CN116990651A - Testing device for intelligent power module - Google Patents
Testing device for intelligent power module Download PDFInfo
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- CN116990651A CN116990651A CN202310780820.6A CN202310780820A CN116990651A CN 116990651 A CN116990651 A CN 116990651A CN 202310780820 A CN202310780820 A CN 202310780820A CN 116990651 A CN116990651 A CN 116990651A
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- 238000012360 testing method Methods 0.000 title claims abstract description 202
- 238000012546 transfer Methods 0.000 claims description 19
- 238000009529 body temperature measurement Methods 0.000 abstract description 18
- 230000008901 benefit Effects 0.000 abstract description 7
- 238000001514 detection method Methods 0.000 description 13
- 238000010586 diagram Methods 0.000 description 6
- 230000005611 electricity Effects 0.000 description 5
- 238000003466 welding Methods 0.000 description 3
- 230000008054 signal transmission Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2642—Testing semiconductor operation lifetime or reliability, e.g. by accelerated life tests
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- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention discloses a testing device for an intelligent power module, which comprises: the test board is provided with a first test surface and a second test surface, the first test surface and the second test surface are positioned on two opposite sides of the test board, and the first test surface is suitable for being connected with at least one of an IGBT and a freewheeling diode; the switching component is connected with the second test surface, a plug interface is formed on one side of the switching component, which is opposite to the test board, and the plug interface is suitable for being connected with pins of the intelligent power module in a pluggable manner. The testing device for the intelligent power module has the advantages of being convenient to assemble and disassemble, avoiding damage to the intelligent power module, being accurate in temperature measurement and the like.
Description
Technical Field
The invention relates to the technical field of semiconductor testing, in particular to a testing device for an intelligent power module.
Background
The testing device for the intelligent power module in the related art generally needs to weld the testing board and pins of the intelligent power module, and controls the intelligent power module to operate through the testing board, so as to simulate the working states of the intelligent power module under different working conditions and test the change conditions of the electrical performance waveforms and the shell temperature of the intelligent power module under different working conditions. However, since repeated welding and disassembly of the test board and the intelligent power module are required, not only is disassembly and assembly troublesome, but also the intelligent power module or the test board is easily damaged.
Disclosure of Invention
The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, an object of the present invention is to provide a testing device for an intelligent power module, which has the advantages of convenient disassembly and assembly, avoiding damage to the intelligent power module, and accurate temperature measurement.
In order to achieve the above object, according to an embodiment of the present invention, there is provided a test device for an intelligent power module, including: the test board is provided with a first test surface and a second test surface, the first test surface and the second test surface are positioned on two opposite sides of the test board, and the first test surface is suitable for being connected with at least one of an IGBT and a freewheeling diode; the switching component is connected with the second test surface, a plug interface is formed on one side of the switching component, which is opposite to the test board, and the plug interface is suitable for being connected with pins of the intelligent power module in a pluggable manner.
The testing device for the intelligent power module has the advantages of being convenient to assemble and disassemble, avoiding damage to the intelligent power module, being accurate in temperature measurement and the like.
According to some embodiments of the invention, the adapter assembly comprises: the adapter plate is connected with the second test surface; the adapter seat is connected with one side, facing away from the test board, of the adapter board, and the plug interface is constructed on one side, facing away from the adapter board, of the adapter seat; the thickness of the adapter seat is larger than that of the adapter plate.
According to some embodiments of the invention, the adapter assembly further comprises: the first adapter needle seat is connected between the second test surface and the adapter plate; the second adapter needle seat is connected between the second test surface and the adapter plate; the intelligent power module is provided with a first pin on one side of the adapter seat in the width direction, and the first pin is electrically connected with the first adapter seat through the adapter seat and the adapter plate; the intelligent power module is provided with a second pin on the other side of the width direction of the adapter seat, and the second pin is electrically connected with the second adapter seat through the adapter seat and the adapter plate.
According to some embodiments of the present invention, the first adapter seat has a plurality of first adapter pins, the plurality of first pins are arranged at intervals along the length direction of the adapter seat, and the plurality of first pins and the plurality of first adapter pins are electrically connected through the adapter plate in one-to-one correspondence; the second transfer needle seat is provided with a plurality of second transfer needles, the second pins are arranged in a plurality, the second pins are arranged at intervals along the length direction of the transfer seat, and the second pins and the second transfer needles are electrically connected through the transfer plates in a one-to-one correspondence.
