CN112881898A - High-temperature aging test device for integrated circuit - Google Patents
High-temperature aging test device for integrated circuit Download PDFInfo
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- CN112881898A CN112881898A CN202110202345.5A CN202110202345A CN112881898A CN 112881898 A CN112881898 A CN 112881898A CN 202110202345 A CN202110202345 A CN 202110202345A CN 112881898 A CN112881898 A CN 112881898A
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- 230000032683 aging Effects 0.000 title claims abstract description 99
- 238000012360 testing method Methods 0.000 title claims abstract description 31
- 238000010438 heat treatment Methods 0.000 claims description 24
- 239000011229 interlayer Substances 0.000 claims description 16
- 235000017166 Bambusa arundinacea Nutrition 0.000 claims description 8
- 235000017491 Bambusa tulda Nutrition 0.000 claims description 8
- 241001330002 Bambuseae Species 0.000 claims description 8
- 235000015334 Phyllostachys viridis Nutrition 0.000 claims description 8
- 239000011425 bamboo Substances 0.000 claims description 8
- 238000012544 monitoring process Methods 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 6
- 239000010410 layer Substances 0.000 claims description 5
- 210000002421 cell wall Anatomy 0.000 claims description 2
- 238000009413 insulation Methods 0.000 claims description 2
- 238000001514 detection method Methods 0.000 abstract description 14
- 230000002349 favourable effect Effects 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 6
- 239000002184 metal Substances 0.000 description 5
- 238000009434 installation Methods 0.000 description 4
- 210000001503 joint Anatomy 0.000 description 4
- 230000002633 protecting effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000011056 performance test Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 230000001174 ascending effect Effects 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 210000003781 tooth socket Anatomy 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2881—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to environmental aspects other than temperature, e.g. humidity or vibrations
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- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention discloses an integrated circuit high-temperature aging test device which comprises a box body and an aging mother board positioned in the box body, wherein an aging daughter board is arranged on the aging mother board through a station slot part, and a fixed block penetrates through one side of a sliding sleeve and is inserted into the supporting rod. The device backup pad drives sliding sleeve and locating piece and resets, make the locating piece to the chip body, compress tightly the location between ageing daughter board and the ageing mother board, be favorable to guaranteeing detection efficiency, the simple operation, it is nimble to use, it is stupefied through the rubber tooth, the cooperation of location tooth's socket and magnet piece, make the firm grafting of fixed block on the bracing piece, thereby realize the effective spacing fixed to sliding sleeve and the flexible shift position of locating piece, make the locating piece location accurate, the effect steadiness of compressing tightly is high, the simple operation, time saving and labor saving, make stability when detecting high, effectively avoided because the bad error phenomenon that leads to of contact, thereby detection precision and quality have further been improved.
Description
Technical Field
The invention belongs to the technical field of integrated circuit chip testing, and particularly relates to a high-temperature aging testing device for an integrated circuit.
Background
Before the integrated circuit chips are produced in batches, the integrated circuit chips are generally subjected to an aging test (to ensure the service life and reliability of the chips) and a performance test (to test the functions and performance of the chips in batches), and the integrated circuit chips passing the aging test and the performance test can be defined as good products. The traditional burn-in test board is usually a multi-station burn-in PCB with at least 77 stations, a special chip socket is arranged on each station, pins of chips to be tested are led into the burn-in PCB, and a plurality of chips to be tested are subjected to high-temperature high-voltage electrification burn-in tests. However, the types of the chips to be tested are various, and the packaging types and the arrangement of the pins are different, so different burn-in boards need to be customized for different types of chips to be tested, the design and manufacturing costs of the burn-in boards are high, the test period is prolonged, and the test efficiency is reduced.
