TW200807596A - Probing apparatus and probing method - Google Patents

Probing apparatus and probing method Download PDF

Info

Publication number
TW200807596A
TW200807596A TW96116687A TW96116687A TW200807596A TW 200807596 A TW200807596 A TW 200807596A TW 96116687 A TW96116687 A TW 96116687A TW 96116687 A TW96116687 A TW 96116687A TW 200807596 A TW200807596 A TW 200807596A
Authority
TW
Taiwan
Prior art keywords
loading
cassette
wafer
disposed
chamber
Prior art date
Application number
TW96116687A
Other languages
Chinese (zh)
Other versions
TWI442493B (en
Inventor
Hiroki Hosaka
Shuji Akiyama
Tadashi Obikane
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200807596A publication Critical patent/TW200807596A/en
Application granted granted Critical
Publication of TWI442493B publication Critical patent/TWI442493B/en

Links

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

There is provided a probing apparatus capable of modifying an existing probing apparatus having a single loading port to one having dual loading ports while saving the space without increasing a foot print thereof and also capable of increasing an inspection efficiency by cooperating with an automatic transfer line for the apparatus having a single loading port. The probing apparatus includes a prober chamber in which a wafer is inspected and a loader chamber having: a first and a second loading ports positioned to be spaced apart from each other at the side of a prober chamber, each of the loading ports mounting thereon a cassette accommodating therein a plurality of wafers; and a wafer transfer unit for transferring the wafers between the loading ports and the prober chamber. The loading ports are arranged along a route where the cassette is transferred by an automatic transfer device.