According to some embodiments of the invention, the adapter plate is connected with a support column, the support column is abutted against the second test surface, and the first adapter seat, the second adapter seat and the support column are sequentially arranged at intervals along the width direction of the adapter seat.
According to some embodiments of the invention, the adapter plate is provided with a clamping groove, and one end of the support column, which is opposite to the second test surface, is inserted into the clamping groove.
According to some embodiments of the invention, the adapter is located between the second adapter hub and the support post in a width direction of the adapter.
According to some embodiments of the invention, a side of the adapter plate facing away from the test plate is provided with a plurality of test points, the test points and the adapter seat are arranged in a staggered manner in the width direction of the adapter seat, and the test points are used for detecting parameters of the intelligent functional module.
According to some embodiments of the invention, the testing device of the intelligent power module further comprises: a first heat sink adapted to be connected to a side of the at least one of the IGBT and the flywheel diode facing away from the test board for dissipating heat from the at least one of the IGBT and the flywheel diode; the second radiator is suitable for being connected with one side of the intelligent power module, which is opposite to the adapter seat, and is used for radiating heat for the intelligent power module.
According to some embodiments of the invention, the testing device of the intelligent power module further comprises: the first fixing piece and the second fixing piece penetrate through the second radiator, the intelligent power module is connected with the adapter seat, and the first fixing piece and the second fixing piece are respectively arranged on two opposite sides of the length direction of the adapter seat.
According to some embodiments of the invention, the testing device of the intelligent power module further comprises: the temperature measuring line is provided with a test hole, and the temperature measuring line extends into the test hole from one side of the second radiator, which is opposite to the intelligent power module, and is connected with the intelligent power module and used for testing the temperature of the intelligent power module.
According to some embodiments of the invention, the temperature measuring line is connected with the wall of the test hole; and/or the temperature measuring line is connected with one side of the second radiator, which faces the intelligent power module.
According to some embodiments of the invention, the at least one of the IGBT and the freewheeling diode is arranged offset from the transfer assembly in a length direction of the adaptor.
Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
The foregoing and/or additional aspects and advantages of the invention will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
fig. 1 is a schematic structural view of a test apparatus according to an embodiment of the present invention.
Fig. 2 is a schematic diagram of a structure of another view of the test apparatus according to the embodiment of the present invention.
FIG. 3 is a schematic diagram of the connection of a test device and an intelligent power module according to an embodiment of the present invention.
Fig. 4 is a schematic diagram of connection of a test device and another view of a smart power module according to an embodiment of the present invention.
Fig. 5 is a schematic structural view of an adapter plate of a test apparatus according to an embodiment of the present invention.
Fig. 6 is a schematic structural view of another view of the interposer of the test device according to an embodiment of the present invention.
Fig. 7 is a schematic diagram showing connection between an adapter plate and an adapter seat of a test apparatus according to an embodiment of the present invention.
Fig. 8 is a schematic connection diagram of the adapter plate, the adapter seat and the intelligent power module of the test apparatus according to the embodiment of the invention.
Fig. 9 is a schematic diagram of connection of the adapter plate, the adapter seat, the intelligent power module and the second heat sink of the test device according to the embodiment of the invention.
Reference numerals:
1. the testing device is used for the intelligent power module; 2. an intelligent power module;
100. a test board; 110. a first test surface; 120. a second test surface;
200. a switching component; 210. an adapter plate; 211. a clamping groove; 212. testing the point positions; 220. an adapter; 221. a plug interface; 230. a first adapter hub; 231. a first transfer needle; 240. a second adapter needle seat; 241. a second transfer needle;
300. a support column;
400. a first heat sink; 500. a second heat sink; 510. a test well;
600. a first fixing member; 610. a second fixing member;
700. a temperature measuring line;
800. a first pin; 810. a second pin;
900. an IGBT; 910. a freewheeling diode.
Detailed Description
Embodiments of the present invention will be described in detail below, by way of example with reference to the accompanying drawings.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention.
In the description of the invention, a "first feature" or "second feature" may include one or more of such features.
In the description of the present invention, "plurality" means two or more.
