CN106707141A - Tray type integrated circuit chip testing device - Google Patents
Tray type integrated circuit chip testing device Download PDFInfo
- Publication number
- CN106707141A CN106707141A CN201710125086.4A CN201710125086A CN106707141A CN 106707141 A CN106707141 A CN 106707141A CN 201710125086 A CN201710125086 A CN 201710125086A CN 106707141 A CN106707141 A CN 106707141A
- Authority
- CN
- China
- Prior art keywords
- test
- probe
- charging tray
- plates
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 100
- 239000000523 sample Substances 0.000 claims abstract description 53
- 239000008188 pellet Substances 0.000 claims description 12
- 230000003028 elevating effect Effects 0.000 claims description 3
- 235000015895 biscuits Nutrition 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
Abstract
The invention discloses a tray type integrated circuit chip testing device which comprises a test frame and a probe module for contact conduction, wherein a test charging tray loader and a pneumatic lifting part enabling the test charging tray loader to lift are arranged on the test frame; a limiting part, a lifting inductor and a controller are arranged on the test charging tray loader; the limiting part is used for limiting the test charging tray; the probe module for contact conduction comprises a supporting plate, and a transfer slot, a PCB (printed circuit board) fixing plate, a PCB transfer board, a probe A board, a probe B board and test probes which are arranged on the supporting plate from top to bottom; the test probes are respectively fixed in the probe A board and the probe B board and are in contact connection with the PCB transfer board. According to the testing device disclosed by the invention, a to-be-tested integrated circuit (IC) can be subjected to whole tray testing, and the test efficiency is high.
Description
Technical field
The present invention relates to integrated circuit testing field, more particularly to a kind of pellet type IC chip test dress
Put.
Background technology
In the prior art, IC tests are tested by the way that Special testing device is single, and single test operation is complicated, are surveyed
Examination is less efficient.
Therefore, the prior art is defective, it is necessary to improve.
The content of the invention
The technical problems to be solved by the invention are:A kind of whole looping test, the integrated electricity of testing efficiency pellet type high are provided
Road apparatus for testing chip.
Technical scheme is as follows:A kind of pellet type IC chip test device, including test chassis and connect
Touch and lead general probe module;Wherein, test charging tray load plate is set in test chassis and makes test charging tray load plate elevating movement
Pneumatic elevation part, also, test charging tray load plate is additionally provided with and spacing limiting component and lifting sense carried out to test charging tray
Answer and controller;Contact is led general probe module and is included on supporting plate, supporting plate and be provided with from top to bottom switching slot, PCB and fix
Plate, PCB pinboards, probe A plates, probe B plates and test probe, wherein, test probe is separately fixed at probe A plates and probe B
In plate, and connection is contacted with PCB pinboards.
Above-mentioned technical proposal is applied to, in described pellet type IC chip test device, is also placed on including one
Test charging tray on test charging tray load plate, some limitting casings for placing IC to be measured, each limitting casing are provided with test charging tray
Corresponded with test probe.
Above-mentioned technical proposal is applied to, in described pellet type IC chip test device, general probe is led in contact
Module is additionally provided with some alignment pins.
Using such scheme, the present invention leads general probe module test chassis, passes through by setting test chassis and contact
Pellet type test charging tray load plate and test charging tray are set in test chassis, and general probe module is led by the contact for setting and turn on
IC to be measured on test charging tray, in this way, whole looping test can be carried out, testing efficiency is high.
Brief description of the drawings
Fig. 1 is structural perspective of the invention;
Fig. 2 is front view of the invention;
Fig. 3 is top view of the invention;
Fig. 4 is the structure chart of test charging tray in the present invention;
Fig. 5 is the structure chart that general probe module is led in contact in the present invention;
Fig. 6 is the test structure figure that general probe module is led in contact in the present invention.
Specific embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is described in detail.
A kind of pellet type IC chip test device is present embodiments provided, as Figure 1-3, the integrated electricity of pellet type
Road apparatus for testing chip includes that general probe module 101 is led in test chassis 102 and contact;Wherein, test is set in test chassis
Charging tray load plate 103 and make the Pneumatic elevation part 106 of test charging tray load plate elevating movement, also, test charging tray load plate also sets
Being equipped with carries out spacing limiting component 105 and lifting sensing and controller 104 to test charging tray;Wherein, test chassis 102
It is the shared part of test device, tests different IC by changing different parts, for example, change different contact conductings visits
The charging tray of needle mould group 101 and loading IC to be measured, it is possible to achieve the different whole TRAY tests of IC chip, wherein, TRAY is pallet, example
Such as, such as BGA132/152, TSOP48, UDP card, the IC of TF card encapsulation can respectively be tested.
As shown in figure 4, test charging tray 107 is provided with some journey dot matrix arrangements and the limitting casing for placing IC to be measured
108, each limitting casing 108 is corresponded with test probe, in this way, can correspond connection limitting casing 1085 by testing probe
On IC to be measured, so as to realize the test to IC to be measured.
As it can be seen in figures 5 and 6, contact is led general probe module 101 and is included and set from top to bottom on supporting plate 204, supporting plate 204
There are switching slot 202, PCB fixed plates 203, PCB pinboards 205, probe A plates 206, probe B plates 207 and test probe 209, its
In, test probe is separately fixed in probe A plates and probe B plates, and test probe contacts connection with PCB pinboards;In this way, surveying
During examination, test motherboard 201 is respectively inserted into switching slot 202, and by slot and the company of contact of PCB pinboards 205 of transferring
Logical, PCB pinboards contact connection with individual test probe 209 respectively, and PCB fixed plates 203 are used to fix PCB pinboards, probe A plates
It is used to fixedly mount test probe 209 with probe B plates;Test probe 209 is connected with the IC to be measured in test charging tray 107;So as to
Tested after IC to be measured is connected with test motherboard.