Description

200807596、 (1) 九、名明說明200807596, (1) IX, name description

【發明所屬之技術領域I 本發明係關於一種具備在半導體製程中所用的裝載器 室之處理裝置，更詳言之，關於一種無需增加既有處理裝 置之面積（footprint)就可擴充裝載器室的功能，且可提 ^ 高被處理體的處理效率之可對應自動化的處理裝置。 ϋ 【先前技術】 在半導體製造工廠中係於無麈室（clean room)內的 搬送線兩側逐以複數個之方式排列有各種的處理裝置。在 各處理裝置的裝載器室內以卡匣單位投入被處理體（例如 ’晶圓），且依處理裝置以單片單位投入晶圓，將被投入 至裝載器室內的晶圓供給至處理室內，在此對晶圓施以預 定的處理。 在處理裝置例如爲檢查裝置的情況，檢查裝置，係如 φ 第15(a)圖所示以具備互爲鄰接的裝載器室1與探針室 2，將晶圓從裝載器室1搬送"至探針室2，在探針室2進 行晶圓之電特性檢查後，將晶圓送回裝載器室1之方式所 構成。此裝載器室1，係例如具備裝載璋3、晶圓搬送機 構4及預對準機構（副吸盤）5，又，探針室2，係具備 晶圓吸盤6、對準機構（未圖示）及探針卡（未圖示）。 然後，對裝載器室1之裝載埠3載置收納有複數片晶圓的 卡匣。在裝載器室1中晶圓搬送機構4會驅動並從卡匣遂 片搬送晶圓，於其中途在副吸盤5中進行晶圓的預對準之 -5- 200807596 (2) 後，再搬送至探針室2之晶圓吸盤6。在探針室2中晶圓 吸盤6移軌於水平方向及上下方向，且依探針卡在晶圓吸 盤6上進行晶圓的電特性檢查之後，循著相反的路徑將晶 圓送回至卡匣的原先場所。又，在其爲以單片單位進行晶 ‘ 圓的檢查之檢查裝置的情況，將晶圓逐片投入於裝載器室 •，進行預定的檢查。 而且，作爲檢查裝置，係以所謂的單載型（單一裝載 Ip 器型，single loader type)之檢查裝置最爲廣泛普及，該 單載型之檢查裝置，係如第15 (a)圖所示般將裝載器室 1配置在探針室2之左右中的任一方之側面（在同圖之（ a )中爲右側側面），且在裝載器室1之前側，即檢查裝 置之正面側配置有一個裝載埠3。 又，作爲他型之檢查裝置，例如專利文獻1所記載般 ，係以所謂的雙載型（雙裝載器型，dual loader type)爲 人所周知，該雙載型之檢查裝置，係將左右具有二個裝載 B 埠的裝載器室設在裝置正面。 (專利文獻1)日本特開昭63-081830 -最近，由於檢查速度等高速化，所以習知單載型之檢 查裝置根本無法對應檢查速度等之高速化。因此，在設置 * 單載型之檢查裝置時，大多期望一種可連續處理二個卡匣 內之晶圓的雙載型之檢查裝置。因此，可從習知的單載型 想到變更成專利文獻1的雙載型。 【發明內容】 -6 - 200807596 (3) (發明所欲解決之問題） 然而，專利文獻1的雙載型之檢查裝置，爲了要確保 設置打印機構之墨輥（inker )的空間而在習知的單載型 中將設於檢查裝置之右側或左側的裝載器室配置在探針室 ^ 正面。在此種的構成中由於操作者係在裝置前面，所以在 * 晶圓之自動搬送化中無法將搬送線設在裝置前面側，不得 不設在左右兩側，很難進行搬送線之搬送控制。因此，在 B 將既有單載型變更爲雙載型方面有各種的限制。例如在第 1 5 ( a )圖所示的檢查裝置中即使擴充裝載埠3的情況由 於仍有需要副吸盤5，所以就會如同圖之（b )所示般地 將裝載璋3設在旁邊，面積會擴大。 可是，既有的檢查裝置，由於與其他的檢查裝置等之 間的關係使其在空間上並不充裕，而無法將面積擴大成比 現在還大。又，由於對應晶圓之自動搬送化的搬送線係以 構建單載型爲前提，所以在變更成雙載型時並不被容許面 • 積之擴大，無法對應晶圓之自動搬送。此等情事並不限於 檢查裝置，即使就其他的處理裝置而言亦爲相苘。 本發明係爲了解決上述課題而開發完成者，其目的在 於提供一種無需增加既有單載型之處理裝置的面積，就可 增設裝載埠來變更成雙載型之處理裝置，而且可利用既有 自動搬送線來實現晶圓搬送之完全自動化的處理裝置。 (解決問題之手段） 本發明之申請專利範圍第1項記載的處理裝置，係具 200807596 (4) 備配置於處理室之側面的裝載器室之處理裝置，其特徵爲 ，上述裝載器室具備：2個裝載埠’載置用以收納複數個 上述被處理體的框體且沿著上述側面互相隔開配置；搬送 裝置，配置於此等裝載璋之間且在此等裝載璋與上述探針 室之間搬送上述被處理體；和定位機構，設在上述2個裝 ‘載埠之至少其中一方的裝載埠之下方且進行上述被處理體 之定位。 B 本發明之申請專利範圍第2項記載的處理裝置，係具 備配置於處理室之側面的裝載器室之處理裝置，其特徵爲 ，上述裝載器室具備：2個裝載埠，載置用以收納複數個 上述被處理體的框體且鄰接上述側面而互相於上下方向隔 開配置；搬送裝置，鄰接上述側面而配置且在此等裝載埠 與上述探針室之間搬送上述被處理體；和定位機構，使之 鄰接上述側面而設且進行上述被處理體之定位。 又，本發明之申請專利範圍第3項記載的處理裝置， • 係在申請專利範圍第1或2項所記載的發明中，上述各裝 載埠，係以各自沿著上述框霞之自動-搬送裝置的-搬送路徑 而配置，且在與上述自動搬送裝置之間進行上述框體之交 接之方式所構成。 * 又，本發明之申請專利範圍第4項記載的處理裝置， 係在申請專利範圍第1至3項中任一項所記載的發明中， 上述裝載埠，具有將上述框體之方向予以轉換的方向轉換 機構、及透過該方向轉換機構將與上述搬送裝置對峙的上 述框體之蓋體予以開閉的開閉機構。 -8- 200807596 (5) 又，本發明之申請專利範圍第5項記載的處理裝置， 係在申請專利範圍第4項所記載的發明中，上述方向轉換 機構，具有載置上述框體的載置部、及使該載置部旋轉的 旋轉體，上述框體內的上述被處理體之中心係自上述旋轉 • 體之中心僅偏倚所定尺寸而配置，而上述載置部係利用上 • 述旋轉體進行偏心旋轉。 又，本發明之申請專利範圍第6項記載的處理裝置， B 係在申請專利範圍第5項所記載的發明中，上述旋轉體， 係構成以僅旋轉所定角度使上述框體之蓋體與上述開閉機 構對峙，同時上述框體僅以上述所定尺寸接近上述開閉機 構之開閉位置之方式構成。 又，本發明之申請專利範圍第7項記載的處理裝置， 係在申請專利範圍第5或6項所記載的發明中，上述所定 角度爲90°。 又，本發明之申請專利範圍第8項記載的處理裝置， • 係在申請專利範圍第1至7項中任一項所記載的發明中， 在上述定仡機-歡之近旁設有識別上述被處理體的識別裝置 〇 又，本發明之申請專利範圍第9項記載的處理裝置， * 係在申請專利範圍第1至8項中任一項所記載的發明中， 檢測從上述框體露出的上述被處理體之感測器係設在上述 裝載埠上。 又，本發明之申請專利範圍第1 0項記載的處理裝置 ，係在申請專利範圍第9項所記載的發明中，將從上述框 -9- 200807596 ⑹ 體露出的上述被處理體推入上述框體內的壓件係設在上述 裝載埠上。 又，本發明之申請專利範圍第11項記載的處理裝置 ，係在申請專利範圍第1至1Ό項中任一項所記載的發明 中’上述搬送裝置，具備二種類的第1、第2升降驅動機 • 構。 又，本發明之申請專利範圍第1 2項記載的處理裝置 φ ’係在申請專利範圍第1 1項所記載的發明中，上述第1 升降驅動機構具有氣缸，而上述第2升壓驅動機構具備馬 達。 又，本發明之申請專利範圍第1 3項記載的處理裝置 ’係在申請專利範圍第1及3至1 2項中任一項所記載的 發明中，在上述2個裝載埠中之另一方的裝載埠之下方， 設有於上下方向具有多層用以保持同一尺寸之基板的保持 部之收容體。 • 又，本發明之申請專利範圍第1 4項記載的處理裝置 ，係在申請專利範圍第Ϊ3項所記載的發明中，上述保持 部，具有檢測上述基板之存否的感測器。 又，本發明之申請專利範圍第1 5項記載的處理裝置 ，係在申請專利範圍第1至1 4項中任一項所記載的發明 中’上述搬送裝置，係以多關節機器人構成主體。 又，本發明之申請專利範圍第1 6項記載的處理裝置 ，係具備配置於處理室之側面的裝載器室之處理裝置，其 特徵爲，上述裝載器室具備：2個裝載埠，載置用以收納 -10- 200807596 (7) 複數個上述被處理體的框體且沿著上述側面互相隔開配置 ;和搬送裝置，配置於此等裝載嗥之間且在此等裝載埠與 上述探針室之間搬送上述被處理體；且上述各裝載璋，係 分別沿著上述框體之自動搬送裝置的搬送路徑而配置；上 述搬送裝置，具有進行上述被處理體之定位的定位機構。 • 又，本發明之申請專利範圍第17項記載的處理裝置 ，係具備配置於處理室之側面的裝載器室之處理裝置，其 φ 特徵爲，上述裝載器室具備：2個裝載埠，載置用以收納 複數個上述被處理體之附有蓋體的框體且沿著上述側面而 互相隔開配置；和搬送裝置，配置於此等裝載埠之間且在 此等裝載埠與上述探針室之間搬送上述被處理體；且上述 各裝載埠，分別具有將上述框體之方向予以轉換的方向轉 換機構、及透過該方向轉換機構將與上述搬送裝置對峙的 上述框體之蓋體予以開閉的開閉機構；上述搬送裝置，具 有進行上述被處理體之定位的定位機構。 # 又，本發明之申請專利範圍第1 8項記載的處理裝置 ’係在申請專利範圍第1 ·至1 7項中任一項所記載的發明 中，雀載置於上述各裝載埠上的框體，係各自兼做傳送器 和接收器。 ' 又，本發明之申請專利範圍第19項記載的處理裝置 ，係在申請專利範圍第1至1 7項中任一項所記載的發明 中，被載置於上述各裝載璋上的框體，係可各自切換傳送 器和接收器。 -11 - 200807596 (8) (發明效果） 依據本發明，可提供一種無需增加既有單載型之處理 裝置的面積，就可增設裝載埠來變更成雙載型之處理裝置 ，而且可利用既有自動搬送線來實現晶圓搬送之完全自動 化的處理裝置。 【實施方式】 以下，根據第1至1 2圖所示之實施形態說明本發明 。本實施形態中，係舉檢查裝置作爲處理裝置爲例加以說 明。此檢查裝置，係爲檢查被處理體之電特性的裝置。 (第1實施形態） 例如第1圖所示，本實施形態之檢查裝置1 〇，係具 備搬送被處理體（例如，晶圓）的裝載器室1 1、及進行 晶圓之電特性檢查的探針室12，而裝載器室11被配置在 探針室1 2之側方。裝載器室1 1具備：在至收納有複數片 晶圓的卡匣（未圖示）之前後二個的第1、第2裝載埠 1 3 A、1 3 B ;和配置在第1、第2裝載璋1 3 A、1 3 B之間的 晶圓搬送裝置（參照第3圖）14;其在控制裝置（未圖示 )之控制下驅動。例如第2圖所示，此檢查裝置1 〇，係 逐以複數個方式分別排列在形成於無塵室內之搬送線L的 兩側。本實施形態中，係將於前方具有一個裝載埠的習知 之裝載器室，變更成具有前後之第1、第2裝載璋13A、 13B的裝載器室η，而面積則實質上與既有的檢查裝置相 -12- 200807596 (9) 同，無須擴大面積，更以習知之方式使用對應檢查裝置 10的搬送線L’即可擴充裝載器室u之功能而實現從晶 圓之卡匣搬送至晶圓之檢查的完全自動化。 又’如第2圖所示，自動搬送裝置V亦可將搬送線L 移動至箭號A、B，且在預定的檢查裝置10之側方使用卡 • 匣機械臂Η而對檢查裝置1〇之裝載埠13如箭號C所示 地移載卡匣（未圖示）。當然，操作者亦可將卡匣直接移 Β 載至第1、第2裝載埠13Α、13Β。另外，第1圖中，檢 查裝置之斜下方的面係爲正面。因而，本實施形態中，裝 載器室1 1係配置在探針室1 2之右側方。 前後之第1、第2裝載埠1 3 A、1 3 Β，係互相具有相 同的構成，如第3至5圖所示地隔著晶圓搬送裝置14而 互爲相對配置。此等的裝載璋1 3 A、1 3 B，係以晶圓搬送 裝置14爲中心而配置成左右對稱。因而，以下就前方（ 各圖中爲左方）之第1裝載埠13 A加以說明。例如第3 φ 至5圖所示，第1裝載璋13A具備：基台131;設於基台 131上且載置卡匣的旋轉台132;使旋轉台132t轉且設 在基台1 3 1內的旋轉驅動機構（未圖示）；和將從旋轉後 之卡匣露出的晶圓推入於卡匣內的壓件1 3 3 ;而旋轉台 * 132透過旋轉驅動機構而朝90°正逆方向旋轉，且將卡匣 之搬出入口朝向探針室1 2側與晶圓搬送裝置1 4側。 在基台13 1之探針室12側離開旋轉台132而設有光 學感測器（未圖示），且以此光學感測器檢測從卡匣露出 的晶圓。光學感測器，係檢測晶圓是否在可以壓件1 33推 -13- 200807596 (10) 入卡匣內的範圍內，在以不由壓件133推入的程度露出的 情況就會透過巡視燈（patrol light ) P (參照第1圖）等 發出警報。 又，如第4圖所示，在旋轉台132上設有用以固定卡 匣的鎖機構1 3 4，當卡匣載置於旋轉台1 3 2上時，鎖機構 ' 13 4就會作動將卡匣固定旋轉台132上。在基台131上面 的晶圓搬送裝置1 4側之側緣部，從探針室1 2側之端部朝 • 向搬送線L側至中央部爲止設有開縫S，在該開縫S的兩 端部分別形成有朝向前方（第4圖中爲左方）延伸的第1 、第2較短的開縫（以下，簡稱爲「短開縫」）S1、S2。 壓件13 3，係在第1短開縫S1與第2短開縫S 2之間立設 成通過開縫S而往復移動。此壓件133，係在從第1短開 縫S 1移動至第2短開縫S2之後，藉由將第2短開縫S2 朝向卡匣移動，以將從卡匣部分露出的晶圓推入卡匣內， 且送回至卡匣內之本來的位置。更且，壓件133，係在卡 ® 匣透過旋轉台1 3 2而旋轉並將搬出入口朝向晶圓搬送裝置 1 4側時，自動驅動成將晶圓推入卡匣內。 又，如第3圖、第5圖所示，在第1裝載璋13A之 下方上下配置有緩衝台15與晶圓台，此等兩者15、16係 由支撐體1 7所支撐著。緩衝台1 5，係例如爲用以收納探 針卡之針尖硏磨用晶圓等的基板之機台，而晶圓台1 6， 係爲了確認檢查完之晶画，而用以將檢查完之晶圓取出至 裝置外之可拉出的機台。緩衝台15，從正面來看於左右 兩側之內壁面上下形成有複數種（例如，200mm φ 、 -14- 200807596 (11) 3 00mm φ )尺寸的針尖硏磨用晶圚之糟口（ slot )，透過 此等的槽口來收納不同尺寸的針尖硏磨用晶圓等。 又，如第5圖所示，在第2裝載埠13B之下方設有進 行晶圓之預對準的副吸盤1 8與讀取晶圓之識別資訊的資 ' 訊讀取裝置19，此等兩者18、19均由支撐體20所支撐 * 著。作爲資訊讀取裝置1 9，例如有光學字符讀取裝置（ OCR)或條碼讀取機等，在本實施形態中係設置有OCR。 (I 因而，以下就以OCR19說明。 如第3至7圖所示，晶圓搬送裝置14具備：搬送晶 圓的搬送機械臂1 4 1 ;由使搬送機械臂1 4 1移動於前後方 向的馬達及環狀皮帶所構成的後面所述之直線前進驅動機 構142 ;設有此等兩者的圓形狀之旋轉基板143 ;連結在 此旋轉基板1 4 3之下面中心且透過旋轉基板1 4 3而使搬送 機械臂141朝正反方向旋轉的旋轉驅動機構144 ;支撐此 等的基台145 (篸照弟6圖），和透過基台145使搬送機 • 械臂141升降的二種類之第1、第2升降驅動機構146、 147。又，如第4至6圖所示，在旋轉基板143之前端部 有左右一對之映射感測器（mapping sensor ) 1 48配置在 搬送機械臂141之前方的稍微下方，其可依以圓筒機構爲 _ 主體的直線前進驅動機構148A而移動於前後方向，且以 此等的映射感測器148在搬出卡匣內的晶圓之前檢測晶圓 之收納狀態（晶圓之片數等）。 如第5至7圖所示，搬送機械臂1 4 1具有：配置於上 下的第1、第2機械臂1 4 1 A、1 4 1 B ;和在各自之基端部 -15- 200807596 (12)BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a processing apparatus having a loader chamber for use in a semiconductor process, and more particularly to an expandable loader chamber without increasing the footprint of an existing processing apparatus. The function and the high processing efficiency of the object to be processed can correspond to an automated processing device.先前 [Prior Art] In the semiconductor manufacturing plant, various processing devices are arranged in a plurality of ways on both sides of the transfer line in the clean room. The object to be processed (for example, a 'wafer) is placed in a cassette unit in each of the load cells of the processing device, and the wafer is loaded into the processing chamber in a single-chip unit according to the processing device, and the wafer placed in the loader chamber is supplied to the processing chamber. The wafer is subjected to a predetermined process here. In the case where the processing device is, for example, an inspection device, the inspection device is provided with the loader chamber 1 and the probe chamber 2 adjacent to each other as shown in FIG. 15(a), and the wafer is transferred from the loader chamber 1 &quot The probe chamber 2 is configured to return the wafer to the loader chamber 1 after the probe chamber 2 performs electrical characteristic inspection of the wafer. The loader chamber 1 includes, for example, a loading cassette 3, a wafer transfer mechanism 4, and a pre-alignment mechanism (sub-suction cup) 5. Further, the probe chamber 2 includes a wafer chuck 6 and an alignment mechanism (not shown). ) and probe card (not shown). Then, a cassette containing a plurality of wafers is placed on the loading cassette 3 of the loader chamber 1. In the loader chamber 1, the wafer transfer mechanism 4 drives and transports the wafer from the cassette, and performs pre-alignment of the wafer in the sub-cup 5 in the middle thereof - 5 - 200807596 (2), and then transfers To the wafer chuck 6 of the probe chamber 2. In the probe chamber 2, the wafer chuck 6 is traversed in the horizontal direction and the vertical direction, and after the probe is stuck on the wafer chuck 6 to perform electrical property inspection of the wafer, the wafer is returned to the opposite path. The original location of the card. Further, in the case of an inspection apparatus for performing a crystal "circle inspection" in a single unit, the wafer is placed in the loader chamber piece by piece, and a predetermined inspection is performed. Further, as the inspection device, an inspection apparatus of a so-called single-load type (single loader type) is most widely used, and the single-load type inspection apparatus is as shown in Fig. 15 (a). The loader chamber 1 is disposed on the side of either one of the right and left sides of the probe chamber 2 (the right side surface in (a) of the same drawing), and is disposed on the front side of the loader chamber 1, that is, on the front side of the inspection device. There is a load 埠3. In addition, as described in the patent document 1, for example, the so-called dual-load type (dual loader type) is known, and the double-load type inspection apparatus is about to be left and right. A loader chamber with two loading B 设 is located on the front of the unit. (Patent Document 1) JP-A-63-081830 - Recently, the inspection speed of the conventional single-load type has not been able to cope with the increase in the inspection speed or the like due to the increase in the speed of inspection and the like. Therefore, in the case of providing a single-load type inspection device, a double-load type inspection device capable of continuously processing wafers in two cassettes is desired. Therefore, it is conceivable to change from the conventional single-load type to the double-load type of Patent Document 1. [Explanation] -6 - 200807596 (3) (Problems to be Solved by the Invention) However, the double-load type inspection apparatus of Patent Document 1 is known in order to secure the space of the ink roller (inker) of the printing mechanism. In the single-load type, the loader chamber provided on the right or left side of the inspection device is disposed on the front side of the probe chamber. In such a configuration, since the operator is in front of the apparatus, the transport line cannot be placed on the front side of the apparatus during the automatic transfer of the wafer, and it is necessary to provide the transport line control. . Therefore, there are various restrictions on the change of the existing single-load type to the double-load type. For example, in the inspection apparatus shown in Fig. 15 (a), even if the load chuck 3 is expanded, since the sub-suction tray 5 is still required, the load cassette 3 is set beside the figure (b). The area will expand. However, the existing inspection apparatus does not have sufficient space due to the relationship with other inspection apparatuses, and the area cannot be enlarged to be larger than the present. In addition, since the transfer line for the automatic transfer of the wafer is based on the construction of the single-load type, it is not allowed to expand the surface of the transfer to the double-load type, and the automatic transfer of the wafer cannot be performed. These circumstances are not limited to inspection devices, even for other processing devices. The present invention has been developed in order to solve the above problems, and an object of the present invention is to provide a processing apparatus which can be changed to a dual-load type without adding an area of a processing apparatus of a single-load type, and can be used. A fully automated processing unit that automates the transfer of wafers for wafer transfer. (Means for Solving the Problem) The processing device according to the first aspect of the invention is related to the processing device of the loader chamber disposed on the side of the processing chamber, wherein the loader chamber is provided Two loading frames are placed on the housings for accommodating a plurality of the objects to be processed, and are disposed apart from each other along the side surface; the conveying device is disposed between the loading cassettes, and the loading and the like are carried out. The object to be processed is transported between the needle chambers; and the positioning mechanism is disposed below the loading cassette of at least one of the two mountings, and the positioning of the object to be processed is performed. The processing apparatus according to the second aspect of the invention is characterized in that the processing device includes a loading chamber disposed on a side surface of the processing chamber, wherein the loader chamber includes two loading cassettes for mounting a housing that accommodates a plurality of the objects to be processed, and is disposed to be spaced apart from each other in the vertical direction adjacent to the side surface; the conveying device is disposed adjacent to the side surface, and transports the object to be processed between the loading cassette and the probe chamber; And the positioning mechanism is disposed adjacent to the side surface and performs positioning of the object