TWI442493B - Processing device - Google Patents
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- TWI442493B TWI442493B TW96116687A TW96116687A TWI442493B TW I442493 B TWI442493 B TW I442493B TW 96116687 A TW96116687 A TW 96116687A TW 96116687 A TW96116687 A TW 96116687A TW I442493 B TWI442493 B TW I442493B
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Description
本發明係關於一種具備在半導體製程中所用的裝載器室之處理裝置，更詳言之，關於一種無需增加既有處理裝置之面積(footprint)就可擴充裝載器室的功能，且可提高被處理體的處理效率之可對應自動化的處理裝置。BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a processing apparatus having a loader chamber for use in a semiconductor process, and more particularly to a function of expanding a loader chamber without increasing the footprint of an existing processing apparatus, and The processing efficiency of the processing body can correspond to an automated processing device.
在半導體製造工廠中係於無塵室(clean room)內的搬送線兩側逐以複數個之方式排列有各種的處理裝置。在各處理裝置的裝載器室內以卡匣單位投入被處理體(例如，晶圓)，且依處理裝置以單片單位投入晶圓，將被投入至裝載器室內的晶圓供給至處理室內，在此對晶圓施以預定的處理。In the semiconductor manufacturing factory, various processing devices are arranged in a plurality of ways on both sides of the transfer line in the clean room. The object to be processed (for example, a wafer) is loaded into the loader chamber of each processing device in a cassette unit, and the wafer is loaded into the processing chamber by the processing device in a single unit, and the wafer placed in the loader chamber is supplied to the processing chamber. The wafer is subjected to a predetermined process here.
在處理裝置例如為檢查裝置的情況，檢查裝置，係如第15(a)圖所示以具備互為鄰接的裝載器室1與探針室2，將晶圓從裝載器室1搬送至探針室2，在探針室2進行晶圓之電特性檢查後，將晶圓送回裝載器室1之方式所構成。此裝載器室1，係例如具備裝載埠3、晶圓搬送機構4及預對準機構(副吸盤)5，又，探針室2，係具備晶圓吸盤6、對準機構(未圖示)及探針卡(未圖示)。然後，對裝載器室1之裝載埠3載置收納有複數片晶圓的卡匣。在裝載器室1中晶圓搬送機構4會驅動並從卡匣逐片搬送晶圓，於其中途在副吸盤5中進行晶圓的預對準之後，再搬送至探針室2之晶圓吸盤6。在探針室2中晶圓吸盤6移動於水平方向及上下方向，且依探針卡在晶圓吸盤6上進行晶圓的電特性檢查之後，循著相反的路徑將晶圓送回至卡匣的原先場所。又，在其為以單片單位進行晶圓的檢查之檢查裝置的情況，將晶圓逐片投入於裝載器室，進行預定的檢查。When the processing apparatus is, for example, an inspection apparatus, the inspection apparatus is provided with the loader chamber 1 and the probe chamber 2 adjacent to each other as shown in Fig. 15(a), and the wafer is transported from the loader chamber 1 to the probe. The needle chamber 2 is configured to return the wafer to the loader chamber 1 after the probe chamber 2 performs electrical characteristic inspection of the wafer. The loader chamber 1 includes, for example, a loading cassette 3, a wafer transfer mechanism 4, and a pre-alignment mechanism (sub-suction cup) 5. Further, the probe chamber 2 includes a wafer chuck 6 and an alignment mechanism (not shown). ) and probe card (not shown). Then, a cassette containing a plurality of wafers is placed on the loading cassette 3 of the loader chamber 1. In the loader chamber 1, the wafer transfer mechanism 4 drives and transports the wafers one by one from the cassette, and performs pre-alignment of the wafers in the sub-sucks 5, and then transfers the wafers to the probe chamber 2 Suction cup 6. In the probe chamber 2, the wafer chuck 6 is moved in the horizontal direction and the up and down direction, and after the probe is stuck on the wafer chuck 6 to perform electrical property inspection of the wafer, the wafer is returned to the card in the opposite path. The original place of 匣. Moreover, in the case of the inspection apparatus which performs the inspection of the wafer in a single-chip unit, the wafer is thrown into the loader chamber piece by piece, and predetermined inspection is performed.
而且，作為檢查裝置，係以所謂的單載型(單一裝載器型，single loader type)之檢查裝置最為廣泛普及，該單載型之檢查裝置，係如第15(a)圖所示般將裝載器室1配置在探針室2之左右中的任一方之側面(在同圖之(a)中為右側側面)，且在裝載器室l之前側，即檢查裝置之正面側配置有一個裝載埠3。Further, as the inspection device, a so-called single-load type (single loader type) inspection device is most widely used, and the single-load type inspection device is as shown in Fig. 15(a). The loader chamber 1 is disposed on the side of either one of the left and right sides of the probe chamber 2 (the right side surface in (a) of the same drawing), and is disposed on the front side of the loader chamber 1, that is, on the front side of the inspection device. Load 埠3.
又，作為他型之檢查裝置，例如專利文獻1所記載般，係以所謂的雙載型(雙裝載器型，dual loader type)為人所周知，該雙載型之檢查裝置，係將左右具有二個裝載埠的裝載器室設在裝置正面。In addition, as described in the patent document 1, for example, the so-called dual-load type (dual loader type) is known, and the double-load type inspection apparatus is about to be left and right. A loader chamber with two loading jaws is located on the front of the unit.
(專利文獻1)日本特開昭63－081830(Patent Document 1) Japanese Patent Laid-Open No. 63-081830
最近，由於檢查速度等高速化，所以習知單載型之檢查裝置根本無法對應檢查速度等之高速化。因此，在設置單載型之檢查裝置時，大多期望一種可連續處理二個卡匣內之晶圓的雙載型之檢查裝置。因此，可從習知的單載型想到變更成專利文獻1的雙載型。Recently, since the inspection speed and the like have increased in speed, the conventional single-load type inspection apparatus cannot at all speed up the inspection speed or the like. Therefore, in the case of providing a single-load type inspection apparatus, a double-load type inspection apparatus capable of continuously processing wafers in two cassettes is desired. Therefore, it can be changed from the conventional single-load type to the double-load type of Patent Document 1.
然而，專利文獻1的雙載型之檢查裝置，為了要確保設置打印機構之墨輥(inker)的空間而在習知的單載型中將設於檢查裝置之右側或左側的裝載器室配置在探針室正面。在此種的構成中由於操作者係在裝置前面，所以在晶圓之自動搬送化中無法將搬送線設在裝置前面側，不得不設在左右兩側，很難進行搬送線之搬送控制。因此，在將既有單載型變更為雙載型方面有各種的限制。例如在第15(a)圖所示的檢查裝置中即使擴充裝載埠3的情況由於仍有需要副吸盤5，所以就會如同圖之(b)所示般地將裝載埠3設在旁邊，面積會擴大。However, the double-load type inspection apparatus of Patent Document 1 arranges a loader chamber provided on the right or left side of the inspection apparatus in a conventional single-load type in order to secure a space for providing an ink roller of the printing mechanism. On the front of the probe chamber. In such a configuration, since the operator is in front of the apparatus, the transport line cannot be placed on the front side of the apparatus during the automatic transfer of the wafer, and it is necessary to provide the left and right sides, and it is difficult to carry out the transport control of the transport line. Therefore, there are various restrictions in changing the existing single-load type to the double-load type. For example, in the inspection apparatus shown in Fig. 15(a), even if the loading cassette 3 is expanded, since the sub-suction tray 5 is still required, the loading cassette 3 is placed beside the display unit (b). The area will expand.
可是，既有的檢查裝置，由於與其他的檢查裝置等之間的關係使其在空間上並不充裕，而無法將面積擴大成比現在還大。又，由於對應晶圓之自動搬送化的搬送線係以構建單載型為前提，所以在變更成雙載型時並不被容許面積之擴大，無法對應晶圓之自動搬送。此等情事並不限於檢查裝置，即使就其他的處理裝置而言亦為相同。However, the existing inspection device does not have sufficient space due to the relationship with other inspection devices and the like, and the area cannot be enlarged to be larger than the present. In addition, since the transfer line for the automatic transfer of the wafer is based on the assumption that the single-load type is built, the area is not allowed to be enlarged when the double-load type is changed, and the automatic transfer of the wafer cannot be performed. These circumstances are not limited to the inspection device, even if they are the same for other processing devices.
本發明係為了解決上述課題而開發完成者，其目的在於提供一種無需增加既有單載型之處理裝置的面積，就可增設裝載埠來變更成雙載型之處理裝置，而且可利用既有自動搬送線來實現晶圓搬送之完全自動化的處理裝置。The present invention has been developed in order to solve the above problems, and an object of the present invention is to provide a processing apparatus which can be changed to a dual-load type without adding an area of a processing apparatus of a single-load type, and can be used. A fully automated processing unit that automates the transfer of wafers for wafer transfer.
本發明之申請專利範圍第1項記載的處理裝置，係具備配置於處理室之側面的裝載器室之處理裝置，其特徵為，上述裝載器室具備：2個裝載埠，載置用以收納複數個上述被處理體的框體且沿著上述側面互相隔開配置；搬送裝置，配置於此等裝載埠之間且在此等裝載埠與上述探針室之間搬送上述被處理體；和定位機構，設在上述2個裝載埠之至少其中一方的裝載埠之下方且進行上述被處理體之定位。The processing apparatus according to the first aspect of the present invention is characterized in that the processing device includes a loading chamber disposed on a side surface of the processing chamber, wherein the loader chamber includes two loading cassettes for mounting a plurality of the frames of the object to be processed are disposed apart from each other along the side surface; and the conveying device is disposed between the loading cassettes and transporting the object to be processed between the loading cassette and the probe chamber; and The positioning mechanism is disposed below the loading cassette of at least one of the two loading cassettes and performs positioning of the object to be processed.
本發明之申請專利範圍第2項記載的處理裝置，係具備配置於處理室之側面的裝載器室之處理裝置，其特徵為，上述裝載器室具備：2個裝載埠，載置用以收納複數個上述被處理體的框體且鄰接上述側面而互相於上下方向隔開配置；搬送裝置，鄰接上述側面而配置且在此等裝載埠與上述探針室之間搬送上述被處理體；和定位機構，使之鄰接上述側面而設且進行上述被處理體之定位。The processing apparatus according to the second aspect of the invention is characterized in that the processing device includes a loading chamber disposed on a side surface of the processing chamber, wherein the loader chamber includes two loading cassettes for mounting a plurality of frames of the object to be processed are disposed apart from each other in the vertical direction adjacent to the side surface; and the conveying device is disposed adjacent to the side surface and transports the object to be processed between the loading port and the probe chamber; The positioning mechanism is disposed adjacent to the side surface and performs positioning of the object to be processed.
又，本發明之申請專利範圍第3項記載的處理裝置，係在申請專利範圍第1或2項所記載的發明中，上述各裝載埠，係以各自沿著上述框體之自動搬送裝置的搬送路徑而配置，且在與上述自動搬送裝置之間進行上述框體之交接之方式所構成。Further, in the invention according to claim 1 or 2, the loading device according to the first or second aspect of the invention is characterized in that each of the loading cassettes is an automatic conveying device along the housing. The transport path is disposed, and the frame is transferred to and from the automatic transport device.
又，本發明之申請專利範圍第4項記載的處理裝置，係在申請專利範圍第1至3項中任一項所記載的發明中，上述裝載埠，具有將上述框體之方向予以轉換的方向轉換機構、及透過該方向轉換機構將與上述搬送裝置對峙的上述框體之蓋體予以開閉的開閉機構。The invention according to any one of claims 1 to 3, wherein the loading cassette has a direction in which the direction of the housing is converted. The direction changing mechanism and the opening and closing mechanism that opens and closes the lid of the casing that faces the conveying device through the direction changing mechanism.
