TW201033601A - Vision inspection apparatus - Google Patents

Vision inspection apparatus Download PDF

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Publication number
TW201033601A
TW201033601A TW099106198A TW99106198A TW201033601A TW 201033601 A TW201033601 A TW 201033601A TW 099106198 A TW099106198 A TW 099106198A TW 99106198 A TW99106198 A TW 99106198A TW 201033601 A TW201033601 A TW 201033601A
Authority
TW
Taiwan
Prior art keywords
tray
unit
visual inspection
electronic components
trays
Prior art date
Application number
TW099106198A
Other languages
Chinese (zh)
Other versions
TWI448680B (en
Inventor
Hong-Jun Yoo
Woon-Joung Yoon
Original Assignee
Jt Corp
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Publication date
Application filed by Jt Corp filed Critical Jt Corp
Publication of TW201033601A publication Critical patent/TW201033601A/en
Application granted granted Critical
Publication of TWI448680B publication Critical patent/TWI448680B/en

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Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01Arrangements or apparatus for facilitating the optical investigation
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/89Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67271Sorting devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67288Monitoring of warpage, curvature, damage, defects or the like

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  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Analytical Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Textile Engineering (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

Disclosed is a vision inspection apparatus, and particularly, to a vision inspection apparatus capable of inspecting external appearance of electronic components stacked on trays. The vision inspection apparatus comprises: two or more trays loaded with electronic components thereon; a vision inspection unit for vision-inspecting the electronic components loaded in the trays; and a dumping unit for exchanging good products and bad products with each other between the trays according to a result of the vision inspection, wherein the dumping unit places good electronic component in one or more trays, and places bad electronic component in the remained one or more trays.