Therefore, the publication No. CN106771987A discloses an integrated circuit chip aging test device and a test method based on a mother-daughter board, wherein the device comprises a universal aging mother board and a plurality of aging daughter boards; the universal aging mother board is provided with a plurality of stations, and a plurality of spring pins which are arranged in an array are arranged on the stations; the aging daughter board can be arranged on a station of the universal aging mother board, and the front surface of the aging daughter board is provided with a chip mounting part and integrated with a peripheral application circuit; the back surface of the aging daughter board is provided with a plurality of metal contacts which are arranged in an array manner, wherein one part of the metal contacts is connected with pins of the chip to be tested, and the other part of the metal contacts is connected with a peripheral application circuit; the contact pin on the station is matched with and contacts with the metal contact on the back of the aging daughter board, so that the aging daughter board is connected to the universal aging mother board; a test method is also provided.
The following disadvantages still remain: the device is only to the chip that awaits measuring through station and chip mounting groove, connect the location between ageing mother board and the ageing daughter board, and go into the ageing test board and carry out the high temperature and high humidity dynamic ageing test, it is not convenient for await measuring the chip, the stable connection between ageing mother board and the ageing daughter board, then make the inseparable steadiness of connection structure poor between it easily, thereby make and very easily lead to the chip pin bad contact phenomenon that awaits measuring, and then influence measuring precision and efficiency, and the installation of the chip that awaits measuring at every turn, all need with chip pin and peripheral application circuit respectively with corresponding metal contact electric connection, it is loaded down with trivial details relatively.
Disclosure of Invention
The present invention is directed to a high temperature burn-in tester for integrated circuits, which solves the above problems.
In order to achieve the purpose, the invention provides the following technical scheme: an integrated circuit high-temperature aging testing device comprises a box body and an aging mother board positioned in the box body, wherein an aging daughter board is installed on the aging mother board through a station groove part, a chip body is installed on the aging daughter board through an installation groove part, supporting blocks are fixedly connected to two sides of the aging mother board, supporting rods are fixedly connected to the supporting blocks, a supporting plate is arranged between the supporting rods, a positioning rod is fixedly connected to the supporting plate, a positioning block is connected to the lower end of the positioning rod in a threaded mode, and an anti-skid rubber pad is fixedly sleeved on the positioning block; the locating piece corresponds the butt at the top of chip body, the equal fixedly connected with sliding sleeve in both ends of backup pad, the sliding sleeve slides and cup joints on the bracing piece, fixedly connected with supports a section of thick bamboo on the lateral wall of sliding sleeve, the inside of supporting a section of thick bamboo runs through the sliding connection and has the dead lever, the one end fixedly connected with fixed block of dead lever, the fixed block runs through one side of sliding sleeve and pegs graft to the inside of bracing piece on.
Preferably, a first interlayer is arranged in the box body, heating pipes with hollow structures are arranged in the first interlayer, the diameters of the heating pipes are 3-5mm, the distance between the heating pipes is 3-5mm, and a heat insulation layer is arranged on the outer side of the first interlayer.
This setting is convenient for carry out the spacing fixed of butt between chip body, ageing daughter board and the ageing mother board through the locating piece, thereby is convenient for realize the zonulae occludens between chip body, ageing daughter board and the ageing mother board, and stability is high when making the detection, has effectively avoided the error phenomenon because contact failure leads to, thereby is favorable to improving detection precision and quality, has effectively avoided the wearing and tearing phenomenon of locating piece to the chip through the antiskid cushion, and the protecting effect is good.
Preferably, the top of bracing piece fixedly connected with baffle, fixedly connected with spring between baffle and the sliding sleeve, the spring housing is established on the bracing piece.
This setting has effectively improved connection structure's steadiness between sliding sleeve and the bracing piece, and the sliding sleeve of being convenient for drives backup pad and locating piece and carries out concertina movement, and the stationarity is high to be convenient for drive the locating piece and compress tightly the location between chip body, ageing daughter board and the ageing mother board, be favorable to guaranteeing detection efficiency, the simple operation, it is nimble to use.
Preferably, the other end of the fixing rod is fixedly connected with a stop block, one side of the stop block abuts against the end face of the supporting cylinder, and the other side of the stop block is fixedly connected with a handle.
