TWI394225B - Quickly sorting machine and its method - Google Patents

Quickly sorting machine and its method Download PDF

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TWI394225B
TWI394225B TW99103627A TW99103627A TWI394225B TW I394225 B TWI394225 B TW I394225B TW 99103627 A TW99103627 A TW 99103627A TW 99103627 A TW99103627 A TW 99103627A TW I394225 B TWI394225 B TW I394225B
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carrier
classified
die
sorting
tray
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TW201128729A (en
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Chroma Ate Inc
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Description

晶粒快速分揀排列機台及方法Grain rapid sorting arrangement machine and method

本發明係關於一種晶粒分揀排列機台及分揀排列方法,尤其是一種設置有影像擷取裝置,預先將待分類承載盤上晶粒位置資料與預儲存資料比對確認之晶粒快速分揀排列機台及快速分揀排列方法。The invention relates to a grain sorting arrangement machine and a sorting and arranging method, in particular to an image capturing device, which preliminarily compares the grain position data on the carrier disk to be classified with the pre-stored data to confirm the grain fast. Sorting machine and quick sorting method.

為符合電子設備的輕薄短小潮流,目前電路元件大多微縮佈局至半導體基材上,藉由半導體技術,製造出電子產品上所需要之元件。半導體材料先由長晶及切割後形成晶圓,並在晶圓上佈線,構成例如數萬個電路元件的雛形,再於電路元件之間切割形成凹槽。隨後將整片晶圓移至一片具有黏性之撓性基層上而被黏附住,目前常見撓性基層為藍色薄膜,故一般稱為「藍膜」。當撓性基層被向四方外側拉開,黏附的晶粒便會依切割凹槽處彼此斷開,分割成數以萬計的晶粒;此時以一框架夾固住已延展之撓性基層即構成一盤載有數萬晶粒的承載盤。In order to meet the trend of thin and light electronic devices, most of the current circuit components are miniaturely laid onto semiconductor substrates, and semiconductor devices are used to manufacture components required for electronic products. The semiconductor material is first formed by wafer growth and dicing, and is wired on the wafer to form, for example, tens of thousands of circuit elements, and then cut into grooves between the circuit elements. The entire wafer is then adhered to a viscous flexible substrate and adhered. The current flexible substrate is a blue film and is generally referred to as a "blue film." When the flexible substrate is pulled away from the outside of the square, the adhered crystal grains are broken from each other according to the cutting groove, and are divided into tens of thousands of crystal grains; at this time, the stretched flexible substrate is clamped by a frame. It constitutes a carrier disk carrying tens of thousands of crystal grains.

因為此時所承載的晶粒尚未分類,故稱之為待分類承載盤。且基於待分類承載盤上所黏附置放的每一晶粒之電氣特性會有所不同,需先經一檢測機台,以大範圍、低解析度的攝影機紀錄所有晶粒在該承載盤上的相對位置,並檢測確認每一顆晶粒的電氣特性而將各晶粒的電氣特性與其在承載盤上的相對位置一同儲存;再經由另一分類機台依照前述檢測結果進行分類,將所有晶粒依照其各自特性而分別移載至各自不同的分類承載盤上。Since the crystal grains carried at this time are not classified yet, they are referred to as carrier disks to be classified. And the electrical characteristics of each die placed on the carrier to be classified are different. It is necessary to first record all the crystals on the carrier through a large-scale, low-resolution camera through a detection machine. Relative position, and confirming the electrical characteristics of each die to store the electrical characteristics of each die together with their relative positions on the carrier; and classifying them according to the aforementioned detection results by another sorting machine, The dies are respectively transferred to respective different sorting carriers according to their respective characteristics.

目前一般機台中,待分類承載盤與分類承載盤其實架構相同,唯一差異在於所承載晶粒是否經過分類。待分類承載盤1’如圖1所示,包含撓性基層11’及框架12’,作為撓性基層11’的藍膜如上所述,係被外拉伸延展成平面,再由可分離成上、下兩框體之框架12’上下夾合固定,為便於說明,以下稱撓性基層11’延展平面的中央、供放置晶粒的位置為置放區13’,遠離該置放區13’的部分則稱為邊陲區14’。且為呈現待分類承載盤1’置放區13’中所承載黏附之晶粒還沒被搬移整理,圖中雖未逐一繪出各晶粒,但特別將該等晶粒依照特性劃分為Ⅰ、Ⅱ、Ⅲ、Ⅳ、Ⅴ、Ⅵ等不同特性之區域;每一區域則分別包括複數晶粒。In the general machine, the carrier disk to be classified is the same as the class carrier disk. The only difference is whether the carrier die is classified. As shown in FIG. 1 , the carrier tray 1 ′ to be classified includes a flexible base layer 11 ′ and a frame 12 ′. As described above, the blue film as the flexible base layer 11 ′ is stretched and expanded into a plane, and then separated into The frame 12' of the upper and lower frames is sandwiched and fixed on the upper and lower sides. For convenience of explanation, the center of the extending plane of the flexible base layer 11' is hereinafter referred to as a placement area 13', away from the placement area 13 The part of ' is called the border area 14'. The granules that are carried in the placement area 13' of the tray 1' to be sorted are not yet removed. Although the dies are not drawn one by one in the figure, the granules are specifically classified into I according to characteristics. Regions with different characteristics such as II, III, IV, V, VI; each region includes a plurality of grains.