Description

201033601 六、發明說明: 【發明所屬之技術領域】 本發明係關於—種視覺檢測設備,尤其係種能夠檢測 裝載於托盤之中的電子元件之外觀的視覺檢測設備。 【先前技術】 電子元件,例如半導體封裝在製造過程中或被投入市場以 前,將經過如電職及外·試等各種不_職,藉以提高成 品率並增加產品的可靠性。 例如,料體封裝可透_晶圓上的製造製程、切割製程及 封裝製程等多個製程加以製造。如果不理會半導體裝置中的缺陷 而後續製程仍被非必要地加以執行,則會使整個製造成本增大。 為了避免這-問題,上述測試係於主要製程之前進行藉以選擇合 格的電子元件。織’這些選出的合格的電子元件練歷後續製 程。 大多數的電子元件在被投入到市場中之前都要經過每一種測 〇 試。因此,僅有合格的電子元件才能出現在市場上,進而提高了 產品的可靠性。 視覺檢測設備用以當其上裝載有電子元件之托盤沿著一導軌。 上下移動時執行視覺檢測,並且一攝像機可沿向右及向左之方向 移動藉以檢測裝載於托盤中的電子元件。由於檢測係於裝載有電 子元件之托盤被傳送時進行,因此裝載於托盤中的電子元件之位 201033601 置會由於托盤之容納槽内的電子元件之間的公差而發生變化。因 此,當測量電子元件之位置時會產生缺陷。下面將更加詳細地對 此進行說明。 第1圖」為習知技術的視覺檢測設備之一實例之平面圖。 如第1圖」所示,習知的用以檢測電子元件之外觀的視覺 檢測設備包含:絲裝鮮元1 ,制以沿著導執la裝載其上裝 載有電子轉之托盤5 ;攝像機2,侧以對已被拾取n 6傳送之 電子元件進行概制;拾取!I 7,制以傳送電子元件藉以將完 全經過視覺檢測之電子元件進行分類;托盤傳送裝置(附圖中未 示出)’係用以傳送托盤5 ;分類單元4,係用以沿著導軌如自動 地傳送托盤5。 然而,習知的視覺檢測設備必須配設有用以自動傳送托盤之 托盤傳送裝置,並且托盤裝載單元丨及分類單元4必須分別配設 φ 有導軌la&4a。同時’在視覺檢測之後必須額外地配設分類裝置, 例如包含有額外的拾取II 7之分鮮元4。如此會導致整體結構過 於複雜’並且會使製造成本過於高昂。 在大批量生產電子元件之情況下,可以採用習知的視覺檢測 ;設備。然而,當昂貴的視覺檢測設備被用於生產少量的電子元件 '之時’整體的製造成本會增大進而會降低生產率。 此外,習知的視覺檢測設備會由於其複雜的結構及較大的尺 寸而佔據相對較大的安裝空間。 5 201033601 為了提岗電子元件之製程的可靠性,視覺檢測設備係安裝於 淨化室中,在淨化室中,可最大化地清除灰塵等物質。如果視覺 檢測設備的尺寸增大,那麼其在淨化室内所佔據的面積也會增 大。如此會降低單位面積上的電子元件之生產量。 習知的視覺檢測設備係透過獲取裝載於托盤5中的電子元件 之影像並於齡析顺取之影像純行視覺酬。這裡, 電子元件之影像係透過沿著導軌在「第〗圖」中的向上及向下方 向上移動托盤5,並透過向右及向左移動攝像機2而獲得。 當托盤5被傳送時,電子元件會由於托盤5之容納槽内的電 子元件之間的公差而發生微小的移動。如此會改變電子元件之位 置’進而導致在測#電子元件之精雜置時發生聽,或者導致 未測量出電子元件之準確位置。因此,會使視覺檢測之可靠性降 低’或使視覺檢測無法順利地進行。 【發明内容】 因此,鑒於上述問題,本發明之一目的在於提供一種能夠透 過簡化整體結構減小所占面積並能夠減少製造成本之視覺檢測設 備。 本發明之另一目的在於提供一種能夠使傳送托盤及電子元件— 之構造最小化進而大大地減少製造成本及尺寸之視覺檢測設備。 為了獲得本發明的這些及其它優點且依照本發明之目的,現 對本發明作具體化和概括性地描述,本發明所提供之一種視覺檢 201033601 肩J«又備係包含.兩個或者多個其上裝載有電子元件之托盤;視 覺檢測單元’係用以對裝載於托盤中的電子元件進行視覺檢測; 以及傾#丨單元’係用以依據視覺檢測之結果在托盤之間將合格產 印與不合格產品相互交換,其中傾倒單元係將合格的電子元件放 置於一個或多個托盤中,並將不合格的電子元件放置於剩下的一 個或多個托盤中。 視覺檢測單元及傾倒單元可被獨立地加以驅動,或者可透過 ® 被固定至至少-個軸桿上而彼此相互配合。 傾倒單元可包含複數個用以拾取和放置電子元件之拾取器。 本發明之另一方面在於提供一種視覺檢測設備,係包含:複 數個第一托盤安裝單元,係用以分別安裝其上裝載有電子元件之 托盤·’一個或多個第二托盤安裝單元,係用以安裝空的托盤;視 覺檢測單元,係用以對裝載於托盤中的電子元件進行視覺檢測; ❿以及傾倒單元,係用以依據視覺檢測之結果將合格及不合格的電 子元件分類至第一及第二托盤安裝單元中的至少一個托盤安裝單 元中。 傾倒單元可配置成將合格的電子元件放置到第一托盤安裝單 :元的一個或多個托盤之上,並可將不合格的電子元件放置到第二 i托盤安裝單元的空托盤之上。 傾倒單元也可配置成將不合格的電子元件放置到第一托盤安 裝單元的一個或多個托盤之上,並可將合格的電子元件放置到第 7 201033601 二托盤安裝單元的空托盤之上。 傾倒單元還可配置成將合格的電子元件放置到第一托盤安裝 單兀的一個或多個托盤之上,並可將不合格的電子元件放置到剩 餘的第一托盤安裝單元的一個或多個托盤之上。 傾倒單元還可配置成將合格的電子元件放置到第二托盤安裝 單7L的一個或多個托盤之上,並可將不合格的電子元件放置到剩 餘的第二托盤安裝單元的一個或多個托盤之上。 視覺檢測設備還可包含:一個或多個第一托盤堆疊單元,係參 用以在其上堆疊裝載有電子元件之托盤;一個或多個第二托盤堆 4單元,係用以在其上堆疊空的托盤;一個或多個合格品托盤堆 疊單元,係用以在其上堆疊裝載有合格的電子元件之托盤;一個 或多個廢品鋪堆疊單元,伽以在其上堆4裝載有不合格的電 子兀*件之托盤;以及托盤傳送單元,係用以在第一托盤安裝單元、 第二托盤安裝單元、第-托盤堆疊單元、第二托盤堆叠單元、合 格品托盤堆疊單元及廢品托盤堆疊單元之間傳送托盤。 © 本發明之另—方面還在於提供—種視覺檢測設備,係包含: -個或多個第—托盤安裝單元,係用以安裝—個或多個其上襄载 有電子元件之托細騰視覺第―檢醉元,係包含有用 以對裝載於第-托齡裝單狀托財的電子 檢測之第一視覺檢測單元;倒轉單元,係用以接收已完 一視覺檢測之托盤,並將裝載於托盤中的電子元件倒置;兩個或 I 8 201033601 多個第托盤文裝單元,係用以安裝被倒轉單元倒置的托盤;第 二視覺檢解元,個崎裝載於第二減絲單元之托盤中的 ,電子元件進行第二滅_ ;第二_單元,餘含有用以在第 視覺^帛彳之後依據第—及帛二視覺檢測之絲將裝載於第二托 盤女裝單70之托盤中的電子元件劃分成合格及不合格之電子產品 :傾倒單元;以及托盤傳送單元,伽以在第一檢測單元、倒轉 單元及第二檢測單元之間傳送托盤。 倒轉單7〇可包含有:托盤拾取單元,制以在倒置托盤之前 杧取倒置的托盤;以及倒轉裝f,係用以在被托盤傳送單元傳送 的托盤上·被托盤拾取單元拾取的滅,並於隨後將相重疊的 -對托盤倒轉,藉以使裝載於托盤中的電子元件倒置。 第二檢測單元之第二托盤安褒單元可包含有:一個或多個第 子把盤安裝單兀’係用以在從倒轉單元接收托盤之後進行第二 _視覺檢測;以及_個或多個第二子托盤安裝單元,_以在從第 一子托盤絲單元魏經料二視覺檢狀減後,依據第一及 第一視覺檢測之結果透過傾倒單元對電子元件進行分類。 第-子托盤安裝單元可設置於第一檢測單元與接近於第一檢 -測單元之第二子托盤安裝單元之間。 : 第H托餘裝單元巾的每-個減絲單元可在垂直 於第-及第二檢測單元之排列方向的方向上設置成複數個。 第二托盤安裝單元可配置成使得電子元件能夠在第二視覺檢 9 201033601 由傾倒單元被加以分 測之後依據第-及第二視覺―之結果藉 類。 本發明之視覺檢測設傷可 ^ Γ進一步包含托盤堆疊單元,係用以 將托盤供辑-鋪物元账_繼或者用以 將托盤堆疊於其之上。 托盤堆疊單元可包含有:第一 _ 乐托盤堆疊早7L,係用以將托盤 供應至第一托盤安裝單元;第二把盤堆疊單元,係用以將空的托 盤堆叠於其之上;以及第三托盤堆4單元,伽以在其上堆叠已 經過第二視覺檢測之托盤。 托盤安裝單元可位於第一及第二托盤安裝單元之下方,並且 托盤傳送單元可包含χ·ζ方向機器人或仰2機器人。 本發明之視覺檢測設備可具有如下優點: 第-,由於視覺檢_於兩個❹健上裝财複數個電子 元件之托盤湘定之狀態下進行,且隨後可依據視覺檢測之結果 將合格與不合格的電子元件分類至各個托盤。如此可簡化整體結 構並使視覺檢測設備最小化。 第二,由於視覺檢測設備之尺寸較小因而製造成本被減少, 並且安裝空間也被縮小。因此,用於生產電子元件之整體空間可 被有效地加以利用。 第三,由於視覺檢測設備具有較小的尺寸,因此單位面積上 的電子元件之生產量可以被大大地提高。 201033601 第四’由於視覺檢測係僅僅透過飾視覺侧單元之攝像機 來加以執行’而無需移動待進行視覺檢測之電子元件,因而電子 元件可被穩疋祕持並且視覺檢測可被_地執行。如此能夠提 南視覺檢測之可靠性,並使得視覺檢測可以被更加順暢地加以執 行。 本發明之刚述及其他的目的、特徵、形態及優點將結合圖示 部分在如下的本發明之詳細說明中更清楚地加以闊述。 © 【實施方式】 現在,將結合圖示部分對本發明進行詳細說明。 下面,將結合附圖進一步詳細說明本發明之視覺檢測設備。 「第2圖」為本發明第一實施例之視覺檢測設備之立體圖, 並且「第3A圖」至「第3C圖」為「第2圖」之視覺檢測設備之 運行平面圖。 φ 如「第2圖」所示,本發明第一實施例之視覺檢測設備包含: 主體100 ;兩個或多個安裝至托盤安裝單元110之托盤20,托盤 安裝單元110係固定安裝於主體1〇〇中,並且托盤2〇之上裝載有 電子兀件10藉以進行視覺檢測;視覺檢測單元300,係用以對裝 ,載於托盤20中的電子元件1〇進行視覺檢測;以及傾倒單元, '係用以在托盤20之間相互交換合格及不合格的電子元件10。 待進行視覺檢測的電子元件10可包含需要進行視覺檢測之各 種類型的物體’例如,包含PGA、BGA等的積體電路晶片之半導 11 201033601 體封裝’如DDI、PCBs等之應用晶片。 托盤20用以在其之上裝載複數個電子元件1〇,並運送電子元 件。托盤20可根據電子元件1〇之類型具有各種不同的尺寸和 結構’並且可沿水平及垂直方向具有容納槽,容納槽之中用以容 納電子元件。 ❿ 其中配設絲有各元件之主體⑽可包含有似形成一上表 面之頂板部分ίο卜以及用以支撐頂板部分1〇1之支標部分1〇2。 並且’主體100可具有各種不同的結構,其中包含框架結構。 如「第2圖」所示,托盤安裝單元11〇可包含複數個導引構 件111,係固定安裝於主體100之頂板部分1〇1之上,並且構成沿 橫向支揮托盤20。此處,托盤安裝單元11〇之托盤2〇可於視覺檢 測之後透過操作者之手動製程由其它托盤2〇加以替換。 ❿ 視覺檢測單元3〇〇係為透過獲取電子元件⑴之頂部表面、底 部表面等之外部影像’並透過根據所獲取之影像的分析結果檢測 電子7G件1G之外觀來對電子树1G進行視覺_的設備。視覺 檢測單元_可包含影像獲取裝置(關巾未Μ ),如攝像機, 以及影像分析裝置(附圖中未示出)。 視覺檢測單元300係安裝於續丨⑻之中 杠般也肚精以於移動上述 托盤女裝k m之_捉裝·鋪2G中的電子 像。如「第2圖」所示,視覺檢測單元雇可安裝於x人》 320之中藉以能夠沿χ及γ方向移動。 機器人 12 201033601 在主體100中係安裝有用以在視覺檢測後拾取電子元件10並 將所拾取的電子it件K)傳送至其它托盤2G,以及肋在托盤2〇 之間相互父換合格及不合格的電子元件IQ之傾倒單元2〇〇。 傾倒單元200可具有用來拾取和放置電子元件1〇之各種構 造。例如,傾倒單元200可包含具有吸頭(附圖中未示出)及用 以上下移動吸頭的上下驅動裝置之傾倒單元21〇,其中吸頭係透過 形成真空壓力來拾取電子元件1〇。 > 傾倒單兀210必須執行用於從一個托盤2〇中拾取電子元件忉 之拾取功能,以制於將拾取的電子元件1G放置剌-托盤 中的放置功能。因此,傾倒單元21〇必須配設有兩個或多個拾取 器扣。然而’考慮到製造成本及簡化結構,其優選為安裝兩個拾 取器211。 傾倒單元210之兩個拾取n 211中的一個拾取器可從一個托 盤财拾取電子元件1〇,並於隨後移動到其上裝載有將要被替換 的電子元件10之另-托盤2()處。接下來,傾解元21〇中的另 一個拾取H 2Π可拾取將要被之電子元件1Q,並於隨後將第 一次拾取的電子元件1G放置到另—托盤2G之上。這些操作可重 ^ 複地進行。 與視覺檢測單元300相同,傾倒單元21〇係安裝於主體⑽ 之中藉以當移動上述托盤安裝單元11〇之時可傳送裝載於托盤如 中的電子元件10。如「第2圖」所示,傾倒單元2ι〇可被安裝於 13 201033601 x-Y機器人3 2 0之中藉以能夠沿χ及γ方向移動。 、視覺制單元及_單元⑽可被蚊到—個轴桿上, 並且可彼此相互配合或獨立地加以操作。 、較佳地來說’托盤安裝單元11G係安裝為兩個或多個_於· 視覺檢測及▲被確定為不合格產品之電子元件ι〇//。托盤安裝 單元110可依據操作方法具有各種不同的構造。 如「第3A圖」所示’每一托盤安裝單元11〇係用於安裳其上 裝載有電子元件10之托盤20藉以進行視覺檢測。如「第3b圖」❹ 及「第3C圖」所示,為了在視覺檢測之後透過在托盤2〇之間交 換電子元件ίο以劃分合格的電子元件1〇 (「第3A圖」至「第3c 圖」中的"G〃)及不合格的電子元件1〇 (「第3A圖」至「第3c 圖」中的"R"),僅有合格的電子元件1〇⑹可被裝載於托盤安 裝單το 110之托盤20中,且僅有不合格的電子元件1〇 (R)可被 裝載到剩下的托盤安裝單元11〇之剩餘托盤2〇中。 例如,如「第2圖」至「第3C圖」中所示,設置有兩個托盤⑩ 安裝單元110。並且,其可配置為在視覺檢測之後透過傾倒單元 210之交換製程使得僅有合格的電子元件1〇(G)係被裝載於左側 的托盤20中’而僅有不合格的電子元件1〇 (R)係被裝載到右側 的托盤20中。 也就是說’托盤安裝單元110可包含有一個或多個用於安裝 其上裝載有電子元件10之托盤20的第一托盤安裝單元(左侧) 201033601 以用於視覺檢測,以及一個或多個用以在視覺檢測之後透過傾倒 單元210從第一托盤安裝單元110之托盤20中相互交換合格及不 合格的電子元件丨〇之第二托盤安裝單元(右側 由於為了方便設定第一及第二托盤安裝單元之位置,第一及 第二托盤安裝單元可依據操作方法而變化。201033601 VI. Description of the Invention: [Technical Field] The present invention relates to a visual inspection apparatus, and more particularly to a visual inspection apparatus capable of detecting the appearance of an electronic component loaded in a tray. [Prior Art] Electronic components, such as semiconductor packages, will be subjected to various duties such as power and external testing in the manufacturing process or before being put on the market, thereby increasing the yield and increasing the reliability of the product. For example, the material package can be fabricated by a number of processes such as a manufacturing process, a dicing process, and a packaging process on the wafer. If the defects in the semiconductor device are ignored and the subsequent processes are still performed unnecessarily, the overall manufacturing cost is increased. In order to avoid this problem, the above tests were performed prior to the main process to select qualified electronic components. These selected qualified electronic components are woven to follow the process. Most electronic components go through every test before they are put on the market. Therefore, only qualified electronic components can appear on the market, which increases the reliability of the product. The visual inspection device is used to carry a tray on which electronic components are mounted along a guide rail. Visual inspection is performed while moving up and down, and a camera can be moved in the right and left directions to detect electronic components loaded in the tray. Since the detection is performed when the tray on which the electronic component is loaded is transported, the position of the electronic component loaded in the tray 201033601 changes due to the tolerance between the electronic components in the receiving groove of the tray. Therefore, defects are generated when measuring the position of the electronic component. This will be explained in more detail below. Fig. 1 is a plan view showing an example of a visual inspection apparatus of the prior art. As shown in FIG. 1 , a conventional visual inspection device for detecting the appearance of an electronic component includes: a silk-filled fresh element 1 mounted to carry a tray 5 on which an electron transfer is mounted along a guide la; a camera 2 , the side to the electronic components that have been picked up n 6 to carry out the overview; pick! I 7, by transmitting electronic components to classify fully visually-detected electronic components; a tray transfer device (not shown in the drawings) is used to transport the tray 5; the sorting unit 4 is used along the guide rails The tray 5 is automatically transferred. However, the conventional visual inspection apparatus must be provided with a tray conveying device for automatically conveying the tray, and the tray loading unit 丨 and the sorting unit 4 must be respectively provided with φ rails la&4a. At the same time, a sorting device must be additionally provided after the visual inspection, for example, with an additional picking element 4 of the picking II 7. This can lead to over-complexity in the overall structure and can make manufacturing costs too high. In the case of mass production of electronic components, conventional visual inspection; equipment can be employed. However, when an expensive visual inspection device is used to produce a small number of electronic components 'when the overall manufacturing cost is increased, the productivity is lowered. In addition, conventional visual inspection devices occupy a relatively large installation space due to their complicated structure and large size. 5 201033601 In order to improve the reliability of the process of electronic components, the visual inspection equipment is installed in the clean room, which can remove dust and other substances in the clean room. If the size of the visual inspection device is increased, the area occupied by the visual inspection room will also increase. This will reduce the production of electronic components per unit area. A conventional visual inspection device obtains an image of an electronic component loaded in the tray 5 and performs a visual reward on the image obtained by the ageing. Here, the image of the electronic component is obtained by moving the tray 5 upward and downward along the guide rail in the "figure map" and moving the camera 2 to the right and left. When the tray 5 is conveyed, the electronic components are slightly moved due to the tolerance between the electronic components in the housing groove of the tray 5. This will change the position of the electronic component', which in turn causes the listener to be heard when the electronic component is miscellaneous, or the exact position of the electronic component is not measured. Therefore, the reliability of visual inspection is lowered or the visual inspection cannot be performed smoothly. SUMMARY OF THE INVENTION Therefore, in view of the above problems, it is an object of the present invention to provide a visual inspection apparatus capable of reducing the occupied area by simplifying the overall structure and reducing the manufacturing cost. Another object of the present invention is to provide a visual inspection apparatus capable of minimizing the construction of a transfer tray and electronic components, thereby greatly reducing manufacturing cost and size. In order to obtain these and other advantages of the present invention and in accordance with the purpose of the present invention, the present invention will be described and described in detail. The visual inspection 201033601 shoulder J« provided by the present invention includes two or more. a tray on which electronic components are mounted; a visual inspection unit 'for visually detecting electronic components loaded in the tray; and a tilting unit' for authentically producing prints between the trays based on the results of visual inspection Interchanging with non-conforming products, wherein the pouring unit places the qualified electronic components in one or more trays and places the failed electronic components in the remaining one or more trays. The visual inspection unit and the tilting unit can be driven independently or can be affixed to each other by being affixed to at least one of the shafts. The dump unit can include a plurality of pickers for picking up and placing electronic components. Another aspect of the present invention provides a visual inspection apparatus comprising: a plurality of first tray mounting units for respectively mounting a tray on which electronic components are mounted, 'one or more second tray mounting units, Used to install an empty tray; a visual inspection unit for visually detecting electronic components mounted in the tray; and a dumping unit for classifying qualified and unqualified electronic components to the first based on visual inspection results At least one of the tray mounting units of the first and second tray mounting units. The dump unit can be configured to place