringing an external terminal of the IC device into electrical contact with a contact pin of the contact unit 301, and mainly includes a test unit transport device 310.

[0057] The four pre-test IC devices whose positional deviations were corrected by the loader buffer unit 502 were moved to the contact unit 301 of the test head 300 by the test unit transport device 310 and subjected to four tests at the same time. Thereafter, it is moved again to the unloader buffer unit 602 by the test unit transport device 310 and discharged to the unloader unit 60 by the unloader buffer unit 602.

[0058] In this embodiment, the test head 300 includes four contact portions 301. The four contact portions 301 substantially correspond to the arrangement of the contact arms 315 of the movable head portion 312 of the test portion transport apparatus 310. It is arranged in an array that matches! Further, each contact portion 301 is provided with a plurality of contact bins arranged so as to substantially match the arrangement of the external terminals of the IC device. In addition, when the arrangement of the external terminals differs due to a change in the type of IC device, etc., it is replaced with a contact portion 301 corresponding to the arrangement.

[0059] As shown in FIG. 2, in the test section 30, an opening 11 is formed in the base 12 of the handler 10, and the contact section 301 of the test head 300 protrudes from the opening 11 to form the IC. The device comes to be pressed!

The test unit transport device 310 is a means for moving the IC device between the loader buffer unit 502 and the unloader buffer unit 602 and the test head 300.

[0061] The test unit transporting device 310 has two X-axis direction support members 31 la slidable in the Y-axis direction on the two Y-axis direction rails 311 fixed on the base 12 of the handler 10. Support. A movable head 312 is supported at the center of each X-axis direction support member 311a, and the range including the loader buffer unit 502, the unloader buffer unit 602, and the test head 300 is defined as an operation range. It should be noted that the movable head portion 312 supported by each of the two X-axis direction support members 31 la operating simultaneously on the pair of Y-axis direction rails 311 is controlled so that the operations of each other do not interfere with each other. It has been.

Each movable head portion 312 mainly includes a Z-axis direction actuator (not shown) and four contact arms 315 corresponding to the arrangement of the contact portions 301. It is possible to move the four IC devices held by 5 in the Y-axis direction and the Z-axis direction and press them against the contact portion 301 of the test head 300.

[0063] Unloader section 60

The unloader unit 60 is a means for discharging a tested IC device from the test unit 30 to the IC device storage unit 40, and mainly includes an unloader unit transfer device 601 and two unloader buffer units 602 (see FIG. 1). In the positive direction of the X axis).

[0064] The tested IC device placed on the unloader buffer unit 602 is discharged from the test unit 30 to the unloader unit 60, and the unloader unit transfer device 601 extracts the classification tray stock from the unloader buffer unit 602. Mounted on a sorting tray with a force of 402.

[0065] The unloader buffer unit 602 is a means for reciprocating the operation range of the test unit transport apparatus 310 and the IC device between the operation range of the unloader unit transport apparatus 601. The unloader buffer unit 602 mainly includes the buffer stage 602a and the X Consists of an axial actuator 602b!

[0066] A buffer stage 602a is supported at one end of an X-axis direction actuator 602b fixed on the base 12 of the handler 10, and a recess for dropping an IC device is provided on the upper surface side of the buffer stage 602a. Four 602c are formed.

By providing the unloader buffer unit 602 as described above, the unloader unit transport device 601 and the test unit transport device 310 can operate simultaneously without interfering with each other. Further, by providing the two unloader buffers 602, it is possible to efficiently discharge the IC device from the test head 300 and increase the operating rate of the test head 300. Note that the number of unloader buffer units 602 is not limited to two, and can be set as appropriate, such as time required for testing the IC device.

[0068] The unloader unit transport device 601 is a means for moving and mounting the IC device on the unloader buffer unit 602 onto the classification tray having the sorting tray force 402, and mainly includes a Y-axis direction rail 601a, It is composed of an X-axis direction rail 601b, a movable head portion 601c, and a suction portion 601d. This unloader section conveying apparatus 601 has a range including two unloader buffers 602 and a sorting tray stock force 402 as an operation range.

[0069] As shown in FIG. 1, the two Y-axis direction rails 601a of the unloader section transfer device 601 are fixed on the base 12 of the non-rotor 10, and the X-axis direction rail 602b is Y between them. Axial It is slidably supported in the direction. The X-axis direction rail 602b supports a movable head portion 601c having a Z-axis direction actuator (not shown) so as to be slidable in the X-axis direction.

[0070] The movable head portion 601c includes four suction portions 601d each having a suction pad at the lower end portion. By driving the Z-axis direction actuator, each of the four suction portions 601d is independently Z It can be raised and lowered in the axial direction.

Next, the operation of the above-described nodler 10 will be described.

