201135237 六、發明說明： 【發明所屬之技術領域】 本發明關於探針卡，尤指一 種應用於探針卡的轉接板‘ 【先前技術】 早期的探針卡結構包含了— ,^ ^, A 電路板以及一探針模組， 由電路板負責與一測試機電連 稷罨連接，而探針模組則負責盥待 測半導體（或稱為待測物）接觸， ”， , 以在進行待測物測試時， 藉由探針卡將測試機傳遞測試 唬到待測物，4自待測物 回傳結果訊號至測試機。較早 β 如 衩早以别是將探針模組直接焊接 在電路板上，然而若探針模缸i 惕、出現知壞，則要將探針模組 拆下維修變成極為困難的工作。 & v 7 ^ ^ F爾後，為了方便將電路板 ，、探針模組分離，it常兩者之間採用可分離式結構。為了 更斥裝維修、且盡可能的使探針卡電路板的型式簡化、 規格化’目此探針卡領域巾线了 —種介㈣針卡電路板 與探針模組的轉接板（intei>pGSer，又稱為轉插板、内插器、 插入件）。 勺人請參見圖la’為習用的探針卡的剖視圖。探針卡ι〇 包含一探針卡電路板u、一轉接板12、以及—探針模組 13其中，電路板11下表面上設置多個端子墊（pad)l 10。 接板12具有一轉接基板12〇,其上下表面上均設置多個 彈性結構121 ' 122，每-彈性結構121可分別對應探針卡 電路板11的端子墊110並相抵接。而探針模組13具有一 201135237 基板131，基板131的上表面設置多個端子墊132，基板 131的下表面設置多個探針133,每一端子墊132可分別對 應轉接基板120的彈性結構122並相抵接。在進行待測物 的測試時，藉由端子墊110、彈性結構121、122、端子墊 132、探針133的電路路徑，傳送測試信號或由待測物回傳 的結果訊號。然而，各彈性結構121(或122)之間，於傳遞 測試信號及結果訊號時有互相干擾的現象，致使信號失真 ^ 或耗損。 凊參閱圖〗b，為另一種習用的探針卡的剖視圖。探針 卡20包含一探針卡電路板21及一轉接板22。其中，探針 卡電路板21下表面上設置多個端子墊21〇。轉接板22具 有一轉接基板220，而轉接基板22〇上下表面係使用彈簧 針（pogo pin)221作為轉接基板22〇與，探針卡電路板21 或探針模組（圖中未揭示）之間的電連接接點。 轉接基板220透過彈簧針221與電路板21的端子墊 ® 210接觸，使端子墊21〇、彈簧針221、轉接基板22〇的信 號線2200與探針模組形成測試信號或結果訊號的傳遞路 禮。但彈簧針221的結構複雜，通常包含一個筒型外殼 22 10、其内設有—彈簧μ u及一導體針2212，導體針2212 的針尖2213凸出於筒型外殼221〇的開口端2214，藉由導 體針2212與端子墊21〇抵接，可以形成完整的測試信號的 傳遞路徑。然而彈簧針的結構複雜，且彈簧針的結構本身 受到一定限制’無法應用在高頻信號的測試中，若使用在 南頻信號的測試’必須進一步設計成例如同轴的結構，使 201135237 彈簧針的結構更加複雜而不易製造，也造成製造成本的增 加0 當然’以圖1 a為例，改善各彈性結構12 1 (或122)之 間傳遞信號的互相干擾是目前急需進行的。美國專利第 20090224785 號之「providing an eiectricaUy conductive wall structure adjacent a contact structure of an electronic device」揭露一種探針卡的轉接板，其目的即在於改善圖 la中各彈性結構121(或122)之間傳遞信號的互相干擾。請 參閱圖2’為美國專利第2〇〇9〇224785號揭露之探針卡的 轉接板立體示意圖。轉接板3〇包括一轉接基板31及多個 彈性結構32。在轉接基板3 1表面的多個彈性結構32之間 設置了一屏蔽導體33,以屏蔽傳遞信號的電磁干擾，尤其 在用於π頻彳5號進行待測物的測試時，屏蔽導體3 3的設 置，可以有效的避免傳遞信號的失真或耗損。然而彈性結 構3 2與屏蔽導體3 3的間隙無法控制的很精準，可靠度較 差，可能造成兩者短路，無法反應真實的測試結果。 爰疋之故，申請人有鑑於習知技術之缺失，發明出本 案應用於探針卡的轉接板」，用以改善上述習用手段之缺 失0 【發明内容】 、探針模組、以及 並且降低維修成本 本發明之目的在於使探針卡電路板 轉接板本身的維修、替換得以便利化， 與製造成本。 201135237 本發明的另-目的在於使探針卡所使用的轉接板在進 行高頻信號傳輸時可以降低干擾，並且還可以避免屏蔽導 體與彈性結構的短路。此外還提高了在轉接板上設置屏蔽 導體的良率。 為了達到上述之目的，本發明提供一種應用於探針卡 的轉接板，該轉接板包括—轉接基板，具有―第―表面與 一第二表面；多個彈性結構，設置於該轉接基板的第一表 面；多個迴焊結構，設置於該轉接基板的第二表面，每一 迴焊結構對應且電連接該多個彈性結構巾的_個；以及一 ，槽盘板，設置覆蓋於該轉接基板的第—表面上，該溝槽 蓋板具有多個溝槽，供該彈性結構穿設該溝槽蓋板的上； 表面’該溝槽蓋板包括—屏蔽導體及—絕緣結構：，該屏蔽 導體為該絕緣結構包覆。 如上所述的轉接板，其中該屏蔽導體是設置在該溝槽 的周圍並垂直於該轉接基板。 如上所述的轉接板，其中該屏蔽導體為多個片狀結構 組成。 如上所述的轉接板，其中該屏蔽導體具有至少—穿孔。 如上所述的轉接板，其中該屏蔽導體電連接至一接地 電位。 山如上所述的轉接板’其中該溝槽蓋板更包括-第一接 、端子°又於該溝槽蓋板的上端並與該屏蔽導體電連接； 2一第二接地端子，設於該溝槽蓋板的下端並與該屏蔽 電連接’該第—接地端子及該第二接地端子電連接該 6201135237 VI. Description of the Invention: [Technical Field] The present invention relates to a probe card, and more particularly to an adapter plate applied to a probe card. [Prior Art] The early probe card structure includes - , ^ ^, A circuit board and a probe module, the circuit board is responsible for connecting with a test electromechanical connection, and the probe module is responsible for contacting the semiconductor to be tested (or called the object to be tested), ", When the test object is tested, the test machine transmits the test test to the test object by the probe card, and the test signal is sent back to the test machine from the test object. The earlier β is as early as the other, the probe module is directly Soldering on the circuit board, however, if the probe mold cylinder is defective, it is extremely difficult to remove the probe module and repair it. & v 7 ^ ^ F, after the board is replaced, The probe module is separated, and it is often separated by a separable structure. In order to make the repair and repair, and to make the type of the probe card circuit board as simple as possible, the specification of the probe card field - Intermediary (four) pin card circuit board and probe module adapter board (intei> pGSer, also known as the spinner, interposer, insert). See Figure la' for a conventional probe card. The probe card contains a probe card board u, An adapter board 12 and a probe module 13 are provided with a plurality of terminal pads 10 on the lower surface of the circuit board 11. The board 12 has a switching substrate 12, which is disposed on the upper and lower surfaces. The elastic structure 121' 122, each of the elastic structures 121 can respectively abut the terminal pads 110 of the probe card circuit board 11. The probe module 13 has a 201135237 substrate 131, and the upper surface of the substrate 131 is provided with a plurality of terminals. A plurality of probes 133 are disposed on the lower surface of the substrate 131. Each of the terminal pads 132 can respectively abut the elastic structure 122 of the adapter substrate 120. When the test object is tested, the terminal pad 110 is used. The circuit paths of the elastic structures 121, 122, the terminal pads 132, and the probes 133 transmit test signals or result signals returned by the object to be tested. However, between the elastic structures 