qualified electronic components onto one or more trays of the first tray mounting unit: and to place the failed electronic components onto the empty tray of the second i-tray mounting unit. The dump unit can also be configured to place unacceptable electronic components onto one or more trays of the first tray mounting unit and place the qualified electronic components over the empty tray of the 7th 201033601 second tray mounting unit. The pouring unit may also be configured to place qualified electronic components onto one or more trays of the first tray mounting unit and to place the failed electronic components to one or more of the remaining first tray mounting units Above the tray. The pouring unit may also be configured to place qualified electronic components onto one or more trays of the second tray mounting sheet 7L and to place the failed electronic components to one or more of the remaining second tray mounting units Above the tray. The visual inspection apparatus may further comprise: one or more first tray stacking units on which the trays loaded with electronic components are stacked; one or more second tray stacks 4 units for stacking thereon An empty tray; one or more quality product tray stacking units for stacking trays loaded with qualified electronic components thereon; one or more waste stacking units, which are stacked on the stack 4 a tray of electronic components; and a tray transfer unit for stacking the first tray mounting unit, the second tray mounting unit, the first tray stacking unit, the second tray stacking unit, the quality product tray stacking unit, and the waste tray stack Transfer trays between units. Another aspect of the present invention is to provide a visual inspection apparatus comprising: - one or more first tray mounting units for mounting one or more top trays carrying electronic components thereon Vision---------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- The electronic components loaded in the tray are inverted; two or I 8 201033601 multiple tray loading units are used to install the tray inverted by the inverted unit; the second visual inspection element is loaded on the second wire reduction unit In the tray, the electronic component performs the second extinction _; the second _ unit, the remainder containing the silk for the visual inspection according to the first and second visual inspections will be loaded on the second tray women's clothing 70 The electronic components in the tray are divided into qualified and unqualified electronic products: a dumping unit; and a tray transport unit that transfers the tray between the first detecting unit, the inverting unit and the second detecting unit. The reverse single sheet 7 can include: a tray picking unit for picking up the inverted tray before inverting the tray; and an inverted loading f for picking up on the tray conveyed by the tray transport unit and being picked up by the tray picking unit, And then the overlapping-to-tray is reversed so that the electronic components loaded in the tray are inverted. The second tray mounting unit of the second detecting unit may include: one or more first sub-disk mounting units for performing a second_visual detection after receiving the tray from the inverting unit; and _ or more The second sub-tray mounting unit _ classifies the electronic components through the tilting unit according to the results of the first and first visual inspections after subtracting the visual inspection from the first sub-tray wire unit. The first-sub-tray mounting unit may be disposed between the first detecting unit and the second sub-tray mounting unit proximate to the first detecting unit. : Each of the light-reducing units of the H-stuffed unit towel may be provided in plural in a direction perpendicular to the direction in which the first and second detecting units are arranged. The second tray mounting unit can be configured to enable the electronic component to be borrowed based on the results of the first and second visions after the second visual inspection 9 201033601 is segmented by the dumping unit. The visual inspection of the present invention can further include a tray stacking unit for feeding the trays to the trays or for stacking the trays thereon. The tray stacking unit may include: a first _ Le tray stack 7L early for supplying the tray to the first tray mounting unit; and a second tray stacking unit for stacking the empty tray thereon; The third tray stack 4 unit, on which the trays that have passed the second visual inspection are stacked. The tray mounting unit may be located below the first and second tray mounting units, and the tray transport unit may include a χ·ζ directional robot or a tilt 2 robot. The visual inspection device of the present invention can have the following advantages: First, due to visual inspection - in the state of two trays of the electronic components of the plurality of electronic components, and then can be qualified according to the results of the visual inspection Qualified electronic components are sorted into individual trays. This simplifies the overall structure and minimizes visual inspection equipment. Second, since the size of the visual inspection device is small, the manufacturing cost is reduced, and the installation space is also reduced. Therefore, the overall space for producing electronic components can be effectively utilized. Third, since the visual inspection device has a small size, the throughput of electronic components per unit area can be greatly improved. 201033601 The fourth 'because the visual inspection system is only performed by the camera that adorns the visual side unit' without moving the electronic components to be visually detected, the electronic components can be held secret and the visual inspection can be performed. This makes it possible to improve the reliability of visual inspection and to enable visual inspection to be performed more smoothly. The present invention and other objects, features, aspects and advantages of the present invention will become more apparent from the detailed description of the invention. © Embodiments The present invention will now be described in detail in conjunction with the drawings. Hereinafter, the visual inspection apparatus of the present invention will be described in further detail with reference to the accompanying drawings. Fig. 2 is a perspective view of a visual inspection device according to a first embodiment of the present invention, and "3A to 3C" is a plan view of the operation of the visual inspection device of "Fig. 2". φ As shown in FIG. 2, the visual inspection apparatus according to the first embodiment of the present invention comprises: a main body 100; two or more trays 20 mounted to the tray mounting unit 110, and the tray mounting unit 110 is fixedly mounted to the main body 1. In the middle of the tray, and the electronic cassette 10 is loaded on the tray 2 to perform visual inspection; the visual inspection unit 300 is configured to visually detect the electronic components 1 载 carried in the tray 20; and the dumping unit, 'It is used to exchange qualified and unqualified electronic components 10 between the trays 20. The electronic component 10 to be visually detected may include various types of objects that require visual inspection, for example, a semiconductor wafer including a PGA, a BGA, or the like, a semiconductor package such as DDI, PCBs, or the like. The tray 20 is used to load a plurality of electronic components 1 on it and carry the electronic components. The tray 20 can have various sizes and structures according to the type of the electronic component 1' and can have receiving grooves in the horizontal and vertical directions for accommodating the electronic components. The main body (10) in which the wires are provided may include a top plate portion which forms an upper surface and a support portion 1〇2 for supporting the top plate portion 1〇1. And the 'body 100' can have a variety of different configurations including a frame structure. As shown in Fig. 2, the tray mounting unit 11A may include a plurality of guiding members 111 fixedly mounted on the top plate portion 1〇1 of the main body 100 and configured to support the tray 20 in the lateral direction. Here, the tray 2 of the tray mounting unit 11 can be replaced by the other trays 2 透过 after the visual inspection by the operator's manual process.视觉 The visual inspection unit 3 is configured to visualize the electronic tree 1G by acquiring an external image of the top surface, the bottom surface, and the like of the electronic component (1) and detecting the appearance of the electronic 7G device 1G based on the analysis result of the acquired image. device of. The visual inspection unit _ may include an image acquisition device (such as a camera), and a video analysis device (not shown in the drawings). The visual inspection unit 300 is attached to the sequel (8) and is also used to move the electronic image in the above-mentioned tray. As shown in "Figure 2", the visual inspection unit can be installed in the X-Man 320 to be able to move in the χ and γ directions. The robot 12 201033601 is installed in the main body 100 to pick up the electronic component 10 after visual inspection and transfer the picked electronic component K) to the other tray 2G, and the ribs are mutually qualified and unqualified between the trays 2〇. The electronic component IQ's dumping unit 2〇〇. The pouring unit 200 can have various configurations for picking up and placing electronic components. For example, the pouring unit 200 may include a pouring unit 21A having a suction head (not shown in the drawings) and an upper and lower driving means for moving the suction head upward, wherein the suction head picks up the electronic component 1 by forming a vacuum pressure. > The dumping unit 210 must perform a picking function for picking up the electronic component 从 from a tray 2 to prepare a placing function for placing the picked electronic component 1G in the 剌-tray. Therefore, the pouring unit 21 must be equipped with two or more pickup buckles. However, it is preferable to install the two pickups 211 in consideration of the manufacturing cost and the simplified structure. One of the two pickup n 211 of the dump unit 210 can pick up the electronic component 1 from one tray and then move to the other tray 2 () on which the electronic component 10 to be replaced is loaded. Next, the other one of the plucking elements 21 拾 picks up the H 2 Π to pick up the electronic component 1Q to be picked up, and then places the electronic component 1G picked up for the first time onto the other tray 2G. These operations can be performed repeatedly. Like the visual inspection unit 300, the pouring unit 21 is mounted in the main body (10) so that the electronic component 10 loaded in the tray can be transferred while the tray mounting unit 11 is being moved. As shown in Fig. 2, the tilting unit 2ι can be mounted on the 13 201033601 x-Y robot 3 2 0 so as to be movable in the χ and γ directions. The vision unit and the unit (10) can be mosquitoed onto a shaft and can be operated with each other or independently. Preferably, the tray mounting unit 11G is mounted as two or more electronic components ι〇// which are visually detected and ▲ are determined to be defective products. The tray mounting unit 110 can have a variety of different configurations depending on the method of operation. As shown in "Fig. 3A", each of the tray mounting units 11 is used for the visual inspection of the tray 20 on which the electronic components 10 are mounted. As shown in "3b" and "3C", in order to exchange electronic components ίο between the trays 2〇 after visual inspection, the qualified electronic components are classified ("3A" to "3c"). "G〃 in the figure" and the unqualified electronic components 1 (""R" in "3A" to "3c"), only qualified electronic components 1〇(6) can be loaded The tray is mounted in the tray 20 of the single το 110, and only the defective electronic components 1〇(R) can be loaded into the remaining trays 2 of the remaining tray mounting unit 11〇. For example, as shown in "Fig. 2" to "3C", two tray 10 mounting units 110 are provided. Moreover, it can be configured to pass the switching process of the pouring unit 210 after visual inspection so that only qualified electronic components 1 (G) are loaded in the tray 20 on the left side and only the defective electronic components 1 ( R) is loaded into the tray 20 on the right side. That is, the tray mounting unit 110 may include one or more first tray mounting units (left side) 201033601 for mounting the tray 20 on which the electronic components 10 are mounted for visual inspection, and one or more a second tray mounting unit for exchanging qualified and unqualified electronic components from the tray 20 of the first tray mounting unit 110 through the tilting unit 210 after the visual inspection (the right side is set for the first and second trays for convenience) The position of the mounting unit, the first and second tray mounting units may vary depending on the method of operation.