First, the loader unit transport device 501 sucks the four IC devices on the supply tray positioned at the top of the supply tray stock force 401 of the IC device storage unit 40 by the suction pads 501e of the four suction units 501d. ,Hold.

[0072] The loader unit transport device 501 lifts the four IC devices by the Z-axis direction actuator of the movable head unit 501c while holding the four IC devices, and slides the X-axis rail 501b on the Y-axis direction rail 501a. The movable head unit 501c is slid on the X-axis direction rail 501b and moved to the loader unit 50.

[0073] Then, the loader unit transport device 501 performs positioning above the recess 503a of the heat plate 503, extends the Z-axis direction actuator of the movable head unit 501c, releases the suction pad 501e, and the IC device Into the recess 503a of the heat plate 503. When the IC device is heated to a predetermined temperature by the heat plate 503, the loader unit transfer device 501 holds the four heated IC devices again, and the upper part of the waiting loader buffer unit 502 is Move to.

[0074] The loader unit transport device 501 performs positioning above the buffer stage 502a of one of the waiting loader buffer units 502, and extends the Z-axis direction actuator of the movable head unit 501c. As shown in a), the IC device 2 sucked and held by the suction pad 501e of the suction portion 501d is positioned in the vicinity of the inner wall surface 501f of the recess 502c in the recess 502c of the buffer stage 502a (plan view is shown in FIG. 6 See (a). At this time, the IC device 2 may be inclined in the Θ direction from a desired position, as shown in FIG.

Next, as shown in FIG. 5 (b), the loader unit transport device 501 moves the movable head unit 501c slightly in the X-axis positive direction, and the suction pads 501e of the four suction units 501d One side of the four IC devices 2 that are sucked and held are respectively connected to the recesses 502c of the buffer stage 502a. It is brought into contact with the inner wall surface 501f as a reference surface (see FIG. 6 (b) for a plan view). The IC device 2 that is in contact with the inner wall surface 501f of the recess 502c of the buffer stage 502a moves the movable head portion 501c further in the positive X-axis direction so that the entire side surface of the IC device 2 that is in contact As a result of forcible movement in the direction in contact with the inner wall surface 50 If, the inclination of the IC device 2 in the Θ direction (rotation direction) is corrected. At the same time, even if IC device 2 is displaced in the positive direction of the X axis, the displacement is corrected.

[0076] At the time of the abutment, the surface force of the IC device 2 to be sucked and the suction pad surface of the suction pad 501e are forcibly slid in the suction state. The IC device 2 is precisely positioned so that the misalignment in the positive axial direction is corrected and the side surface of the IC device 2 is positioned at the inner wall surface 501f that is the reference surface. As a result, there is an advantage that the four IC devices 2 are accurately positioned collectively.

Subsequently, as shown in FIG. 5 (c), the loader unit transport apparatus 501 moves the movable head unit 501c in the negative direction of the X axis, and four suction units 501d at the center of the recess 502c of the buffer stage 502a. The suction pad 501e is released, and the IC device 2 is placed at the center of the recess 502c of the buffer stage 502a as shown in FIG. 6 (c).

At the same time, the IC device 2 is sucked and held by the sucking member 501g in the recess 502c of the buffer stage 502a. By this suction and holding, it is possible to prevent the IC device 2 from being displaced when the suction pad 501e releases the IC device 2. As a result, the four IC devices 2 can be sucked and held while the IC device 2 is accurately positioned as described above. Regarding the suction force of the suction member 501g, a suction force that can hold the IC device 2 by suction may be constantly applied, or after the IC device 2 is placed on the suction member 50 lg, the suction force may be increased. You can control the suction to generate! /,

[0079] The loader buffer unit 502 extends the X-axis direction actuator 502b while adsorbing and holding the four IC devices 2 in the recesses 502c of the buffer stage 502a, and the loader unit 50 of the header unit transport device 501 As for the operating range force, the four IC devices 2 are moved to the operating range of the test unit transport device 310 of the test unit 30.

[0080] Next, one of the test unit transfer devices 310 located above the loader buffer unit 502 is allowed. The Z-axis direction actuator of the moving head unit 312 extends, and the four IC devices 2 located in the recess 502c of the buffer stage 502a of the loader buffer unit 502 are sucked and held by the four contact arms 315 of the movable head unit 312. To do. At this time, it is desirable to stop the suction of the suction member 501g of the recess 502c of the buffer stage 502a.

The movable head unit 312 holding the four IC devices is lifted by the Z-axis direction actuator of the movable head unit 312.

Next, the test unit transport apparatus 310 slides the X-axis direction support member 3 11 a that supports the movable head unit 312 on the Y-axis direction rail 311 and holds it by the contact arm 315 of the movable head unit 312. The four IC devices are positioned above the four contact parts 301 of the test head 300.