分類晶粒的機台則如圖2所示,主要包含:控制模組(圖未示)、移動待分類承載盤1’的移動裝置2’、移動分類承載盤3’的移動裝置2”、及工作臂4’。其中,圖式左下方為待分類承載盤1’,置放區13’中所承載黏附之晶粒仍繪示為如圖1所示之Ⅰ、Ⅱ、Ⅲ、Ⅳ、Ⅴ、Ⅵ等不同特性區域,並經由移動裝置2’依照箭頭方向將待分類承載盤1’移動至圖式左上方之一汲取位置(未標號),供工作臂4’吸取晶粒5,並由另一移動裝置2”移動一分類承載盤3’,使得該分類承載盤3’被移動到圖式右上方的承載位置(未標號),使其置放區13”對應該工作臂4’進行移載作業之放置位置。控制模組隨即操控工作臂4’將待分類承載盤1’上,符合該類特性之晶粒5移轉至分類承載盤3’的置放區13”。The machine for classifying the crystal grains is as shown in FIG. 2, and mainly includes: a control module (not shown), a mobile device 2' that moves the carrier disk 1 to be classified, and a mobile device 2 that moves the classified carrier 3', And the working arm 4'. wherein the lower left of the figure is the carrier tray 1' to be classified, and the adhered crystal grains in the placement area 13' are still shown as I, II, III, IV as shown in FIG. V, VI and other different characteristic regions, and moving the to-be-classified carrier 1' to the upper left position of the drawing (not labeled) according to the direction of the arrow via the moving device 2', for the working arm 4' to suck the die 5, and Moving a sorting carrier 3' by another mobile device 2", so that the sorting carrier 3' is moved to the carrying position (not labeled) at the upper right of the drawing, so that its placement area 13" corresponds to the working arm 4' The placement position of the transfer operation is performed. The control module then manipulates the working arm 4' to transfer the die 5 conforming to the characteristics to the placement area 13" of the classification carrier 3'.

當待分類承載盤1’上例如第III類晶粒5已經被移載完畢,控制模組便控制移動裝置2”將第三類的分類承載盤3’移回機台之存放區,並由分類承載盤3’的存放區中,移出另一類的承載盤至承載位置供繼續移載。當然,若待分類承載盤1’中第III類晶粒5尚未完全移除前,分類承載盤3’已經滿載,亦將由移動裝置2”將滿載的分類承載盤3’移回存放區,並取出另一空的分類承載盤3’,繼續將待分類承載盤1’上的該類晶粒5移載完畢。當移載作業完成,所有滿載的待分類承載盤上,都分別置放有相同特性的晶粒,而作業人員會依此特性如圖3所示,用人工方將對應該晶粒特性之標籤35’黏貼於各分類承載盤3’的邊陲區34’,以供後續操作時辯識之用。When, for example, the type III die 5 on the carrier tray 1 to be classified has been transferred, the control module controls the mobile device 2 to move the third type of classification carrier 3' back to the storage area of the machine, and In the storage area of the classification carrier 3', the carrier tray of another type is removed to the carrying position for further transfer. Of course, if the type III die 5 in the carrier tray 1' to be classified has not been completely removed yet, the carrier tray 3 is classified. 'Already fully loaded, the fully loaded sorting tray 3' will be moved back to the storage area by the mobile device 2, and another empty classified carrier tray 3' will be taken out, and the type of crystal grains 5 on the carrier tray 1' to be classified will continue to be moved. The load is completed. When the transfer operation is completed, all the loaded trays to be classified are placed with the same characteristics of the crystal grains, and the operator will use the manual to display the label corresponding to the grain characteristics according to the characteristics as shown in FIG. 35' is adhered to the side edge area 34' of each class carrier tray 3' for identification in subsequent operations.

然而,以往的分類機台僅在汲取位置與承載位置分別設置有監視攝影機,前者監視工作臂將晶粒由待分類承載盤中取出,後者監視工作臂將晶粒放入分類承載盤中。但是,考量晶粒被檢測而定其特性時是在另一機台中作業,且檢測完畢後未必立即進行後續的分類作業。當檢測作業與分類作業分隔的時間愈久,藍膜可能因為本身拉伸程度不一、或環境溫度、濕度變化等各種因素而產生後續形變,使得原先紀錄的各晶粒與待分類承載盤相對位置產生變化。However, the conventional sorting machine is provided with a monitoring camera only in the capturing position and the carrying position. The former monitoring working arm takes out the die from the carrier to be classified, and the latter monitors the working arm to put the die into the sorting carrier. However, when the die is detected and its characteristics are determined, it is operated in another machine, and the subsequent sorting operation may not be performed immediately after the test is completed. When the detection operation is separated from the classification operation for a long time, the blue film may be deformed by various factors such as different stretching degrees or environmental temperature and humidity changes, so that the previously recorded crystal grains are opposite to the carrier to be classified. The position changes.

由於分類機台設置在汲取位置的監視攝影機需以高解析度、小範圍的監視,才能在移載的過程中藉以獲得被汲取晶粒的精確位置與角度等資訊;一旦當上述藍膜收縮或伸張所造成的晶粒位置移動達到例如半顆晶粒的尺寸大小、或扭轉達一定程度時,在監視範圍僅有數百顆晶粒的影像畫面中,將相當難與原先紀錄的晶粒位置比對、並判斷該行或該列被偏移晶粒係原先檢測時所記錄的哪一行或哪一列。此種比對誤差,無疑將在分類過程中造成相當大的困擾、並平添誤判的機會。Since the surveillance camera set in the pickup position needs to be monitored with high resolution and small range, information such as the precise position and angle of the captured crystal can be obtained during the transfer process; once the blue film shrinks or When the grain position movement caused by stretching reaches, for example, the size of a half grain, or when it is twisted to a certain extent, it will be quite difficult to match the previously recorded grain position in an image of only a few hundred grains in the monitoring range. Align and determine which row or column of the row or column was recorded when the offset die was originally detected. This kind of comparison error will undoubtedly cause considerable troubles in the classification process and add opportunities for misjudgment.