由於不合格的電子元件1〇之數量相對較少’因此’如「第3B 圖」中所示,當左側托盤安裝單元11〇之托盤2〇僅被合格的電子 7C件10填滿時,左侧托盤安裝單元11〇之托盤2〇將被不斷地替 換。 如「第3C圖」中所示,當右侧托盤安裝單元110之托盤20 僅被不合格的電子元件1G料時,操作者將藉由其上裝載有待進 行視覺檢測之電子元件1()之另—托盤2〇來替換此填滿的托盤加。 托盤安裝單it 11G之域2G麟每次_由操作者以一個新 參 的托盤來加鱗換。岐,當已經堆疊-定數量的鋪20之後, 所堆疊之托盤20中的每一粍盤2〇可自動地被供應至每一托盤 裝單元110。 第4圖J為本發明第二實施例之視覺檢測設備之立體圖 5:圖且」「至第「6第:圖」為「第4圖」之視覺檢測設備之運行平面 圖,且「第6圖」為「笛j固Since the number of defective electronic components 1 is relatively small, "as shown in the "3B", when the tray 2 of the left tray mounting unit 11 is filled only by the qualified electronic 7C 10, left The tray 2 of the side tray mounting unit 11 will be continuously replaced. As shown in "3C", when the tray 20 of the right tray mounting unit 110 is only rejected by the defective electronic component 1G, the operator will be loaded with the electronic component 1() on which the visual inspection is to be performed. Another - tray 2 〇 to replace this filled tray plus. The tray installation single it 11G domain 2G Lin each time _ by the operator to a new reference tray to scale. That is, after the predetermined number of tiles 20 have been stacked, each of the stacked trays 20 is automatically supplied to each of the tray loading units 110. FIG. 4 is a perspective view of a visual inspection device according to a second embodiment of the present invention; FIG. 5 is a plan view showing the operation of the visual inspection device of FIG. 4 and FIG. For the flute