121 (or 122), test signals and results are transmitted. Signals interfere with each other, causing signal distortion ^ or Fig. b is a cross-sectional view of another conventional probe card. The probe card 20 includes a probe card circuit board 21 and an adapter plate 22. The probe card circuit board 21 is disposed on the lower surface. a plurality of terminal pads 21A. The adapter plate 22 has a transition substrate 220, and the upper and lower surfaces of the adapter substrate 22 are formed by using a pogo pin 221 as a transfer substrate 22 and a probe card circuit board 21 or Electrical connection between the probe module (not shown). The adapter substrate 220 is in contact with the terminal pad® 210 of the circuit board 21 through the spring pin 221, so that the terminal pad 21, the spring pin 221, and the adapter substrate The 22-inch signal line 2200 and the probe module form a pass signal for the test signal or the resulting signal. However, the structure of the spring pin 221 is complicated, and generally includes a cylindrical casing 22 10 having a spring μ u and a conductor pin 2212. The tip 2213 of the conductor pin 2212 protrudes from the open end 2214 of the cylindrical casing 221〇. By the conductor pin 2212 abutting the terminal pad 21, a complete test signal transmission path can be formed. However, the structure of the pogo pin is complicated, and the structure of the pogo pin itself is subject to certain limitations 'cannot be applied in the test of high frequency signals. If the test used in the south frequency signal' must be further designed into a coaxial structure, for example, the 201135237 spring pin The structure is more complicated and not easy to manufacture, and also causes an increase in manufacturing cost. Of course, taking FIG. 1 a as an example, it is urgent to improve the mutual interference of signals transmitted between the elastic structures 12 1 (or 122). The "providing an eiectrica Uy conductive wall structure adjacent a contact structure of an electronic device" discloses a probe card adapter plate, the purpose of which is to improve between the elastic structures 121 (or 122) in FIG. Signals interfere with each other. Please refer to Figure 2' for a perspective view of the adapter plate of the probe card disclosed in U.S. Patent No. 2,924,785. The adapter plate 3 includes an adapter substrate 31 and a plurality of elastic structures 32. A shield conductor 33 is disposed between the plurality of elastic structures 32 on the surface of the transfer substrate 31 to shield the electromagnetic interference of the transmitted signal, especially when used for testing the object to be tested on the π frequency 彳5, the shield conductor 3 The setting of 3 can effectively avoid the distortion or loss of the transmitted signal. However, the gap between the elastic structure 3 2 and the shield conductor 33 is unpredictable and the reliability is poor, which may cause a short circuit between the two and cannot reflect the actual test results.爰疋 , , , , , , , , , , , , , 申请人 申请人 申请人 申请人 申请人 申请人 申请人 申请人 申请人 申请人 申请人 申请人 申请人 申请人 申请人 申请人 申请人 申请人 申请人 申请人 申请人 申请人 申请人 申请人 申请人 申请人 申请人 申请人 申请人 申请人 申请人 申请人Reducing Maintenance Costs The object of the present invention is to facilitate the maintenance and replacement of the probe card circuit board adapter plate itself, as well as the manufacturing cost. 201135237 Another object of the present invention is to enable the adapter plate used in the probe card to reduce interference when transmitting high frequency signals, and to avoid short circuiting of the shield conductor and the elastic structure. It also increases the yield of shielding conductors placed on the riser board. In order to achieve the above object, the present invention provides an interposer board for a probe card, the interposer board comprising: a transfer substrate having a first surface and a second surface; and a plurality of elastic structures disposed on the turn a first surface of the substrate; a plurality of reflow structures disposed on the second surface of the interposer substrate, each reflow structure corresponding to and electrically connecting the plurality of elastic structural tissues; and a slot plate, Providing a cover on the first surface of the interposer substrate, the trench cover having a plurality of trenches for the elastic structure to pass through the trench cover; the surface of the trench cover includes a shield conductor and —Insulation structure: The shield conductor is covered by the insulation structure. The interposer as described above, wherein the shield conductor is disposed around the trench and perpendicular to the interposer substrate. The adapter plate as described above, wherein the shield conductor is composed of a plurality of sheet structures. An adapter plate as described above, wherein the shield conductor has at least a perforation. An adapter plate as described above, wherein the shield conductor is electrically connected to a ground potential. The adapter plate as described above, wherein the trench cover further comprises a first connection, a terminal and an upper end of the trench cover and electrically connected to the shield conductor; 2 a second ground terminal disposed at The lower end of the trench cover is electrically connected to the shield electrical connection 'the first ground terminal and the second ground terminal 6