to be processed. Further, in the invention described in claim 3, in the invention described in the first or second aspect of the invention, each of the loading cassettes is automatically transported along the frame. The apparatus is disposed in a transport path, and is configured to perform the transfer of the above-described housing with the automatic transport device. The invention according to any one of claims 1 to 3, wherein the loading cassette has a direction in which the housing is converted. The direction changing mechanism and the opening and closing mechanism that opens and closes the lid of the casing that faces the conveying device through the direction changing mechanism. In the invention according to the fourth aspect of the invention, the direction conversion mechanism includes the carrier on which the housing is placed. And a rotating body that rotates the mounting portion, wherein a center of the object to be processed in the frame is disposed only from a center of the rotating body by a predetermined size, and the mounting portion is rotated by the above-mentioned rotating portion The body is eccentrically rotated. Further, in the invention according to claim 5, in the invention of the fifth aspect of the invention, the rotating body is configured to rotate the cover of the casing with a predetermined angle only The opening and closing mechanism is configured to face the opening and closing position of the opening and closing mechanism only by the predetermined size. Further, in the invention according to claim 5, in the invention described in the fifth or sixth aspect of the invention, the predetermined angle is 90°. Further, in the invention according to any one of the first to seventh aspects of the present invention, in the invention described in the first aspect of the present invention, In the invention according to any one of the first to eighth aspects of the invention, the detection device is exposed from the frame body. The sensor of the object to be processed is provided on the loading cassette. Further, in the invention according to the ninth aspect of the invention, in the invention described in the ninth aspect of the invention, the object to be processed which is exposed from the above-mentioned frame -9-200807596 (6) is pushed into the above-mentioned The pressing member in the casing is provided on the loading magazine. In the invention according to any one of the first to the first aspect of the invention of the invention of the first aspect of the present invention, the above-mentioned conveying device includes two types of first and second lifting Drive mechanism. In the invention described in the first aspect of the invention, the first lifting and lowering drive mechanism includes a cylinder, and the second boosting drive mechanism is provided in the first aspect of the invention. With motor. Further, in the invention described in any one of claims 1 to 3 and 12, in the invention described in any one of the above claims, the other of the two loading cassettes Below the loading cassette, there is provided a housing having a plurality of holding portions for holding the substrates of the same size in the vertical direction. The invention according to claim 3, wherein the holding unit has a sensor for detecting the presence or absence of the substrate. In the invention described in any one of the first to fourth aspects of the invention, the above-mentioned transfer device is a multi-joint robot. Further, the processing apparatus according to the sixteenth aspect of the invention is the processing apparatus provided in the loader chamber disposed on the side surface of the processing chamber, wherein the loader chamber is provided with two loading cassettes and mounted thereon. For storing -10-200807596 (7) a plurality of frames of the object to be processed and arranged spaced apart from each other along the side surface; and a transfer device disposed between the load ports and loaded with the probes The object to be processed is transported between the needle chambers; and each of the loading cassettes is disposed along a transport path of the automatic transport device of the housing; and the transport device has a positioning mechanism for positioning the object to be processed. Further, the processing apparatus according to claim 17 of the present invention is the processing apparatus provided in the loader chamber disposed on the side surface of the processing chamber, wherein the loader chamber is provided with two loading cassettes. a frame body with a cover body for accommodating a plurality of the objects to be processed, and disposed apart from each other along the side surface; and a transfer device disposed between the load cassettes and loaded with the probe and the probe The object to be processed is transported between the chambers; and each of the loading cassettes has a direction changing mechanism that converts the direction of the frame, and a cover of the frame that is opposed to the conveying device by the direction changing mechanism. The opening and closing mechanism that opens and closes; the conveying device has a positioning mechanism that performs positioning of the object to be processed. In addition, in the invention described in any one of the first to seventh aspects of the invention, the bird is placed on each of the loading magazines. The frames are each a transmitter and a receiver. In the invention according to any one of the first to seventh aspects of the invention of the invention of the present invention, , the transmitter and receiver can be switched individually. -11 - 200807596 (8) Advantageous Effects of Invention According to the present invention, it is possible to provide a processing apparatus which can be changed to a double-load type without adding an area of a processing apparatus of a single single-load type, and can be utilized. A fully automated processing unit with automatic transfer lines for wafer transfer. [Embodiment] Hereinafter, the present invention will be described based on the embodiments shown in Figs. 1 to 12. In the present embodiment, a priming inspection device will be described as an example of a processing device. This inspection device is a device that checks the electrical characteristics of the object to be processed. (First Embodiment) As shown in Fig. 1, the inspection apparatus 1 of the present embodiment includes a loader chamber 11 for transporting a workpiece (for example, a wafer), and an electrical property inspection for performing wafer inspection. The probe chamber 12 is disposed, and the loader chamber 11 is disposed laterally of the probe chamber 12. The loader chamber 1 1 includes first and second loading ports 1 3 A and 1 3 B before and after a cassette (not shown) in which a plurality of wafers are accommodated; and 2 A wafer transfer device (see Fig. 3) 14 between 璋1 3 A and 1 3 B is loaded; it is driven under the control of a control device (not shown). For example, as shown in Fig. 2, the inspection apparatus 1 is arranged in a plurality of ways on both sides of the conveyance line L formed in the clean room. In the present embodiment, a conventional loader chamber having a load port on the front side is changed to a loader chamber η having first and second load ports 13A and 13B before and after, and the area is substantially the same as that of the existing one. Inspection device phase -12- 200807596 (9) Similarly, the area of the loader chamber u can be expanded by using the transfer line L' corresponding to the inspection device 10 in a conventional manner to realize the transfer from the wafer cassette to the cassette Full automation of wafer inspection. Further, as shown in Fig. 2, the automatic transfer device V can also move the transport line L to the arrows A and B, and use the card 匣 匣 on the side of the predetermined inspection device 10 to align the inspection device 1 The loading cassette 13 transfers the cassette (not shown) as indicated by the arrow C. Of course, the operator can also move the cassette directly to the first and second loading cassettes 13Α, 13Β. Further, in Fig. 1, the surface of the inspection device obliquely below is a front surface. Therefore, in the present embodiment, the loader chamber 11 is disposed on the right side of the probe chamber 12. The first and second loading ports 1 3 A and 1 3 前后 in the front and the rear have the same configuration, and are disposed opposite each other across the wafer transfer device 14 as shown in Figs. 3 to 5 . These loading ports 1 3 A and 1 3 B are arranged bilaterally symmetrically around the wafer transfer device 14. Therefore, the first loading cassette 13A in the front (left side in each drawing) will be described below. For example, as shown in the third φ to 5, the first loading cassette 13A includes a base 131, a rotary table 132 provided on the base 131 and on which the cassette is placed, and the rotary table 132t is rotated and provided on the base 1 3 1 a rotary drive mechanism (not shown); and a press member 13 3 that pushes the wafer exposed from the rotated cassette into the cassette; and the rotary table * 132 is rotated toward the 90° through the rotary drive mechanism The rotation is reversed, and the loading and unloading port of the cassette is directed toward the probe chamber 1 2 side and the wafer transfer device 14 side. An optical sensor (not shown) is provided on the probe chamber 12 side of the base 13 1 away from the rotary table 132, and the optical sensor is used to detect the wafer exposed from the cassette. The optical sensor detects whether the wafer is in the range that can be pressed by the pressing member 1 33 - 200807596 (10) into the cassette, and is exposed through the inspection light to the extent that it is not pushed by the pressing member 133. (patrol light ) P (refer to Figure 1), etc., an alarm is issued. Further, as shown in Fig. 4, a lock mechanism 134 for fixing the cassette is provided on the rotary table 132, and when the cassette is placed on the rotary table 132, the lock mechanism '13 4 will be activated. The cassette is fixed to the rotary table 132. On the side edge portion of the wafer transfer apparatus 14 side on the upper side of the base 131, a slit S is provided from the end of the probe chamber 1 2 side toward the center line to the center portion, and the slit S is provided. The first and second short slits (hereinafter simply referred to as "short slits") S1 and S2 extending toward the front (leftward in FIG. 4) are formed at both end portions. The pressing member 13 3 is erected between the first short slit S1 and the second short slit S 2 so as to reciprocate by the slit S. The pressing member 133 is moved from the first short slit S 1 to the second short slit S2 by moving the second short slit S2 toward the cassette to push the wafer exposed from the cassette portion. Enter the card and return it to the original location in the card. Further, the presser 133 is automatically driven to push the wafer into the cassette when the card 匣 is rotated by the rotary table 133 and the carry-out port is directed toward the wafer transfer device 14 side. Further, as shown in Figs. 3 and 5, the buffer stage 15 and the wafer stage are vertically disposed below the first loading cassette 13A, and the two 15 and 16 are supported by the support body 17. The buffer table 15 is, for example, a table for accommodating a substrate such as a tip honing wafer of a probe card, and the wafer table 16 is used for checking the crystal picture to be inspected. The wafer is taken out to the machine that can be pulled out of the device. The buffer table 15 has a plurality of (for example, 200 mm φ, -14-200807596 (11) 3 00 mm φ ) size needle-shaped honing wafers (slots) formed on the inner and outer walls of the left and right sides as viewed from the front. ), the wafers of different sizes of tip honing wafers and the like are accommodated through the slots. Further, as shown in Fig. 5, a sub-sucker 18 for pre-aligning the wafer and a reading device 19 for reading the identification information of the wafer are provided below the second loading cassette 13B. Both 18 and 19 are supported by the support body 20. The information reading device 19 is, for example, an optical character reading device (OCR) or a bar code reader, and in the present embodiment, an OCR is provided. (I will be described below with OCR 19. As shown in Figs. 3 to 7, the wafer transfer device 14 includes a transfer robot 1 4 1 that transports the wafer; and the transfer robot 1 1 1 moves in the front-rear direction. a linear forward drive mechanism 142, which is formed by a motor and an endless belt, and a circular rotating substrate 143 provided with both of them; connected to the lower center of the rotating substrate 134 and transmitted through the rotating substrate 1 4 3 The rotary drive mechanism 144 that rotates the transfer robot arm 141 in the forward and reverse directions; the base 145 that supports these (the same as FIG. 6), and the two types that lift and lower the transport arm 141 through the base 145 1. The second elevation drive mechanism 146, 147. Further, as shown in Figs. 4 to 6, a pair of left and right mapping sensors 1 48 are disposed on the transfer robot arm 141 at the end before the rotation of the substrate 143. Subsequently below, it can be moved in the front-rear direction according to the linear advancement drive mechanism 148A of the main body of the cylinder mechanism, and the mapping sensor 148 can detect the wafer before moving out of the wafer in the cassette. Storage status (number of wafers, etc.). As shown in Fig. 7, the transport robot 1141 has: first and second robot arms 1 4 1 A, 1 4 1 B disposed at the upper and lower sides; and base ends -15-200807596 (12)