This setting is convenient for pull the dead lever and is driven the fixed block and insert or take out from the bracing piece, and the fixed block of being convenient for when inserting carries out spacing fixed to the shift position of sliding sleeve and locating piece, takes out from the time, makes things convenient for the sliding sleeve to drive the locating piece and carries out the regulation of concertina movement, and the simple operation, labour saving and time saving.
Preferably, the lateral wall of the supporting rod is provided with fixing grooves which are uniformly distributed, and the fixing grooves are in sliding connection with the fixing blocks in a matched mode.
When the fixed block is inserted into the fixed grooves at different positions, the sliding sleeves which are telescopically moved to different positions can be limited and fixed, the use is flexible, so that the positioning blocks can be conveniently pressed and fixed on chip bodies with different sizes, and the application range is wide.
Preferably, fixedly connected with rubber tooth is stupefied on the cell wall of fixed slot, be equipped with the location tooth's socket on the lateral wall of fixed block, location tooth's socket and the stupefied looks accordant connection of rubber tooth, equal fixedly connected with magnet piece on the corresponding terminal surface between fixed slot and the fixed block, adsorb fixedly each other between the magnet piece.
When this set up the fixed block and insert in the constant head tank, can drive the location tooth's socket and peg graft to on the rubber tooth is stupefied, until the fixed block passes through the magnet piece absorption to be fixed on the fixed slot to connection structure's steadiness, fastness between fixed block and the fixed slot have been improved greatly, make the locating piece pinpoint the steadiness height.
Preferably, the middle part of the sliding sleeve is provided with a sliding hole, and the sliding hole is in sliding connection with the supporting rod in a matching manner.
This setting has effectively improved connection structure's between sliding sleeve and the bracing piece stability.
Preferably, the inner wall of the end part of the supporting cylinder corresponding to the fixing block is fixedly connected with a rubber cushion block.
When this set up pulling fixed block and break away from the bracing piece, in pulling the handle makes dead lever pulling fixed block break away from the fixed slot and get into a supporting cylinder promptly to drive the fixed block butt to the rubber pad on, be convenient for through the rubber pad cushion the pulling force of fixed block this moment, effectively avoided the fixed block striking supporting cylinder and the wearing and tearing phenomenon that causes, the protecting effect is good, is favorable to guaranteeing fixed block mobility stability.
Preferably, a second interlayer is arranged in the aging daughter board, a plurality of grooves communicated with the second interlayer are formed in the top end of the aging daughter board, a contact element which is butted with the chip body and connected in a manner of being capable of ascending and descending is arranged in each groove, and each contact element can be independently butted with a power supply; and the top end of the contact element is provided with a sealing plate which is matched with the groove and can move left and right.
Preferably, the intelligent recognition control system further comprises:
a controller;
the chip body matching module is used for scanning and acquiring the model, shape and size information of the chip body, generating a layout diagram of the top end of the aging daughter board after being unfolded corresponding to the sealing plate according to the information, and transmitting the layout diagram to the controller so as to control the movement of the corresponding sealing plate through the controller;
the temperature control module is used for controlling the heating temperature of the heating pipe;
and the performance monitoring module is used for monitoring and recording the working performance of the chip body at different set high temperatures and transmitting the working performance to the controller.
