JP2003270295A - Inspection device for electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component inspecting device which enables efficient utilization of its installation space. <P>SOLUTION: The electronic component inspecting device has a container arrangement region where containers for housing electronic components are arranged along an orbit vertically, an inspection region where an inspection portion is arranged, a container housing portion arrangement region where container housing portions for housing containers are arranged, a component conveying portion for conveying electronic components, and a container conveying portion for conveying containers between the container arrangement region and the container housing portion. The inspection of an electronic component is performed by conveying the electronic component between the container arrangement region and the inspection region by the conveying portion. Since the containers are arranged vertically in the container arrangement region, and both containers arranged vertically can be used by moving the containers as occasion demands, an installation space for the device is efficiently utilized. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component inspection device for inspecting electronic components.

[0002]

2. Description of the Related Art Electronic component inspection apparatuses for inspecting electronic components such as semiconductor devices have been used. For example, JP-A-1
0-148507 (prior art) includes an unloader section,
Loader section, empty tray section, heating section, two sorting sections, IC
A test handler including a socket, a device transport mechanism, etc. is disclosed. The unloader section, the loader section, and the sorting section have trays for storing devices. The first sorting unit, the unloader unit, the loader unit, and the empty tray unit are arranged in the X direction, and are separated from these in the Y direction to form the IC.
Sockets are placed. In addition, the second sorting unit and the heating unit are arranged side by side in the Y direction with a space from the first sorting unit and the like. In this test handler, the device on the loader unit is carried to the heating unit by the device carrying mechanism, and the heated device is carried to the IC socket for inspection. Among the devices that have been inspected, the acceptable products are transported to the unloader unit, and the rejected products are transported to the first or second sorting unit by the device transport mechanism.

[0003]

However, in the above prior art, since the unloader section, the loader section, the empty tray section, the heating section, the two sorting sections, and the IC socket are all arranged in a plane, It is hard to say that installation efficiency is good. The present invention has been made to solve such a problem, and an object of the present invention is to provide an electronic component inspection apparatus that can efficiently use the installation area of the apparatus.

[0004]

In order to achieve the above object, an electronic component inspection apparatus according to the present invention is a container in which a track and a plurality of containers for storing electronic parts are arranged vertically along the track. An arrangement area and an inspection area which is arranged in the vicinity of the track and in which an inspection unit for inspecting an electronic component is arranged,
A container housing portion arrangement region for arranging a container housing portion for accommodating the containers in a stack, a suction head mounted on the track and equipped with a suction nozzle for sucking an electronic component, and vertically moving the suction nozzle. A component transfer unit that has a nozzle elevating unit and a nozzle moving unit that moves the suction nozzle along the trajectory, and a component transfer unit that transfers an electronic component between the container placement region and the inspection region, and the container placement region. And a container transport unit that transports the container between the container storage unit and the container storage unit. The electronic component inspection device has a container arrangement region in which containers for storing electronic components are arranged vertically along a track, an inspection region in which an inspection unit is arranged, and a container accommodation unit arrangement region in which a container accommodation unit for accommodating containers is arranged. A component transporting section for transporting electronic components, and a container transporting section for transporting a container between a container placement area and a container storage section, and an electronic component between the container placement area and an inspection area The electronic component is inspected by being transported by. The containers are vertically arranged in the container arrangement region, and by moving the containers as needed, both the containers arranged vertically can be used, so that the installation area of the device is efficiently utilized.

[0005]

BEST MODE FOR CARRYING OUT THE INVENTION (First Embodiment) A first embodiment of the present invention will be described below in detail with reference to the drawings. FIG. 1 is an electronic component inspection apparatus 1 according to the first embodiment of the present invention.
It is a perspective view showing 0. 2 to 4 are a top view, a side view, and a front view showing the electronic component inspection apparatus 10 as viewed from the Z, X, and Y axis directions of FIG. 1, respectively.

The electronic component inspection device 10 is a device for conveying and inspecting the electronic component D, and as shown in FIGS. 1 to 4, the electronic component conveying unit 10 for conveying the electronic component D.
0 and electronic component inspection unit 200 for inspecting electronic component D
It is configured by combining and. Here, the electronic component inspection apparatus 10 means inspection sockets 152a, 1 to be described later.
The electronic component transfer unit 10 that mainly transfers the inspection target component before the inspection plate 153 with the 53b installed is attached or with the inspection plate 153 attached.
Say 0. Alternatively or additionally, the electronic component carrying unit 10
In addition to 0, the inspection sockets 152a, 153b and the control unit 190 of the electronic component carrying unit 100 are connected by signal lines, respectively, to inspect electronic components and output inspection result data to the control unit 190 and others, or Remember
Alternatively, it refers to a device including an electronic component inspection unit 200 which is a device related to inspection control of electronic components to be displayed. The electronic component D is a general electronic component including a semiconductor device such as an IC. Further, the trays described below refer to the containers referred to in the present application.

(Structure of Electronic Component Transport Unit 100) The electronic component transport unit 100 is mainly composed of a base 110, two X-axis robots 120a and 120b, and a tray arrangement area 13.
0, stocker placement area 140, inspection area 150, component transfer mechanisms 160a to 160d, X-direction tray transfer mechanism 1
70a, 170b, Y-direction tray transfer mechanism 180a
(1), 180a (2), 180b (1), 180b
(2) The control unit 190 and the cover 300 are included.

The base 110 has a substantially rectangular upper surface and a substantially L-shaped bottom surface, and has a substantially rectangular parallelepiped space 111 below the inspection region 150. The electronic component inspection unit 200 is inserted into the space 111 for connection with the electronic component transport unit 100. Since the space 111 is open on both side surfaces in the X and Y directions, the electronic component inspection unit 20
Insertion of 0 can be performed from either the X or Y direction.

The X-axis robots 120a and 120b function as orbits for moving the component transfer mechanisms 160a to 160d in the X-axis direction, and are substantially parallel to each other along the X-direction on the upper surface of the base 110. is set up. The component transfer mechanisms 160a and 160b and the component transfer mechanism 160 are placed on the X-axis robots 120a and 120b, respectively.
c and 160d move to carry the electronic component D. As will be described later, the inspection efficiency can be improved by using the two X-axis robots 120a and 120b. The X-axis robots 120a and 120b can be regarded as tracks when viewed from the component transfer mechanisms 160a to 160d that are movably attached, while the component transfer mechanisms 160a to 160d can be considered.
Can be regarded as a component transport unit arranged on the track. The X-axis robots 120a and 120b include an X-axis rail formed of fixed magnets, a linear motor including a moving magnet that can move along the X-axis rail, a screw shaft connected to a servo motor, and a screw. It is a single-axis robot or the like that is fitted to the shaft and the X-axis rail and is configured to move along the X-axis rail while being prevented from rotating. The X-axis rail can also be regarded as the track referred to in the present application.

(Details of Tray Arrangement Area 130) The tray arrangement area 130 is an X-axis robot 120 on the base 110.
a tray 120 (Ta (1), T
This is a substantially rectangular area in which a (2), Tb (1), and Tb (2) are arranged. The length of the tray placement area 130 in the Y direction can be appropriately set within a range larger than the length of one side of the tray T in the Y direction and smaller than twice the length.

The tray T is a container for accommodating the electronic components D, and has a structure (for example, a recess or a protrusion) for separately mounting the electronic components D on the upper surface thereof. Here, as an example, a device that can store 10 electronic components D vertically and 5 electronic components D horizontally is shown. The tray T is a tray for inspected products (for acceptable products and rejected products) that stores the inspected electronic components D, an empty tray that does not store the electronic components D, and an unfilled tray that stores the electronic components D before the inspection. Divided into inspection product trays. The tray placement area 130 is divided into tray placement areas 130a and 130b, and the tray Ta (Ta (1), Ta (2)) and the tray Tb (Tb (1), Tb (2)) are vertically stacked on each. Are arranged. By arranging the trays T in the vertical direction in this manner, the installation area of the device can be effectively used. Here, the numbers in parentheses represent the number of trays T counted from the top.
When using the lower tray T (2) (Ta (2), Tb (2)), the Y-direction tray transport mechanism 180 (1) is used.
(180a (1), 180b (1)) upper tray T
(1) (Ta (1), Tb (1)) is appropriately conveyed, and the upper surfaces of the lower trays T (2) (Ta (2), Tb (2)) are exposed. As a result, the electronic component D can be stored in and taken out from the lower tray T. The upper tray T can store and take out the electronic component D regardless of the position of the lower tray T.

FIG. 5 shows the correspondence between the tray arrangement area 130 and the stocker arrangement area 140. Tray placement area 13
0a and 130b are test sockets 152a and 1 to be described later.
They are arranged in a line including 52b. In addition, the stocker placement area 140 is the tray placement areas 130a and 130b.
Are divided into stocker placement areas 140a and 140b. The trays Ta and Tb are the X-axis robot 120.
They are arranged in a line along a and 120b. Tray Ta,
Saving the space in the Y direction because Tb are arranged in a line (miniaturization of electronic component inspection apparatus 10)
Is possible.

As will be described later, the component transfer mechanism 160a-
The electronic parts D from the tray T for uninspected products by 160d
Are conveyed to the inspection area 150 and are inspected. The inspected electronic components D are separately stored in the inspected product tray T by the component transport mechanisms 160a to 160d according to whether the inspection passes or fails. When the electronic components D are sucked from the tray T for uninspected products or mounted on the tray T for inspected products by the component transfer mechanisms 160a to 160d movable only in the X direction, Y in the tray T is set. Each tray T is moved in the Y direction by the Y-direction tray transport mechanism 180 so that it can be sucked or mounted at a desired position in the direction. Therefore, the tray placement area 130 is not limited to the size of the tray T itself, and is, for example, less than twice the length of the tray T in the Y direction.

Here, the component transfer mechanisms 160a to 160d pick up the electronic component D on the tray arrangement area 130,
When the area for attachment / detachment (= attachment to the tray T) is referred to as a component adsorption / desorption area, in the component transfer mechanisms 160a to 160d that are movable only in the X direction, all the trays T in the X direction.
The region that is extremely narrow in the Y direction is the component adsorption / desorption region. On the other hand, as will be described later, when the electronic component D is sucked and unloaded by the component transfer mechanisms 160a to 160d that are movable in both the X and Y directions, if the tray T does not move in the Y direction, The adsorption / desorption area has the length of the tray T in the Y direction. Further, the tray T is movable in the Y direction when the electronic component D is adsorbed or detached, and the component transport mechanisms 160a to 160d are also in the X direction Y.
In the case of being movable in both directions, the component adsorption / desorption area can be less than twice the length of the tray T in the Y direction in the Y direction, and can be extremely narrow at the minimum. The area 130 is longer than the length of the tray T in the Y direction, 2
Less than double is possible.

(Arrangement of Tray T) The arrangement of the tray T will be described in more detail below. In the present embodiment, how to arrange the trays in the tray arrangement area 130 can be set appropriately. As an example of the arrangement of the tray T,
The arrangements 11, 12 of FIG. 6 are conceivable. (1) In the arrangements 11 and 12 of FIG. 6, the empty tray T is arranged in the lower stage. This is because the frequency of movement of the empty tray T is relatively low. As described above, in order to access the lower tray T, it is necessary to move the upper tray T so as to leave a space above the lower tray T. It has less influence on the inspection speed. That is, the inspected product tray T
The empty tray T is supplied only when the tested electronic parts D are filled (for the acceptable products and the rejected products). Further, the empty tray T is collected only when all the electronic components D are conveyed from the tray T for uninspected products. On the other hand, loading and unloading of the electronic component D with respect to another tray is performed more frequently. (2) In the arrangements 11 and 12 of FIG. 6, the tray T for rejected products is arranged in the lower stage. This is because the yield is usually 50% or more, and even if the rejected product tray T is arranged in the lower stage, there is little fear that the inspection speed will decrease. If the yield is 5
If it is smaller than 0%, the lowering of the tray for acceptable products T causes less decrease in the inspection speed. (3) For the above reason, in the arrangements 11 and 12 of FIG. 6, the empty tray T and the rejected product tray T are arranged in the lower stage. Hereinafter, the arrangement of the tray T in the present embodiment will be described as the arrangement 11 of FIG.