201135237 接地電位。 如上所述的轉接板，其中該探針卡包括一探針卡電路 板與-探針模組’該探針卡電路板及該探針模組具有多個 端子塾，每針卡電路板上的端子塾分科觸一個該 彈性結構，該些探針模、组的端子墊藉由焊接該些迴焊結 構，以電連接該彈性結構。 如上所述的轉接板，其中探針卡包括一探針卡電路板 與一探針m«針卡電路板及㈣針餘具有多個端 子塾’該些探針卡電路板上的端子墊藉由焊接該些迴谭结 構’以分別電連接該㈣性結構，每—該探針模組的端子 墊分別接觸一個該彈性結構。 為了達到上述之目的，本發明再提供一種應用於探針 卡的轉接板，該轉接板包括一轉接基板，具有一表面；多 個彈性結構1電良導體並設置於該轉接基板的該表面； 以：-屏蔽導體，設置覆蓋於該轉接基板的該表面上該 屏敵導體具有多個溝槽’供該彈性結構放置並穿過該屏蔽 導體的上下表面。 如前所述的轉接基板 構組成。 其中該屏蔽導體為多個片狀結 如前所述的轉接基板， 孔。 其中該屏蔽導體具有至少一穿201135237 Ground potential. The adapter board as described above, wherein the probe card comprises a probe card circuit board and a probe module, the probe card circuit board and the probe module have a plurality of terminal ports, each card circuit board The upper terminal branch contacts a resilient structure, and the probe pads and the set of terminal pads are electrically connected to the elastic structure by soldering the reflow structures. The adapter board as described above, wherein the probe card comprises a probe card circuit board and a probe m «pin card circuit board and (4) the needle has a plurality of terminals 塾 'the terminal pads of the probe card circuit board The terminal pads of the probe module respectively contact one of the elastic structures by soldering the return structures to electrically connect the (four) structures, respectively. In order to achieve the above object, the present invention further provides an adapter board applied to a probe card, the adapter board comprising a switch substrate having a surface; a plurality of elastic structures 1 and a conductor disposed on the adapter substrate The surface is: a shield conductor disposed on the surface of the interposer substrate. The screen conductor has a plurality of trenches for the elastic structure to be placed and pass through the upper and lower surfaces of the shield conductor. The transfer substrate is constructed as described above. Wherein the shield conductor is a plurality of chip junctions, the transfer substrate as described above, and the holes. Where the shield conductor has at least one
如前所述的轉接基板， 該屏蔽導體係以一絕緣結構包 7 201135237 【實施方式】 以下針對本發明之應用於探針卡的轉接板以及探針卡 的製造方法的較佳實施例進行描述，請參考附圖，但實於 之配置及所採行的方法並不必須完全符合所描述的内容， 熟習本技藝者當能在不脫離本案之實際精神及範圍的情況 下，做出種種變化及修改。The adapter substrate as described above, the shield guiding system is an insulating structure package 7 201135237. [Embodiment] The following is a preferred embodiment of the method for manufacturing an adapter plate for a probe card and a probe card of the present invention. For the description, please refer to the attached drawings, but the actual configuration and the method of the method are not necessarily in full compliance with the description, and those skilled in the art can make without departing from the actual spirit and scope of the case. Various changes and modifications.
請參閱圖3a及圖3b，其中圖3a為本發明轉接板的實 施例示意圖，而圖3b則為圖3a的剖視圖。由於探針卡的 操作頻率上升，因此使得轉接板也必須承受高頻的信號傳 輪，但也難免有信號的干擾。本發明的轉接板4〇包含—轉 接基板41、多個彈性結構42及一溝槽蓋板43。轉接基板 41的表面410上設有多個彈性結構42，以使彈性結構 一端電連接電路板或探針模組（圖中未揭示）的端子墊，彈 陡、’、。構42另一端則電連接轉接基板4丨的内部電路（圖中未 揭示）。溝槽蓋板43覆蓋於轉接基板41的表面41〇上，兩 者屬於分離式結構，圖3a揭示了兩者分離的實施例示意 圖，而圖3b則揭示了兩者組合的剖視圖。在溝槽蓋板ο 上具有多個溝槽430,以供彈性結構42貫穿溝槽蓋板Μ 的上下表面，溝槽蓋板43包括一屏蔽導體431及一絕緣結 構432，屏蔽導體431為絕緣結構432包覆。溝槽蓋板43 係以多個隔間牆433分隔形成多個溝槽43〇，隔間牆433 即是由屏蔽導體431及絕緣結構432所形成，屏蔽導體431 又置在溝槽430的周圍並垂直於轉接基板41。溝槽蓋板μ 設置於轉接基板41的表面41.0時，彈性結構42穿過溝槽 201135237 430,使兩彈性結構42之間以隔間牆433分隔。屏蔽導體 431係以導體材料構成，且為多個片狀結構，而各片狀级 構再以焊接或其他方式組合’形成如圖3a所示的溝槽蓋= 43的外觀形狀，當然屏蔽導體431也可以—體成型^乍形 成如溝槽蓋板43的外觀形狀’使各隔間牆433内的屏蔽導 體431可以電連接在一起。屏蔽導體431表面形成絕緣結 構432以免彈性結構42接觸屏蔽導體431而短路。此外^ • 屏蔽導體431會與一接地電位電連接（圖中未揭示），例如 探針卡電路板上的接地端子墊，以維持彈性結構42在傳遞 高頻信號的特性阻抗。 圖-4為本發明轉接板的第二實施例示意圖。圖$則為 圖4的立體剖視圖。在圖4的探針卡的轉接板中，轉接基 板、多個彈性結構及溝槽蓋板等結構與圖3a及圖扑相同， 因此沿用圖3a及圖3b的圖號。轉接基板41上設置溝槽蓋 板43，兩者屬於分離式結構，圖3a為兩者分離的實施例 • 不意圖，圖4為兩者組合的剖視圖，圖5為兩者組合的立 體剖視圖。圖4及圖5的結構與圖3a及圖3b的差異，在 於隔間牆433中屏蔽導體431的部分形成至少一穿孔 431a，以控制屏蔽導體431的面積，達到阻抗匹配的效果。 此外，由於彈性結構42是呈陣列方式排列且傾斜設置 於轉接基板41的表面410上’當彈性結構42受力時，會 依其傾斜的方向折彎變形。而如圖5所示，多個彈性結構 42係以分別以第—列42A、第二列42B、第三列42C來排 列，且各列42A、42B、42C互相平行，而隔間牆433係與 201135237 平行，並設置在不同 列42A及第二列42B 即可防止兩列42A、 各列42A、42B、42C的彈性結構42 列的兩彈性結構42之間，例如在第— 的彈性結構42之間設置隔間牆433， 42B的彈性結構42互相干擾。