」马第4圖」之視覺檢測設備的托盤堆疊單 之局部立體圖。 早7L 本發明第—實施例與第—實施例的區別之處在於托盤安裝單 15 201033601 元110係被不同地設置,並且額外地配設有用以自動傳送托盤2〇 之托盤傳送單元。因此,為了方便起見,現僅對第二實施例之不 同構造加以說明。 第一實施例之托盤女裝單元400可包含有一個或多個用以安 裝其上裝載有待進行視覺檢測之電子元件1〇的托盤2〇之第一托 盤安裝單元410,以及一個或多個用以安裝空的托盤2〇之第二托 盤安裝單元420。 如「第4圖」及「第5A圖」至「第5D圖」中所示,可安裝❹ 有兩個或多個第一托盤安裝單元410。一個第一托盤安裝單元41〇 之托盤20的空餘區域上可放置有裝載於另一第一托盤安裝單元 410之托盤20中的合格的電子元件10。這裡,空餘區域係為不合 格的電子元件10被拾取並被傳送至第二托盤安裝單元42〇之托盤 20的區域。 第一及第一托盤安裝單元410及420可依據傾倒單元21〇之 分類結果而分別具有各種不同的構造,並且可配置成在其上放置 ® 合格及不合格的電子元件,或不合格及合格的電子元件。 在安裝複數個托盤20之情形中,第一及第二托盤安裝單元 410及420中的每一個托盤安裝單元可包含其上僅裝載有合格的 電子元件之托盤20,以及其上僅裝載有不合格的電子元件之托盤* 20。 對於第二托盤安裝單元420來說,係首先安裝有空的托盤 16 201033601 20。並且’空的托盤20係填充有裝載於第一托盤安裝單元4i〇之 托盤20中的不合格的電子元件1〇。裝载有待進行視覺檢測的電子 元件之托盤20也可被安裝至第二托盤安裝單元42〇。 在主體100中,可進-步配設有:托盤堆疊單元5〇〇,係用以 在其之上堆疊將要被安裝至托盤安裝單元_之托盤2〇以使得托 盤20能夠被自動地傳送,以及托盤傳送單元58〇,係用以在托盤 堆疊單元500與托盤安裝單元400之間傳送托盤2〇。 如「第4圖」及「第6圖」中所示’托盤堆叠單元可具 有在其上堆4概條盤2〇 ’絲域Μ 至減安裝單: 400或從托盤安裝單元400取回托盤2〇之結構。並且,托盤堆疊 單元500可包含:第-托盤堆叠單元51〇,係用以在其上堆疊待進 行視覺檢測之托盤20並將托盤20供應至第一托盤安裝單元41〇; 第二托盤堆疊單元52〇,係用以堆疊空的托盤;以及第三托盤堆疊 單元530’侧以在其上堆疊已經完全經過視覺檢測及分類製程的 托盤20。 第-托盤堆疊單元MO係配置成可堆叠有其上裝載有待進行 視覺檢測及分類之電子元件10的托盤20,並且在數量上可安裝有 一個或多個。 第二托盤堆疊單元520係配置成可堆疊有未裝載或不必從其 中移除電子元件10之空的托盤2〇,或者可酉己置成當結束在前一空 托盤20上放置不合格的電子元件1〇之後,將空的托盤提供至 17 201033601 第二托盤安裝單元420。 第三托盤堆疊單元530係配置成可於依據視覺檢測之結果劃 分電子元件10之後堆疊托盤20。並且,第三托盤堆叠單元53〇 可包含:一個或多個合格品托盤堆疊單元531’係用以在其上堆疊 ~ 填滿合格的電子元件1〇之托盤20’以及一個或多個第—廢品托盤 堆疊單元532,係用以在其上堆疊填滿不合格的電子元件之托 盤20。 托盤堆疊單元500係安裝於主體1〇〇内部的托盤安裝單元4〇〇 參 之下方。並且’托盤堆疊單元可包含用以形成底部表面藉以 於其上堆疊鋪2〇之底部训’錢帛則導紐2Q之每一邊緣 (頂點)藉以於其上穩定地堆疊托盤2〇之引導元件5〇2。 與第一實施例不同的是,托盤安裝單元4〇〇係配置成可於主 體100之頂板部分101中設置形成一窗口,以使得托盤20能夠順 利地被托盤傳送單元580傳送。並且,托盤安裝單元彻可包含 用以將已經被托盤傳送單S 580供應之托盤20加以固定之托盤固❿ 定單元401。 +托盤堆叠單1 500係安裝成可容納於主體議之中而不會曝 路在外。並且,鋪料單元可滑祕安裝於主體⑽之中 以使得操作者能夠藉由握住—把手503等抽出托盤20。 ; 托盤傳送單元係配置成可在托盤堆疊單元與托盤安 裝單元400之間傳送托盤2G。並且,托盤傳送單元可具有用 18 201033601 於傳送托盤20之各種構造。 如「第6圖」中所示,托盤傳送單元58〇可包含用以拾取技 _盤20之托盤拾取單元581,及用以在托盤堆疊單元5〇〇與托盤安 _裝單元400之間傳送被托盤拾取單元581拾取之托盤2〇的拾取驅 動單元582。 拾取驅動單元582係配置成可沿χ_ζ方向移動托盤拾取單元 鲁581,並可被實施為χ_ζ機器人。拾取驅動單元可根據托盤 20之排列包含χ_γ_ζ機器人。 現在將更為詳細地說明本發明之視覺檢測設備之操作。 首先’係於第-托姆疊單元51Q之上堆疊魏行視覺檢測 之托盤2G,並於第二托盤堆叠單元52〇上堆疊—找量的空托盤 20 〇 當在第-托盤堆疊單元M0上完成托盤2〇之堆叠後,托盤傳 ❿送單元58〇將裝載有待進行視覺檢測之電子元件1〇之她從 第-托盤堆疊單元M0供應至第一托盤安裝單元41〇。並且,托盤 傳送單元將空的托盤20供應至第二托盤安裝單元420。 當完成托盤2G之供錢’概檢解元·細解元训 .將對農載於托盤20中的電子元件1〇執行視覺檢測與分類製程。 ' 謎絲科可根_作絲财各種不_構造。如 上所述’托盤絲單元400可包含-織多娜—托盤安裝單元 41〇,及-個或多個第二托盤安裝單元42〇。例如,如「第*圖」 201033601 至「第5D圖」中所示,托盤安裝單元400可包含兩個第一托盤安 褒單疋410,及—個第二托盤安裝單元420。 如「第5A圖」中所示’待進行視覺檢測之托盤2〇係安裝至 兩個第-托盤安裝單元中的每—個托盤安裝單元 ,並且空的 托盤20係安裝至第二托盤安裝單元42()。 虽70成托盤20之安裝後,視覺檢測單元300將透過χ_γ機器 人320對裝載於第一把盤安裳單it樣之托S 2〇中的電子元件10 執行視覺檢測。 @ 當藉由視覺檢測單元300之視覺檢測完成後,如「第5A圖」 中所示,裝載於第-托盤安裝單元彻之托盤2〇中的電子元件1〇 之不合格的電子元件10將被傳送至第二托盤安裝單元柳之托盤 20。 如「第5B圖」中所示’傾倒單元21〇將不合袼的電子元件 1〇傳送至第二減安裝單元·,並將裝載於_第—托盤安裝 單元410之右侧托盤安裝單元之托# 2〇中的合格的電子元件1〇⑩ 傳送至兩個第-托盤安裝單元·之左侧托盤安裝單元之托盤 20。 如「第5B圖」中所示,當左侧的第一托盤安裝翠元之托 盤20已被完全填滿合格的電子元件1〇時,域2〇係被傳送至合, 格品托盤堆叠單元53卜並且新的托盤2〇將從第一托盤堆疊單^ , 510被供應至左侧的第一托盤安裝單元41〇。 20 201033601 如「第5C圖」中所示,當右侧的第一托盤安裝單元410之托 盤20由於合格的電子元件1〇 e經被完全傳送而變空時,空的托 盤2〇係堆疊於第二托盤堆疊單元wo之上,並且新的托盤2〇將 從第-托盤堆疊單元510被供應至右侧的第一托盤安裝單元41〇。 如「第5D圖」中所示’當第二托盤安裝單元42〇之托盤2〇 已被不合格的電子元件10完全填滿時,托盤2〇將被傳送至第三 托盤堆叠單元530之第一廢品托盤堆疊單元532。並且,新的空的 ❹托盤2〇將從第二托盤堆疊單元WO被供應至第二托盤安裝單元 420。 在必要時,本發明之視覺檢測設備可被構成為用來檢測電子 7L件10之兩録φ ’即,電子元件1G之底部表酿頂部表面。 「第7圖」為本發明第三實施例之視覺檢測設備之立體圖,「第 8圖」為「第7圖」之部分視覺檢測設備的正視圖,「第9圖」為 I 「第7圖」之視覺檢測設備的平面圖;以及「第10A圖」至「第 圖」為「第7圖」之視覺檢測設備的倒轉裝置之運行的局部 正視圖。 本發明之第三實施例之視覺檢測設備係被構成為第一次執行 .視覺檢測(第一視覺檢測),並於隨後在倒置電子元件1〇之後第 *二次執行視覺檢測(第二視覺檢測此第二視覺檢測係採用與第 二實施例她之方式進行。因此,與第二實施例相似之部件將使 用相同的參考標號,並且其詳細說明將被省略。 21 201033601 如「第7圖」至「第9圖」中所示’本發明之第三實施例之 視覺檢測設備可包含··主體励;安裝於主體1〇〇中的第一檢測單 元’係用以執行第一視覺檢測;安裝於主體1〇〇之中的倒轉單元 700’係用以接收已完全經過第-檢測單元之第一視覺檢測的托盤、 20,並將裝載於托盤20中的電子元件1〇锻;安裝於主體1〇〇 中的第二檢測單元’係用以執行第二視覺檢測及分類製程;以及 一個或多個用以傳送托盤20之托盤傳送單元78〇、58〇。 托盤傳送單元780、580可具有各種不_構造藉以於第—檢❹ 測單元之第-托盤安裝單元810與第二檢測單元之第二托盤安裝 單元820之間’以及倒轉單元7〇〇與托盤堆疊單元之間傳送 托盤20。並且’托盤傳送單元78〇、58〇可具有與第三實施例相同 或者相似之結構。參考標號?81係代表用以拾取托盤2〇之托盤拾 取單元。 如「第7圖」中所示,考慮到托盤2〇既要被傳送至第一檢測 單元又要被傳送至第二檢測單元,因此托盤傳送單元78〇、58〇可❿ 單獨地安裝於第-及第二檢測單元之每一檢測單元中以使製程流 暢。 在複數個第-托盤安裳單元⑽沿水平及垂直方向排列的情, 形中,托盤傳送單元780、58〇可包含能夠根據第一托盤安裝單元: 810之排列沿X-Z方向移動之χ_ζ方向機器人或χ 機器人。 第視覺檢测單疋可包含:一個或多個固定安裝於主體⑽ 22 201033601 中的第-托盤安裝單元810,係用以安裝裝載有電子元件ι〇之托 盤20以用於第—視覺制;以及第—視覺制單元⑽,係用以 在移動上述第-托盤安裝單元_時,對裝載於第一托盤安裝單 儿_之托盤20中的電子元件1G進行第—視覺檢測。 第一托盤安裝單元⑽具有與隨後將要說明的第二檢測單元 之第二托_單元㈣她之結構。為了使第—視覺檢測順利 進灯第托盤安裝早疋81〇之數量係優選為兩個或多個。在第 -托盤安裝單元_之數量被實施為缝個之情形中,第一托盤 安裝單元⑽可沿水平方向或垂直方触置。在假設第-及第二 ^單^侧方㈣水平方向(χ軸方向)時,考慮到設備的 寸’第-托盤安裝單元⑽係優選為沿著垂直於χ轴方向之方 向即’沿著垂直方向(Υ轴方向)排列。 第一視覺檢測單元伽具有與第一及第二實施例之視覺檢測 ❿ 細獅冑蝴㈣部影像,並 2過Γ峨取㈣像之分㈣果檢_子元件H)之外觀而對 人疋牛10進行視覺檢測之設備。第一視覺檢測單元⑽可包 中藉以當移動上述第一 20中的電子元件10之 第一視覺檢測單元630 第一視覺檢測單元可安裝於主體100 托盤安裝單元_時_觀錄於托盤 外部影像。並且,如「第7圖」中所示, 23 201033601 可HXY機器人620之中藉以沿χ&γ方向移動。 所述,第二檢測單元具有與第三較佳實施例相似之社 構。並且’第二檢測單從含:兩個或多個 · 中的第二咖輪咖_峨_輪糊= 一第一視覺檢測單元300 ’係用以當移動上述第二托盤安裝 早兀820時’對裝载於第二托盤安裝單元820之托盤20中的電子 凡件10進订第二視覺檢測;以及傾倒單元21〇 ’係用以當移動上 述第托盤安裝單元820時’將裝載於第二托盤安裝單元820之⑩ 個托盤20中的電子元件10傳送至第二托盤安裝單元820之另 一托盤20。 第二檢測單元具有與第三較佳實施例相似之結構,且因此將 省略其詳細贿。此處,由於分類製祕要依據第二檢測單元之 、、Ό果進行,因此第二托盤安裝單元82〇之排列可以變得不同,以 使得分類製雜触據第—及第二視覺檢狀結果來進行。 例如,第二托盤安裝單元82〇可包含:一個或多個第一子托_ 盤女裝單元821,係用以安裝裝載有待進行視覺檢測之電子元件 之托盤20 ;以及複數個第二子托盤安裝單元822,係用以從第 一子托盤安裝單元821接收已經過視覺檢測之托盤2〇,並透過傾· 倒單元210將合格及不合格的電子元件1〇彼此加以分類。 , 第一子托盤安裝單元821可被構成為既執行第二視覺檢測又 執行分類製程’也可如「第7圖」至「第9圖」中所示的被構成 24 201033601 為僅執行第二視覺檢測。並且,第一子托盤安裝單元8 與第一檢測單元之第一托盤安裝單元810相似之結構。 考慮到托盤20在經過第一視覺檢測及倒置後要被傳送,因而 ,第一子托盤安裝單元821係較佳地設置成鄰近第一檢測單元。也 就是說,第-子城安裝單元821可設置於第—檢醉元與第二 子托盤安裝單元822之間。 第二子托盤安裝單元822可設置為能夠根據第一及第二視覺 ® 檢測之結果將電子元件在第一視覺檢測之後劃分出不合格產品 (R1) ’在第二視覺檢測之後劃分出不合格產品(R2)。第二子托 盤安裝單元822可具有各種不同的構造,即,依據分類方法固定 部分托盤之構造。並且,第二子托盤安裝單元822之數量係可實 施為複數個,藉以劃分出合格及不合格的電子元件1〇。 例如’如「第7圖」及「第9圖」中所示,第二子托盤安農 ❹早7^ 822包含一個或多個2-1至2_3子托盤安裝單元8瓜、㈣、 織以用於從第一子托盤安裝單元犯1接收托Μ 20。透賴倒單 7C 210 ’合格的電子元件1〇可被放置於一個或多個第一子托盤安 裝單疋822a中’經第一視覺檢測所檢測出的不合格的電子元件10 ’(RO可被放置於第二子托盤安裝單元㈣中,並且經過第二檢 、測單元之第二視覺檢測所檢測出的不合格的電子元件ι〇⑻)可 被放置於第三子托盤安裝單元822c之中。 第-子托盤女裝單元822還可包含一緩衝托盤單元424,係用 25 201033601 、暫時裝伽於初始化或為設備之誤操作所準備的電子元件ι〇。 在第一托盤文裝單元㈣以與第一檢測單元之第一托盤安裝 單元810相似之方式實施為複數個之情形中,第二托盤安裝單元 820可沿水平方向或垂直方向排列。考慮到設備之尺寸,假設第一 · 及=二檢測單元之排列方向為水平方向(χ轴方向),第二托盤安 裝單元82G係優選為沿垂直方向(Υ軸方向)排列。 視覺檢測單元3GG及傾倒單元21G可依據第—及第二托盤安 裝單元81G㈣之構造及排列而具有與第二實施例相同之結構。⑩ 在第二托盤安裝單元82〇包含第一子托盤安裝單元821及第二子 托盤安裝單元822之情形中,傾倒單元21〇及視覺檢測單元3〇〇 可配置成能夠藉由額外的χ_Υ機器人62〇、_來相互獨立地加以 操作。 第二視覺檢測單元3〇〇可具有各種不同的構造,_,可具有 與第-視覺檢測單元63G她之構造,或與第二實_相似之構 造等等。如「第7圖」及「第9圖」中所示,第二視覺檢測單元⑩ 300可被安裝至Χ·γ機器人64〇以使其能夠沿χ及γ方向移動。 用以移動第一視覺檢測單元630之χ_γ機器人62〇,與用以移動 第二視覺檢測單元之χ-γ機器人64〇可共用導軌65(),功 機器人620、640之運動可沿著導軌65〇被加以引導。 與第二實施例相同,傾倒單元21〇係安裝於主體ι〇〇之中, 藉以於移動上述第二子托盤安裝單元822之時傳送裝載於粍盤加 26 201033601 _的電子7G件1〇 〇如「第7圖 Γ ^ n r^t . 弟7圖」及「第9圖」中所示,傾倒單元 210可安裝至χ-γ機器人32〇藉以沿X及γ方向移動。 與第二實施例相同,用以在其上堆叠將要被安裝至第一及第 二托盤安裝單元_、82G之托盤2G的托盤堆#單元·還可安 裝於主體_之中藉以能夠自動地傳送托盤20。A partial perspective view of the pallet stack of the visual inspection equipment of "Ma 4". Early 7L The difference between the first embodiment of the present invention and the first embodiment is that the tray mounting sheet 15 201033601 yuan 110 is differently disposed, and additionally provided with a tray conveying unit for automatically conveying the tray 2〇. Therefore, for the sake of convenience, only the different configurations of the second embodiment will be described. The tray women's wear unit 400 of the first embodiment may include one or more first tray mounting units 410 for mounting the trays 2 on which the electronic components 1 to be visually inspected are loaded, and one or more To install the second tray mounting unit 420 of the empty tray 2〇. As shown in "Fig. 4" and "5A" to "5D", two or more first tray mounting units 410 can be mounted. Qualified electronic components 10 loaded in the tray 20 of the other first tray mounting unit 410 can be placed on the free area of the tray 20 of a first tray mounting unit 41. Here, the vacant area is an area where the unqualified electronic component 10 is picked up and transferred to the tray 20 of the second tray mounting unit 42. The first and first tray mounting units 410 and 420 may have various configurations depending on the classification result of the pouring unit 21, and may be configured to place Qualified and Unqualified electronic components thereon, or fail and pass. Electronic components. In the case of installing a plurality of trays 20, each of the first and second tray mounting units 410 and 420 may include a tray 20 on which only qualified electronic components are loaded, and only loaded thereon Tray of qualified electronic components* 20. For the second tray mounting unit 420, an empty tray 16 201033601 20 is first installed. Further, the 'empty tray 20 is filled with defective electronic components 1〇 loaded in the tray 20 of the first tray mounting unit 4i. The tray 20 loaded with the electronic components to be visually detected can also be mounted to the second tray mounting unit 42A. In the main body 100, a tray stacking unit 5〇〇 is provided for stacking thereon a tray 2 to be mounted to the tray mounting unit _ to enable the tray 20 to be automatically transferred, And a tray transfer unit 58A for transferring the tray 2 between the tray stacking unit 500 and the tray mounting unit 400. As shown in "Fig. 4" and "Fig. 6", the tray stacking unit may have a stack of trays 2 〇 'filaments 至 to minus installation sheets: 400 or retrieve trays from the tray mounting unit 400. 2 〇 structure. Also, the tray stacking unit 500 may include: a first tray stacking unit 51A for stacking the tray 20 to be visually detected thereon and supplying the tray 20 to the first tray mounting unit 41; the second tray stacking unit 52〇, for stacking empty trays; and a third tray stacking unit 530' side to stack thereon trays 20 that have been completely visually inspected and sorted. The first tray stacking unit MO is configured to stack the trays 20 on which the electronic components 10 to be visually detected and classified are loaded, and one or more of them can be installed in number. The second tray stacking unit 520 is configured to be stackable with trays 2 that are unloaded or free from which the electronic component 10 is removed, or may be placed so as to place unqualified electronic components on the previous empty tray 20 After 1 ,, the empty tray is supplied to 17 201033601 second tray mounting unit 420. The third tray stacking unit 530 is configured to stack the trays 20 after the electronic components 10 are divided according to the results of the visual inspection. Also, the third tray stacking unit 53A may include: one or more quality product tray stacking units 531' for stacking thereon - filling the trays 20' of the qualified electronic components 1' and one or more first The waste tray stacking unit 532 is for stacking the trays 20 on which the defective electronic components are filled. The tray stacking unit 500 is mounted below the tray mounting unit 4 inside the main body 1〇〇. And the 'tray stacking unit may include a guiding member for forming a bottom surface on which the bottom side of the stacking layer 2Q is stacked, so that each of the edges (vertex) of the tray 2 is stably stacked thereon 5〇2. Unlike the first embodiment, the tray mounting unit 4 is configured to be formed in the top plate portion 101 of the main body 100 to form a window so that the tray 20 can be smoothly conveyed by the tray transfer unit 580. Further, the tray mounting unit may include a tray fixing unit 401 for fixing the tray 20 that has been supplied by the tray transporting single S 580. +Tray stacking single 1 500 series is installed to be accommodated in the main body without exposure. Also, the paving unit can be slidably mounted in the main body (10) so that the operator can pull out the tray 20 by holding the handle 503 or the like. The tray transfer unit is configured to transfer the tray 2G between the tray stacking unit and the tray mounting unit 400. Also, the tray transfer unit can have various configurations for transporting the tray 20 with 18 201033601. As shown in "FIG. 6", the tray transfer unit 58A may include a tray picking unit 581 for picking up the tray 20, and for transferring between the tray stacking unit 5 and the tray mounting unit 400. The pickup drive unit 582 of the tray 2 picked up by the tray pickup unit 581. The pickup drive unit 582 is configured to move the tray pickup unit Lu 581 in the χ_ζ direction, and can be implemented as a χ_ζ robot. The pickup drive unit may include a χ_γ_ζ robot according to the arrangement of the trays 20. The operation of the visual inspection apparatus of the present invention will now be described in more detail. Firstly, the trays 2G for visual inspection are stacked on top of the first-tom stack unit 51Q, and stacked on the second tray stacking unit 52. The empty trays 20 are found on the first tray stacking unit M0. After the stacking of the trays 2 is completed, the tray transfer unit 58 picks up the electronic component 1 to be visually inspected and supplies it from the first tray stacking unit M0 to the first tray mounting unit 41. And, the tray transfer unit supplies the empty tray 20 to the second tray mounting unit 420. When the supply of the tray 2G is completed, the inspection and classification process will be performed on the electronic components 1 in the tray 20. ' Mystery silk Keke _ for silk