As described above, the tray T can be moved in the Y direction independently of each other by the Y-direction tray transport mechanism 180. By moving the tray T in the Y direction,
It is possible to attach / detach the electronic component D at a desired position in the tray T without moving the component transport mechanism 160 in the Y direction (almost or at all). That is, all the electronic components D stored in the tray T can be inspected, and the inspected electronic components D can be stored in all the storage locations of the tray T. By efficiently using the entire tray T, it is possible to reduce the number of trays T to be prepared with respect to the number of electronic components D. Further, the electronic component D can be moved by the component transfer mechanism 160 and the tray T can be moved by the Y-direction tray transfer mechanism 180 at the same time. As a result, the inspection speed is improved.

The tray T is moved by the tray T for uninspected products.
(Tray Tb (1) in this embodiment) From above the electronic component D
Is carried out, and also when the inspected product trays (trays Ta (1) and Ta (2) in this embodiment) are filled with the inspected electronic components D. That is, the empty untested tray Tb (1) is moved to the position of the empty tray Tb (2), and the inspected product trays Ta (1) and Ta (2) filled with the electronic component D are After being carried out to the stocker placement area 140 by the Y-direction tray transport mechanism 180, the empty tray Tb
(2) is moved to the inspected product tray Ta (1), Ta (2) position. This movement is performed by the X-direction tray transport mechanism 170, and at this time, the upper tray T (1) is used as necessary.
Are transported by the Y-direction tray transport mechanism 180 (1) to enable access to the lower tray T (2). The suction head 165, which will be described later, may be used instead of the X-direction tray transport mechanism 170. By doing so, the suction head 165 carries out both the carrying of the electronic component D and the carrying of the tray T, and the manufacturing cost of the apparatus can be reduced (the X-direction tray carrying mechanism 170 can be omitted).

(Details of Stocker Arrangement Area 140) The stocker arrangement area 140 is set along the X-axis robot 120b on the upper surface of the base 110, and the stockers 141 (141a) for accommodating the trays T in a stacked state.
(1), 141a (2), 141b (1), 141b
This is a substantially rectangular area in which (2)) is arranged. Here, the numbers 1 and 2 in parentheses indicate the stockers 141 installed above and below the upper surface of the base 110, respectively.
In the present embodiment, the stocker placement area 140 is divided into stocker placement areas 140a and 140b, and the stockers 141a (1) and 141a (2) and the stockers 141b (1) and 141b (2) are vertically stacked and detachable. Is located in. 7 and 8 show the upper stocker 141 (1) (141a (1), 141b (1)),
Lower stocker 141 (2) (141a (2), 14
1b (2)) is an enlarged front view and side view, respectively. 7 and 8, (A) is a front view and (B) is a side view. Since the stocker 141 stores the tray T, it functions as a container storage unit in the present application. Therefore, the stocker placement area 140 functions as a container storage section placement area.

As described above, the stocker placement area 140
Are divided into stocker placement areas 140a and 140b, and the stockers 141a (1), 141a (2), stockers 141b (1), 141b (2) are arranged one above the other in the vertical direction. The divided area is the tray arrangement area 130a,
It corresponds to 130b. Stocker 141a (1),
141a (2) and stockers 141b (1), 14
1b (2) are stacked vertically and arranged in a line in the X direction, and the trays T are stacked and stored in multiple stages inside. As a result, the installation area of the device is effectively used.

A. Configuration of the upper stocker 141 (1) The stocker 141 (1) includes four columns 143 (1),
Bottom 144 (1), four tray separation hooks 145
(1), the tray elevating mechanism 146 (1), and the tray conveying mechanism entry region 147 (1) into which the Y-direction tray conveying mechanism 180 enters is formed therein.

The pillar 143 (1) is a pillar having a substantially L-shaped cross section, and prevents the tray T from moving in the two axial directions of XY corresponding to the four corners of the tray T. Bottom 144 (1)
Is connected to the column 143 (1), is composed of a substantially rectangular bottom plate and four side plates, and has a tray transport mechanism entry region 147 (1) therein. Also, the bottom portion 144 (1)
The Y-direction tray transport mechanism 180 allows the tray transport mechanism 180 to enter and leave the tray transport mechanism entry area 147 (1).
A door that can be opened and closed is provided on the positive side. Stocker 141
The ceiling part 142 (1) of (1) is the stocker 141.
As the ceiling of (1), it is not removable, but stocker 1
When the tray T is inserted into and removed from the stocker 141 (1) from above the stocker 141 (1), the tray T is removable.

The tray separating hook 145 (1) has a bottom portion 14
4 (1), and are arranged corresponding to the side surfaces of the lowermost tray T in the stocker 141 (1) that face each other. Specifically, a concave portion is formed on the opposite side surface of the tray T, and the tray separating hook 145 (1) is attached to the tray T.
The tray T in the lowermost stage is prevented from dropping downward (in the negative Z direction) by being inserted into the concave portion of the. A drive mechanism (not shown) is connected to the tray separating hook 145 (1), and the tray separating hook 145 is inserted into the side surface recess of the tray T.
Insert and remove (1). By this insertion and removal, the tray T is fixed in the Z direction and released.

The tray elevating mechanism 146 (1) is a tray T
It is a mechanism for vertically moving the tray T up and down in the stocker 141 by vertically moving a flat plate (tray mounting plate) on which the tray is mounted. The raising and lowering of the tray mounting plate is performed by the raising and lowering means (not shown) provided on the column 143 (1). The elevating means is provided not on the bottom part 144 (1) but on the column 143 (1) so that the stocker 141 (2) can be installed immediately below the stocker 141 (1). The tray elevating mechanism 146 (1) is capable of raising and lowering the tray mounting plate in a state where the Y-direction tray transport mechanism 180 on which the tray T is not placed is located in the tray transport mechanism entry area 147 (1). Is. Further, the tray side of the Y-direction tray transport mechanism 180 is notched so as to have a U-shape, so that the tray T is mounted while the tray lifting mechanism 146 (1) is raising the tray mounting plate. If the Y-direction tray transfer mechanism 180 that is not placed is placed in the tray transfer mechanism entry area 14
7 (1), and the tray loading plate of the tray lifting mechanism 146 (1) is raised in advance to shorten the carry-out time of the tray T from the stocker 141 (1). it can. Tray transport mechanism entry area 147
(1) is a substantially rectangular parallelepiped space set inside the bottom portion 144 (1) and below the tray separating hook 145 (1), and the Y-direction tray transport mechanism 180 moves in and out from the Y positive direction.

B. Structure of lower stocker 141 (2) The stocker 141 (2) includes a lid 142 (2), four columns 143 (2), a bottom 144 (2), four tray separating hooks 145 (2), and a tray lifting mechanism. 146 (2), and a tray transport mechanism entry region 147 (2) into which the Y-direction tray transport mechanism 180 enters is formed therein. Of these, the lid portion 142 (2), the tray separation hook 145 (2), and the tray transport mechanism entry region 1
47 (2) is installed above the upper surface of the base 110.

The outer shape of the lid portion 142 (2) is a substantially rectangular parallelepiped shape, and its lower portion is open. Further, it has a tray transport mechanism entry area 147 (2) inside, and the tray arrangement area 1
The side surface on the side of 30 has an opening communicating with the tray transport mechanism entrance area 147 (2). Further, two pairs of tray separation hooks 145 (2) are connected. The pillar 143 (2) is
It is a pillar that is connected to the four corners of the lid portion 142 (2) and has a substantially L-shaped cross section, and holds the tray T in two directions of the X axis and the Y axis corresponding to the four corners of the tray T. The bottom 144 (2) is
It is connected to the column 143 (2) and is composed of a substantially rectangular bottom plate and four side plates. It should be noted that the side plate may be excluded, and the support 143 (2) may be directly connected to the bottom plate which is the bottom portion 144 (2).

The tray separating hook 145 (2) has a lid portion 14
2 (2), the tray transport mechanism entrance area 147
(2) The tray T is arranged so as to support the tray T in the inside, corresponding to the side surfaces of the tray T facing each other. The tray T is fixed by inserting the tray separating hook 145 (2) into the recess of the tray T. Tray separation hook 145
A drive mechanism (not shown) is connected to (2), and the tray separating hook 145 (2) is inserted into and removed from the side surface recess of the tray T. By this insertion and removal, the tray T is fixed and released.

The tray elevating mechanism 146 (2) has a flat plate (tray mounting plate) on which the stacked trays T are mounted, and the stacking tray T is moved up and down to move the stacked trays T to the stocker 141 (2). It is a mechanism that moves up and down inside. The tray transport mechanism entry area 147 (2) is a substantially rectangular parallelepiped space set in the lid portion 142 (2), and the Y-direction tray transport mechanism 180 passes through the opening on the side surface of the lid portion 142 (2) to Y-direction.
Enter and exit from the normal direction.

From inside the stocker 141 to the tray arrangement area 1
The movement of the tray T to the 30 is performed by the following procedure. Here, FIGS. 9 and 10 show stockers 141, respectively.
It is a schematic diagram showing the movement state of the tray T in each of (1) and 141 (2). A. Movement of Tray T in Upper Stocker 141 (1) First, movement of the tray T in the stocker 141 (1) will be described. (1) The tray lifting mechanism 146 (1) raises the tray placing plate and presses the tray placing plate against the bottom surface of the tray T in the stocker 141 (1), and then the tray separating hook 145.
(1) is released (the tray separating hook 145 (1) is taken out from the concave portion on the side surface of the tray T) (see FIG. 9A). (2) Operate the tray elevating mechanism 146 (1) to operate the tray T
Is lowered by one tray T (the tray mounting plate is lowered),
The tray corresponding to the tray separation hook 145 (1) is the second tray from the bottom. (3) The tray separating hook 145 (1) is operated to fix the second tray T from the bottom (tray separating hook 1
45 (1) is inserted into the concave portion on the side surface of the second tray T from the lowermost stage) (see FIG. 9 (B)).

(4) The tray elevating mechanism 146 (1) is operated to lower the tray T at the lowermost stage. At this time, the second tray T from the bottom is the tray separation hook 145 (1).
Is fixed by. (5) Continue lowering the tray T by the tray elevating mechanism 146 (1), and lower the lowest tray T to the tray loading mechanism entry area 147 (1). By this time, the Y-direction tray transport mechanism 180 is supposed to have entered the tray loading mechanism entry area 147 (1). Further, the tray T on the tray elevating mechanism 146 (1) is lowered and placed on the Y-direction tray transport mechanism 180 in the tray loading mechanism entry area 147 (see FIG. 9C). (6) The tray T placed on the Y-direction tray transport mechanism 180 is carried out from the stocker 141 (1) by the Y-direction tray transport mechanism 180 exiting from the tray transport mechanism entry area 147 (1). , Are placed in the tray placement area 130.

From the tray arrangement area 130 to the stocker 14
The movement and placement of the tray T to 1 (1) are performed by the following procedure. (1) The tray T is placed on the Y-direction tray transport mechanism 180. When the Y-direction tray transport mechanism 180 enters the tray transport mechanism entry area 147 (1) from the tray arrangement area 130, the tray T is loaded into the stocker 141 (1) (see FIG. 9C). (2) The tray elevating mechanism 146 (1) raises the tray mounting plate. As a result, the tray T placed on the Y-direction tray transport mechanism 180 is delivered to the tray elevating mechanism 146 (1). The tray placing plate of the tray elevating mechanism 146 (1) is further raised, and the stocker T placed on this is brought into contact with the bottom surface of the bottom tray T in the stocker 141 (1) (see FIG. 9 (B)). ..

