CN219348928U

CN219348928U - Chip test module

Info

Publication number: CN219348928U
Application number: CN202223503776.4U
Authority: CN
Inventors: 何润; 何志伟; 刘威
Original assignee: Suzhou Qianming Semiconductor Equipment Co ltd
Current assignee: Suzhou Qianming Semiconductor Equipment Co ltd
Priority date: 2022-12-26
Filing date: 2022-12-26
Publication date: 2023-07-14
Anticipated expiration: 2032-12-26

Abstract

The utility model discloses a chip testing module which comprises a testing tool, a testing heating assembly and a testing moving assembly, wherein the testing heating assembly comprises a heating mounting plate, a heat insulation plate and a heating plate body, a heating rod is arranged in the heating plate body, the heating plate body is connected with a floating pressing block, and the floating pressing block is positioned above the testing tool; the test moving assembly comprises a test mounting frame, a test lifting cylinder and a test horizontal cylinder, wherein a push rod of the test horizontal cylinder is connected with a horizontal moving plate, the test lifting cylinder is arranged on the horizontal moving plate, a push rod of the test lifting cylinder is connected with a lifting transmission arm, the lifting transmission arm is connected with a lifting moving plate, and the heating mounting plate is arranged on the lifting moving plate. When the test chip is pressed down for testing, the utility model has good synchronism, and the floating pressure head is in soft touch with the test chip under the action of the floating spring during testing, so that the test chip is prevented from shifting or damaging.

Description

Chip test module

Technical Field

The utility model relates to the technical field of chip testing, in particular to a chip testing module.

Background

The functional test item refers to the process of simulating various factors involved in the actual use condition of the product to perform corresponding condition reinforcing experiments on the condition of the product generating performance.

In general, electronic devices, whether original, parts, components, complete machines, etc., need to be tested. The testing is completed by manufacturers or first-class electronic appliance detection technology companies, and problems of products are found through testing and are timely modified, so that the problems of the products reaching the hands of consumers are reduced as much as possible or the reliability of the products is improved.

The traditional chip test is mainly to put a single chip into test equipment for testing by manpower, observe the test chip by human eyes and correspondingly record test results, classify the test chip, swing a tray and the like by manpower after the test is finished, and the production efficiency is low, so that the requirement of large-scale efficient production cannot be met.

The test equipment in the prior art has the following defects: when the test module is used for carrying out a downward-pressing test on the chip, the synchronicity of lifting cylinders on the left side and the right side is poor, and the lower pressure head and the chip are in hard touch during the test, so that the chip is easy to shift or damage.

Disclosure of Invention

Aiming at the defects of the prior art, the utility model aims to provide a chip testing module which has good synchronism when a test chip is pressed down, and a floating pressure head is in soft touch with the test chip under the action of a floating spring during testing, so that the test chip is prevented from being shifted or damaged.

In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows: the chip testing module comprises a testing tool, a testing heating assembly and a testing moving assembly, wherein the testing tool is used for loading a testing chip, the testing heating assembly is arranged at the upper position of the testing tool, and the testing moving assembly drives the testing heating assembly to press and heat the testing chip on the testing tool; the test heating assembly comprises a heating mounting plate, a heat insulation plate and a heating plate body which are sequentially arranged from top to bottom, a heating rod is arranged in the heating plate body, the bottom of the heating plate body is connected with a floating pressing block through a floating spring, and the floating pressing block is positioned above the test tool; the test moving assembly comprises a test mounting frame, a test lifting cylinder and a test horizontal cylinder, wherein the test horizontal cylinder is arranged on the test mounting frame, a push rod of the test horizontal cylinder is connected with a horizontal moving plate, a test horizontal sliding rail is arranged on the test mounting frame, the horizontal moving plate is arranged on the test horizontal sliding rail through a test horizontal sliding block, the test lifting cylinder is arranged on the horizontal moving plate, a push rod of the test lifting cylinder is connected with a lifting driving arm, a lifting track hole is formed in the lifting driving arm, the lifting driving arm is connected with a lifting moving plate, a lifting guide column is arranged on the lifting moving plate, the lifting guide column is arranged in the lifting track hole, a test lifting sliding rail is arranged on the horizontal moving plate, and the lifting moving plate is arranged on the test lifting sliding rail through a test lifting sliding block.

As a preferred scheme, the test fixture comprises a test bottom plate and a test plate, wherein the test plate is arranged on the test bottom plate, a plurality of test grooves for placing test chips are formed in the test plate, and test probes are arranged in the bottoms of the test grooves.

As a preferable scheme, the test fixture is also provided with a heating sensor.

As a preferable scheme, the heating plate body is also provided with a temperature sensor, the heating plate body is provided with an overload protector, and the temperature sensor and the overload protector are electrically connected with the heating rod.