Referring to Figures 3a and 3b, Figure 3a is a schematic view of an embodiment of the adapter plate of the present invention, and Figure 3b is a cross-sectional view of Figure 3a. Due to the increased operating frequency of the probe card, the adapter plate must also withstand high frequency signal transmission, but it is also inevitable that there is signal interference. The adapter plate 4 of the present invention comprises a transfer substrate 41, a plurality of elastic structures 42 and a trench cover 43. A plurality of elastic structures 42 are disposed on the surface 410 of the interposer substrate 41 such that one end of the elastic structure is electrically connected to the terminal pads of the circuit board or the probe module (not shown), and is sharp. The other end of the structure 42 is electrically connected to the internal circuit of the interposer substrate 4 (not shown). The trench cover 43 covers the surface 41 of the interposer substrate 41, both of which are of a separate structure, Fig. 3a discloses a schematic view of the separation of the two, and Fig. 3b shows a cross-sectional view of the combination. The groove cover ο has a plurality of grooves 430 for the elastic structure 42 to penetrate the upper and lower surfaces of the groove cover ,. The groove cover 43 includes a shield conductor 431 and an insulation structure 432, and the shield conductor 431 is insulated. Structure 432 is coated. The trench cover 43 is separated by a plurality of partition walls 433 to form a plurality of trenches 43 〇. The partition walls 433 are formed by the shield conductor 431 and the insulating structure 432, and the shield conductor 431 is placed around the trench 430. And perpendicular to the transfer substrate 41. When the trench cover μ is disposed on the surface 41.0 of the interposer substrate 41, the elastic structure 42 passes through the trench 201135237 430 to separate the two elastic structures 42 by the partition wall 433. The shield conductor 431 is made of a conductor material and has a plurality of sheet-like structures, and each of the sheet-like stages is welded or otherwise combined to form an appearance shape of the groove cover 43 as shown in FIG. 3a, of course, the shield conductor The 431 can also be formed such that the outer shape of the trench cover 43 is such that the shield conductors 431 in the respective partition walls 433 can be electrically connected together. The surface of the shield conductor 431 is formed with an insulating structure 432 to prevent the elastic structure 42 from being short-circuited by contacting the shield conductor 431. In addition, the shield conductor 431 is electrically connected to a ground potential (not shown), such as a ground terminal pad on the probe card circuit board, to maintain the characteristic impedance of the resilient structure 42 in transmitting high frequency signals. Figure 4 is a schematic view showing a second embodiment of the adapter plate of the present invention. Figure $ is a perspective cross-sectional view of Figure 4. In the adapter plate of the probe card of Fig. 4, the structure of the transfer substrate, the plurality of elastic structures, and the groove cover is the same as that of Fig. 3a and Fig. 3b, and therefore the numbers of Figs. 3a and 3b are used. A grooved cover plate 43 is disposed on the adapter substrate 41, and the two are separated structures, and FIG. 3a is an embodiment in which the two are separated. FIG. 4 is a cross-sectional view showing a combination of the two, and FIG. 5 is a perspective sectional view showing a combination of the two. . The difference between the structure of Figs. 4 and 5 and that of Figs. 3a and 3b is that at least one through hole 431a is formed in the portion of the partition wall 433 where the shield conductor 431 is formed to control the area of the shield conductor 431 to achieve the effect of impedance matching. Further, since the elastic structures 42 are arranged in an array and are obliquely disposed on the surface 410 of the interposer substrate 41, when the elastic structure 42 is stressed, it is bent and deformed in the direction in which it is inclined. As shown in FIG. 5, the plurality of elastic structures 42 are arranged in the first column 42A, the second column 42B, and the third column 42C, respectively, and the columns 42A, 42B, 42C are parallel to each other, and the partition wall 433 is Parallel to 201135237, and disposed in the different columns 42A and the second column 42B, the two elastic structures 42 of the columns of the elastic structures 42 of the two columns 42A and the columns 42A, 42B, 42C can be prevented, for example, the first elastic structure 42 The elastic structures 42 of the partition walls 433, 42B are disposed to interfere with each other.