In the description of the invention, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, and may also include the first and second features not being in direct contact but being in contact with each other by another feature therebetween.
In the description of the invention, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature.
A test device 1 for an intelligent power module according to an embodiment of the present invention is described below with reference to the accompanying drawings.
As shown in fig. 1 to 9, a test apparatus 1 for an intelligent power module according to an embodiment of the present invention includes a test board 100 and a switching assembly 200.
The test board 100 has a first test surface 110 and a second test surface 120, the first test surface 110 and the second test surface 120 are located on opposite sides of the test board 100, the first test surface 110 is suitable for being connected with at least one of an IGBT (Insulated Gate Bipolar Transistor ) 900 and a freewheeling diode 910, the switching assembly 200 is connected with the second test surface 120, a plug interface 221 is configured on a side of the switching assembly 200 facing away from the test board 100, and the plug interface 221 is suitable for being connected with pins of the intelligent power module 2 in a pluggable manner.
Wherein the test board 100 may be a circuit board.
According to the test device 1 for the intelligent power module of the embodiment of the present invention, by providing the test board 100 with the first test surface 110 and the second test surface 120, the first test surface 110 and the second test surface 120 are located at opposite sides of the test board 100, the first test surface 110 is adapted to be connected with at least one of the IGBT900 and the freewheel diode 910, the switching assembly 200 is connected with the second test surface 120, and the intelligent power module 2 is connected with the switching assembly 200. The first test surface 110 and the second test surface 120 are opposite sides of the test board 100 in the thickness direction, that is, the IGBT900 and the freewheeling diode 910 may be separately disposed on opposite sides of the test board 100 in the thickness direction with the intelligent power module 2, so that the IGBT900 and the freewheeling diode 910 may be spaced apart from the intelligent power module 2 in the thickness direction of the test board 100, which not only can avoid the IGBT900 and the freewheeling diode 910 from position interference with the intelligent power module 2 when connected with the test board 100, but also can avoid temperature interference between the IGBT900 or the freewheeling diode 910 and the intelligent power module 2, and further avoid temperature rise values between the IGBT900 or the freewheeling diode 910 and the intelligent power module 2 from affecting each other, which is beneficial to improving the temperature measurement accuracy of the test device 1 on the intelligent power module 2, and simultaneously, also can improve the temperature measurement accuracy of the IGBT900 and the freewheeling diode 910 by the test device 1.
In addition, the plug interface 221 is constructed on one side of the switching assembly 200, which is opposite to the test board 100, and the plug interface 221 is suitable for being connected with pins of the intelligent power module 2 in a pluggable manner, so that the intelligent power module 2 and the switching assembly 200 do not need to be welded and fixed, and further the intelligent power module 2 is prevented from being damaged by welding, the intelligent power module 2 is protected, and the plug connection and disassembly between the intelligent power module 2 and the switching assembly 200 are more convenient and rapid, so that the intelligent power module 2 and the test board 100 are not damaged, the disassembly efficiency between the test board 100 and the intelligent power module 2 is improved, the testing efficiency of the intelligent power module 2 is improved, and the testing cost is reduced.
Therefore, the testing device 1 for the intelligent power module has the advantages of being convenient to assemble and disassemble, avoiding damage to the intelligent power module 2, being accurate in temperature measurement and the like.
In some embodiments of the present invention, as shown in fig. 1-4 and 7, the adapter assembly 200 includes an adapter plate 210 and an adapter seat 220.
The adaptor board 210 is connected to the second testing surface 120, the adaptor base 220 is connected to a side of the adaptor board 210 facing away from the testing board 100, and the plugging interface 221 is configured on a side of the adaptor base 220 facing away from the adaptor board 210.
The plug interfaces 221 may extend along the thickness direction of the adaptor 220, and the plug interfaces 221 may be plural, and the pins of the intelligent power module 2 may be correspondingly inserted into the plug interfaces 221 one by one, so as to fix the relative positions of the intelligent power module 2 and the adaptor assembly 200.
