TWI561836B - - Google Patents
Info
- Publication number
- TWI561836B TWI561836B TW105119955A TW105119955A TWI561836B TW I561836 B TWI561836 B TW I561836B TW 105119955 A TW105119955 A TW 105119955A TW 105119955 A TW105119955 A TW 105119955A TW I561836 B TWI561836 B TW I561836B
- Authority
- TW
- Taiwan
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW105119955A TW201809697A (en) | 2016-06-24 | 2016-06-24 | Temperature control device for press-bonding unit of electronic component and testing device using the same capable of keeping the temperature difference between primary and secondary effect surfaces of a cooling chip within a better range |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW105119955A TW201809697A (en) | 2016-06-24 | 2016-06-24 | Temperature control device for press-bonding unit of electronic component and testing device using the same capable of keeping the temperature difference between primary and secondary effect surfaces of a cooling chip within a better range |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI561836B true TWI561836B (en) | 2016-12-11 |
TW201809697A TW201809697A (en) | 2018-03-16 |
Family
ID=58227294
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105119955A TW201809697A (en) | 2016-06-24 | 2016-06-24 | Temperature control device for press-bonding unit of electronic component and testing device using the same capable of keeping the temperature difference between primary and secondary effect surfaces of a cooling chip within a better range |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW201809697A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI641842B (en) * | 2017-08-14 | 2018-11-21 | 鴻勁精密股份有限公司 | Crimp of electronic component crimping mechanism and test classification device |
CN109116879A (en) * | 2018-10-19 | 2019-01-01 | 苏州华兴源创科技股份有限公司 | A kind of temperature controller |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI779622B (en) * | 2021-05-21 | 2022-10-01 | 謝德風 | Test device for pre-burning and pre-cooling |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201007721Y (en) * | 2006-12-27 | 2008-01-16 | 中茂电子(深圳)有限公司 | Semiconductor component testing table with ventiduct cooling device |
TW201219802A (en) * | 2010-11-05 | 2012-05-16 | Hon Tech Inc | providing heat conduction mechanism for full-scale cold/heat exchange to greatly enhance cooling performance during testing and ensure testing quality |
TW201346293A (en) * | 2012-05-11 | 2013-11-16 | Hon Tech Inc | Electric component press bonding device, testing equipment applying the same and press bonding control method |
TW201423899A (en) * | 2012-12-14 | 2014-06-16 | Hon Tech Inc | Electric component pressing mechanism and testing facility applying the same |
TW201530161A (en) * | 2014-01-28 | 2015-08-01 | Hon Tech Inc | Electronic component testing equipment |
TW201614249A (en) * | 2014-10-14 | 2016-04-16 | Hon Tech Inc | Electronic component testing apparatus and test equipment using the same |
-
2016
- 2016-06-24 TW TW105119955A patent/TW201809697A/en unknown
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201007721Y (en) * | 2006-12-27 | 2008-01-16 | 中茂电子(深圳)有限公司 | Semiconductor component testing table with ventiduct cooling device |
TW201219802A (en) * | 2010-11-05 | 2012-05-16 | Hon Tech Inc | providing heat conduction mechanism for full-scale cold/heat exchange to greatly enhance cooling performance during testing and ensure testing quality |
TW201346293A (en) * | 2012-05-11 | 2013-11-16 | Hon Tech Inc | Electric component press bonding device, testing equipment applying the same and press bonding control method |
TW201423899A (en) * | 2012-12-14 | 2014-06-16 | Hon Tech Inc | Electric component pressing mechanism and testing facility applying the same |
TW201530161A (en) * | 2014-01-28 | 2015-08-01 | Hon Tech Inc | Electronic component testing equipment |
TW201614249A (en) * | 2014-10-14 | 2016-04-16 | Hon Tech Inc | Electronic component testing apparatus and test equipment using the same |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI641842B (en) * | 2017-08-14 | 2018-11-21 | 鴻勁精密股份有限公司 | Crimp of electronic component crimping mechanism and test classification device |
CN109116879A (en) * | 2018-10-19 | 2019-01-01 | 苏州华兴源创科技股份有限公司 | A kind of temperature controller |
Also Published As
Publication number | Publication date |
---|---|
TW201809697A (en) | 2018-03-16 |