(3) Tray separating mechanism 146 (1) with the tray T in contact with the tray separating hook 145.
(1) is released (the tray separating hook 145 (1) is taken out from the concave portion on the side surface of the tray T). (4) Operate the tray elevating mechanism 146 (1) to operate the tray T
The tray T by one tray, and the tray lifting mechanism 146 (1)
The tray T placed on the tray is attached to the tray separating hook 145.
It corresponds to (1) (see FIG. 9A). (5) The tray separating hook 145 (1) is operated to fix the tray T placed on the tray elevating mechanism 146 (1). Thus, the tray T on the tray arrangement area 130 is stored and fixed in the lowermost stage in the stocker 141 (1).
As described above, the tray T on the tray arrangement area 130 is
Is stored and fixed at the bottom of the stocker 141 (1).

B. Movement of Tray T in Lower Stocker 141 (2) The movement of the tray T from the inside of the stocker 141 (2) to the tray arrangement area 130 is performed by the following procedure. (1) The tray elevating mechanism 146 (2) raises the tray placing plate so that the side surface of the uppermost tray T in the tray transporting mechanism entry area 147 (2) faces the tray separating hook 145 (2). (See FIG. 10A). It is assumed that the Y-direction tray transport mechanism 180 has not entered the tray loading mechanism entry area 147 (2). (2) The tray separating hook 145 (2) is operated to fix the uppermost tray T in the tray transport mechanism entrance area 147 (2).

(3) The tray elevating mechanism 146 (2) lowers the tray mounting plate. As a result, the stacked trays are lowered, and the tray T fixed to the tray separating hook 145 (2) is held in the tray transport mechanism entrance area 147. (See FIG. 10B). (4) The Y-direction tray transfer mechanism 180 is moved into the tray carry-in mechanism entrance area 147 (2), and the tray separation hook 1
45 (2) is released, and the tray T is placed on the Y-direction tray transport mechanism 180 (see FIG. 10C). The tray T placed on the Y-direction tray transfer mechanism 180 is fixed to the tray mounting portion 183 (2), and the Y-direction tray transfer mechanism 1
When 80 is withdrawn from the tray transport mechanism entry area 147 (2), it is carried out from the stocker 141 (2) and placed in the tray placement area 130.

From the tray arrangement area 130 to the stocker 14
The movement and placement of the tray T in 1 (2) are performed by the following procedure. (1) The tray T is placed on the Y-direction tray transport mechanism 180. When the Y-direction tray transport mechanism 180 enters the tray transport mechanism entry area 147 (2) from the tray arrangement area 130, the tray T is loaded into the stocker 141 (2) (see FIG. 10C). (2) The tray fixing portion 18 of the Y-direction tray transport mechanism 180
The fixing of the tray T by 4 (2) is released, and the tray separating hook 145 (2) is operated to fix the tray T. Then, the Y-direction tray transport mechanism 180 exits from the tray transport mechanism entry area 147 (2) (FIG. 10).
(See (B)). (3) The tray elevating mechanism 146 (2) moves up the tray mounting plate to bring the stacked trays T mounted thereon into contact with the bottom surface of the tray T fixed by the tray separating hooks 145 (2). Further, the tray separating hook 145 (2) is released so that all the trays in the stocker 141 (2) are placed on the tray placing plate of the tray elevating mechanism 146 (2). (See FIG. 10A).

(4) The tray elevating mechanism 146 (2) lowers the tray mounting plate and moves the stacked trays T downward in the stocker 141 (2). As described above, the tray T on the tray arrangement area 130 is placed in the stocker 1
It is placed at the top of 41 (2).

(Details of Inspection Area 150) Inspection Area 150
Is an X-axis robot 120a, 120 on the upper surface of the base 110.
It is a substantially rectangular area set between b and on the extension of the tray arrangement area 130 in the X direction, and the electronic component inspection unit 200 is arranged below it. Here, FIGS. 11 and 12 are a top view and a cross-sectional view showing the inspection region 150 in an enlarged manner, respectively. In the inspection area 150, two component position confirmation cameras 151a and 151b and two inspection sockets 152a and 152b which are inspection units are arranged. The component position confirmation cameras 151a and 151b are installed on the base 110, and the inspection sockets 152a and 152b are the inspection plates 15
3 and is attached to and detached from the base 110 via the inspection plate 153.

Parts position confirmation cameras 151a, 151b
Is an image pickup camera for confirming the position of the electronic component D transported by the component transport mechanism 160, and includes a line sensor, C
It consists of a CD camera, a bijoun camera, etc. The configuration is not particularly limited as long as planar image information (on one axis direction in some cases) of the electronic component D can be obtained. The component position confirmation cameras 151a and 151b are arranged on the inspection area 150 along the Y direction and symmetrically arranged in the center of the Y direction.
An image of the electronic component D passing above each is captured. By subjecting the captured image to image processing, the position of the electronic component D with respect to the component transport mechanism 160 is detected. As a result, the positional deviation (X, Y, R directions) of the electronic component D when the electronic component D is sucked by the component transport mechanism 160 is detected,
When connecting the electronic component D to the inspection socket 152, the position of the electronic component D can be corrected to improve the reliability of the connection. That is, the electrodes of the electronic component D and the electrodes of the inspection socket 152 can be contacted and connected more reliably.

Parts position confirmation cameras 151a, 151b
Can also be used to inspect the external appearance of the electronic component D. This inspection can be performed when the component transfer mechanism 160 that has picked up the electronic component D passes over the component position confirmation cameras 151a and 151b, similarly to the confirmation of the position of the electronic component D. In this way, the electronic component inspection device 10 can easily perform the visual inspection in addition to the electrical inspection of the electronic component D. Moreover,
In the case where the electronic component D displays the code on the surface,
The type can also be determined from the electronic component D itself by reading the code with the component position confirmation cameras 151a and 151b (multifunctional inspection).

The inspection sockets 152a and 152b are electrically connected to both the electronic component D and the electronic component inspection unit 200, so that the electronic component D can be electrically inspected by the electronic component inspection unit 200. It is a member. The inspection sockets 152a and 152b are installed side by side in the X direction at the center of the inspection region 150 in the Y direction. The inspection plate 153 includes inspection sockets 152a and 152b.
Is a substantially flat plate connected to and detachable from the base 110.

The arrangement of the component position confirmation camera 151 and the inspection socket 152 in the inspection area 150 will be described in detail. In the present embodiment, there are two component position confirmation cameras 151 and two inspection sockets 152, and the inspection sockets 152 are arranged in the X direction.
It is also possible to change the number and arrangement of these. Figure 1
Reference numerals 3 and 14 are top views schematically showing an arrangement example of the component position confirmation camera 151 and the inspection socket 152. FIG. 13 shows the case where there are two component position confirmation cameras 151, and FIG. 14 shows the case where there is one component position confirmation camera 151. As shown in (A) to (C) of FIGS.
There may be a combination of one or two and two or four test sockets 152. Of these, FIG. 13A corresponds to the arrangement in the present embodiment shown in FIG. If the number of the inspection sockets 152 is large, it becomes easy to perform simultaneous and parallel inspection of many electronic components D. In addition, if a plurality of component position confirmation cameras 151 are provided, it becomes possible to confirm the positions of a plurality of electronic components D at the same time. It is preferable to appropriately select the number and arrangement of these components according to the number and arrangement of the component transport mechanism 160. In the present embodiment, the inspection sockets 152 are arranged in the direction in which the approximate center of the tray T is extended in the X direction, so that the movement amount of the component transport mechanism 160 in the Y direction can be reduced.

While the mounting direction of the inspection plate 153 with respect to the base 110 is fixed, (A) of FIGS.
The type of attachment of the two types of inspection plates 153 of (B) is recognized by the inspection position confirmation camera 154 described later, or is input to the control device 190 by an input device (not shown). In addition,
As shown in (A) and (B) of FIGS.
The direction in which the rows of the inspection sockets 152 are arranged may be changed from the X direction to the Y direction by changing the mounting direction of the 53. Inspection sockets 152a, 152b
The mounting direction of is detected by the inspection position confirmation camera 154 serving as a mounting direction detecting means, or data is input. Figure 1
As shown in FIGS. 1 and 12, an opening 155 is formed in the inspection plate 153, and the base 110 is provided with an opening detector 156 corresponding to the opening 155. This opening detector 15
6 includes, for example, an optical sensor and a limit switch,
It is detected whether or not the opening 155 is arranged at the corresponding position.

As described above, the inspection plate 153 is connected in two directions, that is, the direction in which the opening 155 is arranged on the opening detection part 156 and the direction in which the opening 155 is not arranged on the opening detection part 156. it can. The aperture detector 156 is composed of an optical sensor, and the light emitter 15 corresponding to the aperture detector 156 is provided.
By using 8, the correspondence between the inspection plate 153 and the base 110 can be detected. That is, from the light emitting unit 158 to the opening detection unit 15
Correspondence between the opening 155 and the opening detector 156 can be detected depending on whether or not the light directed to the light source 6 is blocked by the inspection plate 153. The light source 158 can be appropriately installed above the aperture detector 156. Also, the inspection plate 153
It is also possible to install it in the opening 155 on the upper surface of the.

It is also possible to configure the opening detection section 156 with a limit switch and detect the opening 155 by turning this limit switch on and off. If the opening 155 is located on the limit switch, the limit switch is turned off, and if the opening 155 is not located on the limit switch, the inspection plate 153 pushes the limit switch to turn it on. At this time, the opening 155 does not need to be formed by a hole penetrating the inspection plate 153, and may be a recess into which the tip of the limit switch can be inserted.

(Details of Component Conveying Mechanism 160) The component conveying mechanisms (conveying arms) 160a to 160d adsorb and convey the electronic component D. Here, the component transport mechanisms 160a, 16
0b is the X-axis robot 120a, and the parts transfer mechanism 160
c and 160d are installed on the X-axis robot 120b. Component transport mechanisms 160a and 160b and component transport mechanism 1
60c and 160d are different from the X-axis robot 120a,
Since the electronic components D are installed on the 120b, the electronic components D can be independently transported in the X direction. As a result, the inspection efficiency of the electronic component D is improved.

15 and 16 respectively show a component transfer mechanism 16
FIG. 3 is an enlarged top view and a side view of FIG. Figure 1
5 and 16, as shown in FIGS.
Are the X-direction drive unit 161 and the Y-direction drive unit 16 respectively.
2, a Z-direction drive unit 163, an R-direction drive unit 164, a suction head 165, and a suction nozzle 166. The component transfer mechanisms 160a and 160c include an X-direction tray transfer mechanism 170 and a suction head 165b of the component transfer mechanism 160b.
An inspection position confirmation camera 154 is connected to the.