In addition, the adaptor 220 may also be provided with pins, and after the pins of the intelligent power module 2 are plugged into the plug interface 221 and electrically connected with the adaptor 220, the pins of the adaptor 220 may be electrically connected with the adaptor 210, so as to further realize electrical connection between the adaptor 220 and the adaptor 210, thereby realizing electrical conduction between the intelligent power module 2 and the adaptor 210. Alternatively, the plug interface 221 may penetrate through the adaptor 220 along the thickness direction of the adaptor 220, and the pins of the intelligent power module 2 may directly penetrate through the plug interface 221 to contact with the adaptor board 210 and electrically connect with the adaptor board.
Moreover, by setting the adapter plate 210 and the adapter seat 220, the adapter plate 210 can be mainly used for electrically connecting with the test board 100, and the adapter seat 220 can be mainly used for fixing the intelligent power module 2, so that the intelligent power module 2 and the adapter assembly 200 can be conveniently fixed together and electrically connected, that is, the relative positions of the intelligent power module 2 and the test board 100 can be conveniently fixed and electrically connected.
In addition, the thickness of the adaptor 220 is greater than that of the adaptor plate 210, it can be understood that the intelligent power module 2 and the adaptor assembly 200 are connected and fixed mainly through the pins of the intelligent power module 2 and the plug interfaces 221 on the adaptor 220, and the thickness of the adaptor 220 is set to be large, so that the depth of the plug interfaces 221 can be deep, the contact area of the pins of the intelligent power module 2 and the side walls of the plug interfaces 221 can be increased, the connection strength of the intelligent power module 2 and the adaptor 220 can be improved, the connection is more stable, the relative position between the intelligent power module 2 and the test board 100 is fixed more reliably, and the temperature measurement accuracy of the test board 100 to the intelligent power module 2 is further improved.
In some embodiments of the present invention, as shown in fig. 2 and 4, the adapter assembly 200 further includes a first adapter hub 230 and a second adapter hub 240.
The first adapter socket 230 is connected between the second test surface 120 and the adapter plate 210, and the second adapter socket 240 is connected between the second test surface 120 and the adapter plate 210.
The intelligent power module 2 has a first pin 800 at one side of the adaptor 220 in the width direction, and the first pin 800 is electrically connected with the first adaptor holder 230 through the adaptor 220 and the adaptor plate 210; the intelligent power module 2 has a second pin 810 at the other side of the width direction of the adaptor 220, and the second pin 810 is electrically connected with the second adaptor holder 240 through the adaptor 220 and the adaptor board 210.
Through setting up first transfer needle file 230 and second transfer needle file 240, first transfer needle file 230 and second transfer needle file 240 can draw forth the electricity tie point on the test board 100 respectively to be convenient for carry out the electricity with the electricity tie point on adapter board 210 and the test board 100 and connect more conveniently and can be spaced apart adapter board 210 and test board 100, avoid the position to interfere with other components and parts on adapter board 210 and the test board 100, be favorable to improving the security of electric connection. Moreover, the first adapter hub 230 and the second adapter hub 240 may be spaced apart, and thus the adapter plate 210 and the test plate 100 may be supported by the first adapter hub 230 and the second adapter hub 240, so that the adapter plate 210 and the test plate 100 are prevented from tilting or shaking, the stability of the relative position between the adapter plate 210 and the test plate 100 is further improved, and the stability of the relative position between the intelligent power module 2 and the test plate 100 is further improved.
Further, as shown in fig. 2 and fig. 4, the first adapter holder 230 has a plurality of first adapter pins 231, the first pins 800 are plural, the plurality of first pins 800 are disposed at intervals along the length direction of the adapter holder 220, and the plurality of first pins 800 are electrically connected to the plurality of first adapter pins 231 through the adapter plate 210 in a one-to-one correspondence. The second adapter socket 240 has a plurality of second adapter pins 241, the second pins 810 are plural, the second pins 810 are disposed along the length direction of the adapter socket 220 at intervals, and the second pins 810 are electrically connected to the second adapter pins 241 through the adapter plate 210 in a one-to-one correspondence.
For example, the number of first transfer needles 231 and the number of second transfer needles 241 may be the same or different.