因此,目前習知的分類機台在進行分類過程中,係先由移動裝置將待分類承載盤移動至汲取位置,並將攝影機以低倍率方式對該待分類承載盤之置放區進行大範圍拍攝,以便與原先檢測機台所紀錄的晶粒分佈資料進行比對,確認各晶粒之分佈位置與電氣特性。再調整攝影機的解析倍率至高解析度、並縮小攝影範圍,隨後由工作臂在監測下進行晶粒移載作業。當晶粒被挑選並由該取放裝置移載至承載位置的對應分類承載盤時,再由另一台監視攝影機以高解析倍率、小範圍攝影的方式監控工作臂的置放過程,以確保該分類承載盤上之晶粒被整齊排列。Therefore, in the current classification process, the conventional classification machine first moves the to-be-classified carrier to the capture position by the mobile device, and the camera performs a wide range of the placement area of the carrier to be classified in a low-rate manner. The photograph was taken to compare with the grain distribution data recorded by the original inspection machine, and the distribution position and electrical characteristics of each crystal grain were confirmed. Then adjust the resolution of the camera to high resolution, and reduce the range of photography, and then carry out the grain transfer operation under the supervision of the working arm. When the die is selected and transferred by the pick and place device to the corresponding sorting carrier of the carrying position, the monitoring camera is monitored by another monitoring camera with high resolution and small range photography to ensure the placement process of the working arm. The dies on the sorting carrier are arranged neatly.

然而,一方面在汲取位置處的監視攝影機需反覆在低倍率大範圍攝影、以及高倍率小範圍的攝影方式間切換,使得汲取過程與比對過程彼此岔斷,造成作業流程上的延宕。另方面,監視攝影機持續進行高、低倍率的交替切換,不僅會造成機器設備的消耗性損害,降低使用壽命,增加停機維修保養及更換攝影設備之成本,造成工作效率不彰,也會因為不斷往復自動對焦中,偶然發生失焦問題而更增加停機頻率。However, on the one hand, the surveillance camera at the pickup position needs to repeatedly switch between the low-magnification wide-range photography and the high-magnification small-range photography mode, so that the capturing process and the comparison process are interrupted each other, resulting in delay in the workflow. On the other hand, surveillance cameras continue to switch between high and low magnifications, which not only causes consumable damage to machinery and equipment, reduces service life, increases the cost of downtime maintenance and replacement of photographic equipment, and results in inefficient work. In reciprocating autofocus, the out-of-focus problem occurs occasionally and the shutdown frequency is increased.

因此,如何提升作業效率、降低晶粒位置被誤判的機會、減少機械設備的損耗與停機發生的頻率,就是增加產出、降低成本、提升分揀排列機台競爭力的重要法門。Therefore, how to improve work efficiency, reduce the chance of misidentification of die position, reduce the loss of mechanical equipment and the frequency of downtime is an important method to increase output, reduce costs, and improve the competitiveness of sorting machines.

本發明之一目的在提供一種依照各自不同需求、透過多組專屬檢測攝影設備分別在不同操作條件下進行監測,以增加分揀效率之晶粒快速分揀排列機台。An object of the present invention is to provide a die rapid sorting and arranging machine for increasing sorting efficiency by monitoring a plurality of sets of exclusive detecting and photographic apparatuses according to different needs.

本發明之另一目的在提供一種減少監測裝置的倍率變化需求、從而提升產出效率之晶粒快速分揀排列機台。Another object of the present invention is to provide a die rapid sorting machine that reduces the need for rate change of a monitoring device, thereby improving output efficiency.

本發明之再一目的在提供一種減少監測裝置的倍率變化需求、從而延長監測裝置使用壽命之晶粒快速分揀排列機台。Still another object of the present invention is to provide a die rapid sorting machine that reduces the need for rate change of a monitoring device and thereby extends the life of the monitoring device.

本發明之又一目的在提供一種依照各自不同需求、透過多組專屬檢測攝影設備分別在不同操作條件下進行監測,以增加分揀效率之晶粒快速分揀排列方法。Another object of the present invention is to provide a rapid grain sorting method for increasing sorting efficiency by monitoring multiple different sets of dedicated photographic equipment according to different needs.

依照本發明揭露之晶粒快速分揀排列機台,係由一種晶粒快速分揀排列機台,供置放至少一個置放有複數已知特性晶粒之待分類承載盤,及複數個分別對應不同特性晶粒、並分別具有一個供放置複數晶粒之承載件的分類承載盤;其中,該待分類承載盤上之該等晶粒特性及該等晶粒在該待分類承載盤上之位置資料係被儲存於一個儲存裝置;該機台包含:一個帶動該待分類承載盤經一個影像擷取位置至一個晶粒提取位置之輸送裝置;一個對應該影像擷取位置,即時擷取該待分類承載盤上晶粒位置資料之影像擷取裝置;一個接收該影像擷取裝置所擷取即時影像資料,與該儲存裝置中預儲存之該待分類承載盤上所承載該等晶粒的晶粒位置資料進行比對,以確認該等晶粒各自之特性的控制裝置;一個對應該晶粒提取位置之提取監測裝置;一個分類承載盤移載裝置,依照該控制裝置之指令,將上述分類承載盤中之至少一個移動至一個預定承載位置;一個對應該預定承載位置之承載監測裝置;及一個受該控制裝置驅動,在該晶粒提取位置、受該提取監測裝置監測而汲取位於該待分類承載盤上、對應該位於該預定承載位置之分類承載盤的特性類別之晶粒,在該承載監測裝置監測下、移載至該位於該預定承載位置之分類承載盤承載件上的取放裝置。The die fast sorting machine according to the present invention is a sorting and arranging machine for sorting at least one die to be classified with a plurality of known characteristic crystal grains, and a plurality of respectively Corresponding to the different characteristic dies, and each having a carrier for placing a plurality of dies; wherein the grain characteristics on the carrier to be classified and the dies are on the carrier to be classified The location data is stored in a storage device; the machine includes: a conveying device that drives the to-be-classified carrier tray through an image capturing position to a die extraction position; and a corresponding image capturing position, which is immediately captured An image capturing device for classifying the die position data on the carrier disk; receiving an instant image data captured by the image capturing device, and storing the crystal grains on the to-be-classified carrier disk pre-stored in the storage device A control device for comparing the crystal grain position data to confirm the respective characteristics of the crystal grains; an extraction monitoring device corresponding to the crystal grain extraction position; and a classification carrier disk transfer Positioning, in accordance with an instruction of the control device, moving at least one of the classified carrier trays to a predetermined load bearing position; a load bearing monitoring device corresponding to the predetermined load bearing position; and a drive device driven by the control device at the die extraction position Obtaining, by the extraction monitoring device, a die of a characteristic category of the classified carrier tray located on the to-be-classified carrier, corresponding to the predetermined carrier position, under the monitoring of the bearer monitoring device, and moving to the predetermined location The classification of the carrying position carries the pick-and-place device on the carrier of the disk.