如圖4及圖5所示，將屏蔽導體431設計成有多個穿 孔431a’通常可將屏蔽導體431視為網狀，可使屏蔽導體 431與彈性結構42之間的電容值c變小，原因在於如公式 1所示：C=e(A/H)，其中A為屏蔽導體431的面積η為 屏蔽導體431與彈性結構42之間距離，當屏蔽導體431的 面積Α變小’屏蔽導體431與彈性結構42之間距離Η固 定’則電容值C也舍戀1 /丨、。A LU /Λ? 乜f變小在此，穿孔43 la的數量並沒有 特別限制，根據公式卜控制穿孔43U的數量而改變屏蔽 導體431的面積a ’即可設計出所需要的電容值c。 更進步而5 ’屏蔽結構43 1與彈性結構42之間的特 性阻抗z’可藉由改變屏蔽導體431與彈性結構42之間的 電容值C，調整特性阻抗Z，原因在於如公式2所示：z= ，（L/C) ’其中L為每—彈性結構42的線路電感，由於線 路電感L已然固定’而轉接基板41通常亦是規格化的產 〇〇因此貫際上僅剩電容值C可以作為調整特性阻抗Z的 變因。基於公式i，電容值C與屏蔽導體431的面積八成 正比關係，故而利用穿孔431a數量改變屏蔽導體431的面 積A可以改變電谷值c，進一步基於公式2，控制屏蔽結 構431與彈性結構42之間的阻抗z，達到阻抗匹配的效 果，因此可以使探針卡在高頻的測試環境下使用。 201135237 在溝槽蓋板43中，屏蔽導體43 1設置完成之後，係以 半導體製程或其他方式，形成絕緣結構432包覆屏蔽導體 431 ’例如在屏蔽導體431上以塗佈（coating)方式形成絕緣 '°構432 ’或在屏導體43 1以射出成型絕緣材料方式形 成絕緣結構432。以上逑製程製作的溝槽蓋板43可以非常 精‘確的控制各個溝槽43〇尺寸，即屏蔽導體431與彈性結 構42之間的距離非常容易控制，而且轉接基板41與溝槽As shown in FIG. 4 and FIG. 5, the shield conductor 431 is designed to have a plurality of through holes 431a'. Generally, the shield conductor 431 can be regarded as a mesh shape, so that the capacitance value c between the shield conductor 431 and the elastic structure 42 can be made small. The reason is as shown in Formula 1: C=e(A/H), where A is the area η of the shield conductor 431 is the distance between the shield conductor 431 and the elastic structure 42, when the area of the shield conductor 431 becomes smaller, the shield conductor The distance 431 between the 431 and the elastic structure 42 is fixed, and the capacitance value C is also reluctantly 1 / 丨. A LU /Λ? 乜f becomes smaller. Here, the number of the perforations 43 la is not particularly limited, and the required capacitance value c can be designed by changing the area a ' of the shield conductor 431 according to the number of the control perforations 43U. Further, the characteristic impedance z' between the 5' shield structure 43 1 and the elastic structure 42 can be adjusted by changing the capacitance value C between the shield conductor 431 and the elastic structure 42 because the equation Z is as shown in Equation 2. :z= , (L/C) 'where L is the line inductance of each elastic structure 42, since the line inductance L is already fixed' and the interposer substrate 41 is usually also a normalized production, so that only the remaining capacitance is continuously The value C can be used as a factor for adjusting the characteristic impedance Z. Based on the formula i, the capacitance value C is proportional to the area of the shield conductor 431. Therefore, by changing the area A of the shield conductor 431 by the number of the through holes 431a, the electric valley value c can be changed, and based on the formula 2, the shielding structure 431 and the elastic structure 42 are controlled. The impedance z between them achieves the effect of impedance matching, so the probe can be used in a high frequency test environment. 201135237 In the trench cover 43 , after the shield conductor 43 1 is disposed, the insulating structure 432 is formed in a semiconductor process or other manner to cover the shield conductor 431 ', for example, to form a coating on the shield conductor 431 by coating. The insulating structure 432 is formed in the screen conductor 43 1 by injection molding an insulating material. The trench cover 43 made by the above process can precisely control the size of each trench 43, that is, the distance between the shield conductor 431 and the elastic structure 42 is very easy to control, and the transfer substrate 41 and the trench are
蓋板43兩者屬於分離式結構，因此，不需要將屏蔽導體 431黏著在轉接基板41上，避免了圖2中彈性結構32與 屏蔽導體33的間隙無法控制精準的問題產生，也降低製程 的困難度。 圖6為本發明轉接板與電路板的組裝示意圖。其中轉 接板的架構以圖3a及圖3b為例作說明，但亦可以圖4為 '、〜又有特別的限制。請繼續參閱圖ό，轉接板40的架 構中與前文敘述圖3a及圖3b或者圖4相同，在此不再費 述。而轉接板40上方伤< 里竹μ 万係π置探針卡的電路板5〇，電路板 5〇下表面設置多個 鳊子墊50 1以分別抵接彈性結構42。在 進订待測物的測試時， 電路板5〇與測試機電連接，而探針 、探針（圖中未揭示）赴链 )點觸待測物的端子墊，以使電路板 50、彈性結構42到楛 双 _Λ 針形成測試路徑，其中，電路板50 的蠕子墊501藉由雷上 ,式俨號^ β 路板50的内部電路與測試機提供的測The cover plate 43 is of a separate structure. Therefore, it is not necessary to adhere the shield conductor 431 to the adapter substrate 41, thereby avoiding the problem that the gap between the elastic structure 32 and the shield conductor 33 in FIG. 2 cannot be accurately controlled, and the process is also reduced. The difficulty. Figure 6 is a schematic view showing the assembly of the adapter plate and the circuit board of the present invention. The structure of the transfer board is illustrated by taking FIG. 3a and FIG. 3b as an example, but FIG. 4 may also have a special limitation of ', ~. Referring to the drawings, the structure of the adapter plate 40 is the same as that of the foregoing description of Figs. 3a and 3b or Fig. 4, and will not be described herein. On the upper side of the adapter plate 40, a circuit board 5 is placed on the lower surface of the circuit board 5, and a plurality of mattress pads 50 1 are disposed on the lower surface of the circuit board 5 to abut the elastic structure 42 respectively. When the test of the test object is ordered, the circuit board 5〇 is electrically connected to the test, and the probe and the probe (not shown in the figure) are connected to the terminal pad of the object to be tested to make the circuit board 50 and elastic. The structure 42 to 楛 double _ Λ pin form a test path, wherein the creeper pad 501 of the circuit board 50 is provided by the internal circuit of the cymbal cymbal 50 and the tester by the tester
。式h唬、電源信號及 J φ 電位電連接。溝槽蓋板43設置在 電路板50與轉接基板41之間。 直在 為了維持彈性I士馗μ 〇上& 在傳遞高頻信號的特性阻抗，並 201135237. Type h唬, power signal and J φ potential electrical connection. The trench cover 43 is disposed between the circuit board 50 and the interposer substrate 41. Straight in order to maintain the elasticity of the impedance of the 馗 〇 && in transmitting the characteristic impedance of the high frequency signal, and 201135237
避免其他的信號干擾，屏蔽導體43丨的兩端需與接地電位 電連接，如圖6所示，溝槽蓋板43的上下表面分別設置接 地端子434、435與各屏蔽導體431 (請同時配合圖3a至圖 5)電連接’使得溝槽蓋板43中所有屏蔽導體43丨均電連接 至接地電位，以維持彈性結構42在傳遞高頻信號的特性阻 抗。接地端子434係接觸電路板5〇下表面的接地端子墊 502，而接地端子墊5 02藉由電路板50的内部電路5〇3與 測試機提供的接地電位電連接。接地端子435接觸轉接基 板41之表面410上的接地端子墊411，再藉由轉接基板y 的表面410或内部製作接地線路（圖中未揭示）與彈性結構 42電連接，此處與接地端子435電連接的彈性結構42係 接觸電路板50下表面的端子墊5〇1，再藉由電路板5〇的 内部電路與測試機提供的接地電位電連接。 贯明的徠針卞符傅固。馮了方也 說明’省略了溝槽蓋板的部分，而轉接板' 電路板及彈朽 結構等部分與圖6相同，故沿用圖6的圖號，且轉接板及 電路板之間的結構已於前文敘述’不再贅述。探針卡包招 一電路板50,下方依照順序為—轉接板糾及—探針模细 轉接板4G包含-轉接基板41 '多個彈性結構^及多 2焊結構44。轉接基板41的表面412設置多個迴辉結 藉由轉接基板41的内部電路使每-迴淳結構44分 接-個彈性結構42。探針模組⑼包含—基板以To avoid other signal interference, the two ends of the shield conductor 43 are electrically connected to the ground potential. As shown in FIG. 6, the upper and lower surfaces of the trench cover 43 are respectively provided with ground terminals 434 and 435 and shield conductors 431 (please cooperate at the same time). 3a to 5) electrically connect 'all of the shield conductors 43' in the trench cover 43 are electrically connected to ground potential to maintain the characteristic impedance of the resilient structure 42 in transmitting high frequency signals. The ground terminal 434 is in contact with the ground terminal pad 502 of the lower surface of the circuit board 5, and the ground terminal pad 502 is electrically connected to the ground potential provided by the tester by the internal circuit 5〇3 of the circuit board 50. The grounding terminal 435 contacts the grounding terminal pad 411 on the surface 410 of the interposer substrate 41, and is electrically connected to the elastic structure 42 by the surface 410 of the interposer substrate y or the internal grounding line (not shown). The elastic structure 42 electrically connected to the terminal 435 is in contact with the terminal pad 5〇1 on the lower surface of the circuit board 50, and is electrically connected to the ground potential provided by the testing machine by the internal circuit of the circuit board 5〇. Guan Ming's 徕 卞 傅 Fu Fu. Feng Fang also explained that 'the part of the groove cover is omitted, and the part of the adapter plate' circuit board and the structure of the structure is the same as that of FIG. 6, so the figure of FIG. 6 is used, and between the adapter plate and the circuit board. The structure has been described in the previous section 'No longer elaborate. The probe card package is a circuit board 50, and the lower portion is arranged in the order of the adapter plate. The probe die transfer plate 4G includes a plurality of elastic structures and a plurality of solder structures 44. The surface 412 of the interposer substrate 41 is provided with a plurality of refraction junctions. The inner circuit of the interposer substrate 41 separates the per-return structure 44 into an elastic structure 42. The probe module (9) includes a substrate
It針62’在基板61的上表面設置多個端子塾610,這 4子墊㈣分別對應㈣結構44，藉由迴谭作業將端子 12 201135237 塾610與迴焊結構44焊接，基板61的下表面設置多個探 針62 ’藉由基板61設置的内部電路使每一探針62分別電 連接一個端子墊610。而前文所述的溝槽蓋板則是設置在 電路板50及轉接基板41之間。 請參閱圖8 ’為本發明圖7實施例的製造流程圖。首 先，提供轉接基板41。接著，提供探針模組6〇，藉由迴焊 作業將探針模組60的端子墊6 1 0與迴焊結構44焊接，以The It pin 62' is provided with a plurality of terminals 610 on the upper surface of the substrate 61. The four sub-pads (4) respectively correspond to the (four) structure 44, and the terminal 12 201135237 塾 610 is soldered to the reflow structure 44 by the returning operation, and the substrate 61 is under the substrate 61. The surface is provided with a plurality of probes 62'. Each of the probes 62 is electrically connected to a terminal pad 610 by an internal circuit provided by the substrate 61. The trench cover as described above is disposed between the circuit board 50 and the interposer substrate 41. Please refer to FIG. 8 ' for the manufacturing flow chart of the embodiment of FIG. 7 of the present invention. First, the transfer substrate 41 is provided. Next, a probe module 6 is provided, and the terminal pad 6 1 0 of the probe module 60 is soldered to the reflow structure 44 by a reflow operation.
藉由基板61的内部電路、迴焊結構44，使探針62與彈性 …構42電連接。最後，提供電路板5〇，以組裝形成探針 卡，其中每一彈性結構42分別對應接觸一個端子墊5〇1。 請注意，就本發明而言，在將彈性結橼42與探針卡電路板 5〇的端子塾5(H ^者電連接之前，以將—溝槽蓋板設置 於的轉接基板的表面41G及電路板5Q之間，以維持彈 性結構42在傳遞高頻信號的特性阻抗，此部份請參閱圖 3 a至圖6的相關說明。 請參閱圖9’為本發明的另一探針卡的結構圖。大致 上圖9與圖7的實施例相同，惟圖7的實施例巾，將轉接 基板41的表面410及表面412的洲里， 衣囬的6又置位置互換。為了方便 δ明’省略了溝槽蓋板的部分 _ t 1一轉接板、電路板及多個 性結構等部分與圖7相同，故田 ,. J玟，口用圖7的圖號。探針卡 匕括一電路板5〇，下方昭 K序為—轉接板40及一探針 姨組60。電路板5〇下表 4〇 . ^ 衣面。又置夕個端子墊501。