The first pin 800 of the intelligent power module 2 is connected to one side of the adapter 220 and located on one side of the adapter board 210, the first adapter board 230 is located on the other side of the adapter board 210, that is, the first pin 800 and the first adapter pin 231 are located on opposite sides of the adapter board 210, and the first pin 800 and the first adapter pin 231 are electrically connected. In addition, the second pin 810 of the intelligent power module 2 is connected to the other side of the adaptor 220 and is adjacent to the middle portion of the adaptor board 210, the second adaptor pin seat 240 is located at the middle portion of the adaptor board 210 and is adjacent to the second pin 810, that is, the second pin 810 and the second adaptor pin 241 are located at the middle portion of the adaptor board 210, and the second pin 810 and the second adaptor pin 241 are electrically connected. This prevents the first pin 800 and the first switching pin 231 from being electrically connected to interfere with the second pin 810 and the second switching pin 241, thereby facilitating connection.
Like this, every first pin 800 can be connected with a first switching needle 231 electricity and carry out the transmission of signal of telecommunication, every second pin 810 can be connected with a second switching needle 241 electricity and carry out the transmission of signal of telecommunication, and then can avoid taking place to interfere between first pin 800 and the second pin 810, also can avoid taking place to interfere between a plurality of first pins 800 to and can avoid taking place to interfere between a plurality of second pins 810, can avoid taking place the short circuit between intelligent power module 2 and the test board 100 promptly, the electric connection is more reasonable.
In some embodiments of the present invention, as shown in fig. 2 and 4, the adapter plate 210 is connected with the support column 300, the support column 300 is stopped against the second test surface 120, and the first adapter pin holder 230, the second adapter pin holder 240 and the support column 300 are sequentially spaced apart along the width direction of the adapter seat 220.
Specifically, the first adapter hub 230 may be adjacent to one side edge in the width direction of the adapter 220, the support column 300 may be adjacent to the other side edge in the width direction of the adapter 220, and the second adapter hub 240 may be disposed between the first adapter hub 230 and the support column 300 and adjacent to the center in the width direction of the adapter 220.
By the arrangement, even if the first adapter hub 230 and the second adapter hub 240 are biased to one side of the adapter plate 210 in the width direction, the support column 300 can be supported between the other side of the adapter plate 210 in the width direction and the test plate 100, that is, the first adapter hub 230, the second adapter hub 240 and the support column 300 can jointly support the first adapter hub 230, the stability of the relative position between the adapter plate 210 and the test plate 100 is further improved, the adapter plate 210 is prevented from tilting or swaying relative to the test plate 100 more effectively, the electrical connection between the adapter plate 210 and the test plate 100 is more reliable, that is, the stability of the electrical connection between the intelligent power module 2 and the test plate 100 is improved, and the test is more accurate.
In some embodiments of the present invention, as shown in fig. 6-9, the adapter plate 210 is provided with a clamping groove 211, and an end of the support column 300 facing away from the second testing surface 120 is inserted into the clamping groove 211.
That is, the support column 300 and the adapter plate 210 may be separately disposed, and assembled between the adapter plate 210 and the test board 100 during testing, which is advantageous for simplifying the structure of the adapter plate 210, facilitating the processing and manufacturing of the adapter plate 210, and the adapter plate 210 and the support column 300 are conveniently assembled by plug connection, and meanwhile, the clamping groove 211 of the adapter plate 210 may pre-position the support column 300, thereby further simplifying the assembly steps between the support column 300 and the adapter plate 210.
In addition, the number of the clamping grooves 211 may be plural, for example, two clamping grooves 211 are arranged at intervals, and two protrusions may be configured at one end of the support column 300 opposite to the second testing surface 120 to respectively extend into the two clamping grooves 211, so that the rotation of the support column 300 relative to the adapter plate 210 can be avoided, and the stability of the relative position between the adapter plate 210 and the support column 300 is further improved.
In some embodiments of the present invention, as shown in fig. 2 and 4, the adapter 220 is located between the second adapter hub 240 and the support column 300 in the width direction of the adapter 220. Thus, the weight of the adapter 220 is prevented from being biased to the side of the support column 300, which is opposite to the second adapter 220, so that the stability of the support of the adapter plate 210 and the adapter 220 by the first adapter 230, the second adapter 240 and the support column 300 is higher, and the adapter 220 cannot interfere with the second adapter 240 and the support column 300 in the width direction, so that the layout is more reasonable and the assembly is convenient.