於上下空出預定的間隙來保持第1、第2機械臂1 4 1 A、 141B的二個保持體141C;且透過此等的保持體141C連 結在直線前進驅動機構142上。直線前進驅動機構142具 有：例如第7圖所示配置在基板上且連結在保持體141C • 上的環狀皮帶142A ;環狀皮帶142A所繞掛的前後之滑輪 • 142B ;將搬送機械臂141朝前後方向引導移動的導軌（未 圖示）；和連結在後方之滑輪142B上的馬達142C ;且獲 p 得馬達142C之驅動力而使搬送機械臂141按照導軌朝前 後直線前進移動。 又，如第5圖、第6圖所示，旋轉驅動機構144具有 :從旋轉基板1 43之下面中心垂下的旋轉軸1 44A ;和透 過環狀皮帶144B連結在旋轉軸144A上且固定在基台145 上的馬達144C;且馬達144C旋轉於正反方向以將旋轉基 板143上的搬送機械臂141朝向第1、第2裝載埠13A、 13B側或是探針室12側。此旋轉軸144A，係在基台145 • 上被軸支成可旋轉自如。 例如第6圖、第8圖所示，搬送機械臂141之升降驅 動機構，係具備二種類的第1、第2升降驅動機構1 4 6、 147，構成以不同的移動來使基台145上的搬送機械臂 " 1 4 1升降。 如第6圖、第8圖所示，第1升降驅動機構i 46具備 :固定在裝載器室11之底面的第1導板146A;配置在第 1導板146A之左右兩側且前端部透過第！連結構件146β 連結有圓筒本體的左右一對之圓筒機構146C ;和透過第2 -16 - 200807596 (13) 連結構件146D分別連結在圓筒機構146C之桿上的第2 導板146E;且第2導板146E依圓筒機構146C之桿的伸 縮而沿著第1導板146A升降。另外，第2導板146£之 卡合構件146F係與第1導板Γ46Α之導軌146G相卡合著 〇 • 如第6圖、第8圖所示，第2升降驅動機構147具備 :配置在第2導板146E之前面的滾珠螺桿147A;內藏與 • 滾珠螺桿1 4 7 A相螺合的螺帽構件之升降體1 4 7 B ;和在升 降體147B之下方使滾珠螺桿147A旋轉於正反方向的馬 達（未圖示）；且以滾珠螺桿1 4 7 A之正反方向的旋轉使 升降體147B沿著第2導板146E而升降。升降體147B之 卡合構件147C係與第2導板146E之導軌147D相卡合著 。又，升降體147B，係與支撐搬送機械臂141等的基台 1 4 5 (參照第6圖）一體化，俾使搬送機械臂1 4 i升降。 第1升降驅動機構1 4 6 ’係藉由圓筒機構1 4 6 C而驅 φ 動，在其最下降端位置與第1、第2裝載埠13A、13 B的 下端位置之間使晶圓搬送裝置1-41與第2升降驅動機構 147 一起一口氣升降。又，第2升降驅-動機構147，係藉 由馬達驅動，而在其下端位置使晶圓搬送裝置1 4丨於第2 裝載瑋13B之下方進行晶圓之預對準時等升降一點點或是 在第1、第2裝載埠13A、13B中以使卡匣內之任意的晶 圚逐片取出的方式使晶圓搬送裝置i 4 i升降一點點。 其次’就動作加以說明。首先，搭載著例如收納有 25片晶圓的卡匣之自動搬送車v移動於搬送線l上，在 -17- 200807596 (14) 預定的檢查裝置1 0與第1裝載璋1 3 A相對峙之後，自動 搬送車V的卡匣機械臂Η會驅動而將卡匣移載至裝載埠 1 3 Α的旋轉台1 3 2上。此時卡匣的搬出入口係朝向著探針 室1 2側。自動搬送車V，係在移載卡匣之後，移行至搬 * 送下一個卡匣的步驟。The two holding bodies 141C of the first and second robot arms 1 4 1 A and 141B are held by a predetermined gap, and the holding bodies 141C are connected to the linear forward driving mechanism 142. The linear advancement drive mechanism 142 has, for example, an endless belt 142A that is disposed on the substrate and is coupled to the holder 141C as shown in Fig. 7; a front and rear pulley 142B that is wound around the endless belt 142A; and a transfer robot 141 A guide rail (not shown) that guides the movement in the front-rear direction; and a motor 142C that is coupled to the rear pulley 142B; and the driving force of the motor 142C is obtained, and the transport robot arm 141 moves forward and backward in a straight line in accordance with the guide rail. Further, as shown in FIGS. 5 and 6, the rotation driving mechanism 144 has a rotating shaft 1 44A that hangs from the center of the lower surface of the rotating substrate 143 and a rotating shaft 144B coupled to the rotating shaft 144A and fixed to the base. The motor 144C on the stage 145; and the motor 144C is rotated in the forward and reverse directions to move the transfer robot 141 on the rotating substrate 143 toward the first and second loading cassettes 13A, 13B or the probe chamber 12 side. This rotating shaft 144A is rotatably supported on the base 145. For example, as shown in FIGS. 6 and 8, the elevation drive mechanism of the transfer robot arm 141 includes two types of first and second elevation drive mechanisms 146 and 147, and the base plate 145 is configured to be moved differently. Transfer robot arm " 1 4 1 lift. As shown in FIGS. 6 and 8, the first elevation drive mechanism i 46 includes a first guide 146A fixed to the bottom surface of the loader chamber 11, and is disposed on the left and right sides of the first guide 146A and has a front end portion. The first! a pair of left and right cylindrical mechanisms 146C to which the coupling member 146β is coupled, and a second guide 146E that is coupled to the rod of the cylindrical mechanism 146C via the second to 16 - 200807596 (13) coupling members 146D; The second guide 146E moves up and down along the first guide 146A in accordance with the expansion and contraction of the rod of the cylindrical mechanism 146C. Further, the engagement member 146F of the second guide 146 is engaged with the guide rail 146G of the first guide Γ 46 〇. As shown in Figs. 6 and 8, the second elevation drive mechanism 147 is provided: a ball screw 147A in front of the second guide plate 146E; a lifting body 1 4 7 B of a nut member screwed with the ball screw 1 4 7 A; and a ball screw 147A rotated under the lifting body 147B A motor (not shown) in the forward and reverse directions; and the rotation of the ball screw 1 4 7 A in the forward and reverse directions causes the lifting body 147B to ascend and descend along the second guide 146E. The engaging member 147C of the elevating body 147B is engaged with the guide rail 147D of the second guide 146E. Further, the elevating body 147B is integrated with the base 145 (see Fig. 6) supporting the transport robot 141 and the like, and the transport robot 1 4 i is moved up and down. The first lifting/lowering mechanism 1 4 6 ' is driven by the cylindrical mechanism 1 4 6 C, and the wafer is placed between the lowermost end position and the lower end positions of the first and second loading ports 13A and 13 B. The conveying device 1-41 is lifted and lowered together with the second lifting/lowering mechanism 147. Further, the second lift-drive mechanism 147 is driven by a motor, and the wafer transfer device 14 is lifted a little under the second load port 13B to perform pre-alignment of the wafer at the lower end position or In the first and second loading cassettes 13A and 13B, the wafer transfer apparatus i 4 i is lifted and lowered a little so that any of the wafers in the cassette are taken out one by one. Second, let's explain the action. First, an automatic transport vehicle v on which a cassette containing 25 wafers is mounted is moved on the transport line 1, and the predetermined inspection device 10 at -17-200807596 (14) is opposed to the first load port 1 3 A. Thereafter, the cassette arm of the automatic transport vehicle V is driven to transfer the cassette to the rotary table 1 3 2 on which the cassette 1 3 is loaded. At this time, the loading/unloading port of the cassette is directed toward the probe chamber 12 side. The automatic transport vehicle V is a step of moving to the next one after the transfer of the cassette.