而本發明揭露之晶粒快速分揀排列方法,係供一個其上放置有複數晶粒之待分類承載盤上之該等晶粒,依照其晶粒特性分類;其中該等晶粒依照其晶粒特性被分類之資料、係與該等晶粒被檢測其晶粒特性時,該等晶粒位於該待分類承載盤上之位置資料共同被儲存於一記憶裝置,且該方法包含下列步驟:The method for rapidly sorting and arranging the crystal grains disclosed in the present invention is for classifying the crystal grains on a carrier to be classified on which a plurality of crystal grains are placed, according to the grain characteristics thereof; wherein the crystal grains are in accordance with the crystal grains thereof. When the particle characteristics are classified, and the grain characteristics of the crystal grains are detected, the position data of the crystal grains on the carrier to be classified are collectively stored in a memory device, and the method includes the following steps:

a)由一影像擷取裝置擷取該待分類承載盤上之該等晶粒現時位置資料;a) capturing, by an image capturing device, the current position data of the same on the to-be-classified carrier;

b)將該現時位置資料與該被儲存位置資料比對,確認各該晶粒特性之晶粒相對該待分類承載盤位置,並移動該待分類承載盤至一個受一提取監測裝置監測之晶粒提取位置;且選擇該等分類中之一類,並移動一個對應該分類之分類承載盤至一個受一承載監測裝置監測之預定承載位置;及b) comparing the current location data with the stored location data, confirming the position of each of the die characteristics of the die relative to the to-be-classified carrier, and moving the to-be-classified carrier to a crystal monitored by an extraction monitoring device Grain extraction location; and selecting one of the categories, and moving a classified carrier tray corresponding to the classification to a predetermined bearing location monitored by a load bearing monitoring device;

c)由一控制裝置驅動一取放裝置在該晶粒提取位置、受該提取監測裝置監測而汲取位於該待分類承載盤上、對應該位於該預定承載位置之分類承載盤的特性類別之晶粒,並在該承載監測裝置監測下、移載至該位於該預定承載位置之分類承載盤上。c) driving, by a control device, a pick-and-place device at the die extraction position, being monitored by the extraction monitoring device, and picking up a characteristic class of the classified carrier disk located on the to-be-classified carrier tray corresponding to the predetermined carrier position The particles are transferred to the classified carrier tray at the predetermined carrying position under the monitoring of the load bearing monitoring device.

因此,本發明之晶粒快速分揀排列機台及方法,係依照各自操作環境需求,透過多組監測裝置進行影像擷取與監測,各監測裝置的影像擷取倍率無需反覆變換,不僅有效提升晶粒分揀排列的產出效率,也降低誤判發生機率、減少不必要的停機發生機率、延長監測裝置的使用壽命,有別於以往的檢測方式,達到上述所有之目的。Therefore, the die rapid sorting machine and method of the present invention perform image capturing and monitoring through multiple sets of monitoring devices according to the requirements of respective operating environments, and the image capturing magnification of each monitoring device does not need to be repeatedly changed, which not only effectively improves The output efficiency of the grain sorting arrangement also reduces the probability of misjudgment, reduces the probability of unnecessary downtime, and prolongs the service life of the monitoring device, which is different from the previous detection methods and achieves all of the above objectives.

本發明晶粒快速分揀排列機台,同樣是被放置有至少一個待分類承載盤,及複數個分別對應不同特性晶粒、並分別具有一個供放置複數晶粒之承載件的分類承載盤,以對尚未分類之晶粒進行分揀及排列的分類動作。The die fast sorting and arranging machine of the present invention is also provided with at least one carrier disk to be classified, and a plurality of classifying carrier disks respectively corresponding to different characteristic crystal grains and respectively having a carrier for placing a plurality of crystal grains. Classification actions for sorting and arranging unclassified grains.

本案第一較佳實施例之晶粒快速分揀排列機台1如圖4所示,其上放置有至少一個待分類承載盤11,待分類承載盤11上的承載區並承載諸如兩萬顆已知特性之例如發光二極體晶粒;承載盤置放區19如圖式左上方所示,例釋為八個存放區,其中一個存放區置放滿載的已經分類承載盤,另一個存放區則置放空的分類承載盤,其餘六個存放區中的分類承載盤12則分別對應本例中之六種不同類別特性的晶粒。其中,待分類承載盤11上之該等晶粒位置及各自的電氣特性資料均已經由前一級的檢測機台紀錄完成,並傳輸至一個儲存裝置儲存。As shown in FIG. 4, the die fast sorting machine 1 of the first preferred embodiment of the present invention has at least one carrying tray 11 to be classified, and the carrying area on the carrying tray 11 is to be classified and carries 20,000 pieces. Known characteristics such as light-emitting diode dies; the carrier tray placement area 19 is shown in the upper left of the figure, and is illustrated as eight storage areas, one of which is filled with the fully loaded carrier tray and the other is stored. The area is emptied of the classified carrier, and the classified carrier 12 of the remaining six storage areas respectively correspond to the crystals of the six different types of characteristics in this example. The die positions on the carrier tray 11 to be classified and the respective electrical characteristic data have been recorded by the detection machine of the previous stage and transmitted to a storage device for storage.