Compared with the prior art, the invention has the technical effects and advantages that: according to the integrated circuit high-temperature aging test device, a chip body to be tested is mounted on an aging daughter board, the aging daughter board is mounted on an aging mother board, the universal aging mother board is connected with an aging test machine table, an aging driving signal of the aging test machine table is introduced through the aging daughter board, a high-temperature high-humidity dynamic aging test is carried out, the mounting connection and detection principle is the prior art, and the description is omitted; before the test work begins, the supporting plate is held by hand to be extracted upwards, namely, the positioning block and the sliding sleeve are driven to move upwards along the supporting rod, and the spring is extruded, after the chip body is installed on the aging daughter board, the supporting plate is loosened to drive the sliding sleeve and the positioning block to reset, so that the positioning block can be tightly pressed and positioned among the chip body, the aging daughter board and the aging mother board, the detection efficiency is favorably ensured, the operation is convenient and fast, the use is flexible, then the fixing rod is pushed to drive the fixing block to be inserted into the corresponding fixing groove on the supporting rod, at the moment, the fixing block is stably inserted on the supporting rod through the matching action of the rubber tooth ridges, the positioning tooth grooves and the magnetic sheets, the effective limiting and fixing of the telescopic moving positions of the sliding sleeve and the positioning block are realized, the positioning block is accurately positioned, the pressing effect stability, the error phenomenon caused by poor contact is effectively avoided, and the detection precision and quality are further improved.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is an enlarged schematic view of the structure at A in FIG. 1 according to the present invention;
FIG. 3 is a schematic perspective view of the sliding sleeve of the present invention;
FIG. 4 is a side view of the supporting rod of the present invention;
FIG. 5 is a partial cross-sectional view of the case of the present invention;
FIG. 6 is a top view of the burn-in daughter board of the present invention;
FIG. 7 is a partial schematic diagram of a burn-in daughter board according to the present invention.
In the figure: 100. a box body; 110. heating a tube; 111. a heat-insulating layer; 1. aging the mother board; 101. a station groove part; 2. aging the daughter board; 201. an installation groove part; 202. a groove; 203. a contact member; 204. closing the plate; 3. a chip body; 4. a support block; 5. a support bar; 501. a baffle plate; 502. a spring; 503. fixing grooves; 504. rubber tooth ridges; 6. a support plate; 601. positioning a rod; 602. positioning blocks; 603. an anti-slip rubber pad; 7. a sliding sleeve; 701. a slide hole; 8. a support cylinder; 801. a rubber cushion block; 9. fixing the rod; 901. a stopper; 902. a handle; 903. a fixed block; 904. positioning the tooth socket; 10. and a magnet piece.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1-4, an integrated circuit high-temperature aging test device includes an aging motherboard 1, an aging daughter board 2 is mounted on the aging motherboard 1 through a station slot portion 101, a chip body 3 is mounted on the aging daughter board 2 through a mounting slot portion 201, supporting blocks 4 are fixedly connected to both sides of the aging motherboard 1, supporting rods 5 are fixedly connected to the supporting blocks 4, supporting plates 6 are disposed between the supporting rods 5, positioning rods 601 are fixedly connected to the supporting plates 6, lower ends of the positioning rods 601 are connected with positioning blocks 602 in a threaded manner, and anti-skid rubber pads 603 are fixedly sleeved on the positioning blocks 602; the locating piece 602 corresponds the butt at the top of chip body 3, the equal fixedly connected with sliding sleeve 7 in both ends of backup pad 6, sliding sleeve 7 slides and cup joints on bracing piece 5, fixedly connected with supports a section of thick bamboo 8 on sliding sleeve 7's the lateral wall, the inside of supporting a section of thick bamboo 8 is run through the sliding connection and is had dead lever 9, the one end fixedly connected with fixed block 903 of dead lever 9, fixed block 903 runs through one side of sliding sleeve 7 and pegs graft to bracing piece 5 on the inside.
As shown in fig. 5, a first interlayer is disposed in the box body 100100, a heating pipe 110110 having a hollow structure is disposed in the first interlayer, the diameter of the heating pipe 110110 is 3-5mm, the distance between the heating pipes 110110 is 3-5mm, and an insulating layer 111111 is disposed outside the first interlayer. Heating pipes 110 are arranged in the first interlayer of the box body 100, and a heating layer is formed by a plurality of groups of heating pipes 110 so as to set the high temperature in the box body 100; the diameter of the heating pipes 110 and the distance between the heating pipes 110 enable the temperature in the box body 100 to be controlled more effectively, the heating pipes 110 are smaller in diameter, the effect of rapid temperature rise can be achieved, the box body 100 can reach a set high temperature stably in a short time, and the aging test efficiency is improved.