• 在將卡匣從自動搬送車V移載至旋轉台132上時， 有時晶圚會依慣性力從卡匣內露出。因此，在裝載埠1 3 A p 中光學感測器會動作，檢測從卡匣露出的晶圓是否在容許 範圍內。光學感測器，係當判斷晶圓露出容許範圍以上時 ，以使巡視燈P閃爍等來發出警報，且將其旨意通知操作 者。操作者，根據此警報將晶圓推入卡匣內之本體的位置 上。當光學感測器判斷晶圓的露出在容許範圍內時，旋轉 台1 3 2的旋轉驅動機構就會驅動，使旋轉台1 3 2朝順時鐘 方向旋轉90°，且將卡匣之的搬出入口朝向晶圓搬送裝置 14側。 B 在卡匣的搬出入口面向晶圓搬送裝置14側時’有時 會以卡匣的旋轉而使晶圓從卡匣內露出部分。因此，在卡 匣的搬出入口朝向晶圓搬送裝置1 4側時，壓件1 3 3就會 驅動，且從第1短開縫S1經由開縫S ’將第2短開縫S2 ‘ 移動至卡匣側以將晶圓推入卡匣內。之後，壓件1 3 3會循 著相反的路徑回到原來的第1短開縫S 1。 當壓件133回到原來的位置時，晶圓搬送裝置14就 會驅動。此時，首先第1升降驅動機構146會驅動’而第 2導板1 4 6 E會按照第1導板1 4 6 A的導軌1 4 6 G而從下降 -18- 200807596 (15) 端上升至上升端，到達拉出第1裝載璋13A上的卡匣內 之最下層的晶圓之位置。其次，第2升降驅動機構1 47會 驅動並使滾珠螺桿147A旋轉，升降體147B會透過螺帽 構件而與基台145 —起上升。結果，搬送機械臂141會從 ~ 卡匣的下端上升至上端。此期間以映射感測器1 48檢測卡 -匣內的晶圓之收納狀態。之後，第2升降驅動機構1476 的馬達會逆向旋轉，透過滾珠螺桿146A而使搬送機械臂 p 141下降，且移動至從卡匣內取出預定的晶圓之位置。另 外，映射感測器1 48，亦可在從卡匣的下端移動至上端時 檢測晶圓，或是在將卡匣往復於上下兩端之間時二次檢測 晶圓。 然後，執行前進驅動機構142的馬達142C會驅動， 且透過環狀皮帶142A來驅動依保持體141C而保持的搬 送機械臂141。搬送機械臂141係從後端前進，且在第1 裝載埠1 3 A上的卡匣內進出，例如第1機械臂1 4 1 A會位 B 於所期望的晶圓之下側。此時，第2升降驅動機構1 47會 驅動使搬送機械臂1 4 1稍微上升並以第1機械臂1 4 1 A來 吸附保持晶圓。此時，晶圓由於可依壓件1 3 3而收納在本 來的位置，所以沒有因第1搬送機械臂1 4 1 A而漏接晶圓 • 的情事。之後，搬送機械臂141會送回到後端，且以第1 機械臂1 4 1 A從卡匣搬出晶圓。• When the cassette is transferred from the automatic transport vehicle V to the rotary table 132, the wafer may be exposed from the cassette by inertia. Therefore, the optical sensor operates in the load 埠1 3 A p, and detects whether the wafer exposed from the cassette is within the allowable range. When the optical sensor is judged to be equal to or larger than the allowable range of exposure of the wafer, the patrol lamp P is blinked or the like to issue an alarm, and the operator is notified of the intention. The operator pushes the wafer into the position of the body inside the cassette according to this alarm. When the optical sensor determines that the exposure of the wafer is within the allowable range, the rotary driving mechanism of the rotary table 132 is driven to rotate the rotary table 133 in the clockwise direction by 90°, and the cassette is carried out. The inlet faces the side of the wafer transfer device 14. B When the loading/unloading port of the cassette faces the wafer transfer device 14 side, the wafer may be exposed from the inside of the cassette by the rotation of the cassette. Therefore, when the loading/unloading port of the cassette faces the side of the wafer transfer device 14, the pressing member 133 is driven, and the second short slit S2' is moved from the first short slit S1 to the second short slit S2' via the slit S'. The cassette side pushes the wafer into the cassette. Thereafter, the pressing member 13 3 follows the opposite path to return to the original first short slit S 1 . When the pressing member 133 returns to the original position, the wafer transfer device 14 is driven. At this time, first, the first lifting/lowering mechanism 146 is driven, and the second guide plate 14 6 E rises from the descending -18-200807596 (15) end according to the guide rail 1 4 6 G of the first guide plate 1 4 6 A. Up to the rising end, the position of the lowermost wafer in the cassette on the first loading cassette 13A is pulled out. Next, the second lifting/lowering mechanism 1 47 drives and rotates the ball screw 147A, and the lifting body 147B rises up with the base 145 through the nut member. As a result, the transfer robot arm 141 rises from the lower end to the upper end of the cassette. During this period, the mapping sensor 1 48 detects the storage state of the wafer in the card. Thereafter, the motor of the second elevation drive mechanism 1476 rotates in the reverse direction, and the transfer robot arm p 141 is lowered by the ball screw 146A, and moved to a position where a predetermined wafer is taken out from the cassette. In addition, the mapping sensor 1 48 can also detect the wafer when moving from the lower end to the upper end of the cassette or the second time when the cassette is reciprocated between the upper and lower ends. Then, the motor 142C that executes the forward drive mechanism 142 is driven, and the transfer robot 141 held by the holder 141C is driven by the endless belt 142A. The transport robot 141 advances from the rear end and enters and exits in the cassette on the first loading cassette 1 3 A. For example, the first robot arm 1 4 1 A is positioned at the lower side of the desired wafer. At this time, the second elevation drive mechanism 1 47 drives the transfer robot arm 14 1 to rise slightly and sucks and holds the wafer by the first robot arm 1 4 1 A. At this time, since the wafer can be accommodated in the original position by the press member 133, there is no case where the wafer is missed by the first transfer robot 1 4 1 A. Thereafter, the transfer robot 141 is returned to the rear end, and the wafer is carried out from the cassette by the first robot arm 1 4 1 A.

其次，第1升降驅動機構146會驅動，圓筒機構146 之桿會收縮，搬送機械臂141會下降於第1、第2裝載璋 13A、13B之間。其次，旋轉驅動機構144的馬達144C -19- 200807596 (16) 會驅動，透過環狀皮帶144B及旋轉軸144A使旋轉基板 143旋轉180°，將搬送機械臂141的前端朝向第2裝載埠 13B側。接著，直線前進驅動機構142的馬達142C會驅 動並透過環狀皮帶142A使依保持體141C而保持的搬送 機械臂141朝向配置於第2裝載埠13 B之下方的副吸盤 * 18進出。此時，第2升降驅動機構147的滾珠螺桿147A 會驅動於正反方向，搬送機械臂1 4 1會升降，以ΟCR 1 9 φ 來讀取由第1機械臂1 4 1 A所保持的晶圓之識別資訊。之 後，從第1機械臂141A將晶圓載置在副吸盤1 8上。然 後，副吸盤 18 會旋轉，將晶圓根據定向平面（ orientation flat)等而進行預對準。之後，第2升降驅動 機構147之滾珠螺桿147A會旋轉以第1機械臂141A來 吸附保持晶圓並在從副吸盤1 8往上舉起之後，透過直線 前進驅動機構142使搬送機械臂141從副吸盤18後退至 旋轉基板143上的後端。 # 當搬送機械臂1 4 1回到旋轉基板1 43上的後端時，就 透過旋轉驅動機構144朝逆時鐘方-向-旋轉90°以將搬送機 械臂14 1的前端朝向探針氣室12側。之後，搬送機械臂 1 4 1會透過直線前進驅動機構1 4 2而朝探針室1 2內的晶 * 圓吸盤（未圖示）上進出，且在透過第2升降驅動機構 147使搬送機械臂141升降並從第1機械臂141A將未處 理的晶圓交接至晶圓吸盤之後，搬送機械臂1 4 1會透過直 線前進驅動機構1 42而回到後端並從探針室丨2後退。 之後，當結束探針室12內之檢查時，搬送機械臂 -20- 200807596 (17) 141就會透過直線前進驅動機構142而朝探針室12內進 出，且透過第2升降驅動機構147以第2機械臂141B來 接收處理完的晶圓。之後，搬送機械臂141 ’係在從探針 室12回到旋轉基板143上的後端之後’搬送機械臂141 ’就會透過旋轉驅動機構144而朝逆時鐘方向旋轉90°，且 • 將搬送機械臂141的前端朝向第1裝載埠13A側。然後 ，在透過第1、第2升降驅動機構146、147上升之後， ϋ 搬送機械臂141會透過直線前進驅動機構142朝卡匣內進 出，且從第2機械臂1 4 1 Β將處理完的晶圓送回到卡匣內 的原來場所。搬送機械臂1 4 1係透過直線前進驅動機構 1 42而從卡匣回到後端。然後，第2升降驅動機構1 47會 驅動並使搬送機械臂1 4 1升降至下一個晶圓位置，取出下 一個晶圓，且重複進行上面所述的一系列之動作，進行卡 匣內的全部的晶圓之電特性檢查。 又，在處理卡匣內的晶圓之期間，自動搬送車V會 • 搬送卡匣，且將卡匣移載至空著的第2裝載璋1 3Β。然後 ，當有關第1裝載璋13Α上的卡匣內之全部的晶圓之電 特性檢查結束時，旋轉台132會朝逆時鐘方向旋轉90°， 且將卡匣的搬出入口朝向探針室12側。如此，已經在待 ^ 機的自動搬送車V之卡匣機械臂Η就會驅動而在自動搬 送車V上接收裝載埠13上的卡匣，並搬送至下一個步驟 。在此期間，會在裝載器室1 1及探針室1 2中處理位於第 2裝載埠13 Β上的晶圓。因而，本實施形態中的第1、第 2裝載埠13Α、13Β上的卡匣分別具有作爲傳送器與接收 -21 - 200807596 (18) -器的功能。Then, the first lifting/lowering mechanism 146 is driven, the rod of the cylindrical mechanism 146 is contracted, and the conveying robot 141 is lowered between the first and second loading pockets 13A and 13B. Then, the motor 144C -19-200807596 (16) of the rotary drive mechanism 144 is driven to rotate the rotary substrate 143 by 180° through the endless belt 144B and the rotary shaft 144A, and the distal end of the transfer robot 141 is directed to the second loading cassette 13B side. . Then, the motor 142C of the linear advancement drive mechanism 142 is driven to pass through the endless belt 142A, and the transfer robot 141 held by the holder 141C is moved in and out toward the sub-suction tray *18 disposed below the second magazine 13B. At this time, the ball screw 147A of the second elevation drive mechanism 147 is driven in the forward and reverse directions, and the transfer robot 14 1 1 is moved up and down, and the crystal held by the first robot arm 1 4 1 A is read by ΟCR 1 9 φ. Round identification information. Thereafter, the wafer is placed on the sub-suction pad 18 from the first robot arm 141A. Then, the sub-suction cup 18 is rotated to pre-align the wafer according to an orientation flat or the like. Thereafter, the ball screw 147A of the second elevation drive mechanism 147 rotates to hold the wafer by the first robot arm 141A, lifts up from the sub-suction disk 18, and then passes the linear advancement drive mechanism 142 to move the transfer robot 141 from The sub-suction cup 18 is retracted to the rear end on the rotating substrate 143. # When the transfer robot 1 1 1 returns to the rear end of the rotating substrate 1 43 , it is rotated 90° counterclockwise by the rotary drive mechanism 144 to face the front end of the transfer robot 14 1 toward the probe chamber. 12 sides. Thereafter, the transport robot 1141 passes through the linear advance drive mechanism 142, and enters and exits the crystal* disk (not shown) in the probe chamber 1 2, and transmits the transport mechanism through the second lift drive mechanism 147. After the arm 141 is lifted and lowered and the unprocessed wafer is transferred from the first robot arm 141A to the wafer chuck, the transport robot 114 is passed back to the rear end by the linear forward drive mechanism 142 and retracted from the probe chamber 丨2. . Thereafter, when the inspection in the probe chamber 12 is completed, the transfer robot arm -20-200807596 (17) 141 is moved in and out of the probe chamber 12 through the linear forward drive mechanism 142, and is transmitted through the second lift drive mechanism 147. The second robot arm 141B receives the processed wafer. Thereafter, after the transfer robot 141' is returned to the rear end of the rotary substrate 143 from the probe chamber 12, the "transport robot 141" is rotated by 90° in the counterclockwise direction by the rotary drive mechanism 144, and will be transported. The front end of the arm 141 faces the first loading cassette 13A side. Then, after the first and second elevation drive mechanisms 146 and 147 are raised, the transport robot arm 141 is moved in and out of the cassette through the linear forward drive mechanism 142, and is processed from the second robot arm 1 4 1 Β. The wafer is returned to the original location in the cassette. The transport robot 1 4 1 passes through the linear forward drive mechanism 1 42 and returns from the cassette to the rear end. Then, the second lifting/lowering mechanism 1 47 drives and moves the transport robot 1 4 1 to the next wafer position, takes out the next wafer, and repeats the series of operations described above to perform the operation in the cassette. Inspection of electrical characteristics of all wafers. Further, while the wafer in the cassette is being processed, the automatic transport vehicle V will transport the cassette and transfer the cassette to the empty second loading cassette 1 3 . Then, when the electrical characteristic inspection of all the wafers in the cassette on the first loading cassette 13 is completed, the rotating table 132 is rotated by 90° in the counterclockwise direction, and the loading/unloading port of the cassette is directed toward the probe chamber 12 side. In this manner, the robot arm of the automatic transport vehicle V, which is already in the machine, is driven to receive the cassette on the loading cassette 13 on the automatic transport vehicle V, and is transported to the next step. During this time, the wafer on the second loading cassette 13 is processed in the loader chamber 1 1 and the probe chamber 12. Therefore, the cassettes on the first and second loading cassettes 13A and 13A in the present embodiment have functions as a transmitter and a receiver - 21 - 200807596 (18).