該機台主1要包含:輸送裝置13、影像擷取裝置14、控制裝置、儲存裝置、提取監測裝置15、分類承載盤移載裝置16、承載監測裝置17、取放裝置18及承載盤置放區19。而該影像擷取裝置14、提取監測裝置15及承載監測裝置17在本例中均為CCD攝影機,但為因應不同作業條件需求,影像擷取裝置14是採取大範圍,但解析度較低的條件擷取影像,另外兩者則是以高解析度、小範圍的操作條件進行監測。The machine main 1 includes: a conveying device 13, an image capturing device 14, a control device, a storage device, an extraction monitoring device 15, a sorting carrier transfer device 16, a load monitoring device 17, a pick-and-place device 18, and a carrier tray Put area 19. The image capturing device 14, the extraction monitoring device 15, and the load monitoring device 17 are both CCD cameras in this example, but the image capturing device 14 takes a wide range but has a low resolution in response to different operating conditions. The condition captures the image, and the other two are monitored with high resolution and small range of operating conditions.

一併參照圖10之流程,首先在步驟21,如圖5所示,由於待分類承載盤11中之該等晶粒已經分別被檢測過,且每個晶粒依照其特性被分類之資料與其位於待分類承載盤11上之位置資料都已經被傳輸至機台1的記憶裝置中儲存,故由輸送裝置13將待分類承載盤11移動至一個影像擷取位置,並由對應於該影像擷取位置之影像擷取裝置14,以低解析度大範圍拍攝方式例如每個畫面擷取數百至上千顆晶粒的模式,擷取該待分類承載盤11上所有晶粒的現時位置資料。Referring to the flow of FIG. 10, first, in step 21, as shown in FIG. 5, since the crystal grains in the carrier tray 11 to be classified have been separately detected, and each of the crystal grains is classified according to its characteristics, The location data on the carrier tray 11 to be classified has been transferred to the memory device of the machine 1 for storage. Therefore, the transport device 13 moves the tray 11 to be classified to an image capturing position, and corresponds to the image. The image capturing device 14 of the position captures the current position data of all the crystal grains on the carrier tray 11 to be classified in a low-resolution large-range shooting mode, for example, a mode of capturing hundreds to thousands of crystal grains per frame.

步驟22時由該控制裝置接收影像擷取裝置14所傳來即時影像資料,將該待分類承載盤11之晶粒現時分佈位置資料與預先儲存的所有晶粒位置資料進行比對,以確認各晶粒在當初受檢測時之晶粒位置與現時位置的對應關係,進一步,由於當初受檢測時的晶粒位置與晶粒特性是相關連地儲存,確定晶粒現時位置與受檢測時位置關係後,就能一併確定各晶粒特性。In step 22, the control device receives the real-time image data transmitted by the image capturing device 14, and compares the current distribution position data of the die to be sorted with the pre-stored all the grain position data to confirm each Correspondence between the grain position and the current position of the grain when it is initially detected. Further, since the grain position and the grain characteristic are originally stored in association with the original detection, the relationship between the current position of the grain and the position at the time of detection is determined. After that, each grain characteristic can be determined together.

當確認完畢,即如圖6所示進行步驟23,將待分類承載盤11由輸送裝置13依照控制裝置之指令,移至一個晶粒提取位置。在該晶粒提取位置,對應設置有一個提取監測裝置15,為確保汲取晶粒時,可以順利補償現時晶粒位置的偏移、扭轉,提取監測裝置15需要特別將影像擷取範圍縮減成整個擷取範圍涵蓋僅數十至數百顆晶粒的尺寸大小,並同時提高解析度,因此不僅可以辨識出每個晶粒的所在位置,還可以順利分辨其在該位置上的精確角度等情況。由此,可以選定該等晶粒特性分類中之一類,在提取監測裝置15監測下,由一具有吸嘴之工作臂的取放裝置18逐個將該類別的晶粒從待分類承載盤11中取出。當然,若晶粒現時位置與取放裝置18間有偏差,而取放裝置18本身可三維移動,亦可直接由取放裝置18進行補償;但為節約取放裝置18的作業時間、降低其設置成本、並且減少不必要的維修保養複雜度,在本例中,則是藉由控制輸送裝置13進行定位、校正及座標補償。When the confirmation is completed, that is, step 23 is performed as shown in FIG. 6, the carrier tray 11 to be sorted is moved by the conveying device 13 to a die extraction position in accordance with an instruction of the control device. In the die extraction position, an extraction monitoring device 15 is provided correspondingly. In order to ensure that the current die position is offset and twisted smoothly when the die is captured, the extraction monitoring device 15 needs to reduce the image capturing range to the whole. The range of tens to hundreds of dies is increased, and the resolution is improved at the same time, so that not only the position of each granule but also the precise angle at that position can be distinguished. . Therefore, one of the class of the grain characteristics can be selected. Under the monitoring of the extraction monitoring device 15, the pick-and-place device 18 of the working arm having the nozzle is used to sort the die of the class from the tray 11 to be classified. take out. Of course, if the current position of the die is deviated from the pick-and-place device 18, and the pick-and-place device 18 itself can be moved in three dimensions, it can be directly compensated by the pick-and-place device 18; however, to save the working time of the pick-and-place device 18 and reduce it The cost is set and unnecessary maintenance complexity is reduced. In this example, positioning, correction, and coordinate compensation are performed by controlling the conveyor 13.