The X-direction drive unit 161 is the X-axis robot 12
0 in the X direction, the suction head 165 moves in the X direction.
Allows movement in any direction. The Y-direction driving unit 162 is connected to the X-direction driving unit 161, and the Y-direction driving base 1621,
It is composed of a Y-direction driver 1622. By expanding and contracting the Y-direction drive body 1622 in the Y-direction with respect to the Y-direction drive base body 1621, the suction head 165 can be moved in the Y-direction. Further, when the component transport mechanisms 160a and 160b and the component transport mechanisms 160c and 160d are close to each other in the X direction, the Y-direction drive unit 162 moves the suction head 165 to the Y direction.
It can move in the directions and prevent mutual interference (contact). The Z-direction drive unit 163 is connected to an end of the Y-direction drive body 1622, and is provided with a Z-direction drive base body 1631 and a Z-direction drive body 1632.
Composed of. By moving the Z-direction drive body 1632 up and down with respect to the Z-direction drive base body 1631 in the Z direction, the suction head 165 can be moved in the Z direction. It should be noted that the vertical movement in the Z direction is performed by a ball screw, like the Y direction drive unit 162.
It can also be performed by a driving body such as a ball nut mechanism, a hydraulic cylinder mechanism, or a linear motor mechanism. On the contrary, in the Y-direction drive unit 162, like the Z-direction drive unit 163, the suction head 165 can be moved in the Y direction based on the displacement movement of the members.

The R-direction drive section 164 is the Z-direction drive body 16
The suction head 165, which is connected to the upper end of 32 and has the Z axis as the rotation axis, rotates (rotation in the R direction: left / right rotation in the XY plane). The suction head 165 is a head body 165.
1. Adsorption nozzle support member 1652. The head main body 1651 is connected to the lower end of the Z-direction driving body 1632, and the X-direction driving unit 161, the Y-direction driving unit 162, and the Z-direction driving unit 163 independently move the X-axis, the Y-axis, and the Z-direction. Can be done. The suction nozzle support member 1652 is connected to the lower end of the head body 1651 and supports the suction nozzle 166. The suction nozzle support member 1652 is attached to the head body 1 by the R-direction drive unit 164.
Rotate with respect to 651. It should be noted that when these are moved, the movement amount of the X-direction drive unit 161, the Y-direction drive unit 162, the Z-direction drive unit 163, and the R-direction drive unit 164 is detected by an encoder or the like and is fed back to the control unit 190, so that Appropriate control is possible.

The suction nozzle 166 is detachably connected to the suction head 165, and a negative or positive air pressure is applied to the tip of the suction head 165 by a suction mechanism (not shown) to suck, desorb (mount), or mount the electronic component D. Hold. The suction head 165 can be replaced and used depending on the shape of the electronic component D. The suction nozzle 166 is provided in the R-direction drive unit 1.
It is rotated in the R direction by 64. In addition, the suction nozzle 166
Are connected to the suction head 165, the X-direction drive unit 161, the Y-direction drive unit 162, and the Z-direction drive unit 1 are connected.
63 is moved in the X, Y, and Z directions. In the following, for convenience of expression, these movements and rotations may be referred to as movements of the suction head 165 (head main body 165).
1 does not perform the rotational movement by the R-direction drive unit 164.) The Z-direction drive unit 163 serves as a nozzle elevating unit that moves the suction nozzle 166 up and down.
1 is a nozzle moving unit that moves the suction nozzle 166 along an X-axis rail, that is, a track (not shown) of the X-axis robot 120, and the component transport mechanisms 160a to 160d are component transport units.

The inspection position confirmation camera 154 is installed on the side surface of the suction head 165b, and when an identification code is present on the inspection socket 152, the tray T, and the inspection plate 153, the image of the identification code is viewed from above. You can shoot.
The inspection position confirmation camera 154 includes a line sensor, a CCD camera, a view camera, and the like, and the configuration is not particularly limited as long as the planar (in some cases, uniaxial direction) image information of the electronic component D can be obtained. By subjecting the captured image to image processing, the positions of the inspection socket 152 and the tray T, and the identification code are detected. When the inspection position confirmation camera 154 is arranged in each of the component transport mechanisms 160a to 160d, the inspection position confirmation camera 15
Confirm the position of the uninspected electronic component D on the tray T in 4,
The position of the suction nozzle 166 can be corrected corresponding to the confirmed position. That is, it is possible to reduce the positional deviation (X, Y, R directions) of the electronic component D with respect to the suction nozzle 166 when the electronic component D is sucked. As a result, defective suction of the electronic component D onto the suction nozzle 166 can be prevented, and the inspection efficiency can be improved. Further, the position of the inspection socket 152 can be confirmed, and the position of the electronic component D can be corrected when the electronic component D is connected (mounted) to the inspection socket 152. As a result, it is possible to prevent defective mounting of the electronic component D in the inspection socket 152 and improve the reliability of the inspection.

(Details of X-direction tray transport mechanism 170) As shown in FIGS.
70 (170a, 170b) is the Z-direction tray drive unit 1
71 and a tray suction section 172. The Z direction tray drive unit 171 is connected to the Y direction drive base body 1621 and is movable in the X direction by the X direction drive unit 161, and also moves the tray suction unit 172 up and down. The tray suction portion 172 has a flat plate shape that can be moved in the X and Z directions by the X-direction drive portion 161 and the Z-direction tray drive portion 171, and one or a plurality of suction holes (not shown) are formed on the lower surface thereof. A suction mechanism (not shown) is connected to the tray suction portion 172, and suction and desorption of the tray T can be performed by stopping suction and suction of air from the suction holes. It should be noted that the tray suction unit 172 can perform suction and desorption of the tray T independently of suction and desorption of the electronic component D by the suction nozzle 166.

The X-direction tray transfer mechanism 170 can transfer the tray T on the tray placement area 130. This transportation is performed as follows. (1) The tray suction unit 17 is driven by the X-direction drive unit 161.
2 is moved in the X direction and is conveyed above the tray T to be conveyed. (2) The Z-direction tray drive unit 171 lowers the tray suction unit 172 to bring the lower surface thereof into contact with or close to the upper surface of the tray T to be transported. (3) The tray suction unit 172 is operated to operate the tray suction unit 1
The tray T is adsorbed to 72. (4) The Z-direction tray drive unit 171 raises the tray suction unit 172. The tray T sucked by the tray suction portion 172 rises together with the tray suction portion 172.

(5) The X-direction drive unit 161 moves the tray suction unit 172, which has sucked the tray T, to the transport target position in the X-direction. (6) The Z-direction tray drive unit 171 lowers the tray adsorption unit 172 that has adsorbed the tray T, and brings the lower surface of the tray T into contact with or close to the tray arrangement area 130. (7) The suction of the tray T by the tray suction portion 172 is released (attached / detached), and the tray suction portion 172 is raised by the Z-direction tray drive portion 171. As a result, the tray suction unit 17
The tray T detached from No. 2 is placed in the same position as it was transported.

(Details of Y-direction tray transport mechanism 180) Y
Directional tray transport mechanism 180a (180a (1), 180
a (2)), 180b (180b (1), 180b
(2)) indicates tray placement areas 130a and 130, respectively.
This is a mechanism for transporting the tray T in the Y direction between b and the stocker placement areas 140a and 140b. The numbers in parentheses are the upper and lower trays (tray T (1), T
Corresponds to (2)). In this embodiment, the Y-direction tray transport mechanism 180a (1), 180a (2), 180b.
(1) and 180b (2) are stocker 141, respectively.
a (1), 141a (2), 141b (1), 141b
Corresponds to (2). However, as shown in a later embodiment, the correspondence between the upper stage and the lower stage of the Y-direction tray transport mechanism 180 and the upper and lower sides of the stocker 141 is not always established. As shown in FIGS. 7 and 8, the Y-direction tray transfer mechanism 180 includes a shaft 181, a moving part 182, a tray mounting part 183, and a pair of tray fixing parts 184, and functions as a container transfer part in the present application. Shaft 181
Is a ball screw in which a thread groove is formed on a substantially columnar rod, and from the tray arrangement area 130 to the stocker arrangement area 14
0 (specifically, the tray transport mechanism entry area 147 in the stocker 141) is arranged along the direction in which it connects.
The shaft 181 is connected to a rotating mechanism composed of a servo motor (not shown), and by operating this rotating mechanism, the shaft 181 rotates about its axis. It should be noted that during this rotation, the operation amount of the rotating mechanism is detected by an encoder or the like and is fed back to the control unit 190, whereby accurate control can be easily performed. The moving portion 182 has a substantially flat plate shape,
Has a ball nut part. The ball nut portion is penetrated by the shaft 181. The rotation of the shaft 181 causes the shaft 181 and the moving portion 182 to mesh with each other by the ball screw and the ball nut.
The moving unit 182 moves back and forth along the axis 81.

The tray mounting portion 183 is composed of a substantially rectangular flat plate and mounts the tray T thereon. The tray placing portion 183 is connected to one side of the moving portion 182 on the lower surface near one end thereof and moves along with the moving portion 182 along the axis of the shaft 181. The tray mounting portion 183 is formed of rod-shaped members each having a substantially rectangular cross-section and arranged on each of the four sides on the upper surface side. Among the four sides of the tray fixing portion 184, at least one of the two sides in the X direction can be moved in the X direction by a moving device (not shown). As a result, the distance between the tray fixing portions 184 in the X direction can be appropriately controlled, and the tray T on the tray placing portion 183 can be pressed and fixed by both side surfaces thereof.
Furthermore, among the tray fixing portions 184 on the four sides, at least one of the two sides in the Y direction is moved by a moving device (not shown).
Trays T that can move in different directions and have different sizes in the Y direction
May be allowed to be transported.

The Y-direction tray transport mechanism 180 includes a tray T
Can be used when moving from the stocker 141 to the tray placement area 130 or vice versa. In addition to this, the Y-direction tray transport mechanism 180 moves the tray T in the tray placement area 130, and thereby the suction head 16 is moved.
The amount of movement of No. 5 in the Y direction can be reduced. At this time, the trays T can be moved independently or integrally.

(Details of Control Unit) The control unit 190 includes the base 1
CPU 181, ROM 182, RA provided in
The electronic component transport unit 10 includes an M183, a communication controller 194, an I / O controller 195, a motion controller 196, and an image controller 197.
0 drive control and electronic component inspection unit 20
Communication with a control unit (not shown) of 0 is performed.

The CPU 191 has a ROM 192 and a RAM 1
Based on the software stored in 93, drive control of the electronic component transport unit 100 and communication with the electronic component inspection unit 200 are performed through the communication controller 194, I / O controller 195, motion controller 196, and image controller 197. This software carries the electronic component D and the tray T according to a combination of the electronic component D to be inspected and the inspection socket 152 and a signal from the electronic component inspection unit 200,
The electronic component inspection unit 200 performs the inspection based on the software of the inspection content corresponding to the electronic component D.

The ROM 192 and the RAM 193 are respectively
It is a storage means for storing fixed and temporary information, and stores, for example, an operation procedure of the electronic component carrying unit 100, software indicating the contents, information indicating the status of the electronic component carrying unit 100, and the like. This information includes suction head 1
It includes component suction information when the electronic component D on the tray T is suctioned by 65, component mounting information when the electronic component D is mounted on the inspection socket 152, and the like. By referring to these pieces of information when the suction head 165 suctions and detaches the electronic component D, it is possible to more reliably eliminate the malfunction.

Storage means (ROM 192, RAM 193)
Stores the information on the mounting direction of the inspection socket 152 received by the I / O controller 195 from the opening detection unit 156, and the software for rotating or moving the suction head 165 corresponding to this mounting direction. That is, the suction head 165 is provided so as to correspond to the inspection socket 152.
Is rotated or moved to securely mount the electronic component D in the inspection socket 152. The suction head 165
It is preferable that the rotation is performed during the movement of the suction head 165 in terms of the efficiency of inspection (prevention of decrease in inspection speed).