如以上說明般依據本實施形態，則由於裝載器室1 1 係配置在探針室12之側面，而且在裝載器室11的前後設 置第1、第2裝載璋I3A、13B，同時在第2裝載埠13B • 的下方配置副吸盤1 8，更且，在前後的第1、第2裝載埠 • 13A、13B之間設置具有可旋轉、升降之搬送機械臂141 的晶圓搬送裝置1 4，所以無需增加既有的單載型之檢查 B 裝置的面積，可增設裝載埠來變更成雙載型之檢查裝置 10，而且此檢查裝置1〇無需在單載型用之既有的自動搬 送線L上增加變更就可對應。又，由於將副吸盤1 8設在 第2裝載埠13B的下方，所以無需在裝載器室11內分割 副吸盤固有的空間，而可有效利用第2裝載埠1 3B之下方 的空間，來實現檢查裝置1 〇的設置空間之省空間化。 又，由於第1、第2裝載埠13 A、1 3 B，係沿著自動 搬送裝置V之自動搬送線L而排列，所以在檢查裝置1 〇 鲁的正面有操作者，例如即使在檢查載置於檢查裝置1 0的 第1裝載_璋1 3 A上之卡匣內的晶圓時，亦不會與潘作者 互相干涉而可使自動搬送裝~置V在其與第2裝載埠13B 之間進行卡匣的交接。 又，由於第1、第2裝載埠13A、13B，係沿著自動 搬送裝置V之自動搬送線L而排列，又，在各自的旋轉 台1 3 2旋轉使卡匣對峙於晶圓搬送裝置〗4時，各旋轉台 1 3 2上的卡匣相對於晶圓搬送裝置1 4以左右對稱方式配 置成等距離，所以可將晶圓搬送裝置1 4對卡匣的搬出入 -22- 200807596 (19) 動作及搬出入時間在兩卡匣的全部晶圓間形成大致相同’ 而可抑制各裝載璋1 3 A、1 3 B與探針室1 2之間的晶圓搬 送之不均勻，進而可縮短檢查裝置10內的晶w搬送時間 。又，由於卡匣係如此地以晶圓搬送裝置14爲中心而配 = 置成左右對稱，所以在將晶圓從卡匣搬送至探針室12時 • 不會受到因兩卡匣內之全部晶圚間的檢查裝置10內之環 境（例如，溫度、濕度等）所造成的影響之不均句’而可 II 經常以固定的狀態搬送晶圓且高精確度地進行檢查。 又，依據本實施形態，則由於將檢查從卡匣部分露出 的晶圓之感測器設在第1、第2裝載埠13 A、13B之各個 上，所以在將卡匣從自動搬送車V移載至第1、第2裝載 璋1 3 A、1 3 B時當晶圓從卡匣露出時，就可依感測器自動 檢測晶圓之露出，且可防止因晶圓之露出所造成的各種弊 害。 又，由於在第1、第2裝載埠13 A、13B上設置將從 • 卡匣朝晶圓搬送裝置1 4側露出的晶圓推入卡匣內之壓件 1 3 3，所以不會因晶圓搬送裝置Γ4從卡匣漏接晶圓而可確 實地搬出。更且，由於在副吸盤1 之近旁設置用以識別 晶圓的OCR19，所以可有效利用第2裝載埠13B的下方 ^ 空間做爲OCR19的設置空間。 又，由於晶圓搬送裝置1 4，具備二種類的第1、第2 升降驅動機構1 46、1 47，所以分別使用第1、第2升降驅 動機構146、147之二種類的功能，就可使晶圚既正確又 確實地升降。由於第1升降驅動機構1 46，具備圓筒機構 -23- 200807596 (20) 146C，所以可使搬送機械臂141在短時間 於第2升降驅動機構147，具備馬達作爲 及其驅動源，所以可使搬送機械臂141升 配合晶圓的搬入位置等而高精確度地進行 * 又，依據本實施形態，則由於在檢查 • ，將卡匣從自動搬送車V移載至設於裝_ 的第1裝載埠13A之後，在第1裝載璋 φ ，且在將晶圓從此卡匣逐片搬送至探針室 裝載埠13B的下方進行晶圓的定位，且在 之期間，將卡匣從自動搬送車V移載至第 所以可從晶圓投入於檢查裝置1 0至取出 止進行自動化，而且由於在檢查裝置1 0 載埠13A、13B之至少其中一方經常存在 ，所以即使檢查時間高速化亦可無間斷ίί 工作運轉，可提高檢查效率。 φ 又，本實施形態中雖已就使用自動摘 開放式卡匣（open cassette )的情況加以 用 _F_OUP ( Front Opening Unified Pot，晶 卡匣的情況，操作者亦可按照需要以[ * FOUP來搬送，且操作者將FOUP載置於 埠1 3 A、1 3 B。在此情況，如第3實施形 不需要晶圓壓件133，而藉由將自動開閉 開啓器設在裝載埠來取代壓件1 33，且使 內升降。又，由 〉滾珠螺桿147A 降一點點，且可 控制。 裝置1 〇之側面 丨器室11之前後 13A使卡匣旋轉 12之間於第2 進行晶圓的檢查 2裝載埠1 3 B， 檢查後的晶圓爲 的第1、第2裝 有處理中的卡匣 包使檢查裝置1 〇 J送車 V來搬送 說明，但是在使 圓傳送盒）作爲 扫蓋體所密閉的 第1、第2裝載 :態中亦說明般， FOUP之蓋體的 之對應FOUP。 -24- 200807596 (21) (第2實施形態） 例如第9圖所示，本實施形態的檢查裝置1 〇 A，係除 了在第1裝載埠13A的下方更設有第3裝載璋13C，且可 將卡匣C分別收容於上下二層的第1、第3裝載埠13A、 ’ 1 3C內以外，其餘構成實質與第2實施形態的檢查裝置i 〇_ 、相同。因而，在與第1實施形態相同或相當部分上附記相 同的元件符號來加以說明。 p 亦即，如第9圖所示，第3裝載埠13 C，係配置在第 1裝載埠13A的下方，具備與第1、第2裝載埠13A、 1 3 B實質相同的構成。晶圓搬送裝置1 4，係搬送機械臂 141透過第1、第2升降驅動機構（未圖示）而升降，且 與第1裝載埠13A或第3裝載埠13C相對峙，用以搬出 入各自的卡匣C內之晶圓。在第1裝載埠13A的卡匣C 中搬出入晶圓的情況，就如第9圖之實線所示在搬送機械 臂141透過第1升降機構而上升至與第1裝載埠13 A相 B 對峙的位置之後，透過第2升降驅動機構在卡匣C的上下 兩端之間升降並與第1實施形態之情況同樣地搬也入-卡匣 C內的晶瀾。又，在第3裝載埠13C的卡匣C中搬出入晶 圓的情況，只有第2升降驅動機構會驅動，且如第9圖之 * 一點鏈線所示搬送機械臂1 4 1會與第3裝載埠1 3 C相對峙 ，且搬送機械臂1 4 1會透過第2升降驅動機構在卡匣C的 上下兩端之間升降以搬出入晶圓。搬送機械臂1 4 1，係當 從各卡匣C內搬出晶圓時，就與第1實施形態同樣地將晶 圓搬送至處理室，將在處理室中結束預定處理的晶圓從處 -25- 200807596 (22) 理室開始搬送，且搬入至各自的卡匣C內。 依據本實施形態，則由於比第1實施形態更能擴充裝 載埠，所以在檢查裝置10A內可收容1個多的卡匣C，即 使晶圓的檢查時間縮短亦可不間斷地處理晶圓，更可提高 產出。其他，即使在本實施形態中亦可期待與第1實施形 ‘ 態同樣的作用效果。 在第1'第2實施形態中，雖已就在晶圓搬送裝置14 _ 的前後配置有裝載埠之例加以說明，但是本發明的處理裝 置，例如亦可只在晶圓搬送裝置的前方設置上下二層的裝 載埠。在此情況，即使是與以往的單璋之處理裝置相同的 面積亦可擴充裝載埠，且可對應晶圓等被處理體的處理速 度之高速化。又，在第2實施形態中，雖於晶圓搬送裝置 的前方設置上下二層的裝載埠，但是亦可於晶圓搬送裝置 的後方設置上下二層的裝載埠。又，亦可在第1裝載埠上 追加卡匣的升降機構，在此情況可縮小搬送機械臂的升降 ® 衝程。 (第3實施形態） 例如第1 0及1 1圖所示，本實施形態的檢查裝置1 0B ，係除了第1裝載埠13A成爲載置FOUP作爲卡匣C的 構造、設有自動開閉FOUP之蓋體的開啓器21、以及緩 衝台1 5的構造不同以外，其餘實質上係以第1實施形態 的檢查裝置1 0爲準所構成。因而，在與第1實施形態相 同或相當部分上附記相同的元件符號來加以說明，且將 -26- 200807596 (23) FOUP當作卡匣C來加以說明。 如第10圖、第11圖所示，本實施形態中的第1裝載 埠1 3 A，係具備：於上面具有開口部的基台1 3 1 ;以與基 台131之上面形成同一平面的方式設在基台131之開口部 的旋轉台132;和設在旋轉台132上面且載置固定卡匣C 4 的載置部1 3 5。旋轉台1 32，係透過連結於其下面中央的 旋轉驅動軸132A而旋轉，且使載置部135上的卡匣（：旋 H 轉。在載置部1 3 5上安裝有夾板機構（未圖示），可在與 對第1裝載埠13A進行存取的例如 AGV ( Automated Guided Vehicle，無人搬運車）或 OHT ( Overhead Hoist Transport，懸吊式搬運車）之間進行卡匣〇的自動交接 。夾板機構，係與AGV或OHT的動作同步作動。 如第1 1圖所示，旋轉台13 2的中心（旋轉驅動軸 132 A的軸心）0，係從通過開啓器21之寬度方向中心的 中心線L僅以所定尺寸（1偏倚至下方而配置。又，載置部 ® 135，係以在粗線所示的位置上以從AGV或OHT所接收 的卡匣（未圖示）內之粗線所示的晶圓W之中心01成爲 . 從旋轉台1 32之中心Ο僅以所定尺寸D偏倚至右側的位 置關係之方式配置在旋轉台132上。在旋轉台132透過旋 轉驅動軸132A而使載置部135從第1 1圖之粗線位置如 箭號所示地僅以90°朝逆時鐘方向旋轉至細線位置的時間 點，細線所示的晶圓W之中心〇 i會到達中心線L上，同 時從旋轉前之位置僅以所定尺寸d接近開啓器2 1，且載 置部13 5上的卡匣C會與開啓器21相對峙。藉此，卡匣 -27- 200807596 (24) C，係透過旋轉台1 32從旋轉前的狀態僅以所定尺寸d接 近開啓器2 1，且可僅以所定尺寸d來節省從卡匣C至開 啓器21的移動距離，甚至僅以該部分就可節省面積。 又雖未圖示，但是載置部135，係以透過包含導軌等 在內的直線前進驅動機構而可在旋轉台132上朝前後方向 ^ 移動的方式所構成。然後，在載置部135上的卡匣C之蓋 體如第1 0圖所示地與開啓器2 1相對峙時，就如同圖之箭 B 號所示般載置部1 3 5係透過直線前進驅動機構而朝向開啓 器2 1直線前進，且使蓋體與開啓器21自動結合。在此狀 態下，開啓器2 1係將卡匣C之蓋體自動地拆除並朝下方 搬送，藉以開放卡匣C的搬出入口，且藉由晶圓搬送裝置 ,14而備置於晶圓W的搬出入。 又，在第1裝載埠13 A的下方以第1實施形態爲準 而於上下配置有第12圖之（a)所示的緩衝台15及晶圓 台1 6。如同圖之（a )所示在緩衝台1 5上於上下方向多 © 層互相空出等間隔而形成有保持相同口徑（例如，300 mm φ )之針尖硏磨用晶圓W1或晶圓W的槽口 1 5 Γ。由於 如此地收納相同口徑之針尖硏"磨用晶圓Wi或晶圓，所以 即使在受限的空間亦可如同圖之（a )所示般地設置多層 ' 的槽口 1 5 1。藉此即使因晶圓尺寸變大晶片數顯著增加而 使探針卡的針尖硏磨之硏磨次數增加，亦可藉由事先將多 片的針尖硏磨用晶圓w 1收納在緩衝台1 5內而對應硏磨 次數的增加來連續使用多片的針尖硏磨用晶圓W i。 然而，以往的緩衝台是理所當然的，而在第1實施形 -28-As described above, according to the present embodiment, the loader chamber 1 1 is disposed on the side surface of the probe chamber 12, and the first and second loading ports I3A and 13B are provided in front of and behind the loader chamber 11, and at the same time. A sub-sucker 1 8 is disposed below the loading cassette 13B •, and a wafer transfer device 1 4 having a transferable and movable transfer arm 141 is provided between the first and second loading ports 13A and 13B. Therefore, it is not necessary to increase the area of the inspection single device of the existing single-load type, and the loading device can be added to change to the double-load type inspection device 10, and the inspection device 1 does not need to have the existing automatic conveying line for the single-load type. Adding changes to L can correspond. Further, since the sub-suction chuck 18 is disposed below the second loading cassette 13B, it is not necessary to divide the space unique to the sub-suction tray in the loader chamber 11, and the space below the second loading cassette 1 3B can be effectively utilized. Check the space of the installation space of the device 1 。. Further, since the first and second loading cassettes 13 A and 1 3 B are arranged along the automatic conveying line L of the automatic conveying device V, there is an operator on the front side of the inspection apparatus 1, for example, even in the inspection load. When the wafer in the cassette on the first load_璋1 3 A of the inspection device 10 is placed, the automatic transfer device can be placed in the second load port 13B without interfering with the author of the Pan. Hand over the card. Further, the first and second loading cassettes 13A and 13B are arranged along the automatic transfer line L of the automatic transfer device V, and are rotated by the respective rotary tables 133 to cause the cassette to be placed on the wafer transfer apparatus. At 4 o'clock, the cassettes on the respective rotary stages 133 are arranged equidistantly with respect to the wafer transfer apparatus 14 in a bilaterally symmetrical manner, so that the wafer transfer apparatus 14 can carry out the cassettes into the -22-200807596 ( 19) The operation and the loading and unloading time are substantially the same between all the wafers of the two cassettes, and the unevenness of the wafer transfer between the loading ports 1 3 A, 1 3 B and the probe chamber 1 2 can be suppressed, and further The crystal w transport time in the inspection apparatus 10 can be shortened. Further, since the cassette is disposed so as to be bilaterally symmetrical about the wafer transfer device 14, when the wafer is transferred from the cassette to the probe chamber 12, it is not affected by the entire two cassettes. The unevenness of the influence caused by the environment (for example, temperature, humidity, etc.) in the inspection apparatus 10 between the wafers is often carried out in a fixed state and the inspection is performed with high precision. Further, according to the present embodiment, since the sensor for inspecting the wafer exposed from the cassette portion is provided on each of the first and second loading cassettes 13 A and 13B, the cassette is transported from the automatic transport vehicle V. When the wafer is removed from the cassette when it is transferred to the first and second loading ports 1 3 A and 1 3 B, the exposure of the wafer can be automatically detected by the sensor and the exposure of the wafer can be prevented. Various drawbacks. Further, since the first and second loading cassettes 13A and 13B are provided with the pressing member 13 3 that pushes the wafer exposed from the side of the wafer transporting device 14 to the cassette, it is not caused by the pressing member 13 3 . The wafer transfer device Γ4 can be surely carried out by escaping the wafer from the cassette. Further, since the OCR 19 for identifying the wafer is provided in the vicinity of the sub-suction pad 1, the space below the second mounting port 13B can be effectively utilized as the installation space of the OCR 19. Further, since the wafer transfer device 14 includes two types of first and second elevation drive mechanisms 1 46 and 1 47, the functions of the first and second lift drive mechanisms 146 and 147 can be used. Make the crystals rise and fall correctly and surely. Since the first lifting/lowering mechanism 1 46 includes the cylindrical mechanism -23-200807596 (20) 146C, the transport robot 141 can be provided with the motor as its driving source for a short time in the second lifting/lowering mechanism 147. According to the present embodiment, the transport robot arm 141 is lifted to match the loading position of the wafer and the like, and the cassette is transferred from the automatic transport vehicle V to the first set. (1) After loading the crucible 13A, the first loading 璋φ is performed, and the wafer is transferred from the cassette to the probe chamber loading cassette 13B one by one, and the wafer is positioned automatically. Since the vehicle V is transferred to the first place, it can be automated from the time when the wafer is placed in the inspection apparatus 10 to the time of take-out, and since at least one of the inspection apparatuses 10 and 13A, 13B is often present, even if the inspection time is increased, the inspection time can be increased. Uninterrupted ίί Work and improve inspection efficiency. φ Further, in the present embodiment, the case of using the automatic open open cassette is _F_OUP (Front Opening Unified Pot, the case of the crystal card, the operator can also use [* FOUP as needed] The carrier moves the FOUP to 埠1 3 A, 1 3 B. In this case, the wafer pressing member 133 is not required in the third embodiment, but is replaced by the automatic opening and closing opener. Pressing member 1 33, and lifting the inside. Also, the ball screw 147A is lowered a little and can be controlled. The device 1 〇 side of the 丨 室 11 11 11 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 In the inspection 2 loading 埠 1 3 B, the first and second loading cassettes in the inspection wafer are sent to the inspection device 1 〇J to transport the vehicle V, but the circular transfer box is used as the inspection In the first and second loading states in which the sliding cover is sealed, the corresponding FOUP of the cover of the FOUP is also described. -24-200807596 (21) (Second Embodiment) As shown in Fig. 9, the inspection device 1A of the present embodiment further includes a third loading cassette 13C in addition to the first loading cassette 13A. The cassette C can be accommodated in the first and third loading cassettes 13A and '1 3C of the upper and lower layers, respectively, and the rest of the configuration is substantially the same as that of the inspection apparatus i 〇_ of the second embodiment. Therefore, the same or equivalent components as those in the first embodiment will be described with the same reference numerals. In other words, as shown in Fig. 9, the third loading cassette 13 C is disposed below the first loading cassette 13A, and has substantially the same configuration as the first and second loading cassettes 13A and 1 3B. The wafer transfer device 14 moves up and down through the first and second elevation drive mechanisms (not shown), and is opposed to the first loading cassette 13A or the third loading cassette 13C for carrying in and out The wafer inside the cassette C. When the wafer is carried in and out of the cassette C of the first loading cassette 13A, the transfer robot arm 141 is moved to the first loading cassette 13A by the first elevating mechanism as indicated by the solid line in FIG. After the position of the crucible, the second elevating drive mechanism is moved up and down between the upper and lower ends of the cassette C, and the wafer in the cassette C is carried in the same manner as in the first embodiment. Further, when the wafer is carried in and out of the cassette C of the third loading cassette 13C, only the second lifting/lowering mechanism is driven, and the robot arm 1 4 1 is the same as the one-point chain line in Fig. 9 3 When the load 埠1 3 C is opposed to the 峙, the transfer robot arm 141 is lifted and lowered between the upper and lower ends of the cassette C by the second lift drive mechanism to carry in and out of the wafer. When the transfer robot arm 14 1 carries out the wafer from each cassette C, the wafer is transferred to the processing chamber in the same manner as in the first embodiment, and the wafer in which the predetermined processing is completed in the processing chamber is received. 25- 200807596 (22) The management room starts to move and moves into the respective cassette C. According to the present embodiment, since the loading cassette can be expanded more than the first embodiment, a large number of cassettes C can be accommodated in the inspection apparatus 10A, and the wafer can be processed without interruption even if the inspection time of the wafer is shortened. Can increase output. Others, even in the present embodiment, the same operational effects as those of the first embodiment can be expected. In the first 'second embodiment, an example in which the magazine is placed in front of and behind the wafer transfer device 14_ is described. However, the processing device of the present invention may be provided only in front of the wafer transfer device, for example. Load the top and bottom layers. In this case, the loading area can be expanded even in the same area as the conventional processing unit of the single unit, and the processing speed of the object to be processed such as a wafer can be increased. Further, in the second embodiment, the loading and unloading stacks of the upper and lower layers are provided in front of the wafer transfer device, but the loading and unloading stacks of the upper and lower layers may be provided behind the wafer transfer device. Further, a lifting mechanism of the cassette can be added to the first loading cassette, and in this case, the lifting/lowering stroke of the transfer robot can be reduced. (Third Embodiment) For example, as shown in Figs. 10 and 1 1 , the inspection apparatus 10B of the present embodiment is provided with a structure in which the first loading cassette 13A is placed with the FOUP as the cassette C, and the automatic opening and closing FOUP is provided. The configuration of the opening device 21 of the lid body and the buffer table 15 is substantially the same as that of the inspection device 10 of the first embodiment. Therefore, the same reference numerals will be given to the same or corresponding parts as in the first embodiment, and -26-200807596 (23) FOUP will be described as a cassette C. As shown in Fig. 10 and Fig. 11, the first loading cassette 1 3 A in the present embodiment includes a base 13 1 having an opening on the upper surface, and a flat surface formed on the upper surface of the base 131. The rotary table 132 provided in the opening of the base 131; and the mounting portion 135 provided on the upper surface of the rotary table 132 and on which the fixed cassette C 4 is placed. The turntable 1 32 is rotated by the rotation drive shaft 132A connected to the center of the lower surface thereof, and the cassette on the mounting portion 135 is rotated (the rotation H is turned. The splint mechanism is attached to the mounting portion 135 (not As shown in the figure, an automatic transfer of the cassette can be performed between an AGV (Automated Guided Vehicle) or an OHT (Overhead Hoist Transport) that accesses the first loading cassette 13A. The splint mechanism is operated in synchronization with the action of the AGV or the OHT. As shown in Fig. 1, the center of the rotary table 13 2 (the axis of the rotary drive shaft 132 A) 0 is from the center of the width direction of the opener 21 The center line L is disposed only at a predetermined size (1 is biased to the lower side. Further, the mounting portion 135 is placed in a cassette (not shown) received from the AGV or OHT at a position indicated by a thick line. The center 01 of the wafer W indicated by the thick line is disposed on the turntable 132 from the center of the turntable 1 32 so as to be biased to the right side only by the predetermined dimension D. The rotary table 132 transmits the rotary drive shaft. 132A causes the placing portion 135 to be from the thick line position of the 1st figure as an arrow The time point shown in the case where the rotation is only 90° in the counterclockwise direction to the position of the thin line, the center 〇i of the wafer W indicated by the thin line reaches the center line L, and is close to the opening only from the position before the rotation. The clamp 2 and the cassette C on the mounting portion 13 5 are opposite to the opener 21. Thereby, the cassette -27-200807596 (24) C is transmitted through the rotary table 1 32 from the state before the rotation only The predetermined size d is close to the opener 2 1, and the moving distance from the cassette C to the opener 21 can be saved only by the predetermined size d, and even the area can be saved by the portion. Although not shown, the mounting portion 135 is configured to be movable in the front-rear direction on the rotary table 132 by a linear forward drive mechanism including a guide rail or the like. Then, the cover of the cassette C on the mounting portion 135 is the first. When it is opposite to the opener 2 1 as shown in Fig. 1, the mounting portion 1 3 5 is linearly advanced toward the opener 2 1 as shown by the arrow B of the figure, and the cover body and the cover are The opener 21 is automatically coupled. In this state, the opener 2 1 automatically removes the cover of the cassette C The lower loading port is opened, and the loading and unloading port of the cassette C is opened, and the wafer W is placed in and out of the wafer W. Further, the first loading cassette 13A is below the first embodiment. The buffer stage 15 and the wafer stage 16 shown in Fig. 12(a) are disposed above and below. As shown in (a) of the figure, the buffer layer 15 is spaced apart from each other in the vertical direction. Further, the tip honing wafer W1 or the notch of the wafer W which is maintained at the same diameter (for example, 300 mm φ) is formed. Since the wafer tip Wi/wafer of the same diameter is accommodated in this way, even in a limited space, the plurality of slits 151 can be provided as shown in (a) of the figure. Therefore, even if the number of wafers increases significantly as the wafer size increases, the number of times of honing the tip of the probe card increases, and the plurality of tips honing wafer w 1 can be stored in the buffer table 1 in advance. In the case of 5, the number of honing times is increased to continuously use a plurality of wafer tip honing wafers W i . However, the conventional buffer table is taken for granted, and in the first embodiment, -28-

