CN215833546U

CN215833546U - Semiconductor power module switching test structure

Info

Publication number: CN215833546U
Application number: CN202121294387.8U
Authority: CN
Inventors: 廖洪志; 罗少贞; 陆海; 郑科科
Original assignee: Semiconductor Manufacturing Electronics Shaoxing Corp SMEC
Current assignee: Semiconductor Manufacturing Electronics Shaoxing Corp SMEC
Priority date: 2021-06-10
Filing date: 2021-06-10
Publication date: 2022-02-15
Anticipated expiration: 2031-06-10

Abstract

The utility model relates to a semiconductor power module switching test structure which comprises a DUT test board, a switching socket and a switching PCB board, wherein the bottom surface of the switching socket is in contact with the top surface of the DUT test board to realize electric connection, the top surface of the switching socket is in contact with the bottom surface of the switching PCB board to realize electric connection, the switching PCB board is wired according to a test terminal of a tested product, the tested product is placed above the switching PCB board, and a probe connected with the test terminal of the tested product is arranged on the top surface of the switching PCB board. According to the utility model, on the basis of the existing test equipment and the DUT test board, the connection relation of the tested product and the DUT test board is established through the switching PCB matched with the packaging pins of the tested product, the DUT test board does not need to be redesigned when different types of products are tested, only the switching PCB matched with the tested product needs to be designed, the test input cost can be greatly reduced, and the stray influence of the whole test structure is small.

Description

Semiconductor power module switching test structure

Technical Field

The utility model relates to a semiconductor device testing technology, in particular to a semiconductor power module switching testing structure.

Background

In the manufacturing process of the integrated circuit, no matter in the wafer process stage or in the packaging stage, many testing links are involved, and during testing, special testing equipment is required to be matched with corresponding testing software. For example, for testing the packaged IGBT module, the testing is mainly implemented by adding a DUT testing board and a testing program matched with a product to be tested on an ate (automatic Test equipment) platform. As shown in fig. 1, a DUT test board and a test program are usually developed by manufacturers who produce ATE according to the targeted design of products to be tested, and the existing DUT test board is designed through a complex multi-stage structure in order to achieve the purposes of small influence of spurious parameters, good signal integrity, high test power, and the like during the test process. In the existing test equipment, a socket is arranged on a DUT test board, pin terminals of a tested product are inserted into preset jacks on the socket during testing to realize electric signal connection, and the DUT test board is connected with a test head connected with test equipment, so that the tested product is subjected to electric performance test.

Because the DUT test board has a complex structure and is designed only for devices in a specific packaging form, one DUT test board can only be used for testing one type of product, for semiconductor manufacturers, devices in multiple packaging forms and different types are usually designed and developed, and the DUT test board corresponding to each type of product needs to be equipped to meet the test requirements of different products, and the DUT test board can only be designed and manufactured by ATE manufacturers, so that great cost pressure is brought to the semiconductor manufacturers. Even if a semiconductor manufacturer designs a new product to be tested, regardless of the high price, temporarily putting a new test board to an ATE manufacturer requires waiting for a long delivery time, which is obviously disadvantageous for the semiconductor manufacturer's new product development. If the test of different packaging forms and different types of products can be met through the low-cost adapter PCB design on the basis of the existing product test equipment, the utilization rate and compatibility of the existing test equipment can be greatly increased, and the economic pressure of a semiconductor manufacturer can be greatly reduced.

SUMMERY OF THE UTILITY MODEL

The utility model discloses a semiconductor power module switching test structure, which establishes a test signal connection relation between a tested product and a DUT test board through a switching PCB matched with a tested product packaging pin on the basis of the existing test equipment and the DUT test board, and has the advantages of small stray influence and greatly reduced test input cost.

In order to achieve the purpose, the technical scheme adopted by the utility model is as follows:

a semiconductor power module switching test structure comprises a DUT test board, a switching socket and a switching PCB, wherein the bottom surface of the switching socket is in contact with the top surface of the DUT test board to realize electric connection, the top surface of the switching socket is in contact with the bottom surface of the switching PCB to realize electric connection, the switching PCB carries out wiring according to a test terminal of a tested product, the tested product is placed above the switching PCB, and a probe connected with the test terminal of the tested product is arranged on the top surface of the switching PCB.

