TWI561836B - - Google Patents

Info

Publication number
TWI561836B
TWI561836B TW105119955A TW105119955A TWI561836B TW I561836 B TWI561836 B TW I561836B TW 105119955 A TW105119955 A TW 105119955A TW 105119955 A TW105119955 A TW 105119955A TW I561836 B TWI561836 B TW I561836B
Authority
TW
Taiwan
Application number
TW105119955A
Other languages
Chinese (zh)
Other versions
TW201809697A (en
Inventor
zi-wei Li
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW105119955A priority Critical patent/TW201809697A/en
Application granted granted Critical
Publication of TWI561836B publication Critical patent/TWI561836B/zh
Publication of TW201809697A publication Critical patent/TW201809697A/en

Links

TW105119955A 2016-06-24 2016-06-24 Temperature control device for press-bonding unit of electronic component and testing device using the same capable of keeping the temperature difference between primary and secondary effect surfaces of a cooling chip within a better range TW201809697A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW105119955A TW201809697A (en) 2016-06-24 2016-06-24 Temperature control device for press-bonding unit of electronic component and testing device using the same capable of keeping the temperature difference between primary and secondary effect surfaces of a cooling chip within a better range

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW105119955A TW201809697A (en) 2016-06-24 2016-06-24 Temperature control device for press-bonding unit of electronic component and testing device using the same capable of keeping the temperature difference between primary and secondary effect surfaces of a cooling chip within a better range

Publications (2)

Publication Number Publication Date
TWI561836B true TWI561836B (en) 2016-12-11
TW201809697A TW201809697A (en) 2018-03-16

Family

ID=58227294

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105119955A TW201809697A (en) 2016-06-24 2016-06-24 Temperature control device for press-bonding unit of electronic component and testing device using the same capable of keeping the temperature difference between primary and secondary effect surfaces of a cooling chip within a better range

Country Status (1)

Country Link
TW (1) TW201809697A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI641842B (en) * 2017-08-14 2018-11-21 鴻勁精密股份有限公司 Crimp of electronic component crimping mechanism and test classification device
CN109116879A (en) * 2018-10-19 2019-01-01 苏州华兴源创科技股份有限公司 A kind of temperature controller

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI779622B (en) * 2021-05-21 2022-10-01 謝德風 Test device for pre-burning and pre-cooling

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201007721Y (en) * 2006-12-27 2008-01-16 中茂电子(深圳)有限公司 Semiconductor component testing table with ventiduct cooling device
TW201219802A (en) * 2010-11-05 2012-05-16 Hon Tech Inc providing heat conduction mechanism for full-scale cold/heat exchange to greatly enhance cooling performance during testing and ensure testing quality
TW201346293A (en) * 2012-05-11 2013-11-16 Hon Tech Inc Electric component press bonding device, testing equipment applying the same and press bonding control method
TW201423899A (en) * 2012-12-14 2014-06-16 Hon Tech Inc Electric component pressing mechanism and testing facility applying the same
TW201530161A (en) * 2014-01-28 2015-08-01 Hon Tech Inc Electronic component testing equipment
TW201614249A (en) * 2014-10-14 2016-04-16 Hon Tech Inc Electronic component testing apparatus and test equipment using the same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201007721Y (en) * 2006-12-27 2008-01-16 中茂电子(深圳)有限公司 Semiconductor component testing table with ventiduct cooling device
TW201219802A (en) * 2010-11-05 2012-05-16 Hon Tech Inc providing heat conduction mechanism for full-scale cold/heat exchange to greatly enhance cooling performance during testing and ensure testing quality
TW201346293A (en) * 2012-05-11 2013-11-16 Hon Tech Inc Electric component press bonding device, testing equipment applying the same and press bonding control method
TW201423899A (en) * 2012-12-14 2014-06-16 Hon Tech Inc Electric component pressing mechanism and testing facility applying the same
TW201530161A (en) * 2014-01-28 2015-08-01 Hon Tech Inc Electronic component testing equipment
TW201614249A (en) * 2014-10-14 2016-04-16 Hon Tech Inc Electronic component testing apparatus and test equipment using the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI641842B (en) * 2017-08-14 2018-11-21 鴻勁精密股份有限公司 Crimp of electronic component crimping mechanism and test classification device
CN109116879A (en) * 2018-10-19 2019-01-01 苏州华兴源创科技股份有限公司 A kind of temperature controller

Also Published As

Publication number Publication date
TW201809697A (en) 2018-03-16

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