200807596 (25) 態的緩衝台方面，由於收納著X]徑不同的針尖硏磨用 ，所以無法收納相同尺寸的針尖硏磨用晶圓，且有依 而需要暫時停止裝置以交換針尖硏磨用晶圓，造成產 低的主要原因。 又，如第12圖之（b)所示般緩衝台15的各 1 5 1，係分別由上下的擱板1 5 1 A、1 5 1 B所形成。在 口 151上分別設有分別檢測針尖硏磨用晶圓Wl等之 的光學感測器1 52，可依此等的光學感測器1 52來個 認被收納於各槽口 1 5 1內的針尖硏磨用晶圓 W i。光 測器152，係由發光元件152A與受光元件152B所構 透過各自的配線152C、152C而連接在配線基板153 在下側的擱板151 A上形成有收納發光元件152A的 1 5 1 C，而在上側的擱板1 5 1 B上形成有收納受光元件 的空間152D。然後，在各擱板15 1C上分別形成有發 件152A之光線所通過的孔151E。各槽口 151的光學 器1 52係分別每隔一個互異地配置在槽口 1 5 1之前後 上，俾使相鄰的上下之光學感測器152不會重疊。 藉此，——個槽口 1 5 1中的針尖硏磨用晶圓W i之 係依該層之光學感測器1 52而檢測，且不會自此檢1 層的槽口 1 5 1的針尖硏磨用晶圓Wi之存否。換句i 上下的光學感測器1 5 1之光線不會互相千涉。如此π 在各槽口 1 5 1的光學感測器1 52確實地檢測各自甶 1 5 1之針尖硏磨用晶圓W 1等，亦可特定在該槽口 1 保持的晶圓之種類。 晶圓 情況 出降 槽口 各槽 存否 別確 學感 成， 上。 空間 1 52B 光元 感測 方向 .存否 丨出上 ί說， 1衣設 丨槽口 51所 -29 - 200807596 (26) 如以上說明般依據本實施形態，則由於第1裝載埠 13A，係具有載置卡匣C的載置部135、及使該載置部 1 3 5旋轉的旋轉台1 3 2，卡匣C內的晶圓W之中心Ο i僅 以所定尺寸d從旋轉台132之中心Ο偏倚，使載置部135 偏心旋轉，所以當旋轉台132使從AGV或OHT接收的卡 • 匣C偏心旋轉時，卡匣C就會僅以所定尺寸d接近開啓 器2 1並與開啓器2 1相對峙，而可僅以所定尺寸d節省從 B 卡匣C至開啓器21的移動距離，甚至可僅以該部分而節 省面積。 又，依據本實施形態，則由於在第1裝載埠13 A的 下方，設置有於上下方向具有保持相同尺寸（例如，3 00 πιιηφ)之針尖硏磨用晶圓Wi的多層槽口 151之緩衝台 15，所以可收納多片相同尺寸的針尖硏磨用晶圓Wi，300 Φ 的晶圓之檢查片數等會顯著增加，即使探針卡的針 尖硏磨之次數增加亦可以多片的針尖硏磨用晶圓Wi來連 • 續硏磨，且可提高檢查的產出。又，由於緩衝台1 5的各 槽口 151，係具有檢測針尖硏磨用晶圓Wi等之存否的光 . 學感測器1 52，所以可確認各曹口 1 5 1中的針尖硏磨用晶 圓Wi之存否，甚至藉由事先決定各槽口 151與各自的光 學感測器152之對應關係，即可特定被收納於各槽口 151 內的針尖硏磨用晶圓Wi之種類。其他，即使在本實施形 態中亦可期待與第1實施形態同樣的作用效果。 (弟4實施形態） -30- 200807596 (27) 本實施_形態的檢查裝置，係除了晶圓搬送裝置與副吸 盤及OCR —體化以外其餘實質上係構成與第1實施形態 相同。在與第1實施形態相同或相當部分上附記相同的元 件符眾並就本實施形態之特徵加以說明。 例如第1 3圖所示，在本實施形態中的晶圓搬送裝置 6 1 4A之情況，係在旋轉基板1 43上設有作爲定位機構的副 吸盤1 8。此副吸盤1 8，係構成可升降、旋轉，且設在從 ϋ 卡匣搬出晶圓W (同圖中以一點鏈線所示）並後退的中途 。又，在副吸盤1 8之側方設有作爲資訊讀取裝置的 OCR19。因而，搬送機械臂141係與卡匣相對峙，且在從 卡匣搬出預定的晶圓W並後退至旋轉基板1 43上的中途 副吸盤1 8會接收晶圓W。然後，在副吸盤1 8朝同圖之箭 號0方向旋轉的期間以OCR19來讀取晶圓W的識別資訊 之後，進行預對準作業。在預對準後，與第1實施形態同 樣搬送機械臂1 4 1會將晶圓W交接至探針室內之主吸盤 # 上。換句話說，在第1實施形態中雖然搬送機械臂1 4 1從 卡匣搬出晶圓W之後，有必要將晶圓W搬送至第2裝載 , 器室側之副吸=盤及OCR，但是本實施形態中則可在晶圓 搬送裝置1 4 A中讀取預對準與晶圓W的識別資訊。 因而，依據本實施形態，則由於晶圓搬送裝置1 4 A 具有副吸盤18及OCR19，所以可縮短從卡匣搬出且交接 至探針室的時間。其他，可期待與第1實施形態同樣的作 用效果。 -31 - 200807596 (28) (第5 -實施形態） 本實施形態的檢查裝置，係除了設置多關節機器人以 取代晶圓搬送裝置的搬送機械臂以外其餘實質上係以第4 . 實施形態爲準而構成。因而，即使在本實施形態中亦就晶 圓搬送裝置及副吸盤加以說明。 例如第14圖所示，本實施形態中的晶圓搬送裝置 1 4B，係具有：搬送晶圓W的多關節機器人1 49 ;支撐多 B 關節機器人149的基台145 (參照第6圖）；設在基台 145上的副吸盤18 ;以及設在副吸盤18之近旁的OCR 19 〇 如同圖所示，多關節機器人1 49係具有複數個機械臂 149A、互相連結此等機械臂149A的關節149B、連結在 此等機械臂149A之前端的機械手14 9C、及連結在此等機 械臂149A之基端部的旋轉驅動部149D。複數個機械臂 1 49A係以基端部爲中心而朝正反方向旋轉，用以改變晶 B 圓W的搬送方向之方式所構成。複數個機械臂149A，係 以連結各個的關節149B之活動而屈伸，在複數個機械臂 149A及機械手149C伸直時就將機械手149A所保持的晶 圓 W對卡匣進行搬出入，且在探針室與主吸盤之間授受 的方式所構成。另外，作爲多關節機器人1 49可使用以往 公知的多關節機器人。 因而，即使在本實施形態中除了亦可與第4實施形態 同樣地在晶圓搬送裝置14B中進行晶圓的預對準及晶圓 W的識別以外，其餘亦可期待與第1實施形態同樣的作用 -32- 200807596 (29) 效果。 又，在第1至第5實施形態中，載置於第1、第2裝 載埠上的卡匣，係分別具有作爲傳送器與接收器的功能。 但是，亦可將第1裝載璋之卡匣當作傳送器專用來使用， ' 將第2裝載璋之卡匣當作接收器專用來使用，又，亦可將 ^ 傳送器與接收器作適當切換而使用第1、第2裝載埠之卡 匣。 φ 另外，在上述實施形態中雖已舉檢查裝置爲例加以說 明，但是即使對被處理體施予預定處理的處理裝置亦可適 用。因而，本發明並非被任意受限於上述實施形態，其可 按照需要而適當設計變更各構成要素。 (產業上之可利用性） 本發明可廣泛利用於半導體製造工廠之無塵室內所配 置的各種處理裝置中。 【圖式簡單說明】 第1圖係顯示本發明的處理裝置之一實施形態之檢查 裝置的立體圖。 弟2圖係顯τκ弟1圖所不的檢查裝置之無塵室內之佈 局的平面圖。 第3圖係顯不第1圖所示的檢查裝置之裝載器室內部 的平面圖。 第4圖係顯不弟3圖所不的裝載器室之平面圖。 -33- 200807596 (30) 第5圖係顯不第3圖所-示的裝載器室之側視圖。 第6圖係顯示第3圖所示的晶圓搬送裝置之直線前進 驅動機構的側視圖。 第7圖係顯示第5圖所示的晶圓搬送裝置之立體调。 第8圖係顯示第7圖所示的晶圓搬送裝置之升降驅動 - 機構的立體圖。 第9圖係顯示第1圖所示的檢查裝置之變化例之主要 φ 部分的側視圖。 第1 〇圖係顯示本發明的處理裝置之另一實施形態之 裝載器室之主要部分的立體圖。 第11圖係顯示用於本發明的處理裝置之更另一實施 形態中的晶圓搬送裝置之平面圖。 第1 2 ( a )、（ b )圖係分別顯示用於第1 〇圖所示的 裝載器室中的緩衝台及晶圓台，（a )爲其正面圖，（b ) 爲擴大緩衝台之主要部分而顯示的剖視圖。 φ 第1 3圖係顯示本發明的處理裝置之更另一實施例之 主要部分的平面圖。 第1 4圖係顯示本發明的處理裝置之更另一實施例之 主要部分的平面圖。 * 第15 (a)圖係顯示習知檢查裝置之構成的平面圖； (b )係在習知檢查裝置中追加裝載璋的平面圖。 【主要元件符號說明】 1 0 :檢查裝置（處理裝置） -34- 200807596 (31) 1 1 :裝載器室 12 :探針室（處理室） 13A、13B、13C:裝載埠 14、14A、14B :晶圓搬送裝置（搬送裝置） ' 1 5 :緩衝台（收納體） ^ 1 6 :晶圓台 17 :支撐體 • 1 8 :副吸盤（定位機構） 19 : OCR (識別裝置） 21:開啓器（開閉機構） 1 3 1 :基台 132 :旋轉台（旋轉體） 132A :旋轉驅動軸 1 3 3 :壓件 1 4 1 :搬送機械臂 # 142 :直線前進驅動機構 143 :旋轉基板^ 144 :旋轉驅動機構 S :開縫 * S 1 :第1短開縫 S2 :第2短開縫 - 35-200807596 (25) In terms of the buffer table, since the needle tip honing is different in the X] diameter, it is not possible to store the wafer of the same size for the tip honing, and it is necessary to temporarily stop the device to exchange the needle tip honing. Wafers, the main cause of low yields. Further, as shown in Fig. 12(b), each of the buffers 15 is formed of upper and lower shelves 1 5 1 A and 1 5 1 B, respectively. An optical sensor 1 52 for detecting the tip honing wafer W1 or the like is provided on each of the ports 151, and the optical sensor 1 52 can be accommodated in each slot 1 51. The tip of the needle is used to polish the wafer W i . In the photodetector 152, the light-emitting element 152A and the light-receiving element 152B are connected to each other through the respective wirings 152C and 152C, and the shutter 151A on the lower side of the wiring board 153 is formed with the 1 5 1 C that houses the light-emitting element 152A. A space 152D in which the light receiving element is housed is formed on the upper shelf 1 5 1 B. Then, holes 151E through which the light of the hair piece 152A passes are formed on the respective shelves 15 1C. The optical encoders 52 of the notches 151 are disposed alternately before and after the notches 151, respectively, so that the adjacent upper and lower optical sensors 152 do not overlap. Thereby, the tip honing wafer W i in the slot 151 is detected by the optical sensor 152 of the layer, and the slot 1 1 1 of the layer is not detected. The tip of the needle is used to save the wafer Wi. In other words, the light from the upper and lower optical sensors 1 5 1 does not interfere with each other. Thus, the optical sensor 1 52 of each of the notches 151 can surely detect the tip honing wafer W 1 or the like of each of the 甶 1 5 1 , and can also specify the type of the wafer held by the notch 1 . Wafer situation, drop, slot, slot, save, do not make sense, on. Space 1 52B illuminating direction of light element. 存 丨 上 ί 1 1 1 1 1 1 1 -29 -29 -29 -29 -29 -29 -29 -29 -29 -29 -29 -29 -29 -29 -29 -29 -29 -29 -29 -29 -29 -29 -29 -29 -29 -29 -29 -29 -29 -29 -29 -29 -29 -29 -29 -29 The mounting portion 135 on which the cassette C is placed and the rotating table 133 that rotates the mounting portion 135, the center Ο i of the wafer W in the cassette C is only from the rotating table 132 at a predetermined size d The center Ο biases the 135 eccentric rotation, so when the rotary table 132 eccentrically rotates the card 匣C received from the AGV or OHT, the cassette C approaches the opener 2 1 and opens only at a predetermined size d The device 2 1 is relatively sturdy, and the moving distance from the B 匣C to the opener 21 can be saved only by the predetermined size d, and even the area can be saved only by this portion. Further, according to the present embodiment, the buffer of the multi-layer notch 151 having the tip honing wafer Wi having the same size (for example, 300 π π η φ) in the vertical direction is provided below the first loading cassette 13 A. Since the table 15 can accommodate a plurality of wafers of the same size, the wafer Wi, 300 Φ, the number of inspection wafers, etc., can be significantly increased, and even if the number of times of the probe card is increased, the number of needles can be increased. The honing uses the wafer Wi to continue the honing and improve the inspection output. Further, since each of the notches 151 of the buffer table 15 has a light detecting sensor 1 52 for detecting the tip honing wafer Wi or the like, it is possible to confirm the tip honing in each of the cavities 1 5 1 By the presence or absence of the wafer Wi, the type of the tip honing wafer Wi accommodated in each of the notches 151 can be specified by determining the correspondence between the notches 151 and the respective optical sensors 152 in advance. Others, even in the present embodiment, the same operational effects as those of the first embodiment can be expected. (Embodiment 4) -30-200807596 (27) The inspection apparatus of the present embodiment is basically the same as the first embodiment except for the wafer transfer apparatus, the sub-suction tray, and the OCR. Features that are the same as or equivalent to those of the first embodiment will be described with reference to the features of the embodiment. For example, as shown in Fig. 3, in the case of the wafer transfer apparatus 6 1 4A of the present embodiment, the sub-suction pad 18 as a positioning means is provided on the rotary substrate 1 43. The sub-suction pad 18 is configured to be movable up and down and rotated, and is disposed in the middle of retracting the wafer W (shown by a chain line in the same figure) from the cassette. Further, an OCR 19 as an information reading device is provided on the side of the sub-suction pad 18. Therefore, the transport robot 141 is opposed to the cassette, and the sub-sucker 18 receives the wafer W while the predetermined wafer W is carried out from the cassette and retracted to the rotary substrate 143. Then, after the sub-cup 18 is rotated in the direction of the arrow 0 in the same figure, the identification information of the wafer W is read by the OCR 19, and then the pre-alignment operation is performed. After the pre-alignment, the transfer robot 141 transfers the wafer W to the main chuck # in the probe chamber in the same manner as in the first embodiment. In other words, in the first embodiment, after the transport robot 14 1 carries the wafer W from the cassette, it is necessary to transport the wafer W to the second load, the sub-suction disc and the OCR on the chamber side. In the present embodiment, the pre-alignment and the identification information of the wafer W can be read in the wafer transfer apparatus 14A. Therefore, according to the present embodiment, since the wafer transfer apparatus 14A has the sub-suction disk 18 and the OCR 19, the time taken out from the cassette and delivered to the probe chamber can be shortened. Other effects can be expected in the same manner as in the first embodiment. -31 - 200807596 (28) (Embodiment 5) The inspection apparatus according to the present embodiment is basically the fourth embodiment except that the multi-joint robot is provided instead of the transport robot of the wafer transfer apparatus. And constitute. Therefore, even in the present embodiment, the wafer transfer device and the sub-suction pad will be described. For example, as shown in Fig. 14, the wafer transfer apparatus 14B of the present embodiment includes a multi-joint robot 1 49 that transports the wafer W, and a base 145 that supports the multi-B joint robot 149 (see Fig. 6); The sub-suction cup 18 provided on the base 145; and the OCR 19 设 disposed near the sub-suction cup 18 as shown in the figure, the multi-joint robot 1 49 has a plurality of mechanical arms 149A and joints connecting the mechanical arms 149A to each other. 149B, a robot 14 9C coupled to the front end of the arm 149A, and a rotary drive unit 149D coupled to the base end of the arm 149A. A plurality of robot arms 1 49A are formed by rotating the base end portion in the forward and reverse directions to change the conveying direction of the crystal B circle W. The plurality of robot arms 149A are bent and extended by the movement of the joints 149B, and when the plurality of robot arms 149A and 149C are straightened, the wafer W held by the robot 149A is carried in and out of the cassette, and It is constructed by means of receiving and receiving between the probe chamber and the main suction cup. Further, as the articulated robot 1 49, a conventionally known multi-joint robot can be used. Therefore, in the present embodiment, in the same manner as in the fourth embodiment, the pre-alignment of the wafer and the identification of the wafer W can be performed in the wafer transfer apparatus 14B, and the same as in the first embodiment. The role of -32- 200807596 (29) effect. Further, in the first to fifth embodiments, the cassettes placed on the first and second loading cassettes each have a function as a transmitter and a receiver. However, the card of the first loading cassette can also be used exclusively for the transmitter, and the card of the second loading cassette can be used exclusively for the receiver, and the transmitter and receiver can be used appropriately. Switch between the first and second loading cassettes. In addition, although the inspection apparatus has been described as an example in the above embodiment, a processing apparatus that applies predetermined processing to the object to be processed can be applied. Therefore, the present invention is not limited to the above-described embodiments arbitrarily, and various constituent elements can be appropriately designed and changed as needed. (Industrial Applicability) The present invention can be widely used in various processing apparatuses disposed in a clean room of a semiconductor manufacturing factory. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing an inspection apparatus according to an embodiment of a processing apparatus of the present invention. The 2nd picture shows the plan of the clean room of the inspection device of the τκ弟1. Fig. 3 is a plan view showing the inside of the loader of the inspection apparatus shown in Fig. 1. Figure 4 is a plan view of the loader chamber that is not shown in Figure 3. -33- 200807596 (30) Figure 5 shows a side view of the loader chamber shown in Figure 3. Fig. 6 is a side view showing the linear forward drive mechanism of the wafer transfer apparatus shown in Fig. 3. Fig. 7 is a view showing the stereoscopic adjustment of the wafer transfer apparatus shown in Fig. 5. Fig. 8 is a perspective view showing the elevating drive mechanism of the wafer transfer apparatus shown in Fig. 7. Fig. 9 is a side view showing a main φ portion of a variation of the inspection apparatus shown in Fig. 1. Fig. 1 is a perspective view showing a main portion of a loader chamber of another embodiment of the processing apparatus of the present invention. Fig. 11 is a plan view showing a wafer transfer apparatus in still another embodiment of the processing apparatus of the present invention. The first and second (a) and (b) diagrams respectively show the buffer table and the wafer table used in the loader chamber shown in Fig. 1, (a) for the front view and (b) for the expansion buffer table. A cross-sectional view showing the main part. Fig. 13 is a plan view showing the principal part of still another embodiment of the processing apparatus of the present invention. Fig. 14 is a plan view showing the principal part of still another embodiment of the processing apparatus of the present invention. * Figure 15 (a) is a plan view showing the structure of a conventional inspection device; (b) is a plan view in which a conventional cymbal is additionally mounted on a conventional inspection device. [Explanation of main component symbols] 1 0 : Inspection device (processing device) -34- 200807596 (31) 1 1 : Loader chamber 12: Probe chamber (processing chamber) 13A, 13B, 13C: Loading 埠 14, 14A, 14B : Wafer transfer device (transport device) ' 1 5 : Buffer table (storage unit) ^ 1 6 : Wafer table 17 : Support body • 1 8 : Sub-suction cup (positioning mechanism) 19 : OCR (identification device) 21: On (opening and closing mechanism) 1 3 1 : abutment 132 : rotary table (rotary body) 132A : rotary drive shaft 1 3 3 : presser 1 4 1 : transfer robot arm # 142 : linear forward drive mechanism 143 : rotating substrate ^ 144 : Rotary drive mechanism S : Slotted * S 1 : 1st short slit S2 : 2nd short slit - 35-