又，本發明之申請專利範圍第5項記載的處理裝置，係在申請專利範圍第4項所記載的發明中，上述方向轉換機構，具有載置上述框體的載置部、及使該載置部旋轉的旋轉體，上述框體內的上述被處理體之中心係自上述旋轉體之中心僅偏倚所定尺寸而配置，而上述載置部係利用上述旋轉體進行偏心旋轉。The invention according to claim 4, wherein the direction conversion mechanism includes a mounting portion on which the housing is placed, and the loading device is provided in the fourth aspect of the invention. The rotating body that rotates is disposed, and the center of the object to be processed in the frame is disposed only by a predetermined size from the center of the rotating body, and the mounting portion is eccentrically rotated by the rotating body.
又，本發明之申請專利範圍第6項記載的處理裝置，係在申請專利範圍第5項所記載的發明中，上述旋轉體，係構成以僅旋轉所定角度使上述框體之蓋體與上述開閉機構對峙，同時上述框體僅以上述所定尺寸接近上述開閉機構之開閉位置之方式構成。The invention according to claim 5, wherein the rotating body has a structure in which the cover body of the casing is rotated by a predetermined angle. The opening and closing mechanism faces the crucible, and the frame body is configured to approach the opening and closing position of the opening and closing mechanism only by the predetermined size.
又，本發明之申請專利範圍第7項記載的處理裝置，係在申請專利範圍第5或6項所記載的發明中，上述所定角度為90°。Further, in the invention according to claim 5, in the invention described in claim 5, the predetermined angle is 90°.
又，本發明之申請專利範圍第8項記載的處理裝置，係在申請專利範圍第1至7項中任一項所記載的發明中，在上述定位機構之近旁設有識別上述被處理體的識別裝置。Further, in the invention according to any one of the first to seventh aspects of the invention, in the invention of the invention, the object to be processed is provided in the vicinity of the positioning mechanism. Identification device.
又，本發明之申請專利範圍第9項記載的處理裝置，係在申請專利範圍第1至8項中任一項所記載的發明中，檢測從上述框體露出的上述被處理體之感測器係設在上述裝載埠上。Further, in the invention according to any one of the first to eighth aspects of the invention of the present invention, the processing of the object to be processed exposed from the casing is detected. The device is disposed on the loading magazine.
又，本發明之申請專利範圍第10項記載的處理裝置，係在申請專利範圍第9項所記載的發明中，將從上述框體露出的上述被處理體推入上述框體內的壓件係設在上述裝載埠上。In the invention according to claim 9 of the invention of claim 9, the invention is characterized in that the object to be processed which is exposed from the casing is pushed into the casing. It is set on the above loading magazine.
又，本發明之申請專利範圍第11項記載的處理裝置，係在申請專利範圍第1至10項中任一項所記載的發明中，上述搬送裝置，具備二種類的第1、第2升降驅動機構。In the invention according to any one of the first to tenth aspects of the invention, the conveying device includes two types of first and second lifting Drive mechanism.
又，本發明之申請專利範圍第12項記載的處理裝置，係在申請專利範圍第11項所記載的發明中，上述第1升降驅動機構具有氣缸，而上述第2升壓驅動機構具備馬達。In the invention according to claim 11, the first elevation drive mechanism includes a cylinder, and the second boost drive mechanism includes a motor.
又，本發明之申請專利範圍第13項記載的處理裝置，係在申請專利範圍第1及3至12項中任一項所記載的發明中，在上述2個裝載埠中之另一方的裝載埠之下方，設有於上下方向具有多層用以保持同一尺寸之基板的保持部之收容體。Further, in the invention according to any one of claims 1 to 3, the processing device according to any one of claims 1 to 3, wherein the loading of the other of the two loading cassettes is performed. Below the crucible, a housing having a plurality of holding portions for holding the substrates of the same size in the vertical direction is provided.
又，本發明之申請專利範圍第14項記載的處理裝置，係在申請專利範圍第13項所記載的發明中，上述保持部，具有檢測上述基板之存否的感測器。In the invention according to claim 13 of the invention, the holding unit includes a sensor for detecting the presence or absence of the substrate.
又，本發明之申請專利範圍第15項記載的處理裝置，係在申請專利範圍第1至14項中任一項所記載的發明中，上述搬送裝置，係以多關節機器人構成主體。In the invention according to any one of the first to fourteenth aspects of the present invention, the above-mentioned transfer device is configured by a multi-joint robot.
又，本發明之申請專利範圍第16項記載的處理裝置，係具備配置於處理室之側面的裝載器室之處理裝置，其特徵為，上述裝載器室具備：2個裝載埠，載置用以收納複數個上述被處理體的框體且沿著上述側面互相隔開配置；和搬送裝置，配置於此等裝載埠之間且在此等裝載埠與上述探針室之間搬送上述被處理體；且上述各裝載埠，係分別沿著上述框體之自動搬送裝置的搬送路徑而配置；上述搬送裝置，具有進行上述被處理體之定位的定位機構。Further, the processing apparatus according to claim 16 of the present invention is the processing apparatus provided in the loader chamber disposed on the side surface of the processing chamber, wherein the loader chamber includes two loading cassettes for mounting a housing that accommodates a plurality of the objects to be processed is disposed apart from each other along the side surface; and the conveying device is disposed between the loading cassettes and transports the loaded cassette between the loading chamber and the probe chamber And each of the loading cassettes is disposed along a transport path of the automatic transport device of the housing; and the transport device has a positioning mechanism that performs positioning of the object to be processed.
又，本發明之申請專利範圍第17項記載的處理裝置，係具備配置於處理室之側面的裝載器室之處理裝置，其特徵為，上述裝載器室具備：2個裝載埠，載置用以收納複數個上述被處理體之附有蓋體的框體且沿著上述側面而互相隔開配置；和搬送裝置，配置於此等裝載埠之間且在此等裝載埠與上述探針室之間搬送上述被處理體；且上述各裝載埠，分別具有將上述框體之方向予以轉換的方向轉換機構、及透過該方向轉換機構將與上述搬送裝置對峙的上述框體之蓋體予以開閉的開閉機構；上述搬送裝置，具有進行上述被處理體之定位的定位機構。Further, the processing apparatus according to the seventeenth aspect of the present invention is the processing apparatus provided in the loader chamber disposed on the side surface of the processing chamber, wherein the loader chamber includes two loading cassettes for mounting a housing having a cover body that accommodates a plurality of the objects to be processed and disposed apart from each other along the side surface; and a transfer device disposed between the load cassettes and loaded with the probe chamber Each of the loaded magazines has a direction changing mechanism that converts the direction of the frame, and a lid body that opens and closes the frame that faces the conveying device through the direction changing mechanism. The opening and closing mechanism; the conveying device has a positioning mechanism that performs positioning of the object to be processed.
又，本發明之申請專利範圍第18項記載的處理裝置，係在申請專利範圍第1至17項中任一項所記載的發明中，被載置於上述各裝載埠上的框體，係各自兼做傳送器和接收器。The invention according to any one of the first to seventh aspects of the invention of the invention of the invention of Each serves as a transmitter and receiver.
又，本發明之申請專利範圍第19項記載的處理裝置，係在申請專利範圍第1至17項中任一項所記載的發明中，被載置於上述各裝載埠上的框體，係可各自切換傳送器和接收器。Further, in the invention according to any one of the first to 17th aspects of the invention of the present invention, in the invention described in any one of claims 1 to 17, the frame is placed on each of the loading cassettes. The transmitter and receiver can be switched individually.
依據本發明，可提供一種無需增加既有單載型之處理裝置的面積，就可增設裝載埠來變更成雙載型之處理裝置，而且可利用既有自動搬送線來實現晶圓搬送之完全自動化的處理裝置。According to the present invention, it is possible to provide a processing apparatus which can be changed to a dual-load type without adding an area of a processing apparatus of an existing single-load type, and the wafer transfer can be completed by using an existing automatic transfer line. Automated processing unit.
以下，根據第1至12圖所示之實施形態說明本發明。本實施形態中，係舉檢查裝置作為處理裝置為例加以說明。此檢查裝置，係為檢查被處理體之電特性的裝置。Hereinafter, the present invention will be described based on the embodiments shown in Figs. In the present embodiment, a sling inspection device will be described as an example of a processing device. This inspection device is a device that checks the electrical characteristics of the object to be processed.
例如第1圖所示，本實施形態之檢查裝置10，係具備搬送被處理體(例如，晶圓)的裝載器室11、及進行晶圓之電特性檢查的探針室12，而裝載器室11被配置在探針室12之側方。裝載器室11具備：在至收納有複數片晶圓的卡匣(未圖示)之前後二個的第1、第2裝載埠13A、13B；和配置在第1、第2裝載埠13A、13B之間的晶圓搬送裝置(參照第3圖)14；其在控制裝置(未圖示)之控制下驅動。例如第2圖所示，此檢查裝置10，係逐以複數個方式分別排列在形成於無塵室內之搬送線L的兩側。本實施形態中，係將於前方具有一個裝載埠的習知之裝載器室，變更成具有前後之第1、第2裝載埠13A、13B的裝載器室11，而面積則實質上與既有的檢查裝置相同，無須擴大面積，更以習知之方式使用對應檢查裝置10的搬送線L，即可擴充裝載器室11之功能而實現從晶圓之卡匣搬送至晶圓之檢查的完全自動化。For example, as shown in FIG. 1, the inspection apparatus 10 of the present embodiment includes a loader chamber 11 that transports a target (for example, a wafer), and a probe chamber 12 that performs electrical property inspection of the wafer, and the loader The chamber 11 is disposed lateral to the probe chamber 12. The loader chamber 11 includes first and second loading cassettes 13A and 13B before and after a cassette (not shown) in which a plurality of wafers are stored, and first and second loading cassettes 13A, A wafer transfer device (see Fig. 3) 14 between 13B is driven by a control device (not shown). For example, as shown in Fig. 2, the inspection apparatus 10 is arranged in a plurality of ways on both sides of the conveyance line L formed in the clean room. In the present embodiment, the conventional loader chamber having one load port on the front side is changed to the loader chamber 11 having the first and second load ports 13A and 13B before and after, and the area is substantially the same as that of the existing one. The inspection apparatus is the same, and the area of the loader chamber 11 corresponding to the inspection apparatus 10 can be used in a conventional manner without using an enlarged area, so that the function of the loader chamber 11 can be expanded to realize complete automation of the inspection from the wafer cassette to the wafer.
又，如第2圖所示，自動搬送裝置V亦可將搬送線L移動至箭號A、B，且在預定的檢查裝置10之側方使用卡匣機械臂H而對檢查裝置10之裝載埠13如箭號C所示地移載卡匣(未圖示)。當然，操作者亦可將卡匣直接移載至第1、第2裝載埠13A、13B。另外，第1圖中，檢查裝置之斜下方的面係為正面。因而，本實施形態中，裝載器室11係配置在探針室12之右側方。Further, as shown in Fig. 2, the automatic transport device V can also move the transport line L to the arrows A and B, and load the inspection device 10 using the cassette arm H on the side of the predetermined inspection device 10.埠13 Transfer the cassette (not shown) as indicated by arrow C. Of course, the operator can also transfer the cassette directly to the first and second loading cassettes 13A, 13B. In addition, in Fig. 1, the surface of the inspection device obliquely below is a front surface. Therefore, in the present embodiment, the loader chamber 11 is disposed on the right side of the probe chamber 12.