轉接板 匕3 一轉接基板41、多個彈 ^ 坪性結構42及多個迴焊結構 ，轉接基板41的表面412你-η·®合 係s又置多個迴焊結構44，這The probe 62 is electrically connected to the elastic member 42 by the internal circuit of the substrate 61 and the reflow structure 44. Finally, a circuit board 5 is provided to assemble the probe cards, wherein each of the elastic structures 42 respectively contacts a terminal pad 5〇1. Please note that, in the context of the present invention, the surface of the interposer substrate on which the trench cover is disposed before the electrical connection 42 is electrically connected to the terminal 塾 5 of the probe card circuit board 5 (H ^ ) 41G and the circuit board 5Q, in order to maintain the characteristic impedance of the elastic structure 42 in transmitting high-frequency signals, please refer to the relevant description of FIG. 3 a to FIG. 6 for this part. Please refer to FIG. 9' is another probe of the present invention. The structure of the card is substantially the same as that of the embodiment of Fig. 7. However, in the embodiment of Fig. 7, the surface of the substrate 410 and the surface 412 of the transfer substrate 41 are interchanged. It is convenient that δ ′′ omits the part of the trench cover _ t 1 - the adapter plate, the circuit board and the plurality of structures and the like are the same as in Fig. 7, so the field, the J 玟, the port with the figure number of Figure 7. Probe The card includes a circuit board 5〇, and the lower part of the circuit is the adapter plate 40 and a probe set 60. The circuit board 5 is shown in the following table 4. ^ The clothing surface is further provided with a terminal pad 501. The board 3 has a transfer substrate 41, a plurality of elastic structures 42 and a plurality of reflow structures, and the surface 412 of the transfer substrate 41 is provided with a plurality of reflow structures 4 4, this
Si 13 201135237 些迴焊結構44分別對應一電路板5〇的端子墊5〇1，以藉 由迴焊作業將端子墊510與迴焊結構46焊接，轉接基板 41的表面410設置多個彈性結構42。探針模組6〇包含一 基板6!及多個探針62，基板61上表面設置多個端子墊 6 1 0，這些端子墊6丨〇分別對應彈性結構，以在探針卡 組裝時互相接觸，基板61的下表面設置多個探針62，藉 由基板61設置的内部電路使每一探針62分別電連接一個 端子墊610。而前文所述的溝槽蓋板則是設置在轉接基板 41及基板61之間，此部份請參閱圖3a至圖5的相關說明。 請參閱圖10,為本發明圖9實施例的製造流程圖。首 先，提供轉接基板41。接著，提供電路板5〇,電路板5〇 上的端子墊5〇1藉由焊接該些迴焊結構佝，以使該些端子 塾sol分別電連接該些彈性結構42。最後，提供探針模組 6〇,以組裝形成探針卡’纟中彈性結構42分別對應接觸— 探針模組60的端子墊610,以藉由基板6】的内部電路、 彈性結構42，使探針62與迴焊結構料電連接。請注意， 就本發明而言，在將彈性結構42與探針模組⑼的端子墊 兩者電連接之刖’需先將一溝槽蓋板設置於的轉接基 板41的表面410及探針模組6〇之間，以維持彈性結構ο 在傳遞高紹t號的特性阻抗，此部份請參閱圖3a至圖5的 相關說明。 請參閱圖Ua至圖llc，為本發明探針卡的其他實施例 不意圖。探針卡由上而下的結構依次為探針卡電路板60、 轉接板結構7〇 '探針模組80。 14 201135237 以圖lla而言’轉接板結構70具有多個轉接基板η， 每一轉接基板71的表面710設有多個彈性結構72，而每 一轉接基板71的表面711設有多個迴焊結構η。探針模 組8〇具有多個基板81，各基板81設有多個探針82。此一 實施例可以便利於當個別的轉接基板71或探針模組的 基板81需要更換、保養、維修的情形。當然，而前文所述 的溝槽蓋板則是設置在轉接基板7 1及基板8丨之間。 以圖lib而言，轉接板結構70具有多個轉接基板71， 每一轉接基板71的表面710設有多個彈性結構72，.而每 一轉接基板71的表面711則設有多個迴焊結構73。探針 模組80具有單一個基板81，並在基板81設有多個探針 82»此一實施例可以便利於當個別的轉接基板71需要更 換、保養、維修的情形。 以圖11c而s，轉接板結構7〇具有單一個轉接基板 ，其表面710設有多個彈性結構72，而轉接基板71的 .表面7U則設有多個迴焊結構73。探針模組8〇具有多個 基板8卜各基板81設有多個探針82。此—實施例可以便 利於當個別的探針模纟且8 q的其k Q t$ 可倮殂su的基板81需要更換、保養、維 修的情形。 此外，® 1U至圖llc亦可結合圖7的實施例m 即在圖lla至圖11(：中，各轉 将接基板71以表面710朝上而 表面711朝下的方罢 δΧ °糟由轉接基板相對應的兩面 上’面βχ置彈性結構而另—面設置迴焊結構，以便於更 換轉接基板、探針模組、或是探針卡電路板。 15 201135237 上述實施例僅係為了方便說明而舉例，雖遭熟悉本技 «之人士任施匠思而為諸般修飾’然皆不脫如附申請專利 範圍所欲保護者。 【圖式簡單說明】 圖1 a，為習用的探針卡的剖視圖，· 圖lb’為另一種習用的探針卡的剖視圖 φ 圖2，為美國專利第20090224785號揭露之探針卡的 轉接基板立體示意圖； 圖3a ’為本發明轉接板的實施例示意圖； 圖3 b，為圖3 a的剖視圖； 圖4 ’為本發明轉接板的第二實施例示意圖； 圖5 ’為圖4的立體剖視圖； 圖6 ’為本發明轉接板與電路板的組裝示意圖； 圖7’為本發明的探針卡的結構圖； _ 圖8 ’為本發明圖7實施例的製造流程圖； 圖9 ’為本發明的探針卡另一實施例的結構圖； 圖10，為本發明圖9實施例的製造流程圖；以及 圖11a至圖iic ’為本發明轉接基板與探針模組之間的 搭配實施例示意圖。 【主要元件符號說明】 I 〇 :探針卡 II :探針卡電路板 t Si 16 201135237 110 :端子墊 12 :轉接板 120 :轉接基板 121、122 :彈性結構 13 :探針模組 131 :基板 132 :端子墊 133 :探針 20 :探針卡 21 :探針卡電路板 210 :端子墊 22 :轉接板 220 :轉接基板 2200 :信號線 221 :彈簧針 2210 :筒型外殼 2211 :彈簧 2212 :導體針 2213 ：針尖 2214 :開口端 30 :轉接板 31 :轉接基板 32 :彈性結構 33 :屏蔽導體 17 201135237 40 :轉接板 41 :轉接基板 410 :表面 411 :接地端子墊 412 :表面 42 :彈性結構 42A :第一列 42B :第二列 42C :第三列 43 :溝槽蓋板 430 :溝槽 431 :屏蔽導體 43 1a :穿孔 432 :絕緣結構 433 :隔間牆 434 :接地端子 435 :接地端子 50 :電路板 501 :端子墊 502 :接地端子墊 503 :内部電路 60 :探針模組 61 :基板 610 :端子墊 18 201135237 62 :探針 70 :轉接板結構 7 1 :轉接基板 710 :表面 711 :表面 72 :彈性結構 73 :迴焊結構 80 :探針模組 81 :基板 82 :探針The Si re-welding structure 44 corresponds to a terminal pad 5〇1 of a circuit board 5〇, respectively, to solder the terminal pad 510 and the reflow structure 46 by reflowing operation, and the surface 410 of the interposer substrate 41 is provided with multiple elasticity. Structure 42. The probe module 6A includes a substrate 6! and a plurality of probes 62. The upper surface of the substrate 61 is provided with a plurality of terminal pads 610. The terminal pads 6 对应 correspond to elastic structures respectively, so that the probe cards are assembled with each other. In contact, a plurality of probes 62 are disposed on the lower surface of the substrate 61, and each of the probes 62 is electrically connected to one terminal pad 610 by an internal circuit provided by the substrate 61. The trench cover plate described above is disposed between the interposer substrate 41 and the substrate 61. Please refer to the relevant description of FIG. 3a to FIG. Please refer to FIG. 10, which is a manufacturing flowchart of the embodiment of FIG. 9 of the present invention. First, the transfer substrate 41 is provided. Next, a circuit board 5A is provided, and the terminal pads 5〇1 on the circuit board 5〇 are soldered to the resilience structure 以 so that the terminals 塾sol are electrically connected to the elastic structures 42, respectively. Finally, the probe module 6〇 is provided to assemble and form the probe card 纟, wherein the elastic structure 42 corresponds to the terminal pad 610 of the contact-probe module 60, respectively, by the internal circuit of the substrate 6 and the elastic structure 42. The probe 62 is electrically connected to the reflow structure material. Please note that, in the present invention, after the elastic structure 42 and the terminal pads of the probe module (9) are electrically connected, the surface 410 of the interposer substrate 41 on which the trench cover is first disposed is required. Between the needle modules 6〇, to maintain the elastic structure ο in the transmission of the characteristic impedance of Gaoshao t, please refer to the relevant description of Figure 3a to Figure 5 for this part. Referring to Figures Ua through 11c, other embodiments of the probe card of the present invention are not intended. The structure of the probe card from top to bottom is the probe card circuit board 60 and the adapter plate structure 7 〇 'probe module 80. 