步驟24如圖7所示,先將一個對應上述分類的分類承載盤12由移載裝置16從置放區19中取出,移動至對應承載監測裝置17的一個預定承載位置。並於步驟25由取放裝置18攜帶原先從待分類承載盤汲取出的晶粒,沿一樞軸旋轉,並在承載監測裝置17監測下,將晶粒移載置放至位於預定承載位置之分類承載盤12的承載件上,為確保置放時的位置與角度精準,承載監測裝置17也是以高解析度小範圍拍攝方式監控晶粒移載及放置位置之正確性。同樣地,若晶粒汲取角度、位置有偏差或偏轉,在本例中也是由分類承載盤的移載裝置進行定位、校正及座標補償。As shown in FIG. 7, a sorting carrier 12 corresponding to the above classification is first taken out from the placement area 19 by the transfer device 16 and moved to a predetermined carrying position of the corresponding load monitoring device 17. And in step 25, the pick-and-place device 18 carries the die that was originally taken out from the tray to be sorted, rotates along a pivot, and under the monitoring of the load-bearing monitoring device 17, the die is placed and placed at a predetermined load position. On the carrier of the classification carrier 12, in order to ensure accurate position and angle when placed, the load monitoring device 17 also monitors the correctness of the grain transfer and placement position in a high-resolution small-range shooting mode. Similarly, if the grain extraction angle or position is deviated or deflected, in this example, the positioning, correction, and coordinate compensation are performed by the transfer device of the sorting carrier.

當該分類承載盤之晶粒置放區已經滿載晶粒,則進行步驟26,如圖8所示,控制裝置驅動移載裝置16將該滿載的分類承載盤12移至承載盤置放區19,且該承載盤置放區19除了係供已滿載的分類承載盤12置放;若該分類承載盤12尚未滿載,則於步驟27持續移載直到該待分類承載盤所承載之該類別晶粒已移載完,才如圖9所示,將對應該類別的分類承載盤12,同樣由該移載裝置16送回至承載盤置放區19,並取出對應另一類別的分類承載盤12,移載待分類承載盤上的另一類別晶粒。上述輸送裝置及分類承載盤移載裝置均為二維載台,係以X軸及Y軸方向移動至取放裝置對應位置,以供取放裝置將晶粒吸取或放置。已完成分類移載作業之分類承載盤,亦可於步驟28,在該等分類承載盤上額外將該等分類以附加標示片的方式標示,以供辯識之用。When the die placement area of the sorting carrier is full of the die, step 26 is performed. As shown in FIG. 8, the control device drives the transfer device 16 to move the fully loaded sorting carrier 12 to the carrier placement area 19 And the tray placement area 19 is placed for the fully loaded classification carrier 12; if the classification carrier 12 is not fully loaded, the loading is continued in step 27 until the category of crystals carried by the tray to be classified After the particles have been transferred, as shown in FIG. 9, the sorting carrier 12 of the corresponding category is also sent back to the carrying tray placement area 19 by the transfer device 16, and the sorting carrier tray corresponding to another category is taken out. 12. Transfer another type of die on the carrier to be classified. The conveying device and the sorting carrier transfer device are both two-dimensional stages, and are moved to the corresponding positions of the pick-and-place device in the X-axis and Y-axis directions for the pick-and-place device to suck or place the crystal grains. The classification carrier trays of the classified transfer operations may be completed, and in step 28, the classifications may be additionally marked on the classified carrier trays by means of additional labels for identification purposes.

本發明所提供之晶粒快速檢測之分類機台及方法,與習用技術相互比較時,更具有下列之優點:The classification machine and method for rapid grain detection provided by the invention have the following advantages when compared with the conventional technology:

1.與習知技術相較,每一位置比對與監視作業係透過專屬的攝影設備進行作業,因為只需負責單一作業,因此可降低攝影設備不斷往復調整影像擷取狀態時所花費的時間,有效提升產出效率。1. Compared with the prior art, each position comparison and monitoring operation works through a dedicated photographic apparatus, because it is only responsible for a single operation, thereby reducing the time taken by the photographic apparatus to continuously adjust the image capturing state. Effectively improve output efficiency.

2.攝影設備只需單一作業,因此不需進行高、低倍率的交替循環,減少設備因為經常交替轉換造成的消耗性損害,減少無謂停機保養或更換攝影設備之次數,降低運作成本。2. The photographic equipment only needs a single operation, so there is no need to carry out alternating cycles of high and low magnification, reducing the consumable damage caused by frequent alternating conversion of the equipment, reducing the number of unnecessary maintenance or replacement of the photographic equipment, and reducing the operating cost.

3.每台攝影設備均有特定的單一運作條件,由於不需持續轉換,運作條件容易保持,使得晶粒在位置比對及移載時的正確性大幅增加,也使得作業上可更加的方便,不會因為晶粒在位置比對及移載的過程出現錯誤使得作業效率降低。3. Each photographic equipment has a specific single operating condition. Because there is no need for continuous conversion, the operating conditions are easy to maintain, so that the correctness of the dies in position alignment and transfer is greatly increased, which makes the operation more convenient. , the work efficiency will not be lowered due to errors in the process of grain alignment and transfer.

惟以上所述者,僅本發明之較佳實施例而已,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及發明說明內容所作簡單的等效變化與修飾,皆仍屬本發明專利函蓋之範圍內。However, the above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the simple equivalent changes and modifications according to the scope of the present invention and the description of the invention are still It is within the scope of the patent of the present invention.