Be convenient for to chip body 3 through locating piece 602, carry out the spacing fixed of butt between ageing daughter board 2 and the ageing mother board 1, thereby be convenient for realize chip body 3, zonulae occludens between ageing daughter board 2 and the ageing mother board 1, stability is high when making the detection, effectively avoided because the error phenomenon that contact failure leads to, thereby be favorable to improving detection precision and quality, effectively avoided the wearing and tearing phenomenon of locating piece 602 to the chip through anti-skidding cushion 603, the protecting effect is good.
A baffle 501 is fixedly connected to the top of the support rod 5, a spring 502 is fixedly connected between the baffle 501 and the sliding sleeve 7, and the spring 502 is sleeved on the support rod 5; effectively improved connection structure's steadiness between sliding sleeve 7 and the bracing piece 5, the sliding sleeve 7 of being convenient for drives backup pad 6 and locating piece 602 and carries out the concertina movement, and the stationarity is high to be convenient for drive locating piece 602 and compress tightly the location to between chip body 3, ageing daughter board 2 and the ageing mother board 1, be favorable to guaranteeing detection efficiency, the simple operation, it is nimble to use.
The other end of the fixed rod 9 is fixedly connected with a stopper 901, one side of the stopper 901 abuts against the end surface of the support cylinder 8, and the other side of the stopper 901 is fixedly connected with a handle 902; be convenient for spur dead lever 9 and drive fixed block 903 and insert or take out from bracing piece 5, be convenient for fixed block 903 to carry out spacing fixed to the shift position of sliding sleeve 7 and locating piece 602 when inserting, take out from the time, make things convenient for sliding sleeve 7 to drive locating piece 602 and carry out the removal regulation of stretching out and drawing back, the simple operation, labour saving and time saving.
Fixing grooves 503 which are uniformly distributed are formed in the side wall of the supporting rod 5, and the fixing grooves 503 are matched with the fixing blocks 903 and are in sliding connection; when the fixing block 903 is inserted into the fixing grooves 503 at different positions, the sliding sleeve 7 which is telescopically moved to different positions can be limited and fixed, so that the use is flexible, the positioning block 602 can conveniently compress and fix the chip bodies 3 with different sizes, and the application range is wide.
A sliding hole 701 is formed in the middle of the sliding sleeve 7, and the sliding hole 701 is matched with and slidably connected with the supporting rod 5; effectively improving the stability of the connecting structure between the sliding sleeve 7 and the supporting rod 5.
A rubber cushion block 801 is fixedly connected to the inner wall of the end part of the supporting cylinder 8 corresponding to the fixing block 903; when pulling fixed block 903 breaks away from bracing piece 5, pulling handle 902 makes dead lever 9 pulling fixed block 903 break away from fixed slot 503 and enter into and support a section of thick bamboo 8 promptly to drive fixed block 903 butt to rubber pad 801 on, be convenient for cushion the pulling force of fixed block 903 through rubber pad 801 this moment, effectively avoided fixed block 903 striking to support a section of thick bamboo 8 and the wearing and tearing phenomenon that causes, the protecting effect is good, is favorable to guaranteeing fixed block 903 mobility stability.