Also, IC to be measured first before test, is put into chip tray, then test panel left-hand thread to IC is tested into charging tray 107
On, test biscuit 107 and chip tray are integrally overturn 180 °, make to be poured into test charging tray 107 by IC to be measured, and make IC to be measured
Respectively fall in the limitting casing 108 of test charging tray, test charging tray push-in is tested in charging tray load plate 103, and by limiting component
105 have test charging tray are fixed, and after fixation, make test charging tray load plate 103 overall by Pneumatic elevation part 106
Rise, and it is risen to predeterminated position by lifting sensing and controller 104, after test charging tray load plate 103 rises, make test
IC to be measured in biscuit 107 leads the test probe on general probe module 101 and is in contact with touching, so as to be connected by testing probe
The test each IC to be measured of motherboard 201 pairs is tested.
Also, contact leads general probe module and is additionally provided with some alignment pins 208, the 208 pairs of contact conductings of each alignment pin are used
The entirety of probe module plays a part of location and installation fixation.
These are only presently preferred embodiments of the present invention, be not intended to limit the invention, it is all it is of the invention spirit and
Any modification, equivalent and improvement for being made within principle etc., should be included within the scope of the present invention.
Claims (3)
1. a kind of pellet type IC chip test device, it is characterised in that:
General probe module is led including test chassis and contact;Wherein, test charging tray load plate is set in test chassis and makes survey
The Pneumatic elevation part of test portion disk load plate elevating movement, also, test charging tray load plate be additionally provided with to test charging tray carry out it is spacing
Limiting component and lifting sensing and controller;
Contact is led general probe module and is included on supporting plate, supporting plate and be provided with from top to bottom switching slot, PCB fixed plates, PCB and turn
Fishplate bar, probe A plates, probe B plates and test probe, wherein, test probe is separately fixed in probe A plates and probe B plates, and with
The contact connection of PCB pinboards.
2. pellet type IC chip test device according to claim 1, it is characterised in that:Also it is placed on including one
Test charging tray on test charging tray load plate, some limitting casings for placing IC to be measured, each limitting casing are provided with test charging tray
Corresponded with test probe.
3. pellet type IC chip test device according to claim 1, it is characterised in that:General probe is led in contact
Module is additionally provided with some alignment pins.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710125086.4A CN106707141A (en) | 2017-03-03 | 2017-03-03 | Tray type integrated circuit chip testing device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710125086.4A CN106707141A (en) | 2017-03-03 | 2017-03-03 | Tray type integrated circuit chip testing device |
Publications (1)
Publication Number | Publication Date |
---|---|
CN106707141A true CN106707141A (en) | 2017-05-24 |
Family
ID=58917383
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710125086.4A Pending CN106707141A (en) | 2017-03-03 | 2017-03-03 | Tray type integrated circuit chip testing device |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106707141A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108318805A (en) * | 2018-02-09 | 2018-07-24 | 宁波鄞州国康机械科技有限公司 | A kind of electronics integrated equipment |
CN113624398A (en) * | 2021-09-13 | 2021-11-09 | 明石创新(烟台)微纳传感技术研究院有限公司 | Test fixture for pressure sensor |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201135237A (en) * | 2010-04-14 | 2011-10-16 | Mpi Corp | Interposer for probe card |
TW201407171A (en) * | 2012-08-10 | 2014-02-16 | Hon Tech Inc | Electronic component testing and classification equipment |
CN203502148U (en) * | 2013-11-07 | 2014-03-26 | 南京环科电子技术有限公司 | Data acquisition device of ceramic pressure sensor chips |
TW201443451A (en) * | 2013-05-07 | 2014-11-16 | Innovative Turnkey Solution Corp | Test module |
CN206515440U (en) * | 2017-03-03 | 2017-09-22 | 深圳凯智通微电子技术有限公司 | A kind of pellet type IC chip test device |
-
2017
- 2017-03-03 CN CN201710125086.4A patent/CN106707141A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201135237A (en) * | 2010-04-14 | 2011-10-16 | Mpi Corp | Interposer for probe card |
TW201407171A (en) * | 2012-08-10 | 2014-02-16 | Hon Tech Inc | Electronic component testing and classification equipment |
TW201443451A (en) * | 2013-05-07 | 2014-11-16 | Innovative Turnkey Solution Corp | Test module |
CN203502148U (en) * | 2013-11-07 | 2014-03-26 | 南京环科电子技术有限公司 | Data acquisition device of ceramic pressure sensor chips |
CN206515440U (en) * | 2017-03-03 | 2017-09-22 | 深圳凯智通微电子技术有限公司 | A kind of pellet type IC chip test device |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108318805A (en) * | 2018-02-09 | 2018-07-24 | 宁波鄞州国康机械科技有限公司 | A kind of electronics integrated equipment |
CN108318805B (en) * | 2018-02-09 | 2019-07-02 | 嵊州潘辰机械科技有限公司 | A kind of electronics integrated equipment |
CN113624398A (en) * | 2021-09-13 | 2021-11-09 | 明石创新(烟台)微纳传感技术研究院有限公司 | Test fixture for pressure sensor |
CN113624398B (en) * | 2021-09-13 | 2023-11-14 | 明石创新(烟台)微纳传感技术研究院有限公司 | Test fixture for pressure sensor |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170524 |
|
RJ01 | Rejection of invention patent application after publication |