Claims (1)

200807596 (1) 十、申請專利範圍 1·一種處理裝置，係具備配置於處理室之側面的裝載 器室之處理裝置，其特徵爲，上述裝載器室具備： 2個裝載埠，載置用以收納複數個上述被處理體的框 體且沿著上述側面互相隔開配置； • 搬送裝置，配置於此等裝載埠之間且在此等裝載埠與 上述探針室之間搬送上述被處理體；和 φ 定位機構，設在上述2個裝載埠之至少其中一方的裝 載埠之下方且進行上述被處理體之定位。 2·—種處理裝置，係具備配置於處理室之側面的裝載 器室之處理裝置，其特徵爲，上述裝載器室具備： 2個裝載埠，載置用以收納複數個上述被處理體的框 體且鄰接上述側面而互相於上下方向隔開配置； 搬送裝置，鄰接上述側面而配置且在此等裝載埠與上 述探針室之間搬送上述被處理體；和 • 定位機構，使之鄰接上述側面而設且進行上述被處理 體之定位。 3 ·如申請專利範圍第1或2項所記載的處理裝置，其 中上述各裝載埠，係以各自沿著上述框體之自動搬送裝置 的搬送路徑而配置，且在與上述自動搬送裝置之間進行上 述框體之交接之方式所構成。 4.如申請專利範圍第1至3項中任一項所記載的處理 裝置’其中上述裝載埠，具有將上述框體之方向予以轉換 的方向轉換機構、及透過該方向轉換機構將與上述搬送裝 -36- 200807596 (2) 置對峙的上述框體之蓋體予以開閉的開閉機構。 5 _如申請專利範圍第4項所記載的處理裝置，其中上 述方向轉換機構，具有載置上述框體的載置部、及使該載 置部旋轉的旋轉體，上述框體內的上述被處理體之中心係 自上述旋轉體之中心僅偏倚所定尺寸而配置，而上述載置 ^ 部係利用上述旋轉體進行偏心旋轉。 6·如申請專利範圍第5項所記載的處理裝置，其中上 φ 述旋轉體，係以藉由僅旋轉所定角度使上述框體之蓋體與 上述開閉機構對峙，同時上述框體僅以上述所定尺寸接近 上述開閉機構之開閉位置之方式構成。 7.如申請專利範圍第5或6項所記載的處理裝置，其 中上述所定角度爲90°。 8 ·如申請專利範圍第1至7項中任一項所記載的處理 裝置，其中，在上述定位機構之近旁設有識別上述被處理 體的識別裝置。 • 9·如申請專利範圍第1至8項中任一項所記載的處理 裝置，其中，檢測從上述框體露出的上述被處理-體之感測 器係設在上述裝載埠上。 10.如申請專利範圍第9項所記載的處理裝置，其中 ，將從上述框體露出的上述被處理體推入上述框體內的壓 件係設在上述裝載埠上。 1 1 ·如申請專利範圍第1至1 〇項中任一項所記載的處 理裝置，其中上述搬送裝置，具備二種類的第1、第2升 降驅動機構。 -37- 200807596 (3) I2·如申請專利範圍第11項所記載的處理裝置，其中 ，上述第1升降驅動機構具有氣缸，而上述第2升壓驅動 機構具備馬達。 13.如申請專利範圍第1及3至12項中任一項所記載 的處理裝置，其中，在上述2個裝載璋中之另一方的裝載 埠之下方，設有於上下方向具有多層用以保持同一尺寸之 基板的保持部之收容體。 B · 14.如申請專利範圍第13項所記載的處理裝置，其中 上述保持部，具有檢測上述基板之存否的感測器。 1 5 .如申請專利範圍第1至1 4項中任一項所記載的處 理裝置，其中上述搬送裝置，係以多關節機器人構成主體 〇 1 6 . —種處理裝置，係具備配置於處理室之側面的裝 載器室之處理裝置，其特徵爲，上述裝載器室具備： 2個裝載埠，載置用以收納複數個上述被處理體的框 • 體且沿著上述側面互相隔開配置；和 搬送裝置，配置於此等裝載璋之間且在此等裝載埠與 上述探針室之間搬送上述被處理體，且 上述各裝載埠，係分別沿著上述框體之自動搬送裝置 ' 的搬送路徑而配置； 上述搬送裝置，具有進行上述被處理體之定位的定位 機構。 1 7. —種處理裝置，係具備配置於處理室之側面的裝 載器室之處理裝置，其特徵爲，上述裝載器室具備： -38- 200807596 (4) 2個裝載埠，載置用以收納複數個上述ΊΤ處理體之附 有蓋體的框體且沿著上述側面而互相隔開配置；和 搬送裝置，配置於此等裝載埠之間且在此等裝載璋與 上述探針室之間搬送上述被處理體；且 上述各裝載埠，分別具有將上述框體之方向予以轉換 的方向轉換機構、及透過該方向轉換機構將與上述搬送裝 置對峙的上述框體之蓋體予以開閉的開閉機構； • 上述搬送裝置，具有進行上述被處理體之定位的定位 機構。 18·如申請專利範圍第1至17項中任一項所記載的處 理裝置’其中，被載置於上述各裝載埠上的框體，係各自 兼做傳送器和接收器。 19·如申請專利範圍第〗至17項中任一項所記載的處 理裝置’其中，被載置於上述各裝載埠上的框體，係可各 自切換傳送器和接收器。 -39-200807596 (1) X. Patent Application No. 1. A processing apparatus is a processing apparatus including a loader chamber disposed on a side surface of a processing chamber, wherein the loader chamber is provided with two loading cassettes for mounting a housing that accommodates a plurality of the objects to be processed and disposed apart from each other along the side surface; • a conveying device disposed between the loading cassettes and transporting the object to be processed between the loading cassette and the probe chamber And the φ positioning mechanism is disposed below the loading pocket of at least one of the two loading magazines and performs positioning of the object to be processed. A processing apparatus comprising a loader chamber disposed on a side surface of a processing chamber, wherein the loader chamber includes: two loading cassettes for mounting a plurality of the objects to be processed The frame body is disposed to be spaced apart from each other in the vertical direction adjacent to the side surface; the conveying device is disposed adjacent to the side surface, and the workpiece is transported between the loading cassette and the probe chamber; and the positioning mechanism is adjacent to The side surface is provided and the positioning of the object to be processed is performed. The processing apparatus according to the first or second aspect of the invention, wherein each of the loading cassettes is disposed along a transport path of the automatic transport apparatus along the housing, and between the automatic transport apparatus and the automatic transport apparatus It is constituted by the manner in which the above-mentioned frames are handed over. 4. The processing apparatus according to any one of claims 1 to 3, wherein the loading cassette has a direction converting mechanism that converts a direction of the housing, and the conveyance is transmitted through the direction conversion mechanism -36- 200807596 (2) The opening and closing mechanism that opens and closes the lid of the above-mentioned frame. The processing device according to claim 4, wherein the direction changing mechanism includes a mounting portion on which the housing is placed, and a rotating body that rotates the mounting portion, and the processed body in the housing is processed. The center of the body is disposed only by a predetermined size from the center of the rotating body, and the mounting portion is eccentrically rotated by the rotating body. The processing apparatus according to claim 5, wherein the upper body of the rotating body is configured such that the lid body of the frame body faces the opening and closing mechanism by rotating only a predetermined angle, and the frame body is only the above The predetermined size is close to the opening and closing position of the opening and closing mechanism. 7. The processing apparatus according to claim 5, wherein the predetermined angle is 90°. The processing apparatus according to any one of claims 1 to 7, wherein the identification means for identifying the object to be processed is provided in the vicinity of the positioning means. The processing apparatus according to any one of claims 1 to 8, wherein the sensor to be processed from the housing is detected to be attached to the loading cassette. 10. The processing apparatus according to claim 9, wherein the pressing member that pushes the object to be processed exposed from the housing into the housing is attached to the loading cassette. The processing device according to any one of claims 1 to 1, wherein the transfer device includes two types of first and second lift drive mechanisms. The processing apparatus according to claim 11, wherein the first elevating drive mechanism includes a cylinder, and the second boosting drive mechanism includes a motor. The processing apparatus according to any one of the first to third aspect of the present invention, wherein the other one of the two loading cassettes is provided with a plurality of layers in the vertical direction. A housing for holding the holding portion of the substrate of the same size. The processing apparatus according to claim 13, wherein the holding unit has a sensor that detects the presence or absence of the substrate. The processing device according to any one of claims 1 to 4, wherein the transfer device is a multi-joint robot, and the processing device is disposed in the processing chamber. The processing device of the loader chamber on the side surface, wherein the loader chamber includes: two loading magazines, and a frame body for accommodating a plurality of the objects to be processed is placed and spaced apart from each other along the side surface; And the conveying device is disposed between the loading cassettes, and the processing object is transported between the loading cassette and the probe chamber, and the loading cassettes are respectively along the automatic conveying device of the housing The transport path is disposed; the transport device has a positioning mechanism that performs positioning of the object to be processed. 1. A processing apparatus comprising a loader chamber disposed on a side surface of a processing chamber, wherein the loader chamber is provided with: -38 - 200807596 (4) two loading cassettes for mounting Storing a plurality of frames of the above-mentioned sputum processing body with a lid body and arranging them apart from each other along the side surface; and the conveying device is disposed between the loading cassettes and between the loading cassette and the probe chamber Each of the loading cassettes has a direction changing mechanism that converts the direction of the frame, and an opening and closing that opens and closes the lid of the frame that faces the conveying device through the direction changing mechanism. Mechanism; The transfer device has a positioning mechanism that performs positioning of the object to be processed. The processing apparatus described in any one of the first to seventh aspects of the invention, wherein the housings placed on the respective loading cassettes serve as a transmitter and a receiver. The processing device described in any one of the above claims, wherein the housings placed on the respective loading cassettes are each capable of switching between a conveyor and a receiver. -39-
TW96116687A 2006-05-11 2007-05-10 Processing device TWI442493B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006132546 2006-05-11
JP2007044729 2007-02-23
JP2007112353A JP4146495B1 (en) 2006-05-11 2007-04-20 Processing equipment

Publications (2)

Publication Number Publication Date
TW200807596A true TW200807596A (en) 2008-02-01
TWI442493B TWI442493B (en) 2014-06-21

Family

ID=39787824

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96116687A TWI442493B (en) 2006-05-11 2007-05-10 Processing device

Country Status (2)

Country Link
JP (1) JP4146495B1 (en)
TW (1) TWI442493B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5364769B2 (en) * 2011-09-26 2013-12-11 株式会社安川電機 Transfer robot and substrate processing apparatus
JP5894825B2 (en) 2012-03-21 2016-03-30 東京エレクトロン株式会社 Probe apparatus and wafer transfer unit
JP6210726B2 (en) * 2013-05-14 2017-10-11 株式会社ディスコ Processing equipment
CN107634025B (en) * 2017-11-02 2024-04-16 湖南艾博特机器人技术有限公司 Photovoltaic silicon wafer basket of flowers conveying mechanism
JP7294825B2 (en) * 2019-02-15 2023-06-20 株式会社東京精密 Plane processing equipment
JP2022086777A (en) 2020-11-30 2022-06-09 東京エレクトロン株式会社 Substrate delivery method and substrate delivery device

Also Published As

Publication number Publication date
JP4146495B1 (en) 2008-09-10
JP2008235845A (en) 2008-10-02
TWI442493B (en) 2014-06-21

Similar Documents

Publication Publication Date Title
KR100880462B1 (en) Probing apparatus and probing method
KR100909494B1 (en) Processing equipment
CN101071764B (en) Probing apparatus and probing method
JP4166813B2 (en) Inspection apparatus and inspection method
TW200807596A (en) Probing apparatus and probing method
TW200941001A (en) Probe apparatus, probing method, and storage medium
TW200830445A (en) Detecting device and detecting method
JP2003224177A (en) Centering apparatus and semiconductor manufacturing apparatus
CN110211889B (en) Inspection system
KR102465561B1 (en) Substrate misalignment detection method and substrate misalignment detection device
JP2008016676A (en) Probe card automatic exchanging mechanism and inspecting device
JP2001210700A (en) Method of detecting substrate and apparatus thereof
JP2009194046A (en) Substrate conveyor and method of correcting eccentricity of substrate
JP3845585B2 (en) Processing equipment
JP5384270B2 (en) loader
JP3365781B2 (en) Board appearance inspection device
KR20160114556A (en) Loader chamber with adapter unit
JP2862956B2 (en) Substrate transfer device
KR20230156413A (en) Processing device and location determination method
JP3200927U (en) Substrate transfer device
JP3414427B2 (en) Substrate transfer device and substrate inspection device
JPH01248632A (en) Measuring method
JPH0826413A (en) Conveying mechanism and conveying method of platelike object

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees