TWI416655B - Carrying plate holding device and sorting system - Google Patents
Carrying plate holding device and sorting system Download PDFInfo
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Abstract
Description
本發明係有關一種容置裝置,尤其是指一種可以提取之載盤承載容置裝置與揀選系統。The invention relates to a receiving device, in particular to a carrier carrying device and a picking system which can be extracted.
半導體製程當中,當晶圓經由沉積、濺渡、微影以及蝕刻等製程之後,再將該晶圓經過切割形成複數個晶粒(Die),該晶粒係為具有功能之電子元件,然後再將這些晶粒經過封裝、測試的動作,才完成整個半導體之製程。In a semiconductor process, after a wafer is processed by deposition, sputtering, lithography, and etching, the wafer is diced to form a plurality of die, which is a functional electronic component, and then The process of packaging and testing these crystal grains completes the entire semiconductor process.
對於切割下來之晶粒,會被置放於承載盤中,該承載盤結構係為矩形結構且其表面具有複數個容置槽可以容置被切割完畢之晶粒,以利晶粒的輸送、放置、封裝以及側置的進行。其中將晶粒放置於該承載盤之動作稱為置晶,而負責從該承載盤取出或是置放晶粒之動作則是藉由晶粒檢選裝置(chip sorter)來達成。The cut die is placed in a carrier disk. The carrier structure is a rectangular structure and has a plurality of receiving grooves on the surface thereof for accommodating the cut die to facilitate the transportation of the die. Placement, packaging, and side placement. The action of placing the die on the carrier is called crystallizing, and the action of taking out or placing the die from the carrier is achieved by a chip sorter.
請參閱圖一A至一C所示,該圖係為習用之晶片載盤存放裝置示意圖。在習用技術中,晶片載盤存放裝置10固定於一承載台11上,當晶圓經過檢測以及分級的過程之後,會被放置到對應的晶片承載盤上。當晶片承載盤已滿而無法容置晶片的時候,藉由自動化的機制可將晶片承載盤移動至該晶片在盤存放裝置內。請參閱圖一B所示,移載裝置12會由晶片載盤存放裝置10之底側開口向上移動,而頂起已經放置在支撐元件13上之複數個承載盤90,移載裝置12的上下移動使得晶片承載盤90可以堆疊在一 起,形成如圖一C的狀態。在習用技術中,當晶片承載盤堆疊到一定的數量時,需要由操作人員將相互堆疊的晶片承載盤取出,以利後續之存放作業。但是上述之利用人工處理堆疊的晶片承載盤存在著許多問題:1.在利用人工取出時,由於成堆的晶片承載盤無額外結構保護,因此操作者容易因為手指的抖動,或者是不小心的碰撞,而使得堆疊的晶片承載盤翻倒,造成嚴重損失。Please refer to FIG. 1A to FIG. CC, which are schematic diagrams of a conventional wafer carrier storage device. In the conventional technique, the wafer carrier storage device 10 is fixed to a carrier 11 and is placed on the corresponding wafer carrier after the wafer has undergone the process of inspection and classification. When the wafer carrier is full and cannot accommodate the wafer, the wafer carrier can be moved to the wafer in the disk storage device by an automated mechanism. Referring to FIG. 1B, the transfer device 12 is moved upward by the bottom side opening of the wafer carrier storage device 10, and a plurality of carrier trays 90 that have been placed on the support member 13 are lifted up and down. Movement allows wafer carrier trays 90 to be stacked in a As a result, a state as shown in FIG. 1C is formed. In the conventional technology, when the wafer carrier trays are stacked to a certain number, it is necessary for the operator to take out the wafer carrier trays stacked on each other to facilitate subsequent storage operations. However, there are a number of problems with the above-mentioned wafer carrier trays that are manually processed. 1. When using manual removal, since the stack of wafer carrier trays has no additional structural protection, the operator is liable to be shaken by fingers or careless. Collision, causing the stacked wafer carrier tray to tip over, causing serious damage.
2.因為堆疊的晶片承載盤上,由於沒有框架之故,因此不方便進行任何的標示以對各個不同晶片品質等級的晶片承載盤堆疊進行辨識,因此容易造成人員的誤分類。2. Because there is no frame on the stacked wafer carrier, it is not convenient to carry out any indication to identify the wafer carrier stack of different wafer quality levels, so it is easy to cause misclassification of personnel.
綜合上述,因此亟需一種承載盤容置裝置與系統,來解決習用技術所產生之問題。In summary, there is a need for a carrier accommodating device and system to solve the problems caused by conventional techniques.
本發明提供一種承載盤容置裝置,其係利用可以提取之概念,設計出可以存放承載盤之容器,使得當承載盤累積到一的程度時,使用者不必搬動成堆的承載盤,而僅要提取存放的容器即可將存放之堆疊的承載盤提走或者是利用自動化設備將整個容置裝置搬走,以避免人工操作時所發生的問題。The present invention provides a carrier tray accommodating device which utilizes the concept of extractable to design a container for storing a carrier tray, so that when the carrier tray is accumulated to a degree, the user does not have to move the stack of carrier trays. Simply picking up the stored containers can take away the stacked carrier trays or use automated equipment to remove the entire receiving device to avoid problems during manual operation.
本發明提供一種承載盤容置裝置,其係利用可以提取之概念,設計出可以存放承載盤之容器,並於容器上設置對應的辨識元件,以確實分類以及標示存放不同性質的容置裝置以避免人工的分類錯誤,繼而有利於線上生產管理。The invention provides a carrying tray accommodating device, which utilizes the concept of extractable, designs a container for storing a carrying tray, and sets corresponding identification elements on the container to accurately classify and mark the accommodating devices with different properties. Avoid manual classification errors, which in turn facilitate online production management.
本發明提供一種揀選裝置,其係將元件揀選的機制與 承載盤容置與分類的機制相互結合,以形成可以自動分類管理存放容置元件的承載盤,進而讓操作人員可以識別不同等級的存放裝置,以力生產線之管理。The invention provides a sorting device, which is a mechanism for picking components The mechanism for accommodating and arranging the trays is combined to form a carrier tray that can automatically manage and store the accommodating components, thereby allowing the operator to identify different levels of storage devices to manage the production line.
在一實施例中,本發明提供一種承載盤容置裝置,其係具有一容置本體,其內具有一容置空間以提供容置至少一承載盤,該容置本體之至少一側具有一卡合部以與一槽體相卡合,其中容置本體之底部更具有一開口,以利承載盤由下往上緊密堆疊,進入承載盤容置裝置,該容置本體係可根據需要選擇與該槽體相卡合或分離。In one embodiment, the present invention provides a receiving tray accommodating device having a receiving body having an accommodating space for accommodating at least one carrying tray, and at least one side of the accommodating body has a The engaging portion is engaged with a slot body, wherein the bottom of the receiving body further has an opening, so that the carrying tray is tightly stacked from bottom to top and enters the carrying tray receiving device, and the receiving system can be selected according to requirements. Engage or separate from the tank.
在另一實施例中,本發明提供一種揀選系統,包括:一揀選部,其係揀選一載體上之一元件並予以分級以放置於對應該等級之承載盤上;一承載盤輸送部,其係與該揀選部相連接;一承載盤容置部,其係與該承載盤輸送部相連接,該承載盤容置部具有:一承載台,其上設置有複數個槽體;以及複數個容置本體,其係分別具有一容置空間以提供容置複數個承載盤,每一個容置本體係分別容置於該複數個槽體內,每一個容置本體之至少一側具有一卡合部,以與對應之槽體相卡合,其中容置本體之底部更具有一開口,以利承載盤由下往上緊密堆疊,進入承載盤容置裝置,該容置本體係可根據需要選擇與該槽體相卡合或分離。In another embodiment, the present invention provides a picking system comprising: a picking unit that picks one of the components on a carrier and grades it for placement on a corresponding carrier tray; a carrier tray transport portion Connected to the picking unit; a carrying tray receiving portion is connected to the carrying tray conveying portion, the carrying tray receiving portion has: a carrying platform on which a plurality of slots are disposed; and a plurality of The accommodating body has an accommodating space for accommodating a plurality of carrier platters, each of the accommodating systems is respectively received in the plurality of slots, and each of the accommodating bodies has a snap on at least one side thereof The part is engaged with the corresponding slot body, wherein the bottom of the receiving body further has an opening, so that the carrier tray is tightly stacked from bottom to top and enters the carrying tray receiving device, and the receiving system can be selected according to requirements. Engage or separate from the tank.
為使 貴審查委員能對本發明之特徵、目的及功能有更進一步的認知與瞭解,下文特將本發明之裝置的相關細 部結構以及設計的理念原由進行說明,以使得 審查委員可以了解本發明之特點,詳細說明陳述如下:請參閱圖二所示,該圖係為本發明之承載盤容置裝置實施例立體示意圖。在本實施例中,該承載盤容置裝置2包括有一容置本體20,其內具有一容置空間200以提供容置至少一承載盤90,該容置本體20之一側具有一卡合部21以與一槽體相卡合,該容置本體係可根據需要選擇與該槽體相卡合或分離。該本體20基本上是由第一板體201以及第二板體202所構成,該第一板體201與該第二板體202之間相距一段距離,且第一板體201與第二板體202上分別具有相對應之凹槽以形成該容置空間。由於兩板體201與202相距一距離,因此在該容置本體20之頂部以及底部形成有一開口,以利承載盤由下往上緊密堆疊,進入承載盤容置裝置。在底部開口之一側具有該卡合部21。In order to enable the reviewing committee to have a further understanding and understanding of the features, objects and functions of the present invention, the following is a detailed description of the device of the present invention. The structure of the structure and the concept of the design are explained in the original so that the reviewer can understand the features of the present invention. The detailed description is as follows: Please refer to FIG. 2, which is a perspective view of the embodiment of the carrier receiving device of the present invention. In this embodiment, the accommodating disk accommodating device 2 includes a accommodating body 20 having an accommodating space 200 for accommodating at least one carrier disk 90. One side of the accommodating body 20 has a snap fit. The portion 21 is engaged with a tank body, and the receiving system can be selectively engaged or separated from the tank body as needed. The body 20 is basically composed of a first plate body 201 and a second plate body 202. The first plate body 201 and the second plate body 202 are separated by a distance, and the first plate body 201 and the second plate body are separated from each other. Each of the bodies 202 has a corresponding recess to form the accommodating space. Since the two plates 201 and 202 are separated by a distance, an opening is formed at the top and the bottom of the accommodating body 20, so that the carrier trays are closely stacked from bottom to top and enter the carrier accommodating device. The engaging portion 21 is provided on one side of the bottom opening.
本實施例中之卡合部21具有複數個嵌合構件210、211、212與213,其中嵌合構件210與211呈現一凹字形分別與該兩板體201與202之側面相連接。嵌合構件210~213之外形與數量並不以本發明的實施例為限,因為這是熟悉此項技術之人可以根據實際上之需要設計不同的嵌合構件形式。此外,嵌合構件210~213也可以與容置本體20一體成型,這都是熟悉此項技術之人可以根據本發明之精神與以致換。在嵌合構件210與211之凹部內設置有複數個支撐元件22,其係與該容置本體20之底部開口相對應,以提供支撐承載至少一承載盤90。該承載盤90,在本實施例中可以提供容置複數個元件,例如:晶片、陶瓷 元件、被動元件等但不以此為限。在第一板體201以及該第二板體202之上方分別設置有一手把結構23,以利使用者提拿該承載盤容置裝置2。另外,為了方便辨識,在該容置本體上(例如:第一板體或者是第二板體)可以設置有一辨識元件24,以利操作者對於已經提取離開槽體之承載板容置裝置2內所容置的承載板90的種類或者是分級進行辨識。在一般的實施例中,該辨識元件24可以為電子式的辨識元件,例如:無線射頻識別標籤或者是其他的記錄媒體。如此,使用者便可利用手提式或者是其他型式的電子讀寫裝置來讀取辨識元件內之內容,以利分類、記錄與辨識。此外,容置本體上更可以藉由塗佈不同的顏色,作為不同等級元件的分類辨識。The engaging portion 21 in this embodiment has a plurality of fitting members 210, 211, 212 and 213, wherein the fitting members 210 and 211 are in a concave shape and are respectively connected to the sides of the two plates 201 and 202. The shape and number of the fitting members 210 to 213 are not limited to the embodiment of the present invention because it is a form of a fitting member that can be designed by a person skilled in the art according to actual needs. In addition, the fitting members 210 to 213 can also be integrally formed with the accommodating body 20, which can be replaced by those skilled in the art in accordance with the spirit of the present invention. A plurality of support members 22 are disposed in the recesses of the fitting members 210 and 211 corresponding to the bottom opening of the receiving body 20 to provide support for carrying at least one carrier disk 90. The carrier disk 90 can provide a plurality of components, such as a wafer and a ceramic, in this embodiment. Components, passive components, etc. are not limited to this. A handle structure 23 is disposed above the first plate body 201 and the second plate body 202 to facilitate the user to lift the carrier disk receiving device 2. In addition, for the purpose of identification, an identification component 24 may be disposed on the receiving body (for example, the first board or the second board) to facilitate the operator for the carrier receiving device 2 that has been extracted from the slot. The type of the carrier plate 90 accommodated therein is either hierarchically identified. In a typical embodiment, the identification component 24 can be an electronic identification component such as a radio frequency identification tag or other recording medium. In this way, the user can use the portable or other type of electronic reading and writing device to read the contents of the identification component for classification, recording and identification. In addition, the accommodating body can be identified by classifying different grades by applying different colors.
請參閱圖三A與圖三B所示,其中圖三A係為與該承載盤容置裝置相結合之槽體立體示意圖;圖三B為承載盤容置本體與槽體結合示意圖。在圖三A中,該槽體3更具有一固定部30,其係由一第一框體301以及一第二框體302所構成。該第一框體301與該第二框體302形成一空間以提供容置該承載盤容置裝置2。在該固定部30內具有一對結合座31與32,該對結合座31與32分別設置於槽體3內部之第一框體301以及該第二框體302上。每一結合座31與32上更具有至少一支撐架310,其係與一彈性體311樞接於對應支撐座31或32之側壁上,該複數個支撐架310係可提供暫時存放承載盤,待存放在該支撐架310上的承載盤已經確定不需要在進行製程的時候,可以一起藉由移載裝置(如圖一C之標號12的結構,其係屬習用技術,在 此不作贅述)一起移放置該承載盤容置裝置2內。如三B所示,當該承載盤容置裝置2嵌入該槽體3內時,結合座31與32係與承載盤容置裝置2之底面相抵靠,以提供支撐承載該承載盤容置裝置2。當然該槽體3容置該承載盤容置裝置2時,亦可藉由定位元件的抵靠使得定位元件得以將該承載盤容置裝置2之位置維持在定位。至於定位元件的設置與結構係屬於習用之技術,並非本發明之重點,熟悉此項技術之人可以使用很多習用之定位元件例如:銷等元件與該承載盤容置裝置2相抵靠。Referring to FIG. 3A and FIG. 3B, FIG. 3A is a schematic perspective view of a tank body combined with the carrier disk receiving device; FIG. 3B is a schematic view of the carrier body receiving body and the tank body. In FIG. 3A, the trough body 3 further has a fixing portion 30 which is composed of a first frame body 301 and a second frame body 302. The first frame 301 and the second frame 302 form a space to accommodate the carrier receiving device 2 . A pair of coupling seats 31 and 32 are provided in the fixing portion 30. The pair of coupling seats 31 and 32 are respectively disposed on the first frame body 301 and the second frame body 302 inside the groove body 3. Each of the joints 31 and 32 further has at least one support frame 310 pivotally connected to an elastic body 311 on a side wall of the corresponding support base 31 or 32. The plurality of support frames 310 can temporarily store the carrier tray. The carrier tray to be stored on the support frame 310 has been determined that it is not necessary to carry out the process, and the transfer device can be used together (as shown in FIG. 1C, the structure of the structure 12 is a conventional technique. This will not be described again) and placed in the carrier receiving device 2 together. As shown in FIG. 3B, when the carrier accommodating device 2 is embedded in the slot body 3, the coupling seats 31 and 32 are abutted against the bottom surface of the carrier disk accommodating device 2 to provide support for carrying the carrier disk accommodating device. 2. When the carrier 3 accommodates the carrier receiving device 2, the positioning component can maintain the position of the carrier receiving device 2 by the positioning of the positioning component. As for the arrangement and structure of the positioning elements, which is a conventional technique, it is not the focus of the present invention. Those skilled in the art can use many conventional positioning elements such as pins and the like to abut against the carrier receiving device 2.
請參閱圖四所示,該圖係為本發明之壓板實施例立體示意圖。在本實施例中,該壓制結構4的設計係可提供固定存放於該承載板容置裝置內的複數個相互堆疊的承載板。由於承載盤堆疊的高度如果太高,雖然可增加生產的效率,但是堆疊太高的狀態下,承載盤還是容易晃動。雖然在本發明中有第一板體以及第二板體所形成之容置本體可以保護堆疊的承載盤,但是為了增加穩定性,在本發明中設計的壓制結構4,以提供一壓制力於堆疊的承載盤上,增加承載盤的穩定性。在本實施例中,該壓制結構4具有一彈性板體40,其兩端具有一柱體41與42,其係分別夾持該彈性板體40,該兩柱體41與42中心的距離係小於介於該兩柱體中心41與42的彈性板體40長度。該壓制結構4上更具有一拉桿43,其係與該彈性板體40相連接。連接方式為在該彈性板體40上開設兩的孔洞401與402,該拉桿之一部份通過過該兩孔洞401與402與彈性板體40相連接。可提供一作用力於該彈性板體40上使該彈性板體40 對最上方之承載盤產生壓制力以固定該複數個承載盤。請參閱圖五A所示,在圖五A之狀態下,表示該彈性板體40在該拉桿43所提供的向上的作用力,使個彈性板體40因受力而呈現下凹的狀態。此狀態下該壓制結構並不會提供壓制力於承載板上,因此屬於鬆放的狀態。反之,如圖五B所示,當該拉桿提43供一向下的作用力於該彈性板體40上時,該彈性板體40因受力而變形成凹向上的狀態,凹向上的最低點位置會與該承載盤90相抵靠,以提供一壓制力固定堆疊的承載盤90。藉由本發明之壓制結構以使相互堆疊之該至少一承載盤中的元件不會因該承載盤容置裝置移動或傾倒而使該至少一承載盤中的元件掉出。Please refer to FIG. 4, which is a perspective view of an embodiment of the pressure plate of the present invention. In this embodiment, the design of the pressing structure 4 can provide a plurality of mutually stacked carrier plates that are fixedly stored in the carrier receiving device. Since the height of the stack of the carrier tray is too high, although the production efficiency can be increased, the carrier tray is easily shaken in a state where the stack is too high. Although in the present invention, the receiving body formed by the first plate body and the second plate body can protect the stacked carrier trays, in order to increase the stability, the pressing structure 4 designed in the present invention is provided to provide a pressing force. On the stacked carrier disks, the stability of the carrier disks is increased. In this embodiment, the pressing structure 4 has an elastic plate body 40 having a column body 41 and 42 at both ends thereof, which respectively hold the elastic plate body 40, and the distance between the two columns 41 and the center of the 42 is 42 It is smaller than the length of the elastic plate body 40 between the centers of the two cylinders 41 and 42. The pressing structure 4 further has a tie rod 43 connected to the elastic plate body 40. The connecting manner is to open two holes 401 and 402 in the elastic plate body 40. One of the connecting rods is connected to the elastic plate body 40 through the two holes 401 and 402. A force can be provided on the elastic plate body 40 to make the elastic plate body 40 A pressing force is generated on the uppermost carrier tray to fix the plurality of carrier trays. Referring to FIG. 5A, in the state of FIG. 5A, the upward force of the elastic plate body 40 provided by the pull rod 43 is shown, so that the elastic plate body 40 is in a concave state due to the force. In this state, the pressed structure does not provide a pressing force on the carrier plate, and thus is in a loose state. On the other hand, as shown in FIG. 5B, when the pull rod 43 is provided with a downward force on the elastic plate body 40, the elastic plate body 40 is deformed into a concave upward state due to the force, and the lowest point of the concave upward direction. The position will abut against the carrier disk 90 to provide a pressing force to secure the stacked carrier disk 90. By the pressing structure of the present invention, the components in the at least one carrier tray stacked on each other do not cause the components in the at least one carrier tray to fall out due to the movement or dumping of the carrier receiving device.
請參閱圖六所示,該圖係為本發明之揀選系統實施例立體示意圖。該揀選系統5具有承載盤容置部50、一揀選部51以及一承載盤輸送部52。該承載盤容置部50具有一承載台501以及複數個承載盤容置裝置502。每一個承載盤容置裝置502具有一容置本體5020。其中,該承載台501,其上設置有複數個槽體503,以分別提供容置該複數個承載盤容置裝置502。每一個容置本體5020內,其係分別具有一容置空間以提供容置至少一承載盤513,每一個容置本體5020係分別容置於該複數個槽體503內,每一個容置本體5020之一側具有一卡合部504,以與對應之槽體503相卡合。每一個槽體503以及容置本體5020的結構係容同前面之裝置2與槽體3所述,在此不作贅述。該揀選部51係由一載體上揀選一元件並予以分級以放置於對應該等級之承載盤上。在本實施例中,該載體510係為一膠 膜或具有黏著力之基材,其上具有複數個元件5100。該元件5100係為晶片、陶瓷元件,或者是被動元件,但不以此為限。為了方便辨識存放部同等級之承載盤的容置本體,在每一容置本體5020之本體上可以設置有辨識元件,以利操作者對於已經提取離開槽體之承載板容置裝置502內所容置的承載板的種類或者是分級進行辨識。此外,容置本體5020上更可以藉由塗佈不同的顏色,作為不同等級元件的分類辨識。Please refer to FIG. 6, which is a perspective view of an embodiment of the picking system of the present invention. The picking system 5 has a carrier receiving portion 50, a picking portion 51, and a carrier tray transport portion 52. The carrier accommodating portion 50 has a carrying platform 501 and a plurality of carrier accommodating devices 502. Each of the carrier accommodating devices 502 has a receiving body 5020. The loading platform 501 is provided with a plurality of slots 503 for respectively receiving the plurality of carrier receiving devices 502. Each of the accommodating bodies 5020 has an accommodating space for accommodating at least one carrier 513. Each accommodating body 5020 is respectively received in the plurality of slots 503, and each receiving body One side of the 5020 has a latching portion 504 for engaging with the corresponding slot body 503. The structure of each of the tank body 503 and the accommodating body 5020 is the same as that of the front device 2 and the tank body 3, and will not be described herein. The picking unit 51 picks up a component from a carrier and classifies it to be placed on a corresponding carrier. In this embodiment, the carrier 510 is a glue. A film or substrate having an adhesive having a plurality of elements 5100 thereon. The component 5100 is a wafer, a ceramic component, or a passive component, but is not limited thereto. In order to facilitate the identification of the receiving body of the carrier of the same level of the storage unit, an identification component may be disposed on the body of each of the receiving body 5020 to facilitate the operator in the carrier receiving device 502 that has been extracted from the slot. The type of the carrier board that is accommodated is classified or identified. In addition, the accommodating body 5020 can be identified by classifying different grades by applying different colors.
而該揀選部51包括有一拾取部511、一第一影像擷取裝置512、一第二影像擷取裝置514、以及一第三影像擷取裝置515。該拾取部511,其係可拾取該載體510上之元件5100。在本實施例中,拾取部511包括有一拾取元件5110以及一負壓承載台5111。該拾取元件5110係可進行二維平面運動(Y,Z)以及一旋轉運動(Wz),並利用負壓力吸附載體510上之元件5100。該拾取元件5110係屬於習用技術,圖六中係僅為示意,並不以圖式之結構為限。該負壓承載台5111係可提供附加吸附該載體510,該負壓承載台5111內具有一頂出結構5112,係可頂出載體510上之元件5100。同樣地,該負壓承載台5111係屬於習用技術,在此不作贅述。該第一影像擷取裝置512,其係可擷取該元件5100之影像,以作為拾取元件5110拾取元件5100與否之判斷依據,以及拾取元件5110拾取元件5100之位置是否對位。而該第三影像擷取裝置係可擷取該元件5100之底面影像,以判斷該元件5100之底面是否有損傷。一般而言,該第一影像擷取裝置512與第三影像擷取裝置515係為CCD 或者是CMOS的元件。至於該第二影像擷取裝置514,其係可擷取承載盤513之影像,以辨識該承載盤513之位置。此外,該第二影像擷取裝置514更可以在拾取元件5110將元件5100放置在承載盤513上時,擷取元件5100之影像,以判斷元件5100是否有損傷。一般而言,該第二影像擷取裝置514係為CCD或者是CMOS的元件。The picking unit 51 includes a picking unit 511, a first image capturing device 512, a second image capturing device 514, and a third image capturing device 515. The picking portion 511 picks up the component 5100 on the carrier 510. In the present embodiment, the pickup portion 511 includes a pickup member 5110 and a negative pressure bearing table 5111. The pickup element 5110 is capable of two-dimensional planar motion (Y, Z) and a rotational motion (Wz), and adsorbs the component 5100 on the carrier 510 with a negative pressure. The pick-up element 5110 is a conventional technique, and the figure 6 is merely illustrative and is not limited to the structure of the drawing. The negative pressure bearing platform 5111 can provide additional adsorption of the carrier 510. The negative pressure bearing platform 5111 has an ejection structure 5112 for ejecting the component 5100 on the carrier 510. Similarly, the negative pressure bearing platform 5111 is a conventional technique and will not be described herein. The first image capturing device 512 can capture the image of the component 5100 as a basis for determining whether the pickup component 5110 picks up the component 5100, and whether the position of the pickup component 5110 picking component 5100 is aligned. The third image capturing device can capture the image of the bottom surface of the component 5100 to determine whether the bottom surface of the component 5100 is damaged. Generally, the first image capturing device 512 and the third image capturing device 515 are CCDs. Or a component of CMOS. As for the second image capturing device 514, the image of the carrier 513 can be captured to identify the position of the carrier 513. In addition, the second image capturing device 514 can further capture the image of the component 5100 when the picking component 5110 places the component 5100 on the carrier 513 to determine whether the component 5100 is damaged. In general, the second image capturing device 514 is a component of a CCD or a CMOS.
該承載盤輸送部52與53,其係連接該揀選部51以及承載盤容置部50,以輸送承載元件5100之承載盤513。其中承載盤輸送部52係輸送空的承載盤,以讓拾取元件5110可以將元件5100置放。當承載盤513放滿或者是要被放置至承載盤容置部50中之承載盤容置裝置502內存放時,承載盤輸送部53便會將承載盤513移動至該承載盤容置部50中對應的承載盤容置裝置502存放。此時,承載盤輸送部52又會將另一個空的承載盤輸送至定位,以利拾取元件5110放置元件5100。該承載盤輸送部52與53亦可整合成一個輸送部,其係屬於習用技術,在此不作贅述。本實施例之系統中的每一個容置本體分別代表不同存放等級,因此可與自動化的承載盤輸送部52結合,以於線上進行自動化的檢測分類製程。The carrier tray conveying portions 52 and 53 are connected to the picking portion 51 and the carrier tray accommodating portion 50 to transport the carrier tray 513 of the carrier member 5100. The carrier tray transport portion 52 transports an empty carrier tray so that the pickup member 5110 can place the component 5100. When the carrier 513 is full or is to be stored in the carrier accommodating device 502 in the carrier accommodating portion 50, the carrier tray 53 moves the carrier 513 to the carrier accommodating portion 50. The corresponding carrier disk accommodating device 502 is stored. At this time, the carrier tray conveying portion 52 in turn conveys another empty carrier tray to the positioning to facilitate the pickup member 5110 to place the member 5100. The carrier tray conveying portions 52 and 53 may also be integrated into one conveying portion, which is a conventional technique and will not be described herein. Each of the accommodating bodies in the system of the present embodiment respectively represents different storage levels, and thus can be combined with the automated carrier tray conveying portion 52 to perform an automated detection and classification process on the line.
惟以上所述者,僅為本發明之實施例,當不能以之限制本發明範圍。即大凡依本發明申請專利範圍所做之均等變化及修飾,仍將不失本發明之要義所在,亦不脫離本發明之精神和範圍,故都應視為本發明的進一步實施狀況。本發明的精神在於利用可以提取的設計,改變習用固定式的設計,使得操作者在容置空間內的承載盤堆疊至一定高 度後可以直接將容置裝置整的提走,而不需要直接搬動內部所堆疊的承載盤。However, the above is only an embodiment of the present invention, and the scope of the present invention is not limited thereto. It is to be understood that the scope of the present invention is not limited by the spirit and scope of the present invention, and should be considered as a further embodiment of the present invention. The spirit of the present invention is to change the conventional fixed design by using an extractable design, so that the operator can stack the carrier trays in the accommodating space to a certain height. After the degree, the accommodating device can be directly removed, without directly moving the internal stacked stacking tray.
綜合上述,本發明提供之承載盤容置裝置與系統,具有方便使用者提取以及保護承載盤免於外力碰撞而傾倒的問題,此外可以藉由辨識元件或顏色的輔助對於每一個不同的承載盤容置裝置進行辨識分類。因此已經可以提高該產業之競爭力以及帶動週遭產業之發展,誠已符合發明專利法所規定申請發明所需具備之要件,故爰依法呈提發明專利之申請,謹請 貴審查委員允撥時間惠予審視,並賜准專利為禱。In summary, the present invention provides a carrier receiving device and system, which has the problem of facilitating the user to extract and protect the carrier from being dumped by external force collision, and can also be used for each different carrier by identifying components or colors. The accommodating device performs identification classification. Therefore, it has been possible to improve the competitiveness of the industry and promote the development of the surrounding industries. Cheng has already met the requirements for applying for inventions as stipulated in the invention patent law. Therefore, the application for invention patents is submitted according to law. I will review it and give the patent a prayer.
10‧‧‧晶片載盤存放裝置10‧‧‧ wafer carrier storage device
11‧‧‧承載台11‧‧‧Loading station
12‧‧‧移載裝置12‧‧‧Transfer device
13‧‧‧支撐元件13‧‧‧Support components
2‧‧‧承載盤容置裝置2‧‧‧Loading tray accommodating device
20‧‧‧容置本體20‧‧‧ accommodating the ontology
200‧‧‧容置空間200‧‧‧ accommodating space
201‧‧‧第一板體201‧‧‧ first board
202‧‧‧第二板體202‧‧‧Second plate
21‧‧‧卡合部21‧‧‧Care Department
210~213‧‧‧嵌合構件210~213‧‧‧Fitting components
22‧‧‧支撐元件22‧‧‧Support elements
24‧‧‧識別元件24‧‧‧ Identifying components
3‧‧‧槽體3‧‧‧ tank
30‧‧‧固定部30‧‧‧ Fixed Department
301‧‧‧第一框體301‧‧‧ first frame
302‧‧‧第二框體302‧‧‧Second frame
31與32‧‧‧結合座31 and 32‧‧
310‧‧‧支撐架310‧‧‧Support frame
311‧‧‧彈性體311‧‧‧ Elastomers
4‧‧‧該壓制結構4‧‧‧The pressed structure
40‧‧‧彈性板體40‧‧‧Elastic plate
41、42‧‧‧柱體41, 42‧‧‧ cylinder
5‧‧‧揀選系統5‧‧‧Selection system
50‧‧‧承載盤容置部50‧‧‧Loading tray housing
501‧‧‧承載台501‧‧‧bearing station
502‧‧‧承載盤容置裝置502‧‧‧Loading tray accommodating device
5020‧‧‧容置本體5020‧‧‧ accommodating the body
503‧‧‧槽體503‧‧‧
504‧‧‧卡合部504‧‧‧Clock Department
51‧‧‧揀選部51‧‧‧Selection Department
510‧‧‧載體510‧‧‧ Carrier
5100‧‧‧元件5100‧‧‧ components
511‧‧‧拾取部511‧‧‧ Pickup Department
5110‧‧‧拾取元件5110‧‧‧ Pickup components
5111‧‧‧負壓承載台5111‧‧‧Negative pressure bearing platform
5112‧‧‧頂出結構5112‧‧‧Ejection structure
512‧‧‧第一影像擷取裝置512‧‧‧First image capture device
513‧‧‧承載盤513‧‧‧ Carrying tray
514‧‧‧第二影像擷取裝置514‧‧‧Second image capture device
515‧‧‧第三影像擷取裝置515‧‧‧ Third image capture device
52、53‧‧‧承載盤輸送部52, 53‧‧‧ Carrying tray conveying department
圖一A以及圖一C係為習用之晶片載盤存放裝置示意圖。Figure 1A and Figure 1C are schematic views of a conventional wafer carrier storage device.
圖二係為本發明之承載盤容置裝置實施例立體示意圖。FIG. 2 is a perspective view of an embodiment of a carrier disk accommodating device of the present invention.
圖三A係為與該承載盤容置裝置相結合之槽體立體示意圖。Figure 3A is a perspective view of the trough body combined with the carrier receiving device.
圖三B為承載盤容置本體與槽體結合示意圖。FIG. 3B is a schematic view showing the combination of the receiving body and the tank body.
圖四係為本發明之壓板實施例立體示意圖。Figure 4 is a perspective view of an embodiment of the pressure plate of the present invention.
圖五A與圖五B係為本發明之壓制結構動作示意圖。Figure 5A and Figure 5B are schematic views of the action of the pressed structure of the present invention.
圖六係為本發明之揀選系統實施例立體示意圖。Figure 6 is a perspective view of an embodiment of the picking system of the present invention.
2‧‧‧承載盤容置裝置2‧‧‧Loading tray accommodating device
20‧‧‧容置本體20‧‧‧ accommodating the ontology
200‧‧‧容置空間200‧‧‧ accommodating space
201‧‧‧第一板體201‧‧‧ first board
202‧‧‧第二板體202‧‧‧Second plate
21‧‧‧卡合部21‧‧‧Care Department
210~213‧‧‧嵌合構件210~213‧‧‧Fitting components
22‧‧‧支撐元件22‧‧‧Support elements
24‧‧‧識別元件24‧‧‧ Identifying components
Claims (34)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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TW097134414A TWI416655B (en) | 2008-09-08 | 2008-09-08 | Carrying plate holding device and sorting system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW097134414A TWI416655B (en) | 2008-09-08 | 2008-09-08 | Carrying plate holding device and sorting system |
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TW201011853A TW201011853A (en) | 2010-03-16 |
TWI416655B true TWI416655B (en) | 2013-11-21 |
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TW097134414A TWI416655B (en) | 2008-09-08 | 2008-09-08 | Carrying plate holding device and sorting system |
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TWI501341B (en) * | 2012-03-07 | 2015-09-21 | Advanced Semiconductor Eng | System for automatically identifying positions of trays of semiconductor products and method therefor |
CN112885738B (en) * | 2020-09-03 | 2024-02-23 | 天虹科技股份有限公司 | Wafer fixing mechanism and wafer pre-cleaning machine using same |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW327235B (en) * | 1994-04-28 | 1998-02-21 | Semitool Inc | A semiconductor processor for processing wafers or other semiconductor articles, a method for processing wafers and similar semiconductor articles, and a wafer handling apparatus for moving wafers to or from an enclosed wafer container the invention relates to a process for processing integrated circuit wafers, semiconductor substrates, data disks and similar units requiring very low contamination levels. |
TW372325B (en) * | 1995-01-09 | 1999-10-21 | Shinko Elecric Co Ltd | Sealed container |
US20050129301A1 (en) * | 2002-03-07 | 2005-06-16 | Yukio Kanno | Electronic part inspection device |
TW200636799A (en) * | 2005-04-13 | 2006-10-16 | King Yuan Electronics Co Ltd | IC pick-and-place apparatus |
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2008
- 2008-09-08 TW TW097134414A patent/TWI416655B/en active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW327235B (en) * | 1994-04-28 | 1998-02-21 | Semitool Inc | A semiconductor processor for processing wafers or other semiconductor articles, a method for processing wafers and similar semiconductor articles, and a wafer handling apparatus for moving wafers to or from an enclosed wafer container the invention relates to a process for processing integrated circuit wafers, semiconductor substrates, data disks and similar units requiring very low contamination levels. |
TW372325B (en) * | 1995-01-09 | 1999-10-21 | Shinko Elecric Co Ltd | Sealed container |
US20050129301A1 (en) * | 2002-03-07 | 2005-06-16 | Yukio Kanno | Electronic part inspection device |
TW200636799A (en) * | 2005-04-13 | 2006-10-16 | King Yuan Electronics Co Ltd | IC pick-and-place apparatus |
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