As a preferable scheme, the lifting transmission arm comprises a transmission arm and two lifting arms, wherein the two lifting arms are respectively arranged at two ends of the transmission arm, the push rod of the test lifting cylinder is arranged at the center of the transmission arm, and the lifting track hole is formed in the lifting arm.

As a preferable scheme, the top of lifting arm is provided with the lift horizontal slide rail, it is provided with the lift horizontal slide block to go up the slip of lift horizontal slide rail, be connected with the lift mounting on the lift horizontal slide block, the lift mounting sets up on the horizontal migration board.

Compared with the prior art, the utility model has the beneficial effects that: when the test chip is pressed down for testing, the utility model has good synchronism, and the floating pressure head is in soft touch with the test chip under the action of the floating spring during testing, so that the test chip is prevented from shifting or damaging.

Drawings

FIG. 1 is a schematic view of the internal structure of the present utility model;

FIG. 2 is a schematic view of the back structure of the present utility model;

FIG. 3 is a schematic view of the structure of the test heating assembly of the present utility model;

wherein the accompanying figures identify a list: test fixture 1, test heating assembly 2, test moving assembly 3, heating mounting plate 4, heat insulating board 5, heating plate body 6, heating rod 7, floating spring 8, floating briquetting 9, test mounting bracket 10, test lift cylinder 11, test horizontal cylinder 12, horizontal moving plate 13, test horizontal slide rail 14, test horizontal slide block 15, lift driving arm 16, lift track hole 17, lift moving plate 18, lift guide post 19, test lift slide rail 20, test lift slide block 21, test bottom plate 22, test plate 23, test slot 24, heating sensor 25, temperature sensor 26, overload protector 27, driving arm 28, lift arm 29, lift horizontal slide rail 30, lift horizontal slide block 31, lift fixing piece 32, vertical driving piece 33.

Detailed Description

The utility model is further described below in connection with specific embodiments. The following examples are only for more clearly illustrating the technical aspects of the present utility model, and are not intended to limit the scope of the present utility model.

Examples:

as shown in fig. 1 to 3, a chip test module comprises a test fixture 1, a test heating assembly 2 and a test moving assembly 3, wherein the test fixture 1 is used for loading a test chip, the test heating assembly 2 is arranged at the upper position of the test fixture 1, and the test moving assembly 3 drives the test heating assembly 2 to press down and heat the test chip on the test fixture 1; the test heating assembly 2 comprises a heating mounting plate 4, a heat insulation plate 5 and a heating plate body 6 which are sequentially arranged from top to bottom, a heating rod 7 is arranged in the heating plate body 6, the bottom of the heating plate body 6 is connected with a floating pressing block 9 through a floating spring 8, and the floating pressing block 9 is positioned above the test tool 1; the test moving assembly 3 comprises a test mounting frame 10, a test lifting cylinder 11 and a test horizontal cylinder 12, wherein the test horizontal cylinder 12 is arranged on the test mounting frame 10, a push rod of the test horizontal cylinder 12 is connected with a horizontal moving plate 13, a test horizontal sliding rail 14 is arranged on the test mounting frame 10, the horizontal moving plate 13 is arranged on the test horizontal sliding rail 14 through a test horizontal sliding block 15, the test lifting cylinder 11 is arranged on the horizontal moving plate 13, a push rod of the test lifting cylinder 11 is connected with a lifting driving arm 16, a lifting track hole 17 is formed in the lifting driving arm 16, the lifting driving arm 16 is connected with a lifting moving plate 18, a lifting guide column 19 is arranged on the lifting moving plate 18, the lifting guide column 19 is arranged in the lifting track hole 17, a test lifting sliding rail 20 is arranged on the horizontal moving plate 13, the lifting moving plate 18 is arranged on the test lifting sliding rail 20 through a test lifting sliding block 21, and the heating mounting plate 4 is arranged on the lifting moving plate 18.

Preferably, the test fixture 1 includes a test base 22 and a test board 23, the test board 23 is disposed on the test base 22, a plurality of test slots 24 for placing test chips are formed in the test board 23, and test probes (not shown in the drawing) are disposed in the bottoms of the test slots 24.

More preferably, the test fixture 1 is further provided with a heating sensor 25.

Specifically, the heating sensor 25 is used to sense the position of the test chip in the test slot 24.

Preferably, a temperature sensor 26 is further disposed in the heating plate body 6, an overload protector 27 is disposed outside the heating plate body 6, and the temperature sensor 26 and the overload protector 27 are electrically connected with the heating rod 7.

Specifically, in this embodiment, the heating rod 7 can be heated to 150 ℃ at the highest, and when the temperature reaches the temperature set by the temperature sensor 26, the overload protector 27 automatically stops the heating rod 7 from heating.