Specifically, when the device is used, the chip body 3 to be tested is mounted on the aging daughter board 2, the aging daughter board 2 is mounted on the aging mother board 1, the universal aging mother board 1 is connected with an aging test machine table, so that an aging driving signal of the aging test machine table is introduced through the aging daughter board 2 to perform a high-temperature high-humidity dynamic aging test, the mounting connection and detection principle is the prior art, and details are not repeated herein; before the test operation starts, the supporting plate 6 is held by hand to be extracted upwards, namely the positioning block 602 and the sliding sleeve 7 are driven to move upwards along the supporting rod 5, and the spring 502 is extruded, after the chip body 3 is installed on the aging daughter board 2, the supporting plate 6 is loosened to drive the sliding sleeve 7 and the positioning block 602 to reset, so that the positioning block 602 compresses and positions the chip body 3, the aging daughter board 2 and the aging mother board 1, which is beneficial to ensuring the detection efficiency, convenient and fast operation and flexible use, then the fixing rod 9 is pushed to drive the fixing block 903 to be inserted into the corresponding fixing groove 503 on the supporting rod 5, at the moment, the fixing block 903 is stably inserted on the supporting rod 5 through the matching effect of the rubber tooth ridge 504, the positioning tooth groove 904 and the magnetic sheet, thereby realizing the effective limiting and fixing of the telescopic moving positions of the sliding sleeve 7 and the positioning block 602, and ensuring, the compressing effect steadiness is high, the simple operation, and labour saving and time saving for stability is high when detecting, has effectively avoided because the error phenomenon that contact failure leads to, thereby has further improved detection precision and quality.
As shown in fig. 6-7, a second interlayer is disposed inside the aging daughter board 2, a plurality of grooves 202 communicated with the second interlayer are disposed at the top end of the aging daughter board 2, each groove 202 is internally provided with a contact 203 which is butted with the chip body 3 and is connected in a manner of being capable of ascending and descending, and each contact 203 can be butted with a power supply independently; the top end of the contact 203 is provided with a closing plate which is matched with the groove 202 and can move left and right.
Still include intelligent recognition control system, it includes:
a controller;
the chip body 3 matching module is used for scanning and acquiring the model, shape and size information of the chip body 3, generating a layout after the top end of the aging daughter board 2 is unfolded corresponding to the seal board according to the information, and transmitting the layout to the controller so as to control the movement of the corresponding seal board through the controller;
the temperature control module is used for controlling the heating temperature of the heating pipe;
and the performance monitoring module is used for monitoring and recording the working performance of the chip body 3 at different set high temperatures and transmitting the working performance to the controller.
It is specific, place chip body 3 before ageing daughter board 2, scan earlier through chip body 3 matching module and acquire the model of this chip body 3 itself, the shape, information such as size, thereby the tie point of contact when judging chip body 3 installation and ageing daughter board 2 that can be more accurate, and then place corresponding hookup location of being connected on ageing daughter board 2 according to chip body 3, the shrouding of should opening that will correspond is opened, contact 203 with this chip body 3 rises to the contact, with the direct butt joint of chip body 3, thereby avoided placing the external trouble of chip at every turn, corresponding contact 203 of direct control is connected with this chip body 3. And the corresponding contact 203 can be controlled to be connected with the chip body 3 according to different types of the chip body 3, and the non-connection contact 203 is sealed by a sealing plate for dust prevention. The position of the groove on the aging daughter board is set according to the position of the chip body connection in the prior art. The chip body is in contact butt joint with the contact piece and is communicated with a power supply to form an integral test circuit.
The heating of the heating pipe 110 is controlled by the temperature control module so that the temperature in the box body is at a set temperature, which is convenient for controlling the temperature in the box body; carry out performance test to chip body 3 through performance monitoring module, set up under different temperatures, this chip body 3's performance to the record is preserved, and the later stage direct call of being convenient for reads, has avoided artifical record to set for the trouble of test, makes the testing process more comprehensive accurate.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (10)
1. An integrated circuit high-temperature aging test device comprises a box body (100) and an aging motherboard (1) positioned in the box body (100), and is characterized in that: an aging daughter board (2) is mounted on the aging mother board (1) through a station slot part (101), a chip body (3) is mounted on the aging daughter board (2) through a mounting slot part (201), supporting blocks (4) are fixedly connected to two sides of the aging mother board (1), supporting rods (5) are fixedly connected to the supporting blocks (4), supporting plates (6) are arranged between the supporting rods (5), positioning rods (601) are fixedly connected to the supporting plates (6), positioning blocks (602) are connected to the lower ends of the positioning rods (601) in a threaded mode, and anti-skid rubber pads (603) are fixedly sleeved on the positioning blocks (602); locating piece (602) correspond the butt at the top of chip body (3), the equal fixedly connected with sliding sleeve (7) in both ends of backup pad (6), sliding sleeve (7) slide and cup joint on bracing piece (5), fixedly connected with supports a section of thick bamboo (8) on the lateral wall of sliding sleeve (7), the inside of supporting a section of thick bamboo (8) is run through the cunning and is connect has dead lever (9), the one end fixedly connected with fixed block (903) of dead lever (9), one side that fixed block (903) run through sliding sleeve (7) is pegged graft to the inside of bracing piece (5) on.