Then, the movable head portion 312 extends the Z-axis direction actuator so that the external terminals of the four IC devices are brought into contact with the contact pins of the four contact portions 301. During this contact, electrical signals are transmitted and received through each contact pin, thereby simultaneously testing four IC devices.

[0084] When the test of the four IC devices is completed, the test unit transport apparatus 310 lifts the four tested IC devices while holding the four IC devices tested by the Z-axis direction actuator of the movable head unit 312, and moves the movable head unit 312. The X-axis support member 311 a that slides on the Y-axis rail 311 is used for one unloader that stands by within the operating range of the test unit transport device 310. Position the buffer unit 602 above the buffer stage 602a.

Next, the movable head unit 312 extends the Z-axis actuator 313 to release the suction pad 317c, thereby dropping the four IC devices into the recess 602c of the buffer stage 602a.

[0086] The unloader buffer unit 602 drives the X-axis actuator 602b while mounting four tested IC devices, and from the operating range of the test unit transport device 310 of the test unit 30, the unloader of the unloader unit 60 Move the IC device to the operation range of the transfer device 601.

[0087] Next, the unloader unit transport device 601 located above the unloader buffer unit 602 The Z-axis direction actuator of the movable head unit 601c is extended, and the four IC devices that have been tested are positioned in the recess 6 02c of the buffer stage 602a of the unloader buffer unit 602 by the four adsorption units 601d of the movable head unit 601c. Adsorb and hold.

[0088] The unloader unit transfer device 601 is movable while holding the four tested IC devices. The four IC devices are lifted by the Z-axis direction actuator of the head unit 601c, and the Y-axis direction rail 601a is moved to the X-axis direction. Slide the rail 601b and slide the movable head 601c on the X-axis direction rail 601b to move it onto the stock tray force 402 for the IC tray 40. Then, according to the test result of each IC device, each IC device is mounted on the classification tray located at the top of the stock force 402 for each classification tray.

[0089] In the handler 10 that operates as described above, when the IC device 2 is placed on the buffer stage 502a by the loader unit 50, the inclination of the IC device 2 in the Θ direction and, in some cases, the IC device 2 Since the displacement of device 2 in the positive direction of the X-axis can be corrected and the displacement on the buffer stage 502a can be prevented, the external terminal of IC device 2 and test head 300 in test section 30 thereafter As a result of accurate positioning of the contact pin of the contact portion 301, contact can be reliably performed. As a result of the accurate positioning of the IC device in this way, it is possible to make an accurate contact especially for an IC device having an external terminal with a further narrow pitch that will appear in the future.

[0090] Furthermore, when changing the type of IC device 2 under test, it is not necessary to replace the buffer stage 502a, and one type of buffer stage 502a is shared with many IC devices having different external shapes. The great advantage is that it can.

The embodiments described above are described for facilitating the understanding of the present invention, and are not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

[0092] For example, the contact of the side surface of the IC device 2 at the time of correcting the misalignment of the IC device 2 is another inner wall surface in the recess 502c of the buffer stage 502a, for example, a surface along the Y-axis direction and the X-axis It may be performed on the negative side surface or the surface along the X-axis direction, the surface along the Y-axis direction! /, One or both of the surfaces, and the surface along the X-axis direction No! / Go to both one or both sides.

[0093] Also, for example, when the pitch between the terminals of the IC device is relatively wide, or when it is sufficient to accurately define one side of the IC device, the reference plane is as shown in FIG. 7 (a). One side of the inner wall surface 501 f is sufficient. On the other hand, when the pitch between the terminals of the IC device is relatively narrow, or when it is necessary to accurately define two orthogonal sides of the IC device, the reference plane is orthogonal as shown in Fig. 7 (b). The inner wall surface 501f and the inner wall surface 501j, which are the two sides, are used, and the direction of movement of the suction pad 501e that sucks and holds the IC device 2 is an oblique direction (both the X axis and the horizontal axis) in plan view.

[0094] Furthermore, in the above embodiment, the force with which the suction member 501g is disposed at the center of the recess 502c of the buffer stage 502a, as shown in Figs. 7 (c) and 7 (d), the reference surface (inner wall surface) of the IC device 2 50 If and the inner wall surface 501j) are in contact with each other, at least one (1 in Fig. 7 (c), Fig. 7 (d) In this case, the number of adsorbing members 501g may be arranged. In this case, the process of moving the suction pad 501e to the center of the buffer stage 502a can be reduced. Further, since the suction member 501g sucks and holds the IC device 2 when the contact with the reference surface is completed, the minute position of the IC device 2 accompanying the elastic deformation when the suction pad 501e is released is released. There is an advantage that the occurrence of the deviation can be eliminated.