1’、11...待分類承載盤1', 11. . . Tolerant carrier

11’...撓性基層11’. . . Flexible base

12’...框架12’. . . frame

13’、13”...置放區13', 13"... placement area

14’...邊陲區14’. . . Bianbu District

2’、2”...移動裝置2', 2"... mobile device

3’、12...分類承載盤3', 12. . . Classification carrier

4’...工作臂4’. . . Working arm

5...晶粒5. . . Grain

34’...邊陲區34’. . . Bianbu District

35’...標籤35’. . . label

1...機台1. . . Machine

13...輸送裝置13. . . Conveyor

14...影像擷取裝置14. . . Image capture device

15...提取監測裝置15. . . Extraction monitoring device

16...分類承載盤移載裝置16. . . Classification carrier tray transfer device

17...承載監測裝置17. . . Carrying monitoring device

18...取放裝置18. . . Pick and place device

19...承載盤置放區19. . . Carrier tray placement area

圖1為習知待分類承載盤之架構圖;1 is an architectural diagram of a conventional carrier to be classified;

圖2為習知晶粒分類機台之架構圖;2 is a structural diagram of a conventional crystal sorting machine;

圖3為習知標籤黏貼於分類承載盤邊陲區之示意圖;3 is a schematic view showing a conventional label adhered to a side of a sorting carrier;

圖4為本發明第一較佳實施例快速分揀排列機台之示意圖;4 is a schematic view of a quick sorting and arranging machine according to a first preferred embodiment of the present invention;

圖5係圖4機台之待分類承載盤移動至影像擷取位置之示意圖;FIG. 5 is a schematic diagram of the movement of the carrier to be classified to the image capturing position of the machine of FIG. 4; FIG.

圖6係圖4機台之待分類承載盤由輸送裝置移至晶粒提取位置之示意圖;6 is a schematic diagram of the tray to be sorted of the machine of FIG. 4 moved from the conveying device to the die extraction position;

圖7係圖4機台之取放裝置攜帶從待分類承載盤汲取出的晶粒置放至分類承載盤之示意圖FIG. 7 is a schematic diagram of the pick-and-place device of the machine of FIG. 4 carrying the die taken out from the tray to be classified and placed on the sorting carrier.

圖8係圖4機台之滿載的分類承載盤移至承載盤置放區之示意圖;Figure 8 is a schematic view showing the loading of the fully loaded classification carrier of the machine of Figure 4 to the placement area of the carrier;

圖9係圖4機台取出對應另一類別的分類承載盤,移載待分類承載盤上的另一類別晶粒之示意圖;及FIG. 9 is a schematic diagram of the machine of FIG. 4 taking out another type of carrier tray and transferring another type of die on the carrier to be classified; and

圖10係為本發明第一較佳實施例快速分揀排列機台之流程圖。Figure 10 is a flow chart of the quick sorting arrangement machine of the first preferred embodiment of the present invention.

1...機台1. . . Machine

11...待分類承載盤11. . . Tolerant carrier

12...分類承載盤12. . . Classification carrier

13...輸送裝置13. . . Conveyor

14...影像擷取裝置14. . . Image capture device

15...提取監測裝置15. . . Extraction monitoring device

16...分類承載盤移載裝置16. . . Classification carrier tray transfer device

17...承載監測裝置17. . . Carrying monitoring device

18...取放裝置18. . . Pick and place device

19...承載盤置放區19. . . Carrier tray placement area

Claims (11)