2. The apparatus of claim 1, wherein: a first interlayer is arranged in the box body (100), a heating pipe (110) with a hollow structure is arranged in the first interlayer, the diameter of the heating pipe (110) is 3-5mm, the distance between the heating pipes (110) is 3-5mm, and a heat insulation layer (111) is arranged on the outer side of the first interlayer.
3. The apparatus of claim 1, wherein: the top fixedly connected with baffle (501) of bracing piece (5), fixedly connected with spring (502) between baffle (501) and sliding sleeve (7), spring (502) cover is established on bracing piece (5).
4. The apparatus of claim 1, wherein: the other end of the fixing rod (9) is fixedly connected with a stop block (901), one side of the stop block (901) abuts against the end face of the supporting barrel (8), and the other side of the stop block (901) is fixedly connected with a handle (902).
5. The apparatus of claim 1, wherein: the side wall of the supporting rod (5) is provided with fixing grooves (503) which are uniformly distributed, and the fixing grooves (503) are in sliding connection with the fixing blocks (903) in a matching mode.
6. The apparatus of claim 5, wherein: stupefied (504) of fixedly connected with rubber tooth on the cell wall of fixed slot (503), be equipped with location tooth's socket (904) on the lateral wall of fixed block (903), location tooth's socket (904) and the stupefied (504) looks accordant connection of rubber tooth, equal fixedly connected with magnet piece (10) on the corresponding terminal surface between fixed slot (503) and fixed block (903), adsorb each other fixedly between magnet piece (10).
7. The apparatus of claim 1, wherein: the middle part of the sliding sleeve (7) is provided with a sliding hole (701), and the sliding hole (701) is connected with the supporting rod (5) in a sliding mode in a matching mode.
8. The apparatus of claim 1, wherein: and a rubber cushion block (801) is fixedly connected to the inner wall of the end part of the supporting cylinder (8) corresponding to the fixing block (903).
9. The apparatus of claim 2, wherein:
a second interlayer is arranged in the aging daughter board (2), a plurality of grooves (202) communicated with the second interlayer are formed in the top end of the aging daughter board (2), a contact element (203) which is butted with the chip body (3) and connected in a way of lifting up and down is arranged in each groove (202), and each contact element (203) can be butted with a power supply independently; the top end of the contact piece (203) is provided with a closing plate (204) which is matched with the groove (202) and can move left and right.
10. The apparatus of claim 9, wherein: still include intelligent recognition control system, it includes:
a controller;
the chip body matching module is used for scanning and acquiring the model, shape and size information of the chip body (3), generating a layout after the top end of the aging daughter board (2) is unfolded corresponding to the sealing board (204) according to the information, and transmitting the layout to the controller so as to control the movement of the corresponding sealing board (204) through the controller;
the temperature control module is used for controlling the heating temperature of the heating pipe (110);
and the performance monitoring module is used for monitoring and recording the working performance of the chip body (3) at different set high temperatures and transmitting the working performance to the controller.
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Cited By (1)
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| CN113514756A (en) * | 2021-06-23 | 2021-10-19 | 江苏七维测试技术有限公司 | High-speed DSP high-temperature dynamic aging device with high heat dissipation |
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Application publication date: 20210601 |