money all kinds of _ construction. As described above, the tray wire unit 400 may include a woven donut-tray mounting unit 41A and one or more second tray mounting units 42A. For example, as shown in "Fig. 2010" to "5D", the tray mounting unit 400 may include two first tray mounting units 410 and a second tray mounting unit 420. As shown in "Fig. 5A", the tray 2 to be visually detected is attached to each of the two tray-mounting units, and the empty tray 20 is attached to the second tray mounting unit. 42 (). After the installation of 70% of the trays 20, the visual inspection unit 300 performs visual inspection on the electronic components 10 loaded in the first tray of the first tray through the χ_γ robot 320. @ When the visual inspection by the visual inspection unit 300 is completed, as shown in "Fig. 5A", the electronic component 10 that is loaded in the tray 2 of the first tray mounting unit is defective. It is transferred to the tray tray 20 of the second tray mounting unit. As shown in "Fig. 5B", the "dumping unit 21" transfers the non-conforming electronic component 1 to the second subtracting mounting unit, and mounts the loading tray on the right side of the tray mounting unit 410. The qualified electronic components 1〇10 in #2〇 are transferred to the tray 20 of the left tray mounting unit of the two first tray mounting units. As shown in "Fig. 5B", when the first tray on the left side of the tray is loaded with the qualified electronic components 1 , the domain 2 is transferred to the assembly tray. 53b and the new tray 2〇 will be supplied from the first tray stacking unit 510 to the first tray mounting unit 41〇 on the left side. 20 201033601 As shown in "Fig. 5C", when the tray 20 of the first tray mounting unit 410 on the right side becomes empty due to the complete transfer of the qualified electronic component 1〇e, the empty tray 2 is stacked on the tray The second tray stacking unit wo is above, and a new tray 2〇 is supplied from the first tray stacking unit 510 to the first tray mounting unit 41〇 on the right side. As shown in "5D", when the tray 2 of the second tray mounting unit 42 has been completely filled with the defective electronic component 10, the tray 2 is transported to the third tray stacking unit 530. A waste tray stacking unit 532. Also, a new empty stack tray 2 will be supplied from the second tray stacking unit WO to the second tray mounting unit 420. When necessary, the visual inspection apparatus of the present invention can be configured to detect the two recordings φ of the electronic 7L member 10, i.e., the bottom surface of the electronic component 1G. Figure 7 is a perspective view of a visual inspection device according to a third embodiment of the present invention, and "Fig. 8" is a front view of a portion of the visual inspection device of "Fig. 7", and "Fig. 9" is I "Fig. 7 A plan view of the visual inspection device; and a partial front view of the operation of the reversing device of the visual inspection device of "Fig. 7" to "Fig. 7". The visual inspection apparatus of the third embodiment of the present invention is configured to perform the first visual inspection (first visual inspection), and then perform the visual inspection secondarily after inverting the electronic component 1 (second vision) The detection of this second visual inspection is performed in the same manner as the second embodiment. Therefore, components similar to those of the second embodiment will use the same reference numerals, and detailed description thereof will be omitted. 21 201033601 The visual inspection apparatus according to the third embodiment of the present invention may include a main body excitation; the first detection unit installed in the main body 1 is configured to perform the first visual inspection. The inverting unit 700' installed in the main body 1 is for receiving the tray 20 which has completely passed the first visual inspection of the first detecting unit, and upsetting the electronic component 1 loaded in the tray 20; The second detecting unit ' in the main body 1' is for performing a second visual inspection and sorting process; and one or more tray conveying units 78, 58 for conveying the tray 20. The tray conveying unit 780 580 may have various configurations between the first tray mounting unit 810 of the first detecting unit and the second tray mounting unit 820 of the second detecting unit, and between the reverse unit 7 and the tray stacking unit The tray 20 is conveyed. And the 'tray conveying unit 78〇, 58〇 may have the same or similar structure as the third embodiment. Reference numeral 81 denotes a tray picking unit for picking up the tray 2''. As shown in the figure, considering that the tray 2 is to be transported to both the first detecting unit and the second detecting unit, the tray transport unit 78〇, 58〇 can be separately mounted to the first and second detecting units. Each of the detecting units is configured to make the process smooth. In the case where the plurality of first tray-loading units (10) are arranged in the horizontal and vertical directions, the tray conveying units 780, 58A may include a unit capable of mounting according to the first tray: The arrangement of 810 moves in the XZ direction ζ ζ directional robot or 机器人 robot. The visual inspection unit may include: one or more first tray mounting units 81 fixedly mounted in the main body (10) 22 201033601 0, for mounting a tray 20 loaded with electronic components for use in a first-vision system; and a first-vision unit (10) for loading the first tray-mounted unit _ The electronic component 1G in the tray mounting unit 20 performs the first visual inspection. The first tray mounting unit (10) has the structure of the second tray unit (4) of the second detecting unit which will be described later. The number of visual inspections smoothly entering the tray is preferably two or more. In the case where the number of the first tray mounting units is implemented as a seam, the first tray mounting unit (10) can be horizontally The direction or the vertical direction is touched. When the horizontal direction (the x-axis direction) of the first and second sides (fourth) is assumed, the inch-to-tray mounting unit (10) of the device is preferably taken along the vertical axis. The direction of the direction is 'arranged along the vertical direction (the axis direction). The first visual detecting unit 380 has the appearance of the visual inspection of the first and second embodiments, and the appearance of the image of the lion (4) image, and the appearance of the image (4) Equipment for visual inspection of Yak-10. The first visual detecting unit (10) may be included in the first visual detecting unit 630 when the electronic component 10 in the first 20 is moved. The first visual detecting unit may be mounted on the main body 100 tray mounting unit _ . Further, as shown in "Fig. 7," 23 201033601 can be moved in the χ & γ direction by the HXY robot 620. Said second detection unit has a similar structure to the third preferred embodiment. And 'the second test list includes: two or more of the second coffee _ _ _ _ _ = a first visual detection unit 300 ' is used to move the second tray when installed 820 'Pending a second visual inspection of the electronic article 10 loaded in the tray 20 of the second tray mounting unit 820; and the pouring unit 21'' is used to "load" the first tray mounting unit 820 The electronic components 10 in the ten trays 20 of the two tray mounting unit 820 are transferred to the other tray 20 of the second tray mounting unit 820. The second detecting unit has a structure similar to that of the third preferred embodiment, and thus its detailed bribe will be omitted. Here, since the classification secret is performed according to the result of the second detecting unit, the arrangement of the second tray mounting unit 82 can be made different, so that the classification and the second visual inspection are performed. The result is carried out. For example, the second tray mounting unit 82A may include: one or more first tray tray women's units 821 for mounting the tray 20 loaded with electronic components to be visually detected; and a plurality of second trays The mounting unit 822 is configured to receive the tray 2 that has been visually detected from the first sub-tray mounting unit 821, and classify the qualified and unqualified electronic components 1 to each other through the tilting/reversing unit 210. The first sub-tray mounting unit 821 can be configured to perform both the second visual inspection and the classification process, or can be configured as shown in the "figure 7" to the "figure 9" 24 201033601 for performing only the second Visual inspection. And, the first sub-tray mounting unit 8 has a structure similar to that of the first tray mounting unit 810 of the first detecting unit. In view of the fact that the tray 20 is to be conveyed after the first visual inspection and inversion, the first sub-tray mounting unit 821 is preferably disposed adjacent to the first detecting unit. That is, the first sub-mounting unit 821 can be disposed between the first drunk element and the second sub-tray mounting unit 822. The second sub-tray mounting unit 822 can be configured to be able to divide the electronic component into the defective product (R1) after the first visual inspection according to the results of the first and second visual inspections. Product (R2). The second sub-tray mounting unit 822 can have various configurations, i.e., the configuration of the partial tray is fixed according to the sorting method. Moreover, the number of the second sub-tray mounting units 822 can be implemented in plural numbers to thereby divide the qualified and unqualified electronic components. For example, as shown in "Picture 7" and "Picture 9", the second sub-pallet Annon ❹7^822 contains one or more 2-1 to 2_3 sub-tray mounting units 8 (4), weaving It is used to receive the tray 20 from the first sub-tray mounting unit. The pass-through single 7C 210 'qualified electronic component 1' can be placed in one or more first sub-tray mounting units 822a 'the failed electronic component 10 detected by the first visual inspection' (RO can The defective electronic component 8 (8) detected in the second sub-tray mounting unit (4) and detected by the second visual inspection of the second inspection unit can be placed in the third sub-tray mounting unit 822c. in. The first-sub-pallet women's unit 822 can also include a buffer tray unit 424, which is used to temporarily mount or electronically prepare the device for erroneous operation of the device with 25 201033601. In the case where the first tray document loading unit (4) is implemented in plural in a manner similar to the first tray mounting unit 810 of the first detecting unit, the second tray mounting unit 820 may be arranged in the horizontal direction or the vertical direction. In view of the size of the apparatus, it is assumed that the arrangement direction of the first and second detecting units is the horizontal direction (the x-axis direction), and the second tray mounting unit 82G is preferably arranged in the vertical direction (the x-axis direction). The visual detecting unit 3GG and the tilting unit 21G have the same configuration as that of the second embodiment in accordance with the configuration and arrangement of the first and second tray mounting units 81G (4). In the case where the second tray mounting unit 82 includes the first sub-tray mounting unit 821 and the second sub-tray mounting unit 822, the tilting unit 21 and the visual detecting unit 3 can be configured to be capable of being supported by an additional robot 62〇, _ to operate independently of each other. The second visual detecting unit 3 can have various configurations, _, and can have a configuration similar to that of the first-visual detecting unit 63G, or a configuration similar to the second real_. As shown in "Fig. 7" and "Fig. 9", the second visual detecting unit 10300 can be mounted to the Χ·γ robot 64〇 so as to be movable in the χ and γ directions. The χ_γ robot 62 用以 for moving the first visual detecting unit 630 and the χ-γ robot 64 用以 for moving the second visual detecting unit can share the guide rail 65 ( ), and the movement of the working robot 620 , 640 can be along the guide rail 65 You are guided. As in the second embodiment, the pouring unit 21 is mounted in the main body ι, whereby the electronic 7G piece loaded on the tray plus 26 201033601 _ is transferred while the second sub-tray mounting unit 822 is moved. As shown in "Fig. 7 Γ^nr^t. 77" and "Fig. 9", the tilting unit 210 can be mounted to the χ-γ robot 32 to move in the X and γ directions. As with the second embodiment, the pallet stack # unit for stacking the trays 2G to be mounted to the first and second tray mounting units_, 82G thereon can also be installed in the main body_ to be automatically transferred Tray 20.