Preferably, the lifting driving arm 16 includes a driving arm 28 and two lifting arms 29, the two lifting arms 29 are respectively disposed at two ends of the driving arm 28, the push rod of the test lifting cylinder 11 is disposed at the center of the driving arm 28, and the lifting track hole 17 is formed on the lifting arm 29.

More preferably, the top of the lifting arm 29 is provided with a lifting horizontal sliding rail 30, a lifting horizontal sliding block 31 is slidably arranged on the lifting horizontal sliding rail 30, a lifting fixing piece 32 is connected to the lifting horizontal sliding block 31, and the lifting fixing piece 32 is arranged on the horizontal moving plate 13.

Specifically, the horizontal test cylinder 12 is located at the center of the test mounting frame 10, the horizontal moving plate 13 is parallel to the test mounting frame 10, the push rod of the horizontal test cylinder 12 reciprocates in the horizontal direction, and the push rod of the horizontal test cylinder 12 is connected to the center of the horizontal moving plate 13 through the vertical transmission member 33.

More specifically, the test lifting cylinder 11 is located at the center of the horizontal moving plate 13, the push rod of the test lifting cylinder 11 reciprocates in the horizontal direction, and the push rod of the test lifting cylinder 11 is disposed at the center of the lifting transmission arm 16.

Further, the movement direction of the test horizontal sliding block 15 in the test horizontal sliding rail 14 is the same as the movement direction of the horizontal moving plate 13, and the movement direction of the test lifting sliding block 21 in the test lifting sliding rail 20 is the same as the movement direction of the lifting moving plate 18.

In implementation, a test chip is placed in the test slot 24, when the heating sensor 25 senses that the test chip is in the test slot 24, the test moving assembly 3 drives the floating pressing block 9 to move to a position above the test chip, and the test moving assembly 3 drives the floating pressing block 9 to move downwards to press the test chip into close contact with the test probe, so that the test chip is tested.

The foregoing is merely a preferred embodiment of the present utility model, and it should be noted that modifications and variations could be made by those skilled in the art without departing from the technical principles of the present utility model, and such modifications and variations should also be regarded as being within the scope of the utility model.

Claims

1. The utility model provides a chip test module which characterized in that: the test fixture is used for loading test chips, the test heating assembly is arranged at the upper position of the test fixture, and the test moving assembly drives the test heating assembly to press down and heat the test chips on the test fixture; the test heating assembly comprises a heating mounting plate, a heat insulation plate and a heating plate body which are sequentially arranged from top to bottom, a heating rod is arranged in the heating plate body, the bottom of the heating plate body is connected with a floating pressing block through a floating spring, and the floating pressing block is positioned above the test tool; the test moving assembly comprises a test mounting frame, a test lifting cylinder and a test horizontal cylinder, wherein the test horizontal cylinder is arranged on the test mounting frame, a push rod of the test horizontal cylinder is connected with a horizontal moving plate, a test horizontal sliding rail is arranged on the test mounting frame, the horizontal moving plate is arranged on the test horizontal sliding rail through a test horizontal sliding block, the test lifting cylinder is arranged on the horizontal moving plate, a push rod of the test lifting cylinder is connected with a lifting driving arm, a lifting track hole is formed in the lifting driving arm, the lifting driving arm is connected with a lifting moving plate, a lifting guide column is arranged on the lifting moving plate, the lifting guide column is arranged in the lifting track hole, a test lifting sliding rail is arranged on the horizontal moving plate, and the lifting moving plate is arranged on the test lifting sliding rail through a test lifting sliding block.

2. The chip test module of claim 1, wherein: the test fixture comprises a test bottom plate and a test plate, wherein the test plate is arranged on the test bottom plate, a plurality of test grooves for placing test chips are formed in the test plate, and test probes are arranged in the bottoms of the test grooves.

3. The chip test module of claim 1, wherein: and a heating sensor is further arranged on the test tool.

4. The chip test module of claim 1, wherein: the heating plate is characterized in that a temperature sensor is further arranged in the heating plate body, an overload protector is arranged outside the heating plate body, and the temperature sensor, the overload protector and the heating rod are electrically connected.

5. The chip test module of claim 1, wherein: the lifting transmission arm comprises a transmission arm and two lifting arms, the two lifting arms are respectively arranged at two ends of the transmission arm, the push rod of the test lifting cylinder is arranged at the center of the transmission arm, and the lifting track hole is formed in the lifting arm.

6. The chip testing module according to claim 5, wherein: the top of lifting arm is provided with the lift horizontal slide rail, it is provided with the lift horizontal slide block to go up the slip of lift horizontal slide rail, be connected with the lift mounting on the lift horizontal slide block, the lift mounting sets up on the horizontal migration board.