The utility model adds a switching PCB board between the tested product and the switching socket, and the wiring inside the switching PCB board and the probe position of the top surface are determined according to the test terminal design of the tested product, the switching PCB board is used to lead the source measurement lead wire on the DUT test board to the probe position of the top surface of the switching PCB board, when testing different types of tested products, even if the positions of the pin jacks on the existing DUT test board are not matched with the tested product, the semiconductor manufacturer only needs to make a through PCB by rewiring according to the test terminals of the tested product, the difficulty and cost for making the through PCB are obviously much lower than those for making a DUT test board again, the making time is much faster, therefore, semiconductor manufacturers can meet the requirements of electrical performance tests of various tested products on the basis of the existing test device.

Considering that the whole test structure needs to control the stray influence as well as possible, and the electric connection path between the tested product and the test equipment needs to be shortened as much as possible, the electric connection between the structures of each layer of the utility model does not adopt an extension lead for connection, but adopts a mode of stacking and closely contacting each layer, namely: the top of the DUT test board is a switching socket, the top of the switching socket is a switching PCB board, the bottom of the DUT test board is a switching socket clamping plate, the four are tightly fixed together by a fastener, the used fastener only needs to lock the four, the structure of the fastener is not limited, and common bolts, screws and the like can be adopted; in addition, considering that the bottom of the adapter PCB is in good electrical contact with the top surface of the adapter socket, the utility model designs the upper surface of the adapter socket arranged on the top of the DUT test board in the prior art into a plane structure, the original positions of the pins of the adapter socket do not need to be changed, and when the adapter PCB is arranged on the adapter socket, the gold-plated bonding pads on the bottom surface of the adapter PCB can be in good electrical contact with the pins on the top surface of the adapter socket.

According to the design structure of the test terminal of the tested product of most power modules, the probe arranged on the top surface of the adapter PCB can be divided into spring probes of pin clamping pins, the pin clamping pins are used for clamping the signal terminals (usually low current) of the tested product, the spring probes are used for contacting with the power terminals (usually high current) of the tested product, the spring probes are distributed at two ends of the top surface of the adapter PCB, the spring probes at each end can be arranged in a plurality, and a plurality of pin clamping pins are arranged between the spring probes at two ends. The test terminal of the tested product can be accurately positioned with the probe position on the switching PCB when the tested product is placed, a positioning pin for positioning can be arranged on the top surface of the switching PCB, and the position of the positioning pin needs to correspond to the position of a positioning hole on the tested product. In order to ensure that the test terminal of the tested product can be in good electric contact with the probe on the adapter PCB, the utility model also places a pressing plate on the top surface of the tested product, so that the pressing plate is in contact with the heat dissipation surface on the back surface of the tested product, and the pressing plate presses the test terminal of the tested product downwards towards the direction of the probe on the adapter PCB under the action of gravity to ensure that the test terminal is in complete contact.

When the electrical property of a tested product is tested and evaluated, the static parameter index of the tested product in a normal temperature environment needs to be tested, and the dynamic parameter index of the tested product in a high-temperature working environment needs to be tested, so on the basis of the given test structure, the utility model also heats the tested product by the pressing plate which is originally used for realizing good contact, namely, the pressing plate is provided with the electric heating source and the temperature sensing probe, when the thermal property test needs to be carried out, the electric heating source is started to heat the tested product, the environmental temperature rise when the power module works is simulated, and the dynamic parameter index of the tested product in the high-temperature environment is tested.

Drawings

FIG. 1 is a schematic structural diagram of a test apparatus in the prior art;

FIG. 2 is a schematic diagram of a test structure according to an embodiment of the present invention;

FIG. 3 is a top view of an adapter socket according to an embodiment of the present invention;

FIG. 4 is a top view of an adapter PCB board according to an embodiment of the present invention;

FIG. 5 is a waveform diagram of the same tested product using the test structure of the present invention;

FIG. 6 is a waveform diagram of a prior art test structure for the same product under test.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