托盤堆叠單元500可具有與第二實施例她之構造,並具有 用以將托盤20供應至第—檢測單元之第—托盤絲單元⑽或從 第-檢測單S之第-托盤安裝單元_取略盤2()之構造。並 且,托盤堆疊單it 5GG可包含··第—托盤堆疊單元51(),係用以在 其上堆疊待進行視覺檢測之托盤2G並將托盤2()供應至第一檢測 單元之第-托盤安裝單元⑽;第二托盤堆叠料汹,係用以堆 疊空的托盤;以及第三托盤堆疊單元53(),_以在其上堆疊已完 全經過視覺檢測及分類製程之托盤2〇。 Q 考細視覺制係由第—及第二視覺檢晰成,第三托盤堆 叠單元53〇可包含:合格品托盤堆疊單元知,係用以在其上堆疊 裝載有合格的電子元件之托盤20 ;第一廢品托盤堆疊單元成, 係用以在其上堆疊裝載有第-視覺檢測所檢測出的不合格的電子 •元件U)⑻)之托盤20 ;以及第二廢品托盤堆叠單元知,係用 '以在其上堆疊裝載有第二視覺檢測所檢測出的不合格的電子元件 忉(R2)之托盤20。 (附圖中未示 托盤堆疊單元500還可包含一緩衝托盤單元 27 201033601 出)係用以在其上暫時堆疊於第一視覺檢測之後已經被倒置的托 盤20。 倒轉單元700可具有各種不同的構造。倒轉單元7⑻可接收 、”至過第檢測單元之第一次視覺檢測後的托盤2〇,並於隨後將裝 載於托盤20中的電子元件1(H到置,以使得還未經過視覺檢測的 電子元件10之其它表面(下表面或上表面)能夠在電子元件10 之一個表面(上表面或下表面)已經過第一次視覺檢測之後被執 行第二次視覺檢測。 ❹ 如第10A圖」至「第i〇c圖」中所示,倒轉單元7⑻可包 含:托盤拾取單元322,係用以在倒置托盤2〇之前拾取一臨時托 盤21 ;以及倒轉裝置72〇,係用以在托盤傳送單元所傳送之 托盤20上疊加被托盤拾取單元322所拾取之臨時耗盤21,並於隨 後將相重疊的臨時托盤21與托盤2G向下翻轉,進而將堆疊於托 盤20上電子元件10倒置於臨時托盤21之上。 用以在透過倒轉裝置72〇進行倒轉製程之前及之後拾取臨時❹ 托盤21之托盤拾取單元322可具有各種不同的構造。托盤拾取單 元322係於倒置托盤2〇之前拾取臨時托盤21。並於倒置托盤2〇 之後’拾取電子元件1〇 6被從中移除的空的托盤2〇藉以將其作, 為另一臨時托盤加以使用。 用以旋轉處於相重疊狀態的托盤2〇及臨時托盤21之倒轉裝 置720可具有各種不同的構造。倒轉裴置72〇可包含:托盤固定 28 201033601 單元72卜係用以在托盤傳送單元78〇所傳送之托盤2〇上叠加被 托盤拾取單元322所拾取之臨時托盤2卜並將相重叠的臨時托盤 .21及托盤20固定;以及托盤旋轉單元722,係用以旋轉相重叠的 臨時托盤21與托盤2〇。 其上用以裝載電子元件1〇之托盤可具有各種不同的構造。例 如,托盤2G可具有其上表面及下表面均能夠加以使用的結構。或 ❹者’托盤20可具有這樣的結構,即:裝載於托盤20之上表面上 的電子元件10可於托盤20被倒置後堆疊於托盤2〇之下表面上。 被托盤拾取單it 322拾取之臨時托盤21係將以與之相重疊的 托盤20相同之狀態被拾取。由於已被倒轉裝置72〇倒置的托盤 係處於朝下的狀態’因此在被倒轉裝置72〇倒置後用作臨時托盤 21之托•盤20將被倒置。 被倒轉單元7GG之娜裝置72G锻的其上賴有電子元件 • 1〇之臨時托盤21將透過另一托盤傳送單元580以倒置的狀態被傳 送至第二檢測單元以進行第二次檢測。 現在將對本發明之第三實酬之視覺制設備進行更為詳細 地說明。 與第二實施例相同,首先,待進行視覺檢測之托盤2〇係被堆 '疊於第一托盤堆疊單元510之上,並且將於第二托盤堆疊單元52〇 上堆疊一定數量的空托盤20。 當完成在第一托盤堆疊單元510上堆疊托盤2〇之時,第一檢 29 201033601 測單7L之托盤傳送單TL 78〇係將裝载有待進行視覺檢測之電子元 件10之托盤2〇從第-托盤堆叠單元供應至第一托盤安裳單 元 810。 當完成向第-把盤安裝單元81〇裝載托盤2〇之時,第一檢剛 單元之第一視覺檢測單元630將執行第一視覺檢測。 當第-視覺檢測完成時’耗盤傳送單元係從第一托盤安 裝單元810取回托盤20,並將托盤2〇傳送至倒轉單元7〇〇。在第 -托盤安裝單兀810實施為兩個或多個之情形中,第一視覺檢测 _ 單兀630能夠檢測裝載於其它第一托盤安裝單元81〇之托盤2〇中 的電子το件10。如此可使第-視覺檢測能夠被連續地加以執行。 在將托盤20傳送至倒轉單元7〇〇之後,托盤傳送單元78〇可 將待進行視覺檢測之另一托盤2〇從第一托盤堆疊單元51〇供應至 第一托盤安裝單元810。 收容有已經過第一視覺檢測之托盤2〇的倒轉單元7〇〇將在倒 置的托盤20上疊加臨時托盤21,並隨後將相重疊的托盤2〇及臨 © 時托盤21倒置,進而使裝載於托盤2〇中的電子元件1〇倒置。 當透過倒轉單元700完成托盤2〇之倒置時,托盤傳送單元58〇 將移動以便接收褒載有倒置的電子元件1〇之托盤2〇 (臨時托盤· 21) ’並於隨後將所接收的托盤2〇傳送至第二檢測單元之第二托 盤安裝單元820。 在托盤20被傳送至第二檢測單元之第二托盤安裝單元82〇, 30 201033601 特別是,第一子托盤安裝單元821之後,第二檢測單元300將以 與第二實施例相似之方式被操作。 - —第二視覺檢測及分類製程 *· - 一旦托盤20被安裝至第二檢測單元之第二托盤安裝單元820 的第一子托盤安裝單元821,第二視覺檢測單元300便將執行第二 視覺檢測。 在第二視覺檢測之後,托盤20將被托盤傳送單元580傳送至 第二子托盤安裝單元822。然後,裝載於托盤2〇中的電子元件1〇 將依據第一及第二視覺檢測之結果藉由傾倒單元21〇被加以分類。 分類製程可依據第二子托盤安裝單元822之數量及排佈以各 種不同的方式進行。 如上所述’第二子托盤安裝單元822可包含2-1至2_3子托盤 安裝單元822a、822b、822c。對於這些2-1至2-3子托盤安裝單元 ❹822a、822b、822c來說,待進行分類的托盤2〇可被連續地從第一 子托盤安裝單元821加以供應。 依據分類製程之結果,合格的電子元件1〇可被放置於2_丨子 托盤安裝單元822a之中’由第一視覺檢測所檢測出的不合格的電 •子元件10 (R1)可被放置於2_2子托盤安裝單元822b之中,並且 '由第二視覺檢測所檢測出的不合格的電子元件1〇 (R2)可被放置 於2-3子托盤安裝單元822c之中。 下面將說明藉由傾倒單元21〇之分類製程。 31 201033601 首先’傾倒單元210將拾取裝載於24 +托盤安襄單元㈣ 中的不合格的電子元件10 ([視覺檢酬檢_的不合格的電 子元件R1及帛二視覺触1}所檢測丨的不合格❾冑子元件幻),並 於隨後將所拾取的不合格的電子元件1〇傳送至2_2子托盤安裝單* 元822b或2_3子托盤安裝單元822c。 接著,傾倒單元210從2-2子托盤安裝單元822b或2_3子托 盤安裝單S 822e之紐2G巾拾取合格的電子树1(),並隨將不 合格的電子元件10 (第-視覺檢測所檢測出的不合格的電子元件❹ R1及第一視覺檢測所檢測出的不合格的電子元件们)放置到空餘 的空間中。 接著,傾倒單元210移回2-1子托盤安裝單元822a,並將從 2·2子托盤安裝單A 822b或2_3子托盤安裝單元822c中拾取的合 格的電子7G件10放制2_ 1 ?滅安裝單元822a之減2〇的空 餘空間中。 虽2-1子托盤安裝單元822a、2_2 ?托盤安裝單元82此及2 3 ® 子托盤安裝單tg 822c之托盤20已經分別完全被合格的電子元件 1〇、不合格的電子元件1〇 (R1)及不合格的電子元件i〇 (R2)填 滿時’托盤20將由新的托盤2〇加以替換,或者被傳送至托盤堆· 疊單元500。 r 如果需要的話,2·1至2·3子域安裝單元822a、咖、822c 可配设有從第二托盤堆#單元別供應之額外的空托盤。 32 201033601 已完全經過分類製程的托盤2〇將從第二子托盤安裝單元822 加以傳送,並堆疊到托盤堆疊單元5〇〇之上。 t具體而言,如果2·1子托盤絲單元822a之托盤2〇被合格 的電子元件1〇填滿,則托盤2〇將堆疊到合格品托盤堆疊單元531 之上。並且,如果2-2子托盤安裝單元822b及2_3子托盤安裝單 兀822c之托盤20被不合格的電子元件1〇 (R1及犯)填滿,那 麼托盤20將被堆疊到第一及第二廢品托盤堆叠單元议、知之 © 上。 在兩個第一及第二廢品托盤堆疊單元532、533中的一個廢品 托盤堆疊單元之上,被確定為係第一視覺檢測所檢測出的不合格 產品(R1)之托盤20將被加以堆疊。並且,在兩個第一及第二廢 品托盤堆叠單元532、533中的另一個廢品托盤堆疊單元之上,被 確定為係第二視覺檢測所檢測出的不合格產品(们)之托盤2〇將 被加以堆疊。 前述本發狀實施概優點健是具有代紐的並且並不構 成對本發明之關。其巾所提供之教示可實際應驗其它類型的 設備。此說明書僅是為了解釋說明,而並非用以限制本發明之申 ,請專利範圍。任何熟習相像技藝者,在不脫離本發明之精神和範 、圍内,當可對上述本發明作些許之、更動無飾,並可對上 述本發明之典型實施例的特徵、結構、方法及其它特性以各種不 同的方式加雖合,進崎得其它的和/或錢化的典型實施例。 33 201033601 因此’雖然本發明以前述之實施例揭露如上,然其並非用以 限定本發明。本領域之技術人員應當意識到在不脫離本發明所附 之申請專利範圍所揭示之本發明之精神和範圍的情況下,所作之 更動與潤飾’均屬本發明之專利保護範圍之内。關於本發明所界 定之保護範圍請參照所附之申請專利範圍。 【圖式簡單說明】 第1圖為習知技術之視覺檢測設備之平面圖; 第2圖為本發明第一實施例之視覺檢測設備之立體圖·, 第3A圖至第3C圖為第2圖之視覺檢測設備之運行平面圖; 第4圖為本發明第二實施例之視覺檢測設備之立體圖;The tray stacking unit 500 may have the configuration of the second embodiment, and has a tray-to-pallet unit (10) for supplying the tray 20 to the first detecting unit or a first tray mounting unit_ from the first detecting sheet S The structure of the 2 (). And, the tray stacking unit itself 5GG may include a first tray stacking unit 51() for stacking the tray 2G on which the visual inspection is to be performed and supplying the tray 2() to the first tray of the first detecting unit a mounting unit (10); a second tray stacking magazine for stacking empty trays; and a third tray stacking unit 53() for stacking trays 2 on which the visual inspection and sorting process has been completely performed. The Q-based visual system is determined by the first and second visual inspections, and the third tray stacking unit 53A may include: a quality product tray stacking unit for stacking trays 20 on which the qualified electronic components are loaded. a first waste tray stacking unit, configured to stack thereon a tray 20 loaded with unqualified electronic components U) (8) detected by the first visual inspection; and a second waste tray stacking unit A tray 20 on which the defective electronic component 忉 (R2) detected by the second visual inspection is loaded is stacked. (The tray stacking unit 500, not shown in the drawings, may further include a buffer tray unit 27 201033601) for temporarily holding the tray 20 which has been inverted after the first visual inspection. The reverse unit 700 can have a variety of different configurations. The inverting unit 7 (8) can receive, "to the tray 2〇 after the first visual inspection of the detecting unit, and then to mount the electronic component 1 loaded in the tray 20 (H is placed so that it has not been visually detected) The other surface (lower surface or upper surface) of the electronic component 10 is capable of performing a second visual inspection after the first visual inspection has been performed on one surface (upper or lower surface) of the electronic component 10. ❹ Figure 10A As shown in the "figure diagram", the reverse unit 7 (8) may include: a tray picking unit 322 for picking up a temporary tray 21 before inverting the tray 2; and an inverting device 72 for transporting the tray The temporary tray 21 picked up by the tray picking unit 322 is superimposed on the tray 20 conveyed by the unit, and then the temporary tray 21 and the tray 2G which are overlapped are turned down, and the electronic component 10 stacked on the tray 20 is placed upside down. Above the temporary tray 21. The tray picking unit 322 for picking up the temporary stack tray 21 before and after the reverse process through the reverse unit 72 can have various configurations. The 322 picks up the temporary tray 21 before inverting the tray 2, and after picking up the tray 2, 'takes the empty tray 2 from which the electronic component 1 is removed, to use it for another temporary tray. The inverting device 720 for rotating the tray 2 and the temporary tray 21 in an overlapping state may have various different configurations. The inverting device 72 may include: a tray fixing 28 201033601 The unit 72 is used in the tray conveying unit 78 The transported tray 2 is superimposed with the temporary tray 2 picked up by the tray picking unit 322 and the temporarily stacked temporary trays .21 and the tray 20 are fixed; and the tray rotating unit 722 is used to rotate the overlapping temporary trays 21 The tray on which the electronic component 1 is mounted may have various configurations. For example, the tray 2G may have a structure in which both the upper surface and the lower surface can be used. Alternatively, the tray 20 may have Such a structure, that is, the electronic component 10 mounted on the upper surface of the tray 20 can be stacked on the lower surface of the tray 2 after the tray 20 is inverted. The temporary tray 21 is picked up in the same state as the tray 20 which is overlapped therewith. Since the tray which has been inverted by the reverse unit 72 is in a downward state, it is used as a temporary after being inverted by the reverse unit 72. The tray 20 of the tray 21 will be inverted. The temporary unit 21 on which the electronic unit is mounted by the reverse unit 7GG device 72G will be transported to the first state through the other tray transfer unit 580. The second detecting unit performs the second detecting. The visual device of the third embodiment of the present invention will now be described in more detail. As in the second embodiment, first, the tray 2 to be visually detected is piled up. 'Stacked on the first tray stacking unit 510, and a certain number of empty trays 20 will be stacked on the second tray stacking unit 52'. When the stacking of the trays 2 is completed on the first tray stacking unit 510, the first tray 29 201033601, the tray transporting single TL 78 of the sheet 7L, will be loaded with the tray 2 of the electronic component 10 to be visually detected. The tray stacking unit is supplied to the first tray stacking unit 810. When the loading of the tray 2 to the first tray mounting unit 81 is completed, the first visual detecting unit 630 of the first detecting unit will perform the first visual inspection. When the first visual inspection is completed, the consuming tray transport unit retrieves the tray 20 from the first tray mounting unit 810 and transfers the tray 2 至 to the reverse unit 7 。. In the case where the first tray mounting unit 810 is implemented in two or more, the first visual inspection_unit 630 can detect the electrons 10 loaded in the tray 2 of the other first tray mounting unit 81. . This enables the first visual inspection to be performed continuously. After the tray 20 is conveyed to the reverse unit 7A, the tray transfer unit 78A can supply another tray 2 to be visually detected from the first tray stacking unit 51 to the first tray mounting unit 810. The reverse unit 7 accommodating the tray 2 that has passed the first visual inspection superimposes the temporary tray 21 on the inverted tray 20, and then inverts the overlapping tray 2 and the tray 21, thereby loading The electronic component 1 in the tray 2 is inverted. When the inversion of the tray 2 is completed by the inverting unit 700, the tray transfer unit 58 will move to receive the tray 2 (the temporary tray 21) carrying the inverted electronic component 1 and subsequently receive the tray 2〇 is transferred to the second tray mounting unit 820 of the second detecting unit. After the tray 20 is transported to the second tray mounting unit 82 of the second detecting unit, 30 201033601, in particular, after the first sub-tray mounting unit 821, the second detecting unit 300 will be operated in a similar manner to the second embodiment . - Second visual detection and classification process * - - Once the tray 20 is mounted to the first sub-tray mounting unit 821 of the second tray mounting unit 820 of the second detecting unit, the second visual detecting unit 300 will perform the second vision Detection. After the second visual inspection, the tray 20 will be conveyed by the tray transfer unit 580 to the second sub-tray mounting unit 822. Then, the electronic components 1〇 loaded in the tray 2 are sorted by the pouring unit 21 according to the results of the first and second visual inspections. The sorting process can be performed in various different ways depending on the number and arrangement of the second sub-tray mounting units 822. As described above, the second sub-tray mounting unit 822 may include 2-1 to 2_3 sub-tray mounting units 822a, 822b, 822c. For these 2-1 to 2-3 sub-tray mounting units ❹ 822a, 822b, 822c, the trays 2 to be sorted can be continuously supplied from the first sub-tray mounting unit 821. According to the result of the classification process, the qualified electronic component 1 can be placed in the 2_tray tray mounting unit 822a. The unqualified electrical component 10 (R1) detected by the first visual inspection can be placed. In the 2_2 sub-tray mounting unit 822b, and the defective electronic component 1 (R2) detected by the second visual inspection can be placed in the 2-3 sub-tray mounting unit 822c. The classification process by the dump unit 21 will be described below. 31 201033601 First, the 'dumping unit 210 will pick up the unqualified electronic component 10 loaded in the 24 + tray ampere unit (4) ([Visual inspection of defective electronic components R1 and 视觉2 visual touch 1]) The defective electronic component 1 is subsequently transferred to the 2_2 sub-tray mounting unit* 822b or the 2_3 sub-tray mounting unit 822c. Next, the pouring unit 210 picks up the qualified electronic tree 1() from the 2-2 sub-tray mounting unit 822b or the 2_3 sub-tray mounting single S 822e New 2G towel, and the unqualified electronic component 10 (the first visual inspection office) The detected defective electronic component ❹ R1 and the defective electronic components detected by the first visual inspection are placed in a free space. Next, the pouring unit 210 moves back to the 2-1 sub-tray mounting unit 822a, and releases the qualified electronic 7G piece 10 picked up from the 2·2 sub-tray mounting single A 822b or 2_3 sub-tray mounting unit 822c by 2_1? The installation unit 822a is in the vacant space of 2 减. Although the 2-1 sub-tray mounting unit 822a, 2_2, the tray mounting unit 82, and the tray 20 of the 2 3 ® sub-tray mounting single tg 822c have been completely qualified electronic components 1〇, defective electronic components 1〇 (R1 When the defective electronic component i (R2) is filled, the tray 20 will be replaced by a new tray 2 or transferred to the tray stack unit 500. r If necessary, the 2. 1 to 2.3 sub-domain mounting units 822a, cafés, 822c may be provided with additional empty trays supplied from the second pallet stack # unit. 32 201033601 The trays 2 that have been completely sorted are transferred from the second sub-tray mounting unit 822 and stacked onto the tray stacking unit 5〇〇. Specifically, if the tray 2 of the 2·1 sub-tray wire unit 822a is filled with the qualified electronic component 1〇, the tray 2〇 will be stacked on the good-goods tray stacking unit 531. And, if the trays 2 of the 2-2 sub-tray mounting unit 822b and the 2_3 sub-tray mounting unit 822c are filled with the unqualified electronic components 1 (R1 and guilt), the tray 20 will be stacked to the first and second The waste tray stacking unit is discussed and known. On one of the two first and second waste tray stacking units 532, 533, the tray 20 determined to be the defective product (R1) detected by the first visual inspection will be stacked. . And, on the other of the two first and second waste tray stacking units 532, 533, the tray 2 is determined to be the defective product (the) detected by the second visual inspection. Will be stacked. The foregoing embodiments of the present invention are exemplary and do not constitute a connection to the present invention. The teachings provided by the towel can actually fulfill other types of equipment. This description is for illustrative purposes only and is not intended to limit the scope of the invention. Any of the above-described embodiments of the present invention may be modified and modified without departing from the spirit and scope of the present invention, and may be characterized, constructed, and otherwise described in the above-described exemplary embodiments of the present invention. The features are added in a variety of different ways, and other exemplary embodiments of the other and/or money are obtained. 33 201033601 Thus, although the invention has been described above in the foregoing embodiments, it is not intended to limit the invention. It will be appreciated by those skilled in the art that <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; Please refer to the attached patent application for the scope of protection defined by the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view of a visual inspection apparatus of a prior art; FIG. 2 is a perspective view of a visual inspection apparatus according to a first embodiment of the present invention, and FIGS. 3A to 3C are diagrams of FIG. A plan view of the operation of the visual inspection device; FIG. 4 is a perspective view of the visual inspection device of the second embodiment of the present invention;