前後之第1、第2裝載埠13A、13B，係互相具有相同的構成，如第3至5圖所示地隔著晶圓搬送裝置14而互為相對配置。此等的裝載埠13A、13B，係以晶圓搬送裝置14為中心而配置成左右對稱。因而，以下就前方(各圖中為左方)之第1裝載埠13A加以說明。例如第3至5圖所示，第1裝載埠13A具備：基台131；設於基台131上且載置卡匣的旋轉台132；使旋轉台132旋轉且設在基台131內的旋轉驅動機構(未圖示)；和將從旋轉後之卡匣露出的晶圓推入於卡匣內的壓件133；而旋轉台132透過旋轉驅動機構而朝90°正逆方向旋轉，且將卡匣之搬出入口朝向探針室12側與晶圓搬送裝置14側。The first and second loading cassettes 13A and 13B are configured to have the same configuration, and are disposed to face each other with the wafer transfer device 14 as shown in FIGS. 3 to 5 . These loading cassettes 13A and 13B are arranged to be bilaterally symmetrical about the wafer transfer apparatus 14. Therefore, the first loading cassette 13A in the front (left side in each drawing) will be described below. For example, as shown in FIGS. 3 to 5, the first loading cassette 13A includes a base 131, a rotary table 132 that is placed on the base 131 and that has a cassette, and a rotation that rotates the rotary table 132 and is provided in the base 131. a driving mechanism (not shown); and a pressing member 133 that pushes the wafer exposed from the rotated cassette to the cassette; and the rotating table 132 rotates in the 90° direction and the opposite direction through the rotation driving mechanism, and The loading and unloading port of the cassette faces the probe chamber 12 side and the wafer transfer device 14 side.
在基台131之探針室12側離開旋轉台132而設有光學感測器(未圖示)，且以此光學感測器檢測從卡匣露出的晶圓。光學感測器，係檢測晶圓是否在可以壓件133推入卡匣內的範圍內，在以不由壓件133推入的程度露出的情況就會透過巡視燈(patrol light)P(參照第1圖)等發出警報。An optical sensor (not shown) is provided on the probe chamber 12 side of the base 131 away from the turntable 132, and the optical sensor is used to detect the wafer exposed from the cassette. The optical sensor detects whether the wafer is pushed into the cassette by the presser member 133, and is exposed to the extent that it is not pushed by the pressing member 133, and passes through the patrol light P (refer to 1 picture) and so on.
又，如第4圖所示，在旋轉台132上設有用以固定卡匣的鎖機構134，當卡匣載置於旋轉台132上時，鎖機構134就會作動將卡匣固定旋轉台132上。在基台131上面的晶圓搬送裝置14側之側緣部，從探針室12側之端部朝向搬送線L側至中央部為止設有開縫S，在該開縫S的兩端部分別形成有朝向前方(第4圖中為左方)延伸的第1、第2較短的開縫(以下，簡稱為「短開縫」)S1、S2。壓件133，係在第1短開縫S1與第2短開縫S2之間立設成通過開縫S而往復移動。此壓件133，係在從第1短開縫S1移動至第2短開縫S2之後，藉由將第2短開縫S2朝向卡匣移動，以將從卡匣部分露出的晶圓推入卡匣內，且送回至卡匣內之本來的位置。更且，壓件133，係在卡匣透過旋轉台132而旋轉並將搬出入口朝向晶圓搬送裝置14側時，自動驅動成將晶圓推入卡匣內。Further, as shown in FIG. 4, a lock mechanism 134 for fixing the cassette is provided on the rotary table 132. When the cassette is placed on the rotary table 132, the lock mechanism 134 is actuated to fix the rotary table 132. on. A slit S is provided on a side edge portion of the base 131 on the side of the wafer transfer device 14 from the end portion on the probe chamber 12 side toward the transfer line L side to the center portion, and the both ends of the slit S are provided. The first and second short slits (hereinafter simply referred to as "short slits") S1 and S2 extending toward the front (left in FIG. 4) are formed. The presser 133 is erected between the first short slit S1 and the second short slit S2 so as to reciprocate by the slit S. The pressing member 133 is moved from the first short slit S1 to the second short slit S2, and is moved toward the cassette by the second short slit S2 to push the wafer exposed from the cassette portion. Inside the cassette, and return it to the original location in the cassette. Further, the presser 133 is automatically driven to push the wafer into the cassette when the cassette is rotated by the rotary table 132 and the carry-out port is directed toward the wafer transfer device 14 side.
又，如第3圖、第5圖所示，在第1裝載埠13A之下方上下配置有緩衝台15與晶圓台，此等兩者15、16係由支撐體17所支撐著。緩衝台15，係例如為用以收納探針卡之針尖研磨用晶圓等的基板之機台，而晶圓台16，係為了確認檢查完之晶圓，而用以將檢查完之晶圓取出至裝置外之可拉出的機台。緩衝台15，從正面來看於左右兩側之內壁面上下形成有複數種(例如，200mm、300mm)尺寸的針尖研磨用晶圓之槽口(slot)，透過此等的槽口來收納不同尺寸的針尖研磨用晶圓等。Further, as shown in FIGS. 3 and 5, the buffer stage 15 and the wafer stage are vertically disposed below the first loading cassette 13A, and both of them 15 and 16 are supported by the support body 17. The buffer table 15 is, for example, a table for accommodating a substrate such as a probe polishing wafer for a probe card, and the wafer table 16 is for checking the wafer to be inspected. Take out the machine that can be pulled out of the device. The buffer table 15 has a plurality of types (for example, 200 mm) formed on the inner and outer walls of the left and right sides as viewed from the front. , 300mm The slot of the wafer for polishing the tip of the needle is used to store wafers for tipping of different sizes and the like through the slots.
又，如第5圖所示，在第2裝載埠13B之下方設有進行晶圓之預對準的副吸盤18與讀取晶圓之識別資訊的資訊讀取裝置19，此等兩者18、19均由支撐體20所支撐著。作為資訊讀取裝置19，例如有光學字符讀取裝置(OCR)或條碼讀取機等，在本實施形態中係設置有OCR。因而，以下就以OCR19說明。Further, as shown in Fig. 5, under the second loading cassette 13B, a sub-suction tray 18 for pre-aligning the wafer and an information reading device 19 for reading the identification information of the wafer are provided, and so on. 19 is supported by the support body 20. The information reading device 19 includes, for example, an optical character reading device (OCR) or a bar code reader, and in the present embodiment, an OCR is provided. Therefore, the following is explained by OCR19.
如第3至7圖所示，晶圓搬送裝置14具備：搬送晶圓的搬送機械臂141；由使搬送機械臂141移動於前後方向的馬達及環狀皮帶所構成的後面所述之直線前進驅動機構142；設有此等兩者的圓形狀之旋轉基板143；達結在此旋轉基板143之下面中心且透過旋轉基板143而使搬送機械臂141朝正反方向旋轉的旋轉驅動機構144；支撐此等的基台145(參照第6圖)；和透過基台145使搬送機械臂141升降的二種類之第1、第2升降驅動機構146、147。又，如第4至6圖所示，在旋轉基板143之前端部有左右一對之映射感測器(mapping sensor)148配置在搬送機械臂141之前方的稍微下方，其可依以圓筒機構為主體的直線前進驅動機構148A而移動於前後方向，且以此等的映射感測器148在搬出卡匣內的晶圓之前檢測晶圓之收納狀態(晶圓之片數等)。As shown in the third to seventh embodiments, the wafer transfer device 14 includes a transport robot 141 that transports the wafer, and a straight line that is formed by a motor and an endless belt that moves the transport robot 141 in the front-rear direction. a driving mechanism 142; a circular rotating substrate 143 having both of them; a rotating drive mechanism 144 that is coupled to the lower center of the rotating substrate 143 and that transmits the rotating robot 141 in the forward and reverse directions through the rotating substrate 143; The base 145 (see FIG. 6) supporting these and the first and second elevation drive mechanisms 146 and 147 of the two types that lift and lower the transfer robot 141 through the base 145. Further, as shown in FIGS. 4 to 6, a pair of left and right mapping sensors 148 are disposed slightly below the transfer robot 141 at the end before the rotation of the substrate 143, and can be fitted to the cylinder. The mechanism is moved in the front-rear direction by the main linear forward drive mechanism 148A, and the mapping sensor 148 such as this detects the storage state of the wafer (the number of wafers, etc.) before the wafer in the cassette is carried out.
如第5至7圖所示，搬送機械臂141具有：配置於上下的第1、第2機械臂141A、141B；和在各自之基端部於上下空出預定的間隙來保持第1、第2機械臂141A、141B的二個保持體141C；且透過此等的保持體141C連結在直線前進驅動機構142上。直線前進驅動機構142具有：例如第7圖所示配置在基板上且連結在保持體141C上的環狀皮帶142A；環狀皮帶142A所繞掛的前後之滑輪142B；將搬送機械臂141朝前後方向引導移動的導軌(未圖示)；和連結在後方之滑輪142B上的馬達142C；且獲得馬達142C之驅動力而使搬送機械臂141按照導軌朝前後直線前進移動。As shown in FIGS. 5 to 7, the transport robot arm 141 has first and second robot arms 141A and 141B disposed on the upper and lower sides, and a predetermined gap is provided at the base end portions thereof to maintain the first and the first The two holding bodies 141C of the robot arms 141A and 141B are connected to the linear forward driving mechanism 142 via the holding bodies 141C. The linear forward drive mechanism 142 has, for example, an endless belt 142A that is disposed on the substrate and is coupled to the holder 141C as shown in FIG. 7; a front and rear pulley 142B that is wound around the endless belt 142A; and the transport robot 141 is moved forward and backward A guide rail (not shown) that guides the movement, and a motor 142C that is coupled to the rear pulley 142B; and the driving force of the motor 142C is obtained, and the transport robot arm 141 moves forward and backward in a straight line in accordance with the guide rail.
又，如第5圖、第6圖所示，旋轉驅動機構144具有：從旋轉基板143之下面中心垂下的旋轉軸144A；和透過環狀皮帶144B連結在旋轉軸144A上且固定在基台145上的馬達144C；且馬達144C旋轉於正反方向以將旋轉基板143上的搬送機械臂141朝向第1、第2裝載埠13A、13B側或是探針室12側。此旋轉軸144A，係在基台145上被軸支成可旋轉自如。Further, as shown in FIGS. 5 and 6, the rotation driving mechanism 144 has a rotating shaft 144A that hangs from the center of the lower surface of the rotating substrate 143, and is coupled to the rotating shaft 144A via the endless belt 144B and fixed to the base 145. The upper motor 144C; and the motor 144C is rotated in the forward and reverse directions to move the transport robot 141 on the rotating substrate 143 toward the first and second loading cassettes 13A and 13B or the probe chamber 12 side. The rotating shaft 144A is pivotally supported on the base 145 so as to be rotatable.
例如第6圖、第8圖所示，搬送機械臂141之升降驅動機構，係具備二種類的第1、第2升降驅動機構146、147，構成以不同的移動來使基台145上的搬送機械臂141升降。For example, as shown in FIG. 6 and FIG. 8, the elevation drive mechanism of the transfer robot arm 141 includes two types of first and second elevation drive mechanisms 146 and 147, and the base plate 145 is transported by different movements. The robot arm 141 is raised and lowered.
如第6圖、第8圖所示，第1升降驅動機構146具備：固定在裝載器室11之底面的第1導板146A；配置在第1導板146A之左右兩側且前端部透過第1連結構件146B連結有圓筒本體的左右一對之圓筒機構146C；和透過第2連結構件146D分別連結在圓筒機構146C之桿上的第2導板146E；且第2導板146E依圓筒機構146C之桿的伸縮而沿著第1導板146A升降。另外，第2導板146E之卡合構件146F係與第1導板146A之導軌146G相卡合著。As shown in Fig. 6 and Fig. 8, the first elevation drive mechanism 146 includes a first guide plate 146A fixed to the bottom surface of the loader chamber 11, and is disposed on the left and right sides of the first guide plate 146A and has a front end portion transmitted through the first guide plate 146A. 1st connecting member 146B is connected to a pair of right and left cylindrical mechanisms 146C of the cylindrical body; and a second guide 146E connected to the rod of the cylindrical mechanism 146C through the second connecting member 146D; and the second guide 146E is The rod of the cylindrical mechanism 146C expands and contracts along the first guide 146A. Further, the engaging member 146F of the second guide 146E is engaged with the guide rail 146G of the first guide 146A.
如第6圖、第8圖所示，第2升降驅動機構147具備：配置在第2導板146E之前面的滾珠螺桿147A；內藏與滾珠螺桿147A相螺合的螺帽構件之升降體147B；和在升降體147B之下方使滾珠螺桿147A旋轉於正反方向的馬達(未圖示)；且以滾珠螺桿147A之正反方向的旋轉使升降體147B沿著第2導板146E而升降。升降體147B之卡合構件147C係與第2導板146E之導軌147D相卡合著。又，升降體147B，係與支撐搬送機械臂141等的基台145(參照第6圖)一體化，俾使搬送機械臂141升降。As shown in Fig. 6 and Fig. 8, the second elevation drive mechanism 147 includes a ball screw 147A disposed on the front surface of the second guide 146E, and a lifting body 147B in which a nut member is screwed to the ball screw 147A. And a motor (not shown) that rotates the ball screw 147A in the forward and reverse directions below the lifter 147B; and the lifter 147B moves up and down along the second guide 146E by the rotation of the ball screw 147A in the forward and reverse directions. The engaging member 147C of the lifting body 147B is engaged with the guide rail 147D of the second guide 146E. Further, the elevating body 147B is integrated with the base 145 (see FIG. 6) that supports the transport robot 141 and the like, and the transport robot 141 is moved up and down.
第1升降驅動機構146，係藉由圓筒機構146C而驅動，在其最下降端位置與第1、第2裝載埠13A、13B的下端位置之間使晶圓搬送裝置141與第2升降驅動機構147一起一口氣升降。又，第2升降驅動機構147，係藉由馬達驅動，而在其下端位置使晶圓搬送裝置141於第2裝載埠13B之下方進行晶圓之預對準時等升降一點點或是在第1、第2裝載埠13A、13B中以使卡匣內之任意的晶圓逐片取出的方式使晶圓搬送裝置141升降一點點。The first elevation drive mechanism 146 is driven by the cylindrical mechanism 146C, and the wafer transfer device 141 and the second lift drive are provided between the lowermost end position and the lower end positions of the first and second load ports 13A and 13B. The mechanism 147 lifts together in one breath. Further, the second elevating drive mechanism 147 is driven by a motor, and the wafer transfer device 141 is lifted a little at a lower position of the wafer under the second loading cassette 13B at the lower end position. In the second loading cassettes 13A and 13B, the wafer transfer device 141 is moved up and down a little so that any of the wafers in the cassette are taken out one by one.
其次，就動作加以說明。首先，搭載著例如收納有25片晶圓的卡匣之自動搬送車V移動於搬送線L上，在預定的檢查裝置10與第1裝載埠13A相對峙之後，自動搬送車V的卡匣機械臂H會驅動而將卡匣移載至裝載埠13A的旋轉台132上。此時卡匣的搬出入口係朝向著探針室12側。自動搬送車V，係在移載卡匣之後，移行至搬送下一個卡匣的步驟。Second, explain the action. First, the automatic transport vehicle V in which, for example, a cassette containing 25 wafers is mounted is moved on the transport line L, and the predetermined inspection apparatus 10 is opposed to the first loading cassette 13A, and then the cassette mechanism of the vehicle V is automatically transported. The arm H is driven to transfer the cassette to the rotary table 132 of the loading cassette 13A. At this time, the loading and unloading port of the cassette is directed toward the probe chamber 12 side. The automatic transport vehicle V is a step of moving to the next cassette after the cassette has been transferred.
在將卡匣從自動搬送車V移載至旋轉台132上時，有時晶圓會依慣性力從卡匣內露出。因此，在裝載埠13A中光學感測器會動作，檢測從卡匣露出的晶圓是否在容許範圍內。光學感測器，係當判斷晶圓露出容許範圍以上時，以使巡視燈P閃爍等來發出警報，且將其旨意通知操作者。操作者，根據此警報將晶圓推入卡匣內之本體的位置上。當光學感測器判斷晶圓的露出在容許範圍內時，旋轉台132的旋轉驅動機構就會驅動，使旋轉台132朝順時鐘方向旋轉90°，且將卡匣之的搬出入口朝向晶圓搬送裝置14側。When the cassette is transferred from the automatic transport vehicle V to the rotary table 132, the wafer may be exposed from the inside of the cassette by inertial force. Therefore, in the loading cassette 13A, the optical sensor operates to detect whether or not the wafer exposed from the cassette is within an allowable range. When the optical sensor is judged to be equal to or larger than the allowable range of exposure of the wafer, the patrol lamp P is blinked or the like to issue an alarm, and the operator is notified of the intention. The operator pushes the wafer into the position of the body within the cassette according to the alarm. When the optical sensor determines that the exposure of the wafer is within the allowable range, the rotation driving mechanism of the rotating table 132 is driven to rotate the rotating table 132 by 90° in the clockwise direction, and the loading and unloading port of the cassette is oriented toward the wafer. The conveying device 14 side.
在卡匣的搬出入口面向晶圓搬送裝置14側時，有時會以卡匣的旋轉而使晶圓從卡匣內露出部分。因此，在卡匣的搬出入口朝向晶圓搬送裝置14側時，壓件133就會驅動，且從第1短開縫S1經由開縫S，將第2短開縫S2移動至卡匣側以將晶圓推入卡匣內。之後，壓件133會循著相反的路徑回到原來的第1短開縫S1。When the loading/unloading port of the cassette faces the wafer transfer device 14 side, the wafer may be exposed from the inside of the cassette by the rotation of the cassette. Therefore, when the loading/unloading port of the cassette faces the wafer transfer device 14 side, the presser 133 is driven, and the second short slit S2 is moved from the first short slit S1 to the click side via the slit S. Push the wafer into the cassette. Thereafter, the pressing member 133 follows the opposite path to return to the original first short slit S1.
當壓件133回到原來的位置時，晶圓搬送裝置14就會驅動。此時，首先第1升降驅動機構146會驅動，而第2導板146E會按照第1導板146A的導軌146G而從下降端上升至上升端，到達拉出第1裝載埠13A上的卡匣內之最下層的晶圓之位置。其次，第2升降驅動機構147會驅動並使滾珠螺桿147A旋轉，升降體147B會透過螺帽構件而與基台145一起上升。結果，搬送機械臂141會從卡匣的下端上升至上端。此期間以映射感測器148檢測卡匣內的晶圓之收納狀態。之後，第2升降驅動機構1476的馬達會逆向旋轉，透過滾珠螺桿146A而使搬送機械臂141下降，且移動至從卡匣內取出預定的晶圓之位置。另外，映射感測器148，亦可在從卡匣的下端移動至上端時檢測晶圓，或是在將卡匣往復於上下兩端之間時二次檢測晶圓。When the pressing member 133 returns to the original position, the wafer transfer device 14 is driven. At this time, first, the first lift driving mechanism 146 is driven, and the second guide 146E rises from the lower end to the rising end in accordance with the guide rail 146G of the first guide 146A, and reaches the cassette that pulls out the first loading cassette 13A. The position of the lowest wafer within. Next, the second elevation drive mechanism 147 drives and rotates the ball screw 147A, and the elevation body 147B rises together with the base 145 through the nut member. As a result, the transfer robot arm 141 rises from the lower end to the upper end of the cassette. During this period, the mapping sensor 148 detects the storage state of the wafer in the cassette. Thereafter, the motor of the second elevation drive mechanism 1476 rotates in the reverse direction, and the transfer robot arm 141 is lowered by the ball screw 146A, and moved to a position where a predetermined wafer is taken out from the cassette. In addition, the mapping sensor 148 may also detect the wafer when moving from the lower end to the upper end of the cassette, or may detect the wafer twice when the cassette is reciprocated between the upper and lower ends.
然後，執行前進驅動機構142的馬達142C會驅動，且透過環狀皮帶142A來驅動依保持體141C而保持的搬送機械臂141。搬送機械臂141係從後端前進，且在第1裝載埠13A上的卡匣內進出，例如第1機械臂141A會位於所期望的晶圓之下側。此時，第2升降驅動機構147會驅動使搬送機械臂141稍微上升並以第1機械臂141A來吸附保持晶圓。此時，晶圓由於可依壓件133而收納在本來的位置，所以沒有因第1搬送機械臂141A而漏接晶圓的情事。之後，搬送機械臂141會送回到後端，且以第1機械臂141A從卡匣搬出晶圓。Then, the motor 142C that executes the forward drive mechanism 142 is driven, and the transfer robot 141 held by the holder 141C is driven by the endless belt 142A. The transport robot 141 advances from the rear end and enters and exits in the cassette on the first loading cassette 13A. For example, the first robot arm 141A is positioned below the desired wafer. At this time, the second elevation drive mechanism 147 drives the transfer robot arm 141 to slightly rise and sucks and holds the wafer by the first robot arm 141A. At this time, since the wafer can be stored in the original position by the pressure-receiving member 133, there is no case where the wafer is missed by the first transfer robot 141A. Thereafter, the transport robot 141 is returned to the rear end, and the wafer is carried out from the cassette by the first robot arm 141A.
其次，第1升降驅動機構146會驅動，圓筒機構146之桿會收縮，搬送機械臂141會下降於第1、第2裝載埠13A、13B之間。其次，旋轉驅動機構144的馬達144C會驅動，透過環狀皮帶144B及旋轉軸144A使旋轉基板143旋轉180°，將搬送機械臂141的前端朝向第2裝載埠13B側。接著，直線前進驅動機構142的馬達142C會驅動並透過環狀皮帶142A使依保持體141C而保持的搬送機械臂141朝向配置於第2裝載埠13B之下方的副吸盤18進出。此時，第2升降驅動機構147的滾珠螺桿147A會驅動於正反方向，搬送機械臂141會升降，以OCR19來讀取由第1機械臂141A所保持的晶圓之識別資訊。之後，從第1機械臂141A將晶圓載置在副吸盤18上。然後，副吸盤18會旋轉，將晶圓根據定向平面(orientation flat)等而進行預對準。之後，第2升降驅動機構147之滾珠螺桿147A會旋轉以第1機械臂141A來吸附保持晶圓並在從副吸盤18往上舉起之後，透過直線前進驅動機構142使搬送機械臂141從副吸盤18後退至旋轉基板143上的後端。Next, the first lift drive mechanism 146 is driven, the rod of the cylindrical mechanism 146 is contracted, and the transfer robot arm 141 is lowered between the first and second load ports 13A and 13B. Then, the motor 144C of the rotation drive mechanism 144 is driven, and the rotary substrate 143 is rotated by 180° through the endless belt 144B and the rotary shaft 144A, and the distal end of the transfer robot 141 is directed toward the second loading cassette 13B side. Then, the motor 142C of the linear forward drive mechanism 142 is driven to pass through the endless belt 142A, and the transfer robot 141 held by the holder 141C is moved in and out toward the sub-suction cup 18 disposed below the second magazine 13B. At this time, the ball screw 147A of the second elevation drive mechanism 147 is driven in the forward and reverse directions, and the transfer robot 141 is moved up and down, and the identification information of the wafer held by the first robot arm 141A is read by the OCR 19. Thereafter, the wafer is placed on the sub-suction pad 18 from the first robot arm 141A. Then, the sub-suction pad 18 is rotated to pre-align the wafer according to an orientation flat or the like. After that, the ball screw 147A of the second lifting/lowering mechanism 147 rotates to hold the wafer by the first robot arm 141A, lifts up from the sub-suction disk 18, and then passes the linear forward driving mechanism 142 to move the robot arm 141 from the pair. The chuck 18 is retracted to the rear end on the rotating substrate 143.
當搬送機械臂141回到旋轉基板143上的後端時，就透過旋轉驅動機構144朝逆時鐘方向旋轉90°以將搬送機械臂141的前端朝向探針氣室12側。之後，搬送機械臂141會透過直線前進驅動機構142而朝探針室12內的晶圓吸盤(未圖示)上進出，且在透過第2升降驅動機構147使搬送機械臂141升降並從第1機械臂141A將未處理的晶圓交接至晶圓吸盤之後，搬送機械臂141會透過直線前進驅動機構142而回到後端並從探針室12後退。When the transport robot 141 is returned to the rear end of the rotating substrate 143, it is rotated by 90° in the counterclockwise direction by the rotation driving mechanism 144 to face the tip end of the transport robot 141 toward the probe air chamber 12 side. Thereafter, the transport robot 141 passes through the linear advance drive mechanism 142 and moves in and out of the wafer chuck (not shown) in the probe chamber 12, and the transport arm 141 is lifted and lowered by the second lift drive mechanism 147. After the robot arm 141A transfers the unprocessed wafer to the wafer chuck, the transport robot 141 passes through the linear forward drive mechanism 142 to return to the rear end and retreats from the probe chamber 12.
之後，當結束探針室12內之檢查時，搬送機械臂141就會透過直線前進驅動機構142而朝探針室12內進出，且透過第2升降驅動機構147以第2機械臂141B來接收處理完的晶圓。之後，搬送機械臂141，係在從探針室12回到旋轉基板143上的後端之後，搬送機械臂141就會透過旋轉驅動機構144而朝逆時鐘方向旋轉90°，且將搬送機械臂141的前端朝向第1裝載埠13A側。然後，在透過第1、第2升降驅動機構146、147上升之後，搬送機械臂141會透過直線前進驅動機構142朝卡匣內進出，且從第2機械臂141B將處理完的晶圓送回到卡匣內的原來場所。搬送機械臂141係透過直線前進驅動機構142而從卡匣回到後端。然後，第2升降驅動機構147會驅動並使搬送機械臂141升降至下一個晶圓位置，取出下一個晶圓，且重複進行上面所述的一系列之動作，進行卡匣內的全部的晶圓之電特性檢查。Thereafter, when the inspection in the probe chamber 12 is completed, the transfer robot 141 is moved in and out of the probe chamber 12 through the linear advance drive mechanism 142, and is received by the second robot 141B through the second lift drive mechanism 147. Processed wafer. After that, the transfer robot 141 is returned to the rear end of the rotary substrate 143 from the probe chamber 12, and then the transfer robot 141 is rotated by 90° in the counterclockwise direction by the rotation drive mechanism 144, and the transfer arm is moved. The front end of the 141 faces the first loading cassette 13A side. Then, after the first and second elevation drive mechanisms 146 and 147 are raised, the transfer robot 141 is moved in and out of the cassette through the linear advance drive mechanism 142, and the processed wafer is returned from the second robot 141B. Go to the original place in the card. The transport robot 141 passes through the linear forward drive mechanism 142 and returns from the cassette to the rear end. Then, the second elevation drive mechanism 147 drives and moves the transfer robot 141 to the next wafer position, takes out the next wafer, and repeats the series of operations described above to perform all the crystals in the cassette. Check the electrical characteristics of the circle.
又，在處理卡匣內的晶圓之期間，自動搬送車V會搬送卡匣，且將卡匣移載至空著的第2裝載埠13B。然後，當有關第1裝載埠13A上的卡匣內之全部的晶圓之電特性檢查結束時，旋轉台132會朝逆時鐘方向旋轉90°，且將卡匣的搬出入口朝向探針室12側。如此，已經在待機的自動搬送車V之卡匣機械臂H就會驅動而在自動搬送車V上接收裝載埠13上的卡匣，並搬送至下一個步驟。在此期間，會在裝載器室11及探針室12中處理位於第2裝載埠13B上的晶圓。因而，本實施形態中的第1、第2裝載埠13A、13B上的卡匣分別具有作為傳送器與接收器的功能。Further, while the wafer in the cassette is being processed, the automatic transport vehicle V transports the cassette and transfers the cassette to the empty second cassette 13B. Then, when the electrical characteristic inspection of all the wafers in the cassette on the first loading cassette 13A is completed, the rotating stage 132 is rotated by 90° in the counterclockwise direction, and the loading and unloading opening of the cassette is directed toward the probe chamber 12 side. In this manner, the robot arm H of the automatic transport vehicle V that has been in standby is driven, and the cassette on the loading cassette 13 is received by the automatic transport vehicle V, and is transported to the next step. During this time, the wafer on the second loading cassette 13B is processed in the loader chamber 11 and the probe chamber 12. Therefore, the cassettes on the first and second loading cassettes 13A and 13B in the present embodiment have functions as a transmitter and a receiver, respectively.
如以上說明般依據本實施形態，則由於裝載器室11係配置在探針室12之側面，而且在裝載器室11的前後設置第1、第2裝載埠13A、13B，同時在第2裝載埠13B的下方配置副吸盤18，更且，在前後的第1、第2裝載埠13A、13B之間設置具有可旋轉、升降之搬送機械臂141的晶圓搬送裝置14，所以無需增加既有的單載型之檢查裝置的面積，可增設裝載埠來變更成雙載型之檢查裝置10，而且此檢查裝置10無需在單載型用之既有的自動搬送線L上增加變更就可對應。又，由於將副吸盤18設在第2裝載埠13B的下方，所以無需在裝載器室11內分割副吸盤固有的空間，而可有效利用第2裝載埠13B之下方的空間，來實現檢查裝置10的設置空間之省空間化。According to the present embodiment, the loader chamber 11 is disposed on the side surface of the probe chamber 12, and the first and second loading cassettes 13A and 13B are provided in front of and behind the loader chamber 11, and the second loading is performed at the same time. The sub-suction tray 18 is disposed below the crucible 13B, and the wafer transfer device 14 having the transport arm 141 that can be rotated and lifted is provided between the first and second loading cassettes 13A and 13B in the front and rear. The area of the single-load type inspection device can be changed to a double-load type inspection device 10 by adding a load port, and the inspection device 10 can be replaced without adding a change to the existing automatic transfer line L for the single-load type. . Further, since the sub-suction cup 18 is disposed below the second loading cassette 13B, it is not necessary to divide the space unique to the sub-suction tray in the loader chamber 11, and the space below the second loading cassette 13B can be effectively utilized to realize the inspection apparatus. Space saving of 10 setting space.
又，由於第1、第2裝載埠13A、13B，係沿著自動搬送裝置V之自動搬送線L而排列，所以在檢查裝置10的正面有操作者，例如即使在檢查載置於檢查裝置10的第1裝載埠13A上之卡匣內的晶圓時，亦不會與操作者互相干涉而可使自動搬送裝置V在其與第2裝載埠13B之間進行卡匣的交接。Further, since the first and second loading cassettes 13A and 13B are arranged along the automatic transfer line L of the automatic transfer device V, there is an operator on the front surface of the inspection device 10, for example, even if the inspection is placed on the inspection device 10 When the wafer in the cassette on the first cassette 13A is loaded, the automatic transfer device V can perform the cassette transfer between the wafer and the second cassette 13B without interfering with the operator.
又，由於第1、第2裝載埠13A、13B，係沿著自動搬送裝置V之自動搬送線L而排列，又，在各自的旋轉台132旋轉使卡匣對峙於晶圓搬送裝置14時，各旋轉台132上的卡匣相對於晶圓搬送裝置14以左右對稱方式配置成等距離，所以可將晶圓搬送裝置14對卡匣的搬出入動作及搬出入時間在兩卡匣的全部晶圓間形成大致相同，而可抑制各裝載埠13A、13B與探針室12之間的晶圓搬送之不均勻，進而可縮短檢查裝置10內的晶圓搬送時間。又，由於卡匣係如此地以晶圓搬送裝置14為中心而配置成左右對稱，所以在將晶圓從卡匣搬送至探針室12時不會受到因兩卡匣內之全部晶圓間的檢查裝置10內之環境(例如，溫度、濕度等)所造成的影響之不均勻，而可經常以固定的狀態搬送晶圓且高精確度地進行檢查。Further, the first and second loading cassettes 13A and 13B are arranged along the automatic transfer line L of the automatic transfer device V, and when the respective rotary tables 132 are rotated to lock the cassette to the wafer transfer device 14, Since the cassettes on the respective rotary stages 132 are arranged equidistantly with respect to the wafer transfer apparatus 14 in a bilaterally symmetrical manner, the wafer transfer apparatus 14 can carry out the loading and unloading operation of the cassette and the loading and unloading time of all the crystals of the two cassettes. The formation of the circles is substantially the same, and unevenness in wafer transfer between the loading cassettes 13A and 13B and the probe chamber 12 can be suppressed, and the wafer transfer time in the inspection apparatus 10 can be shortened. Further, since the cassette is disposed so as to be bilaterally symmetrical about the wafer transfer device 14, the wafer is not transferred from all the wafers in the two cassettes when the wafer is transferred from the cassette to the probe chamber 12. The influence of the environment (for example, temperature, humidity, etc.) in the inspection apparatus 10 is not uniform, and the wafer can be often transported in a fixed state and inspected with high precision.
又，依據本實施形態，則由於將檢查從卡匣部分露出的晶圓之感測器設在第1、第2裝載埠13A、13B之各個上，所以在將卡匣從自動搬送車V移載至第1、第2裝載埠13A、13B時當晶圓從卡匣露出時，就可依感測器自動檢測晶圓之露出，且可防止因晶圓之露出所造成的各種弊害。Further, according to the present embodiment, since the sensor for inspecting the wafer exposed from the cassette portion is provided on each of the first and second loading cassettes 13A and 13B, the cassette is moved from the automatic transport vehicle V. When the wafer is exposed from the cassette when the first and second loading cassettes 13A and 13B are exposed, the exposure of the wafer can be automatically detected by the sensor, and various disadvantages caused by the exposure of the wafer can be prevented.
又，由於在第1、第2裝載埠13A、13B上設置將從卡匣朝晶圓搬送裝置14側露出的晶圓推入卡匣內之壓件133，所以不會因晶圓搬送裝置14從卡匣漏接晶圓而可確實地搬出。更且，由於在副吸盤18之近旁設置用以識別晶圓的OCR19，所以可有效利用第2裝載埠13B的下方空間做為OCR19的設置空間。Further, since the first and second loading cassettes 13A and 13B are provided with the presser 133 for pushing the wafer exposed from the cassette toward the wafer transfer device 14 side into the cassette, the wafer transfer apparatus 14 is not provided. The wafer is leaked from the cassette and can be reliably carried out. Further, since the OCR 19 for identifying the wafer is provided in the vicinity of the sub-suction pad 18, the space below the second loading cassette 13B can be effectively utilized as the installation space of the OCR 19.
又，由於晶圓搬送裝置14，具備二種類的第1、第2升降驅動機構146、147，所以分別使用第1、第2升降驅動機構146、147之二種類的功能，就可使晶圓既正確又確實地升降。由於第1升降驅動機構146，具備圓筒機構146C，所以可使搬送機械臂141在短時間內升降。又，由於第2升降驅動機構147，具備馬達作為滾珠螺桿147A及其驅動源，所以可使搬送機械臂141升降一點點，且可配合晶圓的搬入位置等而高精確度地進行控制。Further, since the wafer transfer device 14 is provided with two types of first and second elevation drive mechanisms 146 and 147, the wafers can be used by using two types of functions of the first and second elevation drive mechanisms 146 and 147, respectively. It is both correct and sure to rise and fall. Since the first elevation drive mechanism 146 is provided with the cylindrical mechanism 146C, the transfer robot 141 can be moved up and down in a short time. Further, since the second elevation drive mechanism 147 includes the motor as the ball screw 147A and the drive source thereof, the transfer robot arm 141 can be lifted up and down a little, and can be controlled with high precision in accordance with the loading position of the wafer or the like.
又，依據本實施形態，則由於在檢查裝置10之側面，將卡匣從自動搬送車V移載至設於裝載器室11之前後的第1裝載埠13A之後，在第1裝載埠13A使卡匣旋轉，且在將晶圓從此卡匣逐片搬送至探針室12之間於第2裝載埠13B的下方進行晶圓的定位，且在進行晶圓的檢查之期間，將卡匣從自動搬送車V移載至第2裝載埠13B，所以可從晶圓投入於檢查裝置10至取出檢查後的晶圓為止進行自動化，而且由於在檢查裝置10的第1、第2裝載埠13A、13B之至少其中一方經常存在有處理中的卡匣，所以即使檢查時間高速化亦可無間斷地使檢查裝置10工作運轉，可提高檢查效率。Further, according to the present embodiment, after the cassette is transferred from the automatic transport vehicle V to the first loading cassette 13A before and after the loader chamber 11 on the side surface of the inspection device 10, the first loading cassette 13A is placed on the first loading cassette 13A. The cassette rotates, and the wafer is positioned under the second loading cassette 13B between the cassettes and the probe chamber 12, and the cassette is removed from the wafer during inspection. Since the automatic transport vehicle V is transferred to the second loading cassette 13B, it can be automated from the time when the wafer is loaded into the inspection apparatus 10 to the wafer after the inspection, and the first and second loading cassettes 13A of the inspection apparatus 10 are Since at least one of the 13Bs often has a jam in progress, even if the inspection time is increased, the inspection apparatus 10 can be operated without interruption, and the inspection efficiency can be improved.
又，本實施形態中雖已就使用自動搬送車V來搬送開放式卡匣(open cassette)的情況加以說明，但是在使用FOUP(Front Opening Unified Pot，晶圓傳送盒)作為卡匣的情況，操作者亦可按照需要以由蓋體所密閉的FOUP來搬送，且操作者將FOUP載置於第1、第2裝載埠13A、13B。在此情況，如第3實施形態中亦說明般，不需要晶圓壓件133，而藉由將自動開閉FOUP之蓋體的開啟器設在裝載埠來取代壓件133，且使之對應FOUP。In the present embodiment, the case where the open cassette is transported by using the automatic transport vehicle V has been described. However, when a FOUP (Front Opening Unified Pot) is used as the cassette, The operator can also carry the FOUP sealed by the lid as needed, and the operator places the FOUP on the first and second loading cassettes 13A and 13B. In this case, as described in the third embodiment, the wafer presser 133 is not required, and the presser 133 is replaced by the opener that automatically opens and closes the cover of the FOUP, and is made to correspond to the FOUP. .
例如第9圖所示，本實施形態的檢查裝置10A，係除了在第1裝載埠13A的下方更設有第3裝載埠13C，且可將卡匣C分別收容於上下二層的第1、第3裝載埠13A、13C內以外，其餘構成實質與第2實施形態的檢查裝置10相同。因而，在與第1實施形態相同或相當部分上附記相同的元件符號來加以說明。For example, in the inspection apparatus 10A of the present embodiment, the third loading cassette 13C is provided below the first loading cassette 13A, and the cassette C can be accommodated in the first and second layers. The rest of the third loading cassettes 13A and 13C are substantially the same as the inspection apparatus 10 of the second embodiment. Therefore, the same or equivalent components as those in the first embodiment will be described with the same reference numerals.
亦即，如第9圖所示，第3裝載埠13C，係配置在第1裝載埠13A的下方，具備與第1、第2裝載埠13A、13B實質相同的構成。晶圓搬送裝置14，係搬送機械臂141透過第1、第2升降驅動機構(未圖示)而升降，且與第1裝載埠13A或第3裝載埠13C相對峙，用以搬出入各自的卡匣C內之晶圓。在第1裝載埠13A的卡匣C中搬出入晶圓的情況，就如第9圖之實線所示在搬送機械臂141透過第1升降機構而上升至與第1裝載埠13A相對峙的位置之後，透過第2升降驅動機構在卡匣C的上下兩端之間升降並與第1實施形態之情況同樣地搬出入卡匣C內的晶圓。又，在第3裝載埠13C的卡匣C中搬出入晶圓的情況，只有第2升降驅動機構會驅動，且如第9圖之一點鏈線所示搬送機械臂141會與第3裝載埠13C相對峙，且搬送機械臂141會透過第2升降驅動機構在卡匣C的上下兩端之間升降以搬出入晶圓。搬送機械臂141，係當從各卡匣C內搬出晶圓時，就與第1實施形態同樣地將晶圓搬送至處理室，將在處理室中結束預定處理的晶圓從處理室開始搬送，且搬入至各自的卡匣C內。In other words, as shown in FIG. 9, the third loading cassette 13C is disposed below the first loading cassette 13A, and has substantially the same configuration as the first and second loading cassettes 13A and 13B. In the wafer transfer device 14, the transfer robot arm 141 is moved up and down by the first and second lift drive mechanisms (not shown), and is opposed to the first load cassette 13A or the third load cassette 13C, and is carried in and out of the first loading cassette 13A. The wafer inside the cassette C. When the wafer is carried in and out of the cassette C of the first loading cassette 13A, the transfer robot arm 141 is moved to the first loading cassette 13A by the first elevating mechanism as indicated by the solid line in FIG. After the position, the second lifting/lowering mechanism moves up and down between the upper and lower ends of the cassette C, and the wafer inserted into the cassette C is carried out in the same manner as in the first embodiment. When the wafer is carried in and out of the cassette C of the third loading cassette 13C, only the second lifting/lowering mechanism is driven, and the transfer robot 141 and the third loading unit are shown as a dotted line in Fig. 9. When the 13C is relatively opposed, the transport robot 141 is moved up and down between the upper and lower ends of the cassette C through the second lift drive mechanism to carry in and out of the wafer. When the transfer robot arm 141 carries out the wafer from each cassette C, the wafer is transferred to the processing chamber in the same manner as in the first embodiment, and the wafer that has completed the predetermined processing in the processing chamber is transported from the processing chamber. And moved into their respective cards C.
依據本實施形態，則由於比第1實施形態更能擴充裝載埠，所以在檢查裝置10A內可收容1個多的卡匣C，即使晶圓的檢查時間縮短亦可不間斷地處理晶圓，更可提高產出。其他，即使在本實施形態中亦可期待與第1實施形態同樣的作用效果。According to the present embodiment, since the loading cassette can be expanded more than the first embodiment, a large number of cassettes C can be accommodated in the inspection apparatus 10A, and the wafer can be processed without interruption even if the inspection time of the wafer is shortened. Can increase output. Others, even in the present embodiment, the same operational effects as those of the first embodiment can be expected.
在第1、第2實施形態中，雖已就在晶圓搬送裝置14的前後配置有裝載埠之例加以說明，但是本發明的處理裝置，例如亦可只在晶圓搬送裝置的前方設置上下二層的裝載埠。在此情況，即使是與以往的單埠之處理裝置相同的面積亦可擴充裝載埠，且可對應晶圓等被處理體的處理速度之高速化。又，在第2實施形態中，雖於晶圓搬送裝置的前方設置上下二層的裝載埠，但是亦可於晶圓搬送裝置的後方設置上下二層的裝載埠。又，亦可在第1裝載埠上追加卡匣的升降機構，在此情況可縮小搬送機械臂的升降衝程。In the first and second embodiments, the loading device is disposed in front of and behind the wafer transfer device 14. However, the processing device of the present invention may be provided only in front of the wafer transfer device. The second floor is loaded with enamel. In this case, the loading area can be expanded even in the same area as the conventional processing apparatus of the crucible, and the processing speed of the object to be processed such as a wafer can be increased. Further, in the second embodiment, the loading and unloading stacks of the upper and lower layers are provided in front of the wafer transfer device, but the loading and unloading stacks of the upper and lower layers may be provided behind the wafer transfer device. Moreover, the lifting mechanism of the cassette can be added to the first loading cassette, and in this case, the lifting stroke of the conveying robot can be reduced.
例如第10及11圖所示，本實施形態的檢查裝置10B，係除了第1裝載埠13A成為載置FOUP作為卡匣C的構造、設有自動開閉FOUP之蓋體的開啟器21、以及緩衝台15的構造不同以外，其餘實質上係以第1實施形態的檢查裝置10為準所構成。因而，在與第1實施形態相同或相當部分上附記相同的元件符號來加以說明，且將FOUP當作卡匣C來加以說明。For example, as shown in Figs. 10 and 11, the inspection device 10B of the present embodiment is a structure in which the first loading cassette 13A is placed on the FOUP as the cassette C, an opener 21 provided with a lid for automatically opening and closing the FOUP, and a buffer. The structure of the stage 15 is substantially different from that of the inspection apparatus 10 of the first embodiment. Therefore, the same or equivalent components as those in the first embodiment will be described with the same reference numerals, and the FOUP will be described as a cartridge C.
如第10圖、第11圖所示，本實施形態中的第1裝載埠13A，係具備：於上面具有開口部的基台131；以與基台131之上面形成同一平面的方式設在基台131之開口部的旋轉台132；和設在旋轉台132上面且載置固定卡匣C的載置部135。旋轉台132，係透過連結於其下面中央的旋轉驅動軸132A而旋轉，且使載置部135上的卡匣C旋轉。在載置部135上安裝有夾板機構(未圖示)，可在與對第1裝載埠13A進行存取的例如AGV(Automated Guided Vehicle，無人搬運車)或OHT(Overhead Hoist Transport，懸吊式搬運車)之間進行卡匣C的自動交接。夾板機構，係與AGV或OHT的動作同步作動。As shown in Fig. 10 and Fig. 11, the first loading cassette 13A of the present embodiment includes a base 131 having an opening on the upper surface, and is provided on the same plane as the upper surface of the base 131. A rotary table 132 of the opening of the stage 131; and a mounting portion 135 provided on the upper surface of the rotary table 132 and having the fixed cassette C placed thereon. The rotary table 132 is rotated by a rotary drive shaft 132A coupled to the center of the lower surface thereof, and the cassette C on the mounting portion 135 is rotated. A splint mechanism (not shown) is attached to the mounting portion 135, and can be used, for example, an AGV (Automated Guided Vehicle) or an OHT (Overhead Hoist Transport) for accessing the first loading cassette 13A. The automatic transfer of the cassette C is carried out between the trucks. The splint mechanism is synchronized with the action of the AGV or OHT.
如第11圖所示，旋轉台132的中心(旋轉驅動軸132A的軸心)O，係從通過開啟器21之寬度方向中心的中心線L僅以所定尺寸d偏倚至下方而配置。又，載置部135，係以在粗線所示的位置上以從AGV或OHT所接收的卡匣(未圖示)內之粗線所示的晶圓W之中心O1 成為從旋轉台132之中心O僅以所定尺寸D偏倚至右側的位置關係之方式配置在旋轉台132上。在旋轉台132透過旋轉驅動軸132A而使載置部135從第11圖之粗線位置如箭號所示地僅以90°朝逆時鐘方向旋轉至細線位置的時間點，細線所示的晶圓W之中心O1 會到達中心線L上，同時從旋轉前之位置僅以所定尺寸d接近開啟器21，且載置部135上的卡匣C會與開啟器21相對峙。藉此，卡匣C，係透過旋轉台132從旋轉前的狀態僅以所定尺寸d接近開啟器21，且可僅以所定尺寸d來節省從卡匣C至開啟器21的移動距離，甚至僅以該部分就可節省面積。As shown in Fig. 11, the center of the rotary table 132 (the axis of the rotary drive shaft 132A) O is disposed from the center line L passing through the center in the width direction of the opener 21 with only a predetermined dimension d being biased downward. Further, the placing unit 135 is a rotating table from the center O 1 of the wafer W indicated by a thick line in a cassette (not shown) received from the AGV or OHT at a position indicated by a thick line. The center O of 132 is disposed on the rotary table 132 only in a positional relationship in which the predetermined size D is biased to the right side. When the rotating table 132 passes through the rotary drive shaft 132A, the mounting portion 135 is rotated from the thick line position of the eleventh figure to the position of the thin line in the counterclockwise direction by only 90° as indicated by the arrow, and the crystal shown by the thin line The center O 1 of the circle W reaches the center line L while approaching the opener 21 only at a predetermined size d from the position before the rotation, and the click C on the mounting portion 135 is opposed to the opener 21. Thereby, the cassette C is close to the opener 21 through the rotary table 132 from the state before the rotation only at the predetermined size d, and the moving distance from the cassette C to the opener 21 can be saved only by the predetermined size d, or even only This area can save space.
又雖未圖示，但是載置部135，係以透過包含導軌等在內的直線前進驅動機構而可在旋轉台132上朝前後方向移動的方式所構成。然後，在載置部135上的卡匣C之蓋體如第10圖所示地與開啟器21相對峙時，就如同圖之箭號所示般載置部135係透過直線前進驅動機構而朝向開啟器21直線前進，且使蓋體與開啟器21自動結合。在此狀態下，開啟器21係將卡匣C之蓋體自動地拆除並朝下方搬送，藉以開放卡匣C的搬出入口，且藉由晶圓搬送裝置14而備置於晶圓W的搬出入。Further, although not shown, the mounting portion 135 is configured to be movable in the front-rear direction on the rotary table 132 by a linear forward drive mechanism including a guide rail or the like. Then, when the lid of the cassette C on the placing portion 135 faces the opener 21 as shown in Fig. 10, the placing portion 135 transmits the linear forward driving mechanism as indicated by the arrow of the figure. The actuator 21 is linearly advanced, and the cover is automatically coupled to the opener 21. In this state, the opener 21 automatically removes the cover of the cassette C and transports it downward, thereby opening the loading and unloading port of the cassette C, and placing the wafer W in and out by the wafer transfer device 14. .
又，在第1裝載埠13A的下方以第1實施形態為準而於上下配置有第12圖之(a)所示的緩衝台15及晶圓台16。如同圖之(a)所示在緩衝台15上於上下方向多層互相空出等間隔而形成有保持相同口徑(例如，300 mm)之針尖研磨用晶圓W1 或晶圓W的槽口151。由於如此地收納相同口徑之針尖研磨用晶圓W1 或晶圓，所以即使在受限的空間亦可如同圖之(a)所示般地設置多層的槽口151。藉此即使因晶圓尺寸變大晶片數顯著增加而使探針卡的針尖研磨之研磨次數增加，亦可藉由事先將多片的針尖研磨用晶圓W1 收納在緩衝台15內而對應研磨次數的增加來連續使用多片的針尖研磨用晶圓W1 。Further, the buffer stage 15 and the wafer stage 16 shown in FIG. 12(a) are arranged vertically above the first loading cassette 13A in accordance with the first embodiment. As shown in (a) of the figure, the plurality of layers are vertically spaced apart from each other in the vertical direction as shown in (a) to maintain the same diameter (for example, 300 mm). The tip of the wafer W 1 or the notch 151 of the wafer W. Since the wafer W 1 or the wafer for the same tip diameter is accommodated in this manner, the plurality of slits 151 can be provided as shown in (a) of the drawing even in a limited space. In this way, even if the number of wafers is increased by a large increase in the wafer size, the number of times of polishing the tip of the probe card is increased, and the plurality of wafer tip polishing wafers W 1 can be accommodated in the buffer table 15 in advance. The number of times of polishing is increased to continuously use a plurality of wafer tip polishing wafers W 1 .
然而，以往的緩衝台是理所當然的，而在第1實施形態的緩衝台方面，由於收納著口徑不同的針尖研磨用晶圓，所以無法收納相同尺寸的針尖研磨用晶圓，且有依情況而需要暫時停止裝置以交換針尖研磨用晶圓，造成產出降低的主要原因。However, the conventional buffer table is a matter of course. In the buffer table according to the first embodiment, since the wafer for polishing the tip of the needle having different diameters is accommodated, the wafer for polishing the tip of the same size cannot be stored, and depending on the situation, It is necessary to temporarily stop the device to exchange the wafer for polishing the tip, which causes a decrease in output.
又，如第12圖之(b)所示般緩衝台15的各槽口151，係分別由上下的擱板151A、151B所形成。在各槽口151上分別設有分別檢測針尖研磨用晶圓W1 等之存否的光學感測器152，可依此等的光學感測器152來個別確認被收納於各槽口151內的針尖研磨用晶圓W1 。光學感測器152，係由發光元件152A與受光元件152B所構成，透過各自的配線152C、152C而連接在配線基板153上。在下側的擱板151A上形成有收納發光元件152A的空間151C，而在上側的擱板151B上形成有收納受光元件152B的空間152D。然後，在各擱板151C上分別形成有發光元件152A之光線所通過的孔151E。各槽口151的光學感測器152係分別每隔一個互異地配置在槽口151之前後方向上，俾使相鄰的上下之光學感測器152不會重疊。Further, as shown in Fig. 12(b), each of the notches 151 of the buffer table 15 is formed by upper and lower shelves 151A and 151B, respectively. Each of the notches 151 is provided with an optical sensor 152 for detecting the presence or absence of the wafer polishing wafer W 1 and the like, and the optical sensor 152 can be used to individually check the contents of the notches 151. The wafer tip polishing wafer W 1 . The optical sensor 152 is composed of a light-emitting element 152A and a light-receiving element 152B, and is connected to the wiring board 153 through the respective wirings 152C and 152C. A space 151C for accommodating the light-emitting element 152A is formed on the lower shelf 151A, and a space 152D for accommodating the light-receiving element 152B is formed on the upper shelf 151B. Then, holes 151E through which the light of the light-emitting element 152A passes are formed on the respective shelves 151C. The optical sensors 152 of the notches 151 are disposed in the front and rear directions of the notches 151, respectively, every other one, so that the adjacent upper and lower optical sensors 152 do not overlap.
藉此，一個槽口151中的針尖研磨用晶圓W1 之存否係依該層之光學感測器152而檢測，且不會自此檢測出上層的槽口151的針尖研磨用晶圓W1 之存否。換句話說，上下的光學感測器151之光線不會互相干涉。如此可依設在各槽口151的光學感測器152確實地檢測各自的槽口151之針尖研磨用晶圓W1 等，亦可特定在該槽口151所保持的晶圓之種類。Accordingly, a notch 151 in the tip of polishing the wafer W stored NO. 1 by the line sensor 152 and the optical layer of the detection, and the upper layer is not detected since the tip 151 a notch polishing of the wafer W 1 or not. In other words, the light of the upper and lower optical sensors 151 does not interfere with each other. In this manner, the optical sensor 152 provided in each of the notches 151 can surely detect the tip polishing wafer W 1 or the like of each of the notches 151, and the type of the wafer held by the notch 151 can be specified.
如以上說明般依據本實施形態，則由於第1裝載埠13A，係具有載置卡匣C的載置部135、及使該載置部135旋轉的旋轉台132，卡匣C內的晶圓W之中心O1 僅以所定尺寸d從旋轉台132之中心O偏倚，使載置部135偏心旋轉，所以當旋轉台132使從AGV或OHT接收的卡匣C偏心旋轉時，卡匣C就會僅以所定尺寸d接近開啟器21並與開啟器21相對峙，而可僅以所定尺寸d節省從卡匣C至開啟器21的移動距離，甚至可僅以該部分而節省面積。As described above, according to the present embodiment, the first loading cassette 13A has the mounting portion 135 on which the cassette C is placed, and the rotary table 132 that rotates the mounting portion 135, and the wafer in the cassette C The center O 1 of W is biased from the center O of the rotary table 132 by a predetermined dimension d, and the mounting portion 135 is eccentrically rotated. Therefore, when the rotary table 132 eccentrically rotates the cassette C received from the AGV or OHT, the cassette C is The opener 21 will be approached only with a predetermined size d and opposed to the opener 21, and the moving distance from the cassette C to the opener 21 can be saved only by the predetermined size d, and the area can be saved even with only this portion.
又，依據本實施形態，則由於在第1裝載埠13A的下方，設置有於上下方向具有保持相同尺寸(例如，300 mm)之針尖研磨用晶圓W1 的多層槽口151之緩衝台15，所以可收納多片相同尺寸的針尖研磨用晶圓W1 ，300 mm的晶圓之檢查片數等會顯著增加，即使探針卡的針尖研磨之次數增加亦可以多片的針尖研磨用晶圓W1 來連續研磨，且可提高檢查的產出。又，由於緩衝台15的各槽口151，係具有檢測針尖研磨用晶圓W1 等之存否的光學感測器152，所以可確認各槽口151中的針尖研磨用晶圓W1 之存否，甚至藉由事先決定各槽口151與各自的光學感測器152之對應關係，即可特定被收納於各槽口151內的針尖研磨用晶圓W1 之種類。其他，即使在本實施形態中亦可期待與第1實施形態同樣的作用效果。Further, according to the present embodiment, the first loading cassette 13A is provided with the same size in the vertical direction (for example, 300 mm). The buffer stage 15 of the multi-layer notch 151 of the wafer W 1 for the tip polishing, so that a plurality of wafers for the same size of the tip polishing wafer W 1 , 300 mm can be accommodated. The number of inspection wafers and the like is remarkably increased, and even if the number of times of tip polishing of the probe card is increased, the wafer W 1 for multiple tip polishing can be continuously polished, and the inspection output can be improved. Further, since the buffer stage 15 each slot 151, based polishing wafer W having a detecting tip, etc. stored NO optical sensor 152, it can be confirmed that each slot 151 of the needle tip polishing a wafer W kept NO Even by determining the correspondence between the notches 151 and the respective optical sensors 152 in advance, the type of the tip polishing wafer W 1 accommodated in each of the notches 151 can be specified. Others, even in the present embodiment, the same operational effects as those of the first embodiment can be expected.
本實施形態的檢查裝置，係除了晶圓搬送裝置與副吸盤及OCR一體化以外其餘實質上係構成與第1實施形態相同。在與第1實施形態相同或相當部分上附記相同的元件符號並就本實施形態之特徵加以說明。The inspection apparatus according to the present embodiment has substantially the same configuration as that of the first embodiment except that the wafer transfer apparatus, the sub-suction tray, and the OCR are integrated. The same or equivalent components as those of the first embodiment are denoted by the same reference numerals and the features of the embodiment will be described.
例如第13圖所示，在本實施形態中的晶圓搬送裝置14A之情況，係在旋轉基板143上設有作為定位機構的副吸盤18。此副吸盤18，係構成可升降、旋轉，且設在從卡匣搬出晶圓W(同圖中以一點鏈線所示)並後退的中途。又，在副吸盤18之側方設有作為資訊讀取裝置的OCR19。因而，搬送機械臂141係與卡匣相對峙，且在從卡匣搬出預定的晶圓W並後退至旋轉基板143上的中途副吸盤18會接收晶圓W。然後，在副吸盤18朝同圖之箭號θ方向旋轉的期間以OCR19來讀取晶圓W的識別資訊之後，進行預對準作業。在預對準後，與第1實施形態同樣搬送機械臂141會將晶圓W交接至探針室內之主吸盤上。換句話說，在第1實施形態中雖然搬送機械臂141從卡匣搬出晶圓W之後，有必要將晶圓W搬送至第2裝載器室側之副吸盤及OCR，但是本實施形態中則可在晶圓搬送裝置14A中讀取預對準與晶圓W的識別資訊。For example, as shown in Fig. 13, in the case of the wafer transfer apparatus 14A of the present embodiment, the sub-suction pad 18 as a positioning mechanism is provided on the rotary substrate 143. The sub-suction cup 18 is configured to be movable up and down and rotated, and is provided in the middle of carrying out the wafer W from the cassette (shown by a one-dot chain line in the drawing) and retreating. Further, an OCR 19 as an information reading device is provided on the side of the sub-suction cup 18. Therefore, the transport robot arm 141 is opposed to the cassette, and the sub-sucker 18 receives the wafer W in the middle of the transfer of the predetermined wafer W from the cassette and retreat to the rotary substrate 143. Then, after the sub-cup 18 is rotated in the direction of the arrow θ in the same figure, the identification information of the wafer W is read by the OCR 19, and then the pre-alignment operation is performed. After the pre-alignment, the transfer robot 141 transfers the wafer W to the main chuck in the probe chamber in the same manner as in the first embodiment. In other words, in the first embodiment, after the transport robot 141 carries out the wafer W from the cassette, it is necessary to transport the wafer W to the sub-suction cup and the OCR on the second loader chamber side. However, in the present embodiment, The pre-alignment and the identification information of the wafer W can be read in the wafer transfer device 14A.
因而，依據本實施形態，則由於晶圓搬送裝置14A具有副吸盤18及OCR19，所以可縮短從卡匣搬出且交接至探針室的時間。其他，可期待與第1實施形態同樣的作用效果。Therefore, according to the present embodiment, since the wafer transfer device 14A has the sub-suction pad 18 and the OCR 19, the time taken out from the cassette and delivered to the probe chamber can be shortened. Others, the same operational effects as those of the first embodiment can be expected.
本實施形態的檢查裝置，係除了設置多關節機器人以取代晶圓搬送裝置的搬送機械臂以外其餘實質上係以第4實施形態為準而構成。因而，即使在本實施形態中亦就晶圓搬送裝置及副吸盤加以說明。The inspection apparatus according to the present embodiment is basically constituted by a fourth embodiment except that a multi-joint robot is provided instead of the transport robot of the wafer transfer apparatus. Therefore, even in the present embodiment, the wafer transfer device and the sub-suction pad will be described.
例如第14圖所示，本實施形態中的晶圓搬送裝置14B，係具有：搬送晶圓W的多關節機器人149；支撐多關節機器人149的基台145(參照第6圖)；設在基台145上的副吸盤18；以及設在副吸盤18之近旁的OCR19。For example, as shown in Fig. 14, the wafer transfer device 14B of the present embodiment includes a multi-joint robot 149 that transports the wafer W, and a base 145 that supports the articulated robot 149 (see Fig. 6); a secondary suction cup 18 on the table 145; and an OCR 19 disposed adjacent to the secondary suction cup 18.
如同圖所示，多關節機器人149係具有複數個機械臂149A、互相連結此等機械臂149A的關節149B、連結在此等機械臂149A之前端的機械手149C、及連結在此等機械臂149A之基端部的旋轉驅動部149D。複數個機械臂149A係以基端部為中心而朝正反方向旋轉，用以改變晶圓W的搬送方向之方式所構成。複數個機械臂149A，係以連結各個的關節149B之活動而屈伸，在複數個機械臂149A及機械手149C伸直時就將機械手149A所保持的晶圓W對卡匣進行搬出入，且在探針室與主吸盤之間授受的方式所構成。另外，作為多關節機器人149可使用以往公知的多關節機器人。As shown in the figure, the articulated robot 149 has a plurality of mechanical arms 149A, joints 149B that connect the mechanical arms 149A to each other, a robot 149C coupled to the front end of the mechanical arms 149A, and a mechanical arm 149A coupled thereto. The rotation driving portion 149D of the base end portion. The plurality of robot arms 149A are configured to rotate in the forward and reverse directions around the base end portion to change the conveying direction of the wafer W. The plurality of robot arms 149A are bent and extended by the movement of the joints 149B, and when the plurality of robot arms 149A and 149C are straightened, the wafer W held by the robot 149A is carried in and out of the cassette, and It is constructed by means of receiving and receiving between the probe chamber and the main suction cup. Further, as the articulated robot 149, a conventionally known multi-joint robot can be used.
因而，即使在本實施形態中除了亦可與第4實施形態同樣地在晶圓搬送裝置14B中進行晶圓的預對準及晶圓W的識別以外，其餘亦可期待與第1實施形態同樣的作用效果。Therefore, in the present embodiment, in the same manner as in the fourth embodiment, the pre-alignment of the wafer and the identification of the wafer W can be performed in the wafer transfer apparatus 14B, and the same as in the first embodiment. The effect of the effect.
又，在第1至第5實施形態中，載置於第1、第2裝載埠上的卡匣，係分別具有作為傳送器與接收器的功能。但是，亦可將第1裝載埠之卡匣當作傳送器專用來使用，將第2裝載埠之卡匣當作接收器專用來使用，又，亦可將傳送器與接收器作適當切換而使用第1、第2裝載埠之卡匣。Further, in the first to fifth embodiments, the cassettes placed on the first and second loading cassettes each have a function as a transmitter and a receiver. However, the card of the first loading cassette can be used exclusively for the transmitter, and the card of the second loading cassette can be used exclusively for the receiver, and the transmitter and the receiver can be appropriately switched. Use the first and second loading cassettes.
另外，在上述實施形態中雖已舉檢查裝置為例加以說明，但是即使對被處理體施予預定處理的處理裝置亦可適用。因而，本發明並非被任意受限於上述實施形態，其可按照需要而適當設計變更各構成要素。Further, in the above-described embodiment, an inspection apparatus has been described as an example, but a processing apparatus that applies predetermined processing to the object to be processed can be applied. Therefore, the present invention is not limited to the above-described embodiments arbitrarily, and various constituent elements can be appropriately designed and changed as needed.
本發明可廣泛利用於半導體製造工廠之無塵室內所配置的各種處理裝置中。The present invention can be widely utilized in various processing apparatuses disposed in a clean room of a semiconductor manufacturing factory.
10．．．檢查裝置(處理裝置)10. . . Inspection device (processing device)
11．．．裝載器室11. . . Loader room
12．．．探針室(處理室)12. . . Probe chamber (processing chamber)
13A、13B、13C．．．裝載埠13A, 13B, 13C. . . Loading 埠
14、14A、14B．．．晶圓搬送裝置(搬送裝置)14, 14A, 14B. . . Wafer transfer device (transport device)
15．．．緩衝台(收納體)15. . . Buffer table
16．．．晶圓台16. . . Wafer table
17．．．支撐體17. . . Support
18．．．副吸盤(定位機構)18. . . Secondary suction cup (positioning mechanism)
19．．．OCR(識別裝置)19. . . OCR (identification device)
21．．．開啟器(開閉機構)twenty one. . . Opener (opening and closing mechanism)
131．．．基台131. . . Abutment
132．．．旋轉台(旋轉體)132. . . Rotary table
132A．．．旋轉驅動軸132A. . . Rotary drive shaft
133．．．壓件133. . . Pressing piece
141．．．搬送機械臂141. . . Transport robot
142．．．直線前進驅動機構142. . . Straight forward drive mechanism
143．．．旋轉基板143. . . Rotating substrate
144．．．旋轉驅動機構144. . . Rotary drive mechanism
S．．．開縫S. . . Slot
S1．．．第1短開縫S1. . . 1st short slit
S2．．．第2短開縫S2. . . 2nd short slit
第1圖係顯示本發明的處理裝置之一實施形態之檢查裝置的立體圖。Fig. 1 is a perspective view showing an inspection apparatus according to an embodiment of the processing apparatus of the present invention.
第2圖係顯示第1圖所示的檢查裝置之無塵室內之佈局的平面圖。Fig. 2 is a plan view showing the layout of the clean room in the inspection apparatus shown in Fig. 1.
第3圖係顯示第1圖所示的檢查裝置之裝載器室內部的平面圖。Fig. 3 is a plan view showing the inside of the loader of the inspection apparatus shown in Fig. 1.
第4圖係顯示第3圖所示的裝載器室之平面圖。Figure 4 is a plan view showing the loader chamber shown in Figure 3.
第5圖係顯示第3圖所示的裝載器室之側視圖。Fig. 5 is a side view showing the loader chamber shown in Fig. 3.
第6圖係顯示第3圖所示的晶圓搬送裝置之直線前進驅動機構的側視圖。Fig. 6 is a side view showing the linear forward drive mechanism of the wafer transfer device shown in Fig. 3.
第7圖係顯示第5圖所示的晶圓搬送裝置之立體圖。Fig. 7 is a perspective view showing the wafer transfer apparatus shown in Fig. 5.
第8圖係顯示第7圖所示的晶圓搬送裝置之升降驅動機構的立體圖。Fig. 8 is a perspective view showing the elevation drive mechanism of the wafer transfer apparatus shown in Fig. 7.
第9圖係顯示第1圖所示的檢查裝置之變化例之主要部分的側視圖。Fig. 9 is a side view showing a main part of a modification of the inspection apparatus shown in Fig. 1.
第10圖係顯示本發明的處理裝置之另一實施形態之裝載器室之主要部分的立體圖。Fig. 10 is a perspective view showing a main part of a loader chamber of another embodiment of the processing apparatus of the present invention.
第11圖係顯示用於本發明的處理裝置之更另一實施形態中的晶圓搬送裝置之平面圖。Fig. 11 is a plan view showing a wafer transfer apparatus in still another embodiment of the processing apparatus of the present invention.
第12(a)、(b)圖係分別顯示用於第10圖所示的裝載器室中的緩衝台及晶圓台，(a)為其正面圖，(b)為擴大緩衝台之主要部分而顯示的剖視圖。The 12th (a) and (b) drawings respectively show the buffer table and the wafer table used in the loader chamber shown in Fig. 10, (a) for its front view and (b) for expanding the buffer table. Partially shown cross-sectional view.
第13圖係顯示本發明的處理裝置之更另一實施例之主要部分的平面圖。Figure 13 is a plan view showing the main part of still another embodiment of the processing apparatus of the present invention.
第14圖係顯示本發明的處理裝置之更另一實施例之主要部分的平面圖。Figure 14 is a plan view showing the main part of still another embodiment of the processing apparatus of the present invention.
第15(a)圖係顯示習知檢查裝置之構成的平面圖；(b)係在習知檢查裝置中追加裝載埠的平面圖。Fig. 15(a) is a plan view showing the configuration of a conventional inspection device; (b) is a plan view in which a conventional cymbal is additionally mounted on a conventional inspection device.
11．．．裝載器室11. . . Loader room
13A、13B．．．裝載埠13A, 13B. . . Loading 埠
14．．．晶圓搬送裝置(搬送裝置)14. . . Wafer transfer device (transport device)
15．．．緩衝台(收納體)15. . . Buffer table
16．．．晶圓台16. . . Wafer table
17．．．支撐體17. . . Support
131．．．基台131. . . Abutment
132．．．旋轉台(旋轉體)132. . . Rotary table
133．．．壓件133. . . Pressing piece
141．．．搬送機械臂141. . . Transport robot
142．．．直線前進驅動機構142. . . Straight forward drive mechanism
143．．．旋轉基板143. . . Rotating substrate
144．．．旋轉驅動機構144. . . Rotary drive mechanism
S．．．開縫S. . . Slot
S1．．．第1短開縫S1. . . 1st short slit
S2．．．第2短開縫S2. . . 2nd short slit
Claims (17)
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| JP2007044729 | 2007-02-23 | ||
| JP2007112353A JP4146495B1 (en) | 2006-05-11 | 2007-04-20 | Processing equipment |
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| TWI442493B true TWI442493B (en) | 2014-06-21 |
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| JP5364769B2 (en) * | 2011-09-26 | 2013-12-11 | 株式会社安川電機 | Transfer robot and substrate processing apparatus |
| JP5894825B2 (en) | 2012-03-21 | 2016-03-30 | 東京エレクトロン株式会社 | Probe apparatus and wafer transfer unit |
| JP6210726B2 (en) * | 2013-05-14 | 2017-10-11 | 株式会社ディスコ | Processing equipment |
| CN107634025B (en) * | 2017-11-02 | 2024-04-16 | 湖南艾博特机器人技术有限公司 | Photovoltaic silicon wafer basket of flowers conveying mechanism |
| JP7294825B2 (en) * | 2019-02-15 | 2023-06-20 | 株式会社東京精密 | Plane processing equipment |
| JP2022086777A (en) | 2020-11-30 | 2022-06-09 | 東京エレクトロン株式会社 | Substrate delivery method and substrate delivery device |
| CN114300400A (en) * | 2021-12-27 | 2022-04-08 | 泓浒(苏州)半导体科技有限公司 | Semiconductor wafer transfer and turnover integrated processing equipment |
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