The communication controller 194 communicates with the electronic component inspection unit 200, for example, the inspection socket 152.
Information indicating whether the electronic component D is correctly placed on the electronic component D, or further type information of the electronic component D is output to the electronic component inspection unit 200, and the inspection result indicating the inspection result of the electronic component D by the electronic component inspection unit 200 Information is input from the electronic component inspection unit 200, and device state information indicating the state of the electronic component transport unit 100 is input / output. In this way, when the electronic component D is transported and inspected, the electronic component transport unit 100 and the electronic component inspection unit 2
Information is exchanged between 00s. Communication between the communication controller 194 (electronic component transport unit 100) and the electronic component inspection unit 200 can be performed by various methods such as wired and wireless. For example, a worker connects the signal coupler to enable communication between the electronic component transport unit 100 and the electronic component inspection unit 200. In addition, the electronic component inspection unit 200 is replaced with the electronic component transport unit 100.
When inserting into the lower space 111, the signal couplers of both the electronic component inspection unit 200 and the electronic component transport unit 100 may be automatically connected.

The I / O controller 195 and the motion controller 196 are respectively the parts transport mechanism 160, X
Directional tray transport mechanism 170, Y-direction tray transport mechanism 18
0, the stocker 141 is connected to a drive unit (not shown). The drive unit includes an X-direction drive unit 161, a Y-direction drive unit 162, and a Z-direction drive unit 16.
3, connected to the R direction drive unit 164.

The I / O controller 195 inputs the state information indicating the state from the component transfer mechanism 160 and the like, and the motion controller 196 outputs an operation command for instructing the operation content to the component transfer mechanism 160 and the like. As a result, the component transfer mechanism 160 sucks, desorbs, conveys the electronic component D,
Adsorption, detachment, and conveyance of the tray T by the X-direction tray conveyance mechanism 170, and tray T by the Y-direction tray conveyance mechanism 180
Control, release of fixation, conveyance, loading and unloading of the tray T from the stocker 141, and the like. Further, the I / O controller 195 receives information on the mounting direction of the inspection socket 152 from the opening detection unit 156. This information is used to rotate or move the suction head 165 so as to correspond to the inspection socket 152 and securely mount the electronic component D on the inspection socket 152.

The image controller 197 includes the component position confirmation cameras 151a and 151b and the inspection position confirmation camera 154.
Is connected to, and outputs an imaging command for instructing imaging to these, and inputs an imaging result (image information) from them. The image information of the captured image is subjected to image processing by the CPU 191, and the position of the suction head 165, the suction head 1
Position of electronic component D with respect to 65, socket 152 for inspection
The position of the tray T, the position of the electronic component D with respect to the inspection socket 152 or the tray T, and the like are detected. In addition,
A control unit (not shown) on the electronic component inspection unit 200 side that controls the input / output of signals for electronic circuit inspection and a control unit 190 that mainly controls the electronic component transport unit 100 side are integrated to form an electronic component inspection unit 200 side. It may be placed in.
Alternatively, it may be arranged on the electronic component carrying unit 100 side.

(Details of Electronic Component Inspection Unit 200) The electronic component inspection unit 200 is electrically connected to the inspection socket 152 and electrically inspects the electronic component D. Measuring devices and the like for inspecting the electronic component D are installed in the electronic component inspection unit 200, and these measuring devices are electrically connected to the inspection socket 152. As a result,
The electronic component inspection unit 200 includes an inspection socket 152.
The electronic component D can be inspected via the. The electronic component inspection unit 200 can be inserted into the space 111 of the base 110 from both X and Y directions. Space 111
Is open in two directions on the side surface of the electronic component carrying unit 100. As a result, the electronic component transport unit 1
00 and the electronic component inspection unit 200 are easily connected.

(Operation of Electronic Component Inspection Device 10) Next, the overall operation of the electronic component inspection device 10 will be described. Figure 1
7 is a timing chart showing an operation procedure of the electronic component inspection apparatus 10, and FIGS. 18 to 25 are top views showing a state of the electronic component inspection apparatus 10 when operating according to the operation procedure shown in FIG. Reference numeral 11 indicates an inspection area 150. Here, the horizontal axis of FIG. 17 is time, the vertical axis is X,
The output states of the drive commands in the Y, Z, and R directions are shown. The subscript a of X, Y, Z, and R shown here,
b, c, and d are component transfer mechanisms 160a to 160, respectively.
Corresponds to d. In addition, since the suction heads 165c and 165d do not move in the X and R directions within the time range shown in FIG. 17, the Xc, Xd, Rc, and Rd in FIG.
Is omitted.

(1) Time t0 (see FIG. 18) At time t0, the electronic components D1 and D2 are connected to the inspection sockets 152a and 152b and are inspected. Here, the suction heads 165a and 165b respectively connect the electronic components D1 and D2 connected to the inspection sockets 152a and 152b to the inspection sockets 152a and 152b.
It is in the state of pressing respectively. On the other hand, the suction heads 165c and 165d are respectively located in the negative Y direction of the suction heads 165a and 165b in a state of sucking the electronic components D3 and D4 which are not inspected. (2) Time t1 to t2 At time t1, the inspection of the electronic components D1 and D2 ends. The air pressure in the suction holes of the suction nozzles 166a and 166b is changed from positive pressure to negative pressure, and the suction head 165
Each of a and 165b rises in the positive Z direction. As a result, the electronic components D1 and D2, which are sucked by the suction heads 165a and 165b, are detected by the inspection sockets 152a and 15a.
Separated from 2b.

(3) Times t2 to t3 (see FIG. 19) The suction heads 165a to 165d are moved together in the Y-axis positive direction. As a result, instead of the suction heads 165a and 165b, the suction heads 165c and 165d are located above the inspection sockets 152a and 152b. (4) Time t3 to t4 At time t3, the suction heads 165a and 165b start moving in the negative direction of the X axis. In addition, the suction head 165c,
All 165d descend. Suction heads 165c, 16
5d descends, and the air pressure in the suction holes (not shown) is changed from negative pressure to positive pressure at the tips of the suction nozzles 166c and 166d. Inspection sockets 152a, 152b
Connected to the electronic components D3 and D4 at time t4.
Inspection is started.

(5) Times t5 to t6 (see FIG. 20) As a result of the movement of the suction heads 165a and 165b in the X direction, the suction heads 165c and 165d are displaced from each other in the X direction. At this time, the suction head 165b becomes the suction head 1.
After passing the X direction position of 65c, the suction head 165
a and 165b are moved so as to return to the Y-axis negative direction. Here, the suction heads 165a and 165b are maximally positioned in the Y-axis negative direction, and the suction heads 165c and 165d are maximally positioned in the Y-axis positive direction.
When 65b and the suction heads 165c and 165d are relatively moved in the opposite directions in the X-axis direction, head interference occurs. When one of the suction heads 165a and 165b or the suction heads 165c and 165d is on the position of the inspection sockets 152a and 152b in the Y direction, the other suction head 165 (165c, 165d or 165).
The area where interference (contact) occurs when (a, 165b) is moved in the X direction is called a head interference area, which is shown as Ai in FIGS. That is, the movement of the suction heads 165a and 165b in the negative Y-axis direction at times t5 to t6 is performed outside the head interference area Ai. In this way, the interference (contact) between the suction heads 165a, 165b and the suction heads 165c, 165d is avoided.

(6) Times t7 to t8 (see FIG. 21) At time t7, when the electronic components D of the suction heads 165a and 165b are both acceptable products, the suction heads 165a, 165a,
165b completes the movement onto the acceptable product tray Ta (1) and stops the movement in the X direction. Further, the suction heads 165a and 165b descend. For the sake of clarity, it is assumed here that the positions on the tray Ta (1) for housing the two electronic components D1 and D2 are sufficiently separated in the X direction. That is, the suction heads 165a and 165b
The mutual interference does not pose a problem, and the suction heads 165a, 16a
5b can be descended at the same time. Then, the suction heads 165a and 165b rise. Prior to this ascent, the electronic components D1 and D2 are detached and attached to be housed in the inspected product trays T1 and T2.

Generally, suction heads 165a, 165
Interference between b is a problem. Therefore, the electronic component D1,
When both D2 are acceptable products, the electronic components D1 and D2 are stored in the following procedure. One head is moved in the X direction and positioned on the tray Ta (1), and is lowered in the Z axis direction, the electronic component D is attached / detached, and then raised, and then the other head is moved in the X direction to move the tray Ta (1). ), And descends in the Z-axis direction, detaches and attaches the electronic component D, and then ascends. Simultaneously with the movement of the other head in the X direction, one head is retracted from the tray Ta (1) to avoid interference with the other head. When one or both of the electronic components D1 and D2 are rejected products, the Y-direction tray transport mechanism 1 is stored when the rejected products are stored.
The tray Ta (1) is moved by 80a (1), and the upper surface of the tray Ta (2) for rejected products is exposed. Then, the suction head 165 that has adsorbed the rejected electronic component D onto the tray Ta (2) descends, and the rejected electronic component D is dropped.
To store.

(7) Time t8 to t10 At time t8, the suction heads 165a and 165b start moving in the positive direction of the X-axis toward the untested product tray Tb (1). Time t9 to t10 during movement in the X-axis positive direction
In, the suction head 165b moves to the reference position in the Y direction and the R direction. At the same time, the Y-direction tray transport mechanism 180 operates to move the tray Tb (1) in the Y-direction.
The reference position Y0 in the Y direction is the component position confirmation camera 151.
The midpoint between a and 151b is represented as Y0 in FIGS. (8) Time t10 to t12 (see FIG. 22) At time t10, the suction head 165b moves the tray T
Reach above b (1). After that, the suction head 165
b descends to Z3 toward the tray Tb (1).
As a result, the suction nozzle 166b contacts or approaches the upper surface of the electronic component D6 housed in the tray Tb (1). Furthermore, the suction head 165b rises. Prior to this rise, the suction head 165b sucks the electronic component D6 by the suction nozzle 166b. As a result, the suction head 1
65b rises while holding the electronic component D6. Time t
The suction heads 165a and 165b move in the X direction from 10b, and the suction head 165a moves to the tray Tb at time t11.
(1) Reach above. Between the times t11 and t12, as in the case of the suction nozzle 166b, the suction nozzle 1
The electronic component D is adsorbed by 66a. At time t12, the suction head 165a moves the inspection socket 152
The movement in the positive direction of the X axis is started toward a. When the positions on the tray Tb (1) of the electronic component D to be sucked by the suction heads 165a and 165b are sufficiently separated in the X direction, the inspected electronic component D is placed on the tray Ta (1). Like the case of storing, the suction head 165
It is possible to simultaneously lower, adsorb, and raise a and 165b, respectively, and it is possible to shorten the time for adsorption.

(9) Times t13 to t15 (see FIG. 23) At times t13 to t14 during movement in the X direction, the suction heads 165a and 165b move in the Y axis positive direction.
This movement in the Y direction is for preventing interference between the suction heads 165 within the head interference area Ai, and is performed before entering the head interference area Ai. Then, the suction heads 165a and 165b pass above the component position confirmation camera 151a while moving in the X direction. Specifically, the suction heads 165b and 165a pass on the component position confirmation camera 151a in this order, and at the time of this passage, an image is captured by the component position confirmation camera 151a, and the electronic components D5 and D6 are based on the captured image information. Position (suction head 165
a, 165b) is confirmed. (10) Times t15 to t16 Based on the confirmed positions of the electronic components D5 and D6, the positions of the suction heads 165a and 165b in the Y and R directions are corrected at times t15 to t16 during movement in the X direction. This is an inspection socket 152 for electronic parts D5 and D6.
This is for reliable connection to the a and 152b. An error may occur in the suction position when the suction heads 165a and 165b suction the electronic components D5 and D6 due to the displacement of the mounting position when the electronic components D5 and D6 are stored in the tray T3. To eliminate.

(11) Time t17 to t18 (see FIG. 24) At time t17, the movement of the suction heads 165a and 165b in the X direction is completed. In addition, the inspection of the electronic components D3 and D4 is completed. From time t17 to t18, the suction heads 165c and 165d suction the electronic components D3 and D4 and move up. (12) Time t18 to t19 (see FIG. 25) Suction heads 165a, 165b, suction head 165c,
165d moves in the Y-axis negative direction all at once. As a result, the suction heads 165a and 165b are attached to the inspection socket 152.
It comes to be located above a and 152b. Time t15
Since the positions of the suction heads 165a and 165b are corrected from t16 to t16, the electronic components D5 and D6 are at the positions (upward) corresponding to the connection with the inspection sockets 152a and 152b.

(13) Time t19 to t20 The suction heads 165a and 165b are lowered and the electronic component D is moved.
5, D6 are connected to the inspection sockets 152a, 152b. Then, at time t20, the electronic components D5 and D6 are
Inspection is started. The operation here is performed by the suction head 16
5a, 165b and the suction heads 165c, 165d are basically replaced with each other, except that the roles of the suction heads 165c, 165d are exchanged. (14) After time t20, the inspection of the electronic components D5 and D6 continues. Then, the suction heads 165a and 165b and the suction head 165
Except that the roles of c and 165d are exchanged, the operation corresponding to after time t4 is repeatedly continued.

In the operation of the electronic component inspection apparatus 10 described above, the case where the inspection sockets 152 are lined up in the X direction will be described. The description of the control of the position of is omitted. Actually, the type of the inspection socket 152 and the mounting direction are detected by the inspection position confirmation camera 154, the opening detection unit 156, and the like. Then, the type of the detected inspection socket 152,
And the suction head 165 is moved corresponding to the mounting direction. As a result, at the times t3 and t19, the suction head 1
65 is located above the inspection sockets 152a and 152b. In addition, the type of the inspection socket 152,
The detection of the mounting direction may be performed only once when the operation of the electronic component inspection apparatus 10 is started.

In the electronic component inspection apparatus 10 described above, the component transfer mechanism 160 is installed in each of the two X-axis robots 120a and 120b. Therefore, the inspection of the electronic component D by the inspection socket 152 can be performed almost continuously.
Specifically, times t1 to t4 and times t17 to t20
Except for the replacement time of electronic parts D in
Is connected to the inspection socket 152, and the inspection is performed.

(Second Embodiment) FIG. 26 is a side view showing an electronic component inspection apparatus 2000 according to a second embodiment of the present invention. As shown in FIG. 26, the electronic component inspection apparatus 2000 is configured with an electronic component transport unit 2100 that transports the electronic component D, or in combination with the electronic component inspection unit 200 that further inspects the electronic component D.
Here, the stocker 2121 (1) (2141a
(1), 2141b (1)) and stocker 2121
(2) (2141a (2), 2141b (2)) is the first
Stocker 141 (1), 141 in the embodiment
Corresponds to (2). In the first embodiment, the stocker 141
While (1) is in a state of being stacked on the stocker 141 (2), 2121 (1) is the base 11 in this embodiment.
It is installed directly on 0. Also, stocker 2121
(2) is installed below the base 110 in the tray arrangement area 130, and the tray T in the stocker 2121 (2) is
The suction head 165 has an opening above the lid so that the suction head 165 can be accessed. Stocker 214
It is possible to effectively utilize the installation area of the device without stacking 1 (1) and 2141 (2) vertically.

There may be various patterns other than this in the arrangement of the stocker. 27 and 28 are a side view and a top view showing a location where the stocker is arranged. Stocker placement area 141 as an area for placing stockers
(1), 140 (2), 140 (3) (in front of the tray placement area 130, on the tray placement area 130, and behind the tray placement area 130, respectively). Here, the stocker arrangement area 141 (1) corresponds to the stocker arrangement area 141 in the first embodiment. Also, stocker 14
The stocker 141 can be arranged according to whether the No. 1 is arranged above or below the base 110. As described above, the stocker is placed in the stocker placement area 1
41 (1), 140 (2), 140 (3), and further above or below the base 110 are classified. In addition, stocker placement area 1
Since 40 (2) coincides with the tray arrangement area 130, the case where the stocker is arranged above the base 110 is excluded.

FIG. 29 is a table showing an arrangement example of stockers. Two stockers are placed in the tray placement area 141 (1),
140 (2), 140 (3) and above the base 110,
It is shown which one is located below. Furthermore, each stocker has trays T (T
Arrangements 21 to 27 are shown as a combination example of whether (1): upper row and T (2): lower row are stored. Of this,
The arrangements 21 and 22 correspond to the arrangements of the stockers shown in the first and second embodiments, respectively. As described above, there are various combinations of stockers for supplying the upper and lower trays T, and any of them can be used to realize the arrangement of the trays T shown in FIG. 6 in the first embodiment. It should be noted that the stocker placement may be different between the tray placement areas 130a and 130b.

(Third Embodiment) FIG. 30 is a perspective view showing an electronic component inspection apparatus 3000 according to a third embodiment of the present invention. As shown in FIG. 30, the electronic component inspection apparatus 3000 is configured with an electronic component transport unit 3100 that transports the electronic component D, or in combination with the electronic component inspection unit 200 that further inspects the electronic component D.
Here, in the tray arrangement area 130, the tray Ta is
In addition to (1), Ta (2), trays Tb (1), Tb (2), a heating unit H is arranged. In this embodiment, since the tray T is not arranged in the area where the heating section H is arranged, the heating section H is arranged in the stocker arrangement area 140c.
There is no stocker corresponding to the position (tray placement area 130c).

The heating section H is for heating the electronic component D, and moves between the stocker placement area 140 and the tray placement area 130 as required. To move the heating section H between the stocker placement area 140 and the tray placement area 130, the heating section transport mechanism Hm is used. The heating unit H has a substantially flat plate shape, and the electronic component D is driven by the component transfer mechanism 160.
The electronic component D can be heated by mounting. This heating is usually performed before taking out the uninspected electronic component D from the tray T and connecting it to the inspection socket 152. By inspecting the electrical characteristics of the heated electronic component D, the electronic component D can be inspected in an environment higher than room temperature.

The heating section transport mechanism Hm allows the heating section H to move appropriately within the tray arrangement area 130. As a result, a large number of electronic components D can be placed in a wide range not only in the X direction but also in the Y direction on the heating unit H, and the electronic components D having a large heat capacity are retained on the heating unit H for a long time to ensure the reliability. Inspection at a desired temperature becomes possible. Heating unit transport mechanism Hm
Is a ball screw in which a thread groove is formed on a substantially columnar rod, and from the tray arrangement area 130 to the stocker arrangement area 14
They are arranged along the direction connecting 0s. The heating section transport mechanism Hm is connected to a rotation mechanism composed of a servo motor (not shown), and by operating this rotation mechanism, the heating section transport mechanism Hm, which is a ball screw, rotates about its axis. It should be noted that during this rotation, the operation amount of the rotating mechanism is detected by an encoder or the like and is fed back to the control unit 190, whereby accurate control can be easily performed. Heating unit transport mechanism Hm
Penetrates the ball nut portion formed in the heating portion H. As the heating section transport mechanism Hm rotates, the heating section transport mechanism Hm and the heating section H mesh with the ball screw and the ball nut, so that the heating section H moves back and forth along the axis of the heating section transport mechanism Hm. Note that when the heating time is short, it is not necessary to place and retain many electronic components D in the heating unit H, so the heating unit H is arranged at the lowermost stage so that the heating unit H moves in the Y direction. The heating section transport mechanism Hm can be excluded, and the cost can be reduced. Even when the heating unit H is arranged in the upper stage, the heating unit transfer mechanism Hm can be configured by an air cylinder, and can be reciprocally moved to two positions inside and outside the tray arrangement region 130, and the cost can be reduced.

As described above, in addition to the tray T or in place of the tray T, the heating portion H can be arranged in the tray arrangement area 130. This is generally shown in Figure 3.
It is 1. In FIG. 31, the tray arranging area 130 is divided into tray arranging areas 130a to 130c, and the trays Ta to Tc (the heating unit H on the tray T is divided into the divided areas).
Are also included). Tray placement area 130a
~ 130c, the stocker placement area 140 is divided into stocker placement areas 140a to 140c. Note that, here, as in the first embodiment, the tray T
Are arranged as trays T (1) and T (2) at the top and bottom, respectively. FIG. 32 is a table showing an arrangement example of the trays T (including the heating section H) in the tray arrangement areas 130a to 130c. Arrangement 31, 32 of FIG.
Are placed in the tray placement area 130 shown in FIG.
The heating part H is added to c. As described above, the placements 21 to 27 of FIG. 29 can be applied to the placement of the stockers in the stocker placement areas 140a and 140b. In addition, a part of the heating part H is shown in parentheses, which means that there are two cases, that is, the case where the heating part H is arranged at this position and the case where the heating part H is not arranged. That is, when the parentheses are removed, a plurality of heating units H can be arranged in the tray arrangement area 130.
For example, when the heat capacity of the electronic component D is large and it takes time to heat the electronic component D, the heating time can be shortened by using the plurality of heating units H.

(Fourth Embodiment) FIG. 33 is a perspective view showing an electronic component inspection apparatus 4000 according to a fourth embodiment of the present invention. As shown in FIG. 33, the electronic component inspection device 4000 is configured with an electronic component transport unit 4100 that transports the electronic component D, or in combination with the electronic component inspection unit 200 that further inspects the electronic component D.
Here, in the tray arrangement area 130, three upper and lower trays Ta (1) to Ta (3) and an upper stage, a middle stage, and a lower stage,
The lower and upper two trays Tb (1) and the heating unit H are arranged. Tray Ta (1) to Ta (3), Tb (1)
Are stockers 141a (1) and 141a, respectively.
(2), 2141b (2), 141b (1). By using three stockers, the tray Ta
(1) to Ta (3) can be arranged in three stages. The heating section H does not require a stocker, but the stocker 1
It does not matter if the heating part H can be housed in the tray transfer mechanism entrance region (not shown) of 41b (1). At this time, the heating unit transport mechanism Hm moves the heating unit H.

The above-mentioned three-stage arrangement of the tray T is generalized and considered. FIG. 34 shows the tray placement areas 130a and 130b.
To each of the trays Ta (1) to Ta (3) and the tray T.
Tray T when arranging b (1) to Tb (3) in three stages
3 is a table showing an arrangement example of FIG. In addition, here, the tray T is generalized to include the heating unit H. The arrangement 41 of FIG. 34 corresponds to the arrangement of the tray T according to the fourth embodiment shown in FIG. In the arrangement 42, a plurality of heating units H are arranged to speed up heating when the electronic component D has a large heat capacity. Furthermore, generalize the layout of stockers. FIG. 35 shows an example of arranging the stockers in the stocker arranging regions 140 (1) to 141 (3) shown in FIG. 31, which enables the arrangement of three trays. The arrangement 101 of FIG. 35 corresponds to the arrangement of the stocker according to the fourth embodiment shown in FIG. It should be noted that any of the arrangements 101 to 114 can realize the arrangement of trays 41 and 42 shown in FIG. As described above, there are various patterns for the arrangement of the tray T and the stocker. In any case, the tray T can be arranged vertically and the installation area of the apparatus can be effectively utilized.

(Fifth Embodiment) FIG. 36 is a top view showing an electronic component inspection device 5000 according to a fifth embodiment of the present invention. As shown in FIG. 36, the electronic component inspection device 5000 is configured with an electronic component transport unit 5100 that transports the electronic component D, or in combination with an electronic component inspection unit 5200 that further inspects the electronic component D. In the present embodiment, the tray Ta (upper stage: Ta (1),
Lower: Ta (2), Tray Tb (upper: Tb (1),
Lower row: Tb (2) is arranged so as to sandwich the inspection region 150. That is, the tray placement areas 130a and 130b
Are classified.

In the present embodiment, the inspection area 150 is arranged near the center of the base 5110, and the tray arrangement area 130,
The stocker placement area 140 is divided into tray placement areas 130a and 130b and stocker placement areas 140a and 140b with the inspection area 150 interposed therebetween.
As a result, the component transfer mechanism 160 of the X-axis robot 120a
a, 160b, component transfer mechanism 1 of X-axis robot 120b
The 60c and 160d can be efficiently operated, respectively, and the inspection efficiency is improved.

The bottom of the base 2110 has a substantially U shape, and the electronic component inspection unit 2200 is normally inserted into the space 5111 (not shown) of the base 5110 from the Y direction. Become. When a mechanical force (for example, an earthquake) is applied because the bottom of the base 5110 has a substantially U-shape and it is possible to support the weight at the four corners of the base 5110. However, it is hard to fall and stability is improved. As shown by the phantom line, another tray T can be placed on either or both of the tray placement areas 130a and 130b. It is possible to effectively utilize the four suction heads 165 to improve the inspection speed.

(Sixth Embodiment) FIG. 37 is a top view showing a state of an electronic component inspection apparatus 6000 according to a sixth embodiment of the present invention as viewed from above. Electronic component inspection device 6000
37 is configured by an electronic component transport unit 6100 that transports the electronic component D as shown in FIG. 37, or in combination with an electronic component inspection unit 200 that further inspects the electronic component D, and is covered by a cover (not shown). There is. The electronic component carrying unit 6100 includes a base 110 and two Xs.
Axis robots 120a and 120b, tray arrangement area 13
0, stocker placement area 140, inspection area 150, component transfer mechanisms 3160a and 3160b, X-direction tray transfer mechanism 3170, and Y-direction tray transfer mechanisms 180a to 180.
d, a control unit. The X-axis robot 1
20a and 120b may be X-axis rails formed by simple tracks.

38 and 39 are a top view and a side view showing the component transport mechanism 3160 in an enlarged manner. Figures 38 and 3
In the present embodiment, as shown in FIG.
0a and 3160b connect the two X-axis robots 120a and 120b, and the Y-axis robot 316 which connects a pair of X direction drive parts 3161 installed correspondingly above.
It is constructed on the basis of 2. That is, the component transfer mechanism 316
0 is a pair of X-direction drive units 3161, a track (not shown) and Y
A Y-axis robot 3162 having a direction driving device and integrated with an arm member, a Z-direction driving unit 3163, an R-direction driving unit 3165, a suction head main body 3166, a suction nozzle supporting member 3167, and a suction nozzle 3168.

An X-direction tray transfer mechanism 3170 is connected to the component transfer mechanism 3160a, and an inspection position confirmation camera 154 is connected to the suction head body 3166 of the component transfer mechanism 3160b. The suction head including the Z-direction drive unit 3163 and the suction head body 3166 is a Y-axis robot 316.
It moves on 2 along a trajectory not shown. As a result, the suction nozzle 3168 (suction head) moves in the X-direction drive unit 316.
The 1, Y-direction drive unit, Z-direction drive unit 3163, and R-direction drive unit 3165 can move (rotate) in the X, Y, Z, and R directions. As described above, the X-axis robot 312
It is also possible to configure the component transfer mechanism 3160 using a combination of 0 and Y axis robots 3162.

(Other Embodiments) The embodiments of the present invention are not limited to the above-mentioned embodiments, and can be expanded and modified. Extended and modified embodiments are also included in the technical scope of the present invention. (1) In the above-described embodiment, the position of the electronic component on the tray T is confirmed with a component position confirmation camera or the like, and the error in the positional relationship between the suction head and the electronic component D when the suction head sucks is corrected to obtain The reliability of connection of the component D to the inspection socket 152 is improved. Instead of this, a component position adjusting mechanism that automatically corrects the position of the electronic component D may be provided. 40 (A) and 40 (B) are an enlarged top view and a sectional view showing an example of the component position adjusting mechanism 400. The component position adjusting mechanism 400 may be provided on any base of the electronic component carrying unit, but it is preferable to install the component position adjusting mechanism 400 on the heating unit H from the viewpoint of inspection efficiency. Since the position of the component D is adjusted, the component position confirmation means such as the component position confirmation camera can be omitted.

The parts position adjusting mechanism 400 shown in FIG.
It is composed of a position reference unit 401 and a guide unit 402. The position reference portion 401 is a recessed portion that is positioned with respect to predetermined coordinates (X, Y, R) of the electronic component inspection device 10 and is formed corresponding to the outer shape of the electronic component D. The position reference portion 401 in this example is formed of a substantially rectangular parallelepiped recess having a rectangular bottom surface, assuming that the outer shape of the electronic component D is a flat plate rectangular shape. The guide portion 402 is the position reference portion 401.
It has a role of a guide for guiding the electronic component D to, and is composed of a concave portion formed slightly larger than the outer shape of the electronic component D. In this example, the position reference portion 401 is composed of a substantially rectangular trapezoidal recess having sides facing four apexes.

FIG. 41 shows the mechanism of position adjustment by the parts position adjusting mechanism 4210. The electronic component D is sucked by the suction nozzle 166 of the component transport mechanism 160 and is transported onto the component position adjusting mechanism 400 (see FIG. 41 (A)). There is a possibility that the electronic component D has a positional error with respect to the component transport mechanism 160, reflecting the positional error when the electronic component D is placed on the tray T. After that, the suction nozzle 166 is lowered to detach and attach the electronic component D, and the electronic component D is placed (or dropped) in the guide portion 402 of the component position adjusting mechanism 400. The electronic component D placed on the component position adjusting mechanism 400 is guided by the guide unit 402 to the position reference unit 401 by gravity, reaches the reference position, and the position is adjusted (see FIG. 41 (B)). . After that, the component transport mechanism 160 sucks the electronic component D whose position has been adjusted, and the position of the electronic component D with respect to the component transport mechanism 160 is corrected (see FIG. 41C). Therefore, the subsequent mounting of the electronic component D in the inspection socket is reliably performed.

FIG. 42 is an enlarged sectional view and a top view showing a component position adjusting mechanism 410 according to another example. The component position adjusting mechanism 410 includes two position reference walls 411 and 41.
It consists of two. The position reference walls 411 and 412 are walls (projections) that are positioned with respect to predetermined coordinates (X, Y, R) of the electronic component inspection device 10 and are formed corresponding to the outer shape of the electronic component D. . The position reference wall 411 in this example,
412 has an outer shape of the electronic component D as a flat plate rectangular shape, and has reference surfaces corresponding to the shapes of the two side surfaces thereof.

FIG. 43 shows the mechanism of position adjustment by the component position adjusting mechanism 410. The electronic component D is moved by the component conveying mechanism 160 and is conveyed onto the component position adjusting mechanism 410. After that, the electronic component D is placed near the corners of the position reference walls 411 and 412 of the component position adjusting mechanism 4210 (see FIG. 43 (A)). The component transfer mechanism 160 further adjusts the position of the electronic component D so that one side surface of the electronic component D is pressed against the reference surface of the position reference wall 411 (FIG. 43).
(See (B)). Further, while keeping one side surface of the electronic component D pressed against the reference surface of the position reference wall 411, the other side surface of the electronic component D is pressed against the reference surface of the position reference wall 412. Then, the electronic component D is moved.
As a result, the position of the electronic component D is adjusted based on the position reference walls 411 and 412. After that, the component transport mechanism 1
The position of the electronic component D with respect to the component transport mechanism 160 is corrected by the suction of the electronic component D whose position has been adjusted by 60, and the subsequent mounting of the electronic component D in the inspection socket is reliably performed. .

(2) The X-axis robot, that is, the number of trajectories as the constituent elements is only one. By arranging a plurality of trays T (for uninspected products, tested products, empty trays) and further inspection sockets in a line along the X-axis, the installation area of the device in the Y direction and the electronic components D The amount of movement can be reduced.

(3) In the above embodiment, basically, two component transfer mechanisms were installed on the trajectory of one X-axis robot. Three
It is safe to install more than one parts transport mechanism. Further, it is also possible to appropriately set what kind of means is used to configure the X-axis rail on the trajectory of the X-axis robot. Figure 44 shows X
It is a schematic diagram showing the example of the correspondence of an axial rail and a component conveyance mechanism. In FIG. 44 (A), two component transfer mechanisms 512a and 512b are installed on the X-axis rail 511 to configure an X-axis robot. This is a configuration corresponding to the first embodiment, and can be realized by using, for example, a linear motor. In FIG. 44 (B), the X-axis rail 521
a and 521b on the component transfer mechanisms 522a and 522a, respectively.
2b is installed to configure an X-axis robot, which can be realized using, for example, a linear motor. In FIG. 44C, the component transfer mechanism 5 is provided on each of the X-axis rails 531a and 531b.
32a and 532b are installed. Here, X-axis robots 531a and 531b are configured using ball screws. By rotating this ball screw, the component transfer mechanisms 532a and 532b rotate the X-axis rail 5 that is a ball screw.
It moves on each of 31a and 531b. FIG. 44 (D)
In, the base 542 is installed on the X-axis rail 541, and the component transfer mechanisms 543a and 543b are installed on the base 542. The component transfer mechanisms 543a and 543b can change their relative positions in the X-axis direction on the base 542 by the relative movement means 544. Here, the X-axis rail 541 and the relative movement means 544 are
For example, a ball screw can be used. By rotating these ball screws, the movement of the base body 542 on the X-axis rail 541 and the relative position change of the component transfer mechanisms 543a and 543b can be independently performed. The X-axis rail 541 and the relative movement means 544 may be configured by a linear motor.

(4) The component transfer mechanism may be constructed by using a Y-axis robot that can be driven in the Y direction. The Y-axis robot can drive its head portion in the Y direction. Specifically, a Y-axis robot can be composed of a Y-axis rail and a head movable on the rail in the Y direction. An appropriate means such as a server motor, a linear motor, or a ball screw can be used to move the head. It is also possible to configure the Y-axis robot with the fixed part, the movable part, and the movable part movable means. The movable portion is moved by the movable portion moving means with respect to the fixed portion.

By arranging the Y-axis robot so that it can be driven on the X-axis rail, the head can be moved in both the X and Y axes. Therefore, by supporting the suction nozzle on the head of the Y-axis robot so as to be vertically movable and rotatable, the suction nozzle can be moved in all the X, Y, Z, and R directions.

Conversely, it is also possible to install the X-axis rail on the head of the Y-axis robot. By installing a suction head that supports the suction nozzle on the X-axis rail so as to be vertically movable and rotatable, the suction nozzle can be moved in all X, Y, Z, and R directions. In this case, by arranging the tray and the inspection sockets in a line along the X-axis rail,
The Y-axis robot can be shortened in the Y direction, and the area occupied by the device in the Y direction can be reduced.

Even when a Y-axis robot is used, X
The shaft rail can take either one or two configurations. When the number of X-axis rails is one, the distance between the stocker and the X-axis rail can be reduced, and the tray movement amount can be reduced. When there are two X-axis rails, the distance between the two X-axis rails is appropriately adjusted by the Y-axis robot in order to prevent interference between the suction heads installed on each of them. At this time, only one of the X-axis rails may be supported by the Y-axis robot. Even if only one of the suction heads on the X-axis rail is moved in the Y direction by the Y-axis robot, interference between the suction heads can be prevented.

(5) In the above embodiment, the trays including the empty trays are arranged in the tray arrangement area, but the empty trays may not be arranged in this area. In this case, the empty tray is carried between the stocker for storing the empty tray and the tray arrangement area (the tray arrangement area for the uninspected product, the tray arrangement area for the inspected product) as necessary. A suction nozzle can be used for this conveyance. In this case, it is preferable to add a suction nozzle for exclusively sucking and transporting the tray in addition to a suction nozzle for sucking and transporting the electronic component.