In some embodiments of the present invention, as shown in fig. 6 and fig. 7-9, a side of the interposer 210 facing away from the test board 100 has a plurality of test points 212, the test points 212 and the interposer 220 are arranged in a staggered manner in a width direction of the interposer 220, and the test points 212 are used to detect parameters of the intelligent power module 2.
For example, the test point 212 may be electrically connected with a detection device such as an oscilloscope, a resistance detection device, a current detection device or a voltage detection device, so as to electrically connect the oscilloscope, the resistance detection device, the current detection device or the voltage detection device with the test board 100, and the test point 212 may lead out a pin of the intelligent power module 2, that is, the electrical connection between the oscilloscope and the intelligent power module 2 is realized, so that the waveform, the resistance, the current or the voltage of the intelligent power module 2 can be tested by using the detection device such as the oscilloscope, the resistance detection device, the current detection device or the voltage detection device, so that the operation is more convenient, and the reliability of testing the intelligent power module 2 is higher.
Moreover, by arranging the test points 212 and the adaptor 220 in a staggered manner in the width direction of the adaptor 220, the distance between two adjacent test points 212 in the width direction of the adaptor 220 can be closer, so that not only can the position interference of the adjacent test points 212 be avoided, but also the occupied space of the plurality of test points 212 on the test board 100 can be reduced.
In some embodiments of the present invention, as shown in fig. 1, the testing device 1 of the smart power module further includes a first heat sink 400 and a second heat sink 500.
The first heat sink 400 is adapted to be connected to a side of at least one of the IGBT900 and the freewheel diode 910 facing away from the test board 100 for dissipating heat of at least one of the IGBT900 and the freewheel diode 910, and the second heat sink 500 is adapted to be connected to a side of the smart power module 2 facing away from the adaptor 220 for dissipating heat of the smart power module 2.
For example, the first radiator 400 may be connected to the IGBT900 and the flywheel diode 910 at the same time to radiate heat for the IGBT900 and the flywheel diode 910 at the same time, and the second radiator 500 and the intelligent power module 2 are connected to radiate heat for the intelligent power module 2, and by providing two radiators, and because the intelligent power module 2, the IGBT900 and the flywheel diode 910 are respectively disposed on opposite sides of the thickness direction of the test board 100, the first radiator 400 and the second radiator 500 may be disposed on opposite sides of the thickness direction of the test board 100, so that not only the heat radiation effect of the IGBT900, the flywheel diode 910 and the intelligent power module 2 can be improved, but also the temperature rise value between the IGBT900 or the flywheel diode 910 and the intelligent power module 2 is prevented from being affected by each other, and the accuracy of the temperature rise data detection of the intelligent power module 2 is further improved, and the accuracy of the temperature rise data detection of the IGBT900 and the flywheel diode 910 is also improved.
In some embodiments of the present invention, as shown in fig. 1, 3 and 9, the testing device 1 of the smart power module further includes a first fixing member 600 and a second fixing member 610.
The first fixing piece 600 and the second fixing piece 610 penetrate through the second radiator 500 and the intelligent power module 2 to be connected with the adapter 220, and the first fixing piece 600 and the second fixing piece 610 are respectively arranged on two opposite sides of the adapter 220 in the length direction.
Through setting up first mounting 600 and second mounting 610, not only can connect second radiator 500 and intelligent power module 2 fixedly, but also can further fix adapter 220 and intelligent power module 2's relative position, do benefit to the connection stability between adapter 220 and the intelligent power module 2, can improve the connection stability between test board 100 and the intelligent power module 2, avoided taking place the offset between test board 100 and the intelligent power module 2 more effectively, it is more stable to connect, make testing arrangement 1 simultaneously higher to intelligent power module 2's temperature measurement accuracy.
And, by separately arranging the first fixing member 600 and the second fixing member 610 on opposite sides of the length direction of the adapter 220, the first fastening member and the second fastening member can be arranged at intervals, and the first fastening member and the second fastening member can respectively fix the opposite sides of the length direction of the adapter 220, so that the fixing effect is better.
In some embodiments of the present invention, as shown in fig. 1-4, the testing device 1 of the intelligent power module further comprises a temperature measurement line 700.