第5A圖至第5D圖為第4圖之視覺檢測設備之運行平面圖. 第6圖為第4圖之視覺檢測設備的托盤堆疊單元之局部立體 第7圖為本發明第三實施例之視覺檢測設備之立體圖 第8圖為第7 ®之部分视覺檢顺備的正視圖; 第9圖為第7圖之視覺檢測設備的平面圖;以及5A to 5D are plan views of the operation of the visual inspection apparatus of Fig. 4. Fig. 6 is a partial perspective view of the tray stacking unit of the visual inspection apparatus of Fig. 4. Fig. 7 is a visual inspection of a third embodiment of the present invention The perspective view of the device is shown in Fig. 8 as a front view of a portion of the visual inspection device of the 7th; and Fig. 9 is a plan view of the visual inspection device of the seventh embodiment;

第10A圖至第10c圖為第7圖之視覺檢測設備的倒轉 運行的局部正視圖。 K 【主要元件符號說明】 la10A to 10c are partial front views of the reverse operation of the visual inspection apparatus of Fig. 7. K [Main component symbol description] la

托盤裝載單元 導執 34 201033601Pallet loading unit guide 34 201033601

2 攝像機 4 分類單元 4a 導軌 5 托盤 6 拾取器 7 拾取器 10 電子元件 20 托盤 21 臨時托盤 100 主體 101 頂板部分 102 支撐部分 110 托盤安裝單元 111 導引構件 210 傾倒單元 211 拾取器 300 視覺檢測單元 320 X-Y機器人 322 托盤拾取單元 400 托盤安裝單元 401 托盤固定單元 35 201033601 410 第一托盤安裝單元 420 第二托盤安裝單元 424 緩衝托盤單元 500 托盤堆疊單元 501 底部 502 引導元件 503 把手 510 第一托盤堆疊單元 520 第二托盤堆疊單元 530 第三托盤堆疊單元 531 合格品托盤堆疊單元 532 第一廢品托盤堆疊單元 533 第二廢品托盤堆疊單元 580 托盤傳送單元 581 托盤拾取單元 582 拾取驅動單元 620 X-Y機器人 630 第一視覺檢測單元 640 X-Y機器人 650 導軌 700 倒轉單元 ❿ 36 201033601 720 倒轉裝置 721 托盤固定單元 722 托盤旋轉單元 780 托盤傳送單元 781 托盤拾取單元 810 第一托盤安裝單元 820 第二托盤安裝單元 821 第一子托盤安裝單元 822 第二子托盤安裝單元 822a 第一子托盤安裝單元 822b 第二子托盤安裝單元 822c 第三子托盤安裝單元 ⑩ 372 Camera 4 Sorting unit 4a Rail 5 Pallet 6 Picker 7 Picker 10 Electronic component 20 Pallet 21 Temporary tray 100 Main body 101 Top plate portion 102 Support portion 110 Pallet mounting unit 111 Guide member 210 Pour unit 211 Picker 300 Vision detecting unit 320 XY robot 322 tray picking unit 400 tray mounting unit 401 tray fixing unit 35 201033601 410 first tray mounting unit 420 second tray mounting unit 424 buffer tray unit 500 tray stacking unit 501 bottom 502 guiding member 503 handle 510 first tray stacking unit 520 Second tray stacking unit 530 Third tray stacking unit 531 Qualified product tray stacking unit 532 First waste tray stacking unit 533 Second waste tray stacking unit 580 Pallet transfer unit 581 Pallet picking unit 582 Pickup drive unit 620 XY robot 630 First vision Detection unit 640 XY robot 650 Guide rail 700 Reverse unit ❿ 36 201033601 720 Reverse device 721 Pallet fixing unit 722 Pallet rotation unit 780 Pallet transfer unit 781 Pallet Fetching unit 810 First tray mounting unit 820 Second tray mounting unit 821 First sub-tray mounting unit 822 Second sub-tray mounting unit 822a First sub-tray mounting unit 822b Second sub-tray mounting unit 822c Third sub-tray mounting unit 10 37

Claims (1)

201033601 七、申請專利範圍: h 一種視覺檢測設傷,係包含: 兩個或者多個其上裝載有電子元件之托盤;一視覺檢測單 元係用以對裝載於該等托盤中的電子元件進行視覺檢測;以- 及-傾倒單元,係用以依據視覺檢測之結果在該等托盤之間將 合格產品與不合格產品相互交換, 其中該傾倒單元係將合格的電子元件放置於一個或多個 托盤中,並將不合格的電子元件放置於剩下的一個或多個托盤 ® 中。 2. 如凊求項第1項所述之視覺檢測設備’其中該視覺檢測單元及 該傾倒單元可被獨立地加以驅動,或者可透過被固定至至少一 個軸桿上而彼此相互配合。 3. 如請求項第1項所述之視覺檢測設備,其中該傾倒單元包含複 數個用以拾取和放置電子元件之拾取器。 ❹ 4. 一種視覺檢測設備,係包含: 複數個第一托盤安裝單元’係用以分別安裝其上裝載有電 子元件之托盤; 一個或多個第二托盤安裝單元’係用以安裝空的托盤;♦‘ 一視覺檢測單元,係用以對裝載於托盤中的電子元件進行« 視覺檢測;以及 一傾倒單元,係用以依據視覺檢測之結果將合格及不合格 38 201033601 的電子元件分類至該第一托盤安裝單元及該第二托盤安裝單 元中的至少一個托盤安裝單元中。 5. 如請求項第4項所述之視覺檢測設備,其中該傾倒單元係配置 成將合格的電子元件放置到該第一托盤安裝單元的一個或多 個托盤之上,並可將不合格的電子元件放置到該第二托盤安裝 單元的空托盤之上。 6. 如請求項第4項所述之視覺檢測設備,還包含: 一個或多個第一托盤堆疊單元’係用以在其上堆疊其上裝 載有電子元件之托盤; 一個或多個第二托盤堆疊單元,係用以在其上堆疊空的托 盤; 一個或多個合格品托盤堆叠單元’係用以在其上堆疊裝載 有合格的電子元件之托盤; 一個或多個廢品托盤堆疊單元,係用以在其上堆疊裝载有 不合格的電子元件之托盤;以及 一托盤傳送單元,係用以在該第一托盤安裝單元、該第二 托盤安裝卓元、該第一托盤堆疊举元、該第二托盤堆疊單元、 該合格品托盤堆疊单元及該廢品托盤堆疊單元之間傳送托盤。 一種視覺檢測設備,係包含: 一個或多個第一托盤安裝單元,係用以安裝一個或多個其 上裝載有電子元件之托盤以用於視覺檢測; 39 、7. 201033601 檢利單元,係包含有肋對裝載於該第—托盤安裝 軍元之托盤中㈣子元魏行第—錢檢狀-第-視覺檢 測單元; 、!ί轉單元伽轉收已完全經職第—視覺檢測之托 盤’並將裝載於托盤中的電子元件倒置; 兩個或多鱗二托盤安裝單元,_以安裝被該倒轉單元 倒置的托盤; —-第二視覺檢測單元,_简额於該第二托盤安裝單 兀之托盤中的電子元件進行第二視覺檢測; -第二檢測單元,係包含有肋在該第二視覺檢測之後依 據該第視覺檢測及該第二視覺檢測之結果將裝載於該第二 托盤安裝單元之托射的電子元件劃分成合格及不合格之電 子產品的一傾倒單元;以及 -托盤傳送單元,係用以在該第一檢測單元、該倒轉單元 及該第二檢測單元之間傳送杷盤。 8*如請求項第7項所述之視覺也則設備,其中該倒轉單元包含: 托盤拾取單元,係用以在倒置該托盤之前拾取該倒置的 托盤;以及 一倒轉裝置’係用以在被該托盤傳送單元傳送的該托盤上 覆蓋被該托盤拾取單元拾取的該托盤,並於隨後將相重疊的一 對托盤倒轉,藉以使裝載於該托盤中的電子元件倒置。201033601 VII. Patent application scope: h A visual inspection and injury, comprising: two or more trays on which electronic components are mounted; a visual inspection unit for visualizing electronic components loaded in the trays Detecting; and - and - pouring units for exchanging qualified and non-conforming products between the trays based on the results of visual inspection, wherein the pouring unit places the qualified electronic components on one or more trays Place and place unqualified electronic components in one or more of the remaining trays®. 2. The visual inspection device of claim 1, wherein the visual detection unit and the tilting unit are independently drivable or mateable to each other by being fixed to at least one of the shafts. 3. The visual inspection device of claim 1, wherein the pouring unit comprises a plurality of pickers for picking up and placing electronic components. ❹ 4. A visual inspection device comprising: a plurality of first tray mounting units 'for respectively mounting a tray on which electronic components are mounted; one or more second tray mounting units' for mounting empty trays ; ♦ ' a visual inspection unit for « visual inspection of electronic components loaded in the tray; and a dumping unit for classifying the electronic components of the qualified and unqualified 38 201033601 according to the results of the visual inspection At least one of the first tray mounting unit and the second tray mounting unit. 5. The visual inspection device of claim 4, wherein the pouring unit is configured to place qualified electronic components onto one or more trays of the first tray mounting unit and may fail The electronic component is placed over the empty tray of the second tray mounting unit. 6. The visual inspection device of claim 4, further comprising: one or more first tray stacking units 'for stacking trays on which electronic components are mounted; one or more second a tray stacking unit for stacking empty trays thereon; one or more quality product tray stacking units 'for stacking trays with qualified electronic components thereon; one or more waste tray stacking units, a tray for loading unqualified electronic components thereon; and a tray transfer unit for mounting the first tray mounting unit, the second tray mounting unit, and the first tray stacking unit And transferring the tray between the second tray stacking unit, the quality product tray stacking unit, and the waste tray stacking unit. A visual inspection device comprising: one or more first tray mounting units for mounting one or more trays on which electronic components are mounted for visual inspection; 39, 7. 201033601 Detecting unit, The ribbed pair is loaded in the tray of the first tray-mounted military unit (four) Ziyuan Weixing - money inspection - first - visual inspection unit; ί 转换 unit gamma transfer has been fully used - visual inspection of the tray 'and the electronic components loaded in the tray upside down; two or multi-scale two tray mounting unit, _ to install the tray inverted by the inverted unit; a second visual inspection unit, _ a second visual inspection of the electronic components in the tray of the second tray mounting unit; a second detection unit comprising ribs according to the second visual inspection The visual inspection and the result of the second visual inspection divide the electronic component loaded in the second tray mounting unit into a dumping unit of the qualified and unqualified electronic product; and the tray conveying unit is configured to A tray is transferred between the first detecting unit, the inverting unit and the second detecting unit. 8* The visual device of claim 7, wherein the reverse unit comprises: a tray picking unit for picking up the inverted tray before inverting the tray; and a reverse device for being The tray conveyed by the tray transport unit covers the tray picked up by the tray picking unit, and then reverses the overlapping pairs of trays, thereby inverting the electronic components loaded in the tray.
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Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI624660B (en) * 2015-02-10 2018-05-21 宰体有限公司 Device handler, and vision inspection method
KR101940986B1 (en) * 2017-04-25 2019-01-22 주식회사 파워로직스 Apparatus for coupling bracket for comera module
KR101908436B1 (en) 2018-06-21 2018-10-16 (주)풍진솔루션 Automatic Detection System for Insert Parts of Airbag Cover Housing for Vehicle
KR102122760B1 (en) * 2018-11-21 2020-06-26 정성욱 System for changing tray
CN109444157A (en) * 2018-12-25 2019-03-08 苏州凡目视觉科技有限公司 A kind of scratch detection apparatus and method
CN111620118A (en) * 2020-05-29 2020-09-04 苏州天准科技股份有限公司 Blanking equipment and camera protection module detection system
KR102600760B1 (en) * 2021-03-23 2023-11-14 동원시스템즈 주식회사 Automatic inspection apparatus for small battery can
KR102367414B1 (en) * 2021-11-09 2022-02-25 주식회사 엔시스 Secondary battery sorting equipment

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01183826A (en) * 1988-01-19 1989-07-21 Toshiba Corp Method of supplying electronic component
US6956963B2 (en) * 1998-07-08 2005-10-18 Ismeca Europe Semiconductor Sa Imaging for a machine-vision system
KR200339601Y1 (en) * 2003-10-13 2004-01-24 한미반도체 주식회사 apparatus for vision inspection of semiconductor devices
US6919718B2 (en) * 2003-11-10 2005-07-19 Unisys Corporation System for testing a group of IC-chips having a chip holding subassembly that is built-in and loaded/unloaded automatically
KR100638311B1 (en) * 2005-01-31 2006-10-25 (주) 인텍플러스 Apparatus for inspecting semiconductor device and method for a classification semiconductor device using the same
KR100705655B1 (en) * 2005-10-19 2007-04-09 (주) 인텍플러스 Sorting method of semiconductor package
TWI311542B (en) * 2006-06-27 2009-07-01 Hon Tech Inc Testing machine for electronic element
US7514914B2 (en) * 2007-04-12 2009-04-07 Chroma Ate Inc Test circuits of an apparatus for testing system-in-package devices
KR100867386B1 (en) * 2007-06-29 2008-11-06 (주) 인텍플러스 System for vision inspection of semiconductor device
CN101396692B (en) * 2007-09-28 2012-02-29 鸿劲科技股份有限公司 Device capable of automatically detecting the electronic component appearance

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