一種晶粒快速分揀排列機台,供置放至少一個置放有複數已知特性晶粒之待分類承載盤,及複數個分別對應不同特性晶粒、並分別具有一個供放置複數晶粒之承載件的分類承載盤;其中,該待分類承載盤上之該等晶粒特性及該等晶粒在該待分類承載盤上之位置資料係被儲存於一個儲存裝置;該機台包含:一個帶動該待分類承載盤經一個影像擷取位置至一個晶粒提取位置之輸送裝置;一個對應該影像擷取位置,即時擷取該待分類承載盤上晶粒位置資料之影像擷取裝置;一個接收該影像擷取裝置所擷取即時影像資料,與該儲存裝置中預儲存之該待分類承載盤上所承載該等晶粒的晶粒位置資料進行比對,以確認該等晶粒各自之特性的控制裝置;一個對應該晶粒提取位置之提取監測裝置;一個分類承載盤移載裝置,依照該控制裝置之指令,將上述分類承載盤中之至少一個移動至一個預定承載位置;一個對應該預定承載位置之承載監測裝置;及一個受該控制裝置驅動,在該晶粒提取位置、受該提取監測裝置監測而汲取位於該待分類承載盤上、對應該位於該預定承載位置之分類承載盤的特性類別之晶粒,在該承載監測裝置監測下、移載至該位於該預定承載位置之分類承載盤承載件上的取放裝置。A die fast sorting and arranging machine for placing at least one carrier disk to be classified with a plurality of known characteristic crystal grains, and a plurality of corresponding different characteristic crystal grains respectively, and having one for respectively placing a plurality of crystal grains a sorting carrier of the carrier; wherein the die characteristics on the carrier to be classified and the location information of the die on the carrier to be classified are stored in a storage device; the machine includes: a conveying device for driving the tray to be classified through an image capturing position to a die extraction position; an image capturing device corresponding to the image capturing position and instantly capturing the position information of the die on the carrier to be classified; Receiving the real-time image data captured by the image capturing device, and comparing with the die position data of the die carried on the to-be-classified carrier disk pre-stored in the storage device to confirm the respective crystal grains Characteristic control device; an extraction monitoring device corresponding to the die extraction position; a classification carrier disk transfer device, according to the instruction of the control device, the above classification bearing At least one of the plurality of movements to a predetermined load bearing position; a load monitoring device corresponding to the predetermined load bearing position; and a drive device driven by the control device, and being monitored by the extraction monitoring device to capture the load to be classified The dies on the disc, corresponding to the characteristic category of the classified carrier of the predetermined carrying position, are monitored by the carrying monitoring device and transferred to the pick-and-place device of the classified carrying carrier at the predetermined carrying position. 如申請專利範圍第1項之快速分揀排列機台,其中該等待分類承載盤及分類承載盤分別包括一片承載件、及固定該承載件之框架。The fast sorting sorting machine of claim 1, wherein the waiting sorting carrier tray and the sorting carrier tray respectively comprise a piece of carrier and a frame for fixing the carrier. 如申請專利範圍第1項之快速分揀排列機台,其中該提取監測裝置及該承載監測裝置分別系一具攝影機,且該影像擷取裝置係一具解析範圍廣於、且解析度低於該提取監測裝置及該承載監測裝置之攝影機。The fast sorting and arranging machine of the first aspect of the patent application, wherein the extracting monitoring device and the carrying monitoring device are respectively a camera, and the image capturing device has a wide analytical range and a lower resolution The extraction monitoring device and the camera carrying the monitoring device. 如申請專利範圍第1項之快速分揀排列機台,其中該取放裝置係一具有吸嘴之工作臂。For example, the fast sorting sorting machine of claim 1 is wherein the pick-and-place device is a working arm having a nozzle. 如申請專利範圍第1項之快速分揀排列機台,其中該取放裝置係沿一樞軸旋轉,且該輸送裝置及該分類承載盤移載裝置分別包括一個二維載台。The fast sorting machine of claim 1, wherein the pick-and-place device rotates along a pivot, and the transport device and the sorting carrier transfer device respectively comprise a two-dimensional stage. 一種晶粒快速分揀排列方法,係供將一個其上放置有複數晶粒之待分類承載盤上之該等晶粒,依照其晶粒特性分類;其中該等晶粒依照其晶粒特性被分類之資料、係與該等晶粒被檢測其晶粒特性時,該等晶粒位於該待分類承載盤上之位置資料共同被儲存於一記憶裝置,且該該方法包含下列步驟:a)由一影像擷取裝置擷取該待分類承載盤上之該等晶粒現時位置資料;b)將該現時位置資料與該被儲存位置資料比對,確認各該晶粒特性之晶粒相對該待分類承載盤位置,並移動該待分類承載盤至一個受一提取監測裝置監測之晶粒提取位置;且選擇該等分類中之一類,並移動一個對應該分類之分類承載盤至一個受一承載監測裝置監測之預定承載位置;及c)由一控制裝置驅動一取放裝置在該晶粒提取位置、受該提取監測裝置監測而汲取位於該待分類承載盤上、對應該位於該預定承載位置之分類承載盤的特性類別之晶粒,並在該承載監測裝置監測下、移載至該位於該預定承載位置之分類承載盤上。A method for rapidly sorting and arranging grains for classifying the crystal grains on a tray to be classified on which a plurality of crystal grains are placed, according to the grain characteristics thereof; wherein the crystal grains are classified according to their grain characteristics When the classification data and the grain characteristics of the crystal grains are detected, the position data of the crystal grains on the carrier to be classified are collectively stored in a memory device, and the method comprises the following steps: a) Obtaining, by an image capturing device, the current position data of the die on the to-be-classified carrier; b) comparing the current location data with the stored location data, and confirming that the die of each of the die characteristics is relative to the The tray position is to be classified, and the tray to be classified is moved to a die extraction position monitored by an extraction monitoring device; and one of the categories is selected, and a class carrier corresponding to the classification is moved to one subject Carrying a predetermined carrying position monitored by the monitoring device; and c) driving a pick-and-place device at the die extraction position, being monitored by the extraction monitoring device, and being located on the carrier to be classified, The die is located in the characteristic category classification of the predetermined position of the carrier disk bearing, and the monitoring device monitors the carrier, is transferred to the classification of the tray positioned on the predetermined position of the carrier. 如申請專利範圍第6項之晶粒快速分揀排列方法,其中該步驟c)更包括下列次步驟:c1)由該提取監測裝置以較該影像擷取裝置影像擷取範圍小、解析度高之模式,監測該取放裝置汲取上述晶粒;及c2)由該承載監測裝置以較該影像擷取裝置影像擷取範圍小、解析度高之模式,監控該取放裝置將上述晶粒移載至該分類承載盤過程進行放置位置定位、校正及座標補償。For example, in the method of claim 6, the step c) further includes the following steps: c1) the image capturing device has a smaller image capturing range and higher resolution than the image capturing device. a mode of monitoring the pick-and-place device to capture the die; and c2) monitoring, by the load-bearing monitoring device, a mode in which the image capturing device has a smaller image capturing range and a higher resolution, and monitoring the pick-and-place device to move the die The placement position, correction and coordinate compensation are carried out to the classification carrier tray process. 如申請專利範圍第6或7項之晶粒快速分揀排列方法,更包含在該步驟c)後,當該分類承載盤之該置放區均滿載及/或該待分類承載盤上對應該分類承載盤之晶粒均被移載完畢時,更換該分類承載盤之步驟d)。The method for arranging the fast-distribution of the grain according to the sixth or seventh aspect of the patent application further includes, after the step c), when the placement area of the classification carrier is fully loaded and/or the carrier tray to be classified corresponds to Step d) of replacing the classified carrier when the dies of the classified carrier are all transferred. 如申請專利範圍第6或7項之晶粒快速分揀排列方法,更包含在該等分類承載盤上額外將該等分類以附加標示片的方式標示之步驟e)。For example, the method for arranging the grain fast sorting in the sixth or seventh aspect of the patent application further includes the step e) of additionally labeling the sorting sheets on the sorting trays by means of additional labels. 如申請專利範圍第6或7項之晶粒快速分揀排列方法,其中該步驟b)中,移動該待分類承載盤至一個受一提取監測裝置監測之晶粒提取位置,係由該控制裝置驅動一個輸送裝置以二維方向移動所達成。The method for arranging a grain rapid sorting according to claim 6 or 7, wherein in the step b), moving the to-be-classified carrier tray to a die extraction position monitored by an extraction monitoring device is performed by the control device Driving a conveyor to move in two dimensions. 如申請專利範圍第6或7項之晶粒快速分揀排列方法,其中該步驟b)中,移動該分類承載盤至該預定承載位置,係由該控制裝置驅動一個分類承載盤移載裝置以二維方向移動所達成。The method according to claim 6 or 7, wherein in the step b), the sorting carrier tray is moved to the predetermined carrying position, and the control device drives a sorting carrier tray transfer device. The two-dimensional direction is achieved.
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