The present embodiment discloses a semiconductor power module transfer test structure, which is shown in fig. 2 to 4, and the whole test structure sequentially includes, from top to bottom: the device comprises a pressing plate 1 provided with an electric heating source and a temperature sensing probe, a tested product 2, a switching PCB 3, a switching socket 4, a DUT testing plate 5 and a switching socket clamping plate 6. The patch socket clamp plate 6, DUT test plate 5 and patch socket 4, the patch PCB board 3, four are secured together by fasteners such as bolts. The top surface of the adapter socket 4 is changed to a planar structure, and when the pins on the top surface of the adapter socket 4 are electrically connected to the bottom surface of the adapter PCB 3 as shown in fig. 3, the gold-plated pads on the bottom surface of the adapter PCB 3 are contacted to the pins 41 on the adapter socket 4. If the test terminal of the tested product 2 to be tested does not conform to the pins 41 of the adapter socket 4 on the existing DUT test board 5, only one adapter PCB 3 needs to be redesigned according to the test terminal structure of the tested product 2, each adapter PCB 3 corresponding to the specific tested product 2 is designed, the bottom surface structure is the same, and only the internal wiring and the probes on the top surface of the adapter PCB 3 need to be adjusted.

As shown in fig. 4, two sets of spring probes 33 are respectively disposed at two ends of the top surface of the adapting PCB 3, and each set of spring probes 33 is composed of a plurality of spring probes and is mainly used for contacting with the power terminals of the product 2 to be tested. A plurality of housekeeper clamping pins 32 are arranged between the two groups of spring probes 33 and are mainly used for clamping signal terminals of the product 2 to be tested. The top surface of the transfer PCB board 3 is also provided with a positioning pin 31, and the position of the positioning pin 31 corresponds to a positioning hole on the tested product 2, so that the tested product 2 and the probe on the transfer PCB board 3 can be conveniently contacted and positioned. The pressing plate 1 with the electric heating function can not only realize good contact by pressing the test terminal of the tested product 2 downwards towards the direction of the probe on the switching PCB 3 under the action of gravity, but also heat the tested product 2 for testing the dynamic parameter index in a high-temperature environment.

In order to verify the improvement effect of the test structure of the utility model, the test structure of the utility model and a special device test structure of a certain type are respectively adopted to carry out test data acquisition on the same IGBT product, as shown in fig. 5 and 6, according to test waveforms, the test structure of the utility model is adopted in fig. 5, the reverse peak voltage VCE is about 730V, and the waveform oscillation is small; in the inverse view of fig. 6, the inverse peak voltage VCE of the test structure using a special device is about 850V, and the waveform oscillation is very obvious. Therefore, the new test structure can reduce the reverse peak voltage by 14 percent relative to the existing test structure, which shows that the switching test structure designed by the utility model can well control the stray effect, can widen the compatible range of testing different types of products on the basis of the existing test device, and can realize the dynamic and static parameter test of the power module under different environmental temperatures.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A semiconductor power module switching test structure is characterized in that: the testing device comprises a DUT testing board, a switching socket and a switching PCB board, wherein the bottom surface of the switching socket is in contact with the top surface of the DUT testing board to realize electric connection, the top surface of the switching socket is in contact with the bottom surface of the switching PCB board to realize electric connection, the switching PCB board is wired according to a testing terminal of a tested product, the top of the switching PCB board is used for placing the tested product, and a probe connected with the testing terminal of the tested product is arranged on the top surface of the switching PCB board.

2. The semiconductor power module transfer test structure of claim 1, wherein: the probe is including being located the spring probe of switching PCB board top surface both ends and between a plurality of pin clamping piece needles of both ends spring probe, and pin clamping piece needle is used for the signal terminal of centre gripping product under test, and the spring probe is used for contacting the power terminal of product under test.

3. The semiconductor power module transfer test structure of claim 1, wherein: the bottom surface of the DUT test board is in contact with the adapter socket clamping plate, and the adapter PCB board, the adapter socket, the DUT test board and the adapter socket clamping plate are tightly connected together through the fasteners.

4. The semiconductor power module transfer test structure of claim 1, wherein: the top surface and the bottom surface of the adapter socket are both of a plane structure, pins on the bottom surface of the adapter socket are in contact with the bonding pads on the top surface of the DUT test board to form electric connection, and pins on the top surface of the adapter socket are in contact with the bonding pads on the bottom surface of the adapter PCB to form electric connection.

5. The semiconductor power module transfer test structure of claim 1, wherein: and the upper part of the tested product is provided with a pressing plate for pressing the tested product.

6. The semiconductor power module transfer test structure of claim 5, wherein: the pressing plate has an electric heating function and comprises an electric heating source and a temperature sensing probe.

7. The semiconductor power module transfer test structure of claim 1, wherein: the top surface of the switching PCB board is provided with a positioning pin, and the position of the positioning pin corresponds to the position of a positioning hole on a product to be measured.