[0095] When a plurality of suction members 501g are arranged as shown in FIG. 7 (d), when the external shape of the IC device 2 is small, the suction port of the suction member 501g that does not suck the IC device 2 is released. In order to prevent this, it is desirable that the negative pressure flow path be provided with a restriction (orifice) structure that restricts the flow rate.

[0096] In addition, the inner wall surface 502f, which is the reference position of the recess 502c of the buffer stage 502a, may be inclined at a desired angle in a plan view, or may be desired in a side view! It may be inclined at an angle of. In the latter case, position correction is performed while one side of the side of the IC device is in contact with the inner wall surface 502f.

[0097] Further, the test unit 30 of the handler 10 may be additionally provided with an alignment mechanism that can correct a minute positional deviation of the IC device.

Industrial applicability The electronic component handling apparatus and the electronic component misalignment correction method of the present invention are useful for reliably testing an electronic component.

Brief Description of Drawings

FIG. 1 is a plan view of a handler according to an embodiment of the present invention.

FIG. 2 is a partial sectional side view of the handler according to the same embodiment (II sectional view in FIG. 1).

FIG. 3 is a perspective view of a buffer stage used in the handler.

[FIG. 4] A sectional view of a buffer stage used in the handler.

FIG. 5 is a side view showing a method for correcting misalignment of an IC device in the handler.

FIG. 6 is a plan view showing a method for correcting misalignment of an IC device in the handler.

FIG. 7 is a plan view of a recess of a buffer stage according to another embodiment.

Explanation of symbols

[0100] 1… Electronic component testing equipment

2—IC devices (electronic components)

10 ··· Electronic parts handling device (handler)

30 ... Test section

310 ... Test unit transport device

50 ··· Loader section

501 ... Loader transport device

501d ... Suction part

50 le… Suction pad

502a- 'Buffer stage

502c ... concave

502f, 501j… Inner wall surface (reference surface)

502g ... Adsorption member

60 ... Unloader section

Claims

The scope of the claims

[1] A test unit for testing electronic components, a header unit for feeding pre-test electronic components to the test unit, and an unloader unit for taking out and classifying tested electronic components from the test unit An electronic component handling device,

A buffer stage provided in the loader unit for transferring electronic components between the loader unit and the test unit;

A loader unit that sucks and holds electronic components and places them on the buffer stage; and

An electronic component comprising: a position correcting device that corrects a positional shift of the electronic component while bringing a side surface of the electronic component sucked and held by the loader unit conveying device into contact with a predetermined reference side or a reference surface; Handling device.

[2] The test apparatus includes a test unit transport device that corrects a positional shift by the position correction device, sucks and holds the electronic component placed on the buffer stage, and transports the electronic component to the test unit. The electronic component handling apparatus according to 1.

[3] The buffer stage is formed with a recess capable of accommodating an electronic component, and an inner wall of the recess serves as the predetermined reference side or reference surface for correcting the positional deviation of the electronic component. The electronic component handling apparatus according to claim 1 or 2, wherein

[4] The electronic component according to any one of [1] to [3], wherein a suction part capable of sucking the electronic component is provided at a position where the electronic component is placed on the buffer stage. Handling device.

5. The electronic component handling apparatus according to claim 4, wherein a suction member having a porous elastic force is provided in the suction portion of the buffer stage.

[6] The loader unit transport apparatus includes a suction unit having a suction pad, and the suction pad also has a high elastic material force. The electronic component handling device described.

7. The electronic component handling apparatus according to claim 6, wherein the highly elastic material constituting the suction pad has conductivity.

[8] The loader unit transporting device includes a plurality of suction units for sucking and holding electronic components. 8. The electronic component handling apparatus according to claim 3, wherein the number of recesses of the buffer stage is formed in a number corresponding to the number of suction parts of the loader unit conveying apparatus.

[9] The position correcting device may include two adjacent side surfaces of the electronic component sucked and held by the loader unit transport device, the predetermined reference side or reference surface and the side adjacent to the predetermined reference side or reference surface or 9. The electronic component handling apparatus according to claim 11, wherein the electronic component handling apparatus corrects a positional shift of the electronic component while being brought into contact with two sides or two surfaces of the surface.

[10] First positional force on the electronic component handling device

While the side surface of the electronic component held by suction is brought into contact with a predetermined reference side or a reference surface, the positional deviation of the electronic component is corrected, and the electronic component after the positional deviation correction is performed on the second electronic component handling device. Place at the position of

An electronic component misalignment correcting method in an electronic component handling apparatus.

11. The second position according to claim 10, wherein the second position is a recess formed in a koffer stage of an electronic component handling device, and an inner wall of the recess is the predetermined reference side or reference plane. A method for correcting misalignment of an electronic component in an electronic component handling apparatus.