The second heat sink 500 has a test hole 510, and the temperature measurement line 700 extends into the test hole 510 from a side of the second heat sink 500 facing away from the intelligent power module 2 and is connected to the intelligent power module 2 for testing the temperature of the intelligent power module 2. Thus, one end of the temperature measuring wire 700 can be contacted with the intelligent power module 2 to test the temperature of the intelligent power module 2, and the other end of the temperature measuring wire 700 can be connected with equipment such as a thermometer after extending out of the temperature measuring hole to display the temperature of the intelligent power module 2.
In some embodiments of the present invention, as shown in fig. 3 and 4, the temperature measuring wire 700 is connected to the hole wall of the test hole 510, for example, one end of the temperature measuring wire 700 may be fixed to the side wall of the test hole 510 by welding, bonding or other connection methods, and the length of the temperature measuring wire 700 in the test hole 510 may be reserved longer, so that the temperature measuring wire 700 may be bent in the test hole 510, that is, the length of the temperature measuring wire 700 in the test hole 510 is redundant, the temperature measuring wire 700 may be bent towards a direction close to the intelligent power module 2, so that the bent temperature measuring wire 700 may contact the intelligent power module 2, so that the temperature of the intelligent power module 2 may be directly detected by using the temperature measuring wire 700, and thus, the connection between the temperature measuring wire 700 and the test hole 510 is simpler, and the connection between the temperature measuring wire 700 and the intelligent power module 2 is not required, and the disassembly of the temperature measuring wire 700 and the intelligent power module 2 is not required, so as to avoid the intelligent power module 2 from being damaged.
In other embodiments of the present invention, the temperature measurement line 700 is connected to the side of the second heat sink 500 facing the intelligent power module 2, i.e. the temperature measurement line 700 is connected to the side of the second heat sink 500 facing the intelligent power module 2, and after the second heat sink 500 and the intelligent power module 2 clamp one end of the temperature measurement line 700, it is ensured that the one end of the temperature measurement line 700 can be in stable contact with the intelligent power module 2, so that not only is the connection between the temperature measurement line 700 and the second heat sink 500 simpler, but also the temperature measurement line 700 does not need to be connected to the intelligent power module 2, and meanwhile, the contact stability between the temperature measurement line 700 and the intelligent power module 2 can be improved, and the reliability of detecting the temperature of the intelligent power module 2 by the temperature measurement line 700 is further improved.
In some embodiments of the present invention, as shown in fig. 1, at least one of the IGBT900 and the flywheel diode 910 is offset from the adaptor assembly 200 in the length direction of the adaptor base 220.
For example, the freewheeling diode 910, the IGBT900 and the adapting assembly 200 may be sequentially arranged along the length direction of the adapting base 220, so that after the intelligent power module 2 is connected with the adapting base 220, the freewheeling diode 910, the IGBT900 and the intelligent power module 2 may also be sequentially arranged along the length direction of the adapting base 220, so that position interference of the IGBT900, the freewheeling diode 910 and the adapting assembly 200 may be avoided, position interference of the IGBT900, the freewheeling diode 910 and the intelligent power module 2 may also be avoided, assembly is facilitated, and the test board 100 is conveniently connected with the IGBT900, the freewheeling diode 910 and the intelligent power module 2 at the same time, so that the IGBT900, the freewheeling diode 910 and the intelligent power module 2 may be tested at the same time, and the test efficiency is higher.
Other constructions and operations of the test device 1 for intelligent power modules according to embodiments of the present invention are known to those skilled in the art and will not be described in detail herein.
In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the invention, the scope of which is defined by the claims and their equivalents.
Claims (13)
1. A test device for an intelligent power module, comprising:
the test board is provided with a first test surface and a second test surface, the first test surface and the second test surface are positioned on two opposite sides of the test board, and the first test surface is suitable for being connected with at least one of an IGBT and a freewheeling diode;
the switching component is connected with the second test surface, a plug interface is formed on one side of the switching component, which is opposite to the test board, and the plug interface is suitable for being connected with pins of the intelligent power module in a pluggable manner.
2. The smart power module testing apparatus of claim 1, wherein the adapter assembly comprises:
the adapter plate is connected with the second test surface;
the adapter seat is connected with one side, facing away from the test board, of the adapter board, and the plug interface is constructed on one side, facing away from the adapter board, of the adapter seat;
the thickness of the adapter seat is larger than that of the adapter plate.