(6) In the above embodiment, a single suction nozzle is arranged on the suction head, but two or more suction nozzles may be arranged. Further, the number of inspection sockets may be one, or three or more. (7) When the number of X-axis rails is two, the area on the tray T may be divided into two in the Y direction corresponding to the component transport mechanism 160 installed on each rail. The component transfer mechanism installed on each X-axis rail shares the respective divided regions to transfer the electronic components. By doing so, the amount of movement of the component transport mechanism 160 in the Y direction can be reduced. In addition, the amount of movement can be reduced by moving the tray within the tray arrangement area by the Y-direction tray transfer mechanism during the transfer of the electronic component. In any case, the size of the device in the Y direction can be reduced.

(8) In the above-mentioned embodiment, communication is performed between the transport unit and the inspection unit, but this communication may be unnecessary. For example, the inspection position confirmation camera 154 can monitor the inspection socket, and when the mounting of the electronic component in the inspection socket is confirmed as a trigger, the electronic component inspection apparatus can start the transportation and inspection of the electronic component. . If a mark indicating the type of the inspection socket and the inspection content is formed on the inspection socket, the inspection position confirmation camera can read the mark and select an appropriate inspection. Examples of the inspection content include the type of electronic component to be inspected, inspection procedure, and the like. If the transport unit is provided with a table showing the correspondence between this mark and the inspection content, the appropriate inspection content can be selected by referring to this table.

(9) In the above embodiment, the movement of the suction heads in the Y direction for preventing interference (contact) between the suction heads on each of the two X-axis robots is performed in the inspection area. However, this movement to prevent interference can be performed anywhere on the device. The interference between the two suction heads can be performed in the tray arrangement area. This move is 2
It can also be used to prevent interference when two suction heads intersect in the X direction. For example, when two suction heads move in the opposite directions of the X axis, either or both suction heads can be moved in the Y direction (separated in the Y direction) and can pass each other without collision.

(10) In the above embodiment, the mounting direction of the inspection socket is detected by detecting the hole formed in the inspection plate by the sensor (eg, optical sensor, limit switch) on the base side. Instead of this, the mounting direction of the inspection socket can be detected by other means.

For example, by forming a mark (for example, a dot shape or a cross shape) on the inspection plate and confirming the mark on the inspection plate by the inspection position confirmation camera, the mounting direction of the inspection plate, and thus the inspection socket, can be improved. Further, the position (coordinates in the X and Y directions) can be detected if necessary. In this case,
Since it is also possible to detect the position of the inspection plate, it is possible to cope with the mounting error of the inspection plate with respect to the base, and the electronic component D can be connected to the inspection socket more reliably.

It is also possible to detect the mounting direction of the inspection socket by forming (for example, dot-shaped or cross-shaped) on the inspection socket and confirming the mark on the inspection socket with the inspection position confirmation camera. . In this case, the direction and position of the inspection socket itself (X, Y direction coordinates)
Can be detected directly, so that the electronic component D can be more reliably connected to the inspection socket.

The number of marks formed on the inspection plate and the inspection socket may be one, but may be two or more. For example, two marks can be formed on either the inspection plate or the inspection socket, and the position and direction of the inspection socket can be detected based on the coordinates of the two marks by capturing an image of the two marks on the inspection position confirmation camera. In this case, by using marks arranged at different positions, the position and direction of the inspection socket can be detected more accurately.

The position and direction of the inspection socket can be input by an operator using input means (input switch, mouse, keyboard, etc.) without providing the mounting direction detecting means as described above. The input unit at this time functions as a mounting direction teaching unit that teaches the control unit 190 the mounting direction of the inspection socket. Since this attachment direction teaching means only needs to teach the attachment direction of the inspection socket by some means, it includes attachment position detection means for detecting the attachment position of the inspection socket.

[0112]

As described above, according to the present invention, it becomes easy to provide an electronic component inspection apparatus which can efficiently use the installation area of the apparatus.

[Brief description of drawings]

FIG. 1 is a perspective view showing an electronic component inspection device according to a first embodiment of the present invention.

FIG. 2 is a top view showing a state in which the electronic component inspection device according to the first embodiment is viewed from the Z-axis direction in FIG.

FIG. 3 is a side view showing a state in which the electronic component inspection device according to the first embodiment is viewed from the X-axis direction in FIG. 1.

FIG. 4 is a front view showing a state in which the electronic component inspection device according to the first embodiment is viewed from the Y-axis direction in FIG. 1.

FIG. 5 is a schematic diagram showing a correspondence relationship between a tray arrangement area and a stocker arrangement area.

FIG. 6 is a table showing an arrangement example of trays T in a tray arrangement area.

FIG. 7 is a front view and a side view showing an upper stocker in an enlarged manner.

FIG. 8 is a front view and a side view showing a lower stocker in an enlarged manner.

FIG. 9 is a schematic diagram showing a moving state of the tray T in the upper stocker.

FIG. 10 is a schematic diagram showing a moving state of the tray T in the lower stocker.

FIG. 11 is a cross-sectional top view showing a state in which the inspection region is enlarged.

FIG. 12 is a cross-sectional view showing a state in which an inspection region is enlarged.

FIG. 13 is a top view schematically showing an arrangement example of a component position confirmation camera and an inspection socket.

FIG. 14 is a top view schematically showing an arrangement example of a component position confirmation camera and an inspection socket.

FIG. 15 is a top view showing a state in which a component transport mechanism is shown in an enlarged manner.

FIG. 16 is a side view showing a state in which the component transport mechanism is shown in an enlarged manner.

FIG. 17 is a timing chart showing an operation procedure of the electronic component inspection device.

FIG. 18 is a top view showing a state of the electronic component inspection device when it operates according to the operation procedure shown in the timing chart of FIG. 17.

FIG. 19 is a top view showing a state of the electronic component inspection device when operated according to the operation procedure shown in the timing chart of FIG.

20 is a top view showing a state of the electronic component inspection device when operated according to the operation procedure shown in the timing chart of FIG.

FIG. 21 is a top view showing a state of the electronic component inspection device when it operates according to the operation procedure shown in the timing chart of FIG.

22 is a top view showing a state of the electronic component inspection device when operated according to the operation procedure shown in the timing chart of FIG.

23 is a top view showing a state of the electronic component inspection device when it operates according to the operation procedure shown in the timing chart of FIG.

FIG. 24 is a top view showing a state of the electronic component inspection device when operating according to the operation procedure shown in the timing chart of FIG.

25 is a top view showing a state of the electronic component inspection device when it operates according to the operation procedure shown in the timing chart of FIG.

FIG. 26 is a front view showing a state of the electronic component inspection device according to the second embodiment of the present invention seen from the front.

FIG. 27 is a side view showing a location where a stocker is arranged.

FIG. 28 is a top view showing a portion where a stocker is arranged.

FIG. 29 is a table showing an arrangement example of stockers in a stocker arrangement area.

FIG. 30 is a perspective view showing a component transfer mechanism of an electronic component inspection device according to a third embodiment.

FIG. 31 is a schematic diagram showing a correspondence relationship between a tray arrangement area and a stocker arrangement area.

FIG. 32 is a table showing an example of arrangement of trays in a tray arrangement area.

FIG. 33 is a perspective view showing an electronic component inspection device according to a fourth embodiment of the present invention.

FIG. 34 is a table showing an arrangement example of trays in a tray arrangement area.

FIG. 35 is a table illustrating an arrangement example of stockers in a stocker arrangement area.

FIG. 36 is a top view showing an electronic component inspection device according to a fifth embodiment.

FIG. 37 is a top view showing an electronic component inspection device according to a sixth embodiment.

FIG. 38 is a top view showing a state in which a component transport mechanism of the electronic component inspection device according to the sixth embodiment is enlarged and represented.

FIG. 39 is a side view showing an enlarged state of the component transport mechanism of the electronic component inspection device according to the sixth embodiment.

FIG. 40 is a top view and a cross-sectional view showing an example of the component position adjusting mechanism in an enlarged manner.

41 is a schematic diagram showing a mechanism of position adjustment by the component position adjusting mechanism shown in FIG. 40. FIG.

42A and 42B are a top view and a cross-sectional view showing another example of the component position adjusting mechanism in an enlarged manner.

43 is a schematic view showing a mechanism of position adjustment by the component position adjusting mechanism shown in FIG. 42.

FIG. 44 is a schematic diagram showing an example of a correspondence relationship between an X-axis rail and a parts transport mechanism.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 ... Electronic component inspection apparatus, 100 ... Electronic component conveyance unit, 110 ... Base, 111 ... Space, 153 ... Inspection plate, 120 ... X-axis robot, 130 ... Tray arrangement area, 140 ... Stocker arrangement area, 141 ... Stocker, 142 ... Lid part, 143 ... Strut, 144 ... Bottom part, 145 ... Tray separating hook, 146 ... Tray lifting mechanism, 147 ... Tray transport mechanism entry area, 150
... inspection area, 151 ... parts position confirmation camera, 152
... socket for inspection, 153 ... inspection plate, 154 ... inspection position confirmation camera, 155 ... opening, 156 ... opening detection section, 160 ... component transfer mechanism, 161 ... X direction drive section, 162 ... Y direction drive section, 1621 ... Y direction drive base, 1622 ... Y direction drive, 163 ... Z direction drive, 1631 ... Z direction drive, 1632 ... Z direction drive, 164 ... R direction drive, 165 ... Adsorption head, 1651 ... Head body, 1652 ... Suction nozzle support member, 166 ... Suction nozzle, 170 ... X-direction tray transport mechanism, 171 ... Z-direction tray drive unit, 1
72 ... Tray suction section, 180 ... Y direction tray transport mechanism, 181 ... Shaft, 182 ... Moving section, 183
... Tray mounting part, 184 ... Tray fixing part, 190 ...
Control unit, 191 ... CPU, 192 ... ROM, 19
3 ... RAM, 194 ... Communication controller, 195 ...
I / O controller, 196 ... Motion controller, 197 ... Image controller, 200 ... Electronic component inspection unit, 300 ... Cover

Claims (5)

[Claims] 1. An orbit, a container placement region in which a plurality of containers for storing electronic components are arranged vertically along the orbit, and an inspection unit which is placed close to the orbit and inspects electronic components. An inspection area to be arranged, a container housing portion arrangement area for arranging a container housing portion for accommodating and stacking the container, a suction head mounted on the track and equipped with a suction nozzle for sucking an electronic component, and the suction A component transfer unit that has a nozzle lift unit that moves the nozzle up and down, and a nozzle moving unit that moves the suction nozzle along the trajectory, and transfers an electronic component between the container placement region and the inspection region. And a container transporting unit that transports the container between the container placement region and the container storage unit. 2. The electronic component inspection apparatus according to claim 1, wherein a plurality of the container storages are arranged above and below each other. 3. The electronic component inspection apparatus according to claim 1, wherein the container housing portion arrangement region is divided into two regions sandwiching the container arrangement region. 4. The electronic component inspection apparatus according to claim 1, wherein the container housing portion is arranged below the container arrangement area. 5. A container for an uninspected product that stores an uninspected electronic component, a container for an acceptable product that stores an electronic component that has passed the inspection, and an electronic component that has failed the inspection. Containers for rejected products to be stored, and are classified into either empty containers that do not store electronic parts, the plurality of container storage units, uninspected product container storage unit for storing the uninspected product container, It is divided into one of an acceptable product container storage unit for storing the acceptable product container, a reject product container storage unit for storing the reject product container, and an empty container storage unit for storing the empty container. The electronic component inspection apparatus according to claim 1, wherein