14 201135237 In the case of FIG. 11a, the adapter plate structure 70 has a plurality of adapter substrates η, and the surface 710 of each of the adapter substrates 71 is provided with a plurality of elastic structures 72, and the surface 711 of each of the adapter substrates 71 is provided. Multiple reflow structures η. The probe module 8 has a plurality of substrates 81, and each of the substrates 81 is provided with a plurality of probes 82. This embodiment can facilitate the case where the individual transfer substrate 71 or the substrate 81 of the probe module needs to be replaced, maintained, or repaired. Of course, the trench cover plate described above is disposed between the interposer substrate 71 and the substrate 8A. In the figure lib, the adapter plate structure 70 has a plurality of adapter substrates 71. The surface 710 of each of the adapter substrates 71 is provided with a plurality of elastic structures 72. The surface 711 of each of the adapter substrates 71 is provided. A plurality of reflow structures 73. The probe module 80 has a single substrate 81 and a plurality of probes 82 are disposed on the substrate 81. This embodiment facilitates the replacement, maintenance, and maintenance of the individual adapter substrates 71. 11c, the adapter plate structure 7 has a single adapter substrate, the surface 710 of which is provided with a plurality of elastic structures 72, and the surface 7U of the adapter substrate 71 is provided with a plurality of reflow structures 73. The probe module 8 has a plurality of substrates 8 and each of the substrates 81 is provided with a plurality of probes 82. This embodiment can facilitate the replacement, maintenance, and maintenance of the substrate 81 of the individual probes and the substrate 81 of which k q t $ 倮殂su can be replaced. In addition, the ® 1U to FIG. 4c can also be combined with the embodiment m of FIG. 7 , that is, in FIG. 11a to FIG. 11 (:, each of the rotating substrates 71 is arranged with the surface 710 facing upward and the surface 711 facing downwards. The two sides of the adapter substrate are provided with a 'surface β elastic structure on the two sides and a reflow structure on the other side for the replacement of the adapter substrate, the probe module, or the probe card circuit board. 15 201135237 The above embodiment is only For the sake of explanation, for example, those who are familiar with the technology can modify it as if they want to use it. As for the scope of the patent application, the figure is intended to be protected. Figure lb' is a cross-sectional view of another conventional probe card. Figure 2 is a perspective view of the adapter substrate of the probe card disclosed in U.S. Patent No. 20090224785; Figure 3a' Figure 3b is a cross-sectional view of Figure 3a; Figure 4' is a schematic view of a second embodiment of the adapter plate of the present invention; Figure 5' is a perspective cross-sectional view of Figure 4; Schematic diagram of assembly of the board and the circuit board; Figure 7' is the invention Figure 8 is a manufacturing flowchart of the embodiment of Figure 7 of the present invention; Figure 9 is a structural view of another embodiment of the probe card of the present invention; Figure 10 is Figure 9 of the present invention The manufacturing flow chart of the embodiment; and FIG. 11a to FIG. 1ic are schematic diagrams of the matching embodiment between the adapter substrate and the probe module of the present invention. [Description of main component symbols] I 〇: probe card II: probe card Circuit board t Si 16 201135237 110 : terminal pad 12 : adapter plate 120 : adapter substrate 121 , 122 : elastic structure 13 : probe module 131 : substrate 132 : terminal pad 133 : probe 20 : probe card 21 : Probe card circuit board 210: terminal pad 22: adapter plate 220: adapter substrate 2200: signal line 221: spring pin 2210: cylindrical case 2211: spring 2212: conductor pin 2213: pin tip 2214: open end 30: transfer Plate 31: Adapter substrate 32: Elastic structure 33: Shield conductor 17 201135237 40: Adapter plate 41: Adapter substrate 410: Surface 411: Ground terminal pad 412: Surface 42: Elastic structure 42A: First column 42B: Second Column 42C: third column 43: trench cover 430: trench 431: shield conductor 43 1a: via 432: absolutely Edge structure 433: compartment wall 434: grounding terminal 435: grounding terminal 50: circuit board 501: terminal pad 502: grounding terminal pad 503: internal circuit 60: probe module 61: substrate 610: terminal pad 18 201135237 62: Needle 70: adapter plate structure 7 1 : adapter substrate 710 : surface 711 : surface 72 : elastic structure 73 : reflow structure 80 : probe module 81 : substrate 82 : probe