3. The smart power module testing apparatus of claim 2, wherein the adapter assembly further comprises:
the first adapter needle seat is connected between the second test surface and the adapter plate;
the second adapter needle seat is connected between the second test surface and the adapter plate;
the intelligent power module is provided with a first pin on one side of the adapter seat in the width direction, and the first pin is electrically connected with the first adapter seat through the adapter seat and the adapter plate;
the intelligent power module is provided with a second pin on the other side of the width direction of the adapter seat, and the second pin is electrically connected with the second adapter seat through the adapter seat and the adapter plate.
4. The testing device of the intelligent power module according to claim 3, wherein the first adapter seat is provided with a plurality of first adapter pins, the plurality of first pins are arranged at intervals along the length direction of the adapter seat, and the plurality of first pins and the plurality of first adapter pins are electrically connected through the adapter plate in a one-to-one correspondence;
the second transfer needle seat is provided with a plurality of second transfer needles, the second pins are arranged in a plurality, the second pins are arranged at intervals along the length direction of the transfer seat, and the second pins and the second transfer needles are electrically connected through the transfer plates in a one-to-one correspondence.
5. The testing device of the intelligent power module according to claim 3, wherein the adapter plate is connected with a support column, the support column is stopped against the second testing surface, and the first adapter seat, the second adapter seat and the support column are sequentially arranged at intervals along the width direction of the adapter seat.
6. The testing device of the intelligent power module according to claim 5, wherein the adapter plate is provided with a clamping groove, and one end of the support column, which is opposite to the second testing surface, is inserted into the clamping groove.
7. The device for testing a smart power module as recited in claim 5, wherein the adapter is located between the second adapter seat and the support column in a width direction of the adapter.
8. The testing device of the intelligent power module according to claim 2, wherein a side of the adapter plate, which is opposite to the testing plate, is provided with a plurality of testing points, the testing points and the adapter seat are arranged in a staggered manner in the width direction of the adapter seat, and the testing points are used for detecting parameters of the intelligent power module.
9. The smart power module testing apparatus of claim 2, further comprising:
a first heat sink adapted to be connected to a side of the at least one of the IGBT and the flywheel diode facing away from the test board for dissipating heat from the at least one of the IGBT and the flywheel diode;
the second radiator is suitable for being connected with one side of the intelligent power module, which is opposite to the adapter seat, and is used for radiating heat for the intelligent power module.
10. The smart power module testing apparatus of claim 9, further comprising:
the first fixing piece and the second fixing piece penetrate through the second radiator, the intelligent power module is connected with the adapter seat, and the first fixing piece and the second fixing piece are respectively arranged on two opposite sides of the length direction of the adapter seat.
11. The smart power module testing apparatus of claim 9, further comprising:
the temperature measuring line is provided with a test hole, and the temperature measuring line extends into the test hole from one side of the second radiator, which is opposite to the intelligent power module, and is connected with the intelligent power module and used for testing the temperature of the intelligent power module.
12. The intelligent power module testing apparatus of claim 11, wherein the temperature measuring line is connected with a wall of the testing hole; and/or
And the temperature measuring line is connected with one side, facing the intelligent power module, of the second radiator.
13. The testing device of an intelligent power module according to any one of claims 1-12, wherein the at least one of the IGBT and the freewheel diode is arranged offset from the adapter assembly in a length direction of the adapter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310780820.6A CN116990651A (en) | 2023-06-28 | 2023-06-28 | Testing device for intelligent power module |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310780820.6A CN116990651A (en) | 2023-06-28 | 2023-06-28 | Testing device for intelligent power module |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112611962A (en) * | 2020-12-31 | 2021-04-06 | 麦格纳电子（张家港）有限公司 | Testing device for electronic element on circuit board |
| CN215833546U (en) * | 2021-06-10 | 2022-02-15 | 绍兴中芯集成电路制造股份有限公司 | Semiconductor power module switching test structure |
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- 2023-06-28 CN CN202310780820.6A patent/CN116990651A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112611962A (en) * | 2020-12-31 | 2021-04-06 | 麦格纳电子（张家港）有限公司 | Testing device for electronic element on circuit board |
| CN215833546U (en) * | 2021-06-10 | 2022-02-15 | 绍兴中芯集成电路制造股份有限公司